Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35296) > Сторінка 476 з 589
| Фото | Назва | Виробник | Інформація |
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SPC5668EF1AVMG | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 208MAPBGA Packaging: Tray Package / Case: 208-BGA Mounting Type: Surface Mount Speed: 116MHz Program Memory Size: 2MB (2M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z650 Data Converters: A/D 64x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-BGA (17x17) Part Status: Active Number of I/O: 155 |
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74ALVCH162244DL118 | NXP USA Inc. |
 Description: BUS DRIVER, ALVC/VCX/A SERIESPackaging: Bulk Part Status: Active |
на замовлення 1608 шт: термін постачання 21-31 дні (днів) |
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| TFF1025HN/N1F | NXP USA Inc. |
Description: IC CLOCK Packaging: Tape & Reel (TR) Part Status: Obsolete |
товару немає в наявності |
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| IP3338CX24/LF/P135 | NXP USA Inc. |
Description: DATA LINE FILTER Packaging: Bulk Part Status: Active |
на замовлення 4500 шт: термін постачання 21-31 дні (днів) |
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IP3348CX20,135 | NXP USA Inc. |
Description: FILTER LC(PI) 15NH/25PF ESD SMD Packaging: Tape & Reel (TR) Package / Case: 20-UFBGA, WLCSP Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: L = 15nH (Total), C = 25pF (Total) Height: 0.026" (0.65mm) Attenuation Value: 40dB @ 1GHz ~ 3GHz Filter Order: 3rd Applications: Data Lines for Mobile Devices Technology: LC (Pi) Center / Cutoff Frequency: 350MHz (Cutoff) Resistance - Channel (Ohms): 10 ESD Protection: Yes Part Status: Obsolete Number of Channels: 8 Current: 20 mA |
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74AVC16245DGG-Q100118 | NXP USA Inc. |
Description: BUS TRANSCEIVER, AVC SERIES Packaging: Bulk Part Status: Active |
на замовлення 600 шт: термін постачання 21-31 дні (днів) |
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MPC8271CVRTIEA | NXP USA Inc. |
Description: IC MPU MPC82XX 400MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Part Status: Active |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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S12ZVML-MINIBRD | NXP USA Inc. |
Description: LOW COST S12ZVML BLDC MC REFEREN Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Contents: Board(s) Utilized IC / Part: S12ZVM Supplied Contents: Board(s) Embedded: Yes, MCU, 16-Bit Part Status: Active |
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| FRDM-32XSF-EVB | NXP USA Inc. |
Description: FRDM EXP BD - 32V IND LIGHTING 5 Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC17XSF500 Supplied Contents: Board(s) Part Status: Active |
товару немає в наявності |
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| KIT22XS4200EKEVB | NXP USA Inc. |
Description: EVALUATION KIT - MC22XS4200 DUA Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC22XS4200 Supplied Contents: Board(s) Part Status: Active |
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MC9S08JS8CWJ | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, SPI, USB Peripherals: LVD, POR, PWM Supplier Device Package: 20-SOIC Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
на замовлення 373 шт: термін постачання 21-31 дні (днів) |
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S9S08SG8E2CTJ | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20TSSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Part Status: Active Number of I/O: 16 DigiKey Programmable: Not Verified |
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| T2080NSE8PTB557 | NXP USA Inc. |
Description: QORIQ, 64B POWER ARCH, 8X 1.5GHZ Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
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MC9S08DN16ACLC | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 25 DigiKey Programmable: Not Verified |
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MC9S08DN16MLF | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Obsolete Number of I/O: 39 DigiKey Programmable: Not Verified |
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LPC54102J256UK49019 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 49WLCSP Packaging: Bulk Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 49-WLCSP (3.29x3.29) Part Status: Active Number of I/O: 39 |
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PEMI2QFN/LT,115 | NXP USA Inc. |
Description: FILTER RC(PI) 65 OHMS ESD SMD Packaging: Bulk Package / Case: 6-XFDFN Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 65Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 23dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 65 ESD Protection: Yes Part Status: Obsolete Number of Channels: 2 |
на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
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MC9S12XHZ256CAG | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 117 |
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| SPC5746CSK1MKU6,557 | NXP USA Inc. |
Description: MPC574XP MICROCONTROLLER POWER A Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 |
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74HCT153N,652 | NXP USA Inc. |
Description: IC MULTIPLEXER 2 X 4:1 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Supplier Device Package: 16-DIP Part Status: Obsolete |
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| MC68302CRC20C157-NXP | NXP USA Inc. |
Description: INTEGRATED MULTIPROTOCOL MICROPR Packaging: Bulk Part Status: Active |
на замовлення 58 шт: термін постачання 21-31 дні (днів) |
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74LVT74D,112 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 14SO Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 2 Function: Set(Preset) and Reset Type: D-Type Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Current - Quiescent (Iq): 1 mA Current - Output High, Low: 20mA, 32mA Trigger Type: Positive Edge Clock Frequency: 345 MHz Input Capacitance: 3 pF Supplier Device Package: 14-SO Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF Part Status: Obsolete Number of Bits per Element: 1 |
на замовлення 4235 шт: термін постачання 21-31 дні (днів) |
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MC06XSD200FK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:2 23PQFN Features: Internal PWM, Slew Rate Controlled Packaging: Tray Package / Case: 23-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side Rds On (Typ): 6mOhm Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 9A Ratio - Input:Output: 1:2 Supplier Device Package: 23-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Part Status: Obsolete |
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S9S12P32J0MLH | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 49 DigiKey Programmable: Not Verified |
на замовлення 800 шт: термін постачання 21-31 дні (днів) |
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NX3L1T5157GM,132 | NXP USA Inc. |
Description: IC SWITCH SPDT X 1 750MOHM 6XSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 750mOhm -3db Bandwidth: 60MHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 20mOhm Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Obsolete Number of Circuits: 1 |
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74HC258DB,112 | NXP USA Inc. |
Description: IC MULTIPLEXER 4 X 2:1 16-SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 7.8mA, 7.8mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP Part Status: Obsolete |
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MK20DN32VFM5 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32QFN Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 6x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Part Status: Active Number of I/O: 20 DigiKey Programmable: Not Verified |
на замовлення 384 шт: термін постачання 21-31 дні (днів) |
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BGE885,112 | NXP USA Inc. |
Description: IC VIDEO PUSH-PULL CTRLR SFM9 Packaging: Bulk Package / Case: SOT-115D Mounting Type: Chassis Mount Supplier Device Package: SFM9 Part Status: Obsolete |
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BUK763R8-80E118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK763R8-80E - POWE Packaging: Bulk Part Status: Active |
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BUK7Y98-80E,115 | NXP USA Inc. |
Description: BUK7Y98-80E - N-CHANNEL 80V, 98 Packaging: Bulk Part Status: Active |
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| MWPR1024IZVHT | NXP USA Inc. |
Description: KW40 512 WCT 48LQFN Packaging: Tray Part Status: Active |
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В кошику од. на суму грн. | |||||||||||||||
| MWPR1124ZVHT | NXP USA Inc. |
Description: KW40 512 WCT 48LQFN Packaging: Tray Part Status: Active |
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MCIMX6X4AVM08ABR | NXP USA Inc. |
Description: IC MPU I.MX6SX 800MHZ 529MAPBGA Packaging: Tape & Reel (TR) Package / Case: 529-LFBGA Mounting Type: Surface Mount Speed: 200MHz, 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 529-MAPBGA (19x19) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC Part Status: Active |
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| HEC4040BT-Q100118 | NXP USA Inc. |
Description: J-K FLIP-FLOP, 2-BIT Packaging: Bulk Part Status: Active |
товару немає в наявності |
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BZX84J-C62115 | NXP USA Inc. |
Description: NOW NEXPERIA BZX84J-C5V1 - ZENER Packaging: Bulk Part Status: Active |
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BZX84J-C5V1115 | NXP USA Inc. |
Description: NOW NEXPERIA BZX84J-C5V1 - ZENER Packaging: Bulk Part Status: Active |
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NT3H2211W0FTTJ | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 8TSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C Type: RFID Transponder Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.3V Standards: ISO 14443 Supplier Device Package: 8-TSSOP Part Status: Active |
на замовлення 12313 шт: термін постачання 21-31 дні (днів) |
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| MC33XS2410EL | NXP USA Inc. |
Description: HIGH-SIDE SWITCH 60V HTSSOP28 Features: Load Discharge, Slew Rate Controlled Packaging: Tube Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 4 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side Rds On (Typ): 100mOhm Input Type: Non-Inverting Voltage - Load: 3V ~ 60V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 3.6A Ratio - Input:Output: 1:4 Supplier Device Package: 28-HTSSOP Fault Protection: Current Limiting (Fixed), Over Load, Over Temperature, Over Voltage, Short Circuit, UVLO Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
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74AUP2G80GF,115 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 8XSON Packaging: Bulk Package / Case: 8-XFDFN Output Type: Inverted Mounting Type: Surface Mount Number of Elements: 2 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Current - Quiescent (Iq): 500 nA Current - Output High, Low: 4mA, 4mA Trigger Type: Positive Edge Clock Frequency: 309 MHz Input Capacitance: 0.6 pF Supplier Device Package: 8-XSON (1.35x1) Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF Part Status: Active Number of Bits per Element: 1 |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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NX3L4053HRZ | NXP USA Inc. |
Description: IC ANALOG SWITCH SPDT HXQFN16U Packaging: Tape & Reel (TR) Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 16-HXQFN (3x3) Part Status: Active |
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74ALVT162240DL,112 | NXP USA Inc. |
Description: IC BUFFER INVERT 3.6V 48SSOP Packaging: Tube Package / Case: 48-BSSOP (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 12mA, 12mA Supplier Device Package: 48-SSOP Part Status: Obsolete |
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MC9S08QG8MPBE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-PDIP Part Status: Obsolete Number of I/O: 12 DigiKey Programmable: Not Verified |
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| ASK-RYLT1046-1K | NXP USA Inc. |
Description: ROYALTY PREPAYMENT 1K UNITS - LS Packaging: Bulk For Use With/Related Products: LS1046A Type: Design Software Part Status: Active |
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В кошику од. на суму грн. | |||||||||||||||
| 74LVCV2G66GTX | NXP USA Inc. |
Description: IC SWITCH SPST-NOX2 10OHM 8XSON Packaging: Bulk Package / Case: 8-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 10Ohm -3db Bandwidth: 210MHz Supplier Device Package: 8-XSON (1.95x1) Voltage - Supply, Single (V+): 2.3V ~ 5.5V Charge Injection: 0.0035pC Crosstalk: -55dB @ 1MHz Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Switch Time (Ton, Toff) (Max): 5ns, 9ns Channel Capacitance (CS(off), CD(off)): 8pF Current - Leakage (IS(off)) (Max): 10µA Part Status: Active Number of Circuits: 2 |
на замовлення 59251 шт: термін постачання 21-31 дні (днів) |
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FRDM-STBA-A8967 | NXP USA Inc. |
Description: DEV BOARD FXLS8967AF ACCEL Packaging: Bulk Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g Interface: I2C, Serial, SPI Contents: Board(s), Cable(s) Voltage - Supply: 1.71V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: FXLS8967AF, K22 Supplied Contents: Board(s), Cable(s) Embedded: No Sensing Range: ±2g, 4g, 8g, 16g Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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MC56F80748MLH | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: 56800EF Data Converters: A/D 14x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
на замовлення 796 шт: термін постачання 21-31 дні (днів) |
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MC56F81000-EVK | NXP USA Inc. |
Description: MC56F81000 EVAL KIT Packaging: Bulk Mounting Type: Fixed Type: DSP Contents: Board(s) Core Processor: 56800EX Board Type: Evaluation Platform Utilized IC / Part: MC56F81000 Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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MC56F80000-EVK | NXP USA Inc. |
