Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36393) > Сторінка 450 з 607
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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PZM5.6NB2,115 | NXP USA Inc. |
Description: DIODE ZENER 5.6V 300MW SMT3 Tolerance: ±2% Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 5.6 V Impedance (Max) (Zzt): 40 Ohms Supplier Device Package: SMT3; MPAK Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 2 µA @ 2.5 V |
на замовлення 501990 шт: термін постачання 21-31 дні (днів) |
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MCIMX6G2CVM05ABR | NXP USA Inc. |
Description: IC MPU I.MX6G 528MHZ 289MAPBGAPart Status: Active Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Display & Interface Controllers: LCD, LVDS Graphics Acceleration: No RAM Controllers: DDR3, DDR3L, LPDDR2 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100Mbps (2) Supplier Device Package: 289-MAPBGA (14x14) Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A7 Operating Temperature: -40°C ~ 105°C (TJ) Speed: 528MHz Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tape & Reel (TR) Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||
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BUK6E2R0-30C127 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFETQualification: AEC-Q101 Grade: Automotive Input Capacitance (Ciss) (Max) @ Vds: 14964 pF @ 25 V Gate Charge (Qg) (Max) @ Vgs: 229 nC @ 10 V Drain to Source Voltage (Vdss): 30 V Vgs (Max): ±16V Drive Voltage (Max Rds On, Min Rds On): 10V Supplier Device Package: I2PAK Vgs(th) (Max) @ Id: 2.8V @ 1mA Power Dissipation (Max): 306W (Tc) Rds On (Max) @ Id, Vgs: 2.2mOhm @ 25A, 10V Current - Continuous Drain (Id) @ 25°C: 120A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Packaging: Bulk |
на замовлення 4728 шт: термін постачання 21-31 дні (днів) |
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BZX84-C24/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 24V 250MW SOT23Qualification: AEC-Q101 Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Power - Max: 250 mW Part Status: Active Supplier Device Package: SOT-23 (TO-236AB) Impedance (Max) (Zzt): 70 Ohms Voltage - Zener (Nom) (Vz): 24 V Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Tolerance: ±5% Packaging: Tape & Reel (TR) Grade: Automotive |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC35FS6500NAER2 | NXP USA Inc. |
Description: FS6500Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||
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MC9S08JS16LCFK557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| LS1027ASN7KQA | NXP USA Inc. | Description: LS1027A-1000 ST NO SEC |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | |||||||||||
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LS1027ASE7NQA | NXP USA Inc. |
Description: IC MPU QORIQ 1.3GHZ 448FBGAAdditional Interfaces: CANbus, I2C, SPI, UART Part Status: Active SATA: SATA 6Gbps (1) RAM Controllers: DDR3L SDRAM, DDR4 SDRAM Number of Cores/Bus Width: 2 Core, 64-Bit Ethernet: 1Gbps (1), 2.5Gbps (5) Supplier Device Package: 448-FBGA (17x17) Core Processor: ARM® Cortex®-A72 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.3GHz Mounting Type: Surface Mount Package / Case: 448-BFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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LS1017AXN7HNA | NXP USA Inc. |
Description: IC MPU QORIQ 800MHZ 448FBGAPackaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Additional Interfaces: CANbus, I2C, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||||||||||
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LS1017AXN7NQA | NXP USA Inc. |
Description: IC MPU QORIQ 1.3GHZ 448FBGAPackaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Additional Interfaces: CANbus, I2C, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||||||||||
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74AVC16T245DGG,112 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 48TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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74LVTH244ADB,118 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 20SSOP |
на замовлення 2921 шт: термін постачання 21-31 дні (днів) |
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74LVTH244AD,118 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 20SO |
на замовлення 17890 шт: термін постачання 21-31 дні (днів) |
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| NXH3670ADK | NXP USA Inc. |
Description: NXH3670ADKPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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S9S08SL16F1MTJ | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC15XS3400DHFK557 | NXP USA Inc. |
Description: BUFFER/INVERTER BASED PERIPHERAL |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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NX3L4053HR,115 | NXP USA Inc. |
Description: IC SWITCH SPDTX3 800MOHM 16HXQFNCharge Injection: 15pC Voltage - Supply, Single (V+): 1.4V ~ 4.3V Supplier Device Package: 16-HXQFN (3x3) -3db Bandwidth: 60MHz On-State Resistance (Max): 800mOhm Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-XFQFN Exposed Pad Packaging: Bulk Number of Circuits: 3 Part Status: Discontinued at Digi-Key Current - Leakage (IS(off)) (Max): 10nA Channel Capacitance (CS(off), CD(off)): 35pF Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel-to-Channel Matching (ΔRon): 120mOhm Multiplexer/Demultiplexer Circuit: 2:1 Switch Circuit: SPDT Crosstalk: -90dB @ 100kHz |
на замовлення 28091 шт: термін постачання 21-31 дні (днів) |
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| BUK9614-60E118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK9614-60E - POWER |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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S912XEQ512BMALR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFPPackaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||||||
| ASL5115EVBMST | NXP USA Inc. |
Description: ASL5115EVBMST Features: Dimmable Packaging: Bulk Voltage - Input: 4.5V ~ 5.5V Current - Output / Channel: 1.5A Utilized IC / Part: ASL5115 Supplied Contents: Board(s) Outputs and Type: 12, Non-Isolated Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| MK21FX512AVMD12 | NXP USA Inc. |
Description: KINETIS K21: 120MHZ CORTEX-M4F M |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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S9S12G240F0VLH | NXP USA Inc. |
Description: IC MCU 16BIT 240KB FLASH 64LQFP EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 11K x 8 Program Memory Size: 240KB (240K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 54 Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x10b Core Processor: 12V1 |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. | ||||||||||
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MKL33Z32VLK4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 80FQFPNumber of I/O: 70 Part Status: Active Supplier Device Package: 80-FQFP (12x12) Peripherals: DMA, LCD, PWM, WDT Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART DigiKey Programmable: Not Verified Speed: 48MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Tray Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 20x16b; D/A 1x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) |
товару немає в наявності |
Мінімальне замовлення: 480 шт В кошику од. на суму грн. | ||||||||||
| SEN-GEN6-SKT | NXP USA Inc. | Description: SOCKET EVALUATION BOARD FOR FXLS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| MM912J637AM2EPR2564 | NXP USA Inc. |
Description: MM912 - MAGNIV S12 RELAY DRIVER, |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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SPC5673KAVMM1 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGAPart Status: Active Supplier Device Package: 257-LFBGA (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 22x12b Core Processor: e200z7d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 1MB (1M x 8) Speed: 150MHz Mounting Type: Surface Mount DigiKey Programmable: Not Verified Package / Case: 257-LFBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 152 шт В кошику од. на суму грн. | ||||||||||
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SPC5673KAVMM1R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGACore Size: 32-Bit Dual-Core Data Converters: A/D 22x12b Core Processor: e200z7d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 1MB (1M x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 257-LFBGA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Part Status: Active Supplier Device Package: 257-LFBGA (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||
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74LVT241PW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVT SERIES, 4-BIT |
на замовлення 12500 шт: термін постачання 21-31 дні (днів) |
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74LVT240PW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVT SERIES, 4-BIT |
на замовлення 4800 шт: термін постачання 21-31 дні (днів) |
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FS32K142WAT0WLHT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 58 Supplier Device Package: 64-LQFP (10x10) Peripherals: POR, PWM, WDT Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 29x12b SAR; D/A 1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
на замовлення 719 шт: термін постачання 21-31 дні (днів) |
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LD6806TD/14H,125 | NXP USA Inc. |
Description: IC REG LINEAR 1.4V 200MA 5TSOPCurrent - Supply (Max): 250 µA Protection Features: Over Current, Over Temperature Voltage Dropout (Max): 0.13V @ 200mA PSRR: 55dB (1kHz) Part Status: Obsolete Control Features: Enable Voltage - Output (Min/Fixed): 1.4V Supplier Device Package: 5-TSOP Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 100 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 200mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: SC-74A, SOT-753 Packaging: Bulk |
