Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35301) > Сторінка 481 з 589
| Фото | Назва | Виробник | Інформація | Доступність | Ціна | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|   | MK11DX128VMC5 | NXP USA Inc. |  Description: IC MCU 32B 128KB FLASH 121MAPBGA Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 24x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Part Status: Obsolete Number of I/O: 64 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | SP5748CBK0AVKU2R | NXP USA Inc. | Description: IC MCU 32BIT 6MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | MCIMX6L8DVN10AC | NXP USA Inc. |  Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|  | MCIMX6L8DVN10ACR | NXP USA Inc. |  Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA Packaging: Tape & Reel (TR) Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| MHT1005HSR3 | NXP USA Inc. | Description: IC LDMOS TRANS 120V NI-780S Packaging: Tape & Reel (TR) Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | |||||||||||
| MHT1005HSR3 | NXP USA Inc. | Description: IC LDMOS TRANS 120V NI-780S Packaging: Bulk Part Status: Obsolete | на замовлення 1750 шт:термін постачання 21-31 дні (днів) | 
 | |||||||||||
| TEF7094AHN/V205Y | NXP USA Inc. | Description: TEF7094AHN Packaging: Tape & Reel (TR) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||
|   | BSC9131NJE1HHHB | NXP USA Inc. | Description: IC MPU QORIQ 800MHZ 520FCBGA Packaging: Box Package / Case: 520-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 520-FCBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| %20Renders/768_32-VQFN%20Exposed%20Pad.jpg)  | MK10DX64VFM5 | NXP USA Inc. |  Description: IC MCU 32BIT 64KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 10x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, IrDA, SPI, UART/USART Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Part Status: Active Number of I/O: 24 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | SSL1523P/N2,112 | NXP USA Inc. |  Description: IC LED DRIVER OFFL 2A 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Number of Outputs: 1 Frequency: 10kHz ~ 200kHz Type: AC DC Offline Switcher Operating Temperature: -40°C ~ 145°C (TJ) Applications: Lighting Current - Output / Channel: 2A Internal Switch(s): Yes Topology: Flyback Supplier Device Package: 8-DIP Voltage - Supply (Min): 80V Voltage - Supply (Max): 276V Part Status: Obsolete | на замовлення 11400 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
| X-PLUTUS-FAMPC16 | NXP USA Inc. | Description: PLUTUS-FAMPC16 Packaging: Bulk Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | |||||||||||
|   | SPC5746BK1AMMH2 | NXP USA Inc. |  Description: IC MCU 32BIT 3MB FLASH 100MAPBGA Packaging: Tray Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 3MB (3M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Supplier Device Package: 100-MAPBGA (11x11) Part Status: Active DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | MC34904C3EK | NXP USA Inc. |  Description: IC SWITCH HIGH SIDE Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Current - Supply: 2mA Supplier Device Package: 32-SOIC-EP Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | MC68HC908JL8CP | NXP USA Inc. |  Description: IC MCU 8BIT 8KB FLASH 28DIP Packaging: Tube Package / Case: 28-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 8MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 13x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI Peripherals: LED, LVD, POR, PWM Supplier Device Package: 28-PDIP Part Status: Obsolete Number of I/O: 23 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | BB131,115 | NXP USA Inc. |  Description: DIODE VHF VAR CAP 30V SOD323 Packaging: Tape & Reel (TR) Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz Capacitance Ratio Condition: C0.5/C28 Supplier Device Package: SOD-323 Part Status: Obsolete Voltage - Peak Reverse (Max): 30 V Capacitance Ratio: 16.0 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | BB131,115 | NXP USA Inc. |  Description: DIODE VHF VAR CAP 30V SOD323 Packaging: Cut Tape (CT) Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz Capacitance Ratio Condition: C0.5/C28 Supplier Device Package: SOD-323 Part Status: Obsolete Voltage - Peak Reverse (Max): 30 V Capacitance Ratio: 16.0 | на замовлення 2598 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
|  | MC13851EPR2 | NXP USA Inc. |  Description: IC RF AMP GPS 1GHZ-2.5GHZ 8MLPD Packaging: Tape & Reel (TR) Package / Case: 8-UFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 1GHz ~ 2.5GHz RF Type: General Purpose Voltage - Supply: 2.3V ~ 3V Gain: 16.4dB Current - Supply: 4.8mA Noise Figure: 1.1dB P1dB: 8dBm Test Frequency: 2.14GHz Supplier Device Package: 8-MLPD (2x2) Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | FS32V234CON2VUB | NXP USA Inc. |  Description: IC MPU FS32V23 1GHZ 621FCPBGA Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART Part Status: Active | на замовлення 679 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
|   | FS32V234CMN1VUB | NXP USA Inc. |  Description: IC MPU FS32V23 1GHZ 621FCPBGA Packaging: Bulk Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: 1Gbps Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART Part Status: Obsolete | на замовлення 5079 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
|   | SA605D/01,112 | NXP USA Inc. |  Description: RF RCVR ASK/FSK 0HZ-500MHZ 20SO Features: RSSI Equipped Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Frequency: 0Hz ~ 500MHz Modulation or Protocol: ASK, FSK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 8V Applications: FM Remote Receiver Current - Receiving: 5.7mA Antenna Connector: PCB, Surface Mount Supplier Device Package: 20-SO Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|  | 88W8997-A1-CBQE/AZ | NXP USA Inc. |  Description: IC RF TXRX BLE 161WLCSP Packaging: Tape & Reel (TR) Package / Case: 161-BGA, WLCSP Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Type: TxRx Only Protocol: 802.11ac, Bluetooth v5.1 Data Rate (Max): 2Mbps Supplier Device Package: 161-WLCSP RF Family/Standard: Bluetooth Serial Interfaces: PCM, SDIO, UART, USB Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | BUK9107-40ATC,118 | NXP USA Inc. |  Description: BUK9107-40ATC -  D2PAK Packaging: Bulk Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 6.2mOhm @ 50A, 10V FET Feature: Temperature Sensing Diode Power Dissipation (Max): 272W (Tc) Vgs(th) (Max) @ Id: 2V @ 1mA Supplier Device Package: SOT-426 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±15V Drain to Source Voltage (Vdss): 40 V Input Capacitance (Ciss) (Max) @ Vds: 5836 pF @ 25 V | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | PCMF3HDMI14SZ | NXP USA Inc. |  Description: CMC Packaging: Bulk Package / Case: 15-UFBGA, WLCSP Size / Dimension: 0.093" L x 0.046" W (2.37mm x 1.17mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 3Ohm, C = 0.25pF Height: 0.024" (0.60mm) Attenuation Value: 0.3dB @ 1MHz Filter Order: 2nd Applications: Data Lines for Mobile Devices Technology: LC Center / Cutoff Frequency: 6GHz (Cutoff) Resistance - Channel (Ohms): 3 ESD Protection: Yes Part Status: Active Number of Channels: 3 | на замовлення 4500 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
| XAUI-RISER-B | NXP USA Inc. |  Description: ETHERNET CARD PHY RISER P4080 Packaging: Bulk For Use With/Related Products: QorIQ™ Accessory Type: Interface Board Part Status: Active | на замовлення 2 шт:термін постачання 21-31 дні (днів) | 
 | |||||||||||
| SPC5748CSK0AMKU6 | NXP USA Inc. |  Description: IC MCU 32BIT 6MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz, 160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 48x10b, 16x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | |||||||||||
| SPC5748GHK0AMMN6 | NXP USA Inc. | Description: IC MCU 32BIT 6MB FLASH 324MAPBGA Packaging: Tray Package / Case: 324-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 324-MAPBGA (19x19) Part Status: Active Number of I/O: 246 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | |||||||||||
|   | SPC5748CK1MKU6R | NXP USA Inc. |  Description: IC MCU 32BIT 6MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | SPC5748CK1MMJ6R | NXP USA Inc. |  Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | SPC5748CBK0AVMJ6 | NXP USA Inc. | Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | SPC5748CK1MKU6 | NXP USA Inc. |  Description: IC MCU 32BIT 6MB FLASH 176LQFP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | PCF2123BS/1,512 | NXP USA Inc. |  Description: IC RTC CLK/CALENDAR SPI 16HVQFN Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer Packaging: Tube Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.6V ~ 5.5V Time Format: HH:MM:SS (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 16-HVQFN (3x3) Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V Part Status: Discontinued at Digi-Key DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | MC9RS08KB4CWJ | NXP USA Inc. |  Description: IC MCU 8BIT 4KB FLASH 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 126 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-SOIC Part Status: Last Time Buy Number of I/O: 18 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | MWE6IC9100NBR1 | NXP USA Inc. |  Description: IC RF AMP GSM 960MHZ TO272WB Packaging: Bulk Package / Case: TO-272-14 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 960MHz RF Type: GSM, EDGE Voltage - Supply: 28V Gain: 33.5dB Supplier Device Package: TO-272 WB-14 Part Status: Obsolete | на замовлення 465 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
