Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36389) > Сторінка 388 з 607
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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| PCF7938XA/CAAB3800122 | NXP USA Inc. | Description: STICKS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| OM5579/PN7150RPI | NXP USA Inc. |
Description: EVAL BOARD FOR PN7150 Packaging: Bulk Function: Near Field Communication (NFC) Type: Wireless (RF/RFID) Contents: Board(s) Utilized IC / Part: PN7150 Platform: Arduino, BeagleBone Black, Raspberry Pi Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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LPC2106FHN48/01551 | NXP USA Inc. |
Description: IC MCU 16/32B 128KB FLSH 48HVQFNPackaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 128KB (128K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
на замовлення 1875 шт: термін постачання 21-31 дні (днів) |
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LPC2106FHN48/01 | NXP USA Inc. |
Description: IC MCU 16/32B 128KB FLSH 48HVQFNPackaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 128KB (128K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 32 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LPC2103FBD48EL | NXP USA Inc. |
Description: IC MCU 16/32BIT 32KB FLSH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 70MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b SAR Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
на замовлення 1393 шт: термін постачання 21-31 дні (днів) |
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BUK9226-75A/C1,118 | NXP USA Inc. |
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| BUK9219-55A118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK9219-55A - POWERPart Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| LPC1342FBD48.151 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 48LQFPDigiKey Programmable: Not Verified Number of I/O: 42 Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, POR, WDT Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 16KB (16K x 8) Speed: 72MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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LPC1342FHN33,518 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32HVQFNDigiKey Programmable: Not Verified Number of I/O: 28 Supplier Device Package: 32-HVQFN (7x7) Peripherals: Brown-out Detect/Reset, POR, WDT Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 16KB (16K x 8) Speed: 72MHz Mounting Type: Surface Mount Package / Case: 32-VQFN Exposed Pad Packaging: Bulk |
на замовлення 10650 шт: термін постачання 21-31 дні (днів) |
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| LPC1342FBD48151 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 48LQFPOscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 16KB (16K x 8) Speed: 72MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Bulk DigiKey Programmable: Not Verified Number of I/O: 42 Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, POR, WDT Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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LPC1342FHN33,551 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32HVQFNDigiKey Programmable: Not Verified Number of I/O: 28 Supplier Device Package: 32-HVQFN (7x7) Peripherals: Brown-out Detect/Reset, POR, WDT Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 16KB (16K x 8) Speed: 72MHz Mounting Type: Surface Mount Package / Case: 32-VQFN Exposed Pad Packaging: Bulk |
на замовлення 5166 шт: термін постачання 21-31 дні (днів) |
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MC9S08AC60MFGE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08DigiKey Programmable: Not Verified Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9S08AC60MFUE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08DigiKey Programmable: Not Verified Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| MC9S08AW60CFUE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08DigiKey Programmable: Not Verified Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PMEG2005AESF315 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKYPackaging: Bulk |
на замовлення 954000 шт: термін постачання 21-31 дні (днів) |
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PMEG2005AESF/S711315 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKY |
на замовлення 135000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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PMEG2005AESFC315 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKYPackaging: Bulk Part Status: Active |
на замовлення 135000 шт: термін постачання 21-31 дні (днів) |
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BYV34G-600127 | NXP USA Inc. |
Description: DIODE ARRAY GP 600V 20A I2PAK Packaging: Bulk Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 60 ns Technology: Standard Diode Configuration: 1 Pair Common Cathode Current - Average Rectified (Io) (per Diode): 20A Supplier Device Package: I2PAK Operating Temperature - Junction: 150°C (Max) Part Status: Active Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.48 V @ 20 A Current - Reverse Leakage @ Vr: 50 µA @ 600 V |
на замовлення 2841 шт: термін постачання 21-31 дні (днів) |
