Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35348) > Сторінка 453 з 590
Фото | Назва | Виробник | Інформація |
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LD6805K/16H,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 4-UDFN Exposed Pad Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: DFN1010C-4 Voltage - Output (Min/Fixed): 1.6V Control Features: Enable Part Status: Obsolete PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA |
на замовлення 70000 шт: термін постачання 21-31 дні (днів) |
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LS2088AXN7V1B | NXP USA Inc. |
Description: IC MPU QORIQ 2.0GHZ 1292FCPBGA Packaging: Tray Package / Case: 1292-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 2.0GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 1292-FCPBGA (37.5x37.5) Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 8 Core, 64-Bit RAM Controllers: DDR4 SATA: SATA 6Gbps (2) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
NT2L1001G0DUFV | NXP USA Inc. | Description: IC RFID READR/TRAN 13.56MZ WAFER |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
NT2L1001G0DUDV | NXP USA Inc. | Description: IC RFID READR/TRAN 13.56MZ WAFER |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
LS1027AXE7NQA | NXP USA Inc. | Description: LS1027A-1300 XT SEC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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74LVC594APW-Q100118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Serial to Parallel, Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 3.6V Supplier Device Package: 16-TSSOP Grade: Automotive Number of Bits per Element: 8 Qualification: AEC-Q100 |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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MVR5510AMDA4ES | NXP USA Inc. |
Description: IC PMIC VR5510 ASIL-D Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MVR5510AMDA4ESR2 | NXP USA Inc. |
Description: IC PMIC VR5510 ASIL-D Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74AUP1T97GF/S500132 | NXP USA Inc. |
![]() Features: Configurable Gate Logic Functions Packaging: Bulk Package / Case: 6-XFDFN Output Type: Single-Ended Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Supplier Device Package: 6-XSON (1x1) Channel Type: Unidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.8 V ~ 2.7 V Voltage - VCCB: 2.3 V ~ 3.6 V Number of Circuits: 1 |
на замовлення 2216657 шт: термін постачання 21-31 дні (днів) |
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MCIMX6Y2CVK08AB | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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BZX84-C22/LF1VL | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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BZX84-C22/LF1R | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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BUK6209-30C | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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BUK6240-75C,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 22A (Tc) Rds On (Max) @ Id, Vgs: 46mOhm @ 10A, 10V Power Dissipation (Max): 60W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: DPAK Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 75 V Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 1280 pF @ 25 V |
на замовлення 7500 шт: термін постачання 21-31 дні (днів) |
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74LVT573D,112 | NXP USA Inc. |
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на замовлення 8787 шт: термін постачання 21-31 дні (днів) |
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74LVT573BQ,115 | NXP USA Inc. |
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на замовлення 2850 шт: термін постачання 21-31 дні (днів) |
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MPC8306SVMACDCA | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 369-LFBGA Mounting Type: Surface Mount Speed: 200MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 369-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, SPI, TDM |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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PCA8561AHN-ARD | NXP USA Inc. |
![]() Packaging: Bulk Function: LCD Driver Type: Display Contents: Board(s) Utilized IC / Part: PCA8561 Platform: Arduino |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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PMV170UN,215 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 1A (Ta) Rds On (Max) @ Id, Vgs: 165mOhm @ 1A, 4.5V Power Dissipation (Max): 325mW (Ta), 1.14W (Tc) Vgs(th) (Max) @ Id: 1V @ 250µA Supplier Device Package: SOT-23 (TO-236AB) Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 1.65 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 83 pF @ 10 V |
на замовлення 33000 шт: термін постачання 21-31 дні (днів) |
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PTN5110THQMP | NXP USA Inc. |
Description: USB TYPE-C REV 3.0 PD PHY Packaging: Tape & Reel (TR) Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Interface: Bus, I²C Voltage - Supply: 2.7V ~ 5.5V Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet Supplier Device Package: 16-HX2QFN (2.6x2.6) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
PTN5110HQMP | NXP USA Inc. |
Description: USB TYPE-C REV 3.0 PD PHY Packaging: Tape & Reel (TR) Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Interface: Bus, I²C Voltage - Supply: 2.7V ~ 5.5V Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet Supplier Device Package: 16-HX2QFN (2.6x2.6) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
PTN5110DHQMP | NXP USA Inc. |
