Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36595) > Сторінка 455 з 610
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||
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FXPS7165DI4ST1 | NXP USA Inc. | Description: IC PRESSURE SENSOR 16HQFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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FXPS7400DI4T1 | NXP USA Inc. |
Description: 20-400 KPA BAP DIG I2C |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||
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FXPS7400DI4ST1 | NXP USA Inc. | Description: IC PRESSURE SENSOR 16HQFN |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||
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FXPS7165DI4T1 | NXP USA Inc. |
Description: 60-165 KPA BAP DIG I2C |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||
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FXPS7115DI4ST1 | NXP USA Inc. | Description: IC PRESSURE SENSOR 16HQFN |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||
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MC9328MXLCVM15 | NXP USA Inc. |
Description: IC MPU I.MXL 150MHZ 256BGANumber of Cores/Bus Width: 1 Core, 32-Bit USB: USB 1.x (1) Supplier Device Package: 256-PBGA (14x14) Voltage - I/O: 1.8V, 3.0V Core Processor: ARM920T Operating Temperature: -40°C ~ 85°C (TA) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 256-LFBGA Packaging: Tray Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART Display & Interface Controllers: LCD Graphics Acceleration: No RAM Controllers: SDRAM |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68302RC20C | NXP USA Inc. |
Description: IC MPU M683XX 20MHZ 132PGAAdditional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 8/16-Bit Supplier Device Package: 132-PGA (34.5x34.5) Voltage - I/O: 5.0V Core Processor: M68000 Operating Temperature: 0°C ~ 70°C (TA) Speed: 20MHz Mounting Type: Through Hole Package / Case: 132-BPGA Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
| MC68302EH20C | NXP USA Inc. |
Description: M68000 MICROPROCESSOR IC SERIES |
на замовлення 1268 шт: термін постачання 21-31 дні (днів) |
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PHPT60410PY115 | NXP USA Inc. |
Description: POWER BIPOLAR TRANSISTOR, PNPPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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PHPT60410NY115 | NXP USA Inc. |
Description: POWER BIPOLAR TRANSISTOR NPNPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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SPC5746CFK1ACMH6 | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 100MAPBGA |
товару немає в наявності |
Мінімальне замовлення: 880 шт В кошику од. на суму грн. | ||||||||
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SPC5744CBK1ACMH6 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 100MAPBGAPackaging: Tray Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 80MHz, 160MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z2, e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Supplier Device Package: 100-MAPBGA (11x11) Number of I/O: 65 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 880 шт В кошику од. на суму грн. | ||||||||
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BBY31,215 | NXP USA Inc. |
Description: DIODE UHF VAR CAP 30V SOT-23Capacitance Ratio: 8.3 Voltage - Peak Reverse (Max): 30 V Part Status: Obsolete Supplier Device Package: SOT-23 (TO-236AB) Capacitance Ratio Condition: C1/C28 Capacitance @ Vr, F: 2pF @ 28V, 1MHz Operating Temperature: -55°C ~ 125°C (TJ) Diode Type: Single Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
| TJA1042AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 120 mV Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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| NX20P5090UK041 | NXP USA Inc. |
Description: NX20P5090UK - BUFFER/INVERTER BA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
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MCF5272VM66 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB ROM 196MAPBGADigiKey Programmable: Not Verified Number of I/O: 32 Supplier Device Package: 196-LBGA (15x15) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Core Processor: Coldfire V2 Program Memory Type: ROM Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) RAM Size: 1K x 32 Program Memory Size: 16KB (4K x 32) Speed: 66MHz Mounting Type: Surface Mount Package / Case: 196-LBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MCF5206EAB40 | NXP USA Inc. |
Description: IC MPU MCF520X 40MHZ 160QFPPart Status: Obsolete RAM Controllers: DRAM Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 160-QFP (28x28) Voltage - I/O: 3.3V Core Processor: Coldfire V2 Operating Temperature: 0°C ~ 70°C (TA) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
| MRF24301HR5178 | NXP USA Inc. |
Description: 300W 32V RF POWER TRANSISTOR |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
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mpc8250aczumhbc | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGAPart Status: Obsolete Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100Mbps (3) Supplier Device Package: 480-TBGA (37.5x37.5) Voltage - I/O: 3.3V Core Processor: PowerPC G2 Operating Temperature: -40°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MPC8250ACVVMHBC | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGAPart Status: Obsolete Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Packaging: Tray Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100Mbps (3) Supplier Device Package: 480-TBGA (37.5x37.5) Voltage - I/O: 3.3V Core Processor: PowerPC G2 Operating Temperature: -40°C ~ 105°C (TA) Speed: 266MHz Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
товару немає в наявності |
Мінімальне замовлення: 21 шт В кошику од. на суму грн. | ||||||||
