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без ПДВ
40-6554-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS
товар відсутній
28-6554-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
24-6554-16 24-6554-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
1+3230.59 грн
10+ 2855 грн
20-0511-11 Aries Electronics 12008-strip-line-socket.pdf Description: CONN SOCKET SIP 20POS GOLD
товар відсутній
24-6570-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
24-6571-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
66-PRS11054-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
товар відсутній
08-350000-10-P Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
товар відсутній
12-675-191 Aries Electronics Description: IC SCKT DIP PROG HDR 12 PINS
товар відсутній
10-675-191 Aries Electronics Description: HEADER 10 PIN DIP GOLD
товар відсутній
ML-100 ML-100 Aries Electronics 16002-miniature-jumper.pdf Description: CONN MINI LINK JUMPER
Packaging: Bulk
Gender: Female Sockets
Contact Finish: Gold
Color: Black
Current Rating (Amps): 3A
Pitch: 0.100" (2.54mm)
Type: Open Top
Height: 0.250" (6.35mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 20.0µin (0.51µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
Part Status: Active
на замовлення 2595 шт:
термін постачання 21-31 дні (днів)
6+48.14 грн
10+ 39.44 грн
25+ 37.81 грн
50+ 34.74 грн
100+ 33.22 грн
250+ 30.2 грн
500+ 26.74 грн
1000+ 23.77 грн
2500+ 21.54 грн
Мінімальне замовлення: 6
209-PGM17020-10 209-PGM17020-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
1+1689.31 грн
10+ 1424.7 грн
108-PGM12005-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
10-2513-10 10-2513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
на замовлення 343 шт:
термін постачання 21-31 дні (днів)
3+133.65 грн
10+ 112.3 грн
100+ 100.31 грн
Мінімальне замовлення: 3
21-0513-10 Aries Electronics 12013-pin-line-collet-socket.pdf Description: CONN SOCKET SIP 21POS GOLD
товар відсутній
64-304121-00 Aries Electronics 64-304121-00.pdf Description: SOCKET ADAPTER TQFP TO 64QFP
товар відсутній
14-012-211 Aries Electronics Description: CONN MALE/FEMALE DIP JUMPER ASSY
Packaging: Bulk
Connector Type: DIP to DIP
Contact Finish: Gold
Color: Multiple, Ribbon
Length: 1.00' (304.80mm)
Shielding: Unshielded
Number of Positions: 14
Number of Rows: 2
Usage: Socket (0.1"), Board In
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Solder
Pitch - Cable: 0.050" (1.27mm)
Pitch - Connector: 0.100" (2.54mm)
товар відсутній
16-6625-11 Aries Electronics 12035-dip-header.pdf Description: DIP HEADER 625 SERIES
товар відсутній
84-505-110 Aries Electronics 505_Series.pdf Description: SOCKET ADAPTER PLCC TO 84PGA
товар відсутній
169-PRS13001-16 Aries Electronics Description: CONN SOCKET PGA ZIF GOLD
товар відсутній
18-6513-10 18-6513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 158 шт:
термін постачання 21-31 дні (днів)
2+255.08 грн
10+ 222.8 грн
25+ 211.01 грн
50+ 193.44 грн
100+ 184.22 грн
Мінімальне замовлення: 2
14-054-108 Aries Electronics Description: 14POS DIP CABLE
товар відсутній
07-002-171 Aries Electronics 11005-flat-pin-staked-flex-jumpers.pdf Description: FLAT FLEX CABLE 7 POS 2" 26AWG
товар відсутній
24-6553-11 Aries Electronics Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
08-350000-10-HT Aries Electronics 18005-high-temp-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Number of Pins: 8
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: Polyimide (PI)
Part Status: Active
товар відсутній
68-PRS11033-12 Aries Electronics Description: CONN SOCKET PGA ZIF GOLD
товар відсутній
05-0513-10T 05-0513-10T Aries Electronics 12013-pin-line-collet-socket.pdf Description: CONN SOCKET SIP 5POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 2511 шт:
термін постачання 21-31 дні (днів)
5+69.7 грн
10+ 56.95 грн
100+ 51.11 грн
1000+ 34.88 грн
Мінімальне замовлення: 5
12-005-152FB Aries Electronics Description: CABLE 12POS .100 JUMPER 5 INCHES
товар відсутній
28-3554-10 Aries Electronics Description: 28 PIN ZIF SOCKET TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
40-6501-30 Aries Electronics Description: CONN IC DIP SOCKET 40POS TIN
товар відсутній
32-650000-10-P Aries Electronics Description: SOCKET ADAPTER SOIC TO 32DIP 0.6
товар відсутній
20-7800-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 20POS TIN
Features: Carrier, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
07-0513-10 07-0513-10 Aries Electronics 12013-pin-line-collet-socket.pdf Description: CONN SOCKET SIP 7POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 300 шт:
