Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35480) > Сторінка 508 з 592

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S912XDG128F2CAA S912XDG128F2CAA NXP USA Inc. MC9S12XDP512RMV2.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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P2040NSN1MMB NXP USA Inc. P2040_Rev2.pdf Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA
Packaging: Tray
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
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MC9S08AC128MFUE MC9S08AC128MFUE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
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TDA6111Q/N4,112 TDA6111Q/N4,112 NXP USA Inc. TDA6111Q.pdf Description: IC AMP GENERAL PURPOSE DBS9MPF
Packaging: Tube
Package / Case: 9-SIP Exposed Tab, Formed Leads
Mounting Type: Through Hole
Applications: General Purpose
Slew Rate: 3000V/µs
Supplier Device Package: DBS9MPF
Number of Circuits: 1
Current - Supply: 9 mA
Current - Output / Channel: 10 A
-3db Bandwidth: 16 MHz
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KW45Z41052AFPBR KW45Z41052AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41052AFTBR KW45Z41052AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41053AFPBR KW45Z41053AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41082AFPBR KW45Z41082AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41053AFTBR KW45Z41053AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45B41Z52AFPBR KW45B41Z52AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41082AFTBR KW45Z41082AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41083AFPBR KW45Z41083AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45B41Z53AFPBR KW45B41Z53AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41083AFTBR KW45Z41083AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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MVR5510AMMALESR2 MVR5510AMMALESR2 NXP USA Inc. VR5510.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MVR5510AMBALESR2 NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
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MVR5510AMDALESR2 NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
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MC33PF8200CLESR2 MC33PF8200CLESR2 NXP USA Inc. Description: PF8200
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
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MRFX1K80NR5 MRFX1K80NR5 NXP USA Inc. MRFX1K80N.pdf Description: RF MOSFET LDMOS 65V OM1230-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Voltage - Test: 65 V
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
1+15686.20 грн
10+13144.81 грн
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PSMN1R7-25YLC,115 PSMN1R7-25YLC,115 NXP USA Inc. Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Power Dissipation (Max): 164W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 59 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3735 pF @ 12 V
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RPI-CAM-MIPI RPI-CAM-MIPI NXP USA Inc. rpi-cam-mipi_overview.html?_gl=1*ongqnl*_ga*MTEwNjQyMjAzOS4xNzAxMjAxMTg0*_ga_WM5LE0KMSH*MTcwNDkwNDE3OS4xMS4xLjE3MDQ5MDg1ODcuMC4wLjA. Description: ACCESSORY BOARD:MIPI CAMERA CARD
Packaging: Box
For Use With/Related Products: AP1302, AR0144
Accessory Type: Adapter Board
Utilized IC / Part: AP1302, AR0144
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+8732.17 грн
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A2I22D050NR1 A2I22D050NR1 NXP USA Inc. Description: IC AMP W-CDMA 1.8-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 34dB
Current - Supply: 520mA
P1dB: 16.5dBm
Test Frequency: 1.8GHz
Supplier Device Package: TO-270WB-15
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A2I22D050NR1 A2I22D050NR1 NXP USA Inc. Description: IC AMP W-CDMA 1.8-2.2GHZ TO270WB
Packaging: Cut Tape (CT)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 34dB
Current - Supply: 520mA
P1dB: 16.5dBm
Test Frequency: 1.8GHz
Supplier Device Package: TO-270WB-15
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BGU8M1UK/SZ NXP USA Inc. Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB
Current - Supply: 5mA
Noise Figure: 0.7dB
P1dB: -5dBm
Test Frequency: 1.843GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
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S32K314EHT1MMMST S32K314EHT1MMMST NXP USA Inc. S32K3xx.pdf Description: S32K344 PHANTOM, 257MAPBGA, PROD
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
на замовлення 686 шт:
термін постачання 21-31 дні (днів)
1+1580.13 грн
10+1218.99 грн
25+1143.31 грн
100+994.86 грн
250+957.64 грн
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S32K314NHT1MMMST S32K314NHT1MMMST NXP USA Inc. S32K3xx.pdf Description: S32K344 PHANTOM, 257MAPBGA, PROD
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K344NHT1VMMST S32K344NHT1VMMST NXP USA Inc. Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K344NHT1VPBST S32K344NHT1VPBST NXP USA Inc. Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K344NHT1MMMST S32K344NHT1MMMST NXP USA Inc. Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K344NHT1MPBSR S32K344NHT1MPBSR NXP USA Inc. Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K344NHT1MPBST S32K344NHT1MPBST NXP USA Inc. Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K344EHT1MMMST S32K344EHT1MMMST NXP USA Inc. Description: LOCKSTEP CORE M7, 160MHZ, 4M FLA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K344EHT1MPBST S32K344EHT1MPBST NXP USA Inc. Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K3X4EVBQ172NE NXP USA Inc. Description: S32K3X4EVBQ172NE
