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18-650-10 18-650-10 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 18 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 18
Accessory Type: Cap (Cover)
товар відсутній
24-650-10 24-650-10 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 24 PIN .270
на замовлення 34 шт:
термін постачання 21-31 дні (днів)
24-650-20 24-650-20 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 24 PIN .510
на замовлення 89 шт:
термін постачання 21-31 дні (днів)
28-650-10 28-650-10 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 28 PIN .270
на замовлення 28 шт:
термін постачання 21-31 дні (днів)
1+369.19 грн
10+ 322.63 грн
25+ 305.62 грн
40-650-10 40-650-10 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 40 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 40
Accessory Type: Cap (Cover)
на замовлення 136 шт:
термін постачання 21-31 дні (днів)
1+340.07 грн
10+ 297.39 грн
25+ 281.7 грн
50+ 258.21 грн
100+ 245.92 грн
08-810-90 08-810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
1+567.99 грн
10+ 492.26 грн
25+ 463.7 грн
50+ 424.02 грн
14-810-90 14-810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 302 шт:
термін постачання 21-31 дні (днів)
1+717.27 грн
10+ 621.84 грн
100+ 555.73 грн
16-810-90 16-810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
14-810-90T 14-810-90T Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 256 шт:
термін постачання 21-31 дні (днів)
1+622.6 грн
10+ 539.52 грн
25+ 508.22 грн
50+ 464.73 грн
100+ 452.5 грн
250+ 403.58 грн
16-810-90T 16-810-90T Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
10-810-90C 10-810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
1+763.15 грн
10+ 651.09 грн
25+ 626.05 грн
14-810-90C 14-810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 120 шт:
термін постачання 21-31 дні (днів)
1+833.05 грн
10+ 711.25 грн
25+ 683.89 грн
50+ 616.14 грн
100+ 581.91 грн
16-810-90C 16-810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
1+865.09 грн
10+ 738.39 грн
08-823-90 08-823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)
1+596.39 грн
10+ 519.47 грн
25+ 490.74 грн
14-823-90 14-823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 313 шт:
термін постачання 21-31 дні (днів)
1+779.89 грн
10+ 675.84 грн
25+ 636.65 грн
50+ 582.17 грн
100+ 566.85 грн
250+ 505.57 грн
28-6823-90 28-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
40-6823-90 40-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
C9314-02 Aries Electronics C84,C93.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товар відсутній
20-350001-10 20-350001-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
28-653000-10 28-653000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
1+2874.91 грн
17+ 2424.04 грн
32-650000-10 32-650000-10 Aries Electronics 18011-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Bulk
Size / Dimension: 3.200" L x 0.480" W (81.28mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOJ
Part Status: Active
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
1+2763.49 грн
32-450001-10 32-450001-10 Aries Electronics 18011-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
28-350002-10 28-350002-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 77 шт:
термін постачання 21-31 дні (днів)
1+1480.42 грн
10+ 1248.25 грн
25+ 1194.29 грн
50+ 1084.63 грн
24-350000-10 24-350000-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Bulk
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
1+1338.42 грн
10+ 1128.48 грн
28-650000-10 28-650000-10 Aries Electronics 450001%2C650000_Series.pdf Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.480" W (71.12mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 240 шт:
термін постачання 21-31 дні (днів)
1+5052.2 грн
17+ 4464.64 грн
34+ 4292.93 грн
51+ 3894.45 грн
102+ 3679.59 грн
56-184M65 Aries Electronics Description: SOCKET ADAPTER QFP TO 184PGA
товар відсутній
68-505-110 68-505-110 Aries Electronics 18028-plcc-to-pga-adapter.pdf Description: SOCKET ADAPTER PLCC TO 68PGA
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: PLCC
на замовлення 799 шт:
термін постачання 21-31 дні (днів)
1+1771.69 грн
10+ 1494.31 грн
25+ 1429.71 грн
50+ 1298.45 грн
100+ 1255.18 грн
250+ 1185.92 грн
500+ 1132.42 грн
18-6511-10 Aries Electronics Description: SOCKET 18 PIN SOLDER TAIL TIN
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
20-F40-10 20-F40-10 Aries Electronics 16008-thru-hole-female-dip-strip.pdf Description: CONN RCPT 20POS 0.2 TIN PCB
Packaging: Tube
Connector Type: Receptacle, Breakaway
Current Rating (Amps): 8A
Mounting Type: Through Hole
Number of Positions: 20
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.129" (3.28mm)
Insulation Height: 0.040" (1.02mm)
Row Spacing - Mating: 0.200" (5.08mm)
Number of Rows: 2
на замовлення 373 шт:
термін постачання 21-31 дні (днів)
1+1274.34 грн
10+ 1063.26 грн
100+ 876.32 грн
