Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35296) > Сторінка 454 з 589
| Фото | Назва | Виробник | Інформація | Доступність | Ціна | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|  | FXPS7115DI4T1 | NXP USA Inc. |  Description: 40-115 KPA BAP DIG I2C | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
| FXTH870902DT1528 | NXP USA Inc. | Description: TPMS 7X7 900KPA Z AXIS Packaging: Bulk | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||
|   | MWCT1001AVLHR528 | NXP USA Inc. |  Description: 5W, MULTI-COIL AUTO, 5V, STANDAR | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | MWCT1001AVLH557 | NXP USA Inc. |  Description: 5W, MULTI-COIL AUTO, 5V, STANDAR | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | MPL3150A2T1 | NXP USA Inc. |  Description: PRESS SENSOR 2.5V 50/110KPA TSON | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | MPL3150A2 | NXP USA Inc. |  Description: PRESS SENSOR 2.5V 50/110KPA TSON | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
| MC33FS8510B6ESR2 | NXP USA Inc. | Description: FS8500 Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||
| MC33FS8510B6ES | NXP USA Inc. | Description: FS8500 Packaging: Tray | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||
| LPC11E13FBD48/301 | NXP USA Inc. | Description: IC MCU ARM CORTEX-M0 32BIT FLASH | на замовлення 4000 шт:термін постачання 21-31 дні (днів) | 
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|   | S912XET512BVAL | NXP USA Inc. |  Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | S912XET512BVALR | NXP USA Inc. |  Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | 74ABT162245ADGG512 | NXP USA Inc. |  Description: BUS TRANSCEIVER, ABT SERIES | на замовлення 975 шт:термін постачання 21-31 дні (днів) | 
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|   | SPC5604CF2VLL6R | NXP USA Inc. | Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 79 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | MKL28Z512VLL7R | NXP USA Inc. |  Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 27x16b SAR; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 90 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|  | MFS8603BMDA0ES | NXP USA Inc. |  Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 60V Applications: Camera Supplier Device Package: 48-QFN (7x7) Grade: Automotive Qualification: AEC-Q100 | на замовлення 260 шт:термін постачання 21-31 дні (днів) | 
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|  | S912ZVC64F0MLF | NXP USA Inc. |  Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 10x10b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|  | S912ZVC64F0MLFR | NXP USA Inc. |  Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 10x10b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | S9S12GN16F1CLC557 | NXP USA Inc. |  Description: MICROCONTROLLER  16-BIT, HCS12 C | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | S9S12GN32F1CLC557 | NXP USA Inc. |  Description: MICROCONTROLLER, 16-BIT, HCS12 C | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
| S9S12G48BCLC557 | NXP USA Inc. |  Description: MICROCONTROLLER, 16-BIT, HCS12 C | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||
|   | S9S12GN48F1CLC557 | NXP USA Inc. |  Description: MICROCONTROLLER, 16-BIT, HCS12 C | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | MC9S08DZ16ACLC557 | NXP USA Inc. |  Description: MICROCONTROLLER, 8-BIT, HC08/S08 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|  | BZB784-C2V7,115 | NXP USA Inc. |  Description: NOW NEXPERIA BZB784-C2V7 - ZENER Tolerance: ±5% Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 2.7 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-323 Part Status: Active Power - Max: 180 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 20 µA @ 1 V | на замовлення 168000 шт:термін постачання 21-31 дні (днів) | 
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|  | BZB784-C8V2,115 | NXP USA Inc. |  Description: NOW NEXPERIA BZB784-C8V2 - ZENER Tolerance: ±5% Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 8.2 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: SOT-323 Power - Max: 180 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 700 nA @ 5 V | на замовлення 129290 шт:термін постачання 21-31 дні (днів) | 
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| BZB84-C75215 | NXP USA Inc. |  Description: NOW NEXPERIA BZB84-C75 - ZENER D | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||
|   | BZB84-C11215 | NXP USA Inc. |  Description: NOW NEXPERIA BZB84-C10 - ZENER D | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | BZX84-C2V7/LF1R | NXP USA Inc. |  Description: DIODE ZENER 2.7V 250MW TO236AB Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 2.7 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 20 µA @ 1 V Qualification: AEC-Q101 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | BZX84-C2V7/LF1VL | NXP USA Inc. |  Description: DIODE ZENER 2.7V 250MW TO236AB Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 2.7 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 20 µA @ 1 V Qualification: AEC-Q101 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | BUK7640-100A118 | NXP USA Inc. |  Description: NOW NEXPERIA BUK7640-100A - POWE | на замовлення 4269 шт:термін постачання 21-31 дні (днів) | 
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|   | MCIMX250DJM4A | NXP USA Inc. | Description: IC MPU I.MX25 400MAPBGA | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | MCIMX250CJM4A | NXP USA Inc. |  Description: IC MPU IMX25 IND 400MAPBGA | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | MPC8260AZUPJDB-NXP | NXP USA Inc. |  Description: IC MPU MPC82XX 300MHZ 480TBGA Packaging: Bulk Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | на замовлення 17 шт:термін постачання 21-31 дні (днів) | 
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|   | TDF8599TH/N2,512 | NXP USA Inc. | Description: IC AMP D MONO/STEREO 85W 36HSOP Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection Packaging: Tube Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 8V ~ 18V Max Output Power x Channels @ Load: 85W x 1 @ 1Ohm; 70W x 2 @ 2Ohm Supplier Device Package: 36-HSOP Part Status: Obsolete | на замовлення 660 шт:термін постачання 21-31 дні (днів) | 
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|   | TDF8531HH/N3K | NXP USA Inc. |  Description: IC AMPLIFIER CLASS D 100HLQFP Packaging: Tray Package / Case: 100-FQFP Exposed Pad Output Type: 3-Channel Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm Supplier Device Package: 100-HLQFP (14x14) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | TDF8534HH/N3K | NXP USA Inc. |  Description: IC AMPLIFIER CLASS D 100HLQFP Packaging: Tray Package / Case: 100-FQFP Exposed Pad Output Type: 5-Channel Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm Supplier Device Package: 100-HLQFP (14x14) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | TDF8531HH/N3Y | NXP USA Inc. |  Description: IC AMPLIFIER CLASS D 100HLQFP Packaging: Tape & Reel (TR) Package / Case: 100-FQFP Exposed Pad Output Type: 3-Channel Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm Supplier Device Package: 100-HLQFP (14x14) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | TDF8534HH/N3Y | NXP USA Inc. |  Description: IC AMPLIFIER CLASS D 100HLQFP Packaging: Tape & Reel (TR) Package / Case: 100-FQFP Exposed Pad Output Type: 5-Channel Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm Supplier Device Package: 100-HLQFP (14x14) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | TDF8532HH/N3Y | NXP USA Inc. |  Description: IC AMPLIFIER CLASS D 100HLQFP Packaging: Tape & Reel (TR) Package / Case: 100-FQFP Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm Supplier Device Package: 100-HLQFP (14x14) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | TDF8532HH/N3K | NXP USA Inc. |  Description: IC AMPLIFIER CLASS D 100HLQFP Packaging: Tray Package / Case: 100-FQFP Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm Supplier Device Package: 100-HLQFP (14x14) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | P1021NXN2DFB | NXP USA Inc. |  Description: IC MPU QORIQ P1 800MHZ PBGA689 Packaging: Bulk Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Additional Interfaces: DUART, I2C, MMC/SD, SPI | на замовлення 24 шт:термін постачання 21-31 дні (днів) | 
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|  | MCIMX6L2EVN10ACR | NXP USA Inc. |  Description: I.MX 6SL ROM PERF ENHAN | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | LD6806F/18P,115 | NXP USA Inc. |  Description: IC REG LINEAR 1.8V 200MA 6XSON | на замовлення 6669 шт:термін постачання 21-31 дні (днів) | 
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| FRDMSTBI-B3115 | NXP USA Inc. |  Description: SENSOR TOOLBOX DEVELOPMENT PLATF Packaging: Bulk Interface: I2C, Serial Voltage - Supply: 1.95V ~ 3.6V Sensor Type: Pressure Utilized IC / Part: FXPQ3115BV Supplied Contents: Board(s) Sensing Range: 20 ~ 110 kPa Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||
| BRKTSTBI-B3115 | NXP USA Inc. |  Description: SENSOR BREAKOUT BOARD FOR FXPQ31 Packaging: Bulk Interface: I2C, Serial Voltage - Supply: 2.5V Sensor Type: Pressure Utilized IC / Part: FXPQ3115BV Supplied Contents: Board(s) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||
|   | FXPQ3115BV | NXP USA Inc. |  Description: PRESS SENSOR 2.5V 20/110KPA TSON | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | MPC8544VJALFA | NXP USA Inc. |  Description: IC MPU MPC85XX 667MHZ 783FCPBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 667MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI | на замовлення 36 шт:термін постачання 21-31 дні (днів) | 
