Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35738) > Сторінка 512 з 596
Фото | Назва | Виробник | Інформація |
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PDTC114EE,115 | NXP USA Inc. |
![]() ![]() Packaging: Tape & Reel (TR) Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V Supplier Device Package: SC-75 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 150 mW Frequency - Transition: 230 MHz Resistor - Base (R1): 10 kOhms Resistor - Emitter Base (R2): 10 kOhms Resistors Included: R1 and R2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PDTC114EE,115 | NXP USA Inc. |
![]() ![]() Packaging: Cut Tape (CT) Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V Supplier Device Package: SC-75 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 150 mW Frequency - Transition: 230 MHz Resistor - Base (R1): 10 kOhms Resistor - Emitter Base (R2): 10 kOhms Resistors Included: R1 and R2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MIMX8US3DVK08SC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 512-VFBGA Mounting Type: Surface Mount Supplier Device Package: 512-VFBGA (9.4x9.4) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MIMX8US3DVP08SC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 485-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A35 Supplier Device Package: 485-LFBGA (15x15) Ethernet: 10/100Mbps USB: USB 2.0 (2) Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: LPDDR3, LPDDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI-CSI, MIPI-DSI Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB |
на замовлення 630 шт: термін постачання 21-31 дні (днів) |
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LPC1224FBD64/121,1 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 55 DigiKey Programmable: Not Verified |
на замовлення 320 шт: термін постачання 21-31 дні (днів) |
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MRF6VP21KHR5 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 225MHz Configuration: Dual Power - Output: 1000W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 150 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MRF6VP21KHR5 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 225MHz Configuration: Dual Power - Output: 1000W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 150 mA |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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MRFE6VP5600-225 | NXP USA Inc. |
![]() Packaging: Bulk |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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KTY84/150,153 | NXP USA Inc. |
![]() Packaging: Tape & Box (TB) Package / Case: DO-204AG, DO-34, Axial Mounting Type: Through Hole Operating Temperature: -40°C ~ 300°C Supplier Device Package: DO-34 Resistance @ 25°C: 603 Ohms |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
NJJ29C2A9HN5/349Y | NXP USA Inc. |
Description: NJJ29C2A9HN5 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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S912ZVL12AMLFR | NXP USA Inc. |
Description: S12Z CPU, 6128K FLASH Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 10x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 34 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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S912ZVL12AMLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 10x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 34 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC68HC908QY4VDTE | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Number of I/O: 13 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
PK-HC08QY4 | NXP USA Inc. |
![]() Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s), Cable(s) Core Processor: HC08 Utilized IC / Part: MC68HC908QY4 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
PSMN2R2-30YLC/GFX | NXP USA Inc. |
Description: PSMN2R2-30YLC/GFX Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
BTS6403CJ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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BTS6403UJ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 16-HVQFN (3x3) Frequency: 2.3GHz ~ 4.2GHz RF Type: 5G, TDD Voltage - Supply: 4.75V ~ 5.25V Gain: 42dB Current - Supply: 100mA Noise Figure: 4.1dB P1dB: 2.9dBm Test Frequency: 3.5GHz |
на замовлення 5950 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||
OMA1006TL-SKT | NXP USA Inc. |
![]() Packaging: Bulk Function: Anti Tamper and Security Type: Interface Utilized IC / Part: A1006TL Supplied Contents: Board(s) Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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PN7120A0EV/C10801E | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 49-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C Type: RFID Reader Operating Temperature: -30°C ~ 85°C (TA) Voltage - Supply: 1.65V ~ 3.6V Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC Supplier Device Package: 49-VFBGA (4x4.3) |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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N74F74D,623 | NXP USA Inc. |
![]() Packaging: Bulk |
на замовлення 27500 шт: термін постачання 21-31 дні (днів) |
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MCF51QE32CLH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
на замовлення 780 шт: термін постачання 21-31 дні (днів) |
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SC68376BGMAB20R | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Packaging: Tape & Reel (TR) Package / Case: 160-BQFP Mounting Type: Surface Mount Speed: 20MHz RAM Size: 7.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: CPU32 Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 160-QFP (28x28) Number of I/O: 18 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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FXTH8715116T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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FXTH8715116T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
на замовлення 1882 шт: термін постачання 21-31 дні (днів) |
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FXTH870511DT1528 | NXP USA Inc. |
Description: TPMS 7X7 450KPA X&Z AXIS Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