на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
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| MRF8VP13350NR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V OM780G-4Current - Test: 100 mA Voltage - Test: 50 V Voltage - Rated: 100 V Part Status: Active Supplier Device Package: OM-780G-4L Technology: LDMOS Gain: 19.2dB Power - Output: 350W Frequency: 700MHz ~ 1.3GHz Mounting Type: Surface Mount Current Rating (Amps): 10µA Package / Case: OM-780G-4L Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||
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PBSS4260PAN | NXP USA Inc. |
Description: NOW NEXPERIA PBSS4260PAN - SMALL |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| PBSS4260PANPS115 | NXP USA Inc. |
Description: NOW NEXPERIA PBSS4260PANPS SMALL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| MF3D2200DU15/02V | NXP USA Inc. | Description: MIFARE SMART CARD DESFIRE EV2 XL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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74HCT4520DB,112 | NXP USA Inc. |
Description: BINARY COUNTER |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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74AHCT74PW112 | NXP USA Inc. |
Description: NOW NEXPERIA 74AHCT74PW - D FLIPPackaging: Bulk Part Status: Active |
на замовлення 5885 шт: термін постачання 21-31 дні (днів) |
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| A2I09VD050GNR1 | NXP USA Inc. |
Description: IC AMP GPS 575-960MHZ TO270WBGPackaging: Tape & Reel (TR) Package / Case: TO-270-15 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 575MHz ~ 960MHz RF Type: General Purpose Voltage - Supply: 48V ~ 55V Gain: 38dB Current - Supply: 240mA Test Frequency: 920MHz Supplier Device Package: TO-270WBG-15 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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MIMX8MN3CVPIZAA | NXP USA Inc. |
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGAPackaging: Tray Package / Case: 306-TFBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 306-TFBGA (11x11) Ethernet: GbE USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: I2C, PCIe, SDHC, SPI, UART |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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LPC2470FET208,551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 208TFBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| K32L2B21VFM0A | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 32QFNDigiKey Programmable: Not Verified Supplier Device Package: 32-QFN (5x5) Peripherals: DMA, LCD, PWM, WDT Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.2V Core Size: 32-Bit Single-Core Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal RAM Size: 32K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 32-UFQFN Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 490 шт В кошику од. на суму грн. | |||||||||||
| K32L2B11VFM0A | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32QFNDigiKey Programmable: Not Verified Supplier Device Package: 32-QFN (5x5) Peripherals: DMA, LCD, PWM, WDT Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.2V Core Size: 32-Bit Single-Core Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal RAM Size: 32K x 8 Program Memory Size: 64KB (64K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 32-UFQFN Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 490 шт В кошику од. на суму грн. | |||||||||||
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PCA9547PW118 | NXP USA Inc. |
Description: IC MUX 8CH I2C BUS 24TSSOPPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| PCA9955BTW-ARD | NXP USA Inc. |
Description: PCA9955 EVK LED ARDPart Status: Active Platform: Arduino Utilized IC / Part: PCA9955B Contents: Board(s) Type: Opto Function: LED Driver Packaging: Bulk |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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PESD3V3L5U115 | NXP USA Inc. |
Description: TVS DIODEPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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S912ZVML32F3VKH | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Number of I/O: 31 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||
| LPC1820FBD144K | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz RAM Size: 168K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b SAR; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 83 DigiKey Programmable: Not Verified |
на замовлення 300 шт: термін постачання 21-31 дні (днів) |
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MFRC53001T/0FE | NXP USA Inc. |
Description: IC MIFARE HS READER 32SO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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K32W041AMZ | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNPackaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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K32W041AMZ | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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FRDM665CANFDEVB | NXP USA Inc. |