52-536-11 52-536-11 Aries Electronics Description: CONN SOCKET PLCC ZIF 52POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 52 (4 x 13)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
товар відсутній
24-516-11 24-516-11 Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товар відсутній
95-132I25 95-132I25 Aries Electronics 18017-qfp-to-pga-adapter.pdf Description: SOCKET ADAPTER QFP TO 132PGA
товар відсутній
96-100M65 Aries Electronics 96-100M65.pdf Description: SOCKET ADAPTER QFP TO 100PGA
товар відсутній
96-160M65 96-160M65 Aries Electronics 18020-qfp-to-pga-adapter.pdf Description: SOCKET ADAPTER QFP TO 160PGA
товар відсутній
14-3625-21 Aries Electronics Description: CONN HDR DIP POST 14POS GOLD
товар відсутній
25-0625-21 Aries Electronics 12036-pin-line-header.pdf Description: CONN HDR STRIP POST 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Post
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
товар відсутній
96-208M50 96-208M50 Aries Electronics 18031-qfp-to-pga-adapter.pdf Description: SOCKET ADAPTER QFP TO 208PGA
товар відсутній
32-536-11 32-536-11 Aries Electronics Description: CONN SOCKET PLCC ZIF 32POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
товар відсутній
40-516-11 40-516-11 Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+1394.49 грн
10+ 1163.4 грн
16-600-11 16-600-11 Aries Electronics 12032-dip-header.pdf Description: CONN HDR DIP FORK 16POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
на замовлення 323 шт:
термін постачання 21-31 дні (днів)
2+222.83 грн
10+ 194.94 грн
100+ 171.76 грн
Мінімальне замовлення: 2
10-6823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 10POS TIN
товар відсутній
24-6574-10 24-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
24-6574-11 24-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
товар відсутній
28-6574-10 28-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
28-6574-11 28-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
32-6574-10 32-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
товар відсутній
32-6574-11 32-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
товар відсутній
40-6574-10 40-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
40-6574-11 40-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS TIN
товар відсутній
48-6574-10 48-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товар відсутній
48-6574-11 48-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товар відсутній
40-0518-10 40-0518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 228 шт:
термін постачання 21-31 дні (днів)
2+271.62 грн
10+ 237.5 грн
100+ 209.27 грн
Мінімальне замовлення: 2
40-0518-11 40-0518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 68 шт:
термін постачання 21-31 дні (днів)
1+431.82 грн
10+ 376.07 грн
1107741 1107741 Aries Electronics 14005-oscillator-socket.pdf Description: OSCILLATOR SOCKET FULL SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Full Size
Package Accepted: 14-DIP, 4 Lead (Full Size)
Number of Positions: 14
на замовлення 1377 шт:
термін постачання 21-31 дні (днів)
5+64.81 грн
10+ 52.73 грн
25+ 50.57 грн
50+ 46.46 грн
100+ 44.45 грн
250+ 40.4 грн
500+ 35.76 грн
1000+ 31.79 грн
Мінімальне замовлення: 5
1108800 1108800 Aries Electronics 14005-oscillator-socket.pdf Description: OSCILLATOR SOCKET HALF SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Half Size
Package Accepted: 8-DIP, 4 Lead (Half Size)
Part Status: Active
Number of Positions: 8
на замовлення 2511 шт:
термін постачання 21-31 дні (днів)
5+64.08 грн
10+ 52.24 грн
25+ 50.07 грн
50+ 46 грн
100+ 43.99 грн
250+ 39.99 грн
500+ 35.4 грн
1000+ 31.47 грн
2500+ 28.52 грн
Мінімальне замовлення: 5
08-6810-90 08-6810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
10-2810-90 10-2810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 884 шт:
термін постачання 21-31 дні (днів)
1+671.39 грн
10+ 582.01 грн
100+ 520.15 грн
08-6810-90C 08-6810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
04-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 4POS
товар відсутній
06-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 6POS
товар відсутній
18-650-10 12033-header-covers.pdf
18-650-10
Виробник: Aries Electronics
Description: DIP HEADER COVER 18 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 18
Accessory Type: Cap (Cover)
товар відсутній
24-650-10 12033-header-covers.pdf
24-650-10
Виробник: Aries Electronics
Description: DIP HEADER COVER 24 PIN .270
на замовлення 34 шт:
термін постачання 21-31 дні (днів)
24-650-20 12033-header-covers.pdf
24-650-20
Виробник: Aries Electronics
Description: DIP HEADER COVER 24 PIN .510
на замовлення 89 шт:
термін постачання 21-31 дні (днів)
28-650-10 12033-header-covers.pdf
28-650-10
Виробник: Aries Electronics
Description: DIP HEADER COVER 28 PIN .270
на замовлення 28 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+369.19 грн
10+ 322.63 грн
25+ 305.62 грн
40-650-10 12033-header-covers.pdf
40-650-10
Виробник: Aries Electronics
Description: DIP HEADER COVER 40 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 40
Accessory Type: Cap (Cover)
на замовлення 136 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+340.07 грн
10+ 297.39 грн
25+ 281.7 грн
50+ 258.21 грн
100+ 245.92 грн
08-810-90 13002-vertical-display-socket.pdf
08-810-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+567.99 грн
10+ 492.26 грн
25+ 463.7 грн
50+ 424.02 грн
14-810-90 13002-vertical-display-socket.pdf
14-810-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 302 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+717.27 грн
10+ 621.84 грн
100+ 555.73 грн
16-810-90 13002-vertical-display-socket.pdf
16-810-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
14-810-90T 13002-vertical-display-socket.pdf
14-810-90T
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 256 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+622.6 грн
10+ 539.52 грн
25+ 508.22 грн
50+ 464.73 грн
100+ 452.5 грн
250+ 403.58 грн
16-810-90T 13002-vertical-display-socket.pdf
16-810-90T
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
10-810-90C 13004-vertical-display-socket.pdf
10-810-90C
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+763.15 грн
10+ 651.09 грн
25+ 626.05 грн
14-810-90C 13004-vertical-display-socket.pdf
14-810-90C
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 120 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+833.05 грн
10+ 711.25 грн
25+ 683.89 грн
50+ 616.14 грн
100+ 581.91 грн
16-810-90C 13004-vertical-display-socket.pdf
16-810-90C
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+865.09 грн
10+ 738.39 грн
08-823-90 13001-horizontal-display-socket.pdf
08-823-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+596.39 грн
10+ 519.47 грн
25+ 490.74 грн
14-823-90 13001-horizontal-display-socket.pdf
14-823-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 313 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+779.89 грн
10+ 675.84 грн
25+ 636.65 грн
50+ 582.17 грн
100+ 566.85 грн
250+ 505.57 грн
28-6823-90 13001-horizontal-display-socket.pdf
28-6823-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
40-6823-90 13001-horizontal-display-socket.pdf
40-6823-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
C9314-02 C84,C93.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товар відсутній
20-350001-10 18010-soic-and-soj-to-dip-adapter.pdf
20-350001-10
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
28-653000-10 18014-plcc-to-dip-adapter.pdf
28-653000-10
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+2874.91 грн
17+ 2424.04 грн
32-650000-10 18011-soic-and-soj-to-dip-adapter.pdf
32-650000-10
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Bulk
Size / Dimension: 3.200" L x 0.480" W (81.28mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOJ
Part Status: Active
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+2763.49 грн
32-450001-10 18011-soic-and-soj-to-dip-adapter.pdf
32-450001-10
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
28-350002-10 18010-soic-and-soj-to-dip-adapter.pdf
28-350002-10
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 77 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1480.42 грн
10+ 1248.25 грн
25+ 1194.29 грн
50+ 1084.63 грн
24-350000-10 18010-soic-and-soj-to-dip-adapter.pdf
24-350000-10
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Bulk
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1338.42 грн
10+ 1128.48 грн
28-650000-10 450001%2C650000_Series.pdf
28-650000-10
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.480" W (71.12mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 240 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+5052.2 грн
17+ 4464.64 грн
34+ 4292.93 грн
51+ 3894.45 грн
102+ 3679.59 грн
56-184M65
Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP TO 184PGA
товар відсутній
68-505-110 18028-plcc-to-pga-adapter.pdf
68-505-110
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68PGA
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: PLCC
на замовлення 799 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1771.69 грн
10+ 1494.31 грн
25+ 1429.71 грн
50+ 1298.45 грн
100+ 1255.18 грн
250+ 1185.92 грн
500+ 1132.42 грн
18-6511-10
Виробник: Aries Electronics
Description: SOCKET 18 PIN SOLDER TAIL TIN
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
20-F40-10 16008-thru-hole-female-dip-strip.pdf
20-F40-10
Виробник: Aries Electronics
Description: CONN RCPT 20POS 0.2 TIN PCB
Packaging: Tube
Connector Type: Receptacle, Breakaway
Current Rating (Amps): 8A
Mounting Type: Through Hole
Number of Positions: 20
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.129" (3.28mm)
Insulation Height: 0.040" (1.02mm)
Row Spacing - Mating: 0.200" (5.08mm)
Number of Rows: 2
на замовлення 373 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1274.34 грн
10+ 1063.26 грн
100+ 876.32 грн
52-536-11
52-536-11
Виробник: Aries Electronics
Description: CONN SOCKET PLCC ZIF 52POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 52 (4 x 13)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
товар відсутній
24-516-11 516.pdf
24-516-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товар відсутній
95-132I25 18017-qfp-to-pga-adapter.pdf
95-132I25
Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP TO 132PGA
товар відсутній
96-100M65 96-100M65.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP TO 100PGA
товар відсутній
96-160M65 18020-qfp-to-pga-adapter.pdf
96-160M65
Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP TO 160PGA
товар відсутній
14-3625-21
Виробник: Aries Electronics
Description: CONN HDR DIP POST 14POS GOLD
товар відсутній
25-0625-21 12036-pin-line-header.pdf
Виробник: Aries Electronics
Description: CONN HDR STRIP POST 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Post
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
товар відсутній
96-208M50 18031-qfp-to-pga-adapter.pdf
96-208M50
Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP TO 208PGA
товар відсутній
32-536-11
32-536-11
Виробник: Aries Electronics
Description: CONN SOCKET PLCC ZIF 32POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
товар відсутній
40-516-11 516.pdf
40-516-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1394.49 грн
10+ 1163.4 грн
16-600-11 12032-dip-header.pdf
16-600-11
Виробник: Aries Electronics
Description: CONN HDR DIP FORK 16POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
на замовлення 323 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+222.83 грн
10+ 194.94 грн
100+ 171.76 грн
Мінімальне замовлення: 2
10-6823-90T 13001-horizontal-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
товар відсутній
24-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
24-6574-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
24-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
24-6574-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товар відсутній
28-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
28-6574-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
28-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
28-6574-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
32-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
32-6574-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
товар відсутній
32-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
32-6574-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
товар відсутній
40-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
40-6574-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
40-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
40-6574-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
товар відсутній
48-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
48-6574-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товар відсутній
48-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
48-6574-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товар відсутній
40-0518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
40-0518-10
Виробник: Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 228 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+271.62 грн
10+ 237.5 грн
100+ 209.27 грн
Мінімальне замовлення: 2
40-0518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
40-0518-11
Виробник: Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 68 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+431.82 грн
10+ 376.07 грн
1107741 14005-oscillator-socket.pdf
1107741
Виробник: Aries Electronics
Description: OSCILLATOR SOCKET FULL SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Full Size
Package Accepted: 14-DIP, 4 Lead (Full Size)
Number of Positions: 14
на замовлення 1377 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
5+64.81 грн
10+ 52.73 грн
25+ 50.57 грн
50+ 46.46 грн
100+ 44.45 грн
250+ 40.4 грн
500+ 35.76 грн
1000+ 31.79 грн
Мінімальне замовлення: 5
1108800 14005-oscillator-socket.pdf
1108800
Виробник: Aries Electronics
Description: OSCILLATOR SOCKET HALF SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Half Size
Package Accepted: 8-DIP, 4 Lead (Half Size)
Part Status: Active
Number of Positions: 8
на замовлення 2511 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
5+64.08 грн
10+ 52.24 грн
25+ 50.07 грн
50+ 46 грн
100+ 43.99 грн
250+ 39.99 грн
500+ 35.4 грн
1000+ 31.47 грн
2500+ 28.52 грн
Мінімальне замовлення: 5
08-6810-90 13002-vertical-display-socket.pdf
08-6810-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
10-2810-90 13002-vertical-display-socket.pdf
10-2810-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 884 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+671.39 грн
10+ 582.01 грн
100+ 520.15 грн
08-6810-90C 13004-vertical-display-socket.pdf
08-6810-90C
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
04-655-10 16005-program-header-and-cover.pdf
Виробник: Aries Electronics
Description: CONN COVER HEADER 4POS
товар відсутній
06-655-10 16005-program-header-and-cover.pdf
Виробник: Aries Electronics
Description: CONN COVER HEADER 6POS
товар відсутній
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