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TC233L32F200NACKXUMA1 TC233L32F200NACKXUMA1 Infineon Technologies Infineon-TC23xAC_DS-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695316f3d103ee Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
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TC233L32F200NACKXUMA1 TC233L32F200NACKXUMA1 Infineon Technologies Infineon-TC23xAC_DS-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695316f3d103ee Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
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AUIRFR3806TRL AUIRFR3806TRL Infineon Technologies auirfr3806.pdf?fileId=5546d462533600a4015355b56f981482 Description: MOSFET N-CH 60V 43A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 15.8mOhm @ 25A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 4V @ 50µA
Supplier Device Package: TO-252AA (DPAK)
Grade: Automotive
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1150 pF @ 50 V
Qualification: AEC-Q101
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
3000+67.64 грн
Мінімальне замовлення: 3000
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AUIRFR3806TRL AUIRFR3806TRL Infineon Technologies auirfr3806.pdf?fileId=5546d462533600a4015355b56f981482 Description: MOSFET N-CH 60V 43A DPAK
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 15.8mOhm @ 25A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 4V @ 50µA
Supplier Device Package: TO-252AA (DPAK)
Grade: Automotive
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1150 pF @ 50 V
Qualification: AEC-Q101
на замовлення 6249 шт:
термін постачання 21-31 дні (днів)
2+178.41 грн
10+127.47 грн
100+92.51 грн
500+71.35 грн
1000+64.62 грн
Мінімальне замовлення: 2
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TC337LP32F300SAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 2MB FLASH 292LFBGA
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TC337LP32F300SAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 2MB FLASH 292LFBGA
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TC332LP32F300FAAKXUMA1 TC332LP32F300FAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 2MB FLASH 80TQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-80-7
Part Status: Active
DigiKey Programmable: Not Verified
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TC332LP32F300FAAKXUMA1 TC332LP32F300FAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 2MB FLASH 80TQFP
Packaging: Cut Tape (CT)
Package / Case: 80-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-80-7
Part Status: Active
DigiKey Programmable: Not Verified
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TC336LP32F300SAAKXUMA1 TC336LP32F300SAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 2MB FLASH 180LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 180-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LFBGA-180-1
DigiKey Programmable: Not Verified
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TC336LP32F300SAAKXUMA1 TC336LP32F300SAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 2MB FLASH 180LFBGA
Packaging: Cut Tape (CT)
Package / Case: 180-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LFBGA-180-1
DigiKey Programmable: Not Verified
на замовлення 976 шт:
термін постачання 21-31 дні (днів)
1+4258.00 грн
10+3852.09 грн
25+3727.81 грн
100+3241.85 грн
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AUIPS7145RTRL AUIPS7145RTRL Infineon Technologies auips7145r.pdf?fileId=5546d462533600a4015355a7ff1a1334 Description: IC PWR SWITCH N-CHANNEL 1:1 DPAK
Packaging: Cut Tape (CT)
Package / Case: TO-252-5, DPak (4 Leads + Tab), TO-252AD
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 75mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 60V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 2.1A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-TO252-5
Fault Protection: Current Limiting (Fixed), Over Temperature
Grade: Automotive
Part Status: Obsolete
Qualification: AEC-Q100
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FS950R08A6P2LBBPSA1 FS950R08A6P2LBBPSA1 Infineon Technologies Infineon-FS950R08A6P2LB-DataSheet-v01_00-EN.pdf?fileId=5546d4627aa5d4f5017b5311f6332559 Description: HYBRID PACK DRIVE AG-HYBRIDD-1
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 3 Independent
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 450A
NTC Thermistor: Yes
Supplier Device Package: AG-HYBRIDD-2
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 750 V
Power - Max: 870 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 80 nF @ 50 V
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
1+24444.63 грн
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1EDI2004ASXUMA1 Infineon Technologies 1EDI2004AS-ISO-DS_v02_10.pdf Description: DGTL ISO 4.5KV 1CH GT DVR DSO36
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 2A
Technology: Magnetic Coupling
Current - Output High, Low: 2A, 2A
Voltage - Isolation: 4500Vrms
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-36
Rise / Fall Time (Typ): 120ns, 150ns
Common Mode Transient Immunity (Min): 50kV/µs
Propagation Delay tpLH / tpHL (Max): 255ns, 255ns
Pulse Width Distortion (Max): 40ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 13.5V ~ 18V
Qualification: AEC-Q100
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SIGC42T60UNX7SA1 Infineon Technologies Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60SNCX1SA2 SIGC42T60SNCX1SA2 Infineon Technologies SIGC42T60SNC_ed2_11-28-03.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60UNX7SA2 Infineon Technologies Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60UNX1SA1 SIGC42T60UNX1SA1 Infineon Technologies SIGC42T60UN_ed1_13-9-05.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60NCX1SA5 SIGC42T60NCX1SA5 Infineon Technologies SIGC42T60NC_ed2_11-28-03.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60NCX1SA6 Infineon Technologies SIGC42T60NC_ed2_11-28-03.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60NCX1SA4 Infineon Technologies SIGC42T60NC_ed2_11-28-03.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60SNCX1SA1 Infineon Technologies SIGC42T60SNC_ed2_11-28-03.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60NCX1SA3 Infineon Technologies SIGC42T60NC_ed2_11-28-03.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60UNX1SA2 Infineon Technologies SIGC42T60UN_ed1_13-9-05.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T120CQX1SA1 Infineon Technologies SIGC42T120CQ_Rev1.1_12-20-05.pdf Description: DIODE GEN PURPOSE 1.2KV
