Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15982) > Сторінка 4 з 267
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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| 08-655-10 | Aries Electronics |
Description: CONN COVER HEADER 8POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 10-655-10 | Aries Electronics |
Description: CONN COVER HEADER 10POSPart Status: Active Accessory Type: Cap (Cover) Packaging: Bulk Number of Positions: 10 For Use With/Related Products: 680 Series |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 12-655-10 | Aries Electronics |
Description: CONN COVER HEADER 12POSAccessory Type: Cap (Cover) Number of Positions: 12 For Use With/Related Products: 680 Series Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 14-655-10 | Aries Electronics |
Description: CONN COVER HEADER 14POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 16-655-10 | Aries Electronics |
Description: CONN COVER HEADER 16POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 18-655-10 | Aries Electronics |
Description: CONN COVER HEADER 18POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 20-655-10 | Aries Electronics |
Description: CONN COVER HEADER 20POSAccessory Type: Cap (Cover) Number of Positions: 20 For Use With/Related Products: 680 Series Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 22-655-10 | Aries Electronics |
Description: CONN COVER HEADER 22POSAccessory Type: Cap (Cover) Number of Positions: 22 For Use With/Related Products: 680 Series Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 24-655-10 | Aries Electronics |
Description: CONN COVER HEADER 24POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| T-680 | Aries Electronics |
Description: HEADER PROGRAMMING TOOL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 04-680-190T | Aries Electronics |
Description: CONN HDR MALE PIN 4POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 06-680-190T | Aries Electronics |
Description: CONN HEADER PROGRAMMABLE 6POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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08-680-190T | Aries Electronics |
Description: CONN HDR MALE PIN 8POS TINNumber of Rows: 2 Contact Finish Thickness: 50.0µin (1.27µm) Termination: Solder Row Spacing: 0.300" (7.62mm) Pitch: 0.100" (2.54mm) Number of Positions: 8 Mounting Type: Through Hole Color: Black Contact Finish: Tin Connector Type: Header Features: Programmable Packaging: Tray |
на замовлення 1016 шт: термін постачання 21-31 дні (днів) |
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| 10-680-190T | Aries Electronics |
Description: CONN HEADER PROGRAMMABLE 10POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 12-680-190T | Aries Electronics |
Description: CONN HEADER PROGRAMMABLE 12POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 14-680-190T | Aries Electronics |
Description: CONN HEADER PROGRAMMABLE 14POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 16-680-190T | Aries Electronics |
Description: CONN HEADER PROGRAMMABLE 16POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 18-680-190T | Aries Electronics |
Description: CONN HEADER PROGRAMMABLE 18POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 20-680-190T | Aries Electronics |
Description: CONN HDR MALE PIN 20POS TINMounting Type: Through Hole Color: Black Contact Finish: Tin Connector Type: Header Features: Programmable Packaging: Tray Number of Rows: 2 Contact Finish Thickness: 50.0µin (1.27µm) Termination: Solder Row Spacing: 0.300" (7.62mm) Pitch: 0.100" (2.54mm) Number of Positions: 20 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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22-680-190T | Aries Electronics |
Description: CONN HDR MALE PIN 22POS TINPackaging: Bulk Features: Programmable Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 22 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Part Status: Active Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 24-680-190T | Aries Electronics |
Description: CONN HEADER PROGRAMMABLE 24POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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24-650000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6Packaging: Tube Size / Dimension: 2.400" L x 0.480" W (60.96mm x 12.19mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 454 шт: термін постачання 21-31 дні (днів) |
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32-653000-10 | Aries Electronics |
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6Board Material: FR4 Epoxy Glass Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Pitch - Mating: 0.050" (1.27mm) Termination: Solder Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert From (Adapter End): PLCC Mounting Type: Through Hole Number of Pins: 32 Packaging: Bulk Part Status: Active |
на замовлення 57 шт: термін постачання 21-31 дні (днів) |
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| 97-68340 | Aries Electronics |
Description: SOCKET ADAPTER QFP TO 144PGA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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08-350000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3Packaging: Bulk Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 329 шт: термін постачання 21-31 дні (днів) |
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14-350000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3Packaging: Tube Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 64 шт: термін постачання 21-31 дні (днів) |
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16-350000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3Packaging: Bulk Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 325 шт: термін постачання 21-31 дні (днів) |
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20-350000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3Part Status: Active Package Accepted: SOIC Proto Board Type: SMD to DIP Board Thickness: 0.062" (1.57mm) 1/16" Pitch: 0.050" (1.27mm) Number of Positions: 20 Material: FR4 Epoxy Glass Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm) Packaging: Bulk |
на замовлення 59 шт: термін постачання 21-31 дні (днів) |
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| 28-354000-20 | Aries Electronics |
Description: SOCKET ADAPTER DIP TO 28SOICPackaging: Tube Number of Pins: 28 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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28-351000-10 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3Packaging: Bulk Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 109 шт: термін постачання 21-31 дні (днів) |
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| 11-0513-10 | Aries Electronics |
