Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (37094) > Сторінка 105 з 619

Виробник: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 16QFN

Виробник: NXP USA Inc.
Description: DEBUGGER U-LINK2 JTAG FOR NXP
Packaging: Bulk
For Use With/Related Products: LPC2000, LPC3000
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Utilized IC / Part: LPC2000, LPC3000
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: DEBUGGER J-LINK JTAG
Packaging: Bulk
For Use With/Related Products: ARM7®, ARM9®, ARM11®, Cortex®
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s)
Utilized IC / Part: ARM7®, ARM9®, ARM11®, Cortex®
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: PHYTEC PHYCORE RAPID DEV LPC3180
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM9
Board Type: Evaluation Platform
Utilized IC / Part: LPC3180
Platform: PHYTEC phyCORE Rapid Dev Kit
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: IC LED DRIVER PS I2C 25MA 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active

Виробник: NXP USA Inc.
Description: IC LED DRVR PS I2C 25MA 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active

Виробник: NXP USA Inc.
Description: IC LED DRVR LIN PWM 25MA 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 100kHz ~ 1MHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 28-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active

Виробник: NXP USA Inc.
Description: IC CNTRLR PARALLEL/I2C 20-SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 100µA
Protocol: I2C
Supplier Device Package: 20-SO
Part Status: Obsolete
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC CNTRLR PARALLEL/I2C 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 100µA
Protocol: I2C
Supplier Device Package: 20-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 16TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 20SSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 20-SSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 16TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 20SSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 20-SSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 8HVSON
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 8-VFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 4
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 8-HVSON (3x3)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: MC9S12XDT512 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS12X
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12XDT512
Part Status: Active

Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-DIP
Number of I/O: 14
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2011
Packaging: Bulk
For Use With/Related Products: BGA2714
Frequency: 1.8GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2022
Packaging: Bulk
For Use With/Related Products: BGA2711
Frequency: 0Hz ~ 2.4GHz
Type: Mixer
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2711
Packaging: Bulk
For Use With/Related Products: BGA2011
Frequency: 1GHz ~ 3.6GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2714
Packaging: Bulk
For Use With/Related Products: BGA2714
Frequency: 2.7GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2001
Packaging: Bulk
For Use With/Related Products: BGA2001
Frequency: 1.8GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2001
Packaging: Bulk
For Use With/Related Products: BGA2001
Frequency: 1.8GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2003
Packaging: Bulk
For Use With/Related Products: BGA2003
Frequency: 1.8GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2012
Packaging: Bulk
For Use With/Related Products: BGA2012
Frequency: 1.9GHz
Type: Amplifier
Contents: Board(s)
Utilized IC / Part: BGA2012
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2022
Packaging: Bulk
For Use With/Related Products: BGA2022
Type: Mixer
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2031
Packaging: Bulk
For Use With/Related Products: BGA2031
Frequency: 1.8GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2709
Packaging: Bulk
For Use With/Related Products: BGA2709
Frequency: 1.8GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2712
Packaging: Bulk
For Use With/Related Products: BGA2712
Frequency: 1GHz ~ 3.2GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2715
Packaging: Bulk
For Use With/Related Products: BGA2715
Frequency: 0Hz ~ 4GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2716
Packaging: Bulk
For Use With/Related Products: BGA2716
Frequency: 50MHz ~ 3.6GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2748
Packaging: Bulk
For Use With/Related Products: BGA2748
Frequency: 100MHz ~ 2.2GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2771
Packaging: Bulk
For Use With/Related Products: BGA2771
Frequency: 20MHz ~ 2.5GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2776
Packaging: Bulk
For Use With/Related Products: BGA2776
Frequency: 0Hz ~ 3GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA6489B
Packaging: Bulk
For Use With/Related Products: BGA6489B
Frequency: 500MHz ~ 3.5GHz
Type: Amplifier
Supplied Contents: Board(s)

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA6589B

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGM1011

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGM1013
Packaging: Bulk
For Use With/Related Products: BGM1013
Frequency: 0Hz ~ 2.2GHz
Type: Amplifier
Supplied Contents: Board(s)

Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8DIP

Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified

Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Part Status: Obsolete
Number of I/O: 4
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8DIP

Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Number of I/O: 4
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 5V, 12V
Supplier Device Package: 20-SOIC
Grade: Automotive

Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC

Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 1.1Ohm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage

Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive

Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 1.1Ohm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage

Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive

Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-SOIC

Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-SOIC

Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage

Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 18V
Current - Supply: 42mA
Supplier Device Package: 28-SOIC
Grade: Automotive

Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 18V
Current - Supply: 42mA
Supplier Device Package: 28-SOIC
Grade: Automotive

Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC

Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC

Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 350mOhm
Voltage - Load: 5.5V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3A
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage

Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC

Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC