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BAS16QA147 BAS16QA147 NXP USA Inc. BAS16QA.pdf Description: DIODE STD 100V 290MA DFN1010D3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: DFN1010D-3
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 290mA
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Grade: Automotive
Qualification: AEC-Q101
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MPC17529EV MPC17529EV NXP USA Inc. MPC17529.pdf Description: IC MTR DRV BIPLR 2.7-5.6V 20VMFP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MPC17533EV MPC17533EV NXP USA Inc. DS_568_MPC17533.pdf Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 16-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MCIMX515CJM6C MCIMX515CJM6C NXP USA Inc. IMX51CONINDFS.pdf Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 95°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
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SLN-SVUI-IOT SLN-SVUI-IOT NXP USA Inc. SLN-SVUI-IOT-UG.pdf Description: VOICE COMMAND EVAL BOARD
Packaging: Bulk
Function: Voice Recognition
Type: Audio/Voice
Supplied Contents: Board(s), Cable(s), Accessories
Contents: Board(s), Cable(s), Accessories
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
1+19863.32 грн
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MC33812EKR2 MC33812EKR2 NXP USA Inc. Description: IC DVR IGNITION/INJECTOR 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
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MC33812EK MC33812EK NXP USA Inc. Description: IC DVR IGNITION/INJECTOR 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
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K32W061-DK006 K32W061-DK006 NXP USA Inc. K32W061.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
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MK51DX256ZCLL10 MK51DX256ZCLL10 NXP USA Inc. KNTSK50FMLYFS.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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SPC5566MVR144R NXP USA Inc. MPC5566.pdf Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
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MCIMX6G1CVM05ABR MCIMX6G1CVM05ABR NXP USA Inc. IMX6ULTRALITEFS.pdf Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MCIMX6G1AVM07ABR NXP USA Inc. Description: I.MX 32-BIT MPU, ARM CORTEX-A7 C
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MCIMX6G2AVM05ABR NXP USA Inc. Description: I.MX 32-BIT MPU, ARM CORTEX-A7 C
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MCIMX6G2DVK05AB MCIMX6G2DVK05AB NXP USA Inc. IMX6ULCEC.pdf Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MCIMX6G1AVM07AB MCIMX6G1AVM07AB NXP USA Inc. IMX6ULTRALITEFS.pdf Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MPC8548VJATGD NXP USA Inc. FSCLS11828-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC RISC MICROPROCESSOR,
Packaging: Bulk
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
2+20161.42 грн
Мінімальне замовлення: 2
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KMPC8548EVUAUJ KMPC8548EVUAUJ NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
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MPC8548EPXAUJB MPC8548EPXAUJB NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
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MPC8548EPXAVHB MPC8548EPXAVHB NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.5GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
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MPC8548PXAUJC MPC8548PXAUJC NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
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MPC8548PXATGD MPC8548PXATGD NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.2GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
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SC26C92C1A,529 SC26C92C1A,529 NXP USA Inc. SC26C92.pdf Description: IC DUART 1MBPS 44PLCC
Packaging: Tube
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
FIFO's: 8 Byte
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC (16.59x16.59)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
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SP05127-05UL NXP USA Inc. Description: EVAL BOARD FOR TEA1936X
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
Contents: Board(s)
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SP05145-01UL NXP USA Inc. Description: SP05145-01
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
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S9S12VR32F0CLCR S9S12VR32F0CLCR NXP USA Inc. 15944_MC9S12VRRMV3.pdf Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
DigiKey Programmable: Not Verified
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S9S12VR32F0CLC S9S12VR32F0CLC NXP USA Inc. 15944_MC9S12VRRMV3.pdf Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
DigiKey Programmable: Not Verified
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MPF5200AMMG3ES MPF5200AMMG3ES NXP USA Inc. R_MPF5200AMMG3ES.pdf Description: IC REG BUCK 1.2V/1.2V DL 32HWQFN
Packaging: Tray
