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MPXAZ4115A6T1 MPXAZ4115A6T1 NXP USA Inc. MPXAZ4115A.pdf Description: SENSOR 16.68PSIA 4.8V
Pressure Type: Absolute
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Output: 0.2 V ~ 4.8 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD Module
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Part Status: Obsolete
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Applications: Board Mount
Voltage - Supply: 4.85V ~ 5.35V
Termination Style: SMD (SMT) Tab
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
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PCU9661B,118 PCU9661B,118 NXP USA Inc. PCU9661.pdf Description: IC CONTROLLER 48LQFP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Standards: IEEE 1149.1
Protocol: I2C
Current - Supply: 15mA
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Interface: I2C
Function: Controller
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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PCU9661B,118 PCU9661B,118 NXP USA Inc. PCU9661.pdf Description: IC CONTROLLER 48LQFP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Standards: IEEE 1149.1
Protocol: I2C
Current - Supply: 15mA
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Interface: I2C
Function: Controller
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
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PRF13750HR9697 NXP USA Inc. _MRF13750H.pdf?t.download=true&u=ovmfp3 Description: PRF13750HR - RF MOSFET LDMOS (DU
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
2+16648.44 грн
Мінімальне замовлення: 2
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MF3MOD4101DA4/05,1 NXP USA Inc. Description: IC RFID TRANSP 13.56MHZ MOA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
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MPC8569ECVJANKGB MPC8569ECVJANKGB NXP USA Inc. MPC8569EEC.pdf Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100Mbps (8), 1Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR2, DDR3, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
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MKM14Z64CHH5 MKM14Z64CHH5 NXP USA Inc. MKMxxZxxCxx5.pdf Description: IC MCU 32BIT 64KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Part Status: Not For New Designs
Number of I/O: 20
DigiKey Programmable: Not Verified
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A5G35S004NT6 NXP USA Inc. A5G35S004N.pdf Description: AIRFAST RF POWER GAN TRANSISTOR,
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: 6-PDFN (4x4.5)
Gain: 16.9dB
Power - Output: 24.5dBm
Frequency: 3.3GHz ~ 4.3GHz
Mounting Type: Surface Mount
Package / Case: 6-LDFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Test: 12 mA
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LPC55S69JBD64Y LPC55S69JBD64Y NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Number of I/O: 36
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
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LPC55S69JEV98E LPC55S69JEV98E NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH
Number of I/O: 64
Part Status: Active
Supplier Device Package: 98-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Packaging: Tray
на замовлення 239 шт:
термін постачання 21-31 дні (днів)
1+597.33 грн
10+447.21 грн
25+415.09 грн
100+356.48 грн
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LPC55S69JEV98Y LPC55S69JEV98Y NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH
Number of I/O: 64
Part Status: Active
Supplier Device Package: 98-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Packaging: Tape & Reel (TR)
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LPC55S69JBD64E LPC55S69JBD64E NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Number of I/O: 36
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
на замовлення 57 шт:
термін постачання 21-31 дні (днів)
1+454.13 грн
10+407.60 грн
25+382.48 грн
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LPC55S69JBD100E LPC55S69JBD100E NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH 100LQFP
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
на замовлення 15 шт:
термін постачання 21-31 дні (днів)
1+503.97 грн
10+451.94 грн
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MC9S08AC60CFGE MC9S08AC60CFGE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 3555 шт:
термін постачання 21-31 дні (днів)
1+714.42 грн
10+536.58 грн
25+498.90 грн
100+429.26 грн
250+410.71 грн
800+393.10 грн
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MC9S08AC60MFUE MC9S08AC60MFUE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 1222 шт:
термін постачання 21-31 дні (днів)
49+451.72 грн
Мінімальне замовлення: 49
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MC9S08AC60MFUE MC9S08AC60MFUE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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BZX384-C27/ZLX BZX384-C27/ZLX NXP USA Inc. BZX384_SER.pdf Description: DIODE ZENER 27V 300MW SOD323
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 300 mW
Part Status: Obsolete
Supplier Device Package: SOD-323
Impedance (Max) (Zzt): 80 Ohms
Voltage - Zener (Nom) (Vz): 27 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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P5040NXN7TMC NXP USA Inc. FSCLS11784-1.pdf?t.download=true&u=5oefqw Description: QORIQ, 64-BIT POWER ARCH SOC, 4