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
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S32K3X4EVBQ172ND NXP USA Inc. Description: S32K3X4EVBQ172ND
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
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S32K3X4EVBQ172NS NXP USA Inc. Description: S32K3X4EVBQ172NS
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
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S32K3X4EVB-Q257 NXP USA Inc. Description: S32K3X4EVB-Q257 FULL-FEATURED EV
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
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RD-K344BMU NXP USA Inc. Description: RD-K344BMU
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: S32K344
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
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S32K314EHT1VPBST S32K314EHT1VPBST NXP USA Inc. S32K3xx.pdf Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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MPC603RRX266LC MPC603RRX266LC NXP USA Inc. MPC603E7TEC.pdf Description: IC MPU MPC6XX 266MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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BLF8G27LS-100V,112 NXP USA Inc. PHGLS25948-1.pdf?t.download=true&u=5oefqw Description: NOW AMPLEON, BLF8G27LS-100V, POW
Packaging: Bulk
Package / Case: SOT-1244B
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Power - Output: 25W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM6
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 900 mA
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
6+4217.97 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
BLF8G27LS-100V,118 NXP USA Inc. PHGLS25948-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 28V CDFM6
Packaging: Bulk
Package / Case: SOT-1244B
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Power - Output: 25W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM6
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 900 mA
на замовлення 74 шт:
термін постачання 21-31 дні (днів)
6+4200.00 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
S9S12G128AVLFR S9S12G128AVLFR NXP USA Inc. MC9S12G_Family_Manual_and_Datasheet.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
2000+348.23 грн
Мінімальне замовлення: 2000
В кошику  од. на суму  грн.
S9S12G128AVLFR S9S12G128AVLFR NXP USA Inc. MC9S12G_Family_Manual_and_Datasheet.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
1+637.53 грн
10+482.29 грн
100+399.27 грн
1000+326.81 грн
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S9S12GN48F0WLFR S9S12GN48F0WLFR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12G96ACLFR S9S12G96ACLFR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12G96F0MLFR S9S12G96F0MLFR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12G64AMLHR S9S12G64AMLHR NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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74AVCH2T45GS115 NXP USA Inc. 74AVCH2T45.pdf Description: NOW NEXPERIA 74AVCH2T45GS - BUS
Packaging: Bulk
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TEA19032BAAT/1J TEA19032BAAT/1J NXP USA Inc. TEA19032BT.pdf Description: IC SMPS CTRLR SMART CHARGE SO10
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Function: Controller
Interface: USB
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 10-SO
DigiKey Programmable: Not Verified
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)
2500+87.92 грн
5000+81.52 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
TEA19032BAAT/1J TEA19032BAAT/1J NXP USA Inc. TEA19032BT.pdf Description: IC SMPS CTRLR SMART CHARGE SO10
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Function: Controller
Interface: USB
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 10-SO
DigiKey Programmable: Not Verified
на замовлення 9994 шт:
термін постачання 21-31 дні (днів)
2+192.38 грн
10+166.19 грн
25+156.77 грн
100+125.35 грн
250+117.70 грн
500+102.99 грн
1000+83.94 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
PDTC114EE,115 PDTC114EE,115 NXP USA Inc. PDTC114E_SER.pdf description Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
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PDTC114EE,115 PDTC114EE,115 NXP USA Inc. PDTC114E_SER.pdf description Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
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MIMX8US3DVK08SC MIMX8US3DVK08SC NXP USA Inc. IMX8ULPCEC.pdf Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Supplier Device Package: 512-VFBGA (9.4x9.4)
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MIMX8US3DVP08SC MIMX8US3DVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 485-LFBGA (15x15)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M33
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
на замовлення 630 шт:
термін постачання 21-31 дні (днів)
1+1107.62 грн
10+850.49 грн
25+796.57 грн
100+736.59 грн
В кошику  од. на суму  грн.