Package / Case: 32-PowerWFQFN
Output Type: Fixed
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 2
Function: Step-Down
Output Configuration: Positive
Frequency - Switching: 2MHz
Topology: Buck
Supplier Device Package: 32-HWQFN (5x5)
Synchronous Rectifier: No
Voltage - Output (Min/Fixed): 1.2V, 1.2V
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
1+516.70 грн
10+383.78 грн
25+355.41 грн
100+304.26 грн
490+282.11 грн
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MPF5200AMMG2ES MPF5200AMMG2ES NXP USA Inc. R_MPF5200AMMG2ES.pdf Description: IC REG BUCK 1.2V/1.2V DL 32HWQFN
Packaging: Tray
Package / Case: 32-PowerWFQFN
Output Type: Fixed
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 2
Function: Step-Down
Output Configuration: Positive
Frequency - Switching: 2MHz
Topology: Buck
Supplier Device Package: 32-HWQFN (5x5)
Synchronous Rectifier: No
Voltage - Output (Min/Fixed): 1.2V, 1.2V
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
1+516.70 грн
10+383.78 грн
25+355.41 грн
100+304.26 грн
490+282.11 грн
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MPF5200AMMG2ESR2 NXP USA Inc. Description: POWER MANAGEMENT SPECIALIZED - P
Packaging: Tape & Reel (TR)
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MPF5200AMMG3ESR2 NXP USA Inc. Description: POWER MANAGEMENT SPECIALIZED - P
Packaging: Tape & Reel (TR)
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MPF5200AMMG0ESR2 MPF5200AMMG0ESR2 NXP USA Inc. PF5200.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 32-HWQFN (5x5)
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MPF5200AMMG0ES MPF5200AMMG0ES NXP USA Inc. PF5200.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 40µA
Supplier Device Package: 32-HWQFN (5x5)
Grade: Automotive
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
1+477.79 грн
10+419.74 грн
25+411.77 грн
40+383.62 грн
80+344.22 грн
230+342.94 грн
490+316.14 грн
В кошику  од. на суму  грн.
SPC5668EAMMG NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 208BGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
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SPC5668EF1AMMG NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 208BGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
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MIMXRT1170-EVKB MIMXRT1170-EVKB NXP USA Inc. IMXRT1170CEC.pdf Description: I.MX RT1170 EVAL KIT REV.B
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Utilized IC / Part: RT1170
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MCIMX6D4AVT08AC-NXP NXP USA Inc. PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw Description: I.MX 6 SERIES 32 BIT MPU, DUAL A
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 59 шт:
термін постачання 21-31 дні (днів)
5+4331.87 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
MC33FS8430G1ESR2 NXP USA Inc. Description: SYSTEM BASIS CHIP FS8430
Packaging: Tape & Reel (TR)
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P1012NSN2HFB P1012NSN2HFB NXP USA Inc. QP1021FS.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
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MC13201FCR2 MC13201FCR2 NXP USA Inc. MC13201.pdf Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
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MC56F8006VWL MC56F8006VWL NXP USA Inc. MC56F8006.pdf Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
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PTN3360DBS518 PTN3360DBS518 NXP USA Inc. PTN3360D.pdf Description: ENHANCED PERFORMANCE HDMI/DVI LE
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: DVI, HDMI
Voltage - Supply: 3V ~ 3.6V
Applications: DisplayPort to HDMI, DVI Adapters
Supplier Device Package: 48-HVQFN (7x7)
на замовлення 230413 шт:
термін постачання 21-31 дні (днів)
290+78.51 грн
Мінімальне замовлення: 290
В кошику  од. на суму  грн.
S9S08QD2J1CSCR S9S08QD2J1CSCR NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
на замовлення 2295 шт:
термін постачання 21-31 дні (днів)
2+207.01 грн
10+148.71 грн
25+136.13 грн
100+114.77 грн
250+108.58 грн
500+104.85 грн
1000+100.12 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
OM-SE050ARD-E OM-SE050ARD-E NXP USA Inc. Description: SE050E ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SE050
Platform: Arduino
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OMA1006UK-SKT NXP USA Inc. A1006_Demo-Dev_Kit.pdf Description: EVAL BOARD FOR A1006UK
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006UK
Supplied Contents: Board(s)
Contents: Board(s)
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OM67201ULUL NXP USA Inc. Description: A1007 DEMONSTRATION BOARD
Packaging: Box
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OMPCA9957LEDEV NXP USA Inc. PCA9957DS.pdf Description: EVAL BOARD FOR PCA9957
Packaging: Bulk
Features: Dimmable
Voltage - Output: 5.5V
Voltage - Input: 2.7V ~ 5.5V
Current - Output / Channel: 32mA
Utilized IC / Part: PCA9957
Supplied Contents: Board(s)
Outputs and Type: 24 Non-Isolated Outputs
Contents: Board(s)
