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MM912J637AM2EP MM912J637AM2EP NXP USA Inc. MM912_637D1.pdf Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
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PCT2075GVX PCT2075GVX NXP USA Inc. PCT2075.pdf Description: SENSOR DIGITAL -55C-125C 6TSOP
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
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PCT2075GVX PCT2075GVX NXP USA Inc. PCT2075.pdf Description: SENSOR DIGITAL -55C-125C 6TSOP
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
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MC9S08JS16LCWJ MC9S08JS16LCWJ NXP USA Inc. MC9S08JS16.pdf Description: IC MCU 8BIT 16KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
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MPC8245LZU266D MPC8245LZU266D NXP USA Inc. MPC8245.pdf Description: IC MPU MPC82XX 266MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
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LPC1111FDH20/002,5 LPC1111FDH20/002,5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
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LPC1111FDH20/002,5 LPC1111FDH20/002,5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
на замовлення 575 шт:
термін постачання 21-31 дні (днів)
2+174.68 грн
10+101.23 грн
25+98.51 грн
100+89.91 грн
250+89.28 грн
500+88.64 грн
Мінімальне замовлення: 2
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MC68HC705C8AB MC68HC705C8AB NXP USA Inc. MC68HC705C8A.pdf Description: IC MCU 8BIT 8KB OTP 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 42-PDIP
Number of I/O: 24
DigiKey Programmable: Not Verified
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MC68HC705C8AFNE MC68HC705C8AFNE NXP USA Inc. MC68HC705C8A.pdf Description: IC MCU 8BIT 8KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Verified
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MIMX8SL1CVNFZBAR NXP USA Inc. Description: I.MX8SOLOLXLITE 15SQ
Packaging: Tape & Reel (TR)
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MIMX8SL1CVNFZBA NXP USA Inc. Description: I.MX8SOLOLXLITE 15SQ
Packaging: Tray
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SAF4000EL/101S470K NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tray
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SAF4000EL/101S275Y NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
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74LVC2G241DP-Q100125 74LVC2G241DP-Q100125 NXP USA Inc. 74LVC2G241_Q100.pdf Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-TSSOP
Grade: Automotive
Qualification: AEC-Q100
на замовлення 81040 шт:
термін постачання 21-31 дні (днів)
1354+16.15 грн
Мінімальне замовлення: 1354
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A5M34TG140-TCT1 A5M34TG140-TCT1 NXP USA Inc. A5M34TG140-TC.pdf Description: RF AMPLIFIER AIRFAST POWER AMPLI
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.67GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.5dB
P1dB: 49.7dBm
Test Frequency: 3.67GHz
Supplier Device Package: 30-PLGA (14x10)
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A5M34TG140-TCT1 A5M34TG140-TCT1 NXP USA Inc. A5M34TG140-TC.pdf Description: RF AMPLIFIER AIRFAST POWER AMPLI
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.67GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.5dB
P1dB: 49.7dBm
Test Frequency: 3.67GHz
Supplier Device Package: 30-PLGA (14x10)
на замовлення 1035 шт:
термін постачання 21-31 дні (днів)
1+5868.14 грн
10+4966.89 грн
25+4788.03 грн
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MAC7121MAG40 MAC7121MAG40 NXP USA Inc. MAC7100.pdf Description: IC MCU 32BIT 544KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM7®
Data Converters: A/D 16x8/10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 85
DigiKey Programmable: Not Verified
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LPC1114LVFHN24/103 LPC1114LVFHN24/103 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
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LFTHNBT NXP USA Inc. Description: 44 PIN 0.8 MM QFP SURFACE MOUNT
Packaging: Bulk
Module/Board Type: Socket Module - QFP
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LFTHNYLT NXP USA Inc. Description: 144 PIN 0.5MM QFP TARGET INTERFA
Packaging: Bulk
Module/Board Type: Socket Module - QFP
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LFTHNYBT NXP USA Inc. Description: 44PIN .8MM QFP TARGET INTERFACE
Packaging: Bulk
Module/Board Type: Socket Module - QFP
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MMPF0100F3AEPR2 MMPF0100F3AEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
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MMPF0100F6AEPR2 MMPF0100F6AEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
