Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35485) > Сторінка 185 з 592
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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PCF7931AS/3851,122 | NXP USA Inc. | Description: PROG ID TRANS LEADLESS STICK |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
PCF7936AS/3851/C,1 | NXP USA Inc. | Description: RFID TAG R/W 125KHZ ENCAP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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PJF7992ATW/C1C,518 | NXP USA Inc. | Description: IMMOBIL BASESTATION IC 20HTSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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OM13005,598 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
MC33970DWR2 | NXP USA Inc. |
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC Packaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 40mA Interface: SPI Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (8) Voltage - Supply: 4.5V ~ 5.5V Voltage - Load: 6.5V ~ 26V Supplier Device Package: 24-SOIC Motor Type - Stepper: Bipolar Grade: Automotive |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MMA2260DR2 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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LPC1850FET256,551 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 200K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Number of I/O: 164 DigiKey Programmable: Not Verified |
на замовлення 12893 шт: термін постачання 21-31 дні (днів) |
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LPC1830FET256,551 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 200K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Number of I/O: 164 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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OM13313,598 | NXP USA Inc. |
![]() Packaging: Box Function: Power Line Transceiver Type: Interface Utilized IC / Part: TDA5051A Supplied Contents: Board(s) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SSL2103T/1,518 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Outputs: 1 Frequency: 100kHz Type: AC DC Offline Switcher Operating Temperature: -40°C ~ 100°C (TA) Internal Switch(s): No Topology: Flyback, Step-Down (Buck) Supplier Device Package: 14-SO Dimming: Triac Voltage - Supply (Min): 12V Voltage - Supply (Max): 28V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
TFA9881UK/N1,118 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Depop, Overvoltage, Short Circuit, Thermal Protection Package / Case: 9-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm Supplier Device Package: 9-WLCSP (1.3x1.3) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
TFA9881UK/N1,118 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Features: Depop, Overvoltage, Short Circuit, Thermal Protection Package / Case: 9-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm Supplier Device Package: 9-WLCSP (1.3x1.3) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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LPC1788FET208,551 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-TFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-TFBGA (15x15) Part Status: Active Number of I/O: 165 DigiKey Programmable: Not Verified |
на замовлення 2859 шт: термін постачання 21-31 дні (днів) |
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LPC1778FET208,551 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-TFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-TFBGA (15x15) Part Status: Active Number of I/O: 165 DigiKey Programmable: Not Verified |
на замовлення 92 шт: термін постачання 21-31 дні (днів) |
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LPC1788FBD208,551 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Discontinued at Digi-Key Number of I/O: 165 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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LPC1778FBD208,551 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 165 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TFA9882UK/N1,023 | NXP USA Inc. |
![]() Features: Depop, I2S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage Packaging: Tape & Reel (TR) Package / Case: 9-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm Supplier Device Package: 9-WLCSP (1.49x1.27) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TFA9882UK/N1,023 | NXP USA Inc. |
![]() Features: Depop, I2S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage Packaging: Cut Tape (CT) Package / Case: 9-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm Supplier Device Package: 9-WLCSP (1.49x1.27) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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CBTL04DP211BS,518 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Multiplexer Voltage - Supply: 3.0V ~ 3.6V Applications: Video Display Supplier Device Package: 32-HVQFN (3x6) Part Status: Obsolete Control Interface: I²C |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PCA9621PW,118 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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CBTL04DP211BS,518 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Multiplexer Voltage - Supply: 3.0V ~ 3.6V Applications: Video Display Supplier Device Package: 32-HVQFN (3x6) Part Status: Obsolete Control Interface: I²C |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-K60N512-KEIL | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-MCF51JF | NXP USA Inc. |
![]() Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: Coldfire V1 Utilized IC / Part: MCF51JF Platform: Tower System |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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LFSTBEB3110 | NXP USA Inc. |
![]() Packaging: Box Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB Interface: I2C Sensor Type: Accelerometer, Magnetometer Utilized IC / Part: MAG3110, MMA8451Q Supplied Contents: Board(s), Cable(s) Embedded: No Sensing Range: ±2g, 4g, 8g, ±1000µT Part Status: Obsolete Contents: Board(s), Cable(s) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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RD4247MAG3110 | NXP USA Inc. |
![]() Packaging: Box Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB Interface: I2C Sensor Type: Accelerometer, Magnetometer Utilized IC / Part: MAG3110, MMA8451Q Supplied Contents: Board(s), Cable(s) Embedded: No Sensing Range: ±2g, 4g, 8g, ±1000µT Part Status: Active Contents: Board(s), Cable(s) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MCIMX-LVDS1 | NXP USA Inc. |
![]() Packaging: Box For Use With/Related Products: i.MX53 Accessory Type: Display - LVDS Interface Add-On Board |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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FSLBOT | NXP USA Inc. |
![]() Packaging: Box Configuration: Servo Actuators Contents: Board(s), Components, Hardware, Servo(s) Utilized IC / Part: MCF52259, MMA8451Q, MPR121 Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-AUDIO-SGTL | NXP USA Inc. |
Description: TOWER SYSTEM KIT AUDIO Packaging: Box For Use With/Related Products: Freescale Tower System Accessory Type: Module, Audio with CODEC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-K53N512 | NXP USA Inc. |
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на замовлення 1 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||
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TWR-MCF51QM | NXP USA Inc. |
![]() Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: Coldfire V1 Board Type: Evaluation Platform Utilized IC / Part: MCF51QM Platform: Tower System Part Status: Active |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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TWR-MCF51QM-KIT | NXP USA Inc. |
![]() Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: Coldfire V1 Utilized IC / Part: MCF51QM Platform: Tower System |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-MECH | NXP USA Inc. |
![]() Packaging: Box Configuration: Robot Components Contents: Board(s), Cable(s), Components, Hardware, Wheel(s) Utilized IC / Part: MCF52259, MMA8451Q, MPR121 Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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EVBUSB2SER | NXP USA Inc. |
Description: USB TO SERIAL BRIDGE Packaging: Box Accessory Type: USB to Serial TTL Adapter |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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U-MULTILINK | NXP USA Inc. |
![]() Packaging: Box For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices Type: Debugger, Programmer (In-Circuit/In-System) Contents: Board(s), Cable(s) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MCZ33903BD5EK | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MCZ33903BS3EK | NXP USA Inc. |
![]() Packaging: Box Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SSOP-EP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MCZ33903BS5EK | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MCZ33905BD3EK | NXP USA Inc. |
![]() Packaging: Box Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 54-SOIC-EP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-MCF51JF-KIT | NXP USA Inc. |
![]() Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: Coldfire V1 Utilized IC / Part: MCF51JF Platform: Tower System |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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MCIMX233DAG4C | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 128-LQFP Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -10°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 128-LQFP (14x14) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
на замовлення 510 шт: термін постачання 21-31 дні (днів) |
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MCIMX233DJM4C | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -10°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 169-MAPBGA (11x11) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
на замовлення 1457 шт: термін постачання 21-31 дні (днів) |
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MCZ33905BD5EK | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC34827A1EPR2 | NXP USA Inc. |
Description: IC USB POWER MANAGER 20-QFN Packaging: Tape & Reel (TR) Package / Case: 20-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: OR Controller, UART/USB Data, Audio Management Current - Supply: 9µA Supplier Device Package: 20-QFN-EP (3x3) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC34827A2EPR2 | NXP USA Inc. |
