Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36384) > Сторінка 474 з 607
| Фото | Назва | Виробник | Інформація |
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MC33596FJER2 | NXP USA Inc. |
Description: UHF RECEIVERPart Status: Not For New Designs Supplier Device Package: 32-LQFP (5x5) Antenna Connector: PCB, Surface Mount Data Rate (Max): 22.4kBaud Current - Receiving: 10.3mA Applications: General Data Transfer Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Data Interface: PCB, Surface Mount Modulation or Protocol: FSK, OOK Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz Mounting Type: Surface Mount Sensitivity: -104dBm Package / Case: 32-LQFP Packaging: Tape & Reel (TR) |
на замовлення 30000 шт: термін постачання 21-31 дні (днів) |
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| P5CD012X0/T0B38170 | NXP USA Inc. |
Description: P5CD012X0/T0B38170 Packaging: Bulk Speed: 30MHz Program Memory Size: 200KB (200K x 8) RAM Size: 6K x 8 Operating Temperature: -25°C ~ 85°C Program Memory Type: ROM EEPROM Size: 12K x 8 Core Processor: Secure MX51 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.5V Connectivity: ISO 7816, ISO 14443, UART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MC908JL3ECPE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 28DIPPackaging: Tube Package / Case: 28-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 12x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V Peripherals: LED, LVD, POR, PWM Supplier Device Package: 28-PDIP Part Status: Obsolete Number of I/O: 23 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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FRDM-STBA-A8964 | NXP USA Inc. |
Description: DEV BOARD FXLS8964AF ACCELPackaging: Bulk Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g Interface: I2C, Serial, SPI Voltage - Supply: 1.71V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: FXLS8964AF, K22 Supplied Contents: Board(s), Cable(s) Embedded: No Sensing Range: ±2g, 4g, 8g, 16g Part Status: Active Contents: Board(s), Cable(s) |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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| LS1024ASN7MLA | NXP USA Inc. |
Description: LS1024 - QORIQ LAYERSCAPE 32-BITPart Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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BUK962R1-40E,118 | NXP USA Inc. |
Description: MOSFET N-CH 40V 120A D2PAKInput Capacitance (Ciss) (Max) @ Vds: 13160 pF @ 25 V Gate Charge (Qg) (Max) @ Vgs: 87.8 nC @ 5 V Drain to Source Voltage (Vdss): 40 V Vgs (Max): ±10V Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Part Status: Obsolete Supplier Device Package: D2PAK Vgs(th) (Max) @ Id: 2.1V @ 1mA Power Dissipation (Max): 293W (Tc) Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V Current - Continuous Drain (Id) @ 25°C: 120A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Packaging: Bulk |
на замовлення 3369 шт: термін постачання 21-31 дні (днів) |
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T1024NSE7MQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.2GHZ 780FBGAPackaging: Bulk Package / Case: 780-FBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FBGA (23x23) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
на замовлення 1363 шт: термін постачання 21-31 дні (днів) |
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MMA8452QR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C 16QFNPackaging: Tape & Reel (TR) Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode Package / Case: 16-VFQFN Output Type: I2C Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.95V ~ 3.6V Bandwidth: 0.78Hz ~ 400Hz Supplier Device Package: 16-QFN (3x3) Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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FXLS8964AFR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-16G 10DFNPart Status: Active Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g) Supplier Device Package: 10-DFN (2x2) Bandwidth: 1.6kHz Voltage - Supply: 1.71V ~ 3.6V Operating Temperature: -40°C ~ 105°C Acceleration Range: ±2g, 4g, 8g, 16g Axis: X, Y, Z Type: Digital Mounting Type: Surface Mount Output Type: I²C, SPI Package / Case: 10-VFDFN Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| FRDM-KW019032,598 | NXP USA Inc. |
Description: FREEDOM BOARD FOR KW SERIES Part Status: Active Supplied Contents: Board(s), Cable(s) Type: Transceiver; 802.15.4 For Use With/Related Products: KW0x Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MCF54455VP266 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360BGAPackaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 32K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-BGA (23x23) Part Status: Active Number of I/O: 132 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| KCF52211CAE80 | NXP USA Inc. |
Description: IC MCU Packaging: Bulk Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MK11DX256AVMC5 | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 121MAPBGADigiKey Programmable: Not Verified Number of I/O: 64 Part Status: Active Supplier Device Package: 121-MAPBGA (8x8) Peripherals: DMA, I²S, LVD, POR, PWM, WDT Connectivity: I²C, IrDA, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 24x16b; D/A 1x12b Core Processor: ARM® Cortex®-M4 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 121-LFBGA Packaging: Tray |
на замовлення 348 шт: термін постачання 21-31 дні (днів) |
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MK50DX256ZCLL10 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 34x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Not For New Designs Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LPC54605J256ET100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100TFBGAMounting Type: Surface Mount Package / Case: 100-TFBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 64 Part Status: Active Supplier Device Package: 100-TFBGA (9x9) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: I2C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M4 EEPROM Size: 16K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 136K x 8 Program Memory Size: 256KB (256K x 8) Speed: 180MHz |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PCA9539D,118 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C SMBUS 24SOPackaging: Bulk Features: POR Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I²C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-SO Current - Output Source/Sink: 10mA, 25mA Part Status: Obsolete DigiKey Programmable: Not Verified |
на замовлення 18136 шт: термін постачання 21-31 дні (днів) |
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PCA9539D,112 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C SMBUS 24SOPackaging: Bulk Features: POR Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I²C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-SO Current - Output Source/Sink: 10mA, 25mA Part Status: Obsolete DigiKey Programmable: Not Verified |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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74AUP1G885GD125 | NXP USA Inc. |
Description: XOR GATENumber of Circuits: 1 Part Status: Active Supplier Device Package: 8-XSON (2x3) Schmitt Trigger Input: No Number of Inputs: 3 Current - Output High, Low: 4mA, 4mA Voltage - Supply: 0.8V ~ 3.6V Operating Temperature: -40°C ~ 125°C Logic Type: Configurable Multiple Function Mounting Type: Surface Mount Output Type: Single-Ended Package / Case: 8-XFDFN Packaging: Bulk |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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| T2080NXN8P1B | NXP USA Inc. |
Description: IC MPU QORIQ 1.533GHZ 896FCPBGAPackaging: Bulk Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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| T2080NXN8P1B | NXP USA Inc. |
Description: IC MPU QORIQ 1.533GHZ 896FCPBGAPackaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| T2080NXN8TTB | NXP USA Inc. |
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGAUSB: USB 2.0 + PHY (2) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) Supplier Device Package: 896-FCPBGA (25x25) Core Processor: PowerPC e6500 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.8GHz Mounting Type: Surface Mount Package / Case: 896-BFBGA, FCBGA Packaging: Tray Part Status: Active SATA: SATA 3Gbps (2) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage RAM Controllers: DDR3, DDR3L Number of Cores/Bus Width: 4 Core, 64-Bit |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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1PS70SB16,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 30V 200MA SOT323 Part Status: Active Packaging: Bulk |
на замовлення 320700 шт: термін постачання 21-31 дні (днів) |
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1PS70SB46,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 120MA SOT323Part Status: Active Packaging: Bulk |
на замовлення 418659 шт: термін постачання 21-31 дні (днів) |
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1PS70SB45,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 120MA SOT323Part Status: Active Packaging: Bulk |
на замовлення 366000 шт: термін постачання 21-31 дні (днів) |
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MPC5566MZP132 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 416PBGAVoltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Core Size: 32-Bit Data Converters: A/D 40x12b Core Processor: e200z6 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 128K x 8 Program Memory Size: 3MB (3M x 8) Speed: 132MHz Mounting Type: Surface Mount Package / Case: 416-BBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 256 Part Status: Active Supplier Device Package: 416-PBGA (27x27) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI |
на замовлення 184 шт: термін постачання 21-31 дні (днів) |
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QN9022/DY | NXP USA Inc. |
Description: IC RF TXRX BLUETOOTH 40VFQFNPackaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 128kB Flash Type: TxRx Only Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Power - Output: 4dBm Protocol: Bluetooth v4.0 Current - Receiving: 9.2mA Current - Transmitting: 8.8mA Supplier Device Package: 40-HVQFN (5x5) GPIO: 31 RF Family/Standard: Bluetooth Serial Interfaces: I²C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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QN9022/DY | NXP USA Inc. |
Description: IC RF TXRX BLUETOOTH 40VFQFNPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 128kB Flash Type: TxRx Only Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Power - Output: 4dBm Protocol: Bluetooth v4.0 Current - Receiving: 9.2mA Current - Transmitting: 8.8mA Supplier Device Package: 40-HVQFN (5x5) GPIO: 31 RF Family/Standard: Bluetooth Serial Interfaces: I²C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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IP4364CX8/LF/P,135 | NXP USA Inc. |
Description: IC FILTER/ESD PROT 3CH WLCSP8Part Status: Active Packaging: Bulk |
на замовлення 28422 шт: термін постачання 21-31 дні (днів) |
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| LPC54S016JBD100 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100LQFP Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 180MHz RAM Size: 360K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 2899 шт: термін постачання 21-31 дні (днів) |
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74LVC1G58GW/S901125 | NXP USA Inc. |
Description: 74LVC1G58GW - LOGIC CIRCUITPart Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PCA9550D,112 | NXP USA Inc. |
Description: IC LED DRVR LINEAR I2C 25MA 8SOPackaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Outputs: 2 Frequency: 400kHz Type: Linear Operating Temperature: -40°C ~ 85°C (TA) Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 8-SO Dimming: I²C Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Part Status: Obsolete |
на замовлення 3925 шт: термін постачання 21-31 дні (днів) |
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MPC8314VRAGDA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGAAdditional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM Part Status: Active Graphics Acceleration: No RAM Controllers: DDR, DDR2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 620-HBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: 0°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Packaging: Tray |
на замовлення 113 шт: термін постачання 21-31 дні (днів) |
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MK22FX512VMD12 | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 144MAPBGAConnectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 42x16b; D/A 2x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 64K x 8 Program Memory Size: 512KB (512K x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 144-LBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 100 Part Status: Not For New Designs Supplier Device Package: 144-MAPBGA (13x13) Peripherals: DMA, I2S, LVD, POR, PWM, WDT |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TEF6640HW/V101518 | NXP USA Inc. |
Description: IC ONE-CHIP RADIO 64HTQFP Packaging: Bulk Part Status: Active |
на замовлення 161850 шт: термін постачання 21-31 дні (днів) |
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| SAF4000EL/101S23EK | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MC33FS5502Y0ES | NXP USA Inc. |
Description: HIGH VOLTAGE PMIC QFN56 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Power Supplies Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
на замовлення 512 шт: термін постачання 21-31 дні (днів) |
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74ALVCH16374DGG11 | NXP USA Inc. |
Description: BUS DRIVER, ALVC/VCX/A SERIESNumber of Bits per Element: 8 Part Status: Active Max Propagation Delay @ V, Max CL: 3.4ns @ 3.3V, 50pF Supplier Device Package: 48-TSSOP Input Capacitance: 5 pF Clock Frequency: 350 MHz Trigger Type: Positive Edge Current - Output High, Low: 24mA, 24mA Current - Quiescent (Iq): 40 µA Voltage - Supply: 1.2V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Type: D-Type Function: Standard Number of Elements: 2 Mounting Type: Surface Mount Output Type: Tri-State, Non-Inverted Package / Case: 48-TFSOP (0.240", 6.10mm Width) Packaging: Bulk |
на замовлення 897 шт: термін постачання 21-31 дні (днів) |
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| P5CD016UE/T1AL828V | NXP USA Inc. |
Description: P5CD016UE/T1AL828V Packaging: Bulk Speed: 30MHz Program Memory Size: 264KB (264K x 8) RAM Size: 7.5K x 8 Operating Temperature: -25°C ~ 85°C Program Memory Type: ROM EEPROM Size: 16K x 8 Core Processor: Secure MX51 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.6V Connectivity: ISO 7816, ISO 14443, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MK51DN512CLQ10 | NXP USA Inc. |
