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BZX79-C36143 BZX79-C36143 NXP USA Inc. BZX79.pdf Description: NOW NEXPERIA BZX79-C36 - ZENER D
Part Status: Active
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 36 V
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
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S32G-VNP-RDB3 S32G-VNP-RDB3 NXP USA Inc. RMS32G-VNP-RDB3.pdf Description: VEHICLE NETWORKING REFERENCE DES
Part Status: Active
Utilized IC / Part: S32G3
Board Type: Single Board Computers (SBC)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Box
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BF1108,215 BF1108,215 NXP USA Inc. PHGLS15576-1.pdf?t.download=true&u=5oefqw Description: BF1108 - SILICON RF SWITCHES
Packaging: Bulk
Part Status: Active
на замовлення 11230 шт:
термін постачання 21-31 дні (днів)
1082+22.15 грн
Мінімальне замовлення: 1082
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S912ZVC64AMKHR S912ZVC64AMKHR NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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S912ZVC64AMKH S912ZVC64AMKH NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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S912ZVCA19AMKH S912ZVCA19AMKH NXP USA Inc. Description: IC MCU 16BIT 192KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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S912ZVC12F0MKHR S912ZVC12F0MKHR NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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S912ZVC19F0MKH S912ZVC19F0MKH NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 192KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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S912ZVC19F0MKHR S912ZVC19F0MKHR NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 192KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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S912ZVC12F0MKH S912ZVC12F0MKH NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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N74F574D,623 N74F574D,623 NXP USA Inc. 74F573,4.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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N74F574D,623 N74F574D,623 NXP USA Inc. 74F573,4.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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N74F574D,623 N74F574D,623 NXP USA Inc. 74F573,4.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
на замовлення 8695 шт:
термін постачання 21-31 дні (днів)
1924+12.66 грн
Мінімальне замовлення: 1924
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N74F574D,602 N74F574D,602 NXP USA Inc. 74F573,4.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
на замовлення 4750 шт:
термін постачання 21-31 дні (днів)
1776+12.26 грн
Мінімальне замовлення: 1776
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SAF7751HV/N205/SCK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Part Status: Obsolete
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MPC8309VMAHFCA MPC8309VMAHFCA NXP USA Inc. MPC8309EC.pdf Description: IC MPU MPC83XX 417MHZ 489BGA
Part Status: Obsolete
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 417MHz
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LM75B-PCT2202 NXP USA Inc. Description: LM75B-PCT2202
Part Status: Last Time Buy
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Resolution: 11 b
Sensor Type: Digital, Local
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -55°C ~ 125°C (TA)
Output Type: I2C
Features: Programmable Limit, Shutdown Mode
Packaging: Bulk
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KCHC908GR8MFAE NXP USA Inc. Description: IC MCU
Packaging: Bulk
Part Status: Last Time Buy
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MIMXRT1021CAG4BR MIMXRT1021CAG4BR NXP USA Inc. IMXRT1020IEC.pdf Description: IC MCU 32BIT 96KB ROM 144LQFP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
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MIMXRT1021DAG5B MIMXRT1021DAG5B NXP USA Inc. IMXRT1020CEC.pdf Description: IC MCU 32BIT EXT MEM 144LQFP
RAM Size: 256K x 8
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Number of I/O: 96
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 19x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
DigiKey Programmable: Not Verified
на замовлення 49 шт:
термін постачання 21-31 дні (днів)
1+552.23 грн
10+411.79 грн
25+381.87 грн
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MIMXRT1021DAF5B MIMXRT1021DAF5B NXP USA Inc. IMXRT1020CEC.pdf Description: IC MCU 32BIT EXT MEM 100LQFP
Number of I/O: 57
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 256K x 8
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
на замовлення 266 шт:
термін постачання 21-31 дні (днів)
1+552.23 грн
10+412.01 грн
25+382.09 грн
100+327.67 грн
250+312.93 грн
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MIMXRT1021CAG4B MIMXRT1021CAG4B NXP USA Inc. IMXRT1020IEC.pdf Description: IC MCU 32BIT EXT MEM 144LQFP
Number of I/O: 96
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 19x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 256K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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MIMXRT1021CAF4B MIMXRT1021CAF4B NXP USA Inc. IMXRT1020IEC.pdf Description: IC MCU 32BIT EXT MEM 100LQFP
Number of I/O: 57
