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44-6556-41 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 44POS GOLD
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48-6556-40 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 48POS GOLD
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48-6556-41 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 48POS GOLD
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24-6556-10 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 24POS GOLD
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24-6556-11 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
1+1297.56 грн
10+1107.62 грн
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24-6556-20 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 24POS GOLD
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24-6556-21 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 24POS GOLD
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24-6556-30 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 24POS GOLD
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24-6556-31 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 24POS GOLD
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28-6556-10 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
28-6556-11 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
28-6556-20 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
28-6556-21 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
28-6556-30 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
28-6556-31 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
32-6556-10 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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32-6556-11 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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32-6556-20 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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32-6556-21 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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В кошику  од. на суму  грн.
32-6556-30 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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В кошику  од. на суму  грн.
32-6556-31 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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В кошику  од. на суму  грн.
36-6556-10 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 36POS GOLD
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В кошику  од. на суму  грн.
36-6556-11 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 36POS GOLD
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В кошику  од. на суму  грн.
36-6556-20 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 36POS GOLD
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В кошику  од. на суму  грн.
36-6556-21 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 36POS GOLD
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3883-312-10-32 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: SER 6556 UNIV TEST SCKT RECEP
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40-6556-10 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-6556-11 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-6556-20 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-6556-21 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
42-6556-10 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
42-6556-11 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
42-6556-20 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
42-6556-21 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
44-6556-10 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 44POS GOLD
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В кошику  од. на суму  грн.
44-6556-11 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 44POS GOLD
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В кошику  од. на суму  грн.
44-6556-20 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 44POS GOLD
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В кошику  од. на суму  грн.
44-6556-21 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 44POS GOLD
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В кошику  од. на суму  грн.
48-6556-10 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 48POS GOLD
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В кошику  од. на суму  грн.
48-6556-11 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 48POS GOLD
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В кошику  од. на суму  грн.
48-6556-20 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 48POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
48-6556-21 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 48POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
68-PLS13117-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
68-PRS13117-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
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В кошику  од. на суму  грн.
100-PLS10001-12 100-PLS10001-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
100-PLS15031-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-PLS17048-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
100-PLS17049-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
100-PRS10001-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
товару немає в наявності
В кошику  од. на суму  грн.
100-PRS15031-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-PRS17048-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
100-PRS17049-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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В кошику  од. на суму  грн.
101-PLS14030-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
101-PRS13022-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
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В кошику  од. на суму  грн.
101-PRS13023-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
101-PRS14030-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
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В кошику  од. на суму  грн.
105-PLS17055-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
105-PRS17054-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
108-PLS12005-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
108-PRS13129-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
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В кошику  од. на суму  грн.
44-6556-41 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 44POS GOLD
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В кошику  од. на суму  грн.
48-6556-40 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
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В кошику  од. на суму  грн.
48-6556-41 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
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В кошику  од. на суму  грн.
24-6556-10 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
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В кошику  од. на суму  грн.
24-6556-11 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1297.56 грн
10+1107.62 грн
В кошику  од. на суму  грн.
24-6556-20 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
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В кошику  од. на суму  грн.
24-6556-21 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
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В кошику  од. на суму  грн.
24-6556-30 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
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В кошику  од. на суму  грн.
24-6556-31 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
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В кошику  од. на суму  грн.
28-6556-10 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
28-6556-11 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
28-6556-20 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
28-6556-21 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
28-6556-30 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
28-6556-31 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
32-6556-10 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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В кошику  од. на суму  грн.
32-6556-11 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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В кошику  од. на суму  грн.
32-6556-20 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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В кошику  од. на суму  грн.
32-6556-21 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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В кошику  од. на суму  грн.
32-6556-30 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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В кошику  од. на суму  грн.
32-6556-31 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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В кошику  од. на суму  грн.
36-6556-10 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
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В кошику  од. на суму  грн.
36-6556-11 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
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В кошику  од. на суму  грн.
36-6556-20 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
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В кошику  од. на суму  грн.
36-6556-21 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
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В кошику  од. на суму  грн.
3883-312-10-32 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: SER 6556 UNIV TEST SCKT RECEP
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40-6556-10 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-6556-11 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-6556-20 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-6556-21 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
42-6556-10 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
42-6556-11 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
42-6556-20 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
42-6556-21 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
44-6556-10 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 44POS GOLD
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В кошику  од. на суму  грн.
44-6556-11 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 44POS GOLD
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В кошику  од. на суму  грн.
44-6556-20 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 44POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
44-6556-21 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 44POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
48-6556-10 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
48-6556-11 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
48-6556-20 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
48-6556-21 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
68-PLS13117-16 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
68-PRS13117-16 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
товару немає в наявності
В кошику  од. на суму  грн.
100-PLS10001-12 10004-pga-zif-test-and-burn-in-socket.pdf
100-PLS10001-12
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
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100-PLS15031-16 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
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В кошику  од. на суму  грн.
100-PLS17048-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
100-PLS17049-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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В кошику  од. на суму  грн.
100-PRS10001-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
товару немає в наявності
В кошику  од. на суму  грн.
100-PRS15031-16 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-PRS17048-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
100-PRS17049-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
101-PLS14030-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
101-PRS13022-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
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В кошику  од. на суму  грн.
101-PRS13023-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
101-PRS14030-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
товару немає в наявності
В кошику  од. на суму  грн.
105-PLS17055-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
105-PRS17054-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
108-PLS12005-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
108-PRS13129-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
товару немає в наявності
В кошику  од. на суму  грн.
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