Description: USB TYPE-C REV 3.0 PD PHY Packaging: Tape & Reel (TR) Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Interface: Bus, I²C Voltage - Supply: 2.7V ~ 5.5V Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet Supplier Device Package: 16-HX2QFN (2.6x2.6) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
BLF7G20LS-140P,112 | NXP USA Inc. |
Description: FET RF 2CH 65V 1.88GHZ ACC-4L Packaging: Tube |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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SWAC57D-A5SCST1L | NXP USA Inc. | Description: AUTO SOFTWARE SAC57D A5 STRUCTUR |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
SW5746R-Z4ICST1L | NXP USA Inc. | Description: AUTO SOFTWARE MPC5746R Z4 INSTRU |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
SW577XK-Z7SCST1L | NXP USA Inc. | Description: AUTO SOFTWARE MPC577XK Z7 STRUCT |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
SWAC57D-M4SCST1L | NXP USA Inc. | Description: AUTO SOFTWARE SAC57D M4 STRUCTUR |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
SW574XG-Z4SCST1L | NXP USA Inc. | Description: AUTO SOFTWARE MPC574XG Z4 STRUCT |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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S912XEG128BCAA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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S912XEA128J2CAAR | NXP USA Inc. | Description: IC MCU 16BIT 128KB FLASH 80QFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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S912XET256BCAA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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S912XEA128BCAA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
MC56F8367MPYE | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 160-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 512KB (256K x 16) RAM Size: 18K x 16 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Supplier Device Package: 160-LQFP (24x24) Part Status: Active Number of I/O: 76 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MC56F8365MFGE,557 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC56F83689VLL | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 20x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, I2C, LINbus, SCI, SPI, USB Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 82 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74HC3GU04DP-Q100125 | NXP USA Inc. |
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на замовлення 12000 шт: термін постачання 21-31 дні (днів) |
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MC9S12DG256CFUER | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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NCJ3310AHN/0J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Interface: GPIO, I2C Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 105°C Standards: ISO 15693, NFC Supplier Device Package: 16-HVQFN (3x3) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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NCJ3310AHN/0J | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Interface: GPIO, I2C Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 105°C Standards: ISO 15693, NFC Supplier Device Package: 16-HVQFN (3x3) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
BF510 | NXP USA Inc. |
Description: JFET N-CH 20V 30MA TO236AB Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: 150°C (TJ) FET Type: N-Channel Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V Voltage - Breakdown (V(BR)GSS): 20 V Current Drain (Id) - Max: 30 mA Supplier Device Package: TO-236AB Part Status: Obsolete Drain to Source Voltage (Vdss): 20 V Power - Max: 250 mW Voltage - Cutoff (VGS off) @ Id: 800 mV @ 10 µA Current - Drain (Idss) @ Vds (Vgs=0): 3 mA @ 10 V |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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S9S12G192F0CLLR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 192KB (192K x 8) RAM Size: 11K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: 12V1 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 86 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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K32WAM-001-T10 | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: K32W041AM Frequency: 2.4GHz Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE) Supplied Contents: Board(s) Part Status: Active Contents: Board(s) Utilized IC / Part: K32W041AM |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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MCF54453CVP200 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-BGA (23x23) Part Status: Active Number of I/O: 132 DigiKey Programmable: Not Verified |
на замовлення 294 шт: термін постачання 21-31 дні (днів) |
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FS32K146UAT0VLLR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 112MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b SAR; D/A1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 89 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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LD6806CX4/13P,315 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 1.3V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.1V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
на замовлення 27000 шт: термін постачання 21-31 дні (днів) |
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AFT26HW050GSR3-NXP | NXP USA Inc. |
![]() Packaging: Bulk |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