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 256K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
на замовлення 970 шт:
термін постачання 21-31 дні (днів)
1+530.87 грн
10+395.71 грн
25+366.79 грн
100+314.35 грн
250+300.10 грн
500+291.52 грн
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1PS300/ZLX 1PS300/ZLX NXP USA Inc. Description: DIODE SW 85V 170MA SC-70
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA
Voltage - DC Reverse (Vr) (Max): 85 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SC-70
Current - Average Rectified (Io) (per Diode): 170mA (DC)
Diode Configuration: 1 Pair Common Anode
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
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MC33981ADHFK MC33981ADHFK NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled, Status Flag, Watchdog Timer
Packaging: Tray
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off, PWM
Switch Type: Relay, Solenoid Driver
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 6mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 4.5V ~ 27V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
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MC33981ADHFKR2 MC33981ADHFKR2 NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled, Status Flag, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off, PWM
Switch Type: Relay, Solenoid Driver
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 6mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 4.5V ~ 27V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
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MC56F8322MFAE MC56F8322MFAE NXP USA Inc. MC56F8322.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 6K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: CANbus, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 21
DigiKey Programmable: Verified
на замовлення 438 шт:
термін постачання 21-31 дні (днів)
1+1856.07 грн
10+1438.62 грн
25+1351.51 грн
100+1178.45 грн
250+1135.61 грн
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74LVC1G175GN,132 74LVC1G175GN,132 NXP USA Inc. PHGLS28855-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 6XSON
Number of Bits per Element: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Supplier Device Package: 6-XSON (0.9x1)
Input Capacitance: 2.5 pF
Clock Frequency: 200 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 32mA
Current - Quiescent (Iq): 40 µA
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 6-XFDFN
Packaging: Bulk
на замовлення 94945 шт:
термін постачання 21-31 дні (днів)
2882+7.54 грн
Мінімальне замовлення: 2882
В кошику  од. на суму  грн.
LS1023ASN8PQB LS1023ASN8PQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
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T2081NSN8P1B NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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CBTL04DP211BS,518 CBTL04DP211BS,518 NXP USA Inc. CBTL04DP211.pdf Description: IC VIDEO MULTIPLEXER 32HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (3x6)
Applications: Video Display
Voltage - Supply: 3.0V ~ 3.6V
Function: Multiplexer
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
на замовлення 81045 шт:
термін постачання 21-31 дні (днів)
311+76.74 грн
Мінімальне замовлення: 311
В кошику  од. на суму  грн.
TDF19971AHN/C1,551 NXP USA Inc. Description: IC VIDEO SILICON TUNER
Part Status: Obsolete
Packaging: Bulk
товару немає в наявності
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FRDM-33664AEVM NXP USA Inc. KT33664AEVBUG.pdf Description: FREEDOM EXPANSION BOARD - MC3366
Packaging: Bulk
Part Status: Obsolete
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Utilized IC / Part: MC33664
Type: Power Management
Function: Battery Cell Controller
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FS32K148HET0MMHT FS32K148HET0MMHT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: I²S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
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KIT908-5643EVM NXP USA Inc. MC33907_8.pdf Description: MC33908MB AND MPC5643 DAUGHTER B
Part Status: Active
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Utilized IC / Part: MC33908, MPC564xL
Type: Interface
Function: System Basis Chip (SBC)
Packaging: Bulk
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LFMAJ43LT3LT NXP USA Inc. Description: QORIVVA MPC5643L 257 PIN 0.8MM P
Part Status: Active
Packaging: Bulk
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LFMAJ43LT3A NXP USA Inc. Description: QORIVVA MPC5643L 257 PIN 0.8MM P
Part Status: Active
Packaging: Bulk
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NTS0102TL-Q100H NTS0102TL-Q100H NXP USA Inc. NTS0102.pdf Description: IC XLTR VL BIDIR 8-XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
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NTS0102TL-Q100H NTS0102TL-Q100H NXP USA Inc. NTS0102.pdf Description: IC XLTR VL BIDIR 8-XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
на замовлення 3666 шт:
термін постачання 21-31 дні (днів)
5+68.04 грн
10+47.31 грн
25+42.69 грн
100+35.28 грн
250+33.00 грн
500+31.63 грн
1000+30.00 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
NTS0102TLH NTS0102TLH NXP USA Inc. NTS0102.pdf Description: IC XLTR VL BIDIR 8-XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)
4000+28.38 грн
8000+26.72 грн
Мінімальне замовлення: 4000
В кошику  од. на суму  грн.