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74LV132N,112 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2IN 14DIP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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74LV367D,112 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 16SOLogic Type: Buffer, Non-Inverting Number of Elements: 2 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 16-SOIC (0.154", 3.90mm Width) Packaging: Tube Supplier Device Package: 16-SO Current - Output High, Low: 8mA, 8mA Number of Bits per Element: 2, 4 (Hex) Voltage - Supply: 1V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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74LV367N,112 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 16DIPPart Status: Obsolete Supplier Device Package: 16-DIP Current - Output High, Low: 8mA, 8mA Number of Bits per Element: 2, 4 (Hex) Voltage - Supply: 1V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 2 Mounting Type: Through Hole Output Type: 3-State Package / Case: 16-DIP (0.300", 7.62mm) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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SPC5603BF2CLL6 | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 100LQFP |
товару немає в наявності |
Мінімальне замовлення: 450 шт В кошику од. на суму грн. | ||||||||
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PDTA113ZE,115 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 50V 0.1A SC75Packaging: Tape & Reel (TR) Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Transistor Type: PNP - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 35 @ 5mA, 5V Supplier Device Package: SC-75 Part Status: Obsolete Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 150 mW Resistor - Base (R1): 1 kOhms Resistor - Emitter Base (R2): 10 kOhms Resistors Included: R1 and R2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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PDTA113EE,115 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 50V 0.1A SC75Resistor - Emitter Base (R2): 1 kOhms Resistor - Base (R1): 1 kOhms Power - Max: 150 mW Voltage - Collector Emitter Breakdown (Max): 50 V Current - Collector (Ic) (Max): 100 mA Part Status: Obsolete Supplier Device Package: SC-75 DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 40mA, 5V Current - Collector Cutoff (Max): 1µA Vce Saturation (Max) @ Ib, Ic: 150mV @ 1.5mA, 30mA Transistor Type: PNP - Pre-Biased Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC33665ATF4AE | NXP USA Inc. |
Description: IC BMS TPL TXRX CAN GATEWAYPackaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 1 Mounting Type: Surface Mount Function: Power Management Interface: CAN, I2C Operating Temperature: -40°C ~ 125°C (TA) Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 249 шт: термін постачання 21-31 дні (днів) |
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| A3I20D040WNR1 | NXP USA Inc. | Description: AIRFAST RF LDMOS WIDEBAND INTEGR |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | |||||||||
| A3I20D040WGNR1 | NXP USA Inc. | Description: AIRFAST RF LDMOS WIDEBAND INTEGR |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | |||||||||
| AFSC5G23D37T2 | NXP USA Inc. |
Description: AIRFAST PWR AMP 5G 27DB HLQFN26 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| AFSC5G35D37T2 | NXP USA Inc. |
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFNGain: 31dB Voltage - Supply: 0V ~ 32V RF Type: 5G, LTE Frequency: 3.4GHz ~ 3.6GHz Mounting Type: Surface Mount Package / Case: 26-LQFN Exposed Pad Packaging: Tape & Reel (TR) Supplier Device Package: 26-HLQFN (10x6) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||
| AFSC5G35D37T2 | NXP USA Inc. |
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFNSupplier Device Package: 26-HLQFN (10x6) Gain: 31dB Voltage - Supply: 0V ~ 32V RF Type: 5G, LTE Frequency: 3.4GHz ~ 3.6GHz Mounting Type: Surface Mount Package / Case: 26-LQFN Exposed Pad Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| A3I35D012WGNR1 | NXP USA Inc. |
Description: AIRFAST RF LDMOS WIDEBAND INTEGR |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
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PMGD130UN,115 | NXP USA Inc. |
Description: MOSFET 2N-CH 20V 1.2A 6TSSOPSupplier Device Package: 6-TSSOP Vgs(th) (Max) @ Id: 1V @ 250µA FET Feature: Logic Level Gate Gate Charge (Qg) (Max) @ Vgs: 1.3nC @ 4.5V Rds On (Max) @ Id, Vgs: 145mOhm @ 1.2A, 4.5V Input Capacitance (Ciss) (Max) @ Vds: 83pF @ 10V Current - Continuous Drain (Id) @ 25°C: 1.2A Drain to Source Voltage (Vdss): 20V Power - Max: 390mW Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 150°C (TJ) Configuration: 2 N-Channel (Dual) Mounting Type: Surface Mount Package / Case: 6-TSSOP, SC-88, SOT-363 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MPC8255ACVVMHBB | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGARAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100Mbps (3) Supplier Device Package: 480-TBGA (37.5x37.5) Voltage - I/O: 3.3V Core Processor: PowerPC G2 Operating Temperature: -40°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Packaging: Tray Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Part Status: Obsolete Graphics Acceleration: No |
товару немає в наявності |
Мінімальне замовлення: 21 шт В кошику од. на суму грн. | ||||||||
| MPC8347ECVRADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620BGAPart Status: Active Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR Co-Processors/DSP: Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 620-PBGA (29x29) Voltage - I/O: 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: -40°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Packaging: Bulk Additional Interfaces: DUART, I2C, PCI, SPI |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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LPC4310FBD144,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFPDigiKey Programmable: Not Verified Number of I/O: 83 Supplier Device Package: 144-LQFP (20x20) Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM® Cortex®-M4/M0 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 168K x 8 Speed: 204MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||||||||
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74AUP3G0434GD125 | NXP USA Inc. |
Description: INVERTER, AUP/ULP/V SERIESPackaging: Bulk Package / Case: 8-XFDFN Output Type: Single-Ended Mounting Type: Surface Mount Logic Type: Buffer/Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Input (2, 1) Schmitt Trigger Input: No Supplier Device Package: 8-XSON (2x3) Part Status: Active Number of Circuits: 3 |
на замовлення 92750 шт: термін постачання 21-31 дні (днів) |
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74AUP3G0434DC125 | NXP USA Inc. |
Description: INVERTER, AUP/ULP/V SERIESNumber of Circuits: 3 Part Status: Active Supplier Device Package: 8-VSSOP Schmitt Trigger Input: No Number of Inputs: 3 Input (2, 1) Current - Output High, Low: 4mA, 4mA Voltage - Supply: 0.8V ~ 3.6V Operating Temperature: -40°C ~ 125°C Logic Type: Buffer/Inverter Mounting Type: Surface Mount Output Type: Single-Ended Package / Case: 8-VFSOP (0.091", 2.30mm Width) Packaging: Bulk |
на замовлення 2600 шт: термін постачання 21-31 дні (днів) |
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| 74AUP3G0434GT115 | NXP USA Inc. |
Description: INVERTER, AUP/ULP/V SERIESPackaging: Bulk Supplier Device Package: 8-XSON (1.95x1) Mounting Type: Surface Mount Package / Case: 8-XFDFN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
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74AUP3G0434GS115 | NXP USA Inc. |
Description: INVERTER, AUP/ULP/V SERIES |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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S9S12ZVL16F0VLC | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 32LQFPDigiKey Programmable: Not Verified Number of I/O: 19 Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 6x10b Core Processor: S12Z EEPROM Size: 128 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||
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S9S08SG4E2VTGR518 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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74AXP1T34GS,125 | NXP USA Inc. |
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE |
на замовлення 4967 шт: термін постачання 21-31 дні (днів) |
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74AXP1T34GN,125 | NXP USA Inc. |
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE |
на замовлення 3199 шт: термін постачання 21-31 дні (днів) |
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74AXP1T34GN125 | NXP USA Inc. |
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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74AXP1T34GM125 | NXP USA Inc. |
Description: 74AXP1T34GM - BUFFER, AXP SERIESPart Status: Active Supplier Device Package: 6-XSON, SOT886 (1.45x1) Current - Output High, Low: 12mA, 12mA Number of Bits per Element: 1 Voltage - Supply: 0.7V ~ 2.75V Operating Temperature: -40°C ~ 85°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 1 Mounting Type: Surface Mount Output Type: Push-Pull Package / Case: 6-XFDFN Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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74AXP1T34GS125 | NXP USA Inc. |
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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74AXP1T34GW125 | NXP USA Inc. |
Description: 74AXP1T34GW - BUFFER, AXP SERIES |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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74LV365N,112 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 16DIPPart Status: Obsolete Supplier Device Package: 16-DIP Current - Output High, Low: 8mA, 8mA Number of Bits per Element: 6 Voltage - Supply: 1V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 1 Mounting Type: Through Hole Output Type: 3-State Package / Case: 16-DIP (0.300", 7.62mm) Packaging: Tube |
на замовлення 1768 шт: термін постачання 21-31 дні (днів) |
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74LV132DB,118 | NXP USA Inc. |
Description: NAND GATE, LV/LV-A/LVX/H SERIES,Current - Quiescent (Max): 40 µA Number of Circuits: 4 Part Status: Active Max Propagation Delay @ V, Max CL: 9ns @ 5V, 50pF Input Logic Level - Low: 0.3V ~ 1.2V Input Logic Level - High: 1.4V ~ 3.9V Supplier Device Package: 14-SSOP Number of Inputs: 2 Current - Output High, Low: 12mA, 12mA Voltage - Supply: 1V ~ 5.5V Operating Temperature: -40°C ~ 125°C Logic Type: NAND Gate Mounting Type: Surface Mount Package / Case: 14-SSOP (0.209", 5.30mm Width) Features: Schmitt Trigger Packaging: Bulk |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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74LV132DB,112 | NXP USA Inc. |
Description: NAND GATE, LV/LV-A/LVX/H SERIES, |
на замовлення 2492 шт: термін постачання 21-31 дні (днів) |
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74ALVT162241DL,112 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 48SSOPSupplier Device Package: 48-SSOP Current - Output High, Low: 12mA, 12mA Number of Bits per Element: 4 Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 4 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 48-BSSOP (0.295", 7.50mm Width) Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 1581 шт В кошику од. на суму грн. | ||||||||
|
FS32K116LAT0VLFT | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 17K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 13x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 43 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
|
MCIMX6X3EVK10AC | NXP USA Inc. |
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Operating Temperature: -20°C ~ 105°C (TJ) Speed: 227MHz, 1GHz Mounting Type: Surface Mount USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 400-MAPