Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (34294) > Сторінка 448 з 572
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
||
|---|---|---|---|---|---|---|---|
 |
S912ZVL12F0CLF | NXP USA Inc. | Description: IC MCU 16BIT 128KB FLASH 48LQFP |
товар відсутній |
|||
 |
MCIMX6D5EYM12AC | NXP USA Inc. |
 Description: I.MX 6 SERIES 32-BIT MPU ARM CO |
товар відсутній |
|||
| LS1084ASE7MQA | NXP USA Inc. | Description: LS1084A 1200/1600 ST WE |
товар відсутній |
||||
 |
MK22FN1M0AVLK12R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 80FQFP Packaging: Tape & Reel (TR) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 27x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 56 DigiKey Programmable: Not Verified |
товар відсутній |
|||
 |
MC33HB2001EKR2518 | NXP USA Inc. |
Description: BRUSH DC MOTOR CONTROLLER 16A |
товар відсутній |
|||
 |
MC33HB2002ES | NXP USA Inc. |
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR Packaging: Tray Package / Case: 28-VQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 10A Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Applications: DC Motors Technology: CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 28-HVQFN (6x6) Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Grade: Automotive Part Status: Active |
товар відсутній |
|||
| MC33HB2002ESR2 | NXP USA Inc. |
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR Packaging: Tape & Reel (TR) Package / Case: 28-VQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 10A Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Applications: DC Motors Technology: CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 28-HVQFN (6x6) Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Grade: Automotive Part Status: Active |
товар відсутній |
||||
 |
S9S12GN48AMLF | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
товар відсутній |
|||
 |
MPF5024AVNA0ESR2 | NXP USA Inc. | Description: PF5024 |
товар відсутній |
|||
 |
NX3L1G3157GMZ | NXP USA Inc. |
Description: IC SWITCH SPDT X 1 900MOHM 6XSON Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 900mOhm -3db Bandwidth: 60MHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 1MHz Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 100mOhm Switch Time (Ton, Toff) (Max): 25ns, 10ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Number of Circuits: 1 Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
|||
| S32G274AABK0CUCT | NXP USA Inc. |
Description: IC MPU AEC-Q100 1GHZ 525FCPBGA Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Supplier Device Package: 525-FCPBGA (19x19) Ethernet: MII, RGMII, RMII, SGMII USB: USB OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Security Features: HSE-H |
товар відсутній |
||||
 |
IP4284CZ10-TBR,115 | NXP USA Inc. |
Description: TVS DIODE 8VC DFN2510A-10 |
товар відсутній |
|||
 |
SPC5746CK1MMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
товар відсутній |
|||
 |
2PA1774QMB315 | NXP USA Inc. |
Description: NOW NEXPERIA 2PA1774QMB - SMALL Packaging: Bulk Package / Case: 3-XFDFN Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V Frequency - Transition: 100MHz Supplier Device Package: DFN1006B-3 Grade: Automotive Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 40 V Power - Max: 250 mW Qualification: AEC-Q101 |
на замовлення 57940 шт: термін постачання 21-31 дні (днів) |
|
||
 |
PDTC144VMB315 | NXP USA Inc. |
Description: TRANS PREBIAS Packaging: Bulk Part Status: Active Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V Supplier Device Package: DFN1006B-3 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 230 MHz Resistor - Base (R1): 47 kOhms Resistor - Emitter Base (R2): 10 kOhms Grade: Automotive Qualification: AEC-Q101 |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
|
||
 |
LPC11E13FBD48301 | NXP USA Inc. |
Description: IC MCU 32BIT 24KB FLASH 48LQFP |
товар відсутній |
|||
 |
SPC5747CHK0AVKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
товар відсутній |
|||
|
|
SP5747CHK0AVKU6R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
товар відсутній |
|||
 |
MML09211HT1 | NXP USA Inc. |
Description: IC RF AMP GSM 400MHZ-1.4GHZ 8DFN Packaging: Tape & Reel (TR) Package / Case: 8-VFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 400MHz ~ 1.4GHz RF Type: GSM, LTE, W-CDMA Voltage - Supply: 5V Gain: 21.3dB Current - Supply: 60mA Noise Figure: 0.66dB P1dB: 20dBm Test Frequency: 1.4GHz Supplier Device Package: 8-DFN (2x2) Part Status: Obsolete |
на замовлення 24000 шт: термін постачання 21-31 дні (днів) |
|
||
 |
NX3V1T66GM,115 | NXP USA Inc. |
Description: IC SWITCH SPST 6XSON |
на замовлення 33273 шт: термін постачання 21-31 дні (днів) |
|
||
 |
S912ZVC12F0VLFR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 10x10b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
|
||
 |
NX3L1G53GD,125 | NXP USA Inc. |
Description: IC SWITCH SPDT X 1 750MOHM 8XSON Packaging: Bulk Package / Case: 8-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 750mOhm -3db Bandwidth: 60MHz Supplier Device Package: 8-XSON, SOT996-2 (2x3) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 100kHz Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 20mOhm Switch Time (Ton, Toff) (Max): 24ns, 8ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Obsolete Number of Circuits: 1 |
на замовлення 13143 шт: термін постачання 21-31 дні (днів) |
|
||
| TDA18225HN/C1 | NXP USA Inc. | Description: INTEGRATED CIRCUIT |
на замовлення 938 шт: термін постачання 21-31 дні (днів) |
||||
 |
MC9S12E64MFUE | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP Packaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 16x10b; D/A 2x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V Connectivity: EBI/EMI, I²C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 60 |
на замовлення 924 шт: термін постачання 21-31 дні (днів) |
|
||
|
|
MC9S12DJ64MFUE | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP Packaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I²C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 59 |
товар відсутній |
|||
 |
LPC1112LVFHI33/103 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32HVQFN |
на замовлення 3920 шт: термін постачання 21-31 дні (днів) |
|
||
| P60D144PX34/9A0409 | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
товар відсутній |
||||
 |
BZX79-B6V2143 | NXP USA Inc. |
Description: NOW NEXPERIA BZX79-B6V2 - ZENER |
на замовлення 105000 шт: термін постачання 21-31 дні (днів) |
|
||
| BAP65-05 | NXP USA Inc. | Description: PIN DIODE, 30V V(BR), SILICON, T |
товар відсутній |
||||
 |
74AVC20T245DGV,118 | NXP USA Inc. |
Description: IC TRNSLTR BIDIRECTIONAL 56TSSOP |
на замовлення 14222 шт: термін постачання 21-31 дні (днів) |
|
||
|
|
S9S12G64AVLFR | NXP USA Inc. | Description: IC MCU 16BIT 64KB FLASH 48LQFP |
товар відсутній |
|||
| SWAC58R-ICC01L | NXP USA Inc. | Description: AUTO SOFTWARE SAC58R INTER CORE |
товар відсутній |
||||
| SWAC58R-ICC01V | NXP USA Inc. | Description: AUTO SOFTWARE SAC58R INTER CORE |
товар відсутній |
||||
| SWAC58R-ICC01P | NXP USA Inc. | Description: AUTO SOFTWARE SAC58R INTER CORE |
товар відсутній |
||||
 |
LD6806TD/18P,125 | NXP USA Inc. |
Description: IC REG LINEAR 1.8V 200MA 5TSOP Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 1.8V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
на замовлення 19362 шт: термін постачання 21-31 дні (днів) |
|
||
| MPC5775B-EVB | NXP USA Inc. |
Description: MPC5775B-EVB DEV BOARD Packaging: Bulk Mounting Type: Socket Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5775B, MPC5775E Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
|
|||
| S32K14WEVB-Q064 | NXP USA Inc. |
Description: S32K144W EVAL BOARD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M4F Utilized IC / Part: S32K144W |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
|
|||
| S12VR64EVB3 | NXP USA Inc. |
Description: S12VR64 EVAL BRD |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
|
|||
 |
MIMXRT1060-EVKB | NXP USA Inc. |
Description: I.MX RT1060 EVAL BRD REVB Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M7 Utilized IC / Part: i.MX RT1060 |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
|
||
 |
S32K3X4EVBQ257ND | NXP USA Inc. |
Description: S32K344 EVAL BOARD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M7 Utilized IC / Part: S32K344 |
товар відсутній |
|||
 |
S32K116EVB2Q048 | NXP USA Inc. |
Description: EVAL BOARD S32K116 Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: S32K116 |
товар відсутній |
|||
 |
S32K118EVB2Q048 | NXP USA Inc. |
Description: EVAL BOARD S32K118 GEN PURPOSE Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: S32K118 |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
|
||
| KIT33772CTPLEVB | NXP USA Inc. |
Description: EVAL BOARD MC33772C DAISY CHAIN Packaging: Bulk Function: Battery Cell Controller Type: Power Management Utilized IC / Part: MC33772C Supplied Contents: Board(s), Cable(s) Primary Attributes: 6-Channel (Hex) Embedded: Yes, MCU Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
|
|||
| FRDM33772CSPEVB | NXP USA Inc. |