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LD6836TD/29P,125 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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LPC54607J256ET180551 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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LPC54606J256BD100551 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 64 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
LPC54607J256ET180 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 145 DigiKey Programmable: Not Verified |
на замовлення 1827 шт: термін постачання 21-31 дні (днів) |
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LPC54606J512BD208K | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 171 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
M83261G13,557 | NXP USA Inc. | Description: C1K 650MHZ VOIP IC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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74ABT2244DB,112 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74ABT2244DB,118 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
74HC221DB112 | NXP USA Inc. |
Description: IC MULTIVIBRATOR 19NS 16SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: Monostable Operating Temperature: -40°C ~ 125°C Propagation Delay: 23 ns Independent Circuits: 2 Schmitt Trigger Input: No Supplier Device Package: 16-SSOP Part Status: Obsolete Voltage - Supply: 4.5 V ~ 5.5 V |
на замовлення 1992 шт: термін постачання 21-31 дні (днів) |
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JN5179-001-M10 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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EK-MPC5744P | NXP USA Inc. |
![]() Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5744P |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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CBTL04083ABS,558 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
на замовлення 286403 шт: термін постачання 21-31 дні (днів) |
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CBTL04083BBS | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
на замовлення 8000 шт: термін постачання 21-31 дні (днів) |
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CBTL04083ABS | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
LD6805K/16H,115 |
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Виробник: NXP USA Inc.
Description: IC REG LIN 1.6V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 1.6V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Description: IC REG LIN 1.6V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 1.6V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
на замовлення 70000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2959+ | 7.89 грн |
LS2088AXN7V1B |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 2.0GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.0GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 2.0GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.0GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
NT2L1001G0DUFV |
Виробник: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
Description: IC RFID READR/TRAN 13.56MZ WAFER
товару немає в наявності
В кошику
од. на суму грн.
NT2L1001G0DUDV |
Виробник: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
Description: IC RFID READR/TRAN 13.56MZ WAFER
товару немає в наявності
В кошику
од. на суму грн.
LS1027AXE7NQA |
Виробник: NXP USA Inc.
Description: LS1027A-1300 XT SEC
Description: LS1027A-1300 XT SEC
товару немає в наявності
В кошику
од. на суму грн.
74LVC594APW-Q100118 |
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Виробник: NXP USA Inc.
Description: SERIAL IN PARALLEL OUT
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Supplier Device Package: 16-TSSOP
Grade: Automotive
Number of Bits per Element: 8
Qualification: AEC-Q100
Description: SERIAL IN PARALLEL OUT
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Supplier Device Package: 16-TSSOP
Grade: Automotive
Number of Bits per Element: 8
Qualification: AEC-Q100
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1132+ | 20.35 грн |
MVR5510AMDA4ES |
Виробник: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-D
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: IC PMIC VR5510 ASIL-D
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
MVR5510AMDA4ESR2 |
Виробник: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-D
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: IC PMIC VR5510 ASIL-D
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
74AUP1T97GF/S500132 |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Features: Configurable Gate Logic Functions
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 6-XSON (1x1)
Channel Type: Unidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.8 V ~ 2.7 V
Voltage - VCCB: 2.3 V ~ 3.6 V
Number of Circuits: 1
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Features: Configurable Gate Logic Functions
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 6-XSON (1x1)
Channel Type: Unidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.8 V ~ 2.7 V
Voltage - VCCB: 2.3 V ~ 3.6 V
Number of Circuits: 1
на замовлення 2216657 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2036+ | 12.36 грн |
MCIMX6Y2CVK08AB |
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Виробник: NXP USA Inc.
Description: I.MX6ULL ROM PERF ENHAN
Description: I.MX6ULL ROM PERF ENHAN
товару немає в наявності
В кошику
од. на суму грн.
BZX84-C22/LF1VL |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 22V 250MW TO236AB
Description: DIODE ZENER 22V 250MW TO236AB
товару немає в наявності
В кошику
од. на суму грн.
BZX84-C22/LF1R |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 22V 250MW TO236AB
Description: DIODE ZENER 22V 250MW TO236AB
товару немає в наявності
В кошику
од. на суму грн.
BUK6209-30C |
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Виробник: NXP USA Inc.
Description: PFET, 50A I(D), 30V, 0.0192OHM,
Description: PFET, 50A I(D), 30V, 0.0192OHM,
товару немає в наявності
В кошику
од. на суму грн.
BUK6240-75C,118 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 75V 22A DPAK
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22A (Tc)
Rds On (Max) @ Id, Vgs: 46mOhm @ 10A, 10V
Power Dissipation (Max): 60W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1280 pF @ 25 V
Description: MOSFET N-CH 75V 22A DPAK
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22A (Tc)
Rds On (Max) @ Id, Vgs: 46mOhm @ 10A, 10V
Power Dissipation (Max): 60W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1280 pF @ 25 V
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
683+ | 33.70 грн |
74LVT573D,112 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74LVT573D - BUS DRI
Description: NOW NEXPERIA 74LVT573D - BUS DRI
на замовлення 8787 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1419+ | 16.14 грн |
74LVT573BQ,115 |
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Виробник: NXP USA Inc.
Description: IC OCTAL D TRANSP LATCH 20DHVQFN
Description: IC OCTAL D TRANSP LATCH 20DHVQFN
на замовлення 2850 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1597+ | 14.60 грн |
MPC8306SVMACDCA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 200MHZ 369BGA
Packaging: Bulk
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
Description: IC MPU MPC83XX 200MHZ 369BGA
Packaging: Bulk
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
на замовлення 34 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
14+ | 1756.49 грн |
PCA8561AHN-ARD |
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Виробник: NXP USA Inc.
Description: 18X4 LCD DRIVER ARDUINO SHIELD
Packaging: Bulk
Function: LCD Driver
Type: Display
Contents: Board(s)
Utilized IC / Part: PCA8561
Platform: Arduino
Description: 18X4 LCD DRIVER ARDUINO SHIELD
Packaging: Bulk
Function: LCD Driver
Type: Display
Contents: Board(s)
Utilized IC / Part: PCA8561
Platform: Arduino
на замовлення 6 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 11918.49 грн |
PMV170UN,215 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 20V 1A TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1A (Ta)
Rds On (Max) @ Id, Vgs: 165mOhm @ 1A, 4.5V
Power Dissipation (Max): 325mW (Ta), 1.14W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 1.65 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 83 pF @ 10 V
Description: MOSFET N-CH 20V 1A TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1A (Ta)
Rds On (Max) @ Id, Vgs: 165mOhm @ 1A, 4.5V
Power Dissipation (Max): 325mW (Ta), 1.14W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 1.65 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 83 pF @ 10 V
на замовлення 33000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2219+ | 10.65 грн |
PTN5110THQMP |
Виробник: NXP USA Inc.
Description: USB TYPE-C REV 3.0 PD PHY
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Bus, I²C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Description: USB TYPE-C REV 3.0 PD PHY
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Bus, I²C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
товару немає в наявності
В кошику
од. на суму грн.
PTN5110HQMP |
Виробник: NXP USA Inc.
Description: USB TYPE-C REV 3.0 PD PHY
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Bus, I²C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Description: USB TYPE-C REV 3.0 PD PHY
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Bus, I²C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
товару немає в наявності
В кошику
од. на суму грн.
PTN5110DHQMP |
Виробник: NXP USA Inc.
Description: USB TYPE-C REV 3.0 PD PHY
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Bus, I²C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Description: USB TYPE-C REV 3.0 PD PHY
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Bus, I²C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
товару немає в наявності
В кошику
од. на суму грн.
BLF7G20LS-140P,112 |
на замовлення 30 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
4+ | 6597.56 грн |
SWAC57D-A5SCST1L |
Виробник: NXP USA Inc.
Description: AUTO SOFTWARE SAC57D A5 STRUCTUR
Description: AUTO SOFTWARE SAC57D A5 STRUCTUR
товару немає в наявності
В кошику
од. на суму грн.
SW5746R-Z4ICST1L |
Виробник: NXP USA Inc.
Description: AUTO SOFTWARE MPC5746R Z4 INSTRU
Description: AUTO SOFTWARE MPC5746R Z4 INSTRU
товару немає в наявності
В кошику
од. на суму грн.
SW577XK-Z7SCST1L |
Виробник: NXP USA Inc.
Description: AUTO SOFTWARE MPC577XK Z7 STRUCT
Description: AUTO SOFTWARE MPC577XK Z7 STRUCT
товару немає в наявності
В кошику
од. на суму грн.
SWAC57D-M4SCST1L |
Виробник: NXP USA Inc.
Description: AUTO SOFTWARE SAC57D M4 STRUCTUR
Description: AUTO SOFTWARE SAC57D M4 STRUCTUR
товару немає в наявності
В кошику
од. на суму грн.
SW574XG-Z4SCST1L |
Виробник: NXP USA Inc.
Description: AUTO SOFTWARE MPC574XG Z4 STRUCT
Description: AUTO SOFTWARE MPC574XG Z4 STRUCT
товару немає в наявності
В кошику
од. на суму грн.
S912XEG128BCAA |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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S912XEA128J2CAAR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Description: IC MCU 16BIT 128KB FLASH 80QFP
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S912XET256BCAA |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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S912XEA128BCAA |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC56F8367MPYE |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 160LQFP
Packaging: Bulk
Package / Case: 160-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (256K x 16)
RAM Size: 18K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 160-LQFP (24x24)
Part Status: Active
Number of I/O: 76
Description: IC MCU 16BIT 512KB FLASH 160LQFP
Packaging: Bulk
Package / Case: 160-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (256K x 16)
RAM Size: 18K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 160-LQFP (24x24)
Part Status: Active
Number of I/O: 76
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MC56F8365MFGE,557 |
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Виробник: NXP USA Inc.
Description: DIGITAL SIGNAL PROCESSOR, 16 BIT
Description: DIGITAL SIGNAL PROCESSOR, 16 BIT
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MC56F83689VLL |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI, USB
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 82
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI, USB
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 82
DigiKey Programmable: Not Verified
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74HC3GU04DP-Q100125 |
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Виробник: NXP USA Inc.
Description: IC INVERTER 3CH 3-INP 8TSSOP
Description: IC INVERTER 3CH 3-INP 8TSSOP
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1682+ | 15.46 грн |
MC9S12DG256CFUER |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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NCJ3310AHN/0J |
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Виробник: NXP USA Inc.
Description: IC NFC TAG I2C HVQFN17
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: GPIO, I2C
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C
Standards: ISO 15693, NFC
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
Description: IC NFC TAG I2C HVQFN17
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: GPIO, I2C
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C
Standards: ISO 15693, NFC
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
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NCJ3310AHN/0J |
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Виробник: NXP USA Inc.
Description: IC NFC TAG I2C HVQFN17
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: GPIO, I2C
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C
Standards: ISO 15693, NFC
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
Description: IC NFC TAG I2C HVQFN17
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: GPIO, I2C
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C
Standards: ISO 15693, NFC
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
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BF510 |
Виробник: NXP USA Inc.
Description: JFET N-CH 20V 30MA TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V
Voltage - Breakdown (V(BR)GSS): 20 V
Current Drain (Id) - Max: 30 mA
Supplier Device Package: TO-236AB
Part Status: Obsolete
Drain to Source Voltage (Vdss): 20 V
Power - Max: 250 mW
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 10 µA
Current - Drain (Idss) @ Vds (Vgs=0): 3 mA @ 10 V
Description: JFET N-CH 20V 30MA TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V
Voltage - Breakdown (V(BR)GSS): 20 V
Current Drain (Id) - Max: 30 mA
Supplier Device Package: TO-236AB
Part Status: Obsolete
Drain to Source Voltage (Vdss): 20 V
Power - Max: 250 mW
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 10 µA
Current - Drain (Idss) @ Vds (Vgs=0): 3 mA @ 10 V
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S9S12G192F0CLLR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 86
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 192KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 86
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 688.78 грн |
10+ | 514.91 грн |
25+ | 477.93 грн |
100+ | 410.37 грн |
250+ | 392.18 грн |
500+ | 381.22 грн |
K32WAM-001-T10 |
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Виробник: NXP USA Inc.