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MKW37Z512VFT4 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 48HVQFN Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Connectivity: I²C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 16b SAR Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 64K x 8 Program Memory Size: 512KB (512K x 8) Speed: 48MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad DigiKey Programmable: Not Verified Supplier Device Package: 48-HVQFN (7x7) Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| MKW38Z512VFT4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 8K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) DigiKey Programmable: Not Verified |
на замовлення 127 шт: термін постачання 21-31 дні (днів) |
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MKW37A512VFT4 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 48HVQFN DigiKey Programmable: Not Verified Supplier Device Package: 48-HVQFN (7x7) Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Connectivity: I²C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 16b SAR Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 64K x 8 Program Memory Size: 512KB (512K x 8) Speed: 48MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| MKW39A512VFT4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 8K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) DigiKey Programmable: Not Verified |
на замовлення 260 шт: термін постачання 21-31 дні (днів) |
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| MKW38A512VFT4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 8K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) DigiKey Programmable: Not Verified |
на замовлення 175 шт: термін постачання 21-31 дні (днів) |
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MK22FN512VFX12R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 88QFNPackaging: Cut Tape (CT) Package / Case: 88-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 88-QFN (10x10) Part Status: Active Number of I/O: 60 DigiKey Programmable: Not Verified |
на замовлення 1475 шт: термін постачання 21-31 дні (днів) |
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MK22FN512VDC12R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 121XFBGAPackaging: Cut Tape (CT) Package / Case: 121-XFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 38x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-XFBGA (8x8) Number of I/O: 81 DigiKey Programmable: Not Verified |
на замовлення 594 шт: термін постачання 21-31 дні (днів) |
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BF1206,115 | NXP USA Inc. |
Description: RF MOSFET 5V 6TSSOPCurrent - Test: 18 mA Voltage - Test: 5 V Voltage - Rated: 6 V Part Status: Obsolete Supplier Device Package: 6-TSSOP Noise Figure: 1.3dB Technology: MOSFET Gain: 30dB Configuration: N-Channel Dual Gate Frequency: 400MHz Mounting Type: Surface Mount Current Rating (Amps): 30mA Package / Case: 6-TSSOP, SC-88, SOT-363 Packaging: Bulk |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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BA792,115 | NXP USA Inc. |
Description: RF DIODE STANDARD 35V SOD110Packaging: Bulk Package / Case: SOD-110 Diode Type: Standard - Single Operating Temperature: 150°C (TJ) Capacitance @ Vr, F: 1.1pF @ 3V, 1MHz Resistance @ If, F: 700mOhm @ 3mA, 200MHz Voltage - Peak Reverse (Max): 35V Supplier Device Package: SOD-110 Current - Max: 100 mA |
на замовлення 493000 шт: термін постачання 21-31 дні (днів) |
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TLVH431QDBVR,125 | NXP USA Inc. |
Description: IC VREF SHUNT ADJ 1.5% 5TSOP |
на замовлення 42000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
| PMMA1200KEGR2 | NXP USA Inc. | Description: IC ACCEL Z-AXIS 250G ROHS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PMMA1250KEGR2 | NXP USA Inc. | Description: IC ACCEL Z-AXIS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PMMA1254KEGR2 | NXP USA Inc. | Description: IC ACCEL 5G Z-AXIS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PMMA1260KEGR2 | NXP USA Inc. | Description: IC ACCEL COLOSUS 1.5 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PMMA1270KEGR2 | NXP USA Inc. | Description: IC ACCEL COLOSSUS 2.5G |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PMMA2201KEGR2 | NXP USA Inc. | Description: IC ACCEL X-AXIS 50MV/G ROHS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PMMA2202KEGR2 | NXP USA Inc. | Description: IC ACCEL SMT LN X SOIC 16 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PMMA2206KEGR2 | NXP USA Inc. | Description: IC ACCEL X-LATERAL 80G |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PMMA2240KEGR2 | NXP USA Inc. | Description: IC ACCEL X- LATERAL 300MV G |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PMMA2241KEGR2 | NXP USA Inc. | Description: IC ACCEL X-LATERAL 10G |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PMMA2301KEGR2 | NXP USA Inc. | Description: IC ACCEL X- AXIS 200G NOMINAL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PMMA3221KEGR2 | NXP USA Inc. | Description: IC ACCEL 50 / 20 XY- AXIS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PMMA8205KEGR2 | NXP USA Inc. | Description: IC ACCEL X- AXIS 50G SOIC 16 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PMMA9550LR1 | NXP USA Inc. | Description: IC ACCEL 3-AXIS W/ 32-BIT MCU |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PMMA9551LR1 | NXP USA Inc. | Description: IC ACCEL XYZ W/ MCU&GESTURE |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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BUK964R2-55B/C | NXP USA Inc. |
