Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36604) > Сторінка 470 з 611
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||||
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BGA2031/1,115 | NXP USA Inc. |
Description: IC RF AMP CDMA 1.8GHZ 6TSSOPPart Status: Obsolete Supplier Device Package: 6-TSSOP Test Frequency: 1.9GHz Current - Supply: 37mA ~ 63mA Gain: 23dB Voltage - Supply: 3V ~ 3.3V RF Type: CDMA, PCS Frequency: 1.8GHz Mounting Type: Surface Mount Package / Case: 6-TSSOP, SC-88, SOT-363 Packaging: Tape & Reel (TR) |
товару немає в наявності |
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SL3S1203FTB0,115 | NXP USA Inc. |
Description: IC RFID TRANSP 840-960MHZ XSON6Part Status: Obsolete Supplier Device Package: 6-XSON, SOT886 (1.45x1) Standards: ISO 18000-6, EPC Voltage - Supply: 1.8V Operating Temperature: -40°C ~ 85°C Type: RFID Transponder Frequency: 840MHz ~ 960MHz Mounting Type: Surface Mount Package / Case: 6-XFDFN Packaging: Bulk |
на замовлення 1344860 шт: термін постачання 21-31 дні (днів) |
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| IP4221CZ6-XS132 | NXP USA Inc. |
Description: TRANS VOLTAGE SUPPRESSOR DIODEPart Status: Active Packaging: Bulk |
на замовлення 114407 шт: термін постачання 21-31 дні (днів) |
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MKL43Z256VLH4557 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPNumber of I/O: 50 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT Connectivity: I²C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 18x16b; D/A 1x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Bulk |
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| LFMAK44PT3M | NXP USA Inc. |
Description: NXP MPC5744P NEXUS DEBUG BOARD Part Status: Active Packaging: Bulk Utilized IC / Part: MPC5744P Module/Board Type: Adapter Board For Use With/Related Products: MPC5744P |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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LPC4320FBD144,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 204MHz RAM Size: 200K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 DigiKey Programmable: Not Verified |
на замовлення 716 шт: термін постачання 21-31 дні (днів) |
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BSC9131NXE1KHKB | NXP USA Inc. |
Description: IC MPU QORIQ 800MHZ 520FCBGAPart Status: Obsolete Security Features: Boot Security, Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 520-FCBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: -40°C ~ 105°C (TA) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 520-FBGA, FCBGA Packaging: Box |
товару немає в наявності |
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| KIT50XS4200EKEVB | NXP USA Inc. |
Description: EVAL BOARD FOR MC50XS4200Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC50XS4200 Supplied Contents: Board(s) Part Status: Active Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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T1022NSE7PQB | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGAAdditional Interfaces: I2C, MMC/SD, PCIe, SPI, UART Part Status: Active SATA: SATA 3Gbps (2) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Graphics Acceleration: No RAM Controllers: DDR3L/4 Number of Cores/Bus Width: 2 Core, 64-Bit USB: USB 2.0 + PHY (2) Ethernet: 1Gbps (5) Supplier Device Package: 780-FCPBGA (23x23) Core Processor: PowerPC e5500 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.4GHz Mounting Type: Surface Mount Package / Case: 780-FBGA, FCBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||||||||||||||||
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SA56004AD,118 | NXP USA Inc. |
Description: SENSOR DIGITAL -40C-125C 8SOFeatures: Output Switch, Programmable Limit Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 5.5V Sensor Type: Digital, Local/Remote Resolution: 10 b Supplier Device Package: 8-SO Test Condition: 60°C ~ 100°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2°C (±3°C) Sensing Temperature - Local: -40°C ~ 125°C Sensing Temperature - Remote: -40°C ~ 125°C Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||||||||
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SA56004ED,118 | NXP USA Inc. |
Description: SENSOR DIGITAL -40C-125C 8SOFeatures: Output Switch, Programmable Limit Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 5.5V Sensor Type: Digital, Local/Remote Resolution: 10 b Supplier Device Package: 8-SO Test Condition: 60°C ~ 100°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2°C (±3°C) Sensing Temperature - Local: -40°C ~ 125°C Sensing Temperature - Remote: -40°C ~ 125°C Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||||||||
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SA56004CD,112 | NXP USA Inc. |
Description: SENSOR DIGITAL -40C-125C 8SOFeatures: Output Switch, Programmable Limit Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 5.5V Sensor Type: Digital, Local/Remote Resolution: 10 b Supplier Device Package: 8-SO Test Condition: 60°C ~ 100°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2°C (±3°C) Sensing Temperature - Local: -40°C ~ 125°C Sensing Temperature - Remote: -40°C ~ 125°C Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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SA56004FD,112 | NXP USA Inc. |
Description: SENSOR DIGITAL -40C-125C 8SOFeatures: Output Switch, Programmable Limit Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 5.5V Sensor Type: Digital, Local/Remote Resolution: 10 b Supplier Device Package: 8-SO Test Condition: 60°C ~ 100°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2°C (±3°C) Sensing Temperature - Local: -40°C ~ 125°C Sensing Temperature - Remote: -40°C ~ 125°C Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCIMX253CJM4A | NXP USA Inc. |
Description: IC MPU I.MX25 400MHZ 400LFBGAPackaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPI, SSI, SSP, UART Part Status: Active |
на замовлення 434 шт: термін постачання 21-31 дні (днів) |
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MCIMX253DJM4 | NXP USA Inc. |
Description: IC MPU I.MX25 400MHZ 400LFBGAPackaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCIMX253CJM4 | NXP USA Inc. |
Description: IC MPU I.MX25 400MHZ 400LFBGAPackaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCIMX253CVM4 | NXP USA Inc. |
Description: IC MPU I.MX25 400MHZ 400LFBGAPackaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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P3T1085UK-ARD | NXP USA Inc. |
Description: P3T1085UK ARD SHIELD EVAL BOARDPackaging: Box Function: Temperature Type: Sensor Contents: Board(s) Utilized IC / Part: P3T1085UK Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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| P3T1085UKAZ | NXP USA Inc. |
Description: I3C, I2C-BUS INTERFACE, 0.5 C A Features: Shutdown Mode Packaging: Tape & Reel (TR) Package / Case: 6-XFBGA, WLCSP Output Type: 2-Wire Serial, I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 3.6V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 6-WLCSP (1.18x.84) Test Condition: -20°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±0.5°C (±1°C) Sensing Temperature - Local: -40°C ~ 125°C Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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P3T1085UKZ | NXP USA Inc. |
Description: I3C, I2C-BUS INTERFACE, 0.5 C AFeatures: Shutdown Mode Packaging: Tape & Reel (TR) Package / Case: 6-XFBGA, WLCSP Output Type: 2-Wire Serial, I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 3.6V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 6-WLCSP (1.18x.84) Test Condition: -20°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±0.5°C (±1°C) Sensing Temperature - Local: -40°C ~ 125°C Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 15000 шт В кошику од. на суму грн. | ||||||||||||||||
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TDA8035HN/C1,151 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HVQFNPart Status: Active Supplier Device Package: 32-HVQFN (5x5) Voltage - Supply: 1.8V, 3V, 5V Interface: Analog Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Tray |
на замовлення 160 шт: термін постачання 21-31 дні (днів) |
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TDA8035HN/C1,118 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HVQFNPart Status: Active Supplier Device Package: 32-HVQFN (5x5) Voltage - Supply: 2.7V ~ 5.5V Interface: Analog Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Cut Tape (CT) |
на замовлення 6005 шт: термін постачання 21-31 дні (днів) |
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TDA8029HL/C207151 | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, 8051 CPU Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TDA8023TT/C1 | NXP USA Inc. |
Description: IC SMART CARD INTERFACE 28-TSSOPPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NTSX2102TLH | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-XSONPackaging: Tape & Reel (TR) Package / Case: 8-XFDFN Exposed Pad Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 50Mbps Supplier Device Package: 8-XSON (2x3) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.65 V ~ 5.5 V Voltage - VCCB: 1.65 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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NTSX2102TLH | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-XSONPackaging: Cut Tape (CT) Package / Case: 8-XFDFN Exposed Pad Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 50Mbps Supplier Device Package: 8-XSON (2x3) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.65 V ~ 5.5 V Voltage - VCCB: 1.65 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
на замовлення 4823 шт: термін постачання 21-31 дні (днів) |
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NTS0101GM,115 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 6XSONFeatures: Auto-Direction Sensing Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Output Type: Open Drain, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 6-XSON, SOT886 (1.45x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NTS0101GM,115 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 6XSONFeatures: Auto-Direction Sensing Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Output Type: Open Drain, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 6-XSON, SOT886 (1.45x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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LPC2368FBD100,518 | NXP USA Inc. |
Description: IC MCU 16/32B 512KB FLSH 100LQFPPackaging: Tape & Reel (TR) Part Status: Active Package / Case: 100-LQFP Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14x14) Speed: 72MHz Program Memory Size: 512KB (512K x 8) RAM Size: 58K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM7TDMI-S Data Converters: A/D 6x10b SAR; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 70 Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, SSP, UART/USART, USB |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TJA1021TK/20/S1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSONPackaging: Tape & Reel (TR) Part Status: Active Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5.5V ~ 27V Number of Drivers/Receivers: 1/1 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 300 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 6000 шт В кошику од. на суму грн. | ||||||||||||||||