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IDP45E60XKSA2 IDP45E60XKSA2 Infineon Technologies Infineon-IDP45E60-DS-v02_05-en.pdf?fileId=db3a30432313ff5e01237a518c6e7be9 Description: DISCRETE SWITCHES
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TLD1315ELXUMA1 TLD1315ELXUMA1 Infineon Technologies Infineon-TLD1315EL-DS-v01_01-EN.pdf?fileId=5546d46258fc0bc101596e37d6043532 Description: IC LED DRVR LIN PWM 120MA 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-LSSOP (0.154", 3.90mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 3
Type: Linear
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output / Channel: 120mA
Internal Switch(s): Yes
Supplier Device Package: PG-SSOP-14-5
Dimming: PWM
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Grade: Automotive
Part Status: Not For New Designs
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TLD1315ELXUMA1 TLD1315ELXUMA1 Infineon Technologies Infineon-TLD1315EL-DS-v01_01-EN.pdf?fileId=5546d46258fc0bc101596e37d6043532 Description: IC LED DRVR LIN PWM 120MA 14SSOP
Packaging: Cut Tape (CT)
Package / Case: 14-LSSOP (0.154", 3.90mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 3
Type: Linear
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output / Channel: 120mA
Internal Switch(s): Yes
Supplier Device Package: PG-SSOP-14-5
Dimming: PWM
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Grade: Automotive
Part Status: Not For New Designs
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TLD1315ELXUMA1 TLD1315ELXUMA1 Infineon Technologies Infineon-TLD1315EL-DS-v01_01-EN.pdf?fileId=5546d46258fc0bc101596e37d6043532 Description: IC LED DRVR LIN PWM 120MA 14SSOP
Packaging: Bulk
Package / Case: 14-LSSOP (0.154", 3.90mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 3
Type: Linear
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output / Channel: 120mA
Internal Switch(s): Yes
Supplier Device Package: PG-SSOP-14-5
Dimming: PWM
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Grade: Automotive
Part Status: Not For New Designs
на замовлення 17827 шт:
термін постачання 21-31 дні (днів)
415+55.43 грн
Мінімальне замовлення: 415
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IR4426STRPBF IR4426STRPBF Infineon Technologies ir4426.pdf?fileId=5546d462533600a4015355d60b491822 Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 6V ~ 20V
Input Type: Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 10ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.7V
Current - Peak Output (Source, Sink): 2.3A, 3.3A
Part Status: Active
DigiKey Programmable: Not Verified
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IR4426STRPBF IR4426STRPBF Infineon Technologies ir4426.pdf?fileId=5546d462533600a4015355d60b491822 Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 6V ~ 20V
Input Type: Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 10ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.7V
Current - Peak Output (Source, Sink): 2.3A, 3.3A
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1905 шт:
термін постачання 21-31 дні (днів)
3+124.97 грн
10+88.04 грн
25+80.06 грн
100+66.91 грн
250+62.99 грн
500+60.63 грн
1000+57.72 грн
Мінімальне замовлення: 3
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IRS2008MTRPBFXUMA1 IRS2008MTRPBFXUMA1 Infineon Technologies Infineon-IRS2008S-M-DataSheet-v01_00-EN.pdf?fileId=5546d46269e1c019016ae5475e943bd3 Description: IC GATE DRVR HALF-BRIDGE 14MLPQ
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 10V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 200 V
Supplier Device Package: 14-MLPQ (4x4)
Rise / Fall Time (Typ): 70ns, 30ns
Channel Type: Synchronous
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.5V
Current - Peak Output (Source, Sink): 290mA, 600mA
Part Status: Active
DigiKey Programmable: Not Verified
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XMC1202T028X0032AAXUMA1 XMC1202T028X0032AAXUMA1 Infineon Technologies XMC1200.pdf Description: IC MCU 32BIT 32KB FLASH 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 14x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-28-16
Part Status: Obsolete
Number of I/O: 20
DigiKey Programmable: Not Verified
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CY9AF112NABGL-GE1 CY9AF112NABGL-GE1 Infineon Technologies Infineon-CY9A110A_CY9A110_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eddff4562bb&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-fil Description: IC MCU 32BIT 128KB FLSH 112PFBGA
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CY9AF312NABGL-GE1 CY9AF312NABGL-GE1 Infineon Technologies Infineon-CY9A310A_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ede11f262e1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 128KB FLSH 112PFBGA
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ICA22V14X1SA1 Infineon Technologies Part_Number_Guide_Web.pdf Description: CHIP BARE DIE
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ICA22V13X1SA1 Infineon Technologies Part_Number_Guide_Web.pdf Description: CHIP BARE DIE
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TC275TP64F200NDCKXUMA1 TC275TP64F200NDCKXUMA1 Infineon Technologies Infineon-TC27xDC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 40x12b, 6 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
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TC275TP64F200NDCKXUMA1 TC275TP64F200NDCKXUMA1 Infineon Technologies Infineon-TC27xDC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 40x12b, 6 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
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TC275TP64F200WCALXUMA2 TC275TP64F200WCALXUMA2 Infineon Technologies Description: IC MICROCONTROLLER
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TC275TP64F200WCALXUMA1 TC275TP64F200WCALXUMA1 Infineon Technologies Description: IC MICROCONTROLLER
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IPP040N08NF2SAKMA1 IPP040N08NF2SAKMA1 Infineon Technologies Infineon-IPP040N08NF2S-DataSheet-v02_00-EN.pdf?fileId=5546d46276c4f5350176f70a2eac169b Description: TRENCH 40<-<100V
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22A (Ta), 115A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 80A, 10V