Packaging: Bulk
Part Status: Active
на замовлення 63 шт:
термін постачання 21-31 дні (днів)
1+30286.50 грн
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MR-T1ETH8 MR-T1ETH8 NXP USA Inc. Description: EVAL BOARD FOR SE050
Part Status: Active
Embedded: No
Primary Attributes: 40V Operating Voltage
Supplied Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: SE050, SJA1110, VR5510
Type: Interface
Function: Ethernet
Packaging: Bulk
Secondary Attributes: On-Board LEDs
Contents: Board(s), Cable(s), Accessories
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BAP64LX,315 BAP64LX,315 NXP USA Inc. BAP64LX.pdf Description: RF DIODE PIN 60V 150MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)
10000+6.60 грн
20000+6.21 грн
Мінімальне замовлення: 10000
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BAP64LX,315 BAP64LX,315 NXP USA Inc. BAP64LX.pdf Description: RF DIODE PIN 60V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
на замовлення 26970 шт:
термін постачання 21-31 дні (днів)
19+17.41 грн
27+11.35 грн
31+10.03 грн
100+8.04 грн
250+7.40 грн
500+7.01 грн
1000+6.57 грн
2500+6.24 грн
5000+6.03 грн
Мінімальне замовлення: 19
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P89LPC915FDH,129 P89LPC915FDH,129 NXP USA Inc. P89LPC915_916_917.pdf Description: IC MCU 8BIT 2KB FLASH 14TSSOP
Part Status: Obsolete
Supplier Device Package: 14-TSSOP
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Connectivity: I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 4x8b; D/A 1x8b
Core Processor: 8051
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
DigiKey Programmable: Verified
Number of I/O: 12
Program Memory Size: 2KB (2K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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PCA9505DGGY PCA9505DGGY NXP USA Inc. PCA9505_9506.pdf Description: IC XPNDR 400KHZ I2C 56TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 40
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 56-TSSOP
Current - Output Source/Sink: 10mA, 15mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 5260 шт:
термін постачання 21-31 дні (днів)
1+375.01 грн
10+275.95 грн
25+254.67 грн
100+217.01 грн
250+208.02 грн
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LS1023ASN7MQB LS1023ASN7MQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
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TEF6638HW/V106557 TEF6638HW/V106557 NXP USA Inc. 201605020DN-DN81.pdf Description: TEF6638HW - DIGITAL CAR RADIO IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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TEF6638HW/V105518 NXP USA Inc. 201605020DN-DN81.pdf Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Bulk
Part Status: Active
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TEF6638HW/V105557 TEF6638HW/V105557 NXP USA Inc. 201605020DN-DN81.pdf Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Bulk
Part Status: Active
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TEF6638HW/V106Z/SK NXP USA Inc. Description: TEF6638HW/V106Z/S30/HTQFP100/STA
Packaging: Tray
Part Status: Active
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TEF6638HW/V106/SAK NXP USA Inc. Description: TEF6638HW/V106/S31/HTQFP100/TRAY
Packaging: Tray
Part Status: Active
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TEF6638HW/V106Z/SY NXP USA Inc. Description: TEF6638HW
Packaging: Tape & Reel (TR)
Part Status: Active
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TEF6638HW/V106/SBK NXP USA Inc. Description: TEF6638HW/V106/S32/HTQFP100/TRAY
Packaging: Tray
Part Status: Active
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S912ZVMC12F2WKHR S912ZVMC12F2WKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
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MRF7S21170HSR3 NXP USA Inc. MRF7S21170H.pdf Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 50W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-880S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
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MML20242HT1 MML20242HT1 NXP USA Inc. MML20242H.pdf Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Test Frequency: 1.95GHz
P1dB: 24dBm
Noise Figure: 0.57dB
Current - Supply: 160mA
Gain: 34dB
Voltage - Supply: 5V
RF Type: LTE, TDS-CDMA, W-CDMA
Frequency: 1.4GHz ~ 2.8GHz
Mounting Type: Surface Mount
Package / Case: 12-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 12-QFN (3x3)
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MML20242HT1 MML20242HT1 NXP USA Inc. MML20242H.pdf Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Part Status: Obsolete
Supplier Device Package: 12-QFN (3x3)
Test Frequency: 1.95GHz
P1dB: 24dBm
Noise Figure: 0.57dB
Current - Supply: 160mA
Gain: 34dB
Voltage - Supply: 5V
RF Type: LTE, TDS-CDMA, W-CDMA
Frequency: 1.4GHz ~ 2.8GHz
Mounting Type: Surface Mount
Package / Case: 12-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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MCHSC705C8ACFBE MCHSC705C8ACFBE NXP USA Inc. MC68HC705C8.pdf Description: IC MCU 8BIT 8KB OTP 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
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PMEG045V150EPD146 PMEG045V150EPD146 NXP USA Inc. PMEG045V150EPD.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
на замовлення 43500 шт:
термін постачання 21-31 дні (днів)
838+28.48 грн
Мінімальне замовлення: 838
В кошику  од. на суму  грн.