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MPF5030BMDA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, S32, NON-PRApplications: System Basis Chip Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-PowerVFQFN Packaging: Tray Voltage - Supply: 3.3V ~ 5.25V Part Status: Active Supplier Device Package: 40-HVQFN (6x6) |
на замовлення 420 шт: термін постачання 21-31 дні (днів) |
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DSC-MULTILINK | NXP USA Inc. |
Description: DSC MULTILINKPackaging: Box For Use With/Related Products: MCU Type: Debugger, Programmer (In-Circuit/In-System) Contents: Board(s) Part Status: Active Utilized IC / Part: MCU |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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PCA9411AUKZ | NXP USA Inc. |
Description: IC REG BOOST 5.25V 500MA 9WLCSPPackaging: Cut Tape (CT) Package / Case: 9-UFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Up Current - Output: 500mA Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: Positive Frequency - Switching: 3MHz Voltage - Input (Max): 5.25V Topology: Boost Supplier Device Package: 9-WLCSP (1.24x1.24) Synchronous Rectifier: Yes Voltage - Input (Min): 2.5V Voltage - Output (Min/Fixed): 5.25V Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| NX1WP10Z | NXP USA Inc. |
Description: IC WIRELESS PWR RECEIVER WLCSP42Packaging: Tape & Reel (TR) Package / Case: 42-UFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Applications: Wireless Power Receiver Supplier Device Package: 42-WLCSP (3.56x3.41) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| BB131 | NXP USA Inc. |
Description: VARIABLE CAPACITANCE DIODE, VERY Capacitance Ratio: 16 Voltage - Peak Reverse (Max): 30 V Part Status: Active Supplier Device Package: SOD-323 Capacitance Ratio Condition: C0.5/C28 Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz Operating Temperature: -55°C ~ 125°C (TJ) Diode Type: Single Mounting Type: Surface Mount Package / Case: SC-76, SOD-323 Packaging: Bulk |
на замовлення 547000 шт: термін постачання 21-31 дні (днів) |
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KW45B41Z82AFTBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 48HVQFNSerial Interfaces: I2C, PWM, SPI, UART RF Family/Standard: Bluetooth, General ISM > 1GHz Modulation: FSK, GFSK, GMSK, MSK Supplier Device Package: 48-HVQFN (7x7) Data Rate (Max): 2Mbps Protocol: Bluetooth v5.3 Power - Output: 10dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Type: TxRx + MCU Memory Size: 1MB Flash, 128kB RAM Frequency: 2.36GHz ~ 2.48GHz Mounting Type: Surface Mount, Wettable Flank Sensitivity: -106dBm Package / Case: 48-VFQFN Exposed Pad Qualification: AEC-Q100 Grade: Automotive Part Status: Active Packaging: Tape & Reel (TR) Current - Transmitting: 4.6mA ~ 22.4mA Current - Receiving: 4.1mA ~ 10.01mA |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||||
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KW45B41Z83AFPBT | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 40HVQFNQualification: AEC-Q100 Grade: Automotive Part Status: Active Packaging: Tray Current - Transmitting: 4.6mA ~ 22.4mA Current - Receiving: 4.1mA ~ 10.01mA Serial Interfaces: I2C, PWM, SPI, UART RF Family/Standard: Bluetooth, General ISM > 1GHz Modulation: FSK, GFSK, GMSK, MSK Supplier Device Package: 40-HVQFN (6x6) Data Rate (Max): 2Mbps Protocol: Bluetooth v5.3 Power - Output: 10dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Type: TxRx + MCU Memory Size: 1MB Flash, 128kB RAM Frequency: 2.36GHz ~ 2.48GHz Mounting Type: Surface Mount, Wettable Flank Sensitivity: -106dBm Package / Case: 40-VFQFN Exposed Pad |
товару немає в наявності |
Мінімальне замовлення: 490 шт В кошику од. на суму грн. | ||||||||||||||||
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KW45B41Z52AFTBT | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 48HVQFNQualification: AEC-Q100 Grade: Automotive Serial Interfaces: I2C, PWM, SPI, UART RF Family/Standard: Bluetooth, General ISM > 1GHz Modulation: FSK, GFSK, GMSK, MSK Supplier Device Package: 48-HVQFN (7x7) Data Rate (Max): 2Mbps Protocol: Bluetooth v5.3 Power - Output: 10dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Type: TxRx + MCU Memory Size: 512kB Flash, 128kB RAM Frequency: 2.36GHz ~ 2.48GHz Mounting Type: Surface Mount, Wettable Flank Part Status: Active Packaging: Tray Current - Transmitting: 4.6mA ~ 22.4mA Current - Receiving: 4.1mA ~ 10.01mA Sensitivity: -106dBm Package / Case: 48-VFQFN Exposed Pad |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | ||||||||||||||||
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KW45B41Z82AFTBT | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 48HVQFNFrequency: 2.36GHz ~ 2.48GHz Mounting Type: Surface Mount, Wettable Flank Sensitivity: -106dBm Package / Case: 48-VFQFN Exposed Pad Qualification: AEC-Q100 Grade: Automotive Serial Interfaces: I2C, PWM, SPI, UART RF Family/Standard: Bluetooth, General ISM > 1GHz Modulation: FSK, GFSK, GMSK, MSK Supplier Device Package: 48-HVQFN (7x7) Data Rate (Max): 2Mbps Protocol: Bluetooth v5.3 Power - Output: 10dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Type: TxRx + MCU Memory Size: 1MB Flash, 128kB RAM Part Status: Active Packaging: Tray Current - Transmitting: 4.6mA ~ 22.4mA Current - Receiving: 4.1mA ~ 10.01mA |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | ||||||||||||||||
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KW45B41Z52AFPBT | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 40HVQFNQualification: AEC-Q100 Grade: Automotive Part Status: Active Packaging: Tray Current - Transmitting: 4.6mA ~ 22.4mA Current - Receiving: 4.1mA ~ 10.01mA Serial Interfaces: I2C, PWM, SPI, UART RF Family/Standard: Bluetooth, General ISM > 1GHz Modulation: FSK, GFSK, GMSK, MSK Supplier Device Package: 40-HVQFN (6x6) Data Rate (Max): 2Mbps Protocol: Bluetooth v5.3 Power - Output: 10dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Type: TxRx + MCU Memory Size: 512kB Flash, 128kB RAM Frequency: 2.36GHz ~ 2.48GHz Mounting Type: Surface Mount, Wettable Flank Sensitivity: -106dBm Package / Case: 40-VFQFN Exposed Pad |