Description: DIGITAL SIGNAL CTRL EVAL KIT Packaging: Bulk Mounting Type: Fixed Type: DSP Contents: Board(s), Cable(s) Core Processor: 56800EF Board Type: Evaluation Platform Utilized IC / Part: MC56F80748 Part Status: Active |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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MC56F82348MLH | NXP USA Inc. |
Description: MC56F82348 - 32-BIT DSC, 56800EX Packaging: Bulk Part Status: Active |
на замовлення 160 шт: термін постачання 21-31 дні (днів) |
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PMV37EN,215 | NXP USA Inc. |
Description: MOSFET N-CH 30V 3.1A TO236AB Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta) Rds On (Max) @ Id, Vgs: 36mOhm @ 3.1A, 10V Power Dissipation (Max): 380mW (Ta) Vgs(th) (Max) @ Id: 2.5V @ 250µA Supplier Device Package: SOT-23 (TO-236AB) Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 10 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PMV37EN,215 | NXP USA Inc. |
Description: MOSFET N-CH 30V 3.1A TO236AB Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta) Rds On (Max) @ Id, Vgs: 36mOhm @ 3.1A, 10V Power Dissipation (Max): 380mW (Ta) Vgs(th) (Max) @ Id: 2.5V @ 250µA Supplier Device Package: SOT-23 (TO-236AB) Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 10 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCIMX280DVM4B | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: LVDDR, LVDDR2, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| A2T20H160W04NR3528 | NXP USA Inc. |
Description: RF POWER FIELD-EFFECT TRANSISTOR Packaging: Bulk Part Status: Active |
на замовлення 3460 шт: термін постачання 21-31 дні (днів) |
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| FXLS8967AFR3 | NXP USA Inc. |
Description: IC 3-AXIS ACCELEROMETER 10-DFN Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor Packaging: Tape & Reel (TR) Package / Case: 10-VFDFN Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g, 16g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.71V ~ 3.6V Bandwidth: 1.6kHz Supplier Device Package: 10-DFN (2x2) Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| FXLS8967AFR3 | NXP USA Inc. |
Description: IC 3-AXIS ACCELEROMETER 10-DFN Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor Packaging: Cut Tape (CT) Package / Case: 10-VFDFN Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g, 16g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.71V ~ 3.6V Bandwidth: 1.6kHz Supplier Device Package: 10-DFN (2x2) Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g) Part Status: Active |
на замовлення 869 шт: термін постачання 21-31 дні (днів) |
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MCIMX534AVP8C2R2 | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGA Packaging: Tape & Reel (TR) Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR2, DDR3, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCIMX534AVP8C2 | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGA Packaging: Tray Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR2, DDR3, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| SAF775CHN/N208W/HK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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74HCT27PW,118 | NXP USA Inc. |
Description: IC GATE NOR 3CH 3-INP 14TSSOP Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Supplier Device Package: 14-TSSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF Part Status: Active Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| TWR-LCD-RGB,598 | NXP USA Inc. |
Description: TOWER SYSTEM, PERIPHERAL MODULE, Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| SPC5668EF1AVMG |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 155
Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 155
товару немає в наявності
В кошику
од. на суму грн.
| 74ALVCH162244DL118 |
|
на замовлення 1608 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 535+ | 43.27 грн |
| IP3338CX24/LF/P135 |
|
на замовлення 4500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 656+ | 35.55 грн |
| IP3348CX20,135 |
|
Виробник: NXP USA Inc.
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Current: 20 mA
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Current: 20 mA
товару немає в наявності
В кошику
од. на суму грн.
| 74AVC16245DGG-Q100118 |
|
на замовлення 600 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 329+ | 75.17 грн |
| MPC8271CVRTIEA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Active
Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8690.47 грн |
| 10+ | 7042.03 грн |
| S12ZVML-MINIBRD |
|
Виробник: NXP USA Inc.
Description: LOW COST S12ZVML BLDC MC REFEREN
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S12ZVM
Supplied Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
Description: LOW COST S12ZVML BLDC MC REFEREN
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S12ZVM
Supplied Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| FRDM-32XSF-EVB |
Виробник: NXP USA Inc.