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OM-SE050ARD-F OM-SE050ARD-F NXP USA Inc. SE050-DATASHEET.pdf?pspll=1 Description: SE050F ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SE050
Platform: Arduino
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OM13582UL NXP USA Inc. Description: TYPE-C DOCK BOARD
Packaging: Bulk
Contents: Board(s)
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OM13581UL NXP USA Inc. Description: TYPE-C HOST BOARD
Packaging: Bulk
Contents: Board(s)
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OM13580JP NXP USA Inc. Description: COMPLETE TYE-C DEMONSTRATION KIT
Packaging: Bulk
Contents: Board(s)
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PTVS13VP1UP/WD115 PTVS13VP1UP/WD115 NXP USA Inc. PHGLS23376-1.pdf?t.download=true&u=5oefqw Description: TVS DIODE 13VWM 21.5VC CFP5
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Current - Peak Pulse (10/1000µs): 27.9A
Voltage - Reverse Standoff (Typ): 13V (Max)
Supplier Device Package: CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
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AFT05MS031GNR1 AFT05MS031GNR1 NXP USA Inc. AFT05MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
на замовлення 750 шт:
термін постачання 21-31 дні (днів)
500+1690.53 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
AFT05MS031GNR1 AFT05MS031GNR1 NXP USA Inc. AFT05MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
на замовлення 1030 шт:
термін постачання 21-31 дні (днів)
1+2506.51 грн
10+1960.61 грн
25+1847.38 грн
100+1616.93 грн
250+1574.32 грн
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MC33FS4501CAER2 MC33FS4501CAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC35FS4501CAER2 MC35FS4501CAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS4501CAE MC33FS4501CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC35FS4501CAE MC35FS4501CAE NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MPC8535AVJANGA NXP USA Inc. PHGL-S-A0002263525-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCH SOC
Packaging: Bulk
на замовлення 29 шт:
термін постачання 21-31 дні (днів)
3+10294.90 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
MPC8535BVJANGA NXP USA Inc. NXP_MPC8548EEC.pdf?t.download=true&u=ovmfp3 Description: POWERQUICC, 32 BIT POWER ARCH SO
Packaging: Bulk
на замовлення 720 шт:
термін постачання 21-31 дні (днів)
3+10910.97 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
MPC8533VTALFA NXP USA Inc. FSCL-S-A0001172477-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC RISC MICROPROCESSOR
Packaging: Bulk
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
4+5926.78 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
BAS16QA147 BAS16QA.pdf
BAS16QA147
Виробник: NXP USA Inc.
Description: DIODE STD 100V 290MA DFN1010D3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: DFN1010D-3
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 290mA
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Grade: Automotive
Qualification: AEC-Q101
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MPC17529EV MPC17529.pdf
MPC17529EV
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.6V 20VMFP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MPC17533EV DS_568_MPC17533.pdf
MPC17533EV
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 16-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MCIMX515CJM6C IMX51CONINDFS.pdf
MCIMX515CJM6C
Виробник: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 95°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
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SLN-SVUI-IOT SLN-SVUI-IOT-UG.pdf
SLN-SVUI-IOT
Виробник: NXP USA Inc.
Description: VOICE COMMAND EVAL BOARD
Packaging: Bulk
Function: Voice Recognition
Type: Audio/Voice
Supplied Contents: Board(s), Cable(s), Accessories
Contents: Board(s), Cable(s), Accessories
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+19863.32 грн
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MC33812EKR2
MC33812EKR2
Виробник: NXP USA Inc.
Description: IC DVR IGNITION/INJECTOR 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
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MC33812EK
MC33812EK
Виробник: NXP USA Inc.
Description: IC DVR IGNITION/INJECTOR 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
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K32W061-DK006 K32W061.pdf
K32W061-DK006
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
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MK51DX256ZCLL10 KNTSK50FMLYFS.pdf
MK51DX256ZCLL10
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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SPC5566MVR144R MPC5566.pdf
Виробник: NXP USA Inc.
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
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MCIMX6G1CVM05ABR IMX6ULTRALITEFS.pdf
MCIMX6G1CVM05ABR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MCIMX6G1AVM07ABR
Виробник: NXP USA Inc.
Description: I.MX 32-BIT MPU, ARM CORTEX-A7 C
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MCIMX6G2AVM05ABR
Виробник: NXP USA Inc.
Description: I.MX 32-BIT MPU, ARM CORTEX-A7 C
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MCIMX6G2DVK05AB IMX6ULCEC.pdf
MCIMX6G2DVK05AB
Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MCIMX6G1AVM07AB IMX6ULTRALITEFS.pdf
MCIMX6G1AVM07AB
Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MPC8548VJATGD FSCLS11828-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: POWERQUICC RISC MICROPROCESSOR,
Packaging: Bulk
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+20161.42 грн
Мінімальне замовлення: 2
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KMPC8548EVUAUJ MPC8548EEC.pdf
KMPC8548EVUAUJ
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
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MPC8548EPXAUJB MPC8548EEC.pdf
MPC8548EPXAUJB
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
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MPC8548EPXAVHB MPC8548EEC.pdf
MPC8548EPXAVHB
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.5GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
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MPC8548PXAUJC MPC8548EEC.pdf
MPC8548PXAUJC
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
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MPC8548PXATGD MPC8548EEC.pdf
MPC8548PXATGD
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.2GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
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SC26C92C1A,529 SC26C92.pdf
SC26C92C1A,529
Виробник: NXP USA Inc.
Description: IC DUART 1MBPS 44PLCC
Packaging: Tube
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
FIFO's: 8 Byte
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC (16.59x16.59)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
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SP05127-05UL
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TEA1936X
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
Contents: Board(s)
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SP05145-01UL
Виробник: NXP USA Inc.
Description: SP05145-01
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
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S9S12VR32F0CLCR 15944_MC9S12VRRMV3.pdf
S9S12VR32F0CLCR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
DigiKey Programmable: Not Verified
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S9S12VR32F0CLC 15944_MC9S12VRRMV3.pdf
S9S12VR32F0CLC
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
DigiKey Programmable: Not Verified
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MPF5200AMMG3ES R_MPF5200AMMG3ES.pdf
MPF5200AMMG3ES
Виробник: NXP USA Inc.
Description: IC REG BUCK 1.2V/1.2V DL 32HWQFN
Packaging: Tray
Package / Case: 32-PowerWFQFN
Output Type: Fixed
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 2
Function: Step-Down
Output Configuration: Positive
Frequency - Switching: 2MHz
Topology: Buck
Supplier Device Package: 32-HWQFN (5x5)
Synchronous Rectifier: No
Voltage - Output (Min/Fixed): 1.2V, 1.2V
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+516.70 грн
10+383.78 грн
25+355.41 грн
100+304.26 грн
490+282.11 грн
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MPF5200AMMG2ES R_MPF5200AMMG2ES.pdf
MPF5200AMMG2ES
Виробник: NXP USA Inc.
Description: IC REG BUCK 1.2V/1.2V DL 32HWQFN
Packaging: Tray
Package / Case: 32-PowerWFQFN
Output Type: Fixed
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 2
Function: Step-Down
Output Configuration: Positive
Frequency - Switching: 2MHz
Topology: Buck
Supplier Device Package: 32-HWQFN (5x5)
Synchronous Rectifier: No
Voltage - Output (Min/Fixed): 1.2V, 1.2V
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+516.70 грн
10+383.78 грн
25+355.41 грн
100+304.26 грн
490+282.11 грн
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MPF5200AMMG2ESR2
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT SPECIALIZED - P
Packaging: Tape & Reel (TR)
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MPF5200AMMG3ESR2
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT SPECIALIZED - P
Packaging: Tape & Reel (TR)
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MPF5200AMMG0ESR2 PF5200.pdf
MPF5200AMMG0ESR2
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 32-HWQFN (5x5)
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MPF5200AMMG0ES PF5200.pdf
MPF5200AMMG0ES
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 40µA
Supplier Device Package: 32-HWQFN (5x5)
Grade: Automotive
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+477.79 грн
10+419.74 грн
25+411.77 грн
40+383.62 грн
80+344.22 грн
230+342.94 грн
490+316.14 грн
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SPC5668EAMMG
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208BGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
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SPC5668EF1AMMG
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208BGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
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MIMXRT1170-EVKB IMXRT1170CEC.pdf
MIMXRT1170-EVKB
Виробник: NXP USA Inc.
Description: I.MX RT1170 EVAL KIT REV.B
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Utilized IC / Part: RT1170
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MCIMX6D4AVT08AC-NXP PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: I.MX 6 SERIES 32 BIT MPU, DUAL A
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 59 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+4331.87 грн
Мінімальне замовлення: 5
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MC33FS8430G1ESR2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8430
Packaging: Tape & Reel (TR)
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P1012NSN2HFB QP1021FS.pdf
P1012NSN2HFB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
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MC13201FCR2 MC13201.pdf
MC13201FCR2
Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
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MC56F8006VWL MC56F8006.pdf
MC56F8006VWL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
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PTN3360DBS518 PTN3360D.pdf
PTN3360DBS518
Виробник: NXP USA Inc.