товару немає в наявності |
Мінімальне замовлення: 490 шт В кошику од. на суму грн. | ||||||||||||||||
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KW45B41Z83AFTBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 48HVQFNQualification: AEC-Q100 Grade: Automotive Serial Interfaces: I2C, PWM, SPI, UART RF Family/Standard: Bluetooth, General ISM > 1GHz Modulation: FSK, GFSK, GMSK, MSK Supplier Device Package: 48-HVQFN (7x7) Data Rate (Max): 2Mbps Protocol: Bluetooth v5.3 Power - Output: 10dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Type: TxRx + MCU Memory Size: 1MB Flash, 128kB RAM Frequency: 2.36GHz ~ 2.48GHz Mounting Type: Surface Mount, Wettable Flank Sensitivity: -106dBm Package / Case: 48-VFQFN Exposed Pad Part Status: Active Packaging: Tape & Reel (TR) Current - Transmitting: 4.6mA ~ 22.4mA Current - Receiving: 4.1mA ~ 10.01mA |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||||
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KW45B41Z83AFPBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 40HVQFNSerial Interfaces: I2C, PWM, SPI, UART RF Family/Standard: Bluetooth, General ISM > 1GHz Modulation: FSK, GFSK, GMSK, MSK Supplier Device Package: 40-HVQFN (6x6) Data Rate (Max): 2Mbps Protocol: Bluetooth v5.3 Power - Output: 10dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Type: TxRx + MCU Memory Size: 1MB Flash, 128kB RAM Frequency: 2.36GHz ~ 2.48GHz Mounting Type: Surface Mount, Wettable Flank Sensitivity: -106dBm Package / Case: 40-VFQFN Exposed Pad Grade: Automotive Qualification: AEC-Q100 Part Status: Active Packaging: Tape & Reel (TR) Current - Transmitting: 4.6mA ~ 22.4mA Current - Receiving: 4.1mA ~ 10.01mA |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||||
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KW45B41Z82AFPBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 40HVQFNSerial Interfaces: I2C, PWM, SPI, UART RF Family/Standard: Bluetooth, General ISM > 1GHz Modulation: FSK, GFSK, GMSK, MSK Supplier Device Package: 40-HVQFN (6x6) Data Rate (Max): 2Mbps Protocol: Bluetooth v5.3 Power - Output: 10dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Type: TxRx + MCU Memory Size: 1MB Flash, 128kB RAM Frequency: 2.36GHz ~ 2.48GHz Mounting Type: Surface Mount, Wettable Flank Sensitivity: -106dBm Package / Case: 40-VFQFN Exposed Pad Qualification: AEC-Q100 Grade: Automotive Part Status: Active Packaging: Tape & Reel (TR) Current - Transmitting: 4.6mA ~ 22.4mA Current - Receiving: 4.1mA ~ 10.01mA |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||||
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KW45B41Z53AFTBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 48HVQFNPart Status: Active Serial Interfaces: I2C, PWM, SPI, UART RF Family/Standard: Bluetooth, General ISM > 1GHz Modulation: FSK, GFSK, GMSK, MSK Supplier Device Package: 48-HVQFN (7x7) Data Rate (Max): 2Mbps Protocol: Bluetooth v5.3 Power - Output: 10dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Type: TxRx + MCU Memory Size: 512kB Flash, 128kB RAM Frequency: 2.36GHz ~ 2.48GHz Mounting Type: Surface Mount, Wettable Flank Sensitivity: -106dBm Package / Case: 48-VFQFN Exposed Pad Qualification: AEC-Q100 Grade: Automotive Packaging: Tape & Reel (TR) Current - Transmitting: 4.6mA ~ 22.4mA Current - Receiving: 4.1mA ~ 10.01mA |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||||
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KW45B41Z53AFTBT | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 48HVQFNPart Status: Active Packaging: Tray Data Rate (Max): 2Mbps Protocol: Bluetooth v5.3 Power - Output: 10dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Type: TxRx + MCU Memory Size: 512kB Flash, 128kB RAM Frequency: 2.36GHz ~ 2.48GHz Mounting Type: Surface Mount, Wettable Flank Sensitivity: -106dBm Package / Case: 48-VFQFN Exposed Pad Serial Interfaces: I2C, PWM, SPI, UART RF Family/Standard: Bluetooth, General ISM > 1GHz Qualification: AEC-Q100 Grade: Automotive Modulation: FSK, GFSK, GMSK, MSK Supplier Device Package: 48-HVQFN (7x7) Current - Transmitting: 4.6mA ~ 22.4mA Current - Receiving: 4.1mA ~ 10.01mA |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | ||||||||||||||||
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KW45B41Z82AFPBT | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 40HVQFNPart Status: Active Packaging: Tray Qualification: AEC-Q100 Grade: Automotive Serial Interfaces: I2C, PWM, SPI, UART RF Family/Standard: Bluetooth, General ISM > 1GHz Modulation: FSK, GFSK, GMSK, MSK Supplier Device Package: 40-HVQFN (6x6) Data Rate (Max): 2Mbps Protocol: Bluetooth v5.3 Power - Output: 10dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Type: TxRx + MCU Memory Size: 1MB Flash, 128kB RAM Frequency: 2.36GHz ~ 2.48GHz Mounting Type: Surface Mount, Wettable Flank Sensitivity: -106dBm Package / Case: 40-VFQFN Exposed Pad Current - Transmitting: 4.6mA ~ 22.4mA Current - Receiving: 4.1mA ~ 10.01mA |
товару немає в наявності |
Мінімальне замовлення: 490 шт В кошику од. на суму грн. | ||||||||||||||||
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KW45B41Z83AFTBT | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 48HVQFNPart Status: Active Packaging: Tray Serial Interfaces: I2C, PWM, SPI, UART RF Family/Standard: Bluetooth, General ISM > 1GHz Modulation: FSK, GFSK, GMSK, MSK Supplier Device Package: 48-HVQFN (7x7) Data Rate (Max): 2Mbps Protocol: Bluetooth v5.3 Power - Output: 10dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Type: TxRx + MCU Memory Size: 1MB Flash, 128kB RAM Frequency: 2.36GHz ~ 2.48GHz Mounting Type: Surface Mount, Wettable Flank Sensitivity: -106dBm Package / Case: 48-VFQFN Exposed Pad Qualification: AEC-Q100 Grade: Automotive Current - Transmitting: 4.6mA ~ 22.4mA Current - Receiving: 4.1mA ~ 10.01mA |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | ||||||||||||||||
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KW45B41Z52AFTBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 48HVQFNPart Status: Active Packaging: Tape & Reel (TR) Serial Interfaces: I2C, PWM, SPI, UART RF Family/Standard: Bluetooth, General ISM > 1GHz Modulation: FSK, GFSK, GMSK, MSK Supplier Device Package: 48-HVQFN (7x7) Data Rate (Max): 2Mbps Protocol: Bluetooth v5.3 Power - Output: 10dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Type: TxRx + MCU Memory Size: 512kB Flash, 128kB RAM Frequency: 2.36GHz ~ 2.48GHz Mounting Type: Surface Mount, Wettable Flank Sensitivity: -106dBm Package / Case: 48-VFQFN Exposed Pad Qualification: AEC-Q100 Grade: Automotive Current - Transmitting: 4.6mA ~ 22.4mA Current - Receiving: 4.1mA ~ 10.01mA |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||||
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KW45B41Z53AFPBT | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 40HVQFNPart Status: Active Packaging: Tray Qualification: AEC-Q100 Grade: Automotive Serial Interfaces: I2C, PWM, SPI, UART RF Family/Standard: Bluetooth, General ISM > 1GHz Modulation: FSK, GFSK, GMSK, MSK Supplier Device Package: 40-HVQFN (6x6) Data Rate (Max): 2Mbps Protocol: Bluetooth v5.3 Power - Output: 10dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Type: TxRx + MCU Memory Size: 512kB Flash, 128kB RAM Frequency: 2.36GHz ~ 2.48GHz Mounting Type: Surface Mount, Wettable Flank Sensitivity: -106dBm Package / Case: 40-VFQFN Exposed Pad Current - Transmitting: 4.6mA ~ 22.4mA Current - Receiving: 4.1mA ~ 10.01mA |
товару немає в наявності |
Мінімальне замовлення: 490 шт В кошику од. на суму грн. | ||||||||||||||||
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KW45B41Z-EVK | NXP USA Inc. |
Description: KW45B41Z-EVKUtilized IC / Part: KW45B41Z Contents: Board(s) Packaging: Bulk Supplied Contents: Board(s) Frequency: 2.4GHz Part Status: Active Type: Transceiver; Bluetooth® 5.x (BLE) For Use With/Related Products: KW45B41Z |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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MD7IC2755GNR1 | NXP USA Inc. |
Description: IC RF AMP WIMAX 2.7GHZ TO270Packaging: Tape & Reel (TR) Package / Case: TO-270-14 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 2.7GHz RF Type: WiMax Voltage - Supply: 28V Gain: 25dB Current - Supply: 275mA P1dB: 44.8dBm Test Frequency: 2.7GHz Supplier Device Package: TO-270 WB-14 GULL Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MK11DX128VMC5 | NXP USA Inc. |
Description: IC MCU 32B 128KB FLASH 121MAPBGADigiKey Programmable: Not Verified Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 128KB (128K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 121-LFBGA Packaging: Tray Number of I/O: 64 Part Status: Obsolete Supplier Device Package: 121-MAPBGA (8x8) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: I2C, IrDA, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 24x16b; D/A 1x12b Core Processor: ARM® Cortex®-M4 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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SP5748CBK0AVKU2R | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLASH 176LQFP Number of I/O: 129 Part Status: Active Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 80x10b, 64x12b Core Processor: e200z2, e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 768K x 8 Program Memory Size: 6MB (6M x 8) Speed: 80MHz/160MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||||||||||||
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MCIMX6L8DVN10AC | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGAAdditional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART Mounting Type: Surface Mount Package / Case: 432-TFBGA Packaging: Tray Part Status: Active Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (3) Ethernet: 10/100Mbps (1) Supplier Device Package: 432-MAPBGA (13x13) Voltage - I/O: 1.2V, 1.8V, 3.0V Core Processor: ARM® Cortex®-A9 Operating Temperature: 0°C ~ 95°C (TJ) Speed: 1.0GHz |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. | ||||||||||||||||
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MCIMX6L8DVN10ACR | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGAAdditional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART Part Status: Active Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (3) Ethernet: 10/100Mbps (1) Supplier Device Package: 432-MAPBGA (13x13) Voltage - I/O: 1.2V, 1.8V, 3.0V Core Processor: ARM® Cortex®-A9 Operating Temperature: 0°C ~ 95°C (TJ) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 432-TFBGA Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||||
| MHT1005HSR3 | NXP USA Inc. |
Description: IC LDMOS TRANS 120V NI-780S Packaging: Tape & Reel (TR) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MHT1005HSR3 | NXP USA Inc. |
Description: IC LDMOS TRANS 120V NI-780S Packaging: Bulk Part Status: Obsolete |
на замовлення 1750 шт: термін постачання 21-31 дні (днів) |
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| TEF7094AHN/V205Y | NXP USA Inc. |
Description: TEF7094AHN Packaging: Tape & Reel (TR) Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 6000 шт В кошику од. на суму грн. | |||||||||||||||||
|
BSC9131NJE1HHHB | NXP USA Inc. |