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|   | MC32PF4210A0ESR2 | NXP USA Inc. |  Description: PF4210 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
| TEA1936XDB1463UL | NXP USA Inc. |  Description: TEA1936X DEMOBOARD 1463 | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||
| P302D217UD/T0K092V | NXP USA Inc. | Description: P302D217UD/T0K092V Packaging: Bulk Part Status: Last Time Buy | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||
|   | LD6815TD/33H,125 | NXP USA Inc. |  Description: IC REG LINEAR 3.3V 150MA 5TSOP Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 3.3V Control Features: Enable PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA (Typ) Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA | на замовлення 9000 шт:термін постачання 21-31 дні (днів) | 
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|  | S912ZVMBA6F0WLFR | NXP USA Inc. |  Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 5x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: LINbus, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 15 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|   | BLF10M6LS200U112 | NXP USA Inc. | Description: RF MOSFET LDMOS Packaging: Bulk | на замовлення 260 шт:термін постачання 21-31 дні (днів) | 
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| BUK9Y113-100E115 | NXP USA Inc. |  Description: NOW NEXPERIA BUK9Y113-100E 12A, | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||
|   | BUK7Y113-100E115 | NXP USA Inc. |  Description: NOW NEXPERIA BUK7Y113-100E - POW | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||
|  | S9KEAZ128AVLHR | NXP USA Inc. |  Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified | на замовлення 2635 шт:термін постачання 21-31 дні (днів) | 
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|   | PEMI8QFN/CT,132 | NXP USA Inc. |  Description: FILTER RC(PI) 20 OHMS ESD SMD Packaging: Bulk Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 16dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Part Status: Obsolete Number of Channels: 8 | на замовлення 12000 шт:термін постачання 21-31 дні (днів) | 
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|   | PEMI4QFN/LE,132 | NXP USA Inc. |  Description: FILTER RC(PI) 65 OHM/8.5PF SMD Packaging: Bulk Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 65Ohms, C = 8.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 11dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 65 ESD Protection: Yes Part Status: Obsolete Number of Channels: 4 | на замовлення 112000 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||||
| A2I35H060NR1,528 | NXP USA Inc. |  Description: RF LDMOS WIDEBAND INTEGRATED POW | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||
| MKL27Z32VLH4 | NXP USA Inc. | Description: IC MCU 32BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 19x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I²S, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 51 | на замовлення 1589 шт:термін постачання 21-31 дні (днів) | 
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|   | PCF8545BTT/A118 | NXP USA Inc. |  Description: UNIVERSAL LCD DRIVER FOR MULTIPL Packaging: Bulk | на замовлення 1900 шт:термін постачання 21-31 дні (днів) | 
 | 
| FXPS7115DI4T1 |  | 
Виробник: NXP USA Inc.
Description: 40-115 KPA BAP DIG I2C
    Description: 40-115 KPA BAP DIG I2C
товару немає в наявності
    В кошику
     од. на суму     грн.
| MWCT1001AVLHR528 |  | 
Виробник: NXP USA Inc.
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR
    Description: 5W, MULTI-COIL AUTO, 5V, STANDAR
товару немає в наявності
    В кошику
     од. на суму     грн.
| MWCT1001AVLH557 |  | 
Виробник: NXP USA Inc.
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR
    Description: 5W, MULTI-COIL AUTO, 5V, STANDAR
товару немає в наявності
    В кошику
     од. на суму     грн.
| MPL3150A2T1 |  | 
Виробник: NXP USA Inc.
Description: PRESS SENSOR 2.5V 50/110KPA TSON
    Description: PRESS SENSOR 2.5V 50/110KPA TSON
товару немає в наявності
    В кошику
     од. на суму     грн.
| MPL3150A2 |  | 
Виробник: NXP USA Inc.
Description: PRESS SENSOR 2.5V 50/110KPA TSON
    Description: PRESS SENSOR 2.5V 50/110KPA TSON
товару немає в наявності
    В кошику
     од. на суму     грн.
| LPC11E13FBD48/301 | 
Виробник: NXP USA Inc.
Description: IC MCU ARM CORTEX-M0 32BIT FLASH
    Description: IC MCU ARM CORTEX-M0 32BIT FLASH
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 49+ | 446.83 грн | 
| S912XET512BVAL |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
    Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| S912XET512BVALR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
    Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| 74ABT162245ADGG512 |  | 
Виробник: NXP USA Inc.
