Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35983) > Сторінка 407 з 600
| Фото | Назва | Виробник | Інформація |
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A3G26D055N-100 | NXP USA Inc. |
Description: RF MOSFET GAN 48V 6DFNPackaging: Bulk Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 100MHz ~ 2.69GHz Power - Output: 8W Gain: 13.9dB Technology: GaN Supplier Device Package: 6-PDFN (7x6.5) Part Status: Active Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 40 mA |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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MIMXRT685SFFOB | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 249FOWLPPackaging: Tray Package / Case: 249-WFBGA Mounting Type: Surface Mount Speed: 300MHz RAM Size: 4.5M x 8 Operating Temperature: -20°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 249-FOWLP (7x7) Part Status: Active Number of I/O: 147 DigiKey Programmable: Not Verified |
на замовлення 670 шт: термін постачання 21-31 дні (днів) |
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| BC846B215 | NXP USA Inc. |
Description: 0.1A, 65V, NPN, TO 236ABPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MKV30F128VLF10557 | NXP USA Inc. |
Description: KINETIS KV30: 100MHZ CORTEX-M4F |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| NT3H1201W0FHK125 | NXP USA Inc. |
Description: NTAG I2C 1K - ENERGY HARVESTINGPackaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 3400 шт: термін постачання 21-31 дні (днів) |
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| SL3S4021FHK125 | NXP USA Inc. |
Description: UCODE I2C UHF RFID Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| NT3H1101W0FHK125 | NXP USA Inc. |
Description: NTAG I2C 1K - ENERGY HARVESTING Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MCF51JF64VHS | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 9x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 31 DigiKey Programmable: Not Verified |
на замовлення 490 шт: термін постачання 21-31 дні (днів) |
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| SAF4000EL/101S233Y | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tape & Reel (TR) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| SAF4000EL/101S233K | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MK66FN2M0VLQ18R,528 | NXP USA Inc. |
Description: KINETIS K66, RISC MICROCONTROLLE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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CBTU02044HEJ | NXP USA Inc. |
Description: SWITCH 1-2 PCIE GEN4 HUQFN16Packaging: Tape & Reel (TR) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: PCIe On-State Resistance (Max): 14Ohm -3db Bandwidth: 17GHz Supplier Device Package: 16-HUQFN (1.6x2.4) Voltage - Supply, Single (V+): 1.62V ~ 3.63V Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 1:2 Part Status: Active Number of Channels: 2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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CBTU02044HEJ | NXP USA Inc. |
Description: SWITCH 1-2 PCIE GEN4 HUQFN16Packaging: Cut Tape (CT) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: PCIe On-State Resistance (Max): 14Ohm -3db Bandwidth: 17GHz Supplier Device Package: 16-HUQFN (1.6x2.4) Voltage - Supply, Single (V+): 1.62V ~ 3.63V Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 1:2 Part Status: Active Number of Channels: 2 |
на замовлення 7607 шт: термін постачання 21-31 дні (днів) |
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LPC1311FHN33 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LPC1313FHN33/01551 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| LPC1313FBD48/01 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| AFT09MS031NR1528 | NXP USA Inc. |
Description: RF POWER LDMOS TRANSISTOR |
на замовлення 1139 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | |||||||||||||||
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BTA330-800BT127 | NXP USA Inc. |
Description: 3 QUADRANT TRIAC TO 220ABPackaging: Bulk Part Status: Active |
на замовлення 3891 шт: термін постачання 21-31 дні (днів) |
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LPC1111FDH20/002518 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 20TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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BAV99QA147 | NXP USA Inc. |
Description: RECTIFIER DIODEPackaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 4 ns Technology: Standard Diode Configuration: 1 Pair Series Connection Current - Average Rectified (Io) (per Diode): 170mA (DC) Supplier Device Package: DFN1010D-3 Operating Temperature - Junction: 150°C (Max) Part Status: Active Voltage - DC Reverse (Vr) (Max): 90 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA Current - Reverse Leakage @ Vr: 500 nA @ 80 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LD6836CX4/20P,315 | NXP USA Inc. |
Description: IC REG LINEAR 2V 300MA 4WLCSPPackaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 300mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 2V Control Features: Enable Part Status: Obsolete PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.16V @ 300mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
на замовлення 18000 шт: термін постачання 21-31 дні (днів) |
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74HCT4852PW-Q100118 | NXP USA Inc. |
Description: DIFFERENTIAL MUX, 4 CHANNELPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74HCT4851BQ-Q100115 | NXP USA Inc. |
Description: 74HCT4851 - SINGLE-ENDED MUXPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74HCT4851PW/C4118 | NXP USA Inc. |
Description: SINGLE-ENDED MUX, 8 CHANNELPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74HCT4851PW-Q100118 | NXP USA Inc. |
Description: SINGLE-ENDED MUX, 8 CHANNELPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74HCT4851PW/S400118 | NXP USA Inc. |
Description: SINGLE-ENDED MUX, 8 CHANNELPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74AHC32PW653 | NXP USA Inc. |
Description: IC GATE ORPackaging: Bulk |
на замовлення 7500 шт: термін постачання 21-31 дні (днів) |
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BZX84-C3V0/DG/B3215 | NXP USA Inc. |
Description: DIODE ZENERPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| BUK7226-75A118 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFETPackaging: Bulk Part Status: Active |
на замовлення 13044 шт: термін постачання 21-31 дні (днів) |
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BUK7516-55A,127 | NXP USA Inc. |
Description: PFET, 65.7A I(D), 55V, 0.016OHM,Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 65.7A (Tc) Rds On (Max) @ Id, Vgs: 16mOhm @ 25A, 10V Power Dissipation (Max): 138W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-220AB Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 55 V Input Capacitance (Ciss) (Max) @ Vds: 2245 pF @ 25 V |
на замовлення 4277 шт: термін постачання 21-31 дні (днів) |
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SPC5744BFK1ACKU2 | NXP USA Inc. | Description: IC MCU 32BIT 1.5MB FLASH 176LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| SPC5744BFK1AVKU2 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, I²S, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| SPC5745BFK1AVKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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TDA8035H/C1157 | NXP USA Inc. |
Description: HIGH INTEGRATED AND LOW POWER SMPackaging: Bulk Part Status: Active |
на замовлення 1519 шт: термін постачання 21-31 дні (днів) |
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TDA8007BHL/C4,118 | NXP USA Inc. |
Description: IC INTERFACE CARD MP 48LQFP |
на замовлення 9477 шт: термін постачання 21-31 дні (днів) |
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| TDA8026ET/C3/S1518 | NXP USA Inc. |
Description: MULTIPLE SMART CARD SLOT INTERFAPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| TDA8026ET/C2518 | NXP USA Inc. |
Description: IC SMART CARD SLOT 64TFBGAPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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TDA8763M/4/C4,112 | NXP USA Inc. |
Description: IC ADC 10BIT SIGMA-DELTA 28SSOPPackaging: Bulk Package / Case: 28-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Number of Bits: 10 Configuration: ADC Data Interface: Parallel Reference Type: Internal Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 5V Voltage - Supply, Digital: 5V Sampling Rate (Per Second): 40M Input Type: Single Ended Number of Inputs: 1 Supplier Device Package: 28-SSOP Architecture: Sigma-Delta Part Status: Obsolete Number of A/D Converters: 1 |
на замовлення 658 шт: термін постачання 21-31 дні (днів) |
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S9S08DZ32F2CLC | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 25 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| LPC3220FET296/01551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 296TFBGAPackaging: Bulk Package / Case: 296-TFBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM926EJ-S Data Converters: A/D 3x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V Connectivity: EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT Supplier Device Package: 296-TFBGA (15x15) Part Status: Active Number of I/O: 51 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| OM11079598 | NXP USA Inc. |
Description: SOMDIMM-LPC3250 - MODULAR LPC325 Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MC33FS6600M2ES | NXP USA Inc. |
Description: SAFETY SBC FOR S32S2 MCUPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Applications: Safety Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive |
на замовлення 255 шт: термін постачання 21-31 дні (днів) |
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| BUK724R5-30C118 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFETPackaging: Bulk Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 4.5mOhm @ 25A, 10V Power Dissipation (Max): 157W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: DPAK Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 3760 pF @ 25 V |
на замовлення 8878 шт: термін постачання 21-31 дні (днів) |
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BT234-600D,127 | NXP USA Inc. |
Description: TRIAC 600V 4A TO220ABPackaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Triac Type: Standard Configuration: Single Operating Temperature: 125°C (TJ) Current - Hold (Ih) (Max): 6 mA Current - Gate Trigger (Igt) (Max): 10 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 35A @ 50Hz Voltage - Gate Trigger (Vgt) (Max): 1 V Supplier Device Package: TO-220AB Current - On State (It (RMS)) (Max): 4 A Voltage - Off State: 600 V |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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| BT236X-600,127 | NXP USA Inc. |
Description: TRIAC 600V 6A TO-220F Packaging: Bulk |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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| BT236X-800G,127 | NXP USA Inc. |
