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18-650-10 18-650-10 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 18 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 18
Accessory Type: Cap (Cover)
товару немає в наявності
В кошику  од. на суму  грн.
24-650-10 24-650-10 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 24 PIN .270
на замовлення 34 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
24-650-20 24-650-20 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 24 PIN .510
на замовлення 89 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
28-650-10 28-650-10 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 28 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 28
Accessory Type: Cap (Cover)
на замовлення 49 шт:
термін постачання 21-31 дні (днів)
1+434.10 грн
10+319.95 грн
25+288.54 грн
В кошику  од. на суму  грн.
40-650-10 40-650-10 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 40 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 40
Accessory Type: Cap (Cover)
на замовлення 136 шт:
термін постачання 21-31 дні (днів)
1+387.62 грн
10+338.97 грн
25+321.08 грн
50+294.32 грн
100+280.31 грн
В кошику  од. на суму  грн.
08-810-90 08-810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
1+647.41 грн
10+561.09 грн
25+528.54 грн
50+483.31 грн
В кошику  од. на суму  грн.
14-810-90 14-810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 573 шт:
термін постачання 21-31 дні (днів)
1+769.42 грн
10+603.93 грн
25+556.74 грн
50+491.32 грн
100+462.04 грн
250+426.01 грн
500+399.94 грн
В кошику  од. на суму  грн.
16-810-90 16-810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
14-810-90T 14-810-90T Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 256 шт:
термін постачання 21-31 дні (днів)
1+709.66 грн
10+614.96 грн
25+579.28 грн
50+529.71 грн
100+515.77 грн
250+460.01 грн
В кошику  од. на суму  грн.
16-810-90T 16-810-90T Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
10-810-90C 10-810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 47 шт:
термін постачання 21-31 дні (днів)
1+779.38 грн
10+637.58 грн
25+597.63 грн
В кошику  од. на суму  грн.
14-810-90C 14-810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 101 шт:
термін постачання 21-31 дні (днів)
1+794.32 грн
10+650.29 грн
25+609.53 грн
50+544.71 грн
100+518.72 грн
В кошику  од. на суму  грн.
16-810-90C 16-810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 49 шт:
термін постачання 21-31 дні (днів)
1+873.18 грн
10+714.63 грн
25+669.85 грн
В кошику  од. на суму  грн.
08-823-90 08-823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)
1+679.78 грн
10+592.10 грн
25+559.36 грн
В кошику  од. на суму  грн.
14-823-90 14-823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 314 шт:
термін постачання 21-31 дні (днів)
1+833.33 грн
10+681.78 грн
25+639.07 грн
50+571.10 грн
100+543.84 грн
250+509.82 грн
В кошику  од. на суму  грн.
28-6823-90 28-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
40-6823-90 40-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 195 шт:
термін постачання 21-31 дні (днів)
1+1706.51 грн
10+1439.01 грн
25+1376.83 грн
50+1250.43 грн
100+1208.74 грн
В кошику  од. на суму  грн.
C9314-02 Aries Electronics C84,C93.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
20-350001-10 20-350001-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
28-653000-10 28-653000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
1+3605.58 грн
В кошику  од. на суму  грн.
32-650000-10 32-650000-10 Aries Electronics 18011-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Bulk
Size / Dimension: 3.200" L x 0.480" W (81.28mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOJ
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
1+2683.44 грн
15+2134.43 грн
В кошику  од. на суму  грн.
32-450001-10 32-450001-10 Aries Electronics 18011-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
28-350002-10 28-350002-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 71 шт:
термін постачання 21-31 дні (днів)
1+1139.61 грн
14+910.72 грн
28+867.21 грн
56+775.00 грн
В кошику  од. на суму  грн.
24-350000-10 24-350000-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Bulk
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 29 шт:
термін постачання 21-31 дні (днів)
1+1644.26 грн
16+1237.82 грн
В кошику  од. на суму  грн.