Description: IC USB POWER MANAGER 20-QFN Packaging: Tape & Reel (TR) Package / Case: 20-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: OR Controller, UART/USB Data, Audio Management Current - Supply: 9µA Supplier Device Package: 20-QFN-EP (3x4) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MCIMX233CAG4C | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 128-LQFP Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 128-LQFP (14x14) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
на замовлення 375 шт: термін постачання 21-31 дні (днів) |
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MPC8309CVMAHFCA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 489-LFBGA Mounting Type: Surface Mount Speed: 417MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 489-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MSC8156ETVT1000B | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MSC8156ESVT1000B | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MSC8154TVT1000B | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MSC8154ETVT1000B | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SSL4101/1,518 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Outputs: 1 Frequency: 380kHz Type: AC DC Offline Switcher Operating Temperature: -40°C ~ 150°C (TJ) Applications: Lighting Internal Switch(s): No Topology: Flyback Supplier Device Package: 16-SO Voltage - Supply (Min): 15V Voltage - Supply (Max): 38V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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OM13001,598 | NXP USA Inc. |
Description: LPC1788 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Accessories Core Processor: ARM® Cortex®-M3 Board Type: Evaluation Platform Utilized IC / Part: LPC1788 Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-RS08DC-KA8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: RS08 Board Type: Evaluation Platform Utilized IC / Part: MC9RS08KA8 Platform: Tower System Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-S08DC-AC60 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08AC60 Platform: Tower System Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-S08DC-QD4 | NXP USA Inc. | Description: TOWER SYSTEM MC9S08QD4 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-S08DC-QE64 | NXP USA Inc. | Description: TOWER SYSTEM MC9S08QE64 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-S08DC-QG8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08QG8 Platform: Tower System Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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TWR-S08DC-SH8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08SH8 Platform: Tower System Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
1323XUSB | NXP USA Inc. | Description: RF EVAL FOR MC1323X |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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TWR-S08UNIV | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. |
PCF7931AS/3851,122 |
Виробник: NXP USA Inc.
Description: PROG ID TRANS LEADLESS STICK
Description: PROG ID TRANS LEADLESS STICK
товару немає в наявності
В кошику
од. на суму грн.
PCF7936AS/3851/C,1 |
Виробник: NXP USA Inc.
Description: RFID TAG R/W 125KHZ ENCAP
Description: RFID TAG R/W 125KHZ ENCAP
товару немає в наявності
В кошику
од. на суму грн.
PJF7992ATW/C1C,518 |
Виробник: NXP USA Inc.
Description: IMMOBIL BASESTATION IC 20HTSSOP
Description: IMMOBIL BASESTATION IC 20HTSSOP
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В кошику
од. на суму грн.
OM13005,598 |
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Виробник: NXP USA Inc.
Description: BOARD EVAL EM773 METER US PLUG
Description: BOARD EVAL EM773 METER US PLUG
товару немає в наявності
В кошику
од. на суму грн.
MC33970DWR2 |
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive
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В кошику
од. на суму грн.
MMA2260DR2 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 1.5G ANALOG 16SOIC
Description: ACCELEROMETER 1.5G ANALOG 16SOIC
товару немає в наявності
В кошику
од. на суму грн.
LPC1850FET256,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
на замовлення 12893 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 832.86 грн |
10+ | 632.99 грн |
90+ | 547.33 грн |
180+ | 505.63 грн |
LPC1830FET256,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
OM13313,598 |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TDA5051A
Packaging: Box
Function: Power Line Transceiver
Type: Interface
Utilized IC / Part: TDA5051A
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVAL BOARD FOR TDA5051A
Packaging: Box
Function: Power Line Transceiver
Type: Interface
Utilized IC / Part: TDA5051A
Supplied Contents: Board(s)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
SSL2103T/1,518 |
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Виробник: NXP USA Inc.
Description: IC LED DRIVER OFFL TRIAC 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 100kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 100°C (TA)
Internal Switch(s): No
Topology: Flyback, Step-Down (Buck)
Supplier Device Package: 14-SO
Dimming: Triac
Voltage - Supply (Min): 12V
Voltage - Supply (Max): 28V
Description: IC LED DRIVER OFFL TRIAC 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 100kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 100°C (TA)
Internal Switch(s): No
Topology: Flyback, Step-Down (Buck)
Supplier Device Package: 14-SO
Dimming: Triac
Voltage - Supply (Min): 12V
Voltage - Supply (Max): 28V
товару немає в наявності
В кошику
од. на суму грн.