Description: TRIAC 800V 6A TO-220F Packaging: Bulk |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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| BT236X-800,127 | NXP USA Inc. |
Description: TRIAC 800V 6A TO-220F Packaging: Bulk |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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LPC1752FBD80K | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 80LQFPPackaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 6x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 80-LQFP (12x12) Part Status: Active Number of I/O: 52 DigiKey Programmable: Not Verified |
на замовлення 476 шт: термін постачання 21-31 дні (днів) |
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LPC1756FBD80K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 80LQFPPackaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 6x12b SAR; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 80-LQFP (12x12) Part Status: Active Number of I/O: 52 DigiKey Programmable: Not Verified |
на замовлення 1190 шт: термін постачання 21-31 дні (днів) |
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LPC1759FBD80K | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 80LQFPPackaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 6x12b SAR; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 80-LQFP (12x12) Part Status: Active Number of I/O: 52 DigiKey Programmable: Not Verified |
на замовлення 595 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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S9S08EL32F1MTLR | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 28TSSOPPackaging: Tape & Reel (TR) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-TSSOP Part Status: Active Number of I/O: 22 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| PXLS84422AESR2 | NXP USA Inc. |
Description: 2 AXIS MED/MED XZ Packaging: Tape & Reel (TR) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| FS32V234CON1VUB/PHS | NXP USA Inc. |
Description: ARM CORTEX-A53 64-BIT CPU |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| FS32V232CKN1VUB | NXP USA Inc. | Description: ISP CSE 1GHZ DUAL CORE |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
FS32V234BMN1VUB | NXP USA Inc. |
Description: IC MPU FS32V23 800MHZ 621FCPBGAPackaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: 1Gbps Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
FS32V234BLN1VUB | NXP USA Inc. |
Description: IC MPU FS32V23 800MHZ 621FCPBGAPackaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: 1Gbps Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| FS32V234CON1VUBR | NXP USA Inc. |
Description: ISP GPU CSE 1GHZ 4 CO |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| FS32V234CKN1VUBR | NXP USA Inc. |
Description: ISP CSE 1GHZ 4 CORES |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
74AHCT1G86GV-Q100125 | NXP USA Inc. |
Description: IC GATE XORPackaging: Bulk Part Status: Active Package / Case: SC-74A, SOT-753 Mounting Type: Surface Mount Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 8mA, 8mA Number of Inputs: 2 Supplier Device Package: 5-TSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF Grade: Automotive Number of Circuits: 1 Current - Quiescent (Max): 1 µA Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
|
LX2160XE72029B | NXP USA Inc. |
Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGAPackaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Speed: 2GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A72 Voltage - I/O: 1.2V, 1.8V, 3.3V Supplier Device Package: 1517-FCPBGA (40x40) Ethernet: 100Gbps (2) USB: USB 3.0 (2) + PHY (2) Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR4 Graphics Acceleration: Yes Security Features: Secure Boot, TrustZone® SATA: SATA 3.0 (4) Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
|
| A3G26D055N-100 |
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Виробник: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
Description: RF MOSFET GAN 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 31820.91 грн |
| MIMXRT685SFFOB |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tray
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tray
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
на замовлення 670 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1785.29 грн |
| 10+ | 1381.53 грн |
| 25+ | 1297.23 грн |
| 100+ | 1130.44 грн |
| 250+ | 1088.99 грн |
| 500+ | 1064.01 грн |
| MKV30F128VLF10557 |
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Виробник: NXP USA Inc.
Description: KINETIS KV30: 100MHZ CORTEX-M4F
Description: KINETIS KV30: 100MHZ CORTEX-M4F
товару немає в наявності
В кошику
од. на суму грн.
| NT3H1201W0FHK125 |
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Виробник: NXP USA Inc.
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3400 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 384+ | 65.19 грн |
| SL3S4021FHK125 |
Виробник: NXP USA Inc.
Description: UCODE I2C UHF RFID
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: UCODE I2C UHF RFID
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| NT3H1101W0FHK125 |
Виробник: NXP USA Inc.
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MCF51JF64VHS |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
на замовлення 490 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 626.86 грн |
| 10+ | 474.06 грн |
| 80+ | 392.50 грн |
| SAF4000EL/101S233Y |
Виробник: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MK66FN2M0VLQ18R,528 |
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Виробник: NXP USA Inc.
Description: KINETIS K66, RISC MICROCONTROLLE
Description: KINETIS K66, RISC MICROCONTROLLE
товару немає в наявності
В кошику
од. на суму грн.
| CBTU02044HEJ |
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Виробник: NXP USA Inc.
Description: SWITCH 1-2 PCIE GEN4 HUQFN16
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: PCIe
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 17GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 1:2
Part Status: Active
Number of Channels: 2
Description: SWITCH 1-2 PCIE GEN4 HUQFN16
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: PCIe
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 17GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 1:2
Part Status: Active
Number of Channels: 2
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В кошику
од. на суму грн.
| CBTU02044HEJ |
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Виробник: NXP USA Inc.
Description: SWITCH 1-2 PCIE GEN4 HUQFN16
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: PCIe
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 17GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 1:2
Part Status: Active
Number of Channels: 2
Description: SWITCH 1-2 PCIE GEN4 HUQFN16
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: PCIe
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 17GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 1:2
Part Status: Active
Number of Channels: 2
на замовлення 7607 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 64.36 грн |
| 10+ | 61.49 грн |
| 25+ | 60.69 грн |
| 100+ | 56.70 грн |
| 250+ | 56.51 грн |
| LPC1311FHN33 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
товару немає в наявності
В кошику
од. на суму грн.
| LPC1313FHN33/01551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
товару немає в наявності
В кошику
од. на суму грн.
| LPC1313FBD48/01 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Description: IC MCU 32BIT 32KB FLASH 48LQFP
товару немає в наявності
В кошику
од. на суму грн.
| AFT09MS031NR1528 |
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Виробник: NXP USA Inc.
Description: RF POWER LDMOS TRANSISTOR
Description: RF POWER LDMOS TRANSISTOR
на замовлення 1139 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| BTA330-800BT127 |
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на замовлення 3891 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 407+ | 57.85 грн |
| LPC1111FDH20/002518 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Description: IC MCU 32BIT 8KB FLASH 20TSSOP
товару немає в наявності
В кошику
од. на суму грн.
| BAV99QA147 |
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Виробник: NXP USA Inc.
Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 170mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 90 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 170mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 90 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
товару немає в наявності
В кошику
од. на суму грн.
| LD6836CX4/20P,315 |
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Виробник: NXP USA Inc.
Description: IC REG LINEAR 2V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 18000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2885+ | 7.84 грн |
| 74AHC32PW653 |
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на замовлення 7500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3328+ | 6.86 грн |
| BUK7226-75A118 |
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на замовлення 13044 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 951+ | 26.75 грн |
| BUK7516-55A,127 |
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Виробник: NXP USA Inc.
Description: PFET, 65.7A I(D), 55V, 0.016OHM,
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 65.7A (Tc)
Rds On (Max) @ Id, Vgs: 16mOhm @ 25A, 10V
Power Dissipation (Max): 138W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2245 pF @ 25 V
Description: PFET, 65.7A I(D), 55V, 0.016OHM,
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 65.7A (Tc)
Rds On (Max) @ Id, Vgs: 16mOhm @ 25A, 10V
Power Dissipation (Max): 138W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2245 pF @ 25 V
на замовлення 4277 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 740+ | 32.63 грн |
| SPC5744BFK1ACKU2 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
товару немає в наявності
В кошику
од. на суму грн.
| SPC5744BFK1AVKU2 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| SPC5745BFK1AVKU6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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| TDA8035H/C1157 |
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Виробник: NXP USA Inc.
Description: HIGH INTEGRATED AND LOW POWER SM
Packaging: Bulk
Part Status: Active
Description: HIGH INTEGRATED AND LOW POWER SM
Packaging: Bulk
Part Status: Active
на замовлення 1519 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 436+ | 57.67 грн |
| TDA8007BHL/C4,118 |
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Виробник: NXP USA Inc.
Description: IC INTERFACE CARD MP 48LQFP
Description: IC INTERFACE CARD MP 48LQFP
на замовлення 9477 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 82+ | 308.78 грн |
| TDA8026ET/C3/S1518 |
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Виробник: NXP USA Inc.
Description: MULTIPLE SMART CARD SLOT INTERFA
Packaging: Bulk
Part Status: Active
Description: MULTIPLE SMART CARD SLOT INTERFA
Packaging: Bulk
Part Status: Active
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| TDA8763M/4/C4,112 |
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Виробник: NXP USA Inc.