NTS0102TLH NTS0102TLH NXP USA Inc. NTS0102.pdf Description: IC XLTR VL BIDIR 8-XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 8176 шт:
термін постачання 21-31 дні (днів)
6+61.71 грн
10+42.66 грн
25+38.37 грн
100+31.61 грн
250+29.51 грн
500+28.25 грн
1000+26.76 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
RDW8897-SDSD-S1 NXP USA Inc. Description: RDW8897-SDSD-S1
Packaging: Bulk
Part Status: Active
товару немає в наявності
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MPC8260AVVMHBB MPC8260AVVMHBB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Bulk
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
2+17801.56 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MC56F8155VFGE MC56F8155VFGE NXP USA Inc. MC56F8355.pdf Description: IC MCU 16BIT 256KB FLASH 128LQFP
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 128-LQFP (14x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 16
Program Memory Size: 256KB (128K x 16)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 128-LQFP
Packaging: Tray
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MC34903CP3EK MC34903CP3EK NXP USA Inc. MC34903,4,5.pdf Description: IC SWITCH HIGH SIDE 32SOIC
Part Status: Obsolete
Supplier Device Package: 32-SOIC-EP
Current - Supply: 2mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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MC9S12C64CFUE MC9S12C64CFUE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 60
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
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FXTH87EH026T1 FXTH87EH026T1 NXP USA Inc. FXTH87ERM.pdf Description: SENSOR TIRE PRESSURE RF OUTPUT
Output Type: RF
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Sensor Type: Tire Pressure Monitoring (TPMS)
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FXTH87EH026T1 FXTH87EH026T1 NXP USA Inc. FXTH87ERM.pdf Description: SENSOR TIRE PRESSURE RF OUTPUT
Part Status: Obsolete
Sensor Type: Tire Pressure Monitoring (TPMS)
Output Type: RF
Packaging: Cut Tape (CT)
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MC9S12DT256MFUE MC9S12DT256MFUE NXP USA Inc. 9S12DT256DGV3.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
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SAF7751HV/N208WY NXP USA Inc. Description: MULTI-TUNER CAR RADIO & AUDIO ON
Part Status: Active
Packaging: Bulk
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SAF7751HV/N208WK NXP USA Inc. Description: MULTI-TUNER CAR RADIO & AUDIO ON
Part Status: Active
Packaging: Tray
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SPC5744PK1MLQ9R SPC5744PK1MLQ9R NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Number of I/O: 79
Part Status: Obsolete
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 384K x 8
Program Memory Size: 2.5MB (2.5M x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Operating Temperature: -40°C ~ 125°C (TA)
DigiKey Programmable: Not Verified
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S912XEQ512F0CAL S912XEQ512F0CAL NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
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SPC5604ESF2VLH SPC5604ESF2VLH NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 64LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 4x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Number of I/O: 39
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LPC1112FHI33/102 NXP USA Inc. Description: IC MCU 32BIT 16KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
на замовлення 9790 шт:
термін постачання 21-31 дні (днів)
205+195.42 грн
Мінімальне замовлення: 205
В кошику  од. на суму  грн.
SL3S1014FUD/BG1Z NXP USA Inc. SL3S10X4.pdf Description: IC TRANSPONDER UCODE FFC DIE
Part Status: Active
Packaging: Bulk
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SAF775CHN/N208Z/DK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 184-VQFN Multi Row, Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 184-HVQFN (12x12)
Part Status: Obsolete
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SAF775CHN/N208ZCMP NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 184-VQFN Multi Row, Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 184-HVQFN (12x12)
Part Status: Obsolete
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P2041NSN7PNAC P2041NSN7PNAC NXP USA Inc. P2040_Rev2.pdf Description: IC MPU QORIQ P2 1.5GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
Part Status: Obsolete
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74LVT244ADB,112-NXP 74LVT244ADB,112-NXP NXP USA Inc. Description: IC BUFFER NON-INVERT 3.6V 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
Part Status: Active
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BZX79-C36143 BZX79.pdf
BZX79-C36143
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C36 - ZENER D
Part Status: Active
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 36 V
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
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S32G-VNP-RDB3 RMS32G-VNP-RDB3.pdf
S32G-VNP-RDB3
Виробник: NXP USA Inc.
Description: VEHICLE NETWORKING REFERENCE DES
Part Status: Active
Utilized IC / Part: S32G3
Board Type: Single Board Computers (SBC)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Box
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BF1108,215 PHGLS15576-1.pdf?t.download=true&u=5oefqw
BF1108,215
Виробник: NXP USA Inc.
Description: BF1108 - SILICON RF SWITCHES
Packaging: Bulk
Part Status: Active
на замовлення 11230 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1082+22.15 грн
Мінімальне замовлення: 1082
В кошику  од. на суму  грн.
S912ZVC64AMKHR
S912ZVC64AMKHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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S912ZVC64AMKH
S912ZVC64AMKH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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S912ZVCA19AMKH
S912ZVCA19AMKH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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S912ZVC12F0MKHR S12ZVCFS.pdf
S912ZVC12F0MKHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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S912ZVC19F0MKH S12ZVCFS.pdf
S912ZVC19F0MKH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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S912ZVC19F0MKHR S12ZVCFS.pdf
S912ZVC19F0MKHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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S912ZVC12F0MKH S12ZVCFS.pdf
S912ZVC12F0MKH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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N74F574D,623 74F573,4.pdf
N74F574D,623
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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N74F574D,623 74F573,4.pdf
N74F574D,623
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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N74F574D,623 74F573,4.pdf
N74F574D,623
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
на замовлення 8695 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1924+12.66 грн
Мінімальне замовлення: 1924
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N74F574D,602 74F573,4.pdf
N74F574D,602
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
на замовлення 4750 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1776+12.26 грн
Мінімальне замовлення: 1776
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SAF7751HV/N205/SCK
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Part Status: Obsolete
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MPC8309VMAHFCA MPC8309EC.pdf
MPC8309VMAHFCA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 417MHZ 489BGA
Part Status: Obsolete
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 417MHz
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LM75B-PCT2202
Виробник: NXP USA Inc.
Description: LM75B-PCT2202
Part Status: Last Time Buy
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Resolution: 11 b
Sensor Type: Digital, Local
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -55°C ~ 125°C (TA)
Output Type: I2C
Features: Programmable Limit, Shutdown Mode
Packaging: Bulk
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KCHC908GR8MFAE
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Part Status: Last Time Buy
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MIMXRT1021CAG4BR IMXRT1020IEC.pdf
MIMXRT1021CAG4BR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 144LQFP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
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MIMXRT1021DAG5B IMXRT1020CEC.pdf
MIMXRT1021DAG5B
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 144LQFP
RAM Size: 256K x 8
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Number of I/O: 96
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 19x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
DigiKey Programmable: Not Verified
на замовлення 49 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+552.23 грн
10+411.79 грн
25+381.87 грн
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MIMXRT1021DAF5B IMXRT1020CEC.pdf
MIMXRT1021DAF5B
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Number of I/O: 57
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 256K x 8
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
на замовлення 266 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+552.23 грн
10+412.01 грн
25+382.09 грн
100+327.67 грн
250+312.93 грн
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MIMXRT1021CAG4B IMXRT1020IEC.pdf
MIMXRT1021CAG4B
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 144LQFP
Number of I/O: 96
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 19x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 256K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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MIMXRT1021CAF4B IMXRT1020IEC.pdf
MIMXRT1021CAF4B
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Number of I/O: 57
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 256K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
на замовлення 970 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+530.87 грн
10+395.71 грн
25+366.79 грн
100+314.35 грн
250+300.10 грн
500+291.52 грн
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1PS300/ZLX
1PS300/ZLX
Виробник: NXP USA Inc.