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MMPF0100FCAEPR2 MMPF0100FCAEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
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MMPF0100F6ANESR2 MMPF0100F6ANESR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
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MMPF0100FAANESR2 MMPF0100FAANESR2 NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
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MMPF0100FCANESR2 MMPF0100FCANESR2 NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
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MMPF0100F0AZESR2 MMPF0100F0AZESR2 NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MMPF0100F6AZESR2 MMPF0100F6AZESR2 NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MMPF0100F8AZESR2 MMPF0100F8AZESR2 NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MMPF0100FAAZESR2 MMPF0100FAAZESR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MMPF0100FAANES MMPF0100FAANES NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
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MMPF0100FCANES MMPF0100FCANES NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
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MMPF0100F8AZES MMPF0100F8AZES NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MMPF0100FAAZES MMPF0100FAAZES NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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K32L2A31VLH1A K32L2A31VLH1A NXP USA Inc. K32L2Ax.pdf Description: K32 L2A 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
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S912XET512J3VAG S912XET512J3VAG NXP USA Inc. Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
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MRF1517NT1 MRF1517NT1 NXP USA Inc. MRF1517N.pdf Description: RF MOSFET LDMOS 7.5V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Current Rating (Amps): 4A
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 8W
Gain: 14dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Voltage - Rated: 25 V
Voltage - Test: 7.5 V
Current - Test: 150 mA
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MRF1517NT1 MRF1517NT1 NXP USA Inc. MRF1517N.pdf Description: RF MOSFET LDMOS 7.5V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Current Rating (Amps): 4A
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 8W
Gain: 14dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Voltage - Rated: 25 V
Voltage - Test: 7.5 V
Current - Test: 150 mA
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PDTC115EE,115 PDTC115EE,115 NXP USA Inc. PDTC115E_SERIES.pdf Description: TRANS PREBIAS NPN 50V SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 20 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 100 kOhms
Resistor - Emitter Base (R2): 100 kOhms
Resistors Included: R1 and R2
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PDTC115EE,115 PDTC115EE,115 NXP USA Inc. PDTC115E_SERIES.pdf Description: TRANS PREBIAS NPN 50V SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 20 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 100 kOhms
Resistor - Emitter Base (R2): 100 kOhms
Resistors Included: R1 and R2
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SPC5742PK1MLQ8 SPC5742PK1MLQ8 NXP USA Inc. MPC574xP_FS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
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MPC17531ATEJ MPC17531ATEJ NXP USA Inc. Description: IC MTR DRV BIPLR 2.7-3.6V 20SSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 2V ~ 8.6V
Supplier Device Package: 20-TSSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MPC17531ATEJR2 MPC17531ATEJR2 NXP USA Inc. Description: IC MTR DRV BIPLR 2.7-3.6V 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 2V ~ 8.6V
Supplier Device Package: 20-TSSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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P3T2030BUKAZ P3T2030BUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030BUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)
3500+25.95 грн
Мінімальне замовлення: 3500
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TEA2209DB1584 TEA2209DB1584 NXP USA Inc. get-started-with-the-tea2209db1584:GS-TEA2209DB1584 Description: EVAL BOARD FOR TEA2209T
Packaging: Bulk
Function: Bridge Rectifier
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA2209T
Supplied Contents: Board(s)
Embedded: No
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+12491.32 грн
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TEA2376BT/1Y TEA2376BT/1Y NXP USA Inc. TEA2376BT.pdf Description: IC PFC CTRLR 40KHZ-130KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 22V