Description: EVAL BOARD FOR MC33772C SPI COMM Packaging: Bulk Function: Battery Cell Controller Type: Power Management Utilized IC / Part: MC33772C Supplied Contents: Board(s), Cable(s) Primary Attributes: 6-Channel (Hex) Embedded: Yes, MCU Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
|||
| UJA1161A-EVB | NXP USA Inc. |
Description: UJA1161A EVAL BOARD Packaging: Bulk Function: CAN Transceiver Type: Interface Utilized IC / Part: UJA1161A Supplied Contents: Board(s) Embedded: Yes, MCU |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
|||
| CGY1049112 | NXP USA Inc. |
Description: NARROW BAND HIGH POWER AMPLIFIER |
на замовлення 6870 шт: термін постачання 21-31 дні (днів) |
|
|||
 |
S912XET256J2MAGR | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 119 DigiKey Programmable: Not Verified |
товар відсутній |
|||
 |
LPC1548JBD64151 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 20K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 24x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 44 DigiKey Programmable: Not Verified |
товар відсутній |
|||
| EV-INVERTERHDBT | NXP USA Inc. |
Description: IGBT PWR INVTR CTRL REF PLATFORM Packaging: Box Function: Gate Driver Type: Power Management Utilized IC / Part: GD3160 Supplied Contents: Board(s) Primary Attributes: Motors (DC) Embedded: Yes |
товар відсутній |
||||
 |
XC7SET02GV,125 | NXP USA Inc. |
Description: IC GATE NOR 1CH 2-INP SC74A Packaging: Bulk Package / Case: SC-74A, SOT-753 Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 8mA, 8mA Number of Inputs: 2 Supplier Device Package: 5-TSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 1 µA |
на замовлення 60000 шт: термін постачання 21-31 дні (днів) |
|
||
| SAF7770EL/101S130Y | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tape & Reel (TR) Package / Case: 364-LFBGA Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 364-LFBGA (15x15) Part Status: Active |
товар відсутній |
||||
 |
BUK6207-30C,118 | NXP USA Inc. |
Description: MOSFET N-CH 30V 90A DPAK Packaging: Cut Tape (CT) Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 90A (Tc) Rds On (Max) @ Id, Vgs: 5.2mOhm @ 15A, 10V Power Dissipation (Max): 128W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: DPAK Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 54.8 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 3470 pF @ 25 V |
товар відсутній |
|||
| P1011NSE2HFB | NXP USA Inc. |
Description: QORIQ, POWER ARCH 32-BIT SOC, 80 Packaging: Bulk Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Active |
товар відсутній |
||||
 |
N74F298D,623 | NXP USA Inc. |
Description: IC MULTIPLEXER 4 X 2:1 16SO Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Multiplexer Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 1mA, 20mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
|
||
| PCT2202UKZ | NXP USA Inc. |
Description: SENSOR DIGITAL -40C-125C 6WLCSP Packaging: Cut Tape (CT) Features: One-Shot, Output Switch, Shutdown Mode Package / Case: 6-XFBGA, WLCSP Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 1.65V ~ 1.95V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 6-WLCSP (0.69x1.09) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±1°C (±2°C) Sensing Temperature - Local: -40°C ~ 125°C Part Status: Obsolete |
товар відсутній |
||||
| NCF2961MHN3/0200E | NXP USA Inc. | Description: RFID TRANSPONDER |
товар відсутній |
||||
 |
BLM6G10-30G,118 | NXP USA Inc. |
Description: IC RF AMP CDMA 920-960MHZ 16HSOP Packaging: Bulk Package / Case: 16-SMD Module Mounting Type: Surface Mount Frequency: 920MHz ~ 960MHz RF Type: W-CDMA Voltage - Supply: 28V Gain: 29dB Supplier Device Package: 16-HSOP |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
|
||
| LS1084AXE7MQA | NXP USA Inc. | Description: LS1084A 1200/1600 XT WE |
товар відсутній |
||||
 |
MPC8270VVQLDA | NXP USA Inc. |
Description: IC MPU MPC82XX 333MHZ 480TBGA Packaging: Bulk Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Part Status: Active |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
|
||
 |
MC34PF3000A2EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE- |
товар відсутній |
| MK22FN1M0AVLK12R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
товар відсутній
| MC33HB2002ES |
|
Виробник: NXP USA Inc.
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Packaging: Tray
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: DC Motors
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Packaging: Tray
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: DC Motors
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
товар відсутній
| MC33HB2002ESR2 |
Виробник: NXP USA Inc.