LPC1224FBD64/121,1 LPC1224FBD64/121,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
на замовлення 175 шт:
термін постачання 21-31 дні (днів)
1+452.39 грн
10+264.17 грн
25+256.73 грн
160+234.31 грн
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MRF6VP21KHR5 MRF6VP21KHR5 NXP USA Inc. MRF6VP21KHR6.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 1000W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
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MRF6VP21KHR5 MRF6VP21KHR5 NXP USA Inc. MRF6VP21KHR6.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 1000W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+66312.35 грн
В кошику  од. на суму  грн.
MRFE6VP5600-225 NXP USA Inc. MRFE6VP5600H.pdf Description: MRFE6VP5600 REF BOARD - 225
Packaging: Bulk
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
1+67831.30 грн
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KTY84/150,153 KTY84/150,153 NXP USA Inc. KTY84_SER.pdf Description: SENSOR PTC 603OHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 300°C
Supplier Device Package: DO-34
Resistance @ 25°C: 603 Ohms
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S912XDG128F2CAA MC9S12XDP512RMV2.pdf
S912XDG128F2CAA
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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P2040NSN1MMB P2040_Rev2.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA
Packaging: Tray
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
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MC9S08AC128MFUE MC9S08AC60AD.pdf
MC9S08AC128MFUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
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TDA6111Q/N4,112 TDA6111Q.pdf
TDA6111Q/N4,112
Виробник: NXP USA Inc.
Description: IC AMP GENERAL PURPOSE DBS9MPF
Packaging: Tube
Package / Case: 9-SIP Exposed Tab, Formed Leads
Mounting Type: Through Hole
Applications: General Purpose
Slew Rate: 3000V/µs
Supplier Device Package: DBS9MPF
Number of Circuits: 1
Current - Supply: 9 mA
Current - Output / Channel: 10 A
-3db Bandwidth: 16 MHz
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KW45Z41052AFPBR KW45.pdf
KW45Z41052AFPBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41052AFTBR KW45.pdf
KW45Z41052AFTBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41053AFPBR KW45.pdf
KW45Z41053AFPBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41082AFPBR KW45.pdf
KW45Z41082AFPBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41053AFTBR KW45.pdf
KW45Z41053AFTBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45B41Z52AFPBR KW45.pdf
KW45B41Z52AFPBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41082AFTBR KW45.pdf
KW45Z41082AFTBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41083AFPBR KW45.pdf
KW45Z41083AFPBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45B41Z53AFPBR KW45.pdf
KW45B41Z53AFPBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41083AFTBR KW45.pdf
KW45Z41083AFTBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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MVR5510AMMALESR2 VR5510.pdf
MVR5510AMMALESR2
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MVR5510AMBALESR2
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
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MVR5510AMDALESR2
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
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MC33PF8200CLESR2
MC33PF8200CLESR2
Виробник: NXP USA Inc.
Description: PF8200
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
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MRFX1K80NR5 MRFX1K80N.pdf
MRFX1K80NR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 65V OM1230-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Voltage - Test: 65 V
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+15686.20 грн
10+13144.81 грн
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PSMN1R7-25YLC,115
PSMN1R7-25YLC,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Power Dissipation (Max): 164W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 59 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3735 pF @ 12 V
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RPI-CAM-MIPI rpi-cam-mipi_overview.html?_gl=1*ongqnl*_ga*MTEwNjQyMjAzOS4xNzAxMjAxMTg0*_ga_WM5LE0KMSH*MTcwNDkwNDE3OS4xMS4xLjE3MDQ5MDg1ODcuMC4wLjA.
RPI-CAM-MIPI
Виробник: NXP USA Inc.
Description: ACCESSORY BOARD:MIPI CAMERA CARD
Packaging: Box
For Use With/Related Products: AP1302, AR0144
Accessory Type: Adapter Board
Utilized IC / Part: AP1302, AR0144
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+8732.17 грн
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A2I22D050NR1
A2I22D050NR1
Виробник: NXP USA Inc.
Description: IC AMP W-CDMA 1.8-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 34dB
Current - Supply: 520mA
P1dB: 16.5dBm
Test Frequency: 1.8GHz
Supplier Device Package: TO-270WB-15
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A2I22D050NR1
A2I22D050NR1
Виробник: NXP USA Inc.
Description: IC AMP W-CDMA 1.8-2.2GHZ TO270WB
Packaging: Cut Tape (CT)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 34dB
Current - Supply: 520mA
P1dB: 16.5dBm
Test Frequency: 1.8GHz
Supplier Device Package: TO-270WB-15
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BGU8M1UK/SZ
Виробник: NXP USA Inc.
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB
Current - Supply: 5mA
Noise Figure: 0.7dB
P1dB: -5dBm
Test Frequency: 1.843GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
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S32K314EHT1MMMST S32K3xx.pdf
S32K314EHT1MMMST
Виробник: NXP USA Inc.
Description: S32K344 PHANTOM, 257MAPBGA, PROD
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
на замовлення 686 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1580.13 грн
10+1218.99 грн
25+1143.31 грн
100+994.86 грн
250+957.64 грн
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S32K314NHT1MMMST S32K3xx.pdf
S32K314NHT1MMMST
Виробник: NXP USA Inc.
Description: S32K344 PHANTOM, 257MAPBGA, PROD
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K344NHT1VMMST
S32K344NHT1VMMST
Виробник: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K344NHT1VPBST
S32K344NHT1VPBST
Виробник: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K344NHT1MMMST
S32K344NHT1MMMST
Виробник: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K344NHT1MPBSR
S32K344NHT1MPBSR
Виробник: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K344NHT1MPBST
S32K344NHT1MPBST
Виробник: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K344EHT1MMMST
S32K344EHT1MMMST
Виробник: NXP USA Inc.
Description: LOCKSTEP CORE M7, 160MHZ, 4M FLA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K344EHT1MPBST
S32K344EHT1MPBST
Виробник: NXP USA Inc.
Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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S32K3X4EVBQ172NE
Виробник: NXP USA Inc.
Description: S32K3X4EVBQ172NE
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
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S32K3X4EVBQ172ND
Виробник: NXP USA Inc.
Description: S32K3X4EVBQ172ND
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
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S32K3X4EVBQ172NS
Виробник: NXP USA Inc.
Description: S32K3X4EVBQ172NS
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
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S32K3X4EVB-Q257
Виробник: NXP USA Inc.
Description: S32K3X4EVB-Q257 FULL-FEATURED EV
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
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RD-K344BMU
Виробник: NXP USA Inc.
Description: RD-K344BMU
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: S32K344
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
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S32K314EHT1VPBST S32K3xx.pdf
S32K314EHT1VPBST
Виробник: NXP USA Inc.