Frequency - Switching: 40kHz ~ 130kHz
Mode: Discontinuous (Transition)
Supplier Device Package: 14-SO
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TEA2376AT/1J TEA2376AT/1J NXP USA Inc. TEA2376AT.pdf Description: IC PFC CTRLR 25KHZ-300KHZ 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Frequency - Switching: 25kHz ~ 300kHz
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 10-SO
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TEA2376AT/1Y TEA2376AT/1Y NXP USA Inc. TEA2376AT.pdf Description: IC PFC CTRLR 36KHZ-143KHZ 10SO
Packaging: Bulk
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 10-SO
Frequency - Switching: 36kHz ~ 143kHz
на замовлення 2300 шт:
термін постачання 21-31 дні (днів)
2+178.70 грн
10+127.74 грн
25+116.77 грн
100+98.23 грн
250+92.81 грн
500+89.55 грн
1000+85.44 грн
Мінімальне замовлення: 2
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TEA2376DT/1Y TEA2376DT/1Y NXP USA Inc. TEA2376DT.pdf Description: IC PFC CTRLR 25KHZ-300KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Frequency - Switching: 25kHz ~ 300kHz
Mode: Discontinuous (Transition)
Supplier Device Package: 14-SO
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TEA2226AT/1Y NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
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TEA2209T/1Y NXP USA Inc. TEA2209T.pdf Description: TEA2209T
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.4 ~ 14V
Applications: Power Supplies
Current - Supply: 2mA
Supplier Device Package: 16-SO
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LPC54S016JBD100Y NXP USA Inc. Description: POWER-EFFICIENT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 64
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MK52DN512ZCMD10 MK52DN512ZCMD10 NXP USA Inc. K50PB.pdf Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
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MK53DN512ZCMD10 MK53DN512ZCMD10 NXP USA Inc. K50PB.pdf Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 94
DigiKey Programmable: Not Verified
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MK50DN512CLL10 MK50DN512CLL10 NXP USA Inc. K50PB.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
на замовлення 188 шт:
термін постачання 21-31 дні (днів)
1+861.30 грн
10+684.45 грн
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MK50DX256CLL7 MK50DX256CLL7 NXP USA Inc. K50PB.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC9S08DN32ACLF MC9S08DN32ACLF NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08AC96MLKE MC9S08AC96MLKE NXP USA Inc. MC9S08AC128.pdf Description: IC MCU 8BIT 96KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
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MC9S08DZ48AMLH MC9S08DZ48AMLH NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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MM912J637AM2EP MM912_637D1.pdf
MM912J637AM2EP
Виробник: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
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PCT2075GVX PCT2075.pdf
PCT2075GVX
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 6TSOP
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
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PCT2075GVX PCT2075.pdf
PCT2075GVX
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 6TSOP
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
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MC9S08JS16LCWJ MC9S08JS16.pdf
MC9S08JS16LCWJ
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
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MPC8245LZU266D MPC8245.pdf
MPC8245LZU266D
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
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LPC1111FDH20/002,5 LPC111X.pdf
LPC1111FDH20/002,5
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
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LPC1111FDH20/002,5 LPC111X.pdf
LPC1111FDH20/002,5
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
на замовлення 575 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+174.68 грн
10+101.23 грн
25+98.51 грн
100+89.91 грн
250+89.28 грн
500+88.64 грн
Мінімальне замовлення: 2
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MC68HC705C8AB MC68HC705C8A.pdf
MC68HC705C8AB
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 42-PDIP
Number of I/O: 24
DigiKey Programmable: Not Verified
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MC68HC705C8AFNE MC68HC705C8A.pdf
MC68HC705C8AFNE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Verified
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MIMX8SL1CVNFZBAR
Виробник: NXP USA Inc.
Description: I.MX8SOLOLXLITE 15SQ
Packaging: Tape & Reel (TR)
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MIMX8SL1CVNFZBA
Виробник: NXP USA Inc.