Description: CONN SOCKET SIP 11POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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28-526-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLDFeatures: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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14-600-11 | Aries Electronics |
Description: CONN HDR DIP FORK 14POS GOLDNumber of Rows: 2 Part Status: Active Contact Finish Thickness: 10.0µin (0.25µm) Termination: Solder Row Spacing: 0.300" (7.62mm) Contact Type: Forked Pitch: 0.100" (2.54mm) Connector Type: DIP, DIL - Header Packaging: Bulk Number of Positions: 14 Mounting Type: Through Hole Color: Black Contact Finish: Gold |
на замовлення 443 шт: термін постачання 21-31 дні (днів) |
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| 16-354000-20 | Aries Electronics |
Description: SOCKET ADAPTER DIP TO 16SOICPackaging: Bulk Number of Pins: 16 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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20-680-191T | Aries Electronics |
Description: CONN DIP HEADER 20POS .100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 10-2823-90C | Aries Electronics |
Description: CONN IC DIP SOCKET 10POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 10-6810-90TWR | Aries Electronics |
Description: CONN IC DIP SOCKET 10POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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14-680-191T | Aries Electronics |
Description: CONN HDR MALE PIN 14POS TINFeatures: Programmable Packaging: Bulk Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 14 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Part Status: Active Number of Rows: 2 |
на замовлення 460 шт: термін постачання 21-31 дні (днів) |
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| 60-1518-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 60POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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03-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 3 (1 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 06-3518-10T | Aries Electronics |
Description: SOCKET W/SOLDER TAIL PINS TIM Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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06-3513-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 6-513-10 | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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14-35W000-10 | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3Board Material: FR4 Epoxy Glass Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Pitch - Mating: 0.050" (1.27mm) Termination: Solder Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert From (Adapter End): SOIC-W Mounting Type: Through Hole Number of Pins: 14 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 16-35W000-10 | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 18-35W000-10 | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 20-35W000-10 | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 24-35W000-10 | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 28-450001-10 | Aries Electronics |
Description: SOCKET ADAPTER SOJ TO 28DIP 0.4Part Status: Active Pitch - Post: 0.100" (2.54mm) Pitch - Mating: 0.050" (1.27mm) Termination: Solder Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Convert From (Adapter End): SOJ Mounting Type: Through Hole Number of Pins: 28 Packaging: Bulk Board Material: FR4 Epoxy Glass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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28-651000-10 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6Packaging: Bulk Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 16-680-191T | Aries Electronics |
Description: CONN HDR MALE PIN 16POS TINNumber of Rows: 2 Part Status: Active Contact Finish Thickness: 50.0µin (1.27µm) Termination: Solder Row Spacing: 0.300" (7.62mm) Pitch: 0.100" (2.54mm) Number of Positions: 16 Mounting Type: Through Hole Color: Black Contact Finish: Tin Connector Type: Header Features: Programmable Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 95-100I25 | Aries Electronics |
Description: SOCKET ADAPTER QFP TO 100PGANumber of Pins: 100 Mounting Type: Through Hole Convert From (Adapter End): QFP Convert To (Adapter End): PGA Termination: Solder Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Tin Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 12-0513-10 | Aries Electronics |
Description: CONN SOCKET SIP 12POS GOLDPackaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 12 (1 x 12) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 1109342 | Aries Electronics |
Description: ADAPTER PLCC TO DIP Part Status: Active Board Material: FR4 Epoxy Glass Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Finish - Mating: Tin Housing Material: Polyphenylene Sulfide (PPS) Termination: Solder Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert From (Adapter End): PLCC Mounting Type: Through Hole Number of Pins: 44 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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28-35W000-10 | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3Packaging: Bulk Size / Dimension: 2.800" L x 0.500" W (71.12mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 256 шт: термін постачання 21-31 дні (днів) |
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| 12-6823-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 12POS TINFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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44-647-10 | Aries Electronics |
Description: SOCKET UNIV SOIC TO DIP .600 |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||
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14-351000-10 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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16-351000-10 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3Package Accepted: SSOP Proto Board Type: SMD to DIP Board Thickness: 0.062" (1.57mm) 1/16" Pitch: 0.026" (0.65mm) Number of Positions: 16 Material: FR4 Epoxy Glass Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm) Packaging: Bulk |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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18-351000-10 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 18DIP 0.3Board Material: FR4 Epoxy Glass Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Pitch - Mating: 0.026" (0.65mm) Termination: Solder Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert From (Adapter End): SSOP Mounting Type: Through Hole Number of Pins: 18 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. |
| 08-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 8POS
Description: CONN COVER HEADER 8POS
товару немає в наявності
В кошику
од. на суму грн.