Description: IC MPU QORIQ 800MHZ 520FCBGA Part Status: Obsolete Security Features: Boot Security, Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 520-FCBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: -40°C ~ 105°C (TA) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 520-FBGA, FCBGA Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MK10DX64VFM5 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32QFNPackaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 10x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, IrDA, SPI, UART/USART Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Part Status: Active Number of I/O: 24 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
| BGA2031/1,115 |
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Виробник: NXP USA Inc.
Description: IC RF AMP CDMA 1.8GHZ 6TSSOP
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Test Frequency: 1.9GHz
Current - Supply: 37mA ~ 63mA
Gain: 23dB
Voltage - Supply: 3V ~ 3.3V
RF Type: CDMA, PCS
Frequency: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
Description: IC RF AMP CDMA 1.8GHZ 6TSSOP
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Test Frequency: 1.9GHz
Current - Supply: 37mA ~ 63mA
Gain: 23dB
Voltage - Supply: 3V ~ 3.3V
RF Type: CDMA, PCS
Frequency: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| SL3S1203FTB0,115 |
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Виробник: NXP USA Inc.
Description: IC RFID TRANSP 840-960MHZ XSON6
Part Status: Obsolete
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Standards: ISO 18000-6, EPC
Voltage - Supply: 1.8V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 840MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
Description: IC RFID TRANSP 840-960MHZ XSON6
Part Status: Obsolete
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Standards: ISO 18000-6, EPC
Voltage - Supply: 1.8V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 840MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
на замовлення 1344860 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1975+ | 11.13 грн |
| IP4221CZ6-XS132 |
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на замовлення 114407 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 6662+ | 3.87 грн |
| MKL43Z256VLH4557 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Number of I/O: 50
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 18x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Number of I/O: 50
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 18x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| LFMAK44PT3M |
Виробник: NXP USA Inc.
Description: NXP MPC5744P NEXUS DEBUG BOARD
Part Status: Active
Packaging: Bulk
Utilized IC / Part: MPC5744P
Module/Board Type: Adapter Board
For Use With/Related Products: MPC5744P
Description: NXP MPC5744P NEXUS DEBUG BOARD
Part Status: Active
Packaging: Bulk
Utilized IC / Part: MPC5744P
Module/Board Type: Adapter Board
For Use With/Related Products: MPC5744P
товару немає в наявності
В кошику
од. на суму грн.
| LPC4320FBD144,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 716 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 864.02 грн |
| 10+ | 653.08 грн |
| 60+ | 575.26 грн |
| 120+ | 520.10 грн |
| 300+ | 499.24 грн |
| 540+ | 488.42 грн |
| BSC9131NXE1KHKB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Box
Description: IC MPU QORIQ 800MHZ 520FCBGA
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Box
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| KIT50XS4200EKEVB |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC50XS4200
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC50XS4200
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Description: EVAL BOARD FOR MC50XS4200
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC50XS4200
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
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В кошику
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| T1022NSE7PQB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L/4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L/4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
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| SA56004AD,118 |
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Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Active
Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 2500 шт
В кошику
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| SA56004ED,118 |
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Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Active
Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 2500 шт
В кошику
од. на суму грн.
| SA56004CD,112 |
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Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
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В кошику
од. на суму грн.
| SA56004FD,112 |
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Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
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В кошику
од. на суму грн.
| MCIMX253CJM4A |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPI, SSI, SSP, UART
Part Status: Active
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPI, SSI, SSP, UART
Part Status: Active
на замовлення 434 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1895.42 грн |
| 10+ | 1471.00 грн |
| 25+ | 1382.48 грн |
| 100+ | 1206.11 грн |
| MCIMX253DJM4 |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
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| MCIMX253CJM4 |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
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| MCIMX253CVM4 |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
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| P3T1085UK-ARD |
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Виробник: NXP USA Inc.