Description: FRDM EXP BD - 32V IND LIGHTING 5
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC17XSF500
Supplied Contents: Board(s)
Part Status: Active
Description: FRDM EXP BD - 32V IND LIGHTING 5
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC17XSF500
Supplied Contents: Board(s)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| KIT22XS4200EKEVB |
|
Виробник: NXP USA Inc.
Description: EVALUATION KIT - MC22XS4200 DUA
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC22XS4200
Supplied Contents: Board(s)
Part Status: Active
Description: EVALUATION KIT - MC22XS4200 DUA
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC22XS4200
Supplied Contents: Board(s)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MC9S08JS8CWJ |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 373 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 260.22 грн |
| 10+ | 188.45 грн |
| 38+ | 167.26 грн |
| 114+ | 145.34 грн |
| 266+ | 138.52 грн |
| S9S08SG8E2CTJ |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| T2080NSE8PTB557 |
Виробник: NXP USA Inc.
Description: QORIQ, 64B POWER ARCH, 8X 1.5GHZ
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: QORIQ, 64B POWER ARCH, 8X 1.5GHZ
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MC9S08DN16ACLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MC9S08DN16MLF |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
DigiKey Programmable: Not Verified
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| LPC54102J256UK49019 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
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| PEMI2QFN/LT,115 |
|
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3806+ | 6.34 грн |
| MC9S12XHZ256CAG |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 117
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 117
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| SPC5746CSK1MKU6,557 |
Виробник: NXP USA Inc.
Description: MPC574XP MICROCONTROLLER POWER A
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
Description: MPC574XP MICROCONTROLLER POWER A
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
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| 74HCT153N,652 |
|
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
Part Status: Obsolete
Description: IC MULTIPLEXER 2 X 4:1 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
Part Status: Obsolete
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| MC68302CRC20C157-NXP |
|
Виробник: NXP USA Inc.
Description: INTEGRATED MULTIPROTOCOL MICROPR
Packaging: Bulk
Part Status: Active
Description: INTEGRATED MULTIPROTOCOL MICROPR
Packaging: Bulk
Part Status: Active
на замовлення 58 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 13002.66 грн |
| 74LVT74D,112 |
|
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 1 mA
Current - Output High, Low: 20mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 345 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 1
Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 1 mA
Current - Output High, Low: 20mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 345 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 1
на замовлення 4235 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 833+ | 27.64 грн |
| MC06XSD200FK |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:2 23PQFN
Features: Internal PWM, Slew Rate Controlled
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 6mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 9A
Ratio - Input:Output: 1:2
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:2 23PQFN
Features: Internal PWM, Slew Rate Controlled
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 6mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 9A
Ratio - Input:Output: 1:2
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
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| S9S12P32J0MLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 668.31 грн |
| 10+ | 505.38 грн |
| 80+ | 418.40 грн |
| NX3L1T5157GM,132 |
|
Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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| 74HC258DB,112 |
|
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Obsolete
Description: IC MULTIPLEXER 4 X 2:1 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Obsolete
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од. на суму грн.
| MK20DN32VFM5 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 6x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 6x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
на замовлення 384 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 81+ | 285.29 грн |
| BGE885,112 |
|
Виробник: NXP USA Inc.
Description: IC VIDEO PUSH-PULL CTRLR SFM9
Packaging: Bulk
Package / Case: SOT-115D
Mounting Type: Chassis Mount
Supplier Device Package: SFM9
Part Status: Obsolete
Description: IC VIDEO PUSH-PULL CTRLR SFM9
Packaging: Bulk
Package / Case: SOT-115D
Mounting Type: Chassis Mount
Supplier Device Package: SFM9
Part Status: Obsolete
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| BUK763R8-80E118 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BUK763R8-80E - POWE
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BUK763R8-80E - POWE
Packaging: Bulk
Part Status: Active
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| BUK7Y98-80E,115 |
|
Виробник: NXP USA Inc.