LPC2136FBD64/01151 NXP USA Inc. PHGLS23095-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
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LPC2136FBD64/01,15 LPC2136FBD64/01,15 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 47
DigiKey Programmable: Not Verified
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LPC2136FBD64,151 LPC2136FBD64,151 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 47
DigiKey Programmable: Not Verified
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MIMXRT1024DAG5B MIMXRT1024DAG5B NXP USA Inc. IMXRT1024CEC.pdf Description: IC MCU 32BIT 4MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 90
на замовлення 180 шт:
термін постачання 21-31 дні (днів)
1+757.14 грн
10+570.63 грн
60+501.42 грн
120+452.99 грн
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S912ZVML12F1VKH S912ZVML12F1VKH NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
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S912ZVML12F1VKHR S912ZVML12F1VKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
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MC9S12P64CLH MC9S12P64CLH NXP USA Inc. MC9S12P128RMV1.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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BGA2712,115 BGA2712,115 NXP USA Inc. BGA2712_Rev_Nov2010.pdf Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 1GHz ~ 3.2GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 21.3dB
Current - Supply: 12.3mA
Noise Figure: 3.9dB
P1dB: 4.8dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
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BGA2712,115 BGA2712,115 NXP USA Inc. BGA2712_Rev_Nov2010.pdf Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 1GHz ~ 3.2GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 21.3dB
Current - Supply: 12.3mA
Noise Figure: 3.9dB
P1dB: 4.8dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
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MK51DX256CLK7 NXP USA Inc. FSCLS07731-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 30x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 396 шт:
термін постачання 21-31 дні (днів)
28+863.95 грн
Мінімальне замовлення: 28
В кошику  од. на суму  грн.
PCA9509D,118 PCA9509D,118 NXP USA Inc. PCA9509.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
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PCA9509D,118 PCA9509D,118 NXP USA Inc. PCA9509.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
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SPC5607BAVLQ6R SPC5607BAVLQ6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
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S32G398ASCK1VUCR S32G398ASCK1VUCR NXP USA Inc. S32G2.pdf Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: 2.5Gbps (3)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1.3GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
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S32G399ASCK1VUCT NXP USA Inc. S32G2.pdf Description: 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
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S32G398ASCK1VUCT S32G398ASCK1VUCT NXP USA Inc. S32G3.pdf Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
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MKL04Z8VLC4R MKL04Z8VLC4R NXP USA Inc. KL04P48M48SF1.pdf Description: IC MCU 32BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
126+162.63 грн
Мінімальне замовлення: 126
В кошику  од. на суму  грн.
MC9S08QD2CSC MC9S08QD2CSC NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
на замовлення 6849 шт:
термін постачання 21-31 дні (днів)
2+194.63 грн
10+140.26 грн
98+115.51 грн
196+103.82 грн
294+101.52 грн
588+98.16 грн
1078+94.14 грн
2548+91.36 грн
5096+89.55 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
S912ZVML64F1WKH557 S912ZVML64F1WKH557 NXP USA Inc. FSCL-S-A0000953857-1.pdf?t.download=true&u=5oefqw Description: 16-BIT FLASH, CPU12 CPU
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
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S9S08LG32J0CLH S9S08LG32J0CLH NXP USA Inc. MC9S08LG32.pdf Description: IC MCU 8BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LCD, LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.9K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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UBA2024P/N1,112 UBA2024P/N1,112 NXP USA Inc. UBA2024.pdf Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
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AFT05MP075N-54M NXP USA Inc. AFT05MP075N.pdf Description: RF MOSFET
Packaging: Bulk
Part Status: Active
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P1016NSE5DFB NXP USA Inc. Description: QORIQ, POWER ARCH 32-BIT SOC, 53
Packaging: Bulk
Part Status: Active
на замовлення 2155 шт:
термін постачання 21-31 дні (днів)
5+5718.52 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
MPXAZ4115A6T1 MPXAZ4115A.pdf
MPXAZ4115A6T1
Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.8V
Pressure Type: Absolute
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Output: 0.2 V ~ 4.8 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD Module
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Part Status: Obsolete
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Applications: Board Mount
Voltage - Supply: 4.85V ~ 5.35V
Termination Style: SMD (SMT) Tab
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
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PCU9661B,118 PCU9661.pdf
PCU9661B,118
Виробник: NXP USA Inc.