Description: P3T1085UK ARD SHIELD EVAL BOARD
Packaging: Box
Function: Temperature
Type: Sensor
Contents: Board(s)
Utilized IC / Part: P3T1085UK
Part Status: Active
Description: P3T1085UK ARD SHIELD EVAL BOARD
Packaging: Box
Function: Temperature
Type: Sensor
Contents: Board(s)
Utilized IC / Part: P3T1085UK
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1383.21 грн |
| P3T1085UKAZ |
Виробник: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Features: Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA, WLCSP
Output Type: 2-Wire Serial, I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 6-WLCSP (1.18x.84)
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Active
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Features: Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA, WLCSP
Output Type: 2-Wire Serial, I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 6-WLCSP (1.18x.84)
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Active
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| P3T1085UKZ |
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Виробник: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Features: Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA, WLCSP
Output Type: 2-Wire Serial, I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 6-WLCSP (1.18x.84)
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Active
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Features: Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA, WLCSP
Output Type: 2-Wire Serial, I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 6-WLCSP (1.18x.84)
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 15000 шт
В кошику
од. на суму грн.
| TDA8035HN/C1,151 |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply: 1.8V, 3V, 5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Description: IC INTFACE SPECIALIZED 32HVQFN
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply: 1.8V, 3V, 5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
на замовлення 160 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 81.37 грн |
| 10+ | 56.79 грн |
| 25+ | 51.43 грн |
| 100+ | 42.70 грн |
| TDA8035HN/C1,118 |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply: 2.7V ~ 5.5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC INTFACE SPECIALIZED 32HVQFN
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply: 2.7V ~ 5.5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
на замовлення 6005 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 82.14 грн |
| 10+ | 57.23 грн |
| 25+ | 51.82 грн |
| 100+ | 43.02 грн |
| 250+ | 40.34 грн |
| 500+ | 38.72 грн |
| 1000+ | 36.78 грн |
| 2500+ | 35.40 грн |
| TDA8029HL/C207151 |
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, 8051 CPU
Packaging: Bulk
Part Status: Active
Description: MICROCONTROLLER, 8 BIT, 8051 CPU
Packaging: Bulk
Part Status: Active
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| TDA8023TT/C1 |
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Виробник: NXP USA Inc.
Description: IC SMART CARD INTERFACE 28-TSSOP
Packaging: Bulk
Part Status: Active
Description: IC SMART CARD INTERFACE 28-TSSOP
Packaging: Bulk
Part Status: Active
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| NTSX2102TLH |
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Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 5.5 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 5.5 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4000+ | 33.09 грн |
| NTSX2102TLH |
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Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 5.5 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 5.5 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 4823 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 68.97 грн |
| 10+ | 48.13 грн |
| 25+ | 43.46 грн |
| 100+ | 35.92 грн |
| 250+ | 33.60 грн |
| 500+ | 32.21 грн |
| 1000+ | 30.80 грн |
| NTS0101GM,115 |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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| NTS0101GM,115 |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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| LPC2368FBD100,518 |
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Виробник: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Supplier Device Package: 100-LQFP (14x14)
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM7TDMI-S
Data Converters: A/D 6x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 70
Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, SSP, UART/USART, USB
Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Supplier Device Package: 100-LQFP (14x14)
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM7TDMI-S
Data Converters: A/D 6x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 70
Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, SSP, UART/USART, USB
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| TJA1021TK/20/S1Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 6000 шт
В кошику
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| MPF5030BMDA0ES |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, S32, NON-PR
Applications: System Basis Chip
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-PowerVFQFN
Packaging: Tray
Voltage - Supply: 3.3V ~ 5.25V
Part Status: Active
Supplier Device Package: 40-HVQFN (6x6)
Description: POWER MANAGEMENT IC, S32, NON-PR
Applications: System Basis Chip
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-PowerVFQFN
Packaging: Tray
Voltage - Supply: 3.3V ~ 5.25V
Part Status: Active
Supplier Device Package: 40-HVQFN (6x6)
на замовлення 420 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 356.46 грн |
| 10+ | 304.30 грн |
| 25+ | 290.13 грн |
| 40+ | 265.71 грн |
| 80+ | 256.31 грн |
| 230+ | 245.11 грн |
| DSC-MULTILINK |
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Виробник: NXP USA Inc.
Description: DSC MULTILINK
Packaging: Box
For Use With/Related Products: MCU
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Active
Utilized IC / Part: MCU
Description: DSC MULTILINK
Packaging: Box
For Use With/Related Products: MCU
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Active
Utilized IC / Part: MCU
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 8001.70 грн |
| PCA9411AUKZ |
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Виробник: NXP USA Inc.
Description: IC REG BOOST 5.25V 500MA 9WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Up
Current - Output: 500mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 3MHz
Voltage - Input (Max): 5.25V
Topology: Boost
Supplier Device Package: 9-WLCSP (1.24x1.24)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 5.25V
Part Status: Active
Description: IC REG BOOST 5.25V 500MA 9WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Up
Current - Output: 500mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 3MHz
Voltage - Input (Max): 5.25V
Topology: Boost
Supplier Device Package: 9-WLCSP (1.24x1.24)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 5.25V
Part Status: Active
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| NX1WP10Z |
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Виробник: NXP USA Inc.
Description: IC WIRELESS PWR RECEIVER WLCSP42
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Wireless Power Receiver
Supplier Device Package: 42-WLCSP (3.56x3.41)
Part Status: Obsolete
Description: IC WIRELESS PWR RECEIVER WLCSP42
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Wireless Power Receiver
Supplier Device Package: 42-WLCSP (3.56x3.41)
Part Status: Obsolete
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| BB131 |
Виробник: NXP USA Inc.
Description: VARIABLE CAPACITANCE DIODE, VERY
Capacitance Ratio: 16
Voltage - Peak Reverse (Max): 30 V
Part Status: Active
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C0.5/C28
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
Description: VARIABLE CAPACITANCE DIODE, VERY
Capacitance Ratio: 16
Voltage - Peak Reverse (Max): 30 V
Part Status: Active
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C0.5/C28
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
на замовлення 547000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3572+ | 10.85 грн |
| KW45B41Z82AFTBR |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Description: IC RF TXRX+MCU BLE 48HVQFN
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
товару немає в наявності
Мінімальне замовлення: 2000 шт
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| KW45B41Z83AFPBT |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Description: IC RF TXRX+MCU BLE 40HVQFN
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
товару немає в наявності
Мінімальне замовлення: 490 шт
В кошику
од. на суму грн.
| KW45B41Z52AFTBT |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Description: IC RF TXRX+MCU BLE 48HVQFN
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| KW45B41Z82AFTBT |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Description: IC RF TXRX+MCU BLE 48HVQFN
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| KW45B41Z52AFPBT |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Description: IC RF TXRX+MCU BLE 40HVQFN
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
товару немає в наявності
Мінімальне замовлення: 490 шт
В кошику
од. на суму грн.
| KW45B41Z83AFTBR |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Description: IC RF TXRX+MCU BLE 48HVQFN
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| KW45B41Z83AFPBR |
![]() |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Grade: Automotive
Qualification: AEC-Q100
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Description: IC RF TXRX+MCU BLE 40HVQFN
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Grade: Automotive
Qualification: AEC-Q100
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| KW45B41Z82AFPBR |
![]() |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Description: IC RF TXRX+MCU BLE 40HVQFN
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| KW45B41Z53AFTBR |
![]() |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| KW45B41Z53AFTBT |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Packaging: Tray
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Qualification: AEC-Q100
Grade: Automotive
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Packaging: Tray
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Qualification: AEC-Q100
Grade: Automotive
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| KW45B41Z82AFPBT |
![]() |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Part Status: Active
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Description: IC RF TXRX+MCU BLE 40HVQFN
Part Status: Active
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
товару немає в наявності
Мінімальне замовлення: 490 шт
В кошику
од. на суму грн.
| KW45B41Z83AFTBT |
![]() |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Packaging: Tray
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Packaging: Tray
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| KW45B41Z52AFTBR |
![]() |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Packaging: Tape & Reel (TR)
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Packaging: Tape & Reel (TR)
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| KW45B41Z53AFPBT |
![]() |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Part Status: Active
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Description: IC RF TXRX+MCU BLE 40HVQFN
Part Status: Active
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
товару немає в наявності
Мінімальне замовлення: 490 шт
В кошику
од. на суму грн.
| KW45B41Z-EVK |
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Виробник: NXP USA Inc.
Description: KW45B41Z-EVK
Utilized IC / Part: KW45B41Z
Contents: Board(s)
Packaging: Bulk
Supplied Contents: Board(s)
Frequency: 2.4GHz
Part Status: Active
Type: Transceiver; Bluetooth® 5.x (BLE)
For Use With/Related Products: KW45B41Z
Description: KW45B41Z-EVK
Utilized IC / Part: KW45B41Z
Contents: Board(s)
Packaging: Bulk
Supplied Contents: Board(s)
Frequency: 2.4GHz
Part Status: Active
Type: Transceiver; Bluetooth® 5.x (BLE)
For Use With/Related Products: KW45B41Z
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 10459.70 грн |
| MD7IC2755GNR1 |
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Виробник: NXP USA Inc.
Description: IC RF AMP WIMAX 2.7GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 28V
Gain: 25dB
Current - Supply: 275mA
P1dB: 44.8dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-270 WB-14 GULL
Part Status: Obsolete
Description: IC RF AMP WIMAX 2.7GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 28V
Gain: 25dB
Current - Supply: 275mA
P1dB: 44.8dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-270 WB-14 GULL
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| MK11DX128VMC5 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
Number of I/O: 64
Part Status: Obsolete
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
Number of I/O: 64
Part Status: Obsolete
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
товару немає в наявності
В кошику
од. на суму грн.
| SP5748CBK0AVKU2R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| MCIMX6L8DVN10AC |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tray
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tray
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
товару немає в наявності
Мінімальне замовлення: 800 шт
В кошику
од. на суму грн.
| MCIMX6L8DVN10ACR |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tape & Reel (TR)
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| MHT1005HSR3 |
Виробник: NXP USA Inc.
Description: IC LDMOS TRANS 120V NI-780S
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC LDMOS TRANS 120V NI-780S
Packaging: Tape & Reel (TR)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| MHT1005HSR3 |
на замовлення 1750 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 38+ | 1046.13 грн |
| BSC9131NJE1HHHB |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Box
Description: IC MPU QORIQ 800MHZ 520FCBGA
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Box
товару немає в наявності
В кошику
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| MK10DX64VFM5 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.





























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