|   | MC9S12XDP512VAG | NXP USA Inc. | Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 119 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | MKE02Z32VQH4 | NXP USA Inc. | Description: IC MCU 32BIT 32KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 64-QFP (14x14) Part Status: Active Number of I/O: 57 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | MC33596FJER2 | NXP USA Inc. |  Description: UHF RECEIVER Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Sensitivity: -104dBm Mounting Type: Surface Mount Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V Applications: General Data Transfer Current - Receiving: 10.3mA Data Rate (Max): 22.4kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 32-LQFP (5x5) Part Status: Not For New Designs | на замовлення 30000 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
| %20Renders/768_32-VQFN%20Exposed%20Pad.jpg)  | MC33596FCAER2 | NXP USA Inc. |  Description: RF RX FSK/OOK 304/315/426 32QFN Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Sensitivity: -104dBm Mounting Type: Surface Mount Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -20°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V Applications: General Data Transfer Current - Receiving: 10.3mA Data Rate (Max): 22.4kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 32-QFN-EP (5x5) Part Status: Not For New Designs | на замовлення 10000 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
| P5CD012X0/T0B38170 | NXP USA Inc. | Description: P5CD012X0/T0B38170 Packaging: Bulk Speed: 30MHz Program Memory Size: 200KB (200K x 8) RAM Size: 6K x 8 Operating Temperature: -25°C ~ 85°C Program Memory Type: ROM EEPROM Size: 12K x 8 Core Processor: Secure MX51 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.5V Connectivity: ISO 7816, ISO 14443, UART Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | |||||||||||
|   | MC908JL3ECPE | NXP USA Inc. |  Description: IC MCU 8BIT 4KB FLASH 28DIP Packaging: Tube Package / Case: 28-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 12x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V Peripherals: LED, LVD, POR, PWM Supplier Device Package: 28-PDIP Part Status: Obsolete Number of I/O: 23 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | FRDM-STBA-A8964 | NXP USA Inc. |  Description: DEV BOARD FXLS8964AF ACCEL Packaging: Bulk Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g Interface: I2C, Serial, SPI Voltage - Supply: 1.71V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: FXLS8964AF, K22 Supplied Contents: Board(s), Cable(s) Embedded: No Sensing Range: ±2g, 4g, 8g, 16g Part Status: Active | на замовлення 1 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
| LS1024ASN7MLA | NXP USA Inc. |  Description: LS1024 - QORIQ LAYERSCAPE 32-BIT Packaging: Bulk Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||
|   | BUK962R1-40E,118 | NXP USA Inc. |  Description: MOSFET N-CH 40V 120A D2PAK Packaging: Bulk Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V Power Dissipation (Max): 293W (Tc) Vgs(th) (Max) @ Id: 2.1V @ 1mA Supplier Device Package: D2PAK Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs (Max): ±10V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 87.8 nC @ 5 V Input Capacitance (Ciss) (Max) @ Vds: 13160 pF @ 25 V | на замовлення 3369 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
|   | T1024NSE7MQA | NXP USA Inc. |  Description: IC MPU QORIQ T1 1.2GHZ 780FBGA Packaging: Bulk Package / Case: 780-FBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FBGA (23x23) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART Part Status: Active | на замовлення 1063 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
|   | MMA8452QR1 | NXP USA Inc. |  Description: ACCELEROMETER 2-8G I2C 16QFN Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Output Type: I2C Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.95V ~ 3.6V Bandwidth: 0.78Hz ~ 400Hz Supplier Device Package: 16-QFN (3x3) Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g) Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | FXLS8964AFR1 | NXP USA Inc. |  Description: ACCELEROMETER 2-16G 10DFN Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor Packaging: Tape & Reel (TR) Package / Case: 10-VFDFN Output Type: I²C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g, 16g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.71V ~ 3.6V Bandwidth: 1.6kHz Supplier Device Package: 10-DFN (2x2) Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| FRDM-KW019032,598 | NXP USA Inc. | Description: FREEDOM BOARD FOR KW SERIES Packaging: Bulk For Use With/Related Products: KW0x Type: Transceiver; 802.15.4 Supplied Contents: Board(s), Cable(s) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||
|  | MCF54455VP266 | NXP USA Inc. |  Description: IC MCU 32BIT ROMLESS 360BGA Packaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 32K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I²C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-BGA (23x23) Part Status: Active Number of I/O: 132 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| KCF52211CAE80 | NXP USA Inc. | Description: IC MCU Packaging: Bulk Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | |||||||||||
|  | MK11DX256AVMC5 | NXP USA Inc. |  Description: IC MCU 32B 256KB FLASH 121MAPBGA Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 24x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, IrDA, SPI, UART/USART Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified | на замовлення 348 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
|   | 74HC7030N,652 | NXP USA Inc. |  Description: IC FIFO ASYNC/SYNC 64X9 28DIP Packaging: Tube Package / Case: 28-DIP (0.600", 15.24mm) Mounting Type: Through Hole Function: Asynchronous, Synchronous Memory Size: 576 (64 x 9) Operating Temperature: -40°C ~ 125°C Data Rate: 33MHz Access Time: 36ns Supplier Device Package: 28-DIP Bus Directional: Uni-Directional Expansion Type: Depth, Width Programmable Flags Support: No Retransmit Capability: No FWFT Support: No Part Status: Obsolete Voltage - Supply: 2 V ~ 6 V DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | MK50DX256ZCLL10 | NXP USA Inc. |  Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 34x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Not For New Designs Number of I/O: 59 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | LPC54605J256ET100E | NXP USA Inc. |  Description: IC MCU 32BIT 256KB FLSH 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
|   | PCA9539D,118 | NXP USA Inc. |  Description: IC XPNDR 400KHZ I2C SMBUS 24SO Features: POR Packaging: Bulk Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I²C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-SO Current - Output Source/Sink: 10mA, 25mA Part Status: Obsolete DigiKey Programmable: Not Verified | на замовлення 18136 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
|   | PCA9539D,112 | NXP USA Inc. |  Description: IC XPNDR 400KHZ I2C SMBUS 24SO Features: POR Packaging: Bulk Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I²C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-SO Current - Output Source/Sink: 10mA, 25mA Part Status: Obsolete DigiKey Programmable: Not Verified | на замовлення 6000 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
|   | 74AUP1G885GD125 | NXP USA Inc. |  Description: XOR GATE Packaging: Bulk Package / Case: 8-XFDFN Output Type: Single-Ended Mounting Type: Surface Mount Logic Type: Configurable Multiple Function Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Schmitt Trigger Input: No Supplier Device Package: 8-XSON (2x3) Part Status: Active Number of Circuits: 1 | на замовлення 3000 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
| T2080NXN8P1B | NXP USA Inc. |  Description: IC MPU QORIQ 1.533GHZ 896FCPBGA Packaging: Bulk Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active | на замовлення 28 шт:термін постачання 21-31 дні (днів) | 
 | |||||||||||
| T2080NXN8P1B | NXP USA Inc. |  Description: IC MPU QORIQ 1.533GHZ 896FCPBGA Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||
| T2080NXN8TTB | NXP USA Inc. |  Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||
|   | 1PS70SB16,115 | NXP USA Inc. | Description: DIODE SCHOTTKY 30V 200MA SOT323 Packaging: Bulk Part Status: Active | на замовлення 320700 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||
|   | 1PS70SB46,115 | NXP USA Inc. |  Description: DIODE SCHOTTKY 40V 120MA SOT323 Packaging: Bulk Part Status: Active | на замовлення 418659 шт:термін постачання 21-31 дні (днів) | 
 | 
| MK11DX128VMC5 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Obsolete
Number of I/O: 64
DigiKey Programmable: Not Verified
    Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Obsolete
Number of I/O: 64
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| SP5748CBK0AVKU2R | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
    Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
товару немає в наявності
    В кошику
     од. на суму     грн.
| MCIMX6L8DVN10AC |  | 
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Part Status: Active
    Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Part Status: Active
товару немає в наявності
    В кошику
     од. на суму     грн.
| MCIMX6L8DVN10ACR |  | 
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Part Status: Active
    Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Part Status: Active
товару немає в наявності
    В кошику
     од. на суму     грн.
| MHT1005HSR3 | 
Виробник: NXP USA Inc.
