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SPC5748GSK0AMMJ6 SPC5748GSK0AMMJ6 NXP USA Inc. Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Package / Case: 256-LBGA
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Packaging: Tray
DigiKey Programmable: Not Verified
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
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74HC373DB112 74HC373DB112 NXP USA Inc. 74HC_HCT373.pdf Description: NOW NEXPERIA 74HC373DB - BUS DRI
Current - Output High, Low: 7.8mA, 7.8mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type Transparent Latch
Circuit: 1:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Part Status: Active
Supplier Device Package: 20-SSOP
Delay Time - Propagation: 12ns
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MC812A4CPVE8 MC812A4CPVE8 NXP USA Inc. MC68HC812A4.pdf Description: IC MCU 16BIT 4KB EEPROM 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: EEPROM
Core Processor: CPU12
Data Converters: A/D 8x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
1+3294.40 грн
10+2598.86 грн
25+2455.63 грн
100+2156.86 грн
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LPC1768FBD100Y LPC1768FBD100Y NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
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MRF300ANBN-150M NXP USA Inc. MRF300AN.pdf Description: MRF300ANBN-150M
Packaging: Bulk
Contents: Board(s)
Supplied Contents: Board(s)
Part Status: Active
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MC35FS6510NAER2 MC35FS6510NAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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JN5188HN/001Z JN5188HN/001Z NXP USA Inc. JN5189.pdf Description: WIRELESS MICROCONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Zigbee®
Current - Receiving: 4.3mA
Current - Transmitting: 7.36mA ~ 20.28mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+272.32 грн
Мінімальне замовлення: 1000
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JN5188HN/001Z JN5188HN/001Z NXP USA Inc. JN5189.pdf Description: WIRELESS MICROCONTROLLER
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Zigbee®
Current - Receiving: 4.3mA
Current - Transmitting: 7.36mA ~ 20.28mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1+484.19 грн
10+427.40 грн
25+388.49 грн
100+328.12 грн
250+300.78 грн
500+273.44 грн
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T4161NXN7PQB NXP USA Inc. T4240T4160FS.pdf Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Part Status: Active
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TJA1042TK/3/2Z TJA1042TK/3/2Z NXP USA Inc. TJA1042.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
6000+54.52 грн
Мінімальне замовлення: 6000
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PMST5550,135 PMST5550,135 NXP USA Inc. PMST5550_5551.pdf Description: NOW NEXPERIA PMST5550 - SMALL SI
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 5V
Frequency - Transition: 300MHz
Supplier Device Package: SOT-323
Part Status: Active
Current - Collector (Ic) (Max): 300 mA
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 200 mW
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MC33PF8201A0ESR2 MC33PF8201A0ESR2 NXP USA Inc. PF8101_PF8201.pdf Description: POWER MANAGEMENT IC I.MX8 NON-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
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MC9S12GC128MFUE MC9S12GC128MFUE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
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MK60DN256VMD10 MK60DN256VMD10 NXP USA Inc. K60P144M100SF2V2.pdf Description: IC MCU 32B 256KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
на замовлення 1565 шт:
термін постачання 21-31 дні (днів)
1+1072.82 грн
10+816.87 грн
25+762.84 грн
160+645.70 грн
320+627.55 грн
640+612.61 грн
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MPC8360ECVVAGDGA MPC8360ECVVAGDGA NXP USA Inc. MPC8360E%2C8358E.pdf Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Part Status: Obsolete
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BUK9Y29-40E/CX NXP USA Inc. Description: TRANS N-CH LFPAK
Packaging: Tape & Reel (TR)
Part Status: Obsolete
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MF1P2201DUD/00Z NXP USA Inc. MF1P(H)x2_SDS.pdf Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Part Status: Active
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MF1P2231DUD/00Z NXP USA Inc. MF1P(H)x2_SDS.pdf Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Part Status: Active
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MF1PH2201DUD/00Z NXP USA Inc. MF1P(H)x2.pdf Description: MIFARE PLUS EV2
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Part Status: Active
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MF1P2200DA8/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFARE PLUS EV1
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Part Status: Active
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MF1PH2200DA8/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
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MF1P4230DA8/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFARE PLUS EV2
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Part Status: Active
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
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MF1P2200DA4/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFARE PLUS EV1