| 10-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 10POS
Part Status: Active
Accessory Type: Cap (Cover)
Packaging: Bulk
Number of Positions: 10
For Use With/Related Products: 680 Series
Description: CONN COVER HEADER 10POS
Part Status: Active
Accessory Type: Cap (Cover)
Packaging: Bulk
Number of Positions: 10
For Use With/Related Products: 680 Series
товару немає в наявності
В кошику
од. на суму грн.
| 12-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 12POS
Accessory Type: Cap (Cover)
Number of Positions: 12
For Use With/Related Products: 680 Series
Packaging: Bulk
Description: CONN COVER HEADER 12POS
Accessory Type: Cap (Cover)
Number of Positions: 12
For Use With/Related Products: 680 Series
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 14-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 14POS
Description: CONN COVER HEADER 14POS
товару немає в наявності
В кошику
од. на суму грн.
| 16-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 16POS
Description: CONN COVER HEADER 16POS
товару немає в наявності
В кошику
од. на суму грн.
| 18-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 18POS
Description: CONN COVER HEADER 18POS
товару немає в наявності
В кошику
од. на суму грн.
| 20-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 20POS
Accessory Type: Cap (Cover)
Number of Positions: 20
For Use With/Related Products: 680 Series
Packaging: Bulk
Description: CONN COVER HEADER 20POS
Accessory Type: Cap (Cover)
Number of Positions: 20
For Use With/Related Products: 680 Series
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 22-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 22POS
Accessory Type: Cap (Cover)
Number of Positions: 22
For Use With/Related Products: 680 Series
Packaging: Bulk
Description: CONN COVER HEADER 22POS
Accessory Type: Cap (Cover)
Number of Positions: 22
For Use With/Related Products: 680 Series
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 24-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 24POS
Description: CONN COVER HEADER 24POS
товару немає в наявності
В кошику
од. на суму грн.
| T-680 |
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Виробник: Aries Electronics
Description: HEADER PROGRAMMING TOOL
Description: HEADER PROGRAMMING TOOL
товару немає в наявності
В кошику
од. на суму грн.
| 04-680-190T |
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Виробник: Aries Electronics
Description: CONN HDR MALE PIN 4POS TIN
Description: CONN HDR MALE PIN 4POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 06-680-190T |
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Виробник: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 6POS
Description: CONN HEADER PROGRAMMABLE 6POS
товару немає в наявності
В кошику
од. на суму грн.
| 08-680-190T |
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Виробник: Aries Electronics
Description: CONN HDR MALE PIN 8POS TIN
Number of Rows: 2
Contact Finish Thickness: 50.0µin (1.27µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 8
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: Header
Features: Programmable
Packaging: Tray
Description: CONN HDR MALE PIN 8POS TIN
Number of Rows: 2
Contact Finish Thickness: 50.0µin (1.27µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 8
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: Header
Features: Programmable
Packaging: Tray
на замовлення 1016 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 100.33 грн |
| 10+ | 82.12 грн |
| 100+ | 69.79 грн |
| 500+ | 58.47 грн |
| 1000+ | 55.68 грн |
| 10-680-190T |
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Виробник: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 10POS
Description: CONN HEADER PROGRAMMABLE 10POS
товару немає в наявності
В кошику
од. на суму грн.
| 12-680-190T |
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Виробник: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 12POS
Description: CONN HEADER PROGRAMMABLE 12POS
товару немає в наявності
В кошику
од. на суму грн.
| 14-680-190T |
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Виробник: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 14POS
Description: CONN HEADER PROGRAMMABLE 14POS
товару немає в наявності
В кошику
од. на суму грн.
| 16-680-190T |
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Виробник: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 16POS
Description: CONN HEADER PROGRAMMABLE 16POS
товару немає в наявності
В кошику
од. на суму грн.
| 18-680-190T |
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Виробник: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 18POS
Description: CONN HEADER PROGRAMMABLE 18POS
товару немає в наявності
В кошику
од. на суму грн.