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: DC Motors
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: DC Motors
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
товар відсутній
| S9S12GN48AMLF |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
| NX3L1G3157GMZ |
|
Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| S32G274AABK0CUCT |
|
Виробник: NXP USA Inc.
Description: IC MPU AEC-Q100 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
Description: IC MPU AEC-Q100 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
товар відсутній
| SPC5746CK1MMJ6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
товар відсутній
| 2PA1774QMB315 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 2PA1774QMB - SMALL
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
Description: NOW NEXPERIA 2PA1774QMB - SMALL
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
на замовлення 57940 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 6935+ | 2.63 грн |
| PDTC144VMB315 |
|
Виробник: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Grade: Automotive
Qualification: AEC-Q101
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Grade: Automotive
Qualification: AEC-Q101
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 11225+ | 1.97 грн |
| SPC5747CHK0AVKU6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
товар відсутній
| SP5747CHK0AVKU6R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
товар відсутній
| MML09211HT1 |
|
Виробник: NXP USA Inc.
Description: IC RF AMP GSM 400MHZ-1.4GHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 1.4GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 5V
Gain: 21.3dB
Current - Supply: 60mA
Noise Figure: 0.66dB
P1dB: 20dBm
Test Frequency: 1.4GHz
Supplier Device Package: 8-DFN (2x2)
Part Status: Obsolete
Description: IC RF AMP GSM 400MHZ-1.4GHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 1.4GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 5V
Gain: 21.3dB
Current - Supply: 60mA
Noise Figure: 0.66dB
P1dB: 20dBm
Test Frequency: 1.4GHz
Supplier Device Package: 8-DFN (2x2)
Part Status: Obsolete
на замовлення 24000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 69+ | 528.75 грн |
| NX3V1T66GM,115 |
|
Виробник: NXP USA Inc.
Description: IC SWITCH SPST 6XSON
Description: IC SWITCH SPST 6XSON
на замовлення 33273 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3606+ | 5.79 грн |
| S912ZVC12F0VLFR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2000+ | 323.88 грн |
| NX3L1G53GD,125 |
|
Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
на замовлення 13143 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 888+ | 24.49 грн |
| TDA18225HN/C1 |
Виробник: NXP USA Inc.
Description: INTEGRATED CIRCUIT
Description: INTEGRATED CIRCUIT
на замовлення 938 шт:
термін постачання 21-31 дні (днів)| MC9S12E64MFUE |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
на замовлення 924 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 15+ | 1493.31 грн |
| MC9S12DJ64MFUE |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
товар відсутній
| LPC1112LVFHI33/103 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
на замовлення 3920 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 89+ | 240.12 грн |
| BZX79-B6V2143 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZX79-B6V2 - ZENER
Description: NOW NEXPERIA BZX79-B6V2 - ZENER
на замовлення 105000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 15000+ | 1.32 грн |
| 74AVC20T245DGV,118 |
|
Виробник: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 56TSSOP
Description: IC TRNSLTR BIDIRECTIONAL 56TSSOP
на замовлення 14222 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 332+ | 65.44 грн |
| LD6806TD/18P,125 |
|
Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.8V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.8V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 19362 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2959+ | 6.65 грн |
| MPC5775B-EVB |
Виробник: NXP USA Inc.
Description: MPC5775B-EVB DEV BOARD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Description: MPC5775B-EVB DEV BOARD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 19974.94 грн |
| S32K14WEVB-Q064 |
|
Виробник: NXP USA Inc.
Description: S32K144W EVAL BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K144W
Description: S32K144W EVAL BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K144W
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 11822.6 грн |
| S12VR64EVB3 |
|
Виробник: NXP USA Inc.
Description: S12VR64 EVAL BRD
Description: S12VR64 EVAL BRD
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 39425.46 грн |
| MIMXRT1060-EVKB |
|
Виробник: NXP USA Inc.
Description: I.MX RT1060 EVAL BRD REVB
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: i.MX RT1060
Description: I.MX RT1060 EVAL BRD REVB
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: i.MX RT1060
на замовлення 50 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 8046.45 грн |
| S32K3X4EVBQ257ND |
Виробник: NXP USA Inc.