Description: N-CHANNEL TRENCHMOS LOGIC LEVELPackaging: Bulk Part Status: Active |
на замовлення 2636 шт: термін постачання 21-31 дні (днів) |
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| 74HC1G665GV125 | NXP USA Inc. |
Description: NOW NEXPERIA 74HC1G665GV 0 Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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BZV90-C6V2135 | NXP USA Inc. |
Description: NOW NEXPERIA BZV90-C6V2 - ZENERCurrent - Reverse Leakage @ Vr: 3 µA @ 4 V Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Power - Max: 1.5 W Supplier Device Package: SOT-223 Impedance (Max) (Zzt): 10 Ohms Voltage - Zener (Nom) (Vz): 6.2 V Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-261-4, TO-261AA Tolerance: ±5% Packaging: Bulk |
на замовлення 15990 шт: термін постачання 21-31 дні (днів) |
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PCA9538ABS,128 | NXP USA Inc. |
Description: IC I/O EXPANDER I2C 8B 16HVQFNPackaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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S912ZVML32F3WKH | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Active Number of I/O: 31 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| MVF50NS152CMK50R | NXP USA Inc. |
Description: IC MPU VYBRID 500MHZ 364LFBGA Packaging: Tape & Reel (TR) Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 500MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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SPC5742PK1AMMM8 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 257MAPBGAPackaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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SPC5643LK0MMM1 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 32x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| SPC5775KK2MMY3AR | NXP USA Inc. | Description: IC 4M FLASH 1.5M RAM 356MAPBGA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BUK9535-55A127 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFETInput Capacitance (Ciss) (Max) @ Vds: 1173 pF @ 25 V Drain to Source Voltage (Vdss): 55 V Vgs (Max): ±10V Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Part Status: Active Supplier Device Package: TO-220AB Vgs(th) (Max) @ Id: 2V @ 1mA Power Dissipation (Max): 85W (Tc) Rds On (Max) @ Id, Vgs: 32mOhm @ 25A, 10V Current - Continuous Drain (Id) @ 25°C: 34A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Package / Case: TO-220-3 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
SPC5602PEF0VLH6 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
SPC5602PEF0VLH6R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| PMGD290UCEA/DG/B2115 | NXP USA Inc. | Description: P-CHANNEL MOSFET |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
BZX84-B3V3/DG/B3215 | NXP USA Inc. |
Description: DIODE ZENERPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| BAV99/LF1215 | NXP USA Inc. |
Description: RECTIFIER DIODECurrent - Reverse Leakage @ Vr: 500 nA @ 80 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA Voltage - DC Reverse (Vr) (Max): 100 V Part Status: Active Operating Temperature - Junction: 150°C (Max) Supplier Device Package: TO-236AB Current - Average Rectified (Io) (per Diode): 215mA (DC) Diode Configuration: 1 Pair Series Connection Technology: Standard Reverse Recovery Time (trr): 4 ns Speed: Fast Recovery =< 500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
LPC11E67JBD64551 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 50 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 10x12b Core Processor: ARM® Cortex®-M0+ EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 20K x 8 Program Memory Size: 128KB (128K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| LPC11E36FBD64/501551 | NXP USA Inc. |
Description: IC MCU 32BIT 96KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 96KB (96K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
| PCF7938XA/CAAB3800122 |
Виробник: NXP USA Inc.
Description: STICKS
Description: STICKS
товару немає в наявності
В кошику
од. на суму грн.
| OM5579/PN7150RPI |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PN7150
Packaging: Bulk
Function: Near Field Communication (NFC)
Type: Wireless (RF/RFID)
Contents: Board(s)
Utilized IC / Part: PN7150
Platform: Arduino, BeagleBone Black, Raspberry Pi
Part Status: Active
Description: EVAL BOARD FOR PN7150
Packaging: Bulk
Function: Near Field Communication (NFC)
Type: Wireless (RF/RFID)
Contents: Board(s)
Utilized IC / Part: PN7150
Platform: Arduino, BeagleBone Black, Raspberry Pi
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 7095.94 грн |
| LPC2106FHN48/01551 |
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Виробник: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
на замовлення 1875 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 17+ | 1420.14 грн |
| LPC2106FHN48/01 |
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Виробник: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
товару немає в наявності
В кошику
од. на суму грн.
