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DEMO9S12XHY256 DEMO9S12XHY256 NXP USA Inc. Description: MC9S12XHY256 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), LCD
Core Processor: HCS12X
Utilized IC / Part: MC9S12XHY256
Part Status: Active
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TRK-MPC5604P TRK-MPC5604P NXP USA Inc. MPC5604P.pdf Description: STARTERTRAK MPC5604P EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: e200
Utilized IC / Part: MPC5604P
Platform: StarterTRAK
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+11935.80 грн
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TRK-MPC5634M TRK-MPC5634M NXP USA Inc. MPC5634M.pdf Description: STARTERTRAK MPC5634M EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: e200
Utilized IC / Part: MPC5634M
Platform: StarterTRAK
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
1+13011.69 грн
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DSPAUDIOEVMMB1E NXP USA Inc. Description: DSP563XX EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s)
Utilized IC / Part: DSP563xx
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MX50EBOOKDC1 MX50EBOOKDC1 NXP USA Inc. IMX50FS.pdf Description: HARDWARE MX50EBOOKDC1
Packaging: Box
For Use With/Related Products: i.MX50
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
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LFDA8451 NXP USA Inc. TWRMECHFS.pdf Description: MMA8451 DEVICE ADPTR BRD
Packaging: Box
For Use With/Related Products: Freescale Tower System, MMA8451Q
Accessory Type: Adapter Board
Part Status: Obsolete
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MC13850-900HEVK NXP USA Inc. MC13850.pdf Description: IC MC13850_900_HIIP3_EVK
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MC13851-2400EVK NXP USA Inc. MC13851.pdf Description: IC MC13851 EVB 2400MHZ
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MC13852-434EVK NXP USA Inc. MC13852.pdf Description: IC MC13852 EVB 434MHZ
Packaging: Box
For Use With/Related Products: MC13852
Frequency: 434MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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MC13917-1900EVK NXP USA Inc. MBC13917.pdf Description: IC MC13917_1900_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 1.9GHz
Type: Amplifier
Supplied Contents: Board(s)
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MC13917-350EVK NXP USA Inc. MBC13917.pdf Description: IC MC13917_350_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 350MHz
Type: Amplifier
Supplied Contents: Board(s)
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MC13917-434EVK NXP USA Inc. MBC13917.pdf Description: IC MC13917 EVB 434MHZ
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 434MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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MC13917-900EVK NXP USA Inc. MBC13917.pdf Description: IC MC13917_900_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 900MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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MCIMX535DVV1CR2 MCIMX535DVV1CR2 NXP USA Inc. IMX53CEC.pdf Description: IC MPU I.MX53 1.0GHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Obsolete
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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PSMN3R7-25YLC,115 PSMN3R7-25YLC,115 NXP USA Inc. PSMN3R7-25YLC.pdf Description: MOSFET N-CH 25V 97A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V
Power Dissipation (Max): 64W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 21.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1585 pF @ 12 V
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PSMN3R7-30YLC,115 PSMN3R7-30YLC,115 NXP USA Inc. Description: MOSFET N-CH 30V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.95mOhm @ 20A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1848 pF @ 15 V
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PESD5V0L6UAS,118 PESD5V0L6UAS,118 NXP USA Inc. Description: TVS DIODE 5VWM 15VC 8-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: 8-TSSOP
Unidirectional Channels: 6
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 15V
Power - Peak Pulse: 35W
Power Line Protection: No
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PBSS3540E,115 PBSS3540E,115 NXP USA Inc. PBSS3540E.pdf Description: TRANS PNP 40V 0.5A SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
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PESD3V3L1UA,115 PESD3V3L1UA,115 NXP USA Inc. PESD3V3L1UA_UB_UL.pdf Description: TVS DIODE 3.3VWM 11VC SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 34pF @ 1MHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: SOD-323
Unidirectional Channels: 1
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 45W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
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PBSS2540E,115 PBSS2540E,115 NXP USA Inc. PBSS2540E.pdf Description: TRANS NPN 40V 0.5A SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 2V
Frequency - Transition: 450MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
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BZA862AL,115 BZA862AL,115 NXP USA Inc. BZA862AL.pdf Description: TVS DIODE 6.2VWM SOT353
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 200pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.2V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 15W
Power Line Protection: No