TFA9881UK/N1,118 |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, Overvoltage, Short Circuit, Thermal Protection
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.3x1.3)
Part Status: Obsolete
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, Overvoltage, Short Circuit, Thermal Protection
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.3x1.3)
Part Status: Obsolete
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В кошику
од. на суму грн.
TFA9881UK/N1,118 |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Overvoltage, Short Circuit, Thermal Protection
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.3x1.3)
Part Status: Obsolete
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Overvoltage, Short Circuit, Thermal Protection
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.3x1.3)
Part Status: Obsolete
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В кошику
од. на суму грн.
LPC1788FET208,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
на замовлення 2859 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1087.97 грн |
10+ | 834.29 грн |
25+ | 780.93 грн |
126+ | 677.81 грн |
LPC1778FET208,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
на замовлення 92 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1159.40 грн |
10+ | 883.34 грн |
25+ | 825.17 грн |
LPC1788FBD208,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 165
DigiKey Programmable: Not Verified
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В кошику
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LPC1778FBD208,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
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TFA9882UK/N1,023 |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Features: Depop, I2S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Packaging: Tape & Reel (TR)
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.49x1.27)
Part Status: Obsolete
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Features: Depop, I2S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Packaging: Tape & Reel (TR)
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.49x1.27)
Part Status: Obsolete
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TFA9882UK/N1,023 |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Features: Depop, I2S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Packaging: Cut Tape (CT)
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.49x1.27)
Part Status: Obsolete
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Features: Depop, I2S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Packaging: Cut Tape (CT)
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.49x1.27)
Part Status: Obsolete
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CBTL04DP211BS,518 |
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Виробник: NXP USA Inc.
Description: IC VIDEO MULTIPLEXER 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Multiplexer
Voltage - Supply: 3.0V ~ 3.6V
Applications: Video Display
Supplier Device Package: 32-HVQFN (3x6)
Part Status: Obsolete
Control Interface: I²C
Description: IC VIDEO MULTIPLEXER 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Multiplexer
Voltage - Supply: 3.0V ~ 3.6V
Applications: Video Display
Supplier Device Package: 32-HVQFN (3x6)
Part Status: Obsolete
Control Interface: I²C
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PCA9621PW,118 |
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Виробник: NXP USA Inc.
Description: IC BUS PORT 8BIT 65MA 16TSSOP
Description: IC BUS PORT 8BIT 65MA 16TSSOP
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CBTL04DP211BS,518 |
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Виробник: NXP USA Inc.
Description: IC VIDEO MULTIPLEXER 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Multiplexer
Voltage - Supply: 3.0V ~ 3.6V
Applications: Video Display
Supplier Device Package: 32-HVQFN (3x6)
Part Status: Obsolete
Control Interface: I²C
Description: IC VIDEO MULTIPLEXER 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Multiplexer
Voltage - Supply: 3.0V ~ 3.6V
Applications: Video Display
Supplier Device Package: 32-HVQFN (3x6)
Part Status: Obsolete
Control Interface: I²C
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TWR-K60N512-KEIL |
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Виробник: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Description: TOWER SYSTEM K60 EVAL BRD
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TWR-MCF51JF |
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Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51JF EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Utilized IC / Part: MCF51JF
Platform: Tower System
Description: TOWER SYSTEM MCF51JF EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Utilized IC / Part: MCF51JF
Platform: Tower System
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 5610.19 грн |
LFSTBEB3110 |
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Виробник: NXP USA Inc.
Description: KIT EVAL 3-AXIS DIG ACCELER
Packaging: Box
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Interface: I2C
Sensor Type: Accelerometer, Magnetometer
Utilized IC / Part: MAG3110, MMA8451Q
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, ±1000µT
Part Status: Obsolete
Contents: Board(s), Cable(s)
Description: KIT EVAL 3-AXIS DIG ACCELER
Packaging: Box
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Interface: I2C
Sensor Type: Accelerometer, Magnetometer
Utilized IC / Part: MAG3110, MMA8451Q
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, ±1000µT
Part Status: Obsolete
Contents: Board(s), Cable(s)
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RD4247MAG3110 |
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Виробник: NXP USA Inc.