Description: BUK7Y98-80E - N-CHANNEL 80V, 98
Packaging: Bulk
Part Status: Active
Description: BUK7Y98-80E - N-CHANNEL 80V, 98
Packaging: Bulk
Part Status: Active
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| MCIMX6X4AVM08ABR |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 529MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Part Status: Active
Description: IC MPU I.MX6SX 800MHZ 529MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Part Status: Active
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| BZX84J-C62115 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZX84J-C5V1 - ZENER
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BZX84J-C5V1 - ZENER
Packaging: Bulk
Part Status: Active
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| BZX84J-C5V1115 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZX84J-C5V1 - ZENER
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BZX84J-C5V1 - ZENER
Packaging: Bulk
Part Status: Active
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| NT3H2211W0FTTJ |
|
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
на замовлення 12313 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 88.39 грн |
| 10+ | 73.50 грн |
| 25+ | 69.37 грн |
| 100+ | 59.69 грн |
| 250+ | 56.45 грн |
| 500+ | 54.16 грн |
| 1000+ | 51.15 грн |
| MC33XS2410EL |
|
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH 60V HTSSOP28
Features: Load Discharge, Slew Rate Controlled
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 100mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 60V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.6A
Ratio - Input:Output: 1:4
Supplier Device Package: 28-HTSSOP
Fault Protection: Current Limiting (Fixed), Over Load, Over Temperature, Over Voltage, Short Circuit, UVLO
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: HIGH-SIDE SWITCH 60V HTSSOP28
Features: Load Discharge, Slew Rate Controlled
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 100mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 60V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.6A
Ratio - Input:Output: 1:4
Supplier Device Package: 28-HTSSOP
Fault Protection: Current Limiting (Fixed), Over Load, Over Temperature, Over Voltage, Short Circuit, UVLO
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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| 74AUP2G80GF,115 |
|
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.6 pF
Supplier Device Package: 8-XSON (1.35x1)
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
Description: IC FF D-TYPE DUAL 1BIT 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.6 pF
Supplier Device Package: 8-XSON (1.35x1)
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1528+ | 15.82 грн |
| NX3L4053HRZ |
Виробник: NXP USA Inc.
Description: IC ANALOG SWITCH SPDT HXQFN16U
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 16-HXQFN (3x3)
Part Status: Active
Description: IC ANALOG SWITCH SPDT HXQFN16U
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 16-HXQFN (3x3)
Part Status: Active
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| 74ALVT162240DL,112 |
|
Виробник: NXP USA Inc.
Description: IC BUFFER INVERT 3.6V 48SSOP
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-SSOP
Part Status: Obsolete
Description: IC BUFFER INVERT 3.6V 48SSOP
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-SSOP
Part Status: Obsolete
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| MC9S08QG8MPBE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 12
DigiKey Programmable: Not Verified
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| ASK-RYLT1046-1K |
Виробник: NXP USA Inc.
Description: ROYALTY PREPAYMENT 1K UNITS - LS
Packaging: Bulk
For Use With/Related Products: LS1046A
Type: Design Software
Part Status: Active
Description: ROYALTY PREPAYMENT 1K UNITS - LS
Packaging: Bulk
For Use With/Related Products: LS1046A
Type: Design Software
Part Status: Active
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| 74LVCV2G66GTX |
|
Виробник: NXP USA Inc.
Description: IC SWITCH SPST-NOX2 10OHM 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 210MHz
Supplier Device Package: 8-XSON (1.95x1)
Voltage - Supply, Single (V+): 2.3V ~ 5.5V
Charge Injection: 0.0035pC
Crosstalk: -55dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 5ns, 9ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 10µA
Part Status: Active
Number of Circuits: 2
Description: IC SWITCH SPST-NOX2 10OHM 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 210MHz
Supplier Device Package: 8-XSON (1.95x1)
Voltage - Supply, Single (V+): 2.3V ~ 5.5V
Charge Injection: 0.0035pC
Crosstalk: -55dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 5ns, 9ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 10µA
Part Status: Active
Number of Circuits: 2
на замовлення 59251 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2016+ | 12.39 грн |
| FRDM-STBA-A8967 |
|
Виробник: NXP USA Inc.