Description: BUS TRANSCEIVER, ABT SERIES
    Description: BUS TRANSCEIVER, ABT SERIES
на замовлення 975 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 704+ | 34.83 грн | 
| SPC5604CF2VLL6R | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| MKL28Z512VLL7R |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x16b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 90
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x16b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 90
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| MFS8603BMDA0ES |  | 
Виробник: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
    Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 260 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 638.57 грн | 
| 10+ | 478.17 грн | 
| 25+ | 444.01 грн | 
| 100+ | 381.38 грн | 
| 260+ | 363.93 грн | 
| S912ZVC64F0MLF |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
    Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
     од. на суму     грн.
| S912ZVC64F0MLFR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
    Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
товару немає в наявності
    В кошику
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| S9S12GN16F1CLC557 |  | 
Виробник: NXP USA Inc.
Description: MICROCONTROLLER 16-BIT, HCS12 C
    Description: MICROCONTROLLER 16-BIT, HCS12 C
товару немає в наявності
    В кошику
     од. на суму     грн.
| S9S12GN32F1CLC557 |  | 
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
    Description: MICROCONTROLLER, 16-BIT, HCS12 C
товару немає в наявності
    В кошику
     од. на суму     грн.
| S9S12G48BCLC557 |  | 
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
    Description: MICROCONTROLLER, 16-BIT, HCS12 C
товару немає в наявності
    В кошику
     од. на суму     грн.
| S9S12GN48F1CLC557 |  | 
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
    Description: MICROCONTROLLER, 16-BIT, HCS12 C
товару немає в наявності
    В кошику
     од. на суму     грн.
| MC9S08DZ16ACLC557 |  | 
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
    Description: MICROCONTROLLER, 8-BIT, HC08/S08
товару немає в наявності
    В кошику
     од. на суму     грн.
| BZB784-C2V7,115 |  | 
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C2V7 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-323
Part Status: Active
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
    Description: NOW NEXPERIA BZB784-C2V7 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-323
Part Status: Active
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
на замовлення 168000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 10452+ | 2.26 грн | 
| BZB784-C8V2,115 |  | 
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C8V2 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
    Description: NOW NEXPERIA BZB784-C8V2 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
на замовлення 129290 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 10452+ | 2.48 грн | 
| BZB84-C75215 |  | 
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB84-C75 - ZENER D
    Description: NOW NEXPERIA BZB84-C75 - ZENER D
товару немає в наявності
    В кошику
     од. на суму     грн.
| BZB84-C11215 |  | 
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB84-C10 - ZENER D
    Description: NOW NEXPERIA BZB84-C10 - ZENER D
товару немає в наявності
    В кошику
     од. на суму     грн.
| BZX84-C2V7/LF1R |  | 
Виробник: NXP USA Inc.
Description: DIODE ZENER 2.7V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Qualification: AEC-Q101
    Description: DIODE ZENER 2.7V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Qualification: AEC-Q101
товару немає в наявності
    В кошику
     од. на суму     грн.
| BZX84-C2V7/LF1VL |  | 
Виробник: NXP USA Inc.
Description: DIODE ZENER 2.7V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Qualification: AEC-Q101
    Description: DIODE ZENER 2.7V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Qualification: AEC-Q101
товару немає в наявності
    В кошику
     од. на суму     грн.
| BUK7640-100A118 |  | 
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BUK7640-100A - POWE
    Description: NOW NEXPERIA BUK7640-100A - POWE
на замовлення 4269 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 478+ | 51.02 грн | 
| MCIMX250DJM4A | 
Виробник: NXP USA Inc.
Description: IC MPU I.MX25 400MAPBGA
    Description: IC MPU I.MX25 400MAPBGA
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| MCIMX250CJM4A |  | 
Виробник: NXP USA Inc.
Description: IC MPU IMX25 IND 400MAPBGA
    Description: IC MPU IMX25 IND 400MAPBGA
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| MPC8260AZUPJDB-NXP |  | 
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Bulk
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
    Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Bulk
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
на замовлення 17 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 24060.70 грн | 
| TDF8599TH/N2,512 | 
Виробник: NXP USA Inc.