Description: IC LDMOS TRANS 120V NI-780S
Packaging: Tape & Reel (TR)
Part Status: Obsolete
    Description: IC LDMOS TRANS 120V NI-780S
Packaging: Tape & Reel (TR)
Part Status: Obsolete
товару немає в наявності
    В кошику
     од. на суму     грн.
| MHT1005HSR3 | 
на замовлення 1750 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 38+ | 1115.22 грн | 
| BSC9131NJE1HHHB | 
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Box
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
    Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Box
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
товару немає в наявності
    В кошику
     од. на суму     грн.
| MK10DX64VFM5 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| SSL1523P/N2,112 |  | 
Виробник: NXP USA Inc.
Description: IC LED DRIVER OFFL 2A 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Outputs: 1
Frequency: 10kHz ~ 200kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 145°C (TJ)
Applications: Lighting
Current - Output / Channel: 2A
Internal Switch(s): Yes
Topology: Flyback
Supplier Device Package: 8-DIP
Voltage - Supply (Min): 80V
Voltage - Supply (Max): 276V
Part Status: Obsolete
    Description: IC LED DRIVER OFFL 2A 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Outputs: 1
Frequency: 10kHz ~ 200kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 145°C (TJ)
Applications: Lighting
Current - Output / Channel: 2A
Internal Switch(s): Yes
Topology: Flyback
Supplier Device Package: 8-DIP
Voltage - Supply (Min): 80V
Voltage - Supply (Max): 276V
Part Status: Obsolete
на замовлення 11400 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 311+ | 80.13 грн | 
| SPC5746BK1AMMH2 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| MC34904C3EK |  | 
Виробник: NXP USA Inc.
Description: IC SWITCH HIGH SIDE
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2mA
Supplier Device Package: 32-SOIC-EP
Part Status: Obsolete
    Description: IC SWITCH HIGH SIDE
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2mA
Supplier Device Package: 32-SOIC-EP
Part Status: Obsolete
товару немає в наявності
    В кошику
     од. на суму     грн.
| MC68HC908JL8CP |  | 
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-PDIP
Part Status: Obsolete
Number of I/O: 23
DigiKey Programmable: Not Verified
    Description: IC MCU 8BIT 8KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-PDIP
Part Status: Obsolete
Number of I/O: 23
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| BB131,115 |  | 
Виробник: NXP USA Inc.
Description: DIODE VHF VAR CAP 30V SOD323
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Capacitance Ratio Condition: C0.5/C28
Supplier Device Package: SOD-323
Part Status: Obsolete
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 16.0
    Description: DIODE VHF VAR CAP 30V SOD323
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Capacitance Ratio Condition: C0.5/C28
Supplier Device Package: SOD-323
Part Status: Obsolete
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 16.0
товару немає в наявності
    В кошику
     од. на суму     грн.
| BB131,115 |  | 
Виробник: NXP USA Inc.
Description: DIODE VHF VAR CAP 30V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Capacitance Ratio Condition: C0.5/C28
Supplier Device Package: SOD-323
Part Status: Obsolete
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 16.0
    Description: DIODE VHF VAR CAP 30V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Capacitance Ratio Condition: C0.5/C28
Supplier Device Package: SOD-323
Part Status: Obsolete
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 16.0
на замовлення 2598 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 9+ | 39.65 грн | 
| 14+ | 23.31 грн | 
| 100+ | 14.79 грн | 
| 500+ | 10.41 грн | 
| 1000+ | 9.29 грн | 
| MC13851EPR2 |  | 
Виробник: NXP USA Inc.