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
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MF1PH2231DUD/00Z NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: Wafer
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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MF1PH2200DA4/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
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MF1PH4201DUD/00Z NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: Wafer
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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MF1PH2230DA8/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
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MF1PH2230DA4/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Part Status: Active
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MF1P4200DA8/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFARE PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Part Status: Active
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MC9S08MM128VLH MC9S08MM128VLH NXP USA Inc. MC9S08MM128.pdf Description: IC MCU 8BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x16b; D/A 1x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 33
DigiKey Programmable: Not Verified
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SPC5603BF2VLQ4 SPC5603BF2VLQ4 NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 123
DigiKey Programmable: Not Verified
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SAF7758HV/N205ZY NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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TEA2017AAT/1Y TEA2017AAT/1Y NXP USA Inc. TEA2017AAT_2.pdf Description: DCM/QR/CCM & MULTI MODE PFC + RE
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
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TEA2016AAT/1/S30Y TEA2016AAT/1/S30Y NXP USA Inc. TEA2016AAT.pdf Description: DCM/QR PFC + RESONANT POWER SUPP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 4.8 mA
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TEA2017ABT/2Y TEA2017ABT/2Y NXP USA Inc. TEA2017ABT_2.pdf Description: PFC + RESONANT POWER SUPPLY CONT
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 8 mA
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TEA2016AAT/2Y TEA2016AAT/2Y NXP USA Inc. TEA2016AAT_2.pdf Description: DCM/QR PFC + RESONANT POWER SUPP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 4.8 mA
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TEA2095T/1J TEA2095T/1J NXP USA Inc. TEA2095T.pdf Description: DUAL SYNCHRONOUS RECTIFICATION C
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.75V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: 8-SO
Current - Supply: 90 µA
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TEA2017ABT/1Y TEA2017ABT/1Y NXP USA Inc. TEA2017AAT_2.pdf Description: PFC + RESONANT POWER SUPPLY CONT
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 8 mA
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TEA2017AAT/3Y TEA2017AAT/3Y NXP USA Inc. TEA2017AAT_3.pdf Description: DCM/QR/CCM & MULTI MODE PFC + RE
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+133.21 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
TJA1103EVB TJA1103EVB NXP USA Inc. getting-started-with-the-tja1103evb-evaluation-board:GS-TJA1103EVB Description: EVAL BOARD FOR TJA1103
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1103
Supplied Contents: Board(s)
Primary Attributes: 100BASE-T1
Secondary Attributes: On-Board LEDs
Embedded: No
Part Status: Active
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SAF7758HN/N207ZK NXP USA Inc. Description: CAR DISP
Part Status: Obsolete
Supplier Device Package: 176-HLQFP (24x24)
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Bulk
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MCF5213LCVM66 MCF5213LCVM66 NXP USA Inc. MCF5213EC.pdf Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Not For New Designs
Number of I/O: 44
DigiKey Programmable: Not Verified
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MC34704AEP MC34704AEP NXP USA Inc. MC34704.pdf Description: IC POWER MANAGEMENT 56-QFN
Part Status: Active
Supplier Device Package: 56-QFN-EP (7x7)
Current - Supply: 86mA
Applications: Processor
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -20°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
на замовлення 1848 шт:
термін постачання 21-31 дні (днів)
1+555.40 грн
10+424.51 грн
В кошику  од. на суму  грн.
MIMXRT1172AVM8AR MIMXRT1172AVM8AR NXP USA Inc. IMXRT1170AEC.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
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74AUP3G34GNX 74AUP3G34GNX NXP USA Inc. 74AUP3G34.pdf Description: IC BUFFER NON-INVERT 3.6V 8-XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.2x1)
Part Status: Active
на замовлення 95000 шт:
термін постачання 21-31 дні (днів)
1139+17.53 грн
Мінімальне замовлення: 1139
В кошику  од. на суму  грн.
74AUP1G34GN,132 74AUP1G34GN,132 NXP USA Inc. PHGLS24880-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
2142+11.08 грн
Мінімальне замовлення: 2142
В кошику  од. на суму  грн.
74AUP1G34GX/S500125 74AUP1G34GX/S500125 NXP USA Inc. PHGLS24880-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
Part Status: Active
на замовлення 7381200 шт:
термін постачання 21-31 дні (днів)
4594+5.54 грн
Мінімальне замовлення: 4594
В кошику  од. на суму  грн.
SAF7770EL/202Z13AK NXP USA Inc. Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
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SAF7770EL/202Z13BY NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
Part Status: Active
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SAF7770EL/202Z13BK NXP USA Inc. Description: SAF7770EL
Packaging: Tray
Part Status: Active
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SAF7770EL/202Z130K NXP USA Inc. Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
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SAF7770EL/202Z130Y NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
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SAF7770EL/202Z13AY NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
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PMEG2015EA115 PMEG2015EA115 NXP USA Inc. PMEG2015EA.pdf Description: DIODE SCHOTTKY 20V 1.5A SOD323
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 660 mV @ 1.5 A
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 125°C
Supplier Device Package: SOD-323
Current - Average Rectified (Io): 1.5A
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
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MC56F82728VLH MC56F82728VLH NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 3K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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MKL02Z8VFG4 MKL02Z8VFG4 NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 8KB FLASH 16QFN
DigiKey Programmable: Not Verified
Packaging: Tray
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-QFN (3x3)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-UFQFN Exposed Pad
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
на замовлення 2092 шт:
термін постачання 21-31 дні (днів)
2+285.61 грн
10+181.09 грн
25+156.64 грн
80+124.81 грн
230+109.79 грн
490+101.34 грн
980+93.41 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MKL02Z32VFM4 MKL02Z32VFM4 NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
на замовлення 13477 шт:
термін постачання 21-31 дні (днів)
2+190.67 грн
10+137.82 грн
25+126.35 грн
100+106.77 грн
490+98.82 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MKL02Z16VFM4 MKL02Z16VFM4 NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
Mounting Type: Surface Mount, Wettable Flank
Number of I/O: 28
Part Status: Active
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Program Memory Size: 16KB (16K x 8)
Speed: 48MHz
на замовлення 2450 шт:
термін постачання 21-31 дні (днів)
3+110.76 грн
10+103.00 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
LD6805K/13H,115 LD6805K/13H,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 1.3V 150MA DFN1010C-4
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.3V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
на замовлення 40000 шт:
термін постачання 21-31 дні (днів)
2959+7.05 грн
Мінімальне замовлення: 2959
В кошику  од. на суму  грн.
LD6805K/30P,115 LD6805K/30P,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 3V 150MA DFN1010C-4
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 3V
на замовлення 370394 шт:
термін постачання 21-31 дні (днів)
2959+7.57 грн
Мінімальне замовлення: 2959
В кошику  од. на суму  грн.
SPC5748GSK0AMMJ6
SPC5748GSK0AMMJ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Package / Case: 256-LBGA
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Packaging: Tray
DigiKey Programmable: Not Verified
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
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74HC373DB112 74HC_HCT373.pdf
74HC373DB112
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74HC373DB - BUS DRI
Current - Output High, Low: 7.8mA, 7.8mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type Transparent Latch
Circuit: 1:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Part Status: Active
Supplier Device Package: 20-SSOP
Delay Time - Propagation: 12ns
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MC812A4CPVE8 MC68HC812A4.pdf
MC812A4CPVE8
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 4KB EEPROM 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: EEPROM
Core Processor: CPU12
Data Converters: A/D 8x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3294.40 грн
10+2598.86 грн
25+2455.63 грн
100+2156.86 грн
В кошику  од. на суму  грн.
LPC1768FBD100Y LPC1769_68_67_66_65_64_63.pdf
LPC1768FBD100Y
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
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MRF300ANBN-150M MRF300AN.pdf
Виробник: NXP USA Inc.
Description: MRF300ANBN-150M
Packaging: Bulk
Contents: Board(s)
Supplied Contents: Board(s)
Part Status: Active
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MC35FS6510NAER2 35FS4500-35FS6500SDS.pdf
MC35FS6510NAER2
Виробник: NXP USA Inc.
Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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JN5188HN/001Z JN5189.pdf
JN5188HN/001Z
Виробник: NXP USA Inc.
Description: WIRELESS MICROCONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Zigbee®
Current - Receiving: 4.3mA
Current - Transmitting: 7.36mA ~ 20.28mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+272.32 грн
Мінімальне замовлення: 1000
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JN5188HN/001Z JN5189.pdf
JN5188HN/001Z
Виробник: NXP USA Inc.
Description: WIRELESS MICROCONTROLLER
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Zigbee®
Current - Receiving: 4.3mA
Current - Transmitting: 7.36mA ~ 20.28mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+484.19 грн
10+427.40 грн
25+388.49 грн
100+328.12 грн
250+300.78 грн
500+273.44 грн
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T4161NXN7PQB T4240T4160FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Part Status: Active
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TJA1042TK/3/2Z TJA1042.pdf
TJA1042TK/3/2Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6000+54.52 грн
Мінімальне замовлення: 6000
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PMST5550,135 PMST5550_5551.pdf
PMST5550,135
Виробник: NXP USA Inc.
Description: NOW NEXPERIA PMST5550 - SMALL SI
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 5V
Frequency - Transition: 300MHz
Supplier Device Package: SOT-323
Part Status: Active
Current - Collector (Ic) (Max): 300 mA
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 200 mW
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MC33PF8201A0ESR2 PF8101_PF8201.pdf
MC33PF8201A0ESR2
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 NON-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
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MC9S12GC128MFUE MC9S12C128V1.pdf
MC9S12GC128MFUE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
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MK60DN256VMD10 K60P144M100SF2V2.pdf
MK60DN256VMD10
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
на замовлення 1565 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1072.82 грн
10+816.87 грн
25+762.84 грн
160+645.70 грн
320+627.55 грн
640+612.61 грн
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MPC8360ECVVAGDGA MPC8360E%2C8358E.pdf
MPC8360ECVVAGDGA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Part Status: Obsolete
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BUK9Y29-40E/CX
Виробник: NXP USA Inc.
Description: TRANS N-CH LFPAK
Packaging: Tape & Reel (TR)
Part Status: Obsolete
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MF1P2201DUD/00Z MF1P(H)x2_SDS.pdf
Виробник: NXP USA Inc.
Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Part Status: Active
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MF1P2231DUD/00Z MF1P(H)x2_SDS.pdf
Виробник: NXP USA Inc.
Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Part Status: Active
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MF1PH2201DUD/00Z MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFARE PLUS EV2
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Part Status: Active
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MF1P2200DA8/00J MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFARE PLUS EV1
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Part Status: Active
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MF1PH2200DA8/00J MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
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MF1P4230DA8/00J MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFARE PLUS EV2
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Part Status: Active
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
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MF1P2200DA4/00J MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFARE PLUS EV1
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
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MF1PH2231DUD/00Z MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: Wafer
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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MF1PH2200DA4/00J MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
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MF1PH4201DUD/00Z MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: Wafer
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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MF1PH2230DA8/00J MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
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MF1PH2230DA4/00J MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFAREA PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Part Status: Active
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MF1P4200DA8/00J MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFARE PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Part Status: Active
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MC9S08MM128VLH MC9S08MM128.pdf
MC9S08MM128VLH
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x16b; D/A 1x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 33
DigiKey Programmable: Not Verified
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SPC5603BF2VLQ4 MPC5602D.pdf
SPC5603BF2VLQ4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 123
DigiKey Programmable: Not Verified
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SAF7758HV/N205ZY
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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TEA2017AAT/1Y TEA2017AAT_2.pdf
TEA2017AAT/1Y
Виробник: NXP USA Inc.
Description: DCM/QR/CCM & MULTI MODE PFC + RE
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
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TEA2016AAT/1/S30Y TEA2016AAT.pdf
TEA2016AAT/1/S30Y
Виробник: NXP USA Inc.
Description: DCM/QR PFC + RESONANT POWER SUPP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 4.8 mA
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TEA2017ABT/2Y TEA2017ABT_2.pdf
TEA2017ABT/2Y
Виробник: NXP USA Inc.
Description: PFC + RESONANT POWER SUPPLY CONT
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 8 mA
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TEA2016AAT/2Y TEA2016AAT_2.pdf
TEA2016AAT/2Y
Виробник: NXP USA Inc.
Description: DCM/QR PFC + RESONANT POWER SUPP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 4.8 mA
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TEA2095T/1J TEA2095T.pdf
TEA2095T/1J
Виробник: NXP USA Inc.
Description: DUAL SYNCHRONOUS RECTIFICATION C
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.75V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: 8-SO
Current - Supply: 90 µA
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TEA2017ABT/1Y TEA2017AAT_2.pdf
TEA2017ABT/1Y
Виробник: NXP USA Inc.
Description: PFC + RESONANT POWER SUPPLY CONT
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 8 mA
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TEA2017AAT/3Y TEA2017AAT_3.pdf
TEA2017AAT/3Y
Виробник: NXP USA Inc.
Description: DCM/QR/CCM & MULTI MODE PFC + RE
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+133.21 грн
Мінімальне замовлення: 2500
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TJA1103EVB getting-started-with-the-tja1103evb-evaluation-board:GS-TJA1103EVB
TJA1103EVB
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TJA1103
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1103
Supplied Contents: Board(s)
Primary Attributes: 100BASE-T1
Secondary Attributes: On-Board LEDs
Embedded: No
Part Status: Active
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SAF7758HN/N207ZK
Виробник: NXP USA Inc.
Description: CAR DISP
Part Status: Obsolete
Supplier Device Package: 176-HLQFP (24x24)
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Bulk
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MCF5213LCVM66 MCF5213EC.pdf
MCF5213LCVM66
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Not For New Designs
Number of I/O: 44
DigiKey Programmable: Not Verified
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MC34704AEP MC34704.pdf
MC34704AEP
Виробник: NXP USA Inc.
Description: IC POWER MANAGEMENT 56-QFN
Part Status: Active
Supplier Device Package: 56-QFN-EP (7x7)
Current - Supply: 86mA
Applications: Processor
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -20°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
на замовлення 1848 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+555.40 грн
10+424.51 грн
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MIMXRT1172AVM8AR IMXRT1170AEC.pdf
MIMXRT1172AVM8AR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
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74AUP3G34GNX 74AUP3G34.pdf
74AUP3G34GNX
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 8-XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.2x1)
Part Status: Active
на замовлення 95000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1139+17.53 грн
Мінімальне замовлення: 1139
В кошику  од. на суму  грн.
74AUP1G34GN,132 PHGLS24880-1.pdf?t.download=true&u=5oefqw
74AUP1G34GN,132
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2142+11.08 грн
Мінімальне замовлення: 2142
В кошику  од. на суму  грн.
74AUP1G34GX/S500125 PHGLS24880-1.pdf?t.download=true&u=5oefqw
74AUP1G34GX/S500125
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
Part Status: Active
на замовлення 7381200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4594+5.54 грн
Мінімальне замовлення: 4594
В кошику  од. на суму  грн.
SAF7770EL/202Z13AK
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
товару немає в наявності
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SAF7770EL/202Z13BY
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Part Status: Active
товару немає в наявності
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SAF7770EL/202Z13BK
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Part Status: Active
товару немає в наявності
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SAF7770EL/202Z130K
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
товару немає в наявності
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SAF7770EL/202Z130Y
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
товару немає в наявності
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SAF7770EL/202Z13AY
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
товару немає в наявності
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PMEG2015EA115 PMEG2015EA.pdf
PMEG2015EA115
Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 20V 1.5A SOD323
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 660 mV @ 1.5 A
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 125°C
Supplier Device Package: SOD-323
Current - Average Rectified (Io): 1.5A
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
товару немає в наявності
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MC56F82728VLH MC56F827XXDS.pdf
MC56F82728VLH
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 3K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
товару немає в наявності
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MKL02Z8VFG4 KL0xPB.pdf
MKL02Z8VFG4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16QFN
DigiKey Programmable: Not Verified
Packaging: Tray
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-QFN (3x3)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-UFQFN Exposed Pad
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
на замовлення 2092 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+285.61 грн
10+181.09 грн
25+156.64 грн
80+124.81 грн
230+109.79 грн
490+101.34 грн
980+93.41 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MKL02Z32VFM4 KL0xPB.pdf
MKL02Z32VFM4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
на замовлення 13477 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+190.67 грн
10+137.82 грн
25+126.35 грн
100+106.77 грн
490+98.82 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MKL02Z16VFM4 KL0xPB.pdf
MKL02Z16VFM4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
Mounting Type: Surface Mount, Wettable Flank
Number of I/O: 28
Part Status: Active
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Program Memory Size: 16KB (16K x 8)
Speed: 48MHz
на замовлення 2450 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+110.76 грн
10+103.00 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
LD6805K/13H,115 LD6805.pdf
LD6805K/13H,115
Виробник: NXP USA Inc.
Description: IC REG LIN 1.3V 150MA DFN1010C-4
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.3V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
на замовлення 40000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2959+7.05 грн
Мінімальне замовлення: 2959
В кошику  од. на суму  грн.
LD6805K/30P,115 LD6805.pdf
LD6805K/30P,115
Виробник: NXP USA Inc.
Description: IC REG LIN 3V 150MA DFN1010C-4
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 3V
на замовлення 370394 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2959+7.57 грн
Мінімальне замовлення: 2959
В кошику  од. на суму  грн.
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