FXTH8718026T1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Output Type: RF Operating Temperature: -40°C ~ 125°C Sensor Type: Tire Pressure Monitoring (TPMS) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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FXTH87EG02DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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FXTH87EG02DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
FXTH87EH226T1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
FXTH87EK116T1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Pressure |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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SPC5674KAVMM2R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SPC5674KAVMM2 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SPC5674KAVMS2 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SPC5674KAVMS2R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
SPC5674FAMVV3R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 516-PBGA (27x27) Number of I/O: 32 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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SPC5674FAMVR3 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 416-PBGA (27x27) Number of I/O: 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SPC5674FAMVR3R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 416-PBGA (27x27) Number of I/O: 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SPC5674FAMVY3R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 516-PBGA (27x27) Number of I/O: 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
SPC5674FAMVV3 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 516-PBGA (27x27) Number of I/O: 32 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
LFJ74INTPZA | NXP USA Inc. |
Description: QORIVVA MPC5674F ON A 516 PIN 1. Packaging: Bulk For Use With/Related Products: MPC5674F Module/Board Type: Socket Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
LFJ74INTPWA | NXP USA Inc. |
Description: QORIVVA MPC5674F ON A 416 PIN 1. Packaging: Bulk For Use With/Related Products: MPC5674F Module/Board Type: Socket Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
LFVBBOJ74W1A | NXP USA Inc. |
Description: QORIVVA MPC5674F 422 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674F Accessory Type: Base Board |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
LFVBBJ74WA | NXP USA Inc. |
Description: QORIVVA MPC5674A 416 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674A Accessory Type: Base Board |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
LFJ74DBGZWA | NXP USA Inc. |
Description: QORIVVA MPC5674 416 PIN 1.0MM CA Packaging: Bulk For Use With/Related Products: MPC5674 Module/Board Type: Socket Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
LFVBBOJ74Z1A | NXP USA Inc. |
Description: QORIVVA MPC5674F 522 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674F Accessory Type: Base Board |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
LFVBBJ74ZA | NXP USA Inc. |
Description: QORIVVA MPC5674A 516 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674A Accessory Type: Base Board |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
LFVCAL32SYNC4 | NXP USA Inc. |
Description: 32 BIT 4MB VERTICAL CALIBRATION Packaging: Bulk For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C Accessory Type: Daughter Board |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
LFVCAL32SYNC8 | NXP USA Inc. |
Description: 32 BIT 8MB VERTICAL CALIBRATION Packaging: Bulk For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C Accessory Type: Daughter Board Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
LFVBSJ74ZZ1A | NXP USA Inc. |
Description: QORIVVA MPC5674 522 PIN 1.0MM VE Packaging: Bulk For Use With/Related Products: MPC5674 Accessory Type: Base Board Utilized IC / Part: MPC5674 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
LFVBSJ74ZW1A | NXP USA Inc. |
Description: QORIVVA MPC5674 422 PIN 1.0MM VE Packaging: Bulk For Use With/Related Products: MPC5674 Accessory Type: Base Board Utilized IC / Part: MPC5674 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
LFVBSJ74ZWA | NXP USA Inc. |
Description: QORIVVA MPC5674 416 PIN 1.0MM VE Packaging: Bulk For Use With/Related Products: MPC5674 Accessory Type: Base Board Utilized IC / Part: MPC5674 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
LFVBSJ74ZZA | NXP USA Inc. |
Description: QORIVVA 522 PIN 1.0MM PRE-VERTIC Packaging: Bulk For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C Accessory Type: Base Board Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
SPC5674KAVJM2R | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA Packaging: Tape & Reel (TR) Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
SPC5674KAVJM2 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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PCA8575DB,118 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: POR Package / Case: 24-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-SSOP Current - Output Source/Sink: 100µA, 25mA DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PCA8575DB,118 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Features: POR Package / Case: 24-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-SSOP Current - Output Source/Sink: 100µA, 25mA DigiKey Programmable: Not Verified |
на замовлення 307 шт: термін постачання 21-31 дні (днів) |
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MCF52232CAF50 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 56 DigiKey Programmable: Not Verified |
на замовлення 680 шт: термін постачання 21-31 дні (днів) |
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PMV450ENEA215 | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC8555EPXAPF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 833MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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S912ZVHL32F1VLQ | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 100 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
PDTC114EE,115 | ![]() |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
товару немає в наявності
В кошику
од. на суму грн.