28-650000-10 28-650000-10 Aries Electronics 450001%2C650000_Series.pdf Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.480" W (71.12mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 129 шт:
термін постачання 21-31 дні (днів)
1+4736.06 грн
17+3815.12 грн
В кошику  од. на суму  грн.
56-184M65 Aries Electronics Description: SOCKET ADAPTER QFP TO 184PGA
Number of Pins: 184
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
товару немає в наявності
В кошику  од. на суму  грн.
68-505-110 68-505-110 Aries Electronics 18028-plcc-to-pga-adapter.pdf Description: SOCKET ADAPTER PLCC TO 68PGA
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: PLCC
на замовлення 169 шт:
термін постачання 21-31 дні (днів)
1+2134.80 грн
10+1675.44 грн
25+1544.64 грн
50+1363.21 грн
100+1282.02 грн
В кошику  од. на суму  грн.
18-6511-10 Aries Electronics Description: SOCKET 18 PIN SOLDER TAIL TIN
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
20-F40-10 20-F40-10 Aries Electronics 16008-thru-hole-female-dip-strip.pdf Description: CONN RCPT 20POS 0.2 TIN PCB
Packaging: Tube
Connector Type: Receptacle, Breakaway
Current Rating (Amps): 8A
Mounting Type: Through Hole
Number of Positions: 20
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.129" (3.28mm)
Insulation Height: 0.040" (1.02mm)
Row Spacing - Mating: 0.200" (5.08mm)
Number of Rows: 2
на замовлення 191 шт:
термін постачання 21-31 дні (днів)
1+1506.48 грн
10+1232.72 грн
100+1047.89 грн
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52-536-11 52-536-11 Aries Electronics Description: CONN SOCKET PLCC ZIF 52POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 52 (4 x 13)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
товару немає в наявності
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24-516-11 24-516-11 Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
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В кошику  од. на суму  грн.
95-132I25 95-132I25 Aries Electronics 18017-qfp-to-pga-adapter.pdf Description: SOCKET ADAPTER QFP TO 132PGA
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В кошику  од. на суму  грн.
96-100M65 Aries Electronics 96-100M65.pdf Description: SOCKET ADAPTER QFP TO 100PGA
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В кошику  од. на суму  грн.
96-160M65 96-160M65 Aries Electronics 18020-qfp-to-pga-adapter.pdf Description: SOCKET ADAPTER QFP TO 160PGA
товару немає в наявності
В кошику  од. на суму  грн.
14-3625-21 Aries Electronics Description: CONN HDR DIP POST 14POS GOLD
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В кошику  од. на суму  грн.
25-0625-21 Aries Electronics 12036-pin-line-header.pdf Description: CONN HDR STRIP POST 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Post
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
товару немає в наявності
В кошику  од. на суму  грн.
96-208M50 96-208M50 Aries Electronics 18031-qfp-to-pga-adapter.pdf Description: SOCKET ADAPTER QFP TO 208PGA
Packaging: Bulk
Number of Pins: 208
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
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В кошику  од. на суму  грн.
32-536-11 32-536-11 Aries Electronics Description: CONN SOCKET PLCC ZIF 32POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
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40-516-11 40-516-11 Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
1+1821.05 грн
В кошику  од. на суму  грн.
16-600-11 16-600-11 Aries Electronics 12032-dip-header.pdf Description: CONN HDR DIP FORK 16POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
на замовлення 278 шт:
термін постачання 21-31 дні (днів)
2+241.53 грн
23+186.58 грн
115+166.53 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
10-6823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 10POS TIN
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В кошику  од. на суму  грн.
24-6574-10 24-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
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В кошику  од. на суму  грн.
24-6574-11 24-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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В кошику  од. на суму  грн.
28-6574-10 28-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
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В кошику  од. на суму  грн.
28-6574-11 28-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
32-6574-10 32-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
32-6574-11 32-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
40-6574-10 40-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
40-6574-11 40-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS TIN
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В кошику  од. на суму  грн.
48-6574-10 48-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 48POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
48-6574-11 48-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 48POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
40-0518-10 40-0518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 6171 шт:
термін постачання 21-31 дні (днів)
2+317.07 грн
10+259.20 грн
100+220.30 грн
500+184.54 грн
1000+175.74 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
40-0518-11 40-0518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 148 шт:
термін постачання 21-31 дні (днів)
1+490.54 грн
10+427.05 грн
100+373.95 грн
В кошику  од. на суму  грн.
1107741 1107741 Aries Electronics 14005-oscillator-socket.pdf Description: OSCILLATOR SOCKET FULL SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Full Size
Package Accepted: 14-DIP, 4 Lead (Full Size)
Number of Positions: 14
на замовлення 1514 шт:
термін постачання 21-31 дні (днів)
5+82.17 грн
10+67.06 грн
28+62.34 грн
56+55.71 грн
112+53.04 грн
252+50.09 грн
504+46.92 грн
1008+44.68 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
1108800 1108800 Aries Electronics 14005-oscillator-socket.pdf Description: OSCILLATOR SOCKET HALF SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Half Size
Package Accepted: 8-DIP, 4 Lead (Half Size)
Part Status: Active
Number of Positions: 8
на замовлення 709 шт:
термін постачання 21-31 дні (днів)
5+67.23 грн
10+55.39 грн
49+49.46 грн
98+44.19 грн
147+42.95 грн
294+40.89 грн
539+38.54 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
08-6810-90 08-6810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
10-2810-90 10-2810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 867 шт:
термін постачання 21-31 дні (днів)
1+868.20 грн
10+642.14 грн
25+580.11 грн
50+505.08 грн
100+469.39 грн
250+427.27 грн
500+392.35 грн
В кошику  од. на суму  грн.
08-6810-90C 08-6810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
04-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 4POS
товару немає в наявності
В кошику  од. на суму  грн.
06-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 6POS
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В кошику  од. на суму  грн.
18-650-10 12033-header-covers.pdf
18-650-10
Виробник: Aries Electronics
Description: DIP HEADER COVER 18 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 18
Accessory Type: Cap (Cover)
товару немає в наявності
В кошику  од. на суму  грн.
24-650-10 12033-header-covers.pdf
24-650-10
Виробник: Aries Electronics
Description: DIP HEADER COVER 24 PIN .270
на замовлення 34 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
24-650-20 12033-header-covers.pdf
24-650-20
Виробник: Aries Electronics
Description: DIP HEADER COVER 24 PIN .510
на замовлення 89 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
28-650-10 12033-header-covers.pdf
28-650-10
Виробник: Aries Electronics
Description: DIP HEADER COVER 28 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 28
Accessory Type: Cap (Cover)
на замовлення 49 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+434.10 грн
10+319.95 грн
25+288.54 грн
В кошику  од. на суму  грн.
40-650-10 12033-header-covers.pdf
40-650-10
Виробник: Aries Electronics
Description: DIP HEADER COVER 40 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 40
Accessory Type: Cap (Cover)
на замовлення 136 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+387.62 грн
10+338.97 грн
25+321.08 грн
50+294.32 грн
100+280.31 грн
В кошику  од. на суму  грн.
08-810-90 13002-vertical-display-socket.pdf
08-810-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+647.41 грн
10+561.09 грн
25+528.54 грн
50+483.31 грн
В кошику  од. на суму  грн.
14-810-90 13002-vertical-display-socket.pdf
14-810-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 573 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+769.42 грн
10+603.93 грн
25+556.74 грн
50+491.32 грн
100+462.04 грн
250+426.01 грн
500+399.94 грн
В кошику  од. на суму  грн.
16-810-90 13002-vertical-display-socket.pdf
16-810-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
14-810-90T 13002-vertical-display-socket.pdf
14-810-90T
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 256 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+709.66 грн
10+614.96 грн
25+579.28 грн
50+529.71 грн
100+515.77 грн
250+460.01 грн
В кошику  од. на суму  грн.