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PMF290XN,115 PMF290XN,115 NXP USA Inc. Description: MOSFET N-CH 20V 1A SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1A (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 200mA, 4.5V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SC-70
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 34 pF @ 20 V
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BLF6G27LS-50BN,112 NXP USA Inc. Description: RF MOSFET LDMOS 28V CDFM6
Packaging: Bulk
Package / Case: SOT-1112B
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Configuration: Dual
Power - Output: 3W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: CDFM6
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 430 mA
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P80C31SFAA,512 P80C31SFAA,512 NXP USA Inc. 80C31_80C32.pdf Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 32
DigiKey Programmable: Not Verified
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P87C51RA2FA,512 P87C51RA2FA,512 NXP USA Inc. P87C51RA2_RB2_RC2_RD2.pdf Description: IC MCU 8BIT 8KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P87C552SFAA,512 P87C552SFAA,512 NXP USA Inc. Description: IC MCU 8BIT 8KB OTP 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, I2C, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.18x24.18)
Number of I/O: 40
DigiKey Programmable: Not Verified
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P87LPC764FDH,512 P87LPC764FDH,512 NXP USA Inc. P87LPC764.pdf Description: IC MCU 8BIT 4KB OTP 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
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P89LPC9321FDH,512 P89LPC9321FDH,512 NXP USA Inc. P89LPC9321.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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P89LPC933HDH,512 P89LPC933HDH,512 NXP USA Inc. P89LPC933_934_935_936.pdf Description: IC MCU 8BIT 4KB FLASH 28TSSOP
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P89LPC983FDH,529 P89LPC983FDH,529 NXP USA Inc. P89LPC980_982_983_985.pdf Description: IC MCU 8BIT 4KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
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P89LPC985FA,529 P89LPC985FA,529 NXP USA Inc. P89LPC980_982_983_985.pdf Description: IC MCU 8BIT 8KB FLASH 28PLCC
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P89LPC985FDH,529 P89LPC985FDH,529 NXP USA Inc. P89LPC980_982_983_985.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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PCF7900NHN/C0K,112 PCF7900NHN/C0K,112 NXP USA Inc. PCF7900NHN_C0K_cm_118.html Description: RF TX IC UHF 315/434MHZ 16VFQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: UHF
Data Interface: PCB, Surface Mount
Power - Output: 6dBm
Applications: General Purpose
Current - Transmitting: 7mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
DigiKey Programmable: Not Verified
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PCF7900VHN/C0L,112 PCF7900VHN/C0L,112 NXP USA Inc. Description: RF TX IC UHF 315/434MHZ 16VFQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: UHF
Data Interface: PCB, Surface Mount
Power - Output: 6dBm
Applications: General Purpose
Current - Transmitting: 7mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
DigiKey Programmable: Not Verified
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PJF7992ATW/C1C,512 PJF7992ATW/C1C,512 NXP USA Inc. Description: IMMOBIL BASESTATION IC 20HTSSOP
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TDA8595J/N2S,112 TDA8595J/N2S,112 NXP USA Inc. TDA8595.pdf Description: IC AMP CLASS AB QUAD 64W DBS27P
Packaging: Tube
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
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ASC8848ET,557 ASC8848ET,557 NXP USA Inc. Description: IC IP CAMERA MPU SXGA 484TFBGA
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ASC8849ET,557 ASC8849ET,557 NXP USA Inc. Description: IC IP CAMERA MPU SXGA 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
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ASC8850ET,557 ASC8850ET,557 NXP USA Inc. Description: IC IP CAMERA MPU SXGA 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
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LPC1765FET100,551 LPC1765FET100,551 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC1774FBD208,551 LPC1774FBD208,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 128KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
1+1122.73 грн
10+857.00 грн
36+782.30 грн
В кошику  од. на суму  грн.
LPC1776FBD208,551 LPC1776FBD208,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 165
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
LPC1776FET180,551 LPC1776FET180,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 141
DigiKey Programmable: Not Verified
на замовлення 112 шт:
термін постачання 21-31 дні (днів)
1+996.16 грн
10+756.88 грн
25+706.18 грн
В кошику  од. на суму  грн.
LPC1778FBD144,551 LPC1778FBD144,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
LPC1778FET180,551 LPC1778FET180,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 141
DigiKey Programmable: Not Verified
на замовлення 114 шт:
термін постачання 21-31 дні (днів)
1+1284.65 грн
10+988.86 грн
В кошику  од. на суму  грн.
LPC1785FBD208,551 LPC1785FBD208,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
LPC1786FBD208,551 LPC1786FBD208,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
на замовлення 33 шт:
термін постачання 21-31 дні (днів)
1+1175.33 грн
10+896.97 грн
В кошику  од. на суму  грн.
LPC1787FBD208,551 LPC1787FBD208,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
на замовлення 88 шт:
термін постачання 21-31 дні (днів)
1+1373.41 грн
10+1051.07 грн
36+960.78 грн
В кошику  од. на суму  грн.