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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MPC603RRX266LC MPC603E7TEC.pdf
MPC603RRX266LC
Виробник: NXP USA Inc.
Description: IC MPU MPC6XX 266MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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BLF8G27LS-100V,112 PHGLS25948-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: NOW AMPLEON, BLF8G27LS-100V, POW
Packaging: Bulk
Package / Case: SOT-1244B
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Power - Output: 25W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM6
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 900 mA
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+4217.97 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
BLF8G27LS-100V,118 PHGLS25948-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V CDFM6
Packaging: Bulk
Package / Case: SOT-1244B
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Power - Output: 25W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM6
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 900 mA
на замовлення 74 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+4200.00 грн
Мінімальне замовлення: 6
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S9S12G128AVLFR MC9S12G_Family_Manual_and_Datasheet.pdf
S9S12G128AVLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2000+348.23 грн
Мінімальне замовлення: 2000
В кошику  од. на суму  грн.
S9S12G128AVLFR MC9S12G_Family_Manual_and_Datasheet.pdf
S9S12G128AVLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+637.53 грн
10+482.29 грн
100+399.27 грн
1000+326.81 грн
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S9S12GN48F0WLFR
S9S12GN48F0WLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12G96ACLFR
S9S12G96ACLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12G96F0MLFR
S9S12G96F0MLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12G64AMLHR
S9S12G64AMLHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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74AVCH2T45GS115 74AVCH2T45.pdf
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AVCH2T45GS - BUS
Packaging: Bulk
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TEA19032BAAT/1J TEA19032BT.pdf
TEA19032BAAT/1J
Виробник: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHARGE SO10
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Function: Controller
Interface: USB
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 10-SO
DigiKey Programmable: Not Verified
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+87.92 грн
5000+81.52 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
TEA19032BAAT/1J TEA19032BT.pdf
TEA19032BAAT/1J
Виробник: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHARGE SO10
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Function: Controller
Interface: USB
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 10-SO
DigiKey Programmable: Not Verified
на замовлення 9994 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+192.38 грн
10+166.19 грн
25+156.77 грн
100+125.35 грн
250+117.70 грн
500+102.99 грн
1000+83.94 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
PDTC114EE,115 description PDTC114E_SER.pdf
PDTC114EE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
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PDTC114EE,115 description PDTC114E_SER.pdf
PDTC114EE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
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MIMX8US3DVK08SC IMX8ULPCEC.pdf
MIMX8US3DVK08SC
Виробник: NXP USA Inc.
Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Supplier Device Package: 512-VFBGA (9.4x9.4)
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MIMX8US3DVP08SC IMX8ULPIEC.pdf
MIMX8US3DVP08SC
Виробник: NXP USA Inc.
Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 485-LFBGA (15x15)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M33
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
на замовлення 630 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1107.62 грн
10+850.49 грн
25+796.57 грн
100+736.59 грн
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LPC1224FBD64/121,1 LPC122X.pdf
LPC1224FBD64/121,1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
на замовлення 175 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+452.39 грн
10+264.17 грн
25+256.73 грн
160+234.31 грн
В кошику  од. на суму  грн.
MRF6VP21KHR5 MRF6VP21KHR6.pdf
MRF6VP21KHR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 1000W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
товару немає в наявності
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MRF6VP21KHR5 MRF6VP21KHR6.pdf
MRF6VP21KHR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 1000W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+66312.35 грн
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MRFE6VP5600-225 MRFE6VP5600H.pdf
Виробник: NXP USA Inc.
Description: MRFE6VP5600 REF BOARD - 225
Packaging: Bulk
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+67831.30 грн
В кошику  од. на суму  грн.
KTY84/150,153 KTY84_SER.pdf
KTY84/150,153
Виробник: NXP USA Inc.
Description: SENSOR PTC 603OHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 300°C
Supplier Device Package: DO-34
Resistance @ 25°C: 603 Ohms
товару немає в наявності
В кошику  од. на суму  грн.
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