PDTC114EE,115 | ![]() |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
товару немає в наявності
В кошику
од. на суму грн.
MIMX8US3DVK08SC |
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Виробник: NXP USA Inc.
Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Supplier Device Package: 512-VFBGA (9.4x9.4)
Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Supplier Device Package: 512-VFBGA (9.4x9.4)
товару немає в наявності
В кошику
од. на суму грн.
MIMX8US3DVP08SC |
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Виробник: NXP USA Inc.
Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 485-LFBGA (15x15)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M33
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 485-LFBGA (15x15)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M33
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
на замовлення 630 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1146.38 грн |
10+ | 880.08 грн |
25+ | 824.21 грн |
100+ | 762.15 грн |
LPC1224FBD64/121,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
на замовлення 320 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 495.39 грн |
10+ | 321.77 грн |
25+ | 300.90 грн |
160+ | 262.40 грн |
320+ | 260.03 грн |
MRF6VP21KHR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 1000W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 1000W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
товару немає в наявності
В кошику
од. на суму грн.
MRF6VP21KHR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 1000W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 1000W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 65400.83 грн |
MRFE6VP5600-225 |
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на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 66898.90 грн |
KTY84/150,153 |
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Виробник: NXP USA Inc.
Description: SENSOR PTC 603OHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 300°C
Supplier Device Package: DO-34
Resistance @ 25°C: 603 Ohms
Description: SENSOR PTC 603OHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 300°C
Supplier Device Package: DO-34
Resistance @ 25°C: 603 Ohms
товару немає в наявності
В кошику
од. на суму грн.
S912ZVL12AMLFR |
Виробник: NXP USA Inc.
Description: S12Z CPU, 6128K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Description: S12Z CPU, 6128K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
товару немає в наявності
В кошику
од. на суму грн.
S912ZVL12AMLF |
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Виробник: NXP USA Inc.
Description: S12Z CPU, 128K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Description: S12Z CPU, 128K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
товару немає в наявності
В кошику
од. на суму грн.
MC68HC908QY4VDTE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
PK-HC08QY4 |
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Виробник: NXP USA Inc.
Description: MC68HC908QY4 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HC08
Utilized IC / Part: MC68HC908QY4
Description: MC68HC908QY4 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HC08
Utilized IC / Part: MC68HC908QY4
товару немає в наявності
В кошику
од. на суму грн.
BTS6403UJ |
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Виробник: NXP USA Inc.
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 42dB
Current - Supply: 100mA
Noise Figure: 4.1dB
P1dB: 2.9dBm
Test Frequency: 3.5GHz
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 42dB
Current - Supply: 100mA
Noise Figure: 4.1dB
P1dB: 2.9dBm
Test Frequency: 3.5GHz
на замовлення 5950 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
OMA1006TL-SKT |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR A1006TL
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006TL
Supplied Contents: Board(s)
Contents: Board(s)
Description: EVAL BOARD FOR A1006TL
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006TL
Supplied Contents: Board(s)
Contents: Board(s)
товару немає в наявності
В кошику
од. на суму грн.
PN7120A0EV/C10801E |
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Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 49VFBGA
Packaging: Tray
Package / Case: 49-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 49-VFBGA (4x4.3)
Description: IC RFID READER 13.56MHZ 49VFBGA
Packaging: Tray
Package / Case: 49-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 49-VFBGA (4x4.3)
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 585.10 грн |
N74F74D,623 |
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на замовлення 27500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2049+ | 11.42 грн |
MCF51QE32CLH |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 780 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 816.91 грн |
10+ | 617.86 грн |
80+ | 511.49 грн |
SC68376BGMAB20R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tape & Reel (TR)
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tape & Reel (TR)
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
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FXTH8715116T1 |
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
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FXTH8715116T1 |
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
на замовлення 1882 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 870.11 грн |
10+ | 670.53 грн |
25+ | 620.21 грн |
100+ | 503.39 грн |
500+ | 471.93 грн |
1000+ | 440.47 грн |
FXTH870511DT1528 |
Виробник: NXP USA Inc.