Description: K32W041AM UPGRADE BOARD
Packaging: Bulk
For Use With/Related Products: K32W041AM
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: K32W041AM
Description: K32W041AM UPGRADE BOARD
Packaging: Bulk
For Use With/Related Products: K32W041AM
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: K32W041AM
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2811.14 грн |
MCF54453CVP200 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
на замовлення 294 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2334.92 грн |
10+ | 1832.32 грн |
25+ | 1728.40 грн |
100+ | 1554.90 грн |
FS32K146UAT0VLLR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
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LD6806CX4/13P,315 |
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Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.3V 200MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.3V 200MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 27000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3328+ | 6.84 грн |
AFT26HW050GSR3-NXP |
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на замовлення 250 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 9021.95 грн |
LD6836TD/29P,125 |
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Виробник: NXP USA Inc.
Description: IC REG LINEAR 2.9V 300MA 5TSOP
Description: IC REG LINEAR 2.9V 300MA 5TSOP
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LPC54607J256ET180551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
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LPC54606J256BD100551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC54607J256ET180 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
на замовлення 1827 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
32+ | 1291.87 грн |
LPC54606J512BD208K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 171
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 171
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
M83261G13,557 |
Виробник: NXP USA Inc.
Description: C1K 650MHZ VOIP IC
Description: C1K 650MHZ VOIP IC
товару немає в наявності
В кошику
од. на суму грн.
74ABT2244DB,112 |
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Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20SSOP
Description: IC BUF NON-INVERT 5.5V 20SSOP
товару немає в наявності
В кошику
од. на суму грн.
74ABT2244DB,118 |
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Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20SSOP
Description: IC BUF NON-INVERT 5.5V 20SSOP
товару немає в наявності
В кошику
од. на суму грн.
74HC221DB112 |
Виробник: NXP USA Inc.
Description: IC MULTIVIBRATOR 19NS 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 23 ns
Independent Circuits: 2
Schmitt Trigger Input: No
Supplier Device Package: 16-SSOP
Part Status: Obsolete
Voltage - Supply: 4.5 V ~ 5.5 V
Description: IC MULTIVIBRATOR 19NS 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 23 ns
Independent Circuits: 2
Schmitt Trigger Input: No
Supplier Device Package: 16-SSOP
Part Status: Obsolete
Voltage - Supply: 4.5 V ~ 5.5 V
на замовлення 1992 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
424+ | 97.22 грн |
JN5179-001-M10 |
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Виробник: NXP USA Inc.
Description: ZIGBEE 3.0, ZIGBEE PRO, THREAD A
Description: ZIGBEE 3.0, ZIGBEE PRO, THREAD A
товару немає в наявності
В кошику
од. на суму грн.
EK-MPC5744P |
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Виробник: NXP USA Inc.
Description: ADVANCED AUTOMOTIVE ANALOG
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5744P
Description: ADVANCED AUTOMOTIVE ANALOG
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5744P
товару немає в наявності
В кошику
од. на суму грн.
CBTL04083ABS,558 |
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Виробник: NXP USA Inc.
Description: DIFFERENTIAL MULTIPLEXER, 4 FUNC
Packaging: Bulk
Part Status: Active
Description: DIFFERENTIAL MULTIPLEXER, 4 FUNC
Packaging: Bulk
Part Status: Active
на замовлення 286403 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
259+ | 95.57 грн |
CBTL04083BBS |
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на замовлення 8000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
259+ | 95.57 грн |
CBTL04083ABS |
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Виробник: NXP USA Inc.
Description: DIFFERENTIAL MULTIPLEXER, 4 FUNC
Packaging: Bulk
Part Status: Active
Description: DIFFERENTIAL MULTIPLEXER, 4 FUNC
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.