Power Dissipation (Max): 3.8W (Ta), 150W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 85µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 81 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3800 pF @ 40 V
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
2+209.65 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
IPP016N08NF2SAKMA1 IPP016N08NF2SAKMA1 Infineon Technologies Infineon-IPP016N08NF2S-DataSheet-v02_00-EN.pdf?fileId=5546d46276c4f5350176f69332aa1057 Description: TRENCH 40<-<100V
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Ta), 196A (Tc)
Rds On (Max) @ Id, Vgs: 1.6mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 300W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 267µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 255 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 12000 pF @ 40 V
на замовлення 833 шт:
термін постачання 21-31 дні (днів)
2+315.71 грн
50+156.55 грн
100+142.34 грн
500+110.22 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
TC277T64F200NDCKXUMA2 TC277T64F200NDCKXUMA2 Infineon Technologies Infineon-TC27xDC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a Description: IC MCU 32BIT 4MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 60x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
Number of I/O: 169
DigiKey Programmable: Not Verified
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SAK-TC277T-64F200N DC SAK-TC277T-64F200N DC Infineon Technologies Infineon-TC27xDC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a Description: IC MCU 32BIT 4MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 60x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
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TDA5225C TDA5225C Infineon Technologies Infineon-TDA5225-DS-v01_00-EN.pdf?fileId=5546d4625debb399015e285b7e7b3c4f Description: QUAD-CONFIGURATION RECEIVER
Features: RSSI Equipped
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Sensitivity: -120dBm
Mounting Type: Surface Mount
Frequency: 300MHz ~ 928MHz
Modulation or Protocol: ASK, FSK
Data Interface: SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Alarm Systems, Communication Systems, RKE
Current - Receiving: 15mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: PG-TSSOP-28
Part Status: Active
на замовлення 2570 шт:
термін постачання 21-31 дні (днів)
213+98.80 грн
Мінімальне замовлення: 213
В кошику  од. на суму  грн.
MB95F563HNPFT-G-SNE2 MB95F563HNPFT-G-SNE2 Infineon Technologies Prod_Selector_Guide_11-25-15.pdf Description: IC MCU 8BIT 12KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 496 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 6x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: LINbus, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
на замовлення 118 шт:
термін постачання 21-31 дні (днів)
10+36.18 грн
Мінімальне замовлення: 10
В кошику  од. на суму  грн.
MB95F563HNPFT-G-SNE2 MB95F563HNPFT-G-SNE2 Infineon Technologies Prod_Selector_Guide_11-25-15.pdf Description: IC MCU 8BIT 12KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 496 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 6x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: LINbus, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
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IGT60R070D1ATMA4 IGT60R070D1ATMA4 Infineon Technologies Infineon-IGT60R070D1-DataSheet-v02_13-EN.pdf?fileId=5546d46265f064ff016686028dd56526 Description: GANFET N-CH
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 31A (Tc)
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-HSOF-8-3
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
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IGT60R070D1ATMA4 IGT60R070D1ATMA4 Infineon Technologies Infineon-IGT60R070D1-DataSheet-v02_13-EN.pdf?fileId=5546d46265f064ff016686028dd56526 Description: GANFET N-CH
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 31A (Tc)
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-HSOF-8-3
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
на замовлення 2017 шт:
термін постачання 21-31 дні (днів)
1+975.09 грн
10+657.04 грн
100+579.36 грн
В кошику  од. на суму  грн.
IGLD60R070D1AUMA3 IGLD60R070D1AUMA3 Infineon Technologies Infineon-IGLD60R070D1-DataSheet-v02_12-EN.pdf?fileId=5546d46265f064ff016685f03f056511 Description: GANFET N-CH
Packaging: Tape & Reel (TR)
Package / Case: 8-LDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 15A (Tc)
Power Dissipation (Max): 114W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-LSON-8-1
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
товару немає в наявності
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IGLD60R070D1AUMA3 IGLD60R070D1AUMA3 Infineon Technologies Infineon-IGLD60R070D1-DataSheet-v02_12-EN.pdf?fileId=5546d46265f064ff016685f03f056511 Description: GANFET N-CH
Packaging: Cut Tape (CT)
Package / Case: 8-LDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 15A (Tc)
Power Dissipation (Max): 114W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-LSON-8-1
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
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EVAL1ED3251MC12HTOBO1 EVAL1ED3251MC12HTOBO1 Infineon Technologies Infineon-UG-2021-25_Eval-1ED32x1MC12H-UserManual-v01_00-EN.pdf?fileId=5546d4627aa5d4f5017b105b58ff307b Description: EVAL BOARD FOR 1ED3251MC12H
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 1ED3251MC12H
Supplied Contents: Board(s)
Primary Attributes: Isolated
Secondary Attributes: On-Board LEDs
Embedded: No
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
1+8059.69 грн
В кошику  од. на суму  грн.
EVAL1ED3241MC12HTOBO1 EVAL1ED3241MC12HTOBO1 Infineon Technologies Infineon-EiceDRIVER_1ED32xxMC12H-DataSheet-v02_00-EN.pdf?fileId=5546d46278d64ffd01790e8498044865 Description: EVAL BOARD FOR 1ED3241MC12H
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: 1ED3241MC12H
Supplied Contents: Board(s)
Primary Attributes: Isolated
Secondary Attributes: On-Board LEDs
Embedded: No
Part Status: Active
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EVAL1ED3890MX12MTOBO1 EVAL1ED3890MX12MTOBO1 Infineon Technologies Infineon-UG-2021-03_EVAL-1ED3890MX12M-UserManual-v01_04-EN.pdf?fileId=5546d4627aa5d4f5017aa9776e060d3c Description: 1ED3890MX12M EVAL BRD
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 1ED3890Mx12M
Supplied Contents: Board(s)
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+7516.24 грн
В кошику  од. на суму  грн.
