Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15970) > Сторінка 4 з 267
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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| 08-655-10 | Aries Electronics |
Description: CONN COVER HEADER 8POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 10-655-10 | Aries Electronics |
Description: CONN COVER HEADER 10POSPackaging: Bulk For Use With/Related Products: 680 Series Number of Positions: 10 Accessory Type: Cap (Cover) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 12-655-10 | Aries Electronics |
Description: CONN COVER HEADER 12POSPackaging: Bulk For Use With/Related Products: 680 Series Number of Positions: 12 Accessory Type: Cap (Cover) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 14-655-10 | Aries Electronics |
Description: CONN COVER HEADER 14POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 16-655-10 | Aries Electronics |
Description: CONN COVER HEADER 16POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 18-655-10 | Aries Electronics |
Description: CONN COVER HEADER 18POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 20-655-10 | Aries Electronics |
Description: CONN COVER HEADER 20POSPackaging: Bulk For Use With/Related Products: 680 Series Number of Positions: 20 Accessory Type: Cap (Cover) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 22-655-10 | Aries Electronics |
Description: CONN COVER HEADER 22POSPackaging: Bulk For Use With/Related Products: 680 Series Number of Positions: 22 Accessory Type: Cap (Cover) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 24-655-10 | Aries Electronics |
Description: CONN COVER HEADER 24POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| T-680 | Aries Electronics |
Description: HEADER PROGRAMMING TOOL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 04-680-190T | Aries Electronics |
Description: CONN HDR MALE PIN 4POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 06-680-190T | Aries Electronics |
Description: CONN HEADER PROGRAMMABLE 6POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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08-680-190T | Aries Electronics |
Description: CONN HDR MALE PIN 8POS TINFeatures: Programmable Packaging: Tray Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 8 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Number of Rows: 2 |
на замовлення 1016 шт: термін постачання 21-31 дні (днів) |
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| 10-680-190T | Aries Electronics |
Description: CONN HEADER PROGRAMMABLE 10POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 12-680-190T | Aries Electronics |
Description: CONN HEADER PROGRAMMABLE 12POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 14-680-190T | Aries Electronics |
Description: CONN HEADER PROGRAMMABLE 14POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 16-680-190T | Aries Electronics |
Description: CONN HEADER PROGRAMMABLE 16POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 18-680-190T | Aries Electronics |
Description: CONN HEADER PROGRAMMABLE 18POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 20-680-190T | Aries Electronics |
Description: CONN HDR MALE PIN 20POS TINFeatures: Programmable Packaging: Tray Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 20 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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22-680-190T | Aries Electronics |
Description: CONN HDR MALE PIN 22POS TINFeatures: Programmable Packaging: Tray Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 22 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Part Status: Active Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 24-680-190T | Aries Electronics |
Description: CONN HEADER PROGRAMMABLE 24POS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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24-650000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6Packaging: Bulk Size / Dimension: 2.400" L x 0.480" W (60.96mm x 12.19mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 491 шт: термін постачання 21-31 дні (днів) |
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32-653000-10 | Aries Electronics |
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6Packaging: Bulk Number of Pins: 32 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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| 97-68340 | Aries Electronics |
Description: SOCKET ADAPTER QFP TO 144PGA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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08-350000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3Packaging: Bulk Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 158 шт: термін постачання 21-31 дні (днів) |
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14-350000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3Packaging: Tube Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 225 шт: термін постачання 21-31 дні (днів) |
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16-350000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3Packaging: Bulk Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 69 шт: термін постачання 21-31 дні (днів) |
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20-350000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3Packaging: Bulk Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 59 шт: термін постачання 21-31 дні (днів) |
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| 28-354000-20 | Aries Electronics |
Description: SOCKET ADAPTER DIP TO 28SOICPackaging: Tube Number of Pins: 28 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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28-351000-10 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3Packaging: Bulk Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 109 шт: термін постачання 21-31 дні (днів) |
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| 11-0513-10 | Aries Electronics |
Description: CONN SOCKET SIP 11POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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28-526-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
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14-600-11 | Aries Electronics |
Description: CONN HDR DIP FORK 14POS GOLDPackaging: Bulk Connector Type: DIP, DIL - Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 14 Pitch: 0.100" (2.54mm) Contact Type: Forked Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Rows: 2 |
на замовлення 493 шт: термін постачання 21-31 дні (днів) |
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| 16-354000-20 | Aries Electronics |