LPC1788FBD144,551 LPC1788FBD144,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
DigiKey Programmable: Not Verified
на замовлення 177 шт:
термін постачання 21-31 дні (днів)
1+1033.96 грн
10+752.29 грн
60+751.94 грн
120+705.34 грн
В кошику  од. на суму  грн.
LPC1788FET180,551 LPC1788FET180,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 141
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
LPC1810FET100,551 LPC1810FET100,551 NXP USA Inc. LPC1850_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
LPC1820FET100,551 LPC1820FET100,551 NXP USA Inc. LPC1850_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 135 шт:
термін постачання 21-31 дні (днів)
1+687.94 грн
10+516.59 грн
25+480.11 грн
100+412.93 грн
В кошику  од. на суму  грн.
LPC1833FET256,551 LPC1833FET256,551 NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 80
DigiKey Programmable: Not Verified
на замовлення 76 шт:
термін постачання 21-31 дні (днів)
1+1219.72 грн
10+930.85 грн
25+869.89 грн
В кошику  од. на суму  грн.
LPC1837FET256,551 LPC1837FET256,551 NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 80
DigiKey Programmable: Not Verified
на замовлення 288 шт:
термін постачання 21-31 дні (днів)
1+748.76 грн
10+695.23 грн
90+670.49 грн
В кошику  од. на суму  грн.
LPC1853FET256,551 LPC1853FET256,551 NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
на замовлення 425 шт:
термін постачання 21-31 дні (днів)
1+959.17 грн
10+767.81 грн
В кошику  од. на суму  грн.
LPC1857FET256,551 LPC1857FET256,551 NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
на замовлення 7253 шт:
термін постачання 21-31 дні (днів)
1+969.03 грн
10+811.02 грн
90+747.33 грн
В кошику  од. на суму  грн.
LPC4310FET100,551 LPC4310FET100,551 NXP USA Inc. LPC4350_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
LPC4320FET100,551 LPC4320FET100,551 NXP USA Inc. LPC4350_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
на замовлення 254 шт:
термін постачання 21-31 дні (днів)
1+530.13 грн
10+412.51 грн
В кошику  од. на суму  грн.
LPC4330FET256,551 LPC4330FET256,551 NXP USA Inc. LPC4350_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
на замовлення 128 шт:
термін постачання 21-31 дні (днів)
1+934.51 грн
10+703.54 грн
90+548.74 грн
В кошику  од. на суму  грн.
LPC4350FET256,551 LPC4350FET256,551 NXP USA Inc. LPC4350_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
на замовлення 129 шт:
термін постачання 21-31 дні (днів)
1+1128.48 грн
10+859.38 грн
90+719.86 грн
В кошику  од. на суму  грн.
DEMO9S12XHY256
DEMO9S12XHY256
Виробник: NXP USA Inc.
Description: MC9S12XHY256 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), LCD
Core Processor: HCS12X
Utilized IC / Part: MC9S12XHY256
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
TRK-MPC5604P MPC5604P.pdf
TRK-MPC5604P
Виробник: NXP USA Inc.
Description: STARTERTRAK MPC5604P EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: e200
Utilized IC / Part: MPC5604P
Platform: StarterTRAK
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+11935.80 грн
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TRK-MPC5634M MPC5634M.pdf
TRK-MPC5634M
Виробник: NXP USA Inc.
Description: STARTERTRAK MPC5634M EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: e200
Utilized IC / Part: MPC5634M
Platform: StarterTRAK
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+13011.69 грн
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DSPAUDIOEVMMB1E
Виробник: NXP USA Inc.
Description: DSP563XX EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s)
Utilized IC / Part: DSP563xx
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MX50EBOOKDC1 IMX50FS.pdf
MX50EBOOKDC1
Виробник: NXP USA Inc.
Description: HARDWARE MX50EBOOKDC1
Packaging: Box
For Use With/Related Products: i.MX50
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
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LFDA8451 TWRMECHFS.pdf
Виробник: NXP USA Inc.
Description: MMA8451 DEVICE ADPTR BRD
Packaging: Box
For Use With/Related Products: Freescale Tower System, MMA8451Q
Accessory Type: Adapter Board
Part Status: Obsolete
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MC13850-900HEVK MC13850.pdf
Виробник: NXP USA Inc.
Description: IC MC13850_900_HIIP3_EVK
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MC13851-2400EVK MC13851.pdf
Виробник: NXP USA Inc.
Description: IC MC13851 EVB 2400MHZ
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MC13852-434EVK MC13852.pdf
Виробник: NXP USA Inc.