Description: S32K344 EVAL BOARD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
Description: S32K344 EVAL BOARD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
товар відсутній
| S32K116EVB2Q048 |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD S32K116
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K116
Description: EVAL BOARD S32K116
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K116
товар відсутній
| S32K118EVB2Q048 |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD S32K118 GEN PURPOSE
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K118
Description: EVAL BOARD S32K118 GEN PURPOSE
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K118
на замовлення 15 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7420.46 грн |
| KIT33772CTPLEVB |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD MC33772C DAISY CHAIN
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Part Status: Active
Description: EVAL BOARD MC33772C DAISY CHAIN
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 16576.99 грн |
| FRDM33772CSPEVB |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33772C SPI COMM
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Part Status: Active
Description: EVAL BOARD FOR MC33772C SPI COMM
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 14786.17 грн |
| UJA1161A-EVB |
|
Виробник: NXP USA Inc.
Description: UJA1161A EVAL BOARD
Packaging: Bulk
Function: CAN Transceiver
Type: Interface
Utilized IC / Part: UJA1161A
Supplied Contents: Board(s)
Embedded: Yes, MCU
Description: UJA1161A EVAL BOARD
Packaging: Bulk
Function: CAN Transceiver
Type: Interface
Utilized IC / Part: UJA1161A
Supplied Contents: Board(s)
Embedded: Yes, MCU
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5857.27 грн |
| CGY1049112 |
|
Виробник: NXP USA Inc.
Description: NARROW BAND HIGH POWER AMPLIFIER
Description: NARROW BAND HIGH POWER AMPLIFIER
на замовлення 6870 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 9+ | 2789.81 грн |
| S912XET256J2MAGR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
товар відсутній
| LPC1548JBD64151 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
товар відсутній
| EV-INVERTERHDBT |
|
Виробник: NXP USA Inc.
Description: IGBT PWR INVTR CTRL REF PLATFORM
Packaging: Box
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes
Description: IGBT PWR INVTR CTRL REF PLATFORM
Packaging: Box
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes
товар відсутній
| XC7SET02GV,125 |
|
Виробник: NXP USA Inc.
Description: IC GATE NOR 1CH 2-INP SC74A
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
Description: IC GATE NOR 1CH 2-INP SC74A
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
на замовлення 60000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1926+ | 11.53 грн |
| SAF7770EL/101S130Y |
Виробник: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
товар відсутній
| BUK6207-30C,118 |
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 90A DPAK
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
Rds On (Max) @ Id, Vgs: 5.2mOhm @ 15A, 10V
Power Dissipation (Max): 128W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 54.8 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3470 pF @ 25 V
Description: MOSFET N-CH 30V 90A DPAK
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
Rds On (Max) @ Id, Vgs: 5.2mOhm @ 15A, 10V
Power Dissipation (Max): 128W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 54.8 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3470 pF @ 25 V
товар відсутній
| P1011NSE2HFB |
|
Виробник: NXP USA Inc.
Description: QORIQ, POWER ARCH 32-BIT SOC, 80
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
Description: QORIQ, POWER ARCH 32-BIT SOC, 80
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
товар відсутній
| N74F298D,623 |
|
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: IC MULTIPLEXER 4 X 2:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 254+ | 79.16 грн |
| PCT2202UKZ |
|
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 6WLCSP
Packaging: Cut Tape (CT)
Features: One-Shot, Output Switch, Shutdown Mode
Package / Case: 6-XFBGA, WLCSP
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 1.65V ~ 1.95V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-WLCSP (0.69x1.09)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Obsolete
Description: SENSOR DIGITAL -40C-125C 6WLCSP
Packaging: Cut Tape (CT)
Features: One-Shot, Output Switch, Shutdown Mode
Package / Case: 6-XFBGA, WLCSP
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 1.65V ~ 1.95V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-WLCSP (0.69x1.09)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Obsolete
товар відсутній
| BLM6G10-30G,118 |
|
Виробник: NXP USA Inc.
Description: IC RF AMP CDMA 920-960MHZ 16HSOP
Packaging: Bulk
Package / Case: 16-SMD Module
Mounting Type: Surface Mount
Frequency: 920MHz ~ 960MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 29dB
Supplier Device Package: 16-HSOP
Description: IC RF AMP CDMA 920-960MHZ 16HSOP
Packaging: Bulk
Package / Case: 16-SMD Module
Mounting Type: Surface Mount
Frequency: 920MHz ~ 960MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 29dB
Supplier Device Package: 16-HSOP
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 8+ | 2548.28 грн |
| MPC8270VVQLDA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ 480TBGA
Packaging: Bulk
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Active
Description: IC MPU MPC82XX 333MHZ 480TBGA
Packaging: Bulk
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Active
на замовлення 17 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 12354.94 грн |