Description: KIT EVAL 3-AXIS DIG ACCELER
Packaging: Box
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Interface: I2C
Sensor Type: Accelerometer, Magnetometer
Utilized IC / Part: MAG3110, MMA8451Q
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, ±1000µT
Part Status: Active
Contents: Board(s), Cable(s)
Description: KIT EVAL 3-AXIS DIG ACCELER
Packaging: Box
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Interface: I2C
Sensor Type: Accelerometer, Magnetometer
Utilized IC / Part: MAG3110, MMA8451Q
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, ±1000µT
Part Status: Active
Contents: Board(s), Cable(s)
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MCIMX-LVDS1 |
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Виробник: NXP USA Inc.
Description: DAUGHTER CARD LVDS FOR I.MX53
Packaging: Box
For Use With/Related Products: i.MX53
Accessory Type: Display - LVDS Interface Add-On Board
Description: DAUGHTER CARD LVDS FOR I.MX53
Packaging: Box
For Use With/Related Products: i.MX53
Accessory Type: Display - LVDS Interface Add-On Board
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 42426.95 грн |
FSLBOT |
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Виробник: NXP USA Inc.
Description: KIT TOWER MECH BOARD
Packaging: Box
Configuration: Servo Actuators
Contents: Board(s), Components, Hardware, Servo(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
Description: KIT TOWER MECH BOARD
Packaging: Box
Configuration: Servo Actuators
Contents: Board(s), Components, Hardware, Servo(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
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TWR-AUDIO-SGTL |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM KIT AUDIO
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Module, Audio with CODEC
Description: TOWER SYSTEM KIT AUDIO
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Module, Audio with CODEC
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TWR-K53N512 |
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Виробник: NXP USA Inc.
Description: TOWER SYSTEM K53 EVAL BRD
Description: TOWER SYSTEM K53 EVAL BRD
на замовлення 1 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
TWR-MCF51QM |
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Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51QM EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Board Type: Evaluation Platform
Utilized IC / Part: MCF51QM
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MCF51QM EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Board Type: Evaluation Platform
Utilized IC / Part: MCF51QM
Platform: Tower System
Part Status: Active
на замовлення 19 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 5884.15 грн |
TWR-MCF51QM-KIT |
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Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51QM EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Utilized IC / Part: MCF51QM
Platform: Tower System
Description: TOWER SYSTEM MCF51QM EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Utilized IC / Part: MCF51QM
Platform: Tower System
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TWR-MECH |
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Виробник: NXP USA Inc.
Description: KIT TOWER ROBOT SENSOR MOTOR
Packaging: Box
Configuration: Robot Components
Contents: Board(s), Cable(s), Components, Hardware, Wheel(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
Description: KIT TOWER ROBOT SENSOR MOTOR
Packaging: Box
Configuration: Robot Components
Contents: Board(s), Cable(s), Components, Hardware, Wheel(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
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EVBUSB2SER |
Виробник: NXP USA Inc.
Description: USB TO SERIAL BRIDGE
Packaging: Box
Accessory Type: USB to Serial TTL Adapter
Description: USB TO SERIAL BRIDGE
Packaging: Box
Accessory Type: USB to Serial TTL Adapter
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U-MULTILINK |
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Виробник: NXP USA Inc.
Description: USB MULTILINK PROGRAMMER
Packaging: Box
For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Part Status: Active
Description: USB MULTILINK PROGRAMMER
Packaging: Box
For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Part Status: Active
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MCZ33903BD5EK |
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Виробник: NXP USA Inc.
Description: IC SBC CAN HS 5.0V 32SOIC
Description: IC SBC CAN HS 5.0V 32SOIC
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MCZ33903BS3EK |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Box
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Box
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
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MCZ33903BS5EK |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
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MCZ33905BD3EK |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Box
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Box
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
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TWR-MCF51JF-KIT |
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Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51JF EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Utilized IC / Part: MCF51JF
Platform: Tower System
Description: TOWER SYSTEM MCF51JF EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Utilized IC / Part: MCF51JF
Platform: Tower System
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 8359.17 грн |
MCIMX233DAG4C |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
на замовлення 510 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1259.88 грн |
10+ | 962.71 грн |
25+ | 900.18 грн |
80+ | 789.05 грн |
230+ | 752.02 грн |
450+ | 733.60 грн |
MCIMX233DJM4C |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
на замовлення 1457 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1462.40 грн |
10+ | 1123.27 грн |
25+ | 1052.00 грн |
80+ | 923.76 грн |
230+ | 881.56 грн |
MCZ33905BD5EK |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Description: IC INTERFACE SPECIALIZED 54SOIC
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MC34827A1EPR2 |
Виробник: NXP USA Inc.
Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Obsolete
Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Obsolete
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MC34827A2EPR2 |
Виробник: NXP USA Inc.
Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x4)
Part Status: Obsolete
Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x4)
Part Status: Obsolete
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MCIMX233CAG4C |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
на замовлення 375 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1146.06 грн |
10+ | 879.34 грн |
25+ | 823.39 грн |
100+ | 760.53 грн |
MPC8309CVMAHFCA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 417MHZ 489BGA
Packaging: Tray
Package / Case: 489-LFBGA
Mounting Type: Surface Mount
Speed: 417MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 489-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Description: IC MPU MPC83XX 417MHZ 489BGA
Packaging: Tray
Package / Case: 489-LFBGA
Mounting Type: Surface Mount
Speed: 417MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 489-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
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MSC8156ETVT1000B |
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Виробник: NXP USA Inc.
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Description: IC DSP 6 CORE 1GHZ 783FCBGA
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MSC8156ESVT1000B |
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Виробник: NXP USA Inc.
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Description: IC DSP 6 CORE 1GHZ 783FCBGA
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MSC8154TVT1000B |
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Виробник: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Description: IC DSP QUAD 1GHZ 783FCBGA
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MSC8154ETVT1000B |
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Виробник: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Description: IC DSP QUAD 1GHZ 783FCBGA
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SSL4101/1,518 |
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Виробник: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 380kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 150°C (TJ)
Applications: Lighting
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: 16-SO
Voltage - Supply (Min): 15V
Voltage - Supply (Max): 38V
Description: IC LED DRIVER OFFL SWITCHER 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 380kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 150°C (TJ)
Applications: Lighting
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: 16-SO
Voltage - Supply (Min): 15V
Voltage - Supply (Max): 38V
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OM13001,598 |
Виробник: NXP USA Inc.
Description: LPC1788 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1788
Part Status: Active
Description: LPC1788 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1788
Part Status: Active
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TWR-RS08DC-KA8 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: RS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9RS08KA8
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: RS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9RS08KA8
Platform: Tower System
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TWR-S08DC-AC60 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC60
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC60
Platform: Tower System
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TWR-S08DC-QD4 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QD4 EVAL BRD
Description: TOWER SYSTEM MC9S08QD4 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
TWR-S08DC-QE64 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QE64 EVAL BRD
Description: TOWER SYSTEM MC9S08QE64 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
TWR-S08DC-QG8 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08QG8
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08QG8
Platform: Tower System
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1428.65 грн |
TWR-S08DC-SH8 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SH8
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SH8
Platform: Tower System
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
1323XUSB |
Виробник: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Description: RF EVAL FOR MC1323X
товару немає в наявності
В кошику
од. на суму грн.
TWR-S08UNIV |
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Виробник: NXP USA Inc.
Description: TOWER SYST TWR-RS08DC/TWR-S08DC
Description: TOWER SYST TWR-RS08DC/TWR-S08DC
товару немає в наявності
В кошику
од. на суму грн.