Description: DIODE SW 85V 170MA SC-70
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA
Voltage - DC Reverse (Vr) (Max): 85 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SC-70
Current - Average Rectified (Io) (per Diode): 170mA (DC)
Diode Configuration: 1 Pair Common Anode
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
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MC33981ADHFK
MC33981ADHFK
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled, Status Flag, Watchdog Timer
Packaging: Tray
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off, PWM
Switch Type: Relay, Solenoid Driver
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 6mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 4.5V ~ 27V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
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MC33981ADHFKR2
MC33981ADHFKR2
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled, Status Flag, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off, PWM
Switch Type: Relay, Solenoid Driver
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 6mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 4.5V ~ 27V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
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MC56F8322MFAE MC56F8322.pdf
MC56F8322MFAE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 6K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: CANbus, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 21
DigiKey Programmable: Verified
на замовлення 438 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1856.07 грн
10+1438.62 грн
25+1351.51 грн
100+1178.45 грн
250+1135.61 грн
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74LVC1G175GN,132 PHGLS28855-1.pdf?t.download=true&u=5oefqw
74LVC1G175GN,132
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Number of Bits per Element: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Supplier Device Package: 6-XSON (0.9x1)
Input Capacitance: 2.5 pF
Clock Frequency: 200 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 32mA
Current - Quiescent (Iq): 40 µA
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 6-XFDFN
Packaging: Bulk
на замовлення 94945 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2882+7.54 грн
Мінімальне замовлення: 2882
В кошику  од. на суму  грн.
LS1023ASN8PQB LS1043AFS.pdf
LS1023ASN8PQB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
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T2081NSN8P1B T2080FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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CBTL04DP211BS,518 CBTL04DP211.pdf
CBTL04DP211BS,518
Виробник: NXP USA Inc.
Description: IC VIDEO MULTIPLEXER 32HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (3x6)
Applications: Video Display
Voltage - Supply: 3.0V ~ 3.6V
Function: Multiplexer
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
на замовлення 81045 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
311+76.74 грн
Мінімальне замовлення: 311
В кошику  од. на суму  грн.
TDF19971AHN/C1,551
Виробник: NXP USA Inc.
Description: IC VIDEO SILICON TUNER
Part Status: Obsolete
Packaging: Bulk
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FRDM-33664AEVM KT33664AEVBUG.pdf
Виробник: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD - MC3366
Packaging: Bulk
Part Status: Obsolete
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Utilized IC / Part: MC33664
Type: Power Management
Function: Battery Cell Controller
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FS32K148HET0MMHT S32K-DS.pdf
FS32K148HET0MMHT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: I²S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
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KIT908-5643EVM MC33907_8.pdf
Виробник: NXP USA Inc.
Description: MC33908MB AND MPC5643 DAUGHTER B
Part Status: Active
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Utilized IC / Part: MC33908, MPC564xL
Type: Interface
Function: System Basis Chip (SBC)
Packaging: Bulk
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LFMAJ43LT3LT
Виробник: NXP USA Inc.
Description: QORIVVA MPC5643L 257 PIN 0.8MM P
Part Status: Active
Packaging: Bulk
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LFMAJ43LT3A
Виробник: NXP USA Inc.