EVAL1ED38X0DCTTOBO1 EVAL1ED38X0DCTTOBO1 Infineon Technologies Infineon-UG-2021-04_EVAL-1ED38x0DCT-UserManual-v01_01-EN.pdf?fileId=5546d4627aa5d4f5017aa97786670d44 Description: EICEDRIVER COMPANION BOARD
Packaging: Bulk
Function: MCU
Type: Embedded
Contents: Board(s)
Utilized IC / Part: XMC4200
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+7516.24 грн
В кошику  од. на суму  грн.
1ED3121MC12HXUMA1 1ED3121MC12HXUMA1 Infineon Technologies Infineon-1ED31xxMC12H-_1ED-X3_Compact-DataSheet-v02_00-EN.pdf?fileId=5546d46277fc7439017802de09e5671d Description: DIGITAL ISO 8KV 1CH GT DVR DSO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Current - Peak Output: 5.5A
Technology: Magnetic Coupling
Current - Output High, Low: 5.5A, 5.5A
Voltage - Isolation: 8000Vpk
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-8
Rise / Fall Time (Typ): 30ns, 30ns (Max)
Common Mode Transient Immunity (Min): 200kV/µs
Propagation Delay tpLH / tpHL (Max): 100ns, 100ns
Part Status: Active
Number of Channels: 1
Voltage - Output Supply: 10V ~ 35V
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+88.15 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
1ED3121MC12HXUMA1 1ED3121MC12HXUMA1 Infineon Technologies Infineon-1ED31xxMC12H-_1ED-X3_Compact-DataSheet-v02_00-EN.pdf?fileId=5546d46277fc7439017802de09e5671d Description: DIGITAL ISO 8KV 1CH GT DVR DSO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Current - Peak Output: 5.5A
Technology: Magnetic Coupling
Current - Output High, Low: 5.5A, 5.5A
Voltage - Isolation: 8000Vpk
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-8
Rise / Fall Time (Typ): 30ns, 30ns (Max)
Common Mode Transient Immunity (Min): 200kV/µs
Propagation Delay tpLH / tpHL (Max): 100ns, 100ns
Part Status: Active
Number of Channels: 1
Voltage - Output Supply: 10V ~ 35V
на замовлення 1511 шт:
термін постачання 21-31 дні (днів)
2+165.26 грн
10+117.73 грн
25+107.45 грн
100+90.24 грн
250+85.20 грн
500+82.16 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
1ED3461MC12MXUMA1 1ED3461MC12MXUMA1 Infineon Technologies Infineon-1ED34x1Mx12M-DataSheet-v02_01-EN.pdf?fileId=5546d46274cf54d50174d97c2fb71f62 Description: DGT ISO 5.7KV 1CH GT DVR DSO16
Packaging: Tape & Reel (TR)
Package / Case: 16-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Current - Peak Output: 6A
Technology: Magnetic Coupling
Current - Output High, Low: 6A, 6A
Voltage - Isolation: 5700Vrms
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-16-28
Rise / Fall Time (Typ): 15ns, 15ns
Common Mode Transient Immunity (Min): 200V/ns
Propagation Delay tpLH / tpHL (Max): 270ns, 262ns
Part Status: Active
Number of Channels: 1
Voltage - Output Supply: 13V ~ 25V
товару немає в наявності
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1ED3461MC12MXUMA1 1ED3461MC12MXUMA1 Infineon Technologies Infineon-1ED34x1Mx12M-DataSheet-v02_01-EN.pdf?fileId=5546d46274cf54d50174d97c2fb71f62 Description: DGT ISO 5.7KV 1CH GT DVR DSO16
Packaging: Cut Tape (CT)
Package / Case: 16-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Current - Peak Output: 6A
Technology: Magnetic Coupling
Current - Output High, Low: 6A, 6A
Voltage - Isolation: 5700Vrms
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-16-28
Rise / Fall Time (Typ): 15ns, 15ns
Common Mode Transient Immunity (Min): 200V/ns
Propagation Delay tpLH / tpHL (Max): 270ns, 262ns
Part Status: Active
Number of Channels: 1
Voltage - Output Supply: 13V ~ 25V
на замовлення 698 шт:
термін постачання 21-31 дні (днів)
1+365.86 грн
10+268.55 грн
25+247.65 грн
100+210.89 грн
250+200.62 грн
500+194.43 грн
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1ED3240MC12HXUMA1 1ED3240MC12HXUMA1 Infineon Technologies Infineon-EiceDRIVER_1ED32xxMC12H-DataSheet-v02_00-EN.pdf?fileId=5546d46278d64ffd01790e8498044865 Description: DGT ISO 5.7KV 1CH GT DVR DSO8-66
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Current - Peak Output: 10A
Technology: Magnetic Coupling
Current - Output High, Low: 10A, 10A
Voltage - Isolation: 5700Vrms
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-8-66
Rise / Fall Time (Typ): 9ns, 8.5ns
Common Mode Transient Immunity (Min): 200kV/µs
Propagation Delay tpLH / tpHL (Max): 110ns, 110ns
Pulse Width Distortion (Max): 5ns
Part Status: Active
Number of Channels: 1
Voltage - Output Supply: 10V ~ 35V
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TC233L32F200NACKXUMA1 Infineon-TC23xAC_DS-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695316f3d103ee
TC233L32F200NACKXUMA1
Виробник: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
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TC233L32F200NACKXUMA1 Infineon-TC23xAC_DS-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695316f3d103ee
TC233L32F200NACKXUMA1
Виробник: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
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AUIRFR3806TRL auirfr3806.pdf?fileId=5546d462533600a4015355b56f981482
AUIRFR3806TRL
Виробник: Infineon Technologies
Description: MOSFET N-CH 60V 43A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 15.8mOhm @ 25A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 4V @ 50µA
Supplier Device Package: TO-252AA (DPAK)
Grade: Automotive
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1150 pF @ 50 V
Qualification: AEC-Q101
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+67.64 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
AUIRFR3806TRL auirfr3806.pdf?fileId=5546d462533600a4015355b56f981482
AUIRFR3806TRL
Виробник: Infineon Technologies
Description: MOSFET N-CH 60V 43A DPAK
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 15.8mOhm @ 25A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 4V @ 50µA
Supplier Device Package: TO-252AA (DPAK)
Grade: Automotive
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1150 pF @ 50 V
Qualification: AEC-Q101
на замовлення 6249 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+178.41 грн
10+127.47 грн
100+92.51 грн
500+71.35 грн
1000+64.62 грн
Мінімальне замовлення: 2
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TC337LP32F300SAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
Виробник: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 292LFBGA
товару немає в наявності
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TC337LP32F300SAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
Виробник: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 292LFBGA
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TC332LP32F300FAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC332LP32F300FAAKXUMA1
Виробник: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 80TQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-80-7
Part Status: Active
DigiKey Programmable: Not Verified
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TC332LP32F300FAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC332LP32F300FAAKXUMA1
Виробник: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 80TQFP
Packaging: Cut Tape (CT)
Package / Case: 80-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-80-7
Part Status: Active
DigiKey Programmable: Not Verified
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TC336LP32F300SAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC336LP32F300SAAKXUMA1
Виробник: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 180LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 180-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LFBGA-180-1
DigiKey Programmable: Not Verified
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TC336LP32F300SAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC336LP32F300SAAKXUMA1
Виробник: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 180LFBGA
Packaging: Cut Tape (CT)
Package / Case: 180-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LFBGA-180-1
DigiKey Programmable: Not Verified
на замовлення 976 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+4258.00 грн
10+3852.09 грн
25+3727.81 грн
100+3241.85 грн
В кошику  од. на суму  грн.
AUIPS7145RTRL auips7145r.pdf?fileId=5546d462533600a4015355a7ff1a1334
AUIPS7145RTRL
Виробник: Infineon Technologies
Description: IC PWR SWITCH N-CHANNEL 1:1 DPAK
Packaging: Cut Tape (CT)
Package / Case: TO-252-5, DPak (4 Leads + Tab), TO-252AD
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 75mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 60V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 2.1A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-TO252-5
Fault Protection: Current Limiting (Fixed), Over Temperature
Grade: Automotive
Part Status: Obsolete
Qualification: AEC-Q100
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FS950R08A6P2LBBPSA1 Infineon-FS950R08A6P2LB-DataSheet-v01_00-EN.pdf?fileId=5546d4627aa5d4f5017b5311f6332559
FS950R08A6P2LBBPSA1
Виробник: Infineon Technologies
Description: HYBRID PACK DRIVE AG-HYBRIDD-1
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 3 Independent
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 450A
NTC Thermistor: Yes
Supplier Device Package: AG-HYBRIDD-2
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 750 V
Power - Max: 870 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 80 nF @ 50 V
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+24444.63 грн
В кошику  од. на суму  грн.
1EDI2004ASXUMA1 1EDI2004AS-ISO-DS_v02_10.pdf
Виробник: Infineon Technologies
Description: DGTL ISO 4.5KV 1CH GT DVR DSO36
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 2A
Technology: Magnetic Coupling
Current - Output High, Low: 2A, 2A
Voltage - Isolation: 4500Vrms
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-36
Rise / Fall Time (Typ): 120ns, 150ns
Common Mode Transient Immunity (Min): 50kV/µs
Propagation Delay tpLH / tpHL (Max): 255ns, 255ns
Pulse Width Distortion (Max): 40ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 13.5V ~ 18V
Qualification: AEC-Q100
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SIGC42T60UNX7SA1
Виробник: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60SNCX1SA2 SIGC42T60SNC_ed2_11-28-03.pdf
SIGC42T60SNCX1SA2
Виробник: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60UNX7SA2
Виробник: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60UNX1SA1 SIGC42T60UN_ed1_13-9-05.pdf
SIGC42T60UNX1SA1
Виробник: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60NCX1SA5 SIGC42T60NC_ed2_11-28-03.pdf
SIGC42T60NCX1SA5
Виробник: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60NCX1SA6 SIGC42T60NC_ed2_11-28-03.pdf
Виробник: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60NCX1SA4 SIGC42T60NC_ed2_11-28-03.pdf
Виробник: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60SNCX1SA1 SIGC42T60SNC_ed2_11-28-03.pdf
Виробник: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60NCX1SA3 SIGC42T60NC_ed2_11-28-03.pdf
Виробник: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60UNX1SA2 SIGC42T60UN_ed1_13-9-05.pdf
Виробник: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
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SIGC42T120CQX1SA1 SIGC42T120CQ_Rev1.1_12-20-05.pdf
Виробник: Infineon Technologies
Description: DIODE GEN PURPOSE 1.2KV
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IDP45E60XKSA2 Infineon-IDP45E60-DS-v02_05-en.pdf?fileId=db3a30432313ff5e01237a518c6e7be9
IDP45E60XKSA2
Виробник: Infineon Technologies
Description: DISCRETE SWITCHES
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TLD1315ELXUMA1 Infineon-TLD1315EL-DS-v01_01-EN.pdf?fileId=5546d46258fc0bc101596e37d6043532
TLD1315ELXUMA1
Виробник: Infineon Technologies
Description: IC LED DRVR LIN PWM 120MA 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-LSSOP (0.154", 3.90mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 3
Type: Linear
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output / Channel: 120mA
Internal Switch(s): Yes
Supplier Device Package: PG-SSOP-14-5
Dimming: PWM
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Grade: Automotive
Part Status: Not For New Designs
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TLD1315ELXUMA1 Infineon-TLD1315EL-DS-v01_01-EN.pdf?fileId=5546d46258fc0bc101596e37d6043532