| 20-680-190T |
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Виробник: Aries Electronics
Description: CONN HDR MALE PIN 20POS TIN
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: Header
Features: Programmable
Packaging: Tray
Number of Rows: 2
Contact Finish Thickness: 50.0µin (1.27µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 20
Description: CONN HDR MALE PIN 20POS TIN
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: Header
Features: Programmable
Packaging: Tray
Number of Rows: 2
Contact Finish Thickness: 50.0µin (1.27µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 20
товару немає в наявності
В кошику
од. на суму грн.
| 22-680-190T |
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Виробник: Aries Electronics
Description: CONN HDR MALE PIN 22POS TIN
Packaging: Bulk
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 22
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR MALE PIN 22POS TIN
Packaging: Bulk
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 22
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| 24-680-190T |
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Виробник: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 24POS
Description: CONN HEADER PROGRAMMABLE 24POS
товару немає в наявності
В кошику
од. на суму грн.
| 24-650000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Packaging: Tube
Size / Dimension: 2.400" L x 0.480" W (60.96mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Packaging: Tube
Size / Dimension: 2.400" L x 0.480" W (60.96mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 454 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2214.28 грн |
| 20+ | 1726.12 грн |
| 40+ | 1643.73 грн |
| 60+ | 1499.10 грн |
| 100+ | 1446.08 грн |
| 260+ | 1351.91 грн |
| 32-653000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
Number of Pins: 32
Packaging: Bulk
Part Status: Active
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
Number of Pins: 32
Packaging: Bulk
Part Status: Active
на замовлення 57 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3908.10 грн |
| 10+ | 3198.70 грн |
| 25+ | 2998.55 грн |
| 55+ | 2661.89 грн |
| 97-68340 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP TO 144PGA
Description: SOCKET ADAPTER QFP TO 144PGA
товару немає в наявності
В кошику
од. на суму грн.
| 08-350000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 329 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 688.97 грн |
| 10+ | 563.82 грн |
| 48+ | 504.68 грн |
| 96+ | 451.02 грн |
| 144+ | 438.30 грн |
| 288+ | 417.39 грн |
| 14-350000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Tube
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Tube
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 64 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1406.95 грн |
| 10+ | 1151.65 грн |
| 28+ | 1070.96 грн |
| 56+ | 957.08 грн |
| 16-350000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 325 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1159.26 грн |
| 24+ | 891.72 грн |
| 48+ | 849.16 грн |
| 72+ | 774.45 грн |
| 120+ | 747.04 грн |
| 264+ | 706.65 грн |
| 20-350000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Part Status: Active
Package Accepted: SOIC
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.050" (1.27mm)
Number of Positions: 20
Material: FR4 Epoxy Glass
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Packaging: Bulk
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Part Status: Active
Package Accepted: SOIC
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.050" (1.27mm)
Number of Positions: 20
Material: FR4 Epoxy Glass
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Packaging: Bulk
на замовлення 59 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1300.35 грн |
| 19+ | 963.98 грн |
| 38+ | 906.54 грн |
| 57+ | 820.70 грн |
| 28-354000-20 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Tube
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Tube
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
товару немає в наявності
В кошику
од. на суму грн.
| 28-351000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 109 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2206.44 грн |
| 14+ | 1763.34 грн |
| 28+ | 1679.18 грн |
| 56+ | 1500.67 грн |
| 11-0513-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 11POS GOLD
Description: CONN SOCKET SIP 11POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 28-526-11 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1778.48 грн |
| 15+ | 1414.92 грн |
| 14-600-11 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 14POS GOLD
Number of Rows: 2
Part Status: Active
Contact Finish Thickness: 10.0µin (0.25µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Connector Type: DIP, DIL - Header
Packaging: Bulk
Number of Positions: 14
Mounting Type: Through Hole
Color: Black
Contact Finish: Gold
Description: CONN HDR DIP FORK 14POS GOLD
Number of Rows: 2
Part Status: Active
Contact Finish Thickness: 10.0µin (0.25µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Connector Type: DIP, DIL - Header
Packaging: Bulk
Number of Positions: 14
Mounting Type: Through Hole
Color: Black
Contact Finish: Gold
на замовлення 443 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 261.79 грн |
| 26+ | 200.28 грн |
| 104+ | 181.61 грн |
| 16-354000-20 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
товару немає в наявності
В кошику
од. на суму грн.
| 20-680-191T |
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Виробник: Aries Electronics
Description: CONN DIP HEADER 20POS .100
Description: CONN DIP HEADER 20POS .100
товару немає в наявності
В кошику
од. на суму грн.
| 10-2823-90C |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 10-6810-90TWR |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
Description: CONN IC DIP SOCKET 10POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 14-680-191T |
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Виробник: Aries Electronics
Description: CONN HDR MALE PIN 14POS TIN
Features: Programmable
Packaging: Bulk
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR MALE PIN 14POS TIN
Features: Programmable
Packaging: Bulk
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
на замовлення 460 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 112.87 грн |
| 10+ | 92.23 грн |
| 100+ | 78.37 грн |
| 60-1518-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 60POS GOLD
Description: CONN IC DIP SOCKET 60POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 03-0518-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 3POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 06-3518-10T |
Виробник: Aries Electronics
Description: SOCKET W/SOLDER TAIL PINS TIM
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: SOCKET W/SOLDER TAIL PINS TIM
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 06-3513-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 6-513-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Description: CONN SOCKET SIP 6POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 14-35W000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): SOIC-W
Mounting Type: Through Hole
Number of Pins: 14
Packaging: Bulk
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): SOIC-W
Mounting Type: Through Hole
Number of Pins: 14
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 16-35W000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
товару немає в наявності
В кошику
од. на суму грн.
| 18-35W000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3
товару немає в наявності
В кошику
од. на суму грн.
| 20-35W000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
товару немає в наявності
В кошику
од. на суму грн.
| 24-35W000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3
товару немає в наявності
В кошику
од. на суму грн.
| 28-450001-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 28DIP 0.4
Part Status: Active
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Convert From (Adapter End): SOJ
Mounting Type: Through Hole
Number of Pins: 28
Packaging: Bulk
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SOJ TO 28DIP 0.4
Part Status: Active
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Convert From (Adapter End): SOJ
Mounting Type: Through Hole
Number of Pins: 28
Packaging: Bulk
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику
од. на суму грн.
| 28-651000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику
од. на суму грн.
| 16-680-191T |
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Виробник: Aries Electronics
Description: CONN HDR MALE PIN 16POS TIN
Number of Rows: 2
Part Status: Active
Contact Finish Thickness: 50.0µin (1.27µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 16
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: Header
Features: Programmable
Packaging: Tray
Description: CONN HDR MALE PIN 16POS TIN
Number of Rows: 2
Part Status: Active
Contact Finish Thickness: 50.0µin (1.27µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 16
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: Header
Features: Programmable
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| 95-100I25 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP TO 100PGA
Number of Pins: 100
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Obsolete
Description: SOCKET ADAPTER QFP TO 100PGA
Number of Pins: 100
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 12-0513-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 12POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 1109342 |
Виробник: Aries Electronics
Description: ADAPTER PLCC TO DIP
Part Status: Active
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Housing Material: Polyphenylene Sulfide (PPS)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
Number of Pins: 44
Packaging: Bulk
Description: ADAPTER PLCC TO DIP
Part Status: Active
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Housing Material: Polyphenylene Sulfide (PPS)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
Number of Pins: 44
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 28-35W000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.500" W (71.12mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.500" W (71.12mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 256 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1472.00 грн |
| 14+ | 1176.76 грн |
| 28+ | 1120.56 грн |
| 56+ | 1001.42 грн |
| 112+ | 953.65 грн |
| 252+ | 900.67 грн |
| 12-6823-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 12POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 44-647-10 |
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Виробник: Aries Electronics
Description: SOCKET UNIV SOIC TO DIP .600
Description: SOCKET UNIV SOIC TO DIP .600
на замовлення 3 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 14-351000-10 |
![]() |
Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
товару немає в наявності
В кошику
од. на суму грн.
| 16-351000-10 |
![]() |
Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Package Accepted: SSOP
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.026" (0.65mm)
Number of Positions: 16
Material: FR4 Epoxy Glass
Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm)
Packaging: Bulk
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Package Accepted: SSOP
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.026" (0.65mm)
Number of Positions: 16
Material: FR4 Epoxy Glass
Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm)
Packaging: Bulk
на замовлення 27 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2242.49 грн |
| 10+ | 1835.18 грн |
| 18-351000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 18DIP 0.3
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.026" (0.65mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): SSOP
Mounting Type: Through Hole
Number of Pins: 18
Packaging: Bulk
Description: SOCKET ADAPTER SSOP TO 18DIP 0.3
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.026" (0.65mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): SSOP
Mounting Type: Through Hole
Number of Pins: 18
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.

