Description: QORIVVA MPC5643L 257 PIN 0.8MM P
Part Status: Active
Packaging: Bulk
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NTS0102TL-Q100H NTS0102.pdf
NTS0102TL-Q100H
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
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NTS0102TL-Q100H NTS0102.pdf
NTS0102TL-Q100H
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
на замовлення 3666 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+68.04 грн
10+47.31 грн
25+42.69 грн
100+35.28 грн
250+33.00 грн
500+31.63 грн
1000+30.00 грн
Мінімальне замовлення: 5
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NTS0102TLH NTS0102.pdf
NTS0102TLH
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4000+28.38 грн
8000+26.72 грн
Мінімальне замовлення: 4000
В кошику  од. на суму  грн.
NTS0102TLH NTS0102.pdf
NTS0102TLH
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 8176 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+61.71 грн
10+42.66 грн
25+38.37 грн
100+31.61 грн
250+29.51 грн
500+28.25 грн
1000+26.76 грн
Мінімальне замовлення: 6
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RDW8897-SDSD-S1
Виробник: NXP USA Inc.
Description: RDW8897-SDSD-S1
Packaging: Bulk
Part Status: Active
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MPC8260AVVMHBB MPC8260A.pdf
MPC8260AVVMHBB
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Bulk
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+17801.56 грн
Мінімальне замовлення: 2
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MC56F8155VFGE MC56F8355.pdf
MC56F8155VFGE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 128LQFP
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 128-LQFP (14x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 16
Program Memory Size: 256KB (128K x 16)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 128-LQFP
Packaging: Tray
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MC34903CP3EK MC34903,4,5.pdf
MC34903CP3EK
Виробник: NXP USA Inc.
Description: IC SWITCH HIGH SIDE 32SOIC
Part Status: Obsolete
Supplier Device Package: 32-SOIC-EP
Current - Supply: 2mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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MC9S12C64CFUE MC9S12C128V1.pdf
MC9S12C64CFUE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 60
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
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FXTH87EH026T1 FXTH87ERM.pdf
FXTH87EH026T1
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Output Type: RF
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Sensor Type: Tire Pressure Monitoring (TPMS)
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FXTH87EH026T1 FXTH87ERM.pdf
FXTH87EH026T1
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Part Status: Obsolete
Sensor Type: Tire Pressure Monitoring (TPMS)
Output Type: RF
Packaging: Cut Tape (CT)
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MC9S12DT256MFUE 9S12DT256DGV3.pdf
MC9S12DT256MFUE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
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SAF7751HV/N208WY
Виробник: NXP USA Inc.
Description: MULTI-TUNER CAR RADIO & AUDIO ON
Part Status: Active
Packaging: Bulk
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SAF7751HV/N208WK
Виробник: NXP USA Inc.
Description: MULTI-TUNER CAR RADIO & AUDIO ON
Part Status: Active
Packaging: Tray
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SPC5744PK1MLQ9R
SPC5744PK1MLQ9R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Number of I/O: 79
Part Status: Obsolete
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 384K x 8
Program Memory Size: 2.5MB (2.5M x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Operating Temperature: -40°C ~ 125°C (TA)
DigiKey Programmable: Not Verified
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S912XEQ512F0CAL MC9S12XEPB.pdf
S912XEQ512F0CAL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
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SPC5604ESF2VLH
SPC5604ESF2VLH
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 4x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Number of I/O: 39
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LPC1112FHI33/102
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
на замовлення 9790 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
205+195.42 грн
Мінімальне замовлення: 205
В кошику  од. на суму  грн.
SL3S1014FUD/BG1Z SL3S10X4.pdf
Виробник: NXP USA Inc.
Description: IC TRANSPONDER UCODE FFC DIE
Part Status: Active
Packaging: Bulk
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SAF775CHN/N208Z/DK
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 184-VQFN Multi Row, Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 184-HVQFN (12x12)
Part Status: Obsolete
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SAF775CHN/N208ZCMP
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 184-VQFN Multi Row, Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 184-HVQFN (12x12)
Part Status: Obsolete
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P2041NSN7PNAC P2040_Rev2.pdf
P2041NSN7PNAC
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.5GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
Part Status: Obsolete
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74LVT244ADB,112-NXP
74LVT244ADB,112-NXP
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
Part Status: Active
товару немає в наявності
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