| LPC2103FBD48EL |
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Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 32KB FLSH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
на замовлення 1393 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 669.32 грн |
| 10+ | 501.99 грн |
| 25+ | 466.29 грн |
| 100+ | 400.78 грн |
| 250+ | 383.23 грн |
| 500+ | 372.66 грн |
| 1000+ | 357.99 грн |
| BUK9226-75A/C1,118 |
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Виробник: NXP USA Inc.
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL
товару немає в наявності
В кошику
од. на суму грн.
| BUK9219-55A118 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BUK9219-55A - POWER
Part Status: Active
Packaging: Bulk
Description: NOW NEXPERIA BUK9219-55A - POWER
Part Status: Active
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| LPC1342FBD48.151 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Description: IC MCU 32BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| LPC1342FHN33,518 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
на замовлення 10650 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 72+ | 306.84 грн |
| LPC1342FBD48151 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
товару немає в наявності
В кошику
од. на суму грн.
| LPC1342FHN33,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
на замовлення 5166 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 85+ | 260.08 грн |
| MC9S08AC60MFGE557 |
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Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Description: MICROCONTROLLER, 8-BIT, HC08/S08
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| MC9S08AC60MFUE557 |
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Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Description: MICROCONTROLLER, 8-BIT, HC08/S08
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| MC9S08AW60CFUE557 |
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Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Description: MICROCONTROLLER, 8-BIT, HC08/S08
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| PMEG2005AESF315 |
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на замовлення 954000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 7969+ | 3.16 грн |
| PMEG2005AESF/S711315 |
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Виробник: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Description: RECTIFIER DIODE, SCHOTTKY
на замовлення 135000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| PMEG2005AESFC315 |
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на замовлення 135000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 7212+ | 3.16 грн |
| BYV34G-600127 |
Виробник: NXP USA Inc.
Description: DIODE ARRAY GP 600V 20A I2PAK
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 60 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 20A
Supplier Device Package: I2PAK
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.48 V @ 20 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
Description: DIODE ARRAY GP 600V 20A I2PAK
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 60 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 20A
Supplier Device Package: I2PAK
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.48 V @ 20 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
на замовлення 2841 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 315+ | 68.52 грн |
| MKW37Z512VFT4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 48HVQFN
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
DigiKey Programmable: Not Verified
Supplier Device Package: 48-HVQFN (7x7)
Packaging: Tray
Description: IC MCU 32BIT 512KB FLASH 48HVQFN
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
DigiKey Programmable: Not Verified
Supplier Device Package: 48-HVQFN (7x7)
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MKW38Z512VFT4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
на замовлення 127 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 613.94 грн |
| 10+ | 459.33 грн |
| 25+ | 426.22 грн |
| 100+ | 365.83 грн |
| MKW37A512VFT4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 48HVQFN
DigiKey Programmable: Not Verified
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 512KB FLASH 48HVQFN
DigiKey Programmable: Not Verified
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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| MKW39A512VFT4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
на замовлення 260 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 657.46 грн |
| 10+ | 492.62 грн |
| 25+ | 457.45 грн |
| 100+ | 393.06 грн |
| 260+ | 375.13 грн |
| MKW38A512VFT4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
на замовлення 175 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 667.74 грн |
| 10+ | 500.62 грн |
| 25+ | 464.95 грн |
| 100+ | 399.59 грн |
| MK22FN512VFX12R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 88QFN
Packaging: Cut Tape (CT)
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 88-QFN (10x10)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 88QFN
Packaging: Cut Tape (CT)
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 88-QFN (10x10)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
на замовлення 1475 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 751.60 грн |
| 10+ | 565.91 грн |
| 25+ | 526.32 грн |
| 100+ | 453.15 грн |
| 250+ | 438.97 грн |
| MK22FN512VDC12R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Cut Tape (CT)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Cut Tape (CT)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 81
DigiKey Programmable: Not Verified
на замовлення 594 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 793.54 грн |
| 10+ | 598.52 грн |
| 25+ | 557.07 грн |
| 100+ | 480.07 грн |
| 250+ | 470.76 грн |
| BF1206,115 |
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Виробник: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Current - Test: 18 mA
Voltage - Test: 5 V
Voltage - Rated: 6 V
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Noise Figure: 1.3dB
Technology: MOSFET
Gain: 30dB
Configuration: N-Channel Dual Gate
Frequency: 400MHz
Mounting Type: Surface Mount
Current Rating (Amps): 30mA
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
Description: RF MOSFET 5V 6TSSOP
Current - Test: 18 mA
Voltage - Test: 5 V
Voltage - Rated: 6 V
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Noise Figure: 1.3dB
Technology: MOSFET
Gain: 30dB
Configuration: N-Channel Dual Gate
Frequency: 400MHz
Mounting Type: Surface Mount
Current Rating (Amps): 30mA
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 919+ | 24.71 грн |
| BA792,115 |
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Виробник: NXP USA Inc.