термін постачання 21-31 дні (днів)
4+90.54 грн
10+ 75.84 грн
100+ 67.76 грн
Мінімальне замовлення: 4
24-3551-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
товар відсутній
24-3552-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
товар відсутній
24-6551-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
товар відсутній
24-6552-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
товар відсутній
24-6553-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
товар відсутній
44-6552-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 44POS
товар відсутній
24-3551-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
24-3551-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
24-3552-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
24-3552-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
24-3553-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
24-3553-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
24-3553-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
товар відсутній
24-6551-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
товар відсутній
24-6551-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
24-6552-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
товар відсутній
24-6552-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
24-6553-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
товар відсутній
1109253 Aries Electronics Description: SER X55X UNIV ZIF DIP TST SCKT
товар відсутній
1110729-24 Aries Electronics Description: SER X55X UNIV ZIF DIP TST SCKT
Part Status: Active
товар відсутній
24-3554-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
товар відсутній
44-3554-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 44POS
товар відсутній
24-3554-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
товар відсутній
24-3554-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
7410-101-10 Aries Electronics Description: SER X55X UNIV ZIF DIP TST SCKT
товар відсутній
28-3551-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
28-3552-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
40-6554-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS
товар відсутній
28-6554-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
24-6554-16 10001-universal-dip-zif-test-socket.pdf
24-6554-16
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+3230.59 грн
10+ 2855 грн
20-0511-11 12008-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 20POS GOLD
товар відсутній
24-6570-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
24-6571-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
66-PRS11054-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
товар відсутній
08-350000-10-P 18010-soic-and-soj-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
товар відсутній
12-675-191
Виробник: Aries Electronics
Description: IC SCKT DIP PROG HDR 12 PINS
товар відсутній
10-675-191
Виробник: Aries Electronics
Description: HEADER 10 PIN DIP GOLD
товар відсутній
ML-100 16002-miniature-jumper.pdf
ML-100
Виробник: Aries Electronics
Description: CONN MINI LINK JUMPER
Packaging: Bulk
Gender: Female Sockets
Contact Finish: Gold
Color: Black
Current Rating (Amps): 3A
Pitch: 0.100" (2.54mm)
Type: Open Top
Height: 0.250" (6.35mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 20.0µin (0.51µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
Part Status: Active
на замовлення 2595 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
6+48.14 грн
10+ 39.44 грн
25+ 37.81 грн
50+ 34.74 грн
100+ 33.22 грн
250+ 30.2 грн
500+ 26.74 грн
1000+ 23.77 грн
2500+ 21.54 грн
Мінімальне замовлення: 6
209-PGM17020-10 14033-pga-socket-header.pdf
209-PGM17020-10
Виробник: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1689.31 грн
10+ 1424.7 грн
108-PGM12005-10 14033-pga-socket-header.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
10-2513-10 12011-dip-collet-socket.pdf
10-2513-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
на замовлення 343 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3+133.65 грн
10+ 112.3 грн
100+ 100.31 грн
Мінімальне замовлення: 3
21-0513-10 12013-pin-line-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 21POS GOLD
товар відсутній
64-304121-00 64-304121-00.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER TQFP TO 64QFP
товар відсутній
14-012-211
Виробник: Aries Electronics
Description: CONN MALE/FEMALE DIP JUMPER ASSY
Packaging: Bulk
Connector Type: DIP to DIP
Contact Finish: Gold