Description: IC RF AMP GPS 1GHZ-2.5GHZ 8MLPD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1GHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 3V
Gain: 16.4dB
Current - Supply: 4.8mA
Noise Figure: 1.1dB
P1dB: 8dBm
Test Frequency: 2.14GHz
Supplier Device Package: 8-MLPD (2x2)
Part Status: Obsolete
    Description: IC RF AMP GPS 1GHZ-2.5GHZ 8MLPD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1GHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 3V
Gain: 16.4dB
Current - Supply: 4.8mA
Noise Figure: 1.1dB
P1dB: 8dBm
Test Frequency: 2.14GHz
Supplier Device Package: 8-MLPD (2x2)
Part Status: Obsolete
товару немає в наявності
    В кошику
     од. на суму     грн.
| FS32V234CON2VUB |  | 
Виробник: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Part Status: Active
    Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Part Status: Active
на замовлення 679 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 5155.63 грн | 
| 10+ | 4324.39 грн | 
| 25+ | 4304.96 грн | 
| FS32V234CMN1VUB |  | 
Виробник: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: 1Gbps
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Part Status: Obsolete
    Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: 1Gbps
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Part Status: Obsolete
на замовлення 5079 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 5+ | 5266.16 грн | 
| SA605D/01,112 |  | 
Виробник: NXP USA Inc.
Description: RF RCVR ASK/FSK 0HZ-500MHZ 20SO
Features: RSSI Equipped
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 0Hz ~ 500MHz
Modulation or Protocol: ASK, FSK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 8V
Applications: FM Remote Receiver
Current - Receiving: 5.7mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 20-SO
Part Status: Obsolete
    Description: RF RCVR ASK/FSK 0HZ-500MHZ 20SO
Features: RSSI Equipped
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 0Hz ~ 500MHz
Modulation or Protocol: ASK, FSK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 8V
Applications: FM Remote Receiver
Current - Receiving: 5.7mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 20-SO
Part Status: Obsolete
товару немає в наявності
    В кошику
     од. на суму     грн.
| 88W8997-A1-CBQE/AZ |  | 
Виробник: NXP USA Inc.
Description: IC RF TXRX BLE 161WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 161-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 161-WLCSP
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
    Description: IC RF TXRX BLE 161WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 161-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 161-WLCSP
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
товару немає в наявності
    В кошику
     од. на суму     грн.
| BUK9107-40ATC,118 |  | 
Виробник: NXP USA Inc.
Description: BUK9107-40ATC - D2PAK
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 50A, 10V
FET Feature: Temperature Sensing Diode
Power Dissipation (Max): 272W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SOT-426
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 5836 pF @ 25 V
    Description: BUK9107-40ATC - D2PAK
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 50A, 10V
FET Feature: Temperature Sensing Diode
Power Dissipation (Max): 272W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SOT-426
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 5836 pF @ 25 V
товару немає в наявності
    В кошику
     од. на суму     грн.
| PCMF3HDMI14SZ |  | 
Виробник: NXP USA Inc.
Description: CMC
Packaging: Bulk
Package / Case: 15-UFBGA, WLCSP
Size / Dimension: 0.093" L x 0.046" W (2.37mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 3Ohm, C = 0.25pF
Height: 0.024" (0.60mm)
Attenuation Value: 0.3dB @ 1MHz
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: LC
Center / Cutoff Frequency: 6GHz (Cutoff)
Resistance - Channel (Ohms): 3
ESD Protection: Yes
Part Status: Active
Number of Channels: 3
    Description: CMC
Packaging: Bulk
Package / Case: 15-UFBGA, WLCSP
Size / Dimension: 0.093" L x 0.046" W (2.37mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 3Ohm, C = 0.25pF
Height: 0.024" (0.60mm)
Attenuation Value: 0.3dB @ 1MHz
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: LC
Center / Cutoff Frequency: 6GHz (Cutoff)
Resistance - Channel (Ohms): 3
ESD Protection: Yes
Part Status: Active
Number of Channels: 3
на замовлення 4500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 879+ | 25.67 грн | 
| XAUI-RISER-B |  | 
Виробник: NXP USA Inc.
Description: ETHERNET CARD PHY RISER P4080
Packaging: Bulk
For Use With/Related Products: QorIQ™
Accessory Type: Interface Board
Part Status: Active
    Description: ETHERNET CARD PHY RISER P4080
Packaging: Bulk
For Use With/Related Products: QorIQ™
Accessory Type: Interface Board
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 157462.69 грн | 
| SPC5748CSK0AMKU6 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| SPC5748GHK0AMMN6 | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tray
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Part Status: Active
Number of I/O: 246
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tray
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Part Status: Active
Number of I/O: 246
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| SPC5748CK1MKU6R |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| SPC5748CK1MMJ6R |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| SPC5748CBK0AVMJ6 | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| SPC5748CK1MKU6 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| PCF2123BS/1,512 |  | 
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR SPI 16HVQFN
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HVQFN (3x3)
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Discontinued at Digi-Key
DigiKey Programmable: Not Verified
    Description: IC RTC CLK/CALENDAR SPI 16HVQFN
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HVQFN (3x3)
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Discontinued at Digi-Key
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| MC9RS08KB4CWJ |  | 
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Last Time Buy
Number of I/O: 18
DigiKey Programmable: Not Verified
    Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Last Time Buy
Number of I/O: 18
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| MWE6IC9100NBR1 |  | 
Виробник: NXP USA Inc.
Description: IC RF AMP GSM 960MHZ TO272WB
Packaging: Bulk
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 960MHz
RF Type: GSM, EDGE
Voltage - Supply: 28V
Gain: 33.5dB
Supplier Device Package: TO-272 WB-14
Part Status: Obsolete
    Description: IC RF AMP GSM 960MHZ TO272WB
Packaging: Bulk
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 960MHz
RF Type: GSM, EDGE
Voltage - Supply: 28V
Gain: 33.5dB
Supplier Device Package: TO-272 WB-14
Part Status: Obsolete
на замовлення 465 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 5+ | 5839.30 грн | 
| MC9S12XDP512VAG | 
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
    Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| MKE02Z32VQH4 | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
    Description: IC MCU 32BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
товару немає в наявності
    В кошику
     од. на суму     грн.
| MC33596FJER2 |  | 
Виробник: NXP USA Inc.
Description: UHF RECEIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-LQFP (5x5)
Part Status: Not For New Designs
    Description: UHF RECEIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-LQFP (5x5)
Part Status: Not For New Designs
на замовлення 30000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 145+ | 286.65 грн | 
| MC33596FCAER2 |  | 
Виробник: NXP USA Inc.
Description: RF RX FSK/OOK 304/315/426 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Not For New Designs
    Description: RF RX FSK/OOK 304/315/426 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Not For New Designs
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 150+ | 275.91 грн | 
| P5CD012X0/T0B38170 | 
Виробник: NXP USA Inc.
Description: P5CD012X0/T0B38170
Packaging: Bulk
Speed: 30MHz
Program Memory Size: 200KB (200K x 8)
RAM Size: 6K x 8
Operating Temperature: -25°C ~ 85°C
Program Memory Type: ROM
EEPROM Size: 12K x 8
Core Processor: Secure MX51
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.5V
Connectivity: ISO 7816, ISO 14443, UART
Part Status: Obsolete
    Description: P5CD012X0/T0B38170
Packaging: Bulk
Speed: 30MHz
Program Memory Size: 200KB (200K x 8)
RAM Size: 6K x 8
Operating Temperature: -25°C ~ 85°C
Program Memory Type: ROM
EEPROM Size: 12K x 8
Core Processor: Secure MX51
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.5V
Connectivity: ISO 7816, ISO 14443, UART
Part Status: Obsolete
товару немає в наявності
    В кошику
     од. на суму     грн.
| MC908JL3ECPE |  | 
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-PDIP
Part Status: Obsolete
Number of I/O: 23
DigiKey Programmable: Not Verified
    Description: IC MCU 8BIT 4KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-PDIP
Part Status: Obsolete
Number of I/O: 23
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| FRDM-STBA-A8964 |  | 
Виробник: NXP USA Inc.
Description: DEV BOARD FXLS8964AF ACCEL
Packaging: Bulk
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8964AF, K22
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
Part Status: Active
    Description: DEV BOARD FXLS8964AF ACCEL
Packaging: Bulk
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8964AF, K22
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 6835.90 грн | 
| LS1024ASN7MLA |  | 
Виробник: NXP USA Inc.
Description: LS1024 - QORIQ LAYERSCAPE 32-BIT
Packaging: Bulk
Part Status: Active
    Description: LS1024 - QORIQ LAYERSCAPE 32-BIT
Packaging: Bulk
Part Status: Active
товару немає в наявності
    В кошику
     од. на суму     грн.
| BUK962R1-40E,118 |  | 
Виробник: NXP USA Inc.