Description: IC MC13852 EVB 434MHZ
Packaging: Box
For Use With/Related Products: MC13852
Frequency: 434MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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MC13917-1900EVK MBC13917.pdf
Виробник: NXP USA Inc.
Description: IC MC13917_1900_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 1.9GHz
Type: Amplifier
Supplied Contents: Board(s)
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MC13917-350EVK MBC13917.pdf
Виробник: NXP USA Inc.
Description: IC MC13917_350_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 350MHz
Type: Amplifier
Supplied Contents: Board(s)
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MC13917-434EVK MBC13917.pdf
Виробник: NXP USA Inc.
Description: IC MC13917 EVB 434MHZ
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 434MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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MC13917-900EVK MBC13917.pdf
Виробник: NXP USA Inc.
Description: IC MC13917_900_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 900MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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MCIMX535DVV1CR2 IMX53CEC.pdf
MCIMX535DVV1CR2
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 1.0GHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Obsolete
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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PSMN3R7-25YLC,115 PSMN3R7-25YLC.pdf
PSMN3R7-25YLC,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 25V 97A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V
Power Dissipation (Max): 64W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 21.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1585 pF @ 12 V
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PSMN3R7-30YLC,115
PSMN3R7-30YLC,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.95mOhm @ 20A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1848 pF @ 15 V
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PESD5V0L6UAS,118
PESD5V0L6UAS,118
Виробник: NXP USA Inc.
Description: TVS DIODE 5VWM 15VC 8-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: 8-TSSOP
Unidirectional Channels: 6
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 15V
Power - Peak Pulse: 35W
Power Line Protection: No
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PBSS3540E,115 PBSS3540E.pdf
PBSS3540E,115
Виробник: NXP USA Inc.
Description: TRANS PNP 40V 0.5A SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
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PESD3V3L1UA,115 PESD3V3L1UA_UB_UL.pdf
PESD3V3L1UA,115
Виробник: NXP USA Inc.
Description: TVS DIODE 3.3VWM 11VC SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 34pF @ 1MHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: SOD-323
Unidirectional Channels: 1
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 45W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
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PBSS2540E,115 PBSS2540E.pdf
PBSS2540E,115
Виробник: NXP USA Inc.
Description: TRANS NPN 40V 0.5A SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 2V
Frequency - Transition: 450MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
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BZA862AL,115 BZA862AL.pdf
BZA862AL,115
Виробник: NXP USA Inc.
Description: TVS DIODE 6.2VWM SOT353
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 200pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.2V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 15W
Power Line Protection: No
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PMF290XN,115
PMF290XN,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 20V 1A SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1A (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 200mA, 4.5V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SC-70
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 34 pF @ 20 V
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BLF6G27LS-50BN,112
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V CDFM6
Packaging: Bulk
Package / Case: SOT-1112B
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Configuration: Dual
Power - Output: 3W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: CDFM6
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 430 mA
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P80C31SFAA,512 80C31_80C32.pdf
P80C31SFAA,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 32
DigiKey Programmable: Not Verified
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P87C51RA2FA,512 P87C51RA2_RB2_RC2_RD2.pdf
P87C51RA2FA,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P87C552SFAA,512
P87C552SFAA,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, I2C, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.18x24.18)
Number of I/O: 40
DigiKey Programmable: Not Verified
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P87LPC764FDH,512 P87LPC764.pdf
P87LPC764FDH,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
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P89LPC9321FDH,512 P89LPC9321.pdf
P89LPC9321FDH,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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P89LPC933HDH,512 P89LPC933_934_935_936.pdf
P89LPC933HDH,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28TSSOP
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P89LPC983FDH,529 P89LPC980_982_983_985.pdf
P89LPC983FDH,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
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P89LPC985FA,529 P89LPC980_982_983_985.pdf
P89LPC985FA,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28PLCC
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P89LPC985FDH,529 P89LPC980_982_983_985.pdf
P89LPC985FDH,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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PCF7900NHN/C0K,112 PCF7900NHN_C0K_cm_118.html
PCF7900NHN/C0K,112
Виробник: NXP USA Inc.
Description: RF TX IC UHF 315/434MHZ 16VFQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: UHF
Data Interface: PCB, Surface Mount
Power - Output: 6dBm
Applications: General Purpose
Current - Transmitting: 7mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
DigiKey Programmable: Not Verified
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PCF7900VHN/C0L,112
PCF7900VHN/C0L,112
Виробник: NXP USA Inc.
Description: RF TX IC UHF 315/434MHZ 16VFQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: UHF
Data Interface: PCB, Surface Mount
Power - Output: 6dBm
Applications: General Purpose
Current - Transmitting: 7mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
DigiKey Programmable: Not Verified
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PJF7992ATW/C1C,512
PJF7992ATW/C1C,512
Виробник: NXP USA Inc.