Description: RF DIODE STANDARD 35V SOD110
Packaging: Bulk
Package / Case: SOD-110
Diode Type: Standard - Single
Operating Temperature: 150°C (TJ)
Capacitance @ Vr, F: 1.1pF @ 3V, 1MHz
Resistance @ If, F: 700mOhm @ 3mA, 200MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-110
Current - Max: 100 mA
Description: RF DIODE STANDARD 35V SOD110
Packaging: Bulk
Package / Case: SOD-110
Diode Type: Standard - Single
Operating Temperature: 150°C (TJ)
Capacitance @ Vr, F: 1.1pF @ 3V, 1MHz
Resistance @ If, F: 700mOhm @ 3mA, 200MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-110
Current - Max: 100 mA
на замовлення 493000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3328+ | 6.35 грн |
| TLVH431QDBVR,125 |
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Виробник: NXP USA Inc.
Description: IC VREF SHUNT ADJ 1.5% 5TSOP
Description: IC VREF SHUNT ADJ 1.5% 5TSOP
на замовлення 42000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| PMMA1200KEGR2 |
Виробник: NXP USA Inc.
Description: IC ACCEL Z-AXIS 250G ROHS
Description: IC ACCEL Z-AXIS 250G ROHS
товару немає в наявності
В кошику
од. на суму грн.
| PMMA1250KEGR2 |
Виробник: NXP USA Inc.
Description: IC ACCEL Z-AXIS
Description: IC ACCEL Z-AXIS
товару немає в наявності
В кошику
од. на суму грн.
| PMMA1254KEGR2 |
Виробник: NXP USA Inc.
Description: IC ACCEL 5G Z-AXIS
Description: IC ACCEL 5G Z-AXIS
товару немає в наявності
В кошику
од. на суму грн.
| PMMA1260KEGR2 |
Виробник: NXP USA Inc.
Description: IC ACCEL COLOSUS 1.5
Description: IC ACCEL COLOSUS 1.5
товару немає в наявності
В кошику
од. на суму грн.
| PMMA1270KEGR2 |
Виробник: NXP USA Inc.
Description: IC ACCEL COLOSSUS 2.5G
Description: IC ACCEL COLOSSUS 2.5G
товару немає в наявності
В кошику
од. на суму грн.
| PMMA2201KEGR2 |
Виробник: NXP USA Inc.
Description: IC ACCEL X-AXIS 50MV/G ROHS
Description: IC ACCEL X-AXIS 50MV/G ROHS
товару немає в наявності
В кошику
од. на суму грн.
| PMMA2202KEGR2 |
Виробник: NXP USA Inc.
Description: IC ACCEL SMT LN X SOIC 16
Description: IC ACCEL SMT LN X SOIC 16
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| PMMA2206KEGR2 |
Виробник: NXP USA Inc.
Description: IC ACCEL X-LATERAL 80G
Description: IC ACCEL X-LATERAL 80G
товару немає в наявності
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| PMMA2240KEGR2 |
Виробник: NXP USA Inc.
Description: IC ACCEL X- LATERAL 300MV G
Description: IC ACCEL X- LATERAL 300MV G
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| PMMA2241KEGR2 |
Виробник: NXP USA Inc.