Description: MOSFET N-CH 40V 120A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V
Power Dissipation (Max): 293W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 87.8 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 13160 pF @ 25 V
    Description: MOSFET N-CH 40V 120A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V
Power Dissipation (Max): 293W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 87.8 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 13160 pF @ 25 V
на замовлення 3369 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 303+ | 77.57 грн | 
| T1024NSE7MQA |  | 
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
    Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
на замовлення 1063 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 4+ | 6663.66 грн | 
| MMA8452QR1 |  | 
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C 16QFN
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g)
Part Status: Obsolete
    Description: ACCELEROMETER 2-8G I2C 16QFN
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g)
Part Status: Obsolete
товару немає в наявності
    В кошику
     од. на суму     грн.
| FXLS8964AFR1 |  | 
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Output Type: I²C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
    Description: ACCELEROMETER 2-16G 10DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Output Type: I²C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
товару немає в наявності
    В кошику
     од. на суму     грн.
| FRDM-KW019032,598 | 
Виробник: NXP USA Inc.
Description: FREEDOM BOARD FOR KW SERIES
Packaging: Bulk
For Use With/Related Products: KW0x
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s)
Part Status: Active
    Description: FREEDOM BOARD FOR KW SERIES
Packaging: Bulk
For Use With/Related Products: KW0x
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s)
Part Status: Active
товару немає в наявності
    В кошику
     од. на суму     грн.
| MCF54455VP266 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| MK11DX256AVMC5 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
    Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 348 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 1125.13 грн | 
| 10+ | 851.02 грн | 
| 80+ | 704.54 грн | 
| 74HC7030N,652 |  | 
Виробник: NXP USA Inc.
Description: IC FIFO ASYNC/SYNC 64X9 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Function: Asynchronous, Synchronous
Memory Size: 576 (64 x 9)
Operating Temperature: -40°C ~ 125°C
Data Rate: 33MHz
Access Time: 36ns
Supplier Device Package: 28-DIP
Bus Directional: Uni-Directional
Expansion Type: Depth, Width
Programmable Flags Support: No
Retransmit Capability: No
FWFT Support: No
Part Status: Obsolete
Voltage - Supply: 2 V ~ 6 V
DigiKey Programmable: Not Verified
    Description: IC FIFO ASYNC/SYNC 64X9 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Function: Asynchronous, Synchronous
Memory Size: 576 (64 x 9)
Operating Temperature: -40°C ~ 125°C
Data Rate: 33MHz
Access Time: 36ns
Supplier Device Package: 28-DIP
Bus Directional: Uni-Directional
Expansion Type: Depth, Width
Programmable Flags Support: No
Retransmit Capability: No
FWFT Support: No
Part Status: Obsolete
Voltage - Supply: 2 V ~ 6 V
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| MK50DX256ZCLL10 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| LPC54605J256ET100E |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| PCA9539D,118 |  | 
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 24SO
Features: POR
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
    Description: IC XPNDR 400KHZ I2C SMBUS 24SO
Features: POR
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 18136 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 575+ | 71.87 грн | 
| PCA9539D,112 |  | 
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 24SO
Features: POR
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
    Description: IC XPNDR 400KHZ I2C SMBUS 24SO
Features: POR
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 575+ | 71.87 грн | 
| 74AUP1G885GD125 |  | 
Виробник: NXP USA Inc.
Description: XOR GATE
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Number of Circuits: 1
    Description: XOR GATE
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Number of Circuits: 1
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1567+ | 14.46 грн | 
| T2080NXN8P1B |  | 
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Bulk
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
    Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Bulk
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 24130.92 грн | 
| T2080NXN8P1B |  | 
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
    Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
товару немає в наявності
    В кошику
     од. на суму     грн.
| T2080NXN8TTB |  | 
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
    Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
товару немає в наявності
    В кошику
     од. на суму     грн.
| 1PS70SB16,115 | 
Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 30V 200MA SOT323
Packaging: Bulk
Part Status: Active
    Description: DIODE SCHOTTKY 30V 200MA SOT323
Packaging: Bulk
Part Status: Active
на замовлення 320700 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 9982+ | 2.36 грн | 
| 1PS70SB46,115 |  | 
Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 40V 120MA SOT323
Packaging: Bulk
Part Status: Active
    Description: DIODE SCHOTTKY 40V 120MA SOT323
Packaging: Bulk
Part Status: Active
на замовлення 418659 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 10051+ | 2.48 грн |