TLD1315ELXUMA1
Виробник: Infineon Technologies
Description: IC LED DRVR LIN PWM 120MA 14SSOP
Packaging: Cut Tape (CT)
Package / Case: 14-LSSOP (0.154", 3.90mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 3
Type: Linear
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output / Channel: 120mA
Internal Switch(s): Yes
Supplier Device Package: PG-SSOP-14-5
Dimming: PWM
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Grade: Automotive
Part Status: Not For New Designs
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TLD1315ELXUMA1 Infineon-TLD1315EL-DS-v01_01-EN.pdf?fileId=5546d46258fc0bc101596e37d6043532
TLD1315ELXUMA1
Виробник: Infineon Technologies
Description: IC LED DRVR LIN PWM 120MA 14SSOP
Packaging: Bulk
Package / Case: 14-LSSOP (0.154", 3.90mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 3
Type: Linear
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output / Channel: 120mA
Internal Switch(s): Yes
Supplier Device Package: PG-SSOP-14-5
Dimming: PWM
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Grade: Automotive
Part Status: Not For New Designs
на замовлення 17827 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
415+55.43 грн
Мінімальне замовлення: 415
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IR4426STRPBF ir4426.pdf?fileId=5546d462533600a4015355d60b491822
IR4426STRPBF
Виробник: Infineon Technologies
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 6V ~ 20V
Input Type: Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 10ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.7V
Current - Peak Output (Source, Sink): 2.3A, 3.3A
Part Status: Active
DigiKey Programmable: Not Verified
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IR4426STRPBF ir4426.pdf?fileId=5546d462533600a4015355d60b491822
IR4426STRPBF
Виробник: Infineon Technologies
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 6V ~ 20V
Input Type: Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 10ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.7V
Current - Peak Output (Source, Sink): 2.3A, 3.3A
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1905 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+124.97 грн
10+88.04 грн
25+80.06 грн
100+66.91 грн
250+62.99 грн
500+60.63 грн
1000+57.72 грн
Мінімальне замовлення: 3
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IRS2008MTRPBFXUMA1 Infineon-IRS2008S-M-DataSheet-v01_00-EN.pdf?fileId=5546d46269e1c019016ae5475e943bd3
IRS2008MTRPBFXUMA1
Виробник: Infineon Technologies
Description: IC GATE DRVR HALF-BRIDGE 14MLPQ
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 10V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 200 V
Supplier Device Package: 14-MLPQ (4x4)
Rise / Fall Time (Typ): 70ns, 30ns
Channel Type: Synchronous
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.5V
Current - Peak Output (Source, Sink): 290mA, 600mA
Part Status: Active
DigiKey Programmable: Not Verified
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XMC1202T028X0032AAXUMA1 XMC1200.pdf
XMC1202T028X0032AAXUMA1
Виробник: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 14x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-28-16
Part Status: Obsolete
Number of I/O: 20
DigiKey Programmable: Not Verified
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CY9AF112NABGL-GE1 Infineon-CY9A110A_CY9A110_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eddff4562bb&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-fil
CY9AF112NABGL-GE1
Виробник: Infineon Technologies
Description: IC MCU 32BIT 128KB FLSH 112PFBGA
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CY9AF312NABGL-GE1 Infineon-CY9A310A_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ede11f262e1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY9AF312NABGL-GE1
Виробник: Infineon Technologies
Description: IC MCU 32BIT 128KB FLSH 112PFBGA
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ICA22V14X1SA1 Part_Number_Guide_Web.pdf
Виробник: Infineon Technologies
Description: CHIP BARE DIE
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ICA22V13X1SA1 Part_Number_Guide_Web.pdf
Виробник: Infineon Technologies
Description: CHIP BARE DIE
товару немає в наявності
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TC275TP64F200NDCKXUMA1 Infineon-TC27xDC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a
TC275TP64F200NDCKXUMA1
Виробник: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 40x12b, 6 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
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TC275TP64F200NDCKXUMA1 Infineon-TC27xDC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a
TC275TP64F200NDCKXUMA1
Виробник: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 40x12b, 6 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
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TC275TP64F200WCALXUMA2
TC275TP64F200WCALXUMA2
Виробник: Infineon Technologies
Description: IC MICROCONTROLLER
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TC275TP64F200WCALXUMA1
TC275TP64F200WCALXUMA1
Виробник: Infineon Technologies
Description: IC MICROCONTROLLER
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IPP040N08NF2SAKMA1 Infineon-IPP040N08NF2S-DataSheet-v02_00-EN.pdf?fileId=5546d46276c4f5350176f70a2eac169b
IPP040N08NF2SAKMA1
Виробник: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22A (Ta), 115A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 80A, 10V
Power Dissipation (Max): 3.8W (Ta), 150W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 85µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 81 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3800 pF @ 40 V
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+209.65 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
IPP016N08NF2SAKMA1 Infineon-IPP016N08NF2S-DataSheet-v02_00-EN.pdf?fileId=5546d46276c4f5350176f69332aa1057
IPP016N08NF2SAKMA1
Виробник: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Ta), 196A (Tc)