16-810-90T 13002-vertical-display-socket.pdf
16-810-90T
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
10-810-90C 13004-vertical-display-socket.pdf
10-810-90C
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 47 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+779.38 грн
10+637.58 грн
25+597.63 грн
В кошику  од. на суму  грн.
14-810-90C 13004-vertical-display-socket.pdf
14-810-90C
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 101 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+794.32 грн
10+650.29 грн
25+609.53 грн
50+544.71 грн
100+518.72 грн
В кошику  од. на суму  грн.
16-810-90C 13004-vertical-display-socket.pdf
16-810-90C
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 49 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+873.18 грн
10+714.63 грн
25+669.85 грн
В кошику  од. на суму  грн.
08-823-90 13001-horizontal-display-socket.pdf
08-823-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+679.78 грн
10+592.10 грн
25+559.36 грн
В кошику  од. на суму  грн.
14-823-90 13001-horizontal-display-socket.pdf
14-823-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 314 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+833.33 грн
10+681.78 грн
25+639.07 грн
50+571.10 грн
100+543.84 грн
250+509.82 грн
В кошику  од. на суму  грн.
28-6823-90 13001-horizontal-display-socket.pdf
28-6823-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
40-6823-90 13001-horizontal-display-socket.pdf
40-6823-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 195 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1706.51 грн
10+1439.01 грн
25+1376.83 грн
50+1250.43 грн
100+1208.74 грн
В кошику  од. на суму  грн.
C9314-02 C84,C93.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
20-350001-10 18010-soic-and-soj-to-dip-adapter.pdf
20-350001-10
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
28-653000-10 18014-plcc-to-dip-adapter.pdf
28-653000-10
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3605.58 грн
В кошику  од. на суму  грн.
32-650000-10 18011-soic-and-soj-to-dip-adapter.pdf
32-650000-10
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Bulk
Size / Dimension: 3.200" L x 0.480" W (81.28mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOJ
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2683.44 грн
15+2134.43 грн
В кошику  од. на суму  грн.
32-450001-10 18011-soic-and-soj-to-dip-adapter.pdf
32-450001-10
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
28-350002-10 18010-soic-and-soj-to-dip-adapter.pdf
28-350002-10
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 71 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1139.61 грн
14+910.72 грн
28+867.21 грн
56+775.00 грн
В кошику  од. на суму  грн.
24-350000-10 18010-soic-and-soj-to-dip-adapter.pdf
24-350000-10
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Bulk
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 29 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1644.26 грн
16+1237.82 грн
В кошику  од. на суму  грн.
28-650000-10 450001%2C650000_Series.pdf
28-650000-10
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.480" W (71.12mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 129 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+4736.06 грн
17+3815.12 грн
В кошику  од. на суму  грн.
56-184M65
Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP TO 184PGA
Number of Pins: 184
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
товару немає в наявності
В кошику  од. на суму  грн.
68-505-110 18028-plcc-to-pga-adapter.pdf
68-505-110
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68PGA
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: PLCC
на замовлення 169 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2134.80 грн
10+1675.44 грн
25+1544.64 грн
50+1363.21 грн
100+1282.02 грн
В кошику  од. на суму  грн.
18-6511-10
Виробник: Aries Electronics
Description: SOCKET 18 PIN SOLDER TAIL TIN
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
20-F40-10 16008-thru-hole-female-dip-strip.pdf
20-F40-10
Виробник: Aries Electronics
Description: CONN RCPT 20POS 0.2 TIN PCB
Packaging: Tube
Connector Type: Receptacle, Breakaway
Current Rating (Amps): 8A
Mounting Type: Through Hole
Number of Positions: 20
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.129" (3.28mm)
Insulation Height: 0.040" (1.02mm)
Row Spacing - Mating: 0.200" (5.08mm)
Number of Rows: 2
на замовлення 191 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1506.48 грн
10+1232.72 грн
100+1047.89 грн
В кошику  од. на суму  грн.