Description: KINETIS K51: 100MHZ CORTEX-M4 MEPackaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 41x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 94 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74AUP1G175GN,132 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 1BIT 6XSONPackaging: Bulk Package / Case: 6-XFDFN Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Current - Quiescent (Iq): 500 nA Current - Output High, Low: 4mA, 4mA Trigger Type: Positive Edge Clock Frequency: 300 MHz Input Capacitance: 0.8 pF Supplier Device Package: 6-XSON (0.9x1) Max Propagation Delay @ V, Max CL: 5.7ns @ 3.3V, 30pF Part Status: Active Number of Bits per Element: 1 |
на замовлення 19000 шт: термін постачання 21-31 дні (днів) |
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S912XHY256F0MLM | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP Packaging: Bulk Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 8K x 8 Core Processor: HCS12X Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 88 DigiKey Programmable: Not Verified |
на замовлення 212 шт: термін постачання 21-31 дні (днів) |
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S912XHY256F0CLM | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFPPackaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 8K x 8 Core Processor: HCS12X Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 88 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MK51DN256ZCMD10 | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 144MAPBGARAM Size: 64K x 8 Program Memory Size: 256KB (256K x 8) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 144-LBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 94 Part Status: Not For New Designs Supplier Device Package: 144-MAPBGA (13x13) Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 41x16b; D/A 2x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TJA1042BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.5 ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 120 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TJA1042BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.5 ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 120 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
на замовлення 791 шт: термін постачання 21-31 дні (днів) |
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TJA1042CT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.5 ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 120 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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TJA1042CT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.5 ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 120 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
на замовлення 4075 шт: термін постачання 21-31 дні (днів) |
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FS32K116BRT0MLFT | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 17K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 13x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 43 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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BA891,115 | NXP USA Inc. |
Description: DIODE STANDARD 35V 715MW SOD523Packaging: Tape & Reel (TR) Package / Case: SC-79, SOD-523 Diode Type: Standard - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz Resistance @ If, F: 500mOhm @ 10mA, 100MHz Voltage - Peak Reverse (Max): 35V Supplier Device Package: SOD-523 Part Status: Active Current - Max: 100 mA Power Dissipation (Max): 715 mW |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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BA891,115 | NXP USA Inc. |
Description: DIODE STANDARD 35V 715MW SOD523Packaging: Cut Tape (CT) Package / Case: SC-79, SOD-523 Diode Type: Standard - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz Resistance @ If, F: 500mOhm @ 10mA, 100MHz Voltage - Peak Reverse (Max): 35V Supplier Device Package: SOD-523 Part Status: Active Current - Max: 100 mA Power Dissipation (Max): 715 mW |
на замовлення 1475 шт: термін постачання 21-31 дні (днів) |
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MPC8343CZQADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGAPackaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI Part Status: Obsolete |
на замовлення 105 шт: термін постачання 21-31 дні (днів) |
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MPC8343CZQADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGAPackaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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S912XEP768W1CAG | NXP USA Inc. |
Description: IC MCU 16BIT 768KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 768KB (768K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 119 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LS2088AXN7TTB | NXP USA Inc. |
Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA Packaging: Tray Package / Case: 1292-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 1292-FCPBGA (37.5x37.5) Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 8 Core, 64-Bit RAM Controllers: DDR4 SATA: SATA 6Gbps (2) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MMA25312BT1 | NXP USA Inc. |
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN Packaging: Tape & Reel (TR) Package / Case: 12-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.7GHz RF Type: WiMax, WLAN Voltage - Supply: 3V ~ 5V Gain: 26dB Current - Supply: 124mA Noise Figure: 3.8dB P1dB: 31dBm Test Frequency: 2.5GHz Supplier Device Package: 12-QFN (3x3) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MMA25312BT1 | NXP USA Inc. |
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN Packaging: Cut Tape (CT) Package / Case: 12-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.7GHz RF Type: WiMax, WLAN Voltage - Supply: 3V ~ 5V Gain: 26dB Current - Supply: 124mA Noise Figure: 3.8dB P1dB: 31dBm Test Frequency: 2.5GHz Supplier Device Package: 12-QFN (3x3) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC56F83783AVLHA | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 20x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, I2C, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 68 DigiKey Programmable: Not Verified |
на замовлення 160 шт: термін постачання 21-31 дні (днів) |
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| MC56F83783AMLHA | NXP USA Inc. |
Description: 32-BIT DSC, 56800EX CORE, 256KB Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 20x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| FXLS93733AESR2 | NXP USA Inc. |
Description: PSI5 YZ DUAL-AXIS HIGH-G INERTIPackaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| FS32K116LIT0MFMT | NXP USA Inc. |
Description: IC MCU 32BIT 128MB FLASH 32VFQFNPeripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Number of I/O: 43 Part Status: Active Supplier Device Package: 32-HVQFN (5x5) Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 13x12b SAR; D/A 1x8b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 17K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Tray EEPROM Size: 2K x 8 |
товару немає в наявності |
В кошику од. на суму грн. |
| MC33596FJER2 |
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Виробник: NXP USA Inc.
Description: UHF RECEIVER
Part Status: Not For New Designs
Supplier Device Package: 32-LQFP (5x5)
Antenna Connector: PCB, Surface Mount
Data Rate (Max): 22.4kBaud
Current - Receiving: 10.3mA
Applications: General Data Transfer
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Data Interface: PCB, Surface Mount
Modulation or Protocol: FSK, OOK
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Mounting Type: Surface Mount
Sensitivity: -104dBm
Package / Case: 32-LQFP
Packaging: Tape & Reel (TR)
Description: UHF RECEIVER
Part Status: Not For New Designs
Supplier Device Package: 32-LQFP (5x5)
Antenna Connector: PCB, Surface Mount
Data Rate (Max): 22.4kBaud
Current - Receiving: 10.3mA
Applications: General Data Transfer
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Data Interface: PCB, Surface Mount
Modulation or Protocol: FSK, OOK
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Mounting Type: Surface Mount
Sensitivity: -104dBm
Package / Case: 32-LQFP
Packaging: Tape & Reel (TR)
на замовлення 30000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 145+ | 274.53 грн |
| P5CD012X0/T0B38170 |
Виробник: NXP USA Inc.
Description: P5CD012X0/T0B38170
Packaging: Bulk
Speed: 30MHz
Program Memory Size: 200KB (200K x 8)
RAM Size: 6K x 8
Operating Temperature: -25°C ~ 85°C
Program Memory Type: ROM
EEPROM Size: 12K x 8
Core Processor: Secure MX51
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.5V
Connectivity: ISO 7816, ISO 14443, UART
Part Status: Obsolete
Description: P5CD012X0/T0B38170
Packaging: Bulk
Speed: 30MHz
Program Memory Size: 200KB (200K x 8)
RAM Size: 6K x 8
Operating Temperature: -25°C ~ 85°C
Program Memory Type: ROM
EEPROM Size: 12K x 8
Core Processor: Secure MX51
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.5V
Connectivity: ISO 7816, ISO 14443, UART
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| MC908JL3ECPE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-PDIP
Part Status: Obsolete
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-PDIP
Part Status: Obsolete
Number of I/O: 23
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| FRDM-STBA-A8964 |
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Виробник: NXP USA Inc.
Description: DEV BOARD FXLS8964AF ACCEL
Packaging: Bulk
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8964AF, K22
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
Part Status: Active
Contents: Board(s), Cable(s)
Description: DEV BOARD FXLS8964AF ACCEL
Packaging: Bulk
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8964AF, K22
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
Part Status: Active
Contents: Board(s), Cable(s)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 6589.59 грн |
| LS1024ASN7MLA |
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Виробник: NXP USA Inc.
Description: LS1024 - QORIQ LAYERSCAPE 32-BIT
Part Status: Active
Packaging: Bulk
Description: LS1024 - QORIQ LAYERSCAPE 32-BIT
Part Status: Active
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| BUK962R1-40E,118 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 40V 120A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 13160 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 87.8 nC @ 5 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±10V
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Part Status: Obsolete
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Power Dissipation (Max): 293W (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Bulk
Description: MOSFET N-CH 40V 120A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 13160 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 87.8 nC @ 5 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±10V
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Part Status: Obsolete
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Power Dissipation (Max): 293W (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Bulk
на замовлення 3369 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 303+ | 74.29 грн |
| T1024NSE7MQA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
на замовлення 1363 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 8611.81 грн |
| MMA8452QR1 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C 16QFN
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g)
Part Status: Obsolete
Description: ACCELEROMETER 2-8G I2C 16QFN
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g)
Part Status: Obsolete
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| FXLS8964AFR1 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Part Status: Active
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Supplier Device Package: 10-DFN (2x2)
Bandwidth: 1.6kHz
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±2g, 4g, 8g, 16g
Axis: X, Y, Z
Type: Digital
Mounting Type: Surface Mount
Output Type: I²C, SPI
Package / Case: 10-VFDFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Description: ACCELEROMETER 2-16G 10DFN
Part Status: Active
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Supplier Device Package: 10-DFN (2x2)
Bandwidth: 1.6kHz
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±2g, 4g, 8g, 16g
Axis: X, Y, Z
Type: Digital
Mounting Type: Surface Mount
Output Type: I²C, SPI
Package / Case: 10-VFDFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
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| FRDM-KW019032,598 |
Виробник: NXP USA Inc.
Description: FREEDOM BOARD FOR KW SERIES
Part Status: Active
Supplied Contents: Board(s), Cable(s)
Type: Transceiver; 802.15.4
For Use With/Related Products: KW0x
Packaging: Bulk
Description: FREEDOM BOARD FOR KW SERIES
Part Status: Active
Supplied Contents: Board(s), Cable(s)
Type: Transceiver; 802.15.4
For Use With/Related Products: KW0x
Packaging: Bulk
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| MCF54455VP266 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
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| MK11DX256AVMC5 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: I²C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
Description: IC MCU 32B 256KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: I²C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
на замовлення 348 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1077.56 грн |
| 10+ | 815.04 грн |
| 80+ | 674.75 грн |
| MK50DX256ZCLL10 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
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од. на суму грн.
| LPC54605J256ET100E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 180MHz
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 180MHz
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| PCA9539D,118 |
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Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 24SO
Packaging: Bulk
Features: POR
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C SMBUS 24SO
Packaging: Bulk
Features: POR
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 18136 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 575+ | 68.83 грн |
| PCA9539D,112 |
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Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 24SO
Packaging: Bulk
Features: POR
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C SMBUS 24SO
Packaging: Bulk
Features: POR
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 575+ | 68.83 грн |
| 74AUP1G885GD125 |
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Виробник: NXP USA Inc.
Description: XOR GATE
Number of Circuits: 1
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Schmitt Trigger Input: No
Number of Inputs: 3
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Configurable Multiple Function
Mounting Type: Surface Mount
Output Type: Single-Ended
Package / Case: 8-XFDFN
Packaging: Bulk
Description: XOR GATE
Number of Circuits: 1
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Schmitt Trigger Input: No
Number of Inputs: 3
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Configurable Multiple Function
Mounting Type: Surface Mount
Output Type: Single-Ended
Package / Case: 8-XFDFN
Packaging: Bulk
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1567+ | 13.84 грн |
| T2080NXN8P1B |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Bulk
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Bulk
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 27696.24 грн |
| T2080NXN8P1B |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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| T2080NXN8TTB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
Supplier Device Package: 896-FCPBGA (25x25)
Core Processor: PowerPC e6500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 896-BFBGA, FCBGA
Packaging: Tray
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 4 Core, 64-Bit
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
Supplier Device Package: 896-FCPBGA (25x25)
Core Processor: PowerPC e6500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 896-BFBGA, FCBGA
Packaging: Tray
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 4 Core, 64-Bit
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В кошику
од. на суму грн.
| 1PS70SB16,115 |
Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 30V 200MA SOT323
Part Status: Active
Packaging: Bulk
Description: DIODE SCHOTTKY 30V 200MA SOT323
Part Status: Active
Packaging: Bulk
на замовлення 320700 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 9982+ | 2.26 грн |
| 1PS70SB46,115 |
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Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 40V 120MA SOT323
Part Status: Active
Packaging: Bulk
Description: DIODE SCHOTTKY 40V 120MA SOT323
Part Status: Active
Packaging: Bulk
на замовлення 418659 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10051+ | 2.37 грн |
| 1PS70SB45,115 |
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Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 40V 120MA SOT323
Part Status: Active
Packaging: Bulk
Description: DIODE SCHOTTKY 40V 120MA SOT323
Part Status: Active
Packaging: Bulk
на замовлення 366000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 9982+ | 2.26 грн |
| MPC5566MZP132 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 256
Part Status: Active
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 256
Part Status: Active
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
на замовлення 184 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 7086.45 грн |
| 10+ | 5720.66 грн |
| 25+ | 5445.05 грн |
| QN9022/DY |
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Виробник: NXP USA Inc.
Description: IC RF TXRX BLUETOOTH 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 40-HVQFN (5x5)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX BLUETOOTH 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 40-HVQFN (5x5)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3000+ | 201.32 грн |
| QN9022/DY |
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Виробник: NXP USA Inc.
Description: IC RF TXRX BLUETOOTH 40VFQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 40-HVQFN (5x5)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX BLUETOOTH 40VFQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 40-HVQFN (5x5)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| IP4364CX8/LF/P,135 |
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на замовлення 28422 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2959+ | 7.53 грн |
| LPC54S016JBD100 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 2899 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 82+ | 485.77 грн |
| PCA9550D,112 |
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Виробник: NXP USA Inc.
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I²C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I²C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
на замовлення 3925 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 357+ | 66.46 грн |
| MPC8314VRAGDA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Part Status: Active
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Part Status: Active
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
на замовлення 113 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4301.55 грн |
| 10+ | 3423.34 грн |
| 36+ | 3184.34 грн |
| 108+ | 2850.89 грн |
| MK22FX512VMD12 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 42x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Not For New Designs
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 42x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Not For New Designs
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
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од. на суму грн.
| TEF6640HW/V101518 |
на замовлення 161850 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 39+ | 588.32 грн |
| MC33FS5502Y0ES |
Виробник: NXP USA Inc.
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
на замовлення 512 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 449.38 грн |
| 10+ | 332.02 грн |
| 25+ | 306.76 грн |
| 80+ | 265.36 грн |
| 260+ | 248.92 грн |
| 74ALVCH16374DGG11 |
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Виробник: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 3.4ns @ 3.3V, 50pF
Supplier Device Package: 48-TSSOP
Input Capacitance: 5 pF
Clock Frequency: 350 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Current - Quiescent (Iq): 40 µA
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Bulk
Description: BUS DRIVER, ALVC/VCX/A SERIES
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 3.4ns @ 3.3V, 50pF
Supplier Device Package: 48-TSSOP
Input Capacitance: 5 pF
Clock Frequency: 350 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Current - Quiescent (Iq): 40 µA
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Bulk
на замовлення 897 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 602+ | 39.56 грн |
| P5CD016UE/T1AL828V |
Виробник: NXP USA Inc.
Description: P5CD016UE/T1AL828V
Packaging: Bulk
Speed: 30MHz
Program Memory Size: 264KB (264K x 8)
RAM Size: 7.5K x 8
Operating Temperature: -25°C ~ 85°C
Program Memory Type: ROM
EEPROM Size: 16K x 8
Core Processor: Secure MX51
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.6V
Connectivity: ISO 7816, ISO 14443, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: P5CD016UE/T1AL828V
Packaging: Bulk
Speed: 30MHz
Program Memory Size: 264KB (264K x 8)
RAM Size: 7.5K x 8
Operating Temperature: -25°C ~ 85°C
Program Memory Type: ROM
EEPROM Size: 16K x 8
Core Processor: Secure MX51
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.6V
Connectivity: ISO 7816, ISO 14443, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| MK51DN512CLQ10 |
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Виробник: NXP USA Inc.
Description: KINETIS K51: 100MHZ CORTEX-M4 ME
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 94
DigiKey Programmable: Not Verified
Description: KINETIS K51: 100MHZ CORTEX-M4 ME
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 94
DigiKey Programmable: Not Verified
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од. на суму грн.
| 74AUP1G175GN,132 |
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Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON (0.9x1)
Max Propagation Delay @ V, Max CL: 5.7ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON (0.9x1)
Max Propagation Delay @ V, Max CL: 5.7ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
на замовлення 19000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1362+ | 16.18 грн |
| S912XHY256F0MLM |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 88
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 88
DigiKey Programmable: Not Verified
на замовлення 212 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 33+ | 686.11 грн |
| S912XHY256F0CLM |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 88
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 88
DigiKey Programmable: Not Verified
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| MK51DN256ZCMD10 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Not For New Designs
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 41x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Description: IC MCU 32B 256KB FLASH 144MAPBGA
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Not For New Designs
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 41x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
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| TJA1042BT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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| TJA1042BT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
на замовлення 791 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 56.17 грн |
| 10+ | 38.32 грн |
| 25+ | 34.50 грн |
| 100+ | 28.41 грн |
| 250+ | 26.51 грн |
| 500+ | 25.37 грн |
| TJA1042CT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 26.44 грн |
| TJA1042CT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
на замовлення 4075 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 56.17 грн |
| 10+ | 38.32 грн |
| 25+ | 34.50 грн |
| 100+ | 28.41 грн |
| 250+ | 26.51 грн |
| 500+ | 25.37 грн |
| 1000+ | 24.03 грн |
| FS32K116BRT0MLFT |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
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| BA891,115 |
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Виробник: NXP USA Inc.
Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
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| BA891,115 |
![]() |
Виробник: NXP USA Inc.
Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
на замовлення 1475 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 37+ | 8.70 грн |
| 55+ | 5.64 грн |
| 62+ | 4.97 грн |
| 100+ | 3.93 грн |
| 250+ | 3.58 грн |
| 500+ | 3.37 грн |
| 1000+ | 3.15 грн |
| MPC8343CZQADDB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
на замовлення 105 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 7+ | 3693.60 грн |
| MPC8343CZQADDB |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
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| S912XEP768W1CAG |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
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| LS2088AXN7TTB |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Part Status: Active
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| MMA25312BT1 |
Виробник: NXP USA Inc.
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
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| MMA25312BT1 |
Виробник: NXP USA Inc.
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
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| MC56F83783AVLHA |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
на замовлення 160 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1291.97 грн |
| 10+ | 994.30 грн |
| 160+ | 839.75 грн |
| MC56F83783AMLHA |
Виробник: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 256KB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
Description: 32-BIT DSC, 56800EX CORE, 256KB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
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| FXLS93733AESR2 |
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Виробник: NXP USA Inc.
Description: PSI5 YZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Description: PSI5 YZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
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| FS32K116LIT0MFMT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128MB FLASH 32VFQFN
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Number of I/O: 43
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
EEPROM Size: 2K x 8
Description: IC MCU 32BIT 128MB FLASH 32VFQFN
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Number of I/O: 43
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
EEPROM Size: 2K x 8
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