Rds On (Max) @ Id, Vgs: 1.6mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 300W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 267µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 255 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 12000 pF @ 40 V
на замовлення 833 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+315.71 грн
50+156.55 грн
100+142.34 грн
500+110.22 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
TC277T64F200NDCKXUMA2 Infineon-TC27xDC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a
TC277T64F200NDCKXUMA2
Виробник: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 60x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
Number of I/O: 169
DigiKey Programmable: Not Verified
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SAK-TC277T-64F200N DC Infineon-TC27xDC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a
SAK-TC277T-64F200N DC
Виробник: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 60x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
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TDA5225C Infineon-TDA5225-DS-v01_00-EN.pdf?fileId=5546d4625debb399015e285b7e7b3c4f
TDA5225C
Виробник: Infineon Technologies
Description: QUAD-CONFIGURATION RECEIVER
Features: RSSI Equipped
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Sensitivity: -120dBm
Mounting Type: Surface Mount
Frequency: 300MHz ~ 928MHz
Modulation or Protocol: ASK, FSK
Data Interface: SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Alarm Systems, Communication Systems, RKE
Current - Receiving: 15mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: PG-TSSOP-28
Part Status: Active
на замовлення 2570 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
213+98.80 грн
Мінімальне замовлення: 213
В кошику  од. на суму  грн.
MB95F563HNPFT-G-SNE2 Prod_Selector_Guide_11-25-15.pdf
MB95F563HNPFT-G-SNE2
Виробник: Infineon Technologies
Description: IC MCU 8BIT 12KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 496 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 6x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: LINbus, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
на замовлення 118 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10+36.18 грн
Мінімальне замовлення: 10
В кошику  од. на суму  грн.
MB95F563HNPFT-G-SNE2 Prod_Selector_Guide_11-25-15.pdf
MB95F563HNPFT-G-SNE2
Виробник: Infineon Technologies
Description: IC MCU 8BIT 12KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 496 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 6x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: LINbus, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
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IGT60R070D1ATMA4 Infineon-IGT60R070D1-DataSheet-v02_13-EN.pdf?fileId=5546d46265f064ff016686028dd56526
IGT60R070D1ATMA4
Виробник: Infineon Technologies
Description: GANFET N-CH
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 31A (Tc)
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-HSOF-8-3
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
товару немає в наявності
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IGT60R070D1ATMA4 Infineon-IGT60R070D1-DataSheet-v02_13-EN.pdf?fileId=5546d46265f064ff016686028dd56526
IGT60R070D1ATMA4
Виробник: Infineon Technologies
Description: GANFET N-CH
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 31A (Tc)
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-HSOF-8-3
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
на замовлення 2017 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+975.09 грн
10+657.04 грн
100+579.36 грн
В кошику  од. на суму  грн.
IGLD60R070D1AUMA3 Infineon-IGLD60R070D1-DataSheet-v02_12-EN.pdf?fileId=5546d46265f064ff016685f03f056511
IGLD60R070D1AUMA3
Виробник: Infineon Technologies
Description: GANFET N-CH
Packaging: Tape & Reel (TR)
Package / Case: 8-LDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 15A (Tc)
Power Dissipation (Max): 114W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-LSON-8-1
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
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IGLD60R070D1AUMA3 Infineon-IGLD60R070D1-DataSheet-v02_12-EN.pdf?fileId=5546d46265f064ff016685f03f056511
IGLD60R070D1AUMA3
Виробник: Infineon Technologies
Description: GANFET N-CH
Packaging: Cut Tape (CT)
Package / Case: 8-LDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 15A (Tc)
Power Dissipation (Max): 114W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-LSON-8-1
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
товару немає в наявності
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EVAL1ED3251MC12HTOBO1 Infineon-UG-2021-25_Eval-1ED32x1MC12H-UserManual-v01_00-EN.pdf?fileId=5546d4627aa5d4f5017b105b58ff307b
EVAL1ED3251MC12HTOBO1
Виробник: Infineon Technologies
Description: EVAL BOARD FOR 1ED3251MC12H
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 1ED3251MC12H
Supplied Contents: Board(s)
Primary Attributes: Isolated
Secondary Attributes: On-Board LEDs
Embedded: No
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+8059.69 грн
В кошику  од. на суму  грн.
EVAL1ED3241MC12HTOBO1 Infineon-EiceDRIVER_1ED32xxMC12H-DataSheet-v02_00-EN.pdf?fileId=5546d46278d64ffd01790e8498044865
EVAL1ED3241MC12HTOBO1
Виробник: Infineon Technologies
Description: EVAL BOARD FOR 1ED3241MC12H
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: 1ED3241MC12H
Supplied Contents: Board(s)
Primary Attributes: Isolated
Secondary Attributes: On-Board LEDs
Embedded: No
Part Status: Active
товару немає в наявності
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EVAL1ED3890MX12MTOBO1 Infineon-UG-2021-03_EVAL-1ED3890MX12M-UserManual-v01_04-EN.pdf?fileId=5546d4627aa5d4f5017aa9776e060d3c
EVAL1ED3890MX12MTOBO1
Виробник: Infineon Technologies
Description: 1ED3890MX12M EVAL BRD
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 1ED3890Mx12M
Supplied Contents: Board(s)
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+7516.24 грн
В кошику  од. на суму  грн.