Description: MC33665A CAN FD EVBSupplied Contents: Board(s), Cable(s) Utilized IC / Part: MC33665A Type: Interface Function: CANbus Packaging: Box Part Status: Active Embedded: Yes, MCU |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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RD33775ACNCEVB | NXP USA Inc. |
Description: CAN FD CENTRALIZED EVBContents: Board(s) Supplied Contents: Board(s) Type: Interface Function: CANbus Packaging: Box |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| SAF7755HV/N205ZK | NXP USA Inc. | Description: DSP AUDIO MULTI-TUNER |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| SAF7755HV/N205ZY | NXP USA Inc. | Description: DSP AUDIO MULTI-TUNER |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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74ALVCH162827DGG518 | NXP USA Inc. |
Description: BUS DRIVER, ALVC/VCX/A SERIESPackaging: Bulk |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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74ALVCH162827DGG118 | NXP USA Inc. |
Description: IC BUFF NON-INVERT 3.6V 56-TSSOPSupplier Device Package: 56-TSSOP Current - Output High, Low: 12mA, 12mA Number of Bits per Element: 10 Voltage - Supply: 2.3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 2 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 56-TFSOP (0.240", 6.10mm Width) Part Status: Active Packaging: Bulk |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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74ALVT162827DGG | NXP USA Inc. |
Description: NOW NEXPERIA 74ALVT162827DGG - B |
на замовлення 161 шт: термін постачання 21-31 дні (днів) |
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| MCHC912B32VFUE8-NXP | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 80QFPNumber of I/O: 63 Part Status: Active Supplier Device Package: 80-QFP (14x14) Peripherals: POR, PWM, WDT Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: CPU12 Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1K x 8 Program Memory Size: 32KB (32K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 80-QFP Packaging: Bulk DigiKey Programmable: Not Verified EEPROM Size: 768 x 8 Program Memory Type: FLASH |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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MC908AP48CFBER528 | NXP USA Inc. | Description: MICROCONTROLLER, 8-BIT, HC08/S08 |
на замовлення 2250 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||
| MPC8544EVTANGA | NXP USA Inc. |
Description: POWERQUICC RISC MICROPROCESSORS, |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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| PZM5.6NB2,115 |
Виробник: NXP USA Inc.
Description: DIODE ZENER 5.6V 300MW SMT3
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SMT3; MPAK
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2.5 V
Description: DIODE ZENER 5.6V 300MW SMT3
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SMT3; MPAK
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2.5 V
на замовлення 501990 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 8876+ | 2.26 грн |
| MCIMX6G2CVM05ABR |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6G 528MHZ 289MAPBGA
Part Status: Active
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: LCD, LVDS
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6G 528MHZ 289MAPBGA
Part Status: Active
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: LCD, LVDS
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| BUK6E2R0-30C127 |
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Виробник: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 14964 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 229 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 306W (Tc)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Bulk
Description: N-CHANNEL POWER MOSFET
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 14964 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 229 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 306W (Tc)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Bulk
на замовлення 4728 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 329+ | 65.64 грн |
| BZX84-C24/LF1VL |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 24V 250MW SOT23
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 70 Ohms
Voltage - Zener (Nom) (Vz): 24 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Grade: Automotive
Description: DIODE ZENER 24V 250MW SOT23
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 70 Ohms
Voltage - Zener (Nom) (Vz): 24 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Grade: Automotive
товару немає в наявності
В кошику
од. на суму грн.
| MC35FS6500NAER2 |
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Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MC9S08JS16LCFK557 |
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Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
товару немає в наявності
В кошику
од. на суму грн.
| LS1027ASN7KQA |
Виробник: NXP USA Inc.
Description: LS1027A-1000 ST NO SEC
Description: LS1027A-1000 ST NO SEC
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| LS1027ASE7NQA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| LS1017AXN7HNA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| LS1017AXN7NQA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| 74AVC16T245DGG,112 |
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Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 48TSSOP
Description: IC TRANSLATOR BIDIR 48TSSOP
товару немає в наявності
В кошику
од. на суму грн.
| 74LVTH244ADB,118 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20SSOP
Description: IC BUFFER NON-INVERT 3.6V 20SSOP
на замовлення 2921 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1104+ | 20.94 грн |
| 74LVTH244AD,118 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20SO
Description: IC BUFFER NON-INVERT 3.6V 20SO
на замовлення 17890 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1303+ | 17.84 грн |
| S9S08SL16F1MTJ |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
товару немає в наявності
В кошику
од. на суму грн.
| MC15XS3400DHFK557 |
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Виробник: NXP USA Inc.
Description: BUFFER/INVERTER BASED PERIPHERAL
Description: BUFFER/INVERTER BASED PERIPHERAL
товару немає в наявності
В кошику
од. на суму грн.
| NX3L4053HR,115 |
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Виробник: NXP USA Inc.
Description: IC SWITCH SPDTX3 800MOHM 16HXQFN
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 16-HXQFN (3x3)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 800mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-XFQFN Exposed Pad
Packaging: Bulk
Number of Circuits: 3
Part Status: Discontinued at Digi-Key
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 120mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Crosstalk: -90dB @ 100kHz
Description: IC SWITCH SPDTX3 800MOHM 16HXQFN
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 16-HXQFN (3x3)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 800mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-XFQFN Exposed Pad
Packaging: Bulk
Number of Circuits: 3
Part Status: Discontinued at Digi-Key
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 120mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Crosstalk: -90dB @ 100kHz
на замовлення 28091 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 499+ | 45.26 грн |
| BUK9614-60E118 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BUK9614-60E - POWER
Description: NOW NEXPERIA BUK9614-60E - POWER
товару немає в наявності
В кошику
од. на суму грн.
| S912XEQ512BMALR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| ASL5115EVBMST |
Виробник: NXP USA Inc.
Description: ASL5115EVBMST
Features: Dimmable
Packaging: Bulk
Voltage - Input: 4.5V ~ 5.5V
Current - Output / Channel: 1.5A
Utilized IC / Part: ASL5115
Supplied Contents: Board(s)
Outputs and Type: 12, Non-Isolated
Part Status: Active
Description: ASL5115EVBMST
Features: Dimmable
Packaging: Bulk
Voltage - Input: 4.5V ~ 5.5V
Current - Output / Channel: 1.5A
Utilized IC / Part: ASL5115
Supplied Contents: Board(s)
Outputs and Type: 12, Non-Isolated
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MK21FX512AVMD12 |
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Виробник: NXP USA Inc.
Description: KINETIS K21: 120MHZ CORTEX-M4F M
Description: KINETIS K21: 120MHZ CORTEX-M4F M
товару немає в наявності
В кошику
од. на суму грн.
| S9S12G240F0VLH |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 240KB FLASH 64LQFP
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 11K x 8
Program Memory Size: 240KB (240K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: 12V1
Description: IC MCU 16BIT 240KB FLASH 64LQFP
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 11K x 8
Program Memory Size: 240KB (240K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: 12V1
товару немає в наявності
Мінімальне замовлення: 800 шт
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| MKL33Z32VLK4 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 80FQFP
Number of I/O: 70
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
DigiKey Programmable: Not Verified
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Description: IC MCU 32BIT 32KB FLASH 80FQFP
Number of I/O: 70
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
DigiKey Programmable: Not Verified
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
товару немає в наявності
Мінімальне замовлення: 480 шт
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| SEN-GEN6-SKT |
Виробник: NXP USA Inc.
Description: SOCKET EVALUATION BOARD FOR FXLS
Description: SOCKET EVALUATION BOARD FOR FXLS
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| MM912J637AM2EPR2564 |
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Виробник: NXP USA Inc.
Description: MM912 - MAGNIV S12 RELAY DRIVER,
Description: MM912 - MAGNIV S12 RELAY DRIVER,
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| SPC5673KAVMM1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Package / Case: 257-LFBGA
Packaging: Tray
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Package / Case: 257-LFBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 152 шт
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| SPC5673KAVMM1R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
товару немає в наявності
Мінімальне замовлення: 1000 шт
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| 74LVT241PW/AU118 |
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Виробник: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Description: BUS DRIVER, LVT SERIES, 4-BIT
на замовлення 12500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1312+ | 17.84 грн |
| 74LVT240PW/AU118 |
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Виробник: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Description: BUS DRIVER, LVT SERIES, 4-BIT
на замовлення 4800 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1312+ | 17.84 грн |
| FS32K142WAT0WLHT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
на замовлення 719 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 563.31 грн |
| 10+ | 461.31 грн |
| LD6806TD/14H,125 |
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Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.4V 200MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.4V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
Description: IC REG LINEAR 1.4V 200MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.4V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3206+ | 7.12 грн |
| MRF8VP13350NR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V OM780G-4
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 100 V
Part Status: Active
Supplier Device Package: OM-780G-4L
Technology: LDMOS
Gain: 19.2dB
Power - Output: 350W
Frequency: 700MHz ~ 1.3GHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: OM-780G-4L
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 50V OM780G-4
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 100 V
Part Status: Active
Supplier Device Package: OM-780G-4L
Technology: LDMOS
Gain: 19.2dB
Power - Output: 350W
Frequency: 700MHz ~ 1.3GHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: OM-780G-4L
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 50 шт
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| PBSS4260PAN |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PBSS4260PAN - SMALL
Description: NOW NEXPERIA PBSS4260PAN - SMALL
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| PBSS4260PANPS115 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PBSS4260PANPS SMALL
Description: NOW NEXPERIA PBSS4260PANPS SMALL
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| MF3D2200DU15/02V |
Виробник: NXP USA Inc.
Description: MIFARE SMART CARD DESFIRE EV2 XL
Description: MIFARE SMART CARD DESFIRE EV2 XL
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| 74HCT4520DB,112 |
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Виробник: NXP USA Inc.
Description: BINARY COUNTER
Description: BINARY COUNTER
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| 74AHCT74PW112 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT74PW - D FLIP
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74AHCT74PW - D FLIP
Packaging: Bulk
Part Status: Active
на замовлення 5885 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2377+ | 9.47 грн |
| A2I09VD050GNR1 |
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Виробник: NXP USA Inc.
Description: IC AMP GPS 575-960MHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 575MHz ~ 960MHz
RF Type: General Purpose
Voltage - Supply: 48V ~ 55V
Gain: 38dB
Current - Supply: 240mA
Test Frequency: 920MHz
Supplier Device Package: TO-270WBG-15
Description: IC AMP GPS 575-960MHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 575MHz ~ 960MHz
RF Type: General Purpose
Voltage - Supply: 48V ~ 55V
Gain: 38dB
Current - Supply: 240mA
Test Frequency: 920MHz
Supplier Device Package: TO-270WBG-15
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| MIMX8MN3CVPIZAA |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
на замовлення 42 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1807.02 грн |
| 10+ | 1399.46 грн |
| 25+ | 1314.27 грн |
| LPC2470FET208,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
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| K32L2B21VFM0A |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
DigiKey Programmable: Not Verified
Supplier Device Package: 32-QFN (5x5)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-UFQFN Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 32QFN
DigiKey Programmable: Not Verified
Supplier Device Package: 32-QFN (5x5)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-UFQFN Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 490 шт
В кошику
од. на суму грн.
| K32L2B11VFM0A |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
DigiKey Programmable: Not Verified
Supplier Device Package: 32-QFN (5x5)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-UFQFN Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 64KB FLASH 32QFN
DigiKey Programmable: Not Verified
Supplier Device Package: 32-QFN (5x5)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-UFQFN Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 490 шт
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од. на суму грн.
| PCA9955BTW-ARD |
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Виробник: NXP USA Inc.
Description: PCA9955 EVK LED ARD
Part Status: Active
Platform: Arduino
Utilized IC / Part: PCA9955B
Contents: Board(s)
Type: Opto
Function: LED Driver
Packaging: Bulk
Description: PCA9955 EVK LED ARD
Part Status: Active
Platform: Arduino
Utilized IC / Part: PCA9955B
Contents: Board(s)
Type: Opto
Function: LED Driver
Packaging: Bulk
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8079.35 грн |
| S912ZVML32F3VKH |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 160 шт
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од. на суму грн.
| LPC1820FBD144K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 300 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 793.54 грн |
| 10+ | 597.22 грн |
| 25+ | 555.52 грн |
| 80+ | 484.16 грн |
| 230+ | 459.44 грн |
| MFRC53001T/0FE |
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Виробник: NXP USA Inc.
Description: IC MIFARE HS READER 32SO
Description: IC MIFARE HS READER 32SO
товару немає в наявності
В кошику
од. на суму грн.
| K32W041AMZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1000+ | 312.82 грн |
| K32W041AMZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 503.97 грн |
| FRDM665CANFDEVB |
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Виробник: NXP USA Inc.
Description: MC33665A CAN FD EVB
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: MC33665A
Type: Interface
Function: CANbus
Packaging: Box
Part Status: Active
Embedded: Yes, MCU
Description: MC33665A CAN FD EVB
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: MC33665A
Type: Interface
Function: CANbus
Packaging: Box
Part Status: Active
Embedded: Yes, MCU
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 21944.48 грн |
| RD33775ACNCEVB |
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Виробник: NXP USA Inc.
Description: CAN FD CENTRALIZED EVB
Contents: Board(s)
Supplied Contents: Board(s)
Type: Interface
Function: CANbus
Packaging: Box
Description: CAN FD CENTRALIZED EVB
Contents: Board(s)
Supplied Contents: Board(s)
Type: Interface
Function: CANbus
Packaging: Box
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 31316.60 грн |
| SAF7755HV/N205ZK |
Виробник: NXP USA Inc.
Description: DSP AUDIO MULTI-TUNER
Description: DSP AUDIO MULTI-TUNER
товару немає в наявності
В кошику
од. на суму грн.
| SAF7755HV/N205ZY |
Виробник: NXP USA Inc.
Description: DSP AUDIO MULTI-TUNER
Description: DSP AUDIO MULTI-TUNER
товару немає в наявності
В кошику
од. на суму грн.
| 74ALVCH162827DGG518 |
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на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 355+ | 67.25 грн |
| 74ALVCH162827DGG118 |
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Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 56-TSSOP
Supplier Device Package: 56-TSSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 10
Voltage - Supply: 2.3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Part Status: Active
Packaging: Bulk
Description: IC BUFF NON-INVERT 3.6V 56-TSSOP
Supplier Device Package: 56-TSSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 10
Voltage - Supply: 2.3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Part Status: Active
Packaging: Bulk
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 298+ | 68.11 грн |
| 74ALVT162827DGG |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74ALVT162827DGG - B
Description: NOW NEXPERIA 74ALVT162827DGG - B
на замовлення 161 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 79+ | 301.71 грн |
| MCHC912B32VFUE8-NXP |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Number of I/O: 63
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: CPU12
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Bulk
DigiKey Programmable: Not Verified
EEPROM Size: 768 x 8
Program Memory Type: FLASH
Description: IC MCU 16BIT 32KB FLASH 80QFP
Number of I/O: 63
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: CPU12
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Bulk
DigiKey Programmable: Not Verified
EEPROM Size: 768 x 8
Program Memory Type: FLASH
товару немає в наявності
В кошику
од. на суму грн.
| MC908AP48CFBER528 |
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
на замовлення 2250 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| MPC8544EVTANGA |
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Виробник: NXP USA Inc.
Description: POWERQUICC RISC MICROPROCESSORS,
Description: POWERQUICC RISC MICROPROCESSORS,
на замовлення 11 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 9138.98 грн |













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