Description: SOCKET ADAPTER DIP TO 16SOICPackaging: Bulk Number of Pins: 16 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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20-680-191T | Aries Electronics |
Description: CONN DIP HEADER 20POS .100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 10-2823-90C | Aries Electronics |
Description: CONN IC DIP SOCKET 10POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 10-6810-90TWR | Aries Electronics |
Description: CONN IC DIP SOCKET 10POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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14-680-191T | Aries Electronics |
Description: CONN HDR MALE PIN 14POS TINPackaging: Bulk Features: Programmable Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 14 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Part Status: Active Number of Rows: 2 |
на замовлення 460 шт: термін постачання 21-31 дні (днів) |
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| 60-1518-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 60POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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1110748 | Aries Electronics |
Description: SOCKET ADAPTER SOT25 TO 6DIP 0.3Packaging: Bulk Size / Dimension: 0.300" L x 0.400" W (7.62mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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| 03-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLDPackaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 3 (1 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 06-3518-10T | Aries Electronics |
Description: SOCKET W/SOLDER TAIL PINS TIM Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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06-3513-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 6-513-10 | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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14-35W000-10 | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3Packaging: Bulk Number of Pins: 14 Mounting Type: Through Hole Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 16-35W000-10 | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 18-35W000-10 | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 20-35W000-10 | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 24-35W000-10 | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 28-450001-10 | Aries Electronics |
Description: SOCKET ADAPTER SOJ TO 28DIP 0.4Packaging: Bulk Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Board Material: FR4 Epoxy Glass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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28-651000-10 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6Packaging: Bulk Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 16-680-191T | Aries Electronics |
Description: CONN HDR MALE PIN 16POS TINPackaging: Tray Features: Programmable Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 16 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Part Status: Active Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 95-100I25 | Aries Electronics |
Description: SOCKET ADAPTER QFP TO 100PGANumber of Pins: 100 Mounting Type: Through Hole Convert From (Adapter End): QFP Convert To (Adapter End): PGA Termination: Solder Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Tin Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 12-0513-10 | Aries Electronics |
Description: CONN SOCKET SIP 12POS GOLDPackaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 12 (1 x 12) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 1109342 | Aries Electronics |
Description: ADAPTER PLCC TO DIP Packaging: Bulk Number of Pins: 44 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Contact Finish - Mating: Tin Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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28-35W000-10 | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3Packaging: Bulk Size / Dimension: 2.800" L x 0.500" W (71.12mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 130 шт: термін постачання 21-31 дні (днів) |
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| 12-6823-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 12POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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44-647-10 | Aries Electronics |
Description: SOCKET UNIV SOIC TO DIP .600 |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||
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14-351000-10 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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16-351000-10 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3Packaging: Bulk Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP |
на замовлення 39 шт: термін постачання 21-31 дні (днів) |
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| 08-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 8POS
Description: CONN COVER HEADER 8POS
товару немає в наявності
В кошику
од. на суму грн.
| 10-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 10POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 10
Accessory Type: Cap (Cover)
Part Status: Active
Description: CONN COVER HEADER 10POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 10
Accessory Type: Cap (Cover)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 12-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 12POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 12
Accessory Type: Cap (Cover)
Description: CONN COVER HEADER 12POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 12
Accessory Type: Cap (Cover)
товару немає в наявності
В кошику
од. на суму грн.
| 14-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 14POS
Description: CONN COVER HEADER 14POS
товару немає в наявності
В кошику
од. на суму грн.
| 16-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 16POS
Description: CONN COVER HEADER 16POS
товару немає в наявності
В кошику
од. на суму грн.
| 18-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 18POS
Description: CONN COVER HEADER 18POS
товару немає в наявності
В кошику
од. на суму грн.
| 20-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 20POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 20
Accessory Type: Cap (Cover)
Description: CONN COVER HEADER 20POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 20
Accessory Type: Cap (Cover)
товару немає в наявності
В кошику
од. на суму грн.
| 22-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 22POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 22
Accessory Type: Cap (Cover)
Description: CONN COVER HEADER 22POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 22
Accessory Type: Cap (Cover)
товару немає в наявності
В кошику
од. на суму грн.
| 24-655-10 |
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Виробник: Aries Electronics
Description: CONN COVER HEADER 24POS
Description: CONN COVER HEADER 24POS
товару немає в наявності
В кошику
од. на суму грн.
| T-680 |
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Виробник: Aries Electronics
Description: HEADER PROGRAMMING TOOL
Description: HEADER PROGRAMMING TOOL
товару немає в наявності
В кошику
од. на суму грн.
| 04-680-190T |
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Виробник: Aries Electronics
Description: CONN HDR MALE PIN 4POS TIN
Description: CONN HDR MALE PIN 4POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 06-680-190T |
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Виробник: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 6POS
Description: CONN HEADER PROGRAMMABLE 6POS
товару немає в наявності
В кошику
од. на суму грн.
| 08-680-190T |
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Виробник: Aries Electronics
Description: CONN HDR MALE PIN 8POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
Description: CONN HDR MALE PIN 8POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
на замовлення 1016 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 105.24 грн |
| 10+ | 86.14 грн |
| 100+ | 73.21 грн |
| 500+ | 61.33 грн |
| 1000+ | 58.40 грн |
| 10-680-190T |
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Виробник: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 10POS
Description: CONN HEADER PROGRAMMABLE 10POS
товару немає в наявності
В кошику
од. на суму грн.
| 12-680-190T |
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Виробник: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 12POS
Description: CONN HEADER PROGRAMMABLE 12POS
товару немає в наявності
В кошику
од. на суму грн.
| 14-680-190T |
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Виробник: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 14POS
Description: CONN HEADER PROGRAMMABLE 14POS
товару немає в наявності
В кошику
од. на суму грн.
| 16-680-190T |
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Виробник: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 16POS
Description: CONN HEADER PROGRAMMABLE 16POS
товару немає в наявності
В кошику
од. на суму грн.
| 18-680-190T |
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Виробник: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 18POS
Description: CONN HEADER PROGRAMMABLE 18POS
товару немає в наявності
В кошику
од. на суму грн.
| 20-680-190T |
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Виробник: Aries Electronics
Description: CONN HDR MALE PIN 20POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
Description: CONN HDR MALE PIN 20POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| 22-680-190T |
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Виробник: Aries Electronics
Description: CONN HDR MALE PIN 22POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 22
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR MALE PIN 22POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 22
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| 24-680-190T |
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Виробник: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 24POS
Description: CONN HEADER PROGRAMMABLE 24POS
товару немає в наявності
В кошику
од. на суму грн.
| 24-650000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Packaging: Bulk
Size / Dimension: 2.400" L x 0.480" W (60.96mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Packaging: Bulk
Size / Dimension: 2.400" L x 0.480" W (60.96mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 491 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2048.01 грн |
| 10+ | 1676.30 грн |
| 25+ | 1571.36 грн |
| 98+ | 1339.21 грн |
| 196+ | 1275.35 грн |
| 294+ | 1239.43 грн |
| 32-653000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
на замовлення 60 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4071.36 грн |
| 15+ | 3238.33 грн |
| 30+ | 3083.89 грн |
| 60+ | 2756.10 грн |
| 97-68340 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP TO 144PGA
Description: SOCKET ADAPTER QFP TO 144PGA
товару немає в наявності
В кошику
од. на суму грн.
| 08-350000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 158 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 712.82 грн |
| 10+ | 583.65 грн |
| 48+ | 522.48 грн |
| 96+ | 466.93 грн |
| 144+ | 453.76 грн |
| 14-350000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Tube
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Tube
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 225 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1261.20 грн |
| 10+ | 1032.00 грн |
| 28+ | 959.70 грн |
| 56+ | 857.64 грн |
| 112+ | 816.73 грн |
| 16-350000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 69 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 957.00 грн |
| 24+ | 736.03 грн |
| 48+ | 700.92 грн |
| 20-350000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Packaging: Bulk
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Packaging: Bulk
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 59 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1363.97 грн |
| 19+ | 1011.15 грн |
| 38+ | 950.89 грн |
| 57+ | 860.86 грн |
| 28-354000-20 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Tube
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Tube
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
товару немає в наявності
В кошику
од. на суму грн.
| 28-351000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 109 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1786.57 грн |
| 10+ | 1461.66 грн |
| 25+ | 1370.14 грн |
| 50+ | 1224.47 грн |
| 11-0513-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 11POS GOLD
Description: CONN SOCKET SIP 11POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 28-526-11 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 31 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1859.74 грн |
| 15+ | 1478.98 грн |
| 30+ | 1408.36 грн |
| 14-600-11 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 14POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR DIP FORK 14POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
на замовлення 493 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 272.96 грн |
| 26+ | 208.65 грн |
| 104+ | 189.20 грн |
| 16-354000-20 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
товару немає в наявності
В кошику
од. на суму грн.
| 20-680-191T |
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Виробник: Aries Electronics
Description: CONN DIP HEADER 20POS .100
Description: CONN DIP HEADER 20POS .100
товару немає в наявності
В кошику
од. на суму грн.
| 10-2823-90C |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 10-6810-90TWR |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
Description: CONN IC DIP SOCKET 10POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 14-680-191T |
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Виробник: Aries Electronics
Description: CONN HDR MALE PIN 14POS TIN
Packaging: Bulk
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR MALE PIN 14POS TIN
Packaging: Bulk
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
на замовлення 460 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 113.46 грн |
| 10+ | 95.40 грн |
| 100+ | 85.27 грн |
| 60-1518-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 60POS GOLD
Description: CONN IC DIP SOCKET 60POS GOLD
товару немає в наявності
В кошику
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| 1110748 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOT25 TO 6DIP 0.3
Packaging: Bulk
Size / Dimension: 0.300" L x 0.400" W (7.62mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT
Part Status: Active
Description: SOCKET ADAPTER SOT25 TO 6DIP 0.3
Packaging: Bulk
Size / Dimension: 0.300" L x 0.400" W (7.62mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1196.25 грн |
| 10+ | 978.80 грн |
| 03-0518-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 3POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
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| 06-3518-10T |
Виробник: Aries Electronics
Description: SOCKET W/SOLDER TAIL PINS TIM
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: SOCKET W/SOLDER TAIL PINS TIM
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 06-3513-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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| 6-513-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Description: CONN SOCKET SIP 6POS GOLD
товару немає в наявності
В кошику
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| 14-35W000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
Packaging: Bulk
Number of Pins: 14
Mounting Type: Through Hole
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
Packaging: Bulk
Number of Pins: 14
Mounting Type: Through Hole
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику
од. на суму грн.
| 16-35W000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
товару немає в наявності
В кошику
од. на суму грн.
| 18-35W000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3
товару немає в наявності
В кошику
од. на суму грн.
| 20-35W000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
товару немає в наявності
В кошику
од. на суму грн.
| 24-35W000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3
товару немає в наявності
В кошику
од. на суму грн.
| 28-450001-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 28DIP 0.4
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER SOJ TO 28DIP 0.4
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 28-651000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику
од. на суму грн.
| 16-680-191T |
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Виробник: Aries Electronics
Description: CONN HDR MALE PIN 16POS TIN
Packaging: Tray
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR MALE PIN 16POS TIN
Packaging: Tray
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
товару немає в наявності
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| 95-100I25 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP TO 100PGA
Number of Pins: 100
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Obsolete
Description: SOCKET ADAPTER QFP TO 100PGA
Number of Pins: 100
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 12-0513-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 12POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 1109342 |
Виробник: Aries Electronics
Description: ADAPTER PLCC TO DIP
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: ADAPTER PLCC TO DIP
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
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од. на суму грн.
| 28-35W000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.500" W (71.12mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.500" W (71.12mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 130 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1569.51 грн |
| 14+ | 1254.76 грн |
| 28+ | 1194.87 грн |
| 56+ | 1067.82 грн |
| 112+ | 1016.88 грн |
| 12-6823-90T |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 12POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товару немає в наявності
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| 44-647-10 |
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Виробник: Aries Electronics
Description: SOCKET UNIV SOIC TO DIP .600
Description: SOCKET UNIV SOIC TO DIP .600
на замовлення 3 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 14-351000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
товару немає в наявності
В кошику
од. на суму грн.
| 16-351000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
на замовлення 39 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2210.80 грн |
| 24+ | 1606.09 грн |
