Color: Multiple, Ribbon
Length: 1.00' (304.80mm)
Shielding: Unshielded
Number of Positions: 14
Number of Rows: 2
Usage: Socket (0.1"), Board In
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Solder
Pitch - Cable: 0.050" (1.27mm)
Pitch - Connector: 0.100" (2.54mm)
товар відсутній
16-6625-11 12035-dip-header.pdf
Виробник: Aries Electronics
Description: DIP HEADER 625 SERIES
товар відсутній
84-505-110 505_Series.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 84PGA
товар відсутній
169-PRS13001-16
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
товар відсутній
18-6513-10 12011-dip-collet-socket.pdf
18-6513-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 158 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+255.08 грн
10+ 222.8 грн
25+ 211.01 грн
50+ 193.44 грн
100+ 184.22 грн
Мінімальне замовлення: 2
14-054-108
Виробник: Aries Electronics
Description: 14POS DIP CABLE
товар відсутній
07-002-171 11005-flat-pin-staked-flex-jumpers.pdf
Виробник: Aries Electronics
Description: FLAT FLEX CABLE 7 POS 2" 26AWG
товар відсутній
24-6553-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
08-350000-10-HT 18005-high-temp-soic-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Number of Pins: 8
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: Polyimide (PI)
Part Status: Active
товар відсутній
68-PRS11033-12
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
товар відсутній
05-0513-10T 12013-pin-line-collet-socket.pdf
05-0513-10T
Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 2511 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
5+69.7 грн
10+ 56.95 грн
100+ 51.11 грн
1000+ 34.88 грн
Мінімальне замовлення: 5
12-005-152FB
Виробник: Aries Electronics
Description: CABLE 12POS .100 JUMPER 5 INCHES
товар відсутній
28-3554-10
Виробник: Aries Electronics
Description: 28 PIN ZIF SOCKET TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
40-6501-30
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS TIN
товар відсутній
32-650000-10-P
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 32DIP 0.6
товар відсутній
20-7800-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 20POS TIN
Features: Carrier, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
07-0513-10 12013-pin-line-collet-socket.pdf
07-0513-10
Виробник: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
4+90.54 грн
10+ 75.84 грн
100+ 67.76 грн
Мінімальне замовлення: 4
24-3551-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
товар відсутній
24-3552-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
товар відсутній
24-6551-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
товар відсутній
24-6552-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
товар відсутній
24-6553-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
товар відсутній
44-6552-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 44POS
товар відсутній
24-3551-10 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
24-3551-11 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
24-3552-10 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
24-3552-11 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
24-3553-10 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
24-3553-11 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
24-3553-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
товар відсутній
24-6551-10 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товар відсутній
24-6551-11 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
24-6552-10 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товар відсутній
24-6552-11 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
24-6553-10 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товар відсутній
1109253
Виробник: Aries Electronics
Description: SER X55X UNIV ZIF DIP TST SCKT
товар відсутній
1110729-24
Виробник: Aries Electronics
Description: SER X55X UNIV ZIF DIP TST SCKT
Part Status: Active
товар відсутній
24-3554-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
товар відсутній
44-3554-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 44POS
товар відсутній
24-3554-10 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товар відсутній
24-3554-11 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
товар відсутній
7410-101-10
Виробник: Aries Electronics
Description: SER X55X UNIV ZIF DIP TST SCKT
товар відсутній
28-3551-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
28-3552-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
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