Description: IC AMP D MONO/STEREO 85W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 85W x 1 @ 1Ohm; 70W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
    Description: IC AMP D MONO/STEREO 85W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 85W x 1 @ 1Ohm; 70W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
на замовлення 660 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 24+ | 1024.66 грн | 
| TDF8531HH/N3K |  | 
Виробник: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 3-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
    Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 3-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
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| TDF8534HH/N3K |  | 
Виробник: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 5-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
    Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 5-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
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| TDF8531HH/N3Y |  | 
Виробник: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 3-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
    Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 3-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
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| TDF8534HH/N3Y |  | 
Виробник: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 5-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
    Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 5-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
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| TDF8532HH/N3Y |  | 
Виробник: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
    Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
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| TDF8532HH/N3K |  | 
Виробник: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
    Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
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| P1021NXN2DFB |  | 
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
    Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 4+ | 6911.69 грн | 
| MCIMX6L2EVN10ACR |  | 
Виробник: NXP USA Inc.
Description: I.MX 6SL ROM PERF ENHAN
    Description: I.MX 6SL ROM PERF ENHAN
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| LD6806F/18P,115 |  | 
Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.8V 200MA 6XSON
    Description: IC REG LINEAR 1.8V 200MA 6XSON
на замовлення 6669 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 2404+ | 9.72 грн | 
| FRDMSTBI-B3115 |  | 
Виробник: NXP USA Inc.
Description: SENSOR TOOLBOX DEVELOPMENT PLATF
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Sensing Range: 20 ~ 110 kPa
Part Status: Active
    Description: SENSOR TOOLBOX DEVELOPMENT PLATF
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Sensing Range: 20 ~ 110 kPa
Part Status: Active
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| BRKTSTBI-B3115 |  | 
Виробник: NXP USA Inc.
Description: SENSOR BREAKOUT BOARD FOR FXPQ31
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 2.5V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Part Status: Active
    Description: SENSOR BREAKOUT BOARD FOR FXPQ31
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 2.5V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Part Status: Active
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| FXPQ3115BV |  | 
Виробник: NXP USA Inc.
Description: PRESS SENSOR 2.5V 20/110KPA TSON
    Description: PRESS SENSOR 2.5V 20/110KPA TSON
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| MPC8544VJALFA |  | 
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI
    Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI
на замовлення 36 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 11413.26 грн | 
| 10+ | 9324.07 грн | 
| 36+ | 8770.01 грн | 
| MC32PF4210A0ESR2 |  | 
Виробник: NXP USA Inc.
Description: PF4210
    Description: PF4210
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| TEA1936XDB1463UL |  | 
Виробник: NXP USA Inc.
Description: TEA1936X DEMOBOARD 1463
    Description: TEA1936X DEMOBOARD 1463
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| LD6815TD/33H,125 |  | 
Виробник: NXP USA Inc.
Description: IC REG LINEAR 3.3V 150MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
    Description: IC REG LINEAR 3.3V 150MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 3328+ | 6.86 грн | 
| S912ZVMBA6F0WLFR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 15
DigiKey Programmable: Not Verified
    Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 15
DigiKey Programmable: Not Verified
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| BLF10M6LS200U112 | 
на замовлення 260 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 4+ | 7455.46 грн | 
| BUK9Y113-100E115 |  | 
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BUK9Y113-100E 12A,
    Description: NOW NEXPERIA BUK9Y113-100E 12A,
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| BUK7Y113-100E115 |  | 
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BUK7Y113-100E - POW
    Description: NOW NEXPERIA BUK7Y113-100E - POW
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| S9KEAZ128AVLHR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 2635 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 2+ | 285.00 грн | 
| 10+ | 240.80 грн | 
| 25+ | 240.18 грн | 
| 100+ | 224.77 грн | 
| 250+ | 213.98 грн | 
| 500+ | 201.28 грн | 
| PEMI8QFN/CT,132 |  | 
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 20 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
    Description: FILTER RC(PI) 20 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1567+ | 14.96 грн | 
| PEMI4QFN/LE,132 |  | 
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 11dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
    Description: FILTER RC(PI) 65 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 11dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
на замовлення 112000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 2959+ | 7.42 грн | 
| A2I35H060NR1,528 |  | 
Виробник: NXP USA Inc.
Description: RF LDMOS WIDEBAND INTEGRATED POW
    Description: RF LDMOS WIDEBAND INTEGRATED POW
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| MKL27Z32VLH4 | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 19x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
    Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 19x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
на замовлення 1589 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 50+ | 837.66 грн | 
| PCF8545BTT/A118 |  | 
на замовлення 1900 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 208+ | 109.21 грн |