Description: I.MX8SOLOLXLITE 15SQ
Packaging: Tray
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SAF4000EL/101S470K
Виробник: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tray
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SAF4000EL/101S275Y
Виробник: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
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74LVC2G241DP-Q100125 74LVC2G241_Q100.pdf
74LVC2G241DP-Q100125
Виробник: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-TSSOP
Grade: Automotive
Qualification: AEC-Q100
на замовлення 81040 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1354+16.15 грн
Мінімальне замовлення: 1354
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A5M34TG140-TCT1 A5M34TG140-TC.pdf
A5M34TG140-TCT1
Виробник: NXP USA Inc.
Description: RF AMPLIFIER AIRFAST POWER AMPLI
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.67GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.5dB
P1dB: 49.7dBm
Test Frequency: 3.67GHz
Supplier Device Package: 30-PLGA (14x10)
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A5M34TG140-TCT1 A5M34TG140-TC.pdf
A5M34TG140-TCT1
Виробник: NXP USA Inc.
Description: RF AMPLIFIER AIRFAST POWER AMPLI
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.67GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.5dB
P1dB: 49.7dBm
Test Frequency: 3.67GHz
Supplier Device Package: 30-PLGA (14x10)
на замовлення 1035 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+5868.14 грн
10+4966.89 грн
25+4788.03 грн
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MAC7121MAG40 MAC7100.pdf
MAC7121MAG40
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 544KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM7®
Data Converters: A/D 16x8/10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 85
DigiKey Programmable: Not Verified
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LPC1114LVFHN24/103 LPC111XLV_LPC11XXLVUK.pdf
LPC1114LVFHN24/103
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
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LFTHNBT
Виробник: NXP USA Inc.
Description: 44 PIN 0.8 MM QFP SURFACE MOUNT
Packaging: Bulk
Module/Board Type: Socket Module - QFP
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LFTHNYLT
Виробник: NXP USA Inc.
Description: 144 PIN 0.5MM QFP TARGET INTERFA
Packaging: Bulk
Module/Board Type: Socket Module - QFP
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LFTHNYBT
Виробник: NXP USA Inc.
Description: 44PIN .8MM QFP TARGET INTERFACE
Packaging: Bulk
Module/Board Type: Socket Module - QFP
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MMPF0100F3AEPR2 MMPF0100.pdf
MMPF0100F3AEPR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
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MMPF0100F6AEPR2 MMPF0100.pdf
MMPF0100F6AEPR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
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MMPF0100FCAEPR2 MMPF0100.pdf
MMPF0100FCAEPR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
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MMPF0100F6ANESR2 MMPF0100.pdf
MMPF0100F6ANESR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
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MMPF0100FAANESR2
MMPF0100FAANESR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
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MMPF0100FCANESR2
MMPF0100FCANESR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
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MMPF0100F0AZESR2
MMPF0100F0AZESR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MMPF0100F6AZESR2
MMPF0100F6AZESR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MMPF0100F8AZESR2
MMPF0100F8AZESR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MMPF0100FAAZESR2 MMPF0100.pdf
MMPF0100FAAZESR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MMPF0100FAANES
MMPF0100FAANES
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
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MMPF0100FCANES
MMPF0100FCANES
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
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MMPF0100F8AZES
MMPF0100F8AZES
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MMPF0100FAAZES MMPF0100.pdf
MMPF0100FAAZES
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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K32L2A31VLH1A K32L2Ax.pdf
K32L2A31VLH1A
Виробник: NXP USA Inc.