Description: ENHANCED PERFORMANCE HDMI/DVI LE
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: DVI, HDMI
Voltage - Supply: 3V ~ 3.6V
Applications: DisplayPort to HDMI, DVI Adapters
Supplier Device Package: 48-HVQFN (7x7)
на замовлення 230413 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
290+78.51 грн
Мінімальне замовлення: 290
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S9S08QD2J1CSCR MC9S08QD4.pdf
S9S08QD2J1CSCR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
на замовлення 2295 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+207.01 грн
10+148.71 грн
25+136.13 грн
100+114.77 грн
250+108.58 грн
500+104.85 грн
1000+100.12 грн
Мінімальне замовлення: 2
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OM-SE050ARD-E
OM-SE050ARD-E
Виробник: NXP USA Inc.
Description: SE050E ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SE050
Platform: Arduino
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OMA1006UK-SKT A1006_Demo-Dev_Kit.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR A1006UK
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006UK
Supplied Contents: Board(s)
Contents: Board(s)
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OM67201ULUL
Виробник: NXP USA Inc.
Description: A1007 DEMONSTRATION BOARD
Packaging: Box
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OMPCA9957LEDEV PCA9957DS.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PCA9957
Packaging: Bulk
Features: Dimmable
Voltage - Output: 5.5V
Voltage - Input: 2.7V ~ 5.5V
Current - Output / Channel: 32mA
Utilized IC / Part: PCA9957
Supplied Contents: Board(s)
Outputs and Type: 24 Non-Isolated Outputs
Contents: Board(s)
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OM-SE050ARD-F SE050-DATASHEET.pdf?pspll=1
OM-SE050ARD-F
Виробник: NXP USA Inc.
Description: SE050F ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SE050
Platform: Arduino
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OM13582UL
Виробник: NXP USA Inc.
Description: TYPE-C DOCK BOARD
Packaging: Bulk
Contents: Board(s)
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OM13581UL
Виробник: NXP USA Inc.
Description: TYPE-C HOST BOARD
Packaging: Bulk
Contents: Board(s)
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OM13580JP
Виробник: NXP USA Inc.
Description: COMPLETE TYE-C DEMONSTRATION KIT
Packaging: Bulk
Contents: Board(s)
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PTVS13VP1UP/WD115 PHGLS23376-1.pdf?t.download=true&u=5oefqw
PTVS13VP1UP/WD115
Виробник: NXP USA Inc.
Description: TVS DIODE 13VWM 21.5VC CFP5
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Current - Peak Pulse (10/1000µs): 27.9A
Voltage - Reverse Standoff (Typ): 13V (Max)
Supplier Device Package: CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
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AFT05MS031GNR1 AFT05MS031N.pdf
AFT05MS031GNR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
на замовлення 750 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
500+1690.53 грн
Мінімальне замовлення: 500
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AFT05MS031GNR1 AFT05MS031N.pdf
AFT05MS031GNR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
на замовлення 1030 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2506.51 грн
10+1960.61 грн
25+1847.38 грн
100+1616.93 грн
250+1574.32 грн
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MC33FS4501CAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS4501CAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC35FS4501CAER2 35FS4500-35FS6500SDS.pdf
MC35FS4501CAER2
Виробник: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS4501CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS4501CAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC35FS4501CAE 35FS4500-35FS6500SDS.pdf
MC35FS4501CAE
Виробник: NXP USA Inc.
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MPC8535AVJANGA PHGL-S-A0002263525-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCH SOC
Packaging: Bulk
на замовлення 29 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+10294.90 грн
Мінімальне замовлення: 3
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MPC8535BVJANGA NXP_MPC8548EEC.pdf?t.download=true&u=ovmfp3
Виробник: NXP USA Inc.
Description: POWERQUICC, 32 BIT POWER ARCH SO
Packaging: Bulk
на замовлення 720 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+10910.97 грн
Мінімальне замовлення: 3
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MPC8533VTALFA FSCL-S-A0001172477-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: POWERQUICC RISC MICROPROCESSOR
Packaging: Bulk
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+5926.78 грн
Мінімальне замовлення: 4
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