Description: IC ADC 10BIT SIGMA-DELTA 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 40M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Architecture: Sigma-Delta
Part Status: Obsolete
Number of A/D Converters: 1
Description: IC ADC 10BIT SIGMA-DELTA 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 40M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Architecture: Sigma-Delta
Part Status: Obsolete
Number of A/D Converters: 1
на замовлення 658 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 20+ | 1299.68 грн |
| S9S08DZ32F2CLC |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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| LPC3220FET296/01551 |
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Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Active
Number of I/O: 51
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Active
Number of I/O: 51
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| OM11079598 |
Виробник: NXP USA Inc.
Description: SOMDIMM-LPC3250 - MODULAR LPC325
Packaging: Bulk
Part Status: Active
Description: SOMDIMM-LPC3250 - MODULAR LPC325
Packaging: Bulk
Part Status: Active
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| MC33FS6600M2ES |
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Виробник: NXP USA Inc.
Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
на замовлення 255 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 909.36 грн |
| 10+ | 686.46 грн |
| 25+ | 639.28 грн |
| 100+ | 551.30 грн |
| BUK724R5-30C118 |
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Виробник: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4.5mOhm @ 25A, 10V
Power Dissipation (Max): 157W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3760 pF @ 25 V
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4.5mOhm @ 25A, 10V
Power Dissipation (Max): 157W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3760 pF @ 25 V
на замовлення 8878 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 683+ | 36.78 грн |
| BT234-600D,127 |
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Виробник: NXP USA Inc.
Description: TRIAC 600V 4A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 6 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 35A @ 50Hz
Voltage - Gate Trigger (Vgt) (Max): 1 V
Supplier Device Package: TO-220AB
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
Description: TRIAC 600V 4A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 6 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 35A @ 50Hz
Voltage - Gate Trigger (Vgt) (Max): 1 V
Supplier Device Package: TO-220AB
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1095+ | 20.12 грн |
| BT236X-600,127 |
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 846+ | 27.19 грн |
| BT236X-800G,127 |
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 846+ | 27.19 грн |
| BT236X-800,127 |
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1000+ | 27.19 грн |
| LPC1752FBD80K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
на замовлення 476 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 622.68 грн |
| 10+ | 414.98 грн |
| 25+ | 403.26 грн |
| 119+ | 359.41 грн |
| 357+ | 356.83 грн |
| LPC1756FBD80K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
на замовлення 1190 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 882.61 грн |
| 10+ | 665.77 грн |
| 25+ | 619.61 грн |
| 119+ | 529.13 грн |
| 357+ | 503.86 грн |
| 595+ | 494.51 грн |
| 1071+ | 477.34 грн |
| LPC1759FBD80K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
на замовлення 595 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| S9S08EL32F1MTLR |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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| FS32V234CON1VUB/PHS |
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Виробник: NXP USA Inc.
Description: ARM CORTEX-A53 64-BIT CPU
Description: ARM CORTEX-A53 64-BIT CPU
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| FS32V232CKN1VUB |
Виробник: NXP USA Inc.
Description: ISP CSE 1GHZ DUAL CORE
Description: ISP CSE 1GHZ DUAL CORE
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| FS32V234BMN1VUB |
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Виробник: NXP USA Inc.
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: 1Gbps
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: 1Gbps
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
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| FS32V234BLN1VUB |
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Виробник: NXP USA Inc.
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: 1Gbps
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: 1Gbps
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
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| FS32V234CON1VUBR |
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Виробник: NXP USA Inc.
Description: ISP GPU CSE 1GHZ 4 CO
Description: ISP GPU CSE 1GHZ 4 CO
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| FS32V234CKN1VUBR |
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Виробник: NXP USA Inc.
Description: ISP CSE 1GHZ 4 CORES
Description: ISP CSE 1GHZ 4 CORES
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| 74AHCT1G86GV-Q100125 |
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Виробник: NXP USA Inc.
Description: IC GATE XOR
Packaging: Bulk
Part Status: Active
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Grade: Automotive
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
Qualification: AEC-Q100
Description: IC GATE XOR
Packaging: Bulk
Part Status: Active
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Grade: Automotive
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
Qualification: AEC-Q100
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| LX2160XE72029B |
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Виробник: NXP USA Inc.
Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Part Status: Active
Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 52111.84 грн |


