Description: DEV BOARD FXLS8967AF ACCEL
Packaging: Bulk
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8967AF, K22
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
Part Status: Active
Description: DEV BOARD FXLS8967AF ACCEL
Packaging: Bulk
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8967AF, K22
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 6962.29 грн |
| MC56F80748MLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 796 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 610.48 грн |
| 10+ | 454.62 грн |
| 25+ | 421.29 грн |
| 160+ | 352.13 грн |
| 320+ | 340.95 грн |
| 480+ | 335.36 грн |
| MC56F81000-EVK |
|
Виробник: NXP USA Inc.
Description: MC56F81000 EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s)
Core Processor: 56800EX
Board Type: Evaluation Platform
Utilized IC / Part: MC56F81000
Part Status: Active
Description: MC56F81000 EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s)
Core Processor: 56800EX
Board Type: Evaluation Platform
Utilized IC / Part: MC56F81000
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3272.97 грн |
| MC56F80000-EVK |
|
Виробник: NXP USA Inc.
Description: DIGITAL SIGNAL CTRL EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s)
Core Processor: 56800EF
Board Type: Evaluation Platform
Utilized IC / Part: MC56F80748
Part Status: Active
Description: DIGITAL SIGNAL CTRL EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s)
Core Processor: 56800EF
Board Type: Evaluation Platform
Utilized IC / Part: MC56F80748
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4091.62 грн |
| MC56F82348MLH |
Виробник: NXP USA Inc.
Description: MC56F82348 - 32-BIT DSC, 56800EX
Packaging: Bulk
Part Status: Active
Description: MC56F82348 - 32-BIT DSC, 56800EX
Packaging: Bulk
Part Status: Active
на замовлення 160 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 49+ | 478.32 грн |
| PMV37EN,215 |
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 3.1A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta)
Rds On (Max) @ Id, Vgs: 36mOhm @ 3.1A, 10V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 10 V
Description: MOSFET N-CH 30V 3.1A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta)
Rds On (Max) @ Id, Vgs: 36mOhm @ 3.1A, 10V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 10 V
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| PMV37EN,215 |
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 3.1A TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta)
Rds On (Max) @ Id, Vgs: 36mOhm @ 3.1A, 10V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 10 V
Description: MOSFET N-CH 30V 3.1A TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta)
Rds On (Max) @ Id, Vgs: 36mOhm @ 3.1A, 10V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 10 V
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| MCIMX280DVM4B |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Part Status: Active
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Part Status: Active
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| A2T20H160W04NR3528 |
|
Виробник: NXP USA Inc.
Description: RF POWER FIELD-EFFECT TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: RF POWER FIELD-EFFECT TRANSISTOR
Packaging: Bulk
Part Status: Active
на замовлення 3460 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 6762.17 грн |
| FXLS8967AFR3 |
|
Виробник: NXP USA Inc.
Description: IC 3-AXIS ACCELEROMETER 10-DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Description: IC 3-AXIS ACCELEROMETER 10-DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
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| FXLS8967AFR3 |
|
Виробник: NXP USA Inc.
Description: IC 3-AXIS ACCELEROMETER 10-DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Description: IC 3-AXIS ACCELEROMETER 10-DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
на замовлення 869 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 281.70 грн |
| 10+ | 203.41 грн |
| 25+ | 180.80 грн |
| 50+ | 161.19 грн |
| 100+ | 156.97 грн |
| 500+ | 131.51 грн |
| MCIMX534AVP8C2R2 |
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Active
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| MCIMX534AVP8C2 |
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Active
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| 74HCT27PW,118 |
|
Виробник: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE NOR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
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| TWR-LCD-RGB,598 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM, PERIPHERAL MODULE,
Packaging: Bulk
Part Status: Active
Description: TOWER SYSTEM, PERIPHERAL MODULE,
Packaging: Bulk
Part Status: Active
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