Description: K32 L2A 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
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S912XET512J3VAG
S912XET512J3VAG
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
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MRF1517NT1 MRF1517N.pdf
MRF1517NT1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Current Rating (Amps): 4A
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 8W
Gain: 14dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Voltage - Rated: 25 V
Voltage - Test: 7.5 V
Current - Test: 150 mA
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MRF1517NT1 MRF1517N.pdf
MRF1517NT1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Current Rating (Amps): 4A
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 8W
Gain: 14dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Voltage - Rated: 25 V
Voltage - Test: 7.5 V
Current - Test: 150 mA
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PDTC115EE,115 PDTC115E_SERIES.pdf
PDTC115EE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 20 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 100 kOhms
Resistor - Emitter Base (R2): 100 kOhms
Resistors Included: R1 and R2
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PDTC115EE,115 PDTC115E_SERIES.pdf
PDTC115EE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 20 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 100 kOhms
Resistor - Emitter Base (R2): 100 kOhms
Resistors Included: R1 and R2
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SPC5742PK1MLQ8 MPC574xP_FS.pdf
SPC5742PK1MLQ8
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
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MPC17531ATEJ
MPC17531ATEJ
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-3.6V 20SSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 2V ~ 8.6V
Supplier Device Package: 20-TSSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MPC17531ATEJR2
MPC17531ATEJR2
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-3.6V 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 2V ~ 8.6V
Supplier Device Package: 20-TSSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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P3T2030BUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030BUKAZ
Виробник: NXP USA Inc.
Description: P3T2030BUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3500+25.95 грн
Мінімальне замовлення: 3500
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TEA2209DB1584 get-started-with-the-tea2209db1584:GS-TEA2209DB1584
TEA2209DB1584
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TEA2209T
Packaging: Bulk
Function: Bridge Rectifier
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA2209T
Supplied Contents: Board(s)
Embedded: No
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+12491.32 грн
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TEA2376BT/1Y TEA2376BT.pdf
TEA2376BT/1Y
Виробник: NXP USA Inc.
Description: IC PFC CTRLR 40KHZ-130KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 22V
Frequency - Switching: 40kHz ~ 130kHz
Mode: Discontinuous (Transition)
Supplier Device Package: 14-SO
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TEA2376AT/1J TEA2376AT.pdf
TEA2376AT/1J
Виробник: NXP USA Inc.
Description: IC PFC CTRLR 25KHZ-300KHZ 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Frequency - Switching: 25kHz ~ 300kHz
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 10-SO
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TEA2376AT/1Y TEA2376AT.pdf
TEA2376AT/1Y
Виробник: NXP USA Inc.
Description: IC PFC CTRLR 36KHZ-143KHZ 10SO
Packaging: Bulk
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 10-SO
Frequency - Switching: 36kHz ~ 143kHz
на замовлення 2300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+178.70 грн
10+127.74 грн
25+116.77 грн
100+98.23 грн
250+92.81 грн
500+89.55 грн
1000+85.44 грн
Мінімальне замовлення: 2
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TEA2376DT/1Y TEA2376DT.pdf
TEA2376DT/1Y
Виробник: NXP USA Inc.
Description: IC PFC CTRLR 25KHZ-300KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Frequency - Switching: 25kHz ~ 300kHz
Mode: Discontinuous (Transition)
Supplier Device Package: 14-SO
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TEA2226AT/1Y
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
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TEA2209T/1Y TEA2209T.pdf
Виробник: NXP USA Inc.
Description: TEA2209T
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.4 ~ 14V
Applications: Power Supplies
Current - Supply: 2mA
Supplier Device Package: 16-SO
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LPC54S016JBD100Y
Виробник: NXP USA Inc.
Description: POWER-EFFICIENT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 64
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MK52DN512ZCMD10 K50PB.pdf
MK52DN512ZCMD10
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
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MK53DN512ZCMD10 K50PB.pdf
MK53DN512ZCMD10
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 94
DigiKey Programmable: Not Verified
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MK50DN512CLL10 K50PB.pdf
MK50DN512CLL10
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
на замовлення 188 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+861.30 грн
10+684.45 грн
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MK50DX256CLL7 K50PB.pdf
MK50DX256CLL7
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC9S08DN32ACLF MC9S08DN60.pdf
MC9S08DN32ACLF
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08AC96MLKE MC9S08AC128.pdf
MC9S08AC96MLKE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
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MC9S08DZ48AMLH MC9S08DZ60.pdf
MC9S08DZ48AMLH
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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