Description: IMMOBIL BASESTATION IC 20HTSSOP
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TDA8595J/N2S,112 TDA8595.pdf
TDA8595J/N2S,112
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W DBS27P
Packaging: Tube
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
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ASC8848ET,557
ASC8848ET,557
Виробник: NXP USA Inc.
Description: IC IP CAMERA MPU SXGA 484TFBGA
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ASC8849ET,557
ASC8849ET,557
Виробник: NXP USA Inc.
Description: IC IP CAMERA MPU SXGA 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
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ASC8850ET,557
ASC8850ET,557
Виробник: NXP USA Inc.
Description: IC IP CAMERA MPU SXGA 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
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LPC1765FET100,551 LPC1769_68_67_66_65_64_63.pdf
LPC1765FET100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC1774FBD208,551 LPC178X_7X.pdf
LPC1774FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1122.73 грн
10+857.00 грн
36+782.30 грн
В кошику  од. на суму  грн.
LPC1776FBD208,551 LPC178X_7X.pdf
LPC1776FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 165
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
LPC1776FET180,551 LPC178X_7X.pdf
LPC1776FET180,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 141
DigiKey Programmable: Not Verified
на замовлення 112 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+996.16 грн
10+756.88 грн
25+706.18 грн
В кошику  од. на суму  грн.
LPC1778FBD144,551 LPC178X_7X.pdf
LPC1778FBD144,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
LPC1778FET180,551 LPC178X_7X.pdf
LPC1778FET180,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 141
DigiKey Programmable: Not Verified
на замовлення 114 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1284.65 грн
10+988.86 грн
В кошику  од. на суму  грн.
LPC1785FBD208,551 LPC178X_7X.pdf
LPC1785FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
LPC1786FBD208,551 LPC178X_7X.pdf
LPC1786FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
на замовлення 33 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1175.33 грн
10+896.97 грн
В кошику  од. на суму  грн.
LPC1787FBD208,551 LPC178X_7X.pdf
LPC1787FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
на замовлення 88 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1373.41 грн
10+1051.07 грн
36+960.78 грн
В кошику  од. на суму  грн.
LPC1788FBD144,551 LPC178X_7X.pdf
LPC1788FBD144,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
DigiKey Programmable: Not Verified
на замовлення 177 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1033.96 грн
10+752.29 грн
60+751.94 грн
120+705.34 грн
В кошику  од. на суму  грн.
LPC1788FET180,551 LPC178X_7X.pdf
LPC1788FET180,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 141
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
LPC1810FET100,551 LPC1850_30_20_10.pdf
LPC1810FET100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
LPC1820FET100,551 LPC1850_30_20_10.pdf
LPC1820FET100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 135 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+687.94 грн
10+516.59 грн
25+480.11 грн
100+412.93 грн
В кошику  од. на суму  грн.
LPC1833FET256,551 LPC185X_3X_2X_1X.pdf
LPC1833FET256,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 80
DigiKey Programmable: Not Verified
на замовлення 76 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1219.72 грн
10+930.85 грн
25+869.89 грн
В кошику  од. на суму  грн.
LPC1837FET256,551 LPC185X_3X_2X_1X.pdf
LPC1837FET256,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 80
DigiKey Programmable: Not Verified
на замовлення 288 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+748.76 грн
10+695.23 грн
90+670.49 грн
В кошику  од. на суму  грн.
LPC1853FET256,551 LPC185X_3X_2X_1X.pdf
LPC1853FET256,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
на замовлення 425 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+959.17 грн
10+767.81 грн
В кошику  од. на суму  грн.
LPC1857FET256,551 LPC185X_3X_2X_1X.pdf
LPC1857FET256,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
на замовлення 7253 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+969.03 грн
10+811.02 грн
90+747.33 грн
В кошику  од. на суму  грн.
LPC4310FET100,551 LPC4350_30_20_10.pdf
LPC4310FET100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
LPC4320FET100,551 LPC4350_30_20_10.pdf
LPC4320FET100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
на замовлення 254 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+530.13 грн
10+412.51 грн
В кошику  од. на суму  грн.
LPC4330FET256,551 LPC4350_30_20_10.pdf
LPC4330FET256,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
на замовлення 128 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+934.51 грн
10+703.54 грн
90+548.74 грн
В кошику  од. на суму  грн.
LPC4350FET256,551 LPC4350_30_20_10.pdf
LPC4350FET256,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
на замовлення 129 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1128.48 грн
10+859.38 грн
90+719.86 грн
В кошику  од. на суму  грн.
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