EVAL1ED38X0DCTTOBO1 Infineon-UG-2021-04_EVAL-1ED38x0DCT-UserManual-v01_01-EN.pdf?fileId=5546d4627aa5d4f5017aa97786670d44
EVAL1ED38X0DCTTOBO1
Виробник: Infineon Technologies
Description: EICEDRIVER COMPANION BOARD
Packaging: Bulk
Function: MCU
Type: Embedded
Contents: Board(s)
Utilized IC / Part: XMC4200
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+7516.24 грн
В кошику  од. на суму  грн.
1ED3121MC12HXUMA1 Infineon-1ED31xxMC12H-_1ED-X3_Compact-DataSheet-v02_00-EN.pdf?fileId=5546d46277fc7439017802de09e5671d
1ED3121MC12HXUMA1
Виробник: Infineon Technologies
Description: DIGITAL ISO 8KV 1CH GT DVR DSO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Current - Peak Output: 5.5A
Technology: Magnetic Coupling
Current - Output High, Low: 5.5A, 5.5A
Voltage - Isolation: 8000Vpk
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-8
Rise / Fall Time (Typ): 30ns, 30ns (Max)
Common Mode Transient Immunity (Min): 200kV/µs
Propagation Delay tpLH / tpHL (Max): 100ns, 100ns
Part Status: Active
Number of Channels: 1
Voltage - Output Supply: 10V ~ 35V
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+88.15 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
1ED3121MC12HXUMA1 Infineon-1ED31xxMC12H-_1ED-X3_Compact-DataSheet-v02_00-EN.pdf?fileId=5546d46277fc7439017802de09e5671d
1ED3121MC12HXUMA1
Виробник: Infineon Technologies
Description: DIGITAL ISO 8KV 1CH GT DVR DSO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Current - Peak Output: 5.5A
Technology: Magnetic Coupling
Current - Output High, Low: 5.5A, 5.5A
Voltage - Isolation: 8000Vpk
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-8
Rise / Fall Time (Typ): 30ns, 30ns (Max)
Common Mode Transient Immunity (Min): 200kV/µs
Propagation Delay tpLH / tpHL (Max): 100ns, 100ns
Part Status: Active
Number of Channels: 1
Voltage - Output Supply: 10V ~ 35V
на замовлення 1511 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+165.26 грн
10+117.73 грн
25+107.45 грн
100+90.24 грн
250+85.20 грн
500+82.16 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
1ED3461MC12MXUMA1 Infineon-1ED34x1Mx12M-DataSheet-v02_01-EN.pdf?fileId=5546d46274cf54d50174d97c2fb71f62
1ED3461MC12MXUMA1
Виробник: Infineon Technologies
Description: DGT ISO 5.7KV 1CH GT DVR DSO16
Packaging: Tape & Reel (TR)
Package / Case: 16-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Current - Peak Output: 6A
Technology: Magnetic Coupling
Current - Output High, Low: 6A, 6A
Voltage - Isolation: 5700Vrms
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-16-28
Rise / Fall Time (Typ): 15ns, 15ns
Common Mode Transient Immunity (Min): 200V/ns
Propagation Delay tpLH / tpHL (Max): 270ns, 262ns
Part Status: Active
Number of Channels: 1
Voltage - Output Supply: 13V ~ 25V
товару немає в наявності
В кошику  од. на суму  грн.
1ED3461MC12MXUMA1 Infineon-1ED34x1Mx12M-DataSheet-v02_01-EN.pdf?fileId=5546d46274cf54d50174d97c2fb71f62
1ED3461MC12MXUMA1
Виробник: Infineon Technologies
Description: DGT ISO 5.7KV 1CH GT DVR DSO16
Packaging: Cut Tape (CT)
Package / Case: 16-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Current - Peak Output: 6A
Technology: Magnetic Coupling
Current - Output High, Low: 6A, 6A
Voltage - Isolation: 5700Vrms
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-16-28
Rise / Fall Time (Typ): 15ns, 15ns
Common Mode Transient Immunity (Min): 200V/ns
Propagation Delay tpLH / tpHL (Max): 270ns, 262ns
Part Status: Active
Number of Channels: 1
Voltage - Output Supply: 13V ~ 25V
на замовлення 698 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+365.86 грн
10+268.55 грн
25+247.65 грн
100+210.89 грн
250+200.62 грн
500+194.43 грн
В кошику  од. на суму  грн.
1ED3240MC12HXUMA1 Infineon-EiceDRIVER_1ED32xxMC12H-DataSheet-v02_00-EN.pdf?fileId=5546d46278d64ffd01790e8498044865
1ED3240MC12HXUMA1
Виробник: Infineon Technologies
Description: DGT ISO 5.7KV 1CH GT DVR DSO8-66
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Current - Peak Output: 10A
Technology: Magnetic Coupling
Current - Output High, Low: 10A, 10A
Voltage - Isolation: 5700Vrms
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-8-66
Rise / Fall Time (Typ): 9ns, 8.5ns
Common Mode Transient Immunity (Min): 200kV/µs
Propagation Delay tpLH / tpHL (Max): 110ns, 110ns
Pulse Width Distortion (Max): 5ns
Part Status: Active
Number of Channels: 1
Voltage - Output Supply: 10V ~ 35V
товару немає в наявності
В кошику  од. на суму  грн.
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