52-536-11
52-536-11
Виробник: Aries Electronics
Description: CONN SOCKET PLCC ZIF 52POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 52 (4 x 13)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
товару немає в наявності
В кошику  од. на суму  грн.
24-516-11 516.pdf
24-516-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
95-132I25 18017-qfp-to-pga-adapter.pdf
95-132I25
Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP TO 132PGA
товару немає в наявності
В кошику  од. на суму  грн.
96-100M65 96-100M65.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP TO 100PGA
товару немає в наявності
В кошику  од. на суму  грн.
96-160M65 18020-qfp-to-pga-adapter.pdf
96-160M65
Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP TO 160PGA
товару немає в наявності
В кошику  од. на суму  грн.
14-3625-21
Виробник: Aries Electronics
Description: CONN HDR DIP POST 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
25-0625-21 12036-pin-line-header.pdf
Виробник: Aries Electronics
Description: CONN HDR STRIP POST 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Post
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
товару немає в наявності
В кошику  од. на суму  грн.
96-208M50 18031-qfp-to-pga-adapter.pdf
96-208M50
Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP TO 208PGA
Packaging: Bulk
Number of Pins: 208
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику  од. на суму  грн.
32-536-11
32-536-11
Виробник: Aries Electronics
Description: CONN SOCKET PLCC ZIF 32POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
товару немає в наявності
В кошику  од. на суму  грн.
40-516-11 516.pdf
40-516-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1821.05 грн
В кошику  од. на суму  грн.
16-600-11 12032-dip-header.pdf
16-600-11
Виробник: Aries Electronics
Description: CONN HDR DIP FORK 16POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
на замовлення 278 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+241.53 грн
23+186.58 грн
115+166.53 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
10-6823-90T 13001-horizontal-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
товару немає в наявності
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24-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
24-6574-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
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24-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
24-6574-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
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28-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
28-6574-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
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28-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
28-6574-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
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32-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
32-6574-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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32-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
32-6574-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
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40-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
40-6574-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
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40-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
40-6574-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
товару немає в наявності
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48-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
48-6574-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
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48-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
48-6574-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
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40-0518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
40-0518-10
Виробник: Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 6171 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+317.07 грн
10+259.20 грн
100+220.30 грн
500+184.54 грн
1000+175.74 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
40-0518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
40-0518-11
Виробник: Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 148 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+490.54 грн
10+427.05 грн
100+373.95 грн
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1107741 14005-oscillator-socket.pdf
1107741
Виробник: Aries Electronics
Description: OSCILLATOR SOCKET FULL SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Full Size
Package Accepted: 14-DIP, 4 Lead (Full Size)
Number of Positions: 14
на замовлення 1514 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+82.17 грн
10+67.06 грн
28+62.34 грн
56+55.71 грн
112+53.04 грн
252+50.09 грн
504+46.92 грн
1008+44.68 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
1108800 14005-oscillator-socket.pdf
1108800
Виробник: Aries Electronics
Description: OSCILLATOR SOCKET HALF SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Half Size
Package Accepted: 8-DIP, 4 Lead (Half Size)
Part Status: Active
Number of Positions: 8
на замовлення 709 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+67.23 грн
10+55.39 грн
49+49.46 грн
98+44.19 грн
147+42.95 грн
294+40.89 грн
539+38.54 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
08-6810-90 13002-vertical-display-socket.pdf
08-6810-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
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10-2810-90 13002-vertical-display-socket.pdf
10-2810-90
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 867 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+868.20 грн
10+642.14 грн
25+580.11 грн
50+505.08 грн
100+469.39 грн
250+427.27 грн
500+392.35 грн
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08-6810-90C 13004-vertical-display-socket.pdf
08-6810-90C
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
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04-655-10 16005-program-header-and-cover.pdf
Виробник: Aries Electronics
Description: CONN COVER HEADER 4POS
товару немає в наявності
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06-655-10 16005-program-header-and-cover.pdf
Виробник: Aries Electronics
Description: CONN COVER HEADER 6POS
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