Description: IC ACCEL X-LATERAL 10G
Description: IC ACCEL X-LATERAL 10G
товару немає в наявності
В кошику
од. на суму грн.
| PMMA2301KEGR2 |
Виробник: NXP USA Inc.
Description: IC ACCEL X- AXIS 200G NOMINAL
Description: IC ACCEL X- AXIS 200G NOMINAL
товару немає в наявності
В кошику
од. на суму грн.
| PMMA3221KEGR2 |
Виробник: NXP USA Inc.
Description: IC ACCEL 50 / 20 XY- AXIS
Description: IC ACCEL 50 / 20 XY- AXIS
товару немає в наявності
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од. на суму грн.
| PMMA8205KEGR2 |
Виробник: NXP USA Inc.
Description: IC ACCEL X- AXIS 50G SOIC 16
Description: IC ACCEL X- AXIS 50G SOIC 16
товару немає в наявності
В кошику
од. на суму грн.
| PMMA9550LR1 |
Виробник: NXP USA Inc.
Description: IC ACCEL 3-AXIS W/ 32-BIT MCU
Description: IC ACCEL 3-AXIS W/ 32-BIT MCU
товару немає в наявності
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од. на суму грн.
| PMMA9551LR1 |
Виробник: NXP USA Inc.
Description: IC ACCEL XYZ W/ MCU&GESTURE
Description: IC ACCEL XYZ W/ MCU&GESTURE
товару немає в наявності
В кошику
од. на суму грн.
| BUK964R2-55B/C |
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Виробник: NXP USA Inc.
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL
Packaging: Bulk
Part Status: Active
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL
Packaging: Bulk
Part Status: Active
на замовлення 2636 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 188+ | 108.40 грн |
| BZV90-C6V2135 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZV90-C6V2 - ZENER
Current - Reverse Leakage @ Vr: 3 µA @ 4 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Power - Max: 1.5 W
Supplier Device Package: SOT-223
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 6.2 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Tolerance: ±5%
Packaging: Bulk
Description: NOW NEXPERIA BZV90-C6V2 - ZENER
Current - Reverse Leakage @ Vr: 3 µA @ 4 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Power - Max: 1.5 W
Supplier Device Package: SOT-223
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 6.2 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Tolerance: ±5%
Packaging: Bulk
на замовлення 15990 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1745+ | 12.76 грн |
| PCA9538ABS,128 |
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Виробник: NXP USA Inc.
Description: IC I/O EXPANDER I2C 8B 16HVQFN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC I/O EXPANDER I2C 8B 16HVQFN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товару немає в наявності
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| S912ZVML32F3WKH |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MVF50NS152CMK50R |
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
товару немає в наявності
В кошику
од. на суму грн.
| SPC5742PK1AMMM8 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
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| SPC5643LK0MMM1 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
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| SPC5775KK2MMY3AR |
Виробник: NXP USA Inc.
Description: IC 4M FLASH 1.5M RAM 356MAPBGA
Description: IC 4M FLASH 1.5M RAM 356MAPBGA
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| BUK9535-55A127 |
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Виробник: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Input Capacitance (Ciss) (Max) @ Vds: 1173 pF @ 25 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±10V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Active
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 85W (Tc)
Rds On (Max) @ Id, Vgs: 32mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 34A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
Description: N-CHANNEL POWER MOSFET
Input Capacitance (Ciss) (Max) @ Vds: 1173 pF @ 25 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±10V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Active
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 85W (Tc)
Rds On (Max) @ Id, Vgs: 32mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 34A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
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| SPC5602PEF0VLH6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
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| SPC5602PEF0VLH6R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
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| PMGD290UCEA/DG/B2115 |
Виробник: NXP USA Inc.
Description: P-CHANNEL MOSFET
Description: P-CHANNEL MOSFET
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| BAV99/LF1215 |
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Виробник: NXP USA Inc.
Description: RECTIFIER DIODE
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-236AB
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Diode Configuration: 1 Pair Series Connection
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
Description: RECTIFIER DIODE
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-236AB
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Diode Configuration: 1 Pair Series Connection
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
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| LPC11E67JBD64551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 50
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 50
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
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| LPC11E36FBD64/501551 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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