Description: TPMS 7X7 450KPA X&Z AXIS
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: TPMS 7X7 450KPA X&Z AXIS
Packaging: Bulk
DigiKey Programmable: Not Verified
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FXTH8718026T1 |
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Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
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FXTH87EG02DT1 |
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
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FXTH87EG02DT1 |
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
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FXTH87EK116T1 |
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Виробник: NXP USA Inc.
Description: SENSOR MULT PRESSURE
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Pressure
Description: SENSOR MULT PRESSURE
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Pressure
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SPC5674KAVMM2R |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
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SPC5674KAVMM2 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
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SPC5674KAVMS2 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
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SPC5674KAVMS2R |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
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SPC5674FAMVV3R |
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Виробник: NXP USA Inc.
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
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SPC5674FAMVR3 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
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SPC5674FAMVR3R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
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SPC5674FAMVY3R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 516FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 516FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
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SPC5674FAMVV3 |
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Виробник: NXP USA Inc.
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
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LFJ74INTPZA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674F ON A 516 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
Description: QORIVVA MPC5674F ON A 516 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
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LFJ74INTPWA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674F ON A 416 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
Description: QORIVVA MPC5674F ON A 416 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
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LFVBBOJ74W1A |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674F 422 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
Description: QORIVVA MPC5674F 422 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
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LFVBBJ74WA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674A 416 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Description: QORIVVA MPC5674A 416 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
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LFJ74DBGZWA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674 416 PIN 1.0MM CA
Packaging: Bulk
For Use With/Related Products: MPC5674
Module/Board Type: Socket Adapter
Description: QORIVVA MPC5674 416 PIN 1.0MM CA
Packaging: Bulk
For Use With/Related Products: MPC5674
Module/Board Type: Socket Adapter
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LFVBBOJ74Z1A |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674F 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
Description: QORIVVA MPC5674F 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
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LFVBBJ74ZA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674A 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Description: QORIVVA MPC5674A 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
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LFVCAL32SYNC4 |
Виробник: NXP USA Inc.
Description: 32 BIT 4MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
Description: 32 BIT 4MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
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LFVCAL32SYNC8 |
Виробник: NXP USA Inc.
Description: 32 BIT 8MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Description: 32 BIT 8MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
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LFVBSJ74ZZ1A |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674 522 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Utilized IC / Part: MPC5674
Description: QORIVVA MPC5674 522 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Utilized IC / Part: MPC5674
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LFVBSJ74ZW1A |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674 422 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Utilized IC / Part: MPC5674
Description: QORIVVA MPC5674 422 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Utilized IC / Part: MPC5674
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LFVBSJ74ZWA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674 416 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Utilized IC / Part: MPC5674
Description: QORIVVA MPC5674 416 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Utilized IC / Part: MPC5674
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LFVBSJ74ZZA |
Виробник: NXP USA Inc.
Description: QORIVVA 522 PIN 1.0MM PRE-VERTIC
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Description: QORIVVA 522 PIN 1.0MM PRE-VERTIC
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
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SPC5674KAVJM2R |
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
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SPC5674KAVJM2 |
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
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PCA8575DB,118 |
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Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24SSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SSOP
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C 24SSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SSOP
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
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PCA8575DB,118 |
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Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24SSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SSOP
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C 24SSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SSOP
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
на замовлення 307 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 166.72 грн |
10+ | 118.95 грн |
25+ | 108.56 грн |
100+ | 91.16 грн |
250+ | 86.04 грн |
MCF52232CAF50 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
на замовлення 680 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1444.09 грн |
10+ | 1116.00 грн |
25+ | 1047.32 грн |
80+ | 977.93 грн |
PMV450ENEA215 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL FIELD-
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: NOW NEXPERIA SMALL SIGNAL FIELD-
Packaging: Bulk
DigiKey Programmable: Not Verified
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MPC8555EPXAPF |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 833MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 833MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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S912ZVHL32F1VLQ |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
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