Description: IC CONTROLLER 48LQFP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Standards: IEEE 1149.1
Protocol: I2C
Current - Supply: 15mA
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Interface: I2C
Function: Controller
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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PCU9661B,118 PCU9661.pdf
PCU9661B,118
Виробник: NXP USA Inc.
Description: IC CONTROLLER 48LQFP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Standards: IEEE 1149.1
Protocol: I2C
Current - Supply: 15mA
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Interface: I2C
Function: Controller
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
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PRF13750HR9697 _MRF13750H.pdf?t.download=true&u=ovmfp3
Виробник: NXP USA Inc.
Description: PRF13750HR - RF MOSFET LDMOS (DU
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+16648.44 грн
Мінімальне замовлення: 2
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MF3MOD4101DA4/05,1
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ MOA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
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MPC8569ECVJANKGB MPC8569EEC.pdf
MPC8569ECVJANKGB
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100Mbps (8), 1Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR2, DDR3, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
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MKM14Z64CHH5 MKMxxZxxCxx5.pdf
MKM14Z64CHH5
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Part Status: Not For New Designs
Number of I/O: 20
DigiKey Programmable: Not Verified
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A5G35S004NT6 A5G35S004N.pdf
Виробник: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR,
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: 6-PDFN (4x4.5)
Gain: 16.9dB
Power - Output: 24.5dBm
Frequency: 3.3GHz ~ 4.3GHz
Mounting Type: Surface Mount
Package / Case: 6-LDFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Test: 12 mA
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LPC55S69JBD64Y LPC55S6x.pdf
LPC55S69JBD64Y
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Number of I/O: 36
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
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LPC55S69JEV98E LPC55S6x.pdf
LPC55S69JEV98E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH
Number of I/O: 64
Part Status: Active
Supplier Device Package: 98-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Packaging: Tray
на замовлення 239 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+597.33 грн
10+447.21 грн
25+415.09 грн
100+356.48 грн
В кошику  од. на суму  грн.
LPC55S69JEV98Y LPC55S6x.pdf
LPC55S69JEV98Y
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH
Number of I/O: 64
Part Status: Active
Supplier Device Package: 98-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Packaging: Tape & Reel (TR)
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LPC55S69JBD64E LPC55S6x.pdf
LPC55S69JBD64E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Number of I/O: 36
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
на замовлення 57 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+454.13 грн
10+407.60 грн
25+382.48 грн
В кошику  од. на суму  грн.
LPC55S69JBD100E LPC55S6x.pdf
LPC55S69JBD100E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 100LQFP
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
на замовлення 15 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+503.97 грн
10+451.94 грн
В кошику  од. на суму  грн.
MC9S08AC60CFGE MC9S08AC60.pdf
MC9S08AC60CFGE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 3555 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+714.42 грн
10+536.58 грн
25+498.90 грн
100+429.26 грн
250+410.71 грн
800+393.10 грн
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MC9S08AC60MFUE MC9S08AC60.pdf
MC9S08AC60MFUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 1222 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
49+451.72 грн
Мінімальне замовлення: 49
В кошику  од. на суму  грн.
MC9S08AC60MFUE MC9S08AC60.pdf
MC9S08AC60MFUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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BZX384-C27/ZLX BZX384_SER.pdf
BZX384-C27/ZLX
Виробник: NXP USA Inc.
Description: DIODE ZENER 27V 300MW SOD323
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 300 mW
Part Status: Obsolete
Supplier Device Package: SOD-323
Impedance (Max) (Zzt): 80 Ohms
Voltage - Zener (Nom) (Vz): 27 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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P5040NXN7TMC FSCLS11784-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: QORIQ, 64-BIT POWER ARCH SOC, 4
Packaging: Bulk
Part Status: Active
на замовлення 63 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+30286.50 грн
В кошику  од. на суму  грн.
MR-T1ETH8
MR-T1ETH8
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR SE050
Part Status: Active
Embedded: No
Primary Attributes: 40V Operating Voltage
Supplied Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: SE050, SJA1110, VR5510
Type: Interface
Function: Ethernet
Packaging: Bulk
Secondary Attributes: On-Board LEDs
Contents: Board(s), Cable(s), Accessories
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BAP64LX,315 BAP64LX.pdf
BAP64LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 150MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10000+6.60 грн
20000+6.21 грн
Мінімальне замовлення: 10000
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BAP64LX,315 BAP64LX.pdf
BAP64LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
на замовлення 26970 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
19+17.41 грн
27+11.35 грн
31+10.03 грн
100+8.04 грн
250+7.40 грн
500+7.01 грн
1000+6.57 грн
2500+6.24 грн
5000+6.03 грн
Мінімальне замовлення: 19
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P89LPC915FDH,129 P89LPC915_916_917.pdf
P89LPC915FDH,129
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 14TSSOP
Part Status: Obsolete
Supplier Device Package: 14-TSSOP
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Connectivity: I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 4x8b; D/A 1x8b
Core Processor: 8051
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
DigiKey Programmable: Verified
Number of I/O: 12
Program Memory Size: 2KB (2K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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PCA9505DGGY PCA9505_9506.pdf
PCA9505DGGY
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 56TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 40
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 56-TSSOP
Current - Output Source/Sink: 10mA, 15mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 5260 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+375.01 грн
10+275.95 грн
25+254.67 грн
100+217.01 грн
250+208.02 грн
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LS1023ASN7MQB LS1043AFS.pdf
LS1023ASN7MQB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
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TEF6638HW/V106557 201605020DN-DN81.pdf
TEF6638HW/V106557
Виробник: NXP USA Inc.
Description: TEF6638HW - DIGITAL CAR RADIO IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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TEF6638HW/V105518 201605020DN-DN81.pdf
Виробник: NXP USA Inc.
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Bulk
Part Status: Active
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TEF6638HW/V105557 201605020DN-DN81.pdf
TEF6638HW/V105557
Виробник: NXP USA Inc.
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Bulk
Part Status: Active
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TEF6638HW/V106Z/SK
Виробник: NXP USA Inc.
Description: TEF6638HW/V106Z/S30/HTQFP100/STA
Packaging: Tray
Part Status: Active
товару немає в наявності
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TEF6638HW/V106/SAK
Виробник: NXP USA Inc.
Description: TEF6638HW/V106/S31/HTQFP100/TRAY
Packaging: Tray
Part Status: Active
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TEF6638HW/V106Z/SY
Виробник: NXP USA Inc.
Description: TEF6638HW
Packaging: Tape & Reel (TR)
Part Status: Active
товару немає в наявності
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TEF6638HW/V106/SBK
Виробник: NXP USA Inc.
Description: TEF6638HW/V106/S32/HTQFP100/TRAY
Packaging: Tray
Part Status: Active
товару немає в наявності
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S912ZVMC12F2WKHR S12ZVMFS.pdf
S912ZVMC12F2WKHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
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MRF7S21170HSR3 MRF7S21170H.pdf
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 50W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-880S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
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MML20242HT1 MML20242H.pdf
MML20242HT1
Виробник: NXP USA Inc.
Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Test Frequency: 1.95GHz
P1dB: 24dBm
Noise Figure: 0.57dB
Current - Supply: 160mA
Gain: 34dB
Voltage - Supply: 5V
RF Type: LTE, TDS-CDMA, W-CDMA
Frequency: 1.4GHz ~ 2.8GHz
Mounting Type: Surface Mount
Package / Case: 12-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 12-QFN (3x3)
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MML20242HT1 MML20242H.pdf
MML20242HT1
Виробник: NXP USA Inc.
Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Part Status: Obsolete
Supplier Device Package: 12-QFN (3x3)
Test Frequency: 1.95GHz
P1dB: 24dBm
Noise Figure: 0.57dB
Current - Supply: 160mA
Gain: 34dB
Voltage - Supply: 5V
RF Type: LTE, TDS-CDMA, W-CDMA
Frequency: 1.4GHz ~ 2.8GHz
Mounting Type: Surface Mount
Package / Case: 12-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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MCHSC705C8ACFBE MC68HC705C8.pdf
MCHSC705C8ACFBE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
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PMEG045V150EPD146 PMEG045V150EPD.pdf
PMEG045V150EPD146
Виробник: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
на замовлення 43500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
838+28.48 грн
Мінімальне замовлення: 838
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LPC2136FBD64/01151 PHGLS23095-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
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LPC2136FBD64/01,15 LPC2131_32_34_36_38.pdf
LPC2136FBD64/01,15
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 47
DigiKey Programmable: Not Verified
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LPC2136FBD64,151 LPC2131_32_34_36_38.pdf
LPC2136FBD64,151
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 47
DigiKey Programmable: Not Verified
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MIMXRT1024DAG5B IMXRT1024CEC.pdf
MIMXRT1024DAG5B
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 90
на замовлення 180 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+757.14 грн
10+570.63 грн
60+501.42 грн
120+452.99 грн
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S912ZVML12F1VKH S12ZVMFS.pdf
S912ZVML12F1VKH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
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S912ZVML12F1VKHR S12ZVMFS.pdf
S912ZVML12F1VKHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
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MC9S12P64CLH MC9S12P128RMV1.pdf
MC9S12P64CLH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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BGA2712,115 BGA2712_Rev_Nov2010.pdf
BGA2712,115
Виробник: NXP USA Inc.
Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 1GHz ~ 3.2GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 21.3dB
Current - Supply: 12.3mA
Noise Figure: 3.9dB
P1dB: 4.8dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
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BGA2712,115 BGA2712_Rev_Nov2010.pdf
BGA2712,115
Виробник: NXP USA Inc.
Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 1GHz ~ 3.2GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 21.3dB
Current - Supply: 12.3mA
Noise Figure: 3.9dB
P1dB: 4.8dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
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MK51DX256CLK7 FSCLS07731-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 30x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 396 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
28+863.95 грн
Мінімальне замовлення: 28
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PCA9509D,118 PCA9509.pdf
PCA9509D,118
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
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PCA9509D,118 PCA9509.pdf
PCA9509D,118
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
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SPC5607BAVLQ6R MPC560XBFAMFS.pdf
SPC5607BAVLQ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
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S32G398ASCK1VUCR S32G2.pdf
S32G398ASCK1VUCR
Виробник: NXP USA Inc.
Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: 2.5Gbps (3)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1.3GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
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S32G399ASCK1VUCT S32G2.pdf
Виробник: NXP USA Inc.
Description: 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
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S32G398ASCK1VUCT S32G3.pdf
S32G398ASCK1VUCT
Виробник: NXP USA Inc.
Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
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MKL04Z8VLC4R KL04P48M48SF1.pdf
MKL04Z8VLC4R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
126+162.63 грн
Мінімальне замовлення: 126
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MC9S08QD2CSC MC9S08QD4.pdf
MC9S08QD2CSC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
на замовлення 6849 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+194.63 грн
10+140.26 грн
98+115.51 грн
196+103.82 грн
294+101.52 грн
588+98.16 грн
1078+94.14 грн
2548+91.36 грн
5096+89.55 грн
Мінімальне замовлення: 2
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S912ZVML64F1WKH557 FSCL-S-A0000953857-1.pdf?t.download=true&u=5oefqw
S912ZVML64F1WKH557
Виробник: NXP USA Inc.
Description: 16-BIT FLASH, CPU12 CPU
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
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S9S08LG32J0CLH MC9S08LG32.pdf
S9S08LG32J0CLH
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LCD, LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.9K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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UBA2024P/N1,112 UBA2024.pdf
UBA2024P/N1,112
Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
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AFT05MP075N-54M AFT05MP075N.pdf
Виробник: NXP USA Inc.
Description: RF MOSFET
Packaging: Bulk
Part Status: Active
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P1016NSE5DFB
Виробник: NXP USA Inc.
Description: QORIQ, POWER ARCH 32-BIT SOC, 53
Packaging: Bulk
Part Status: Active
на замовлення 2155 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+5718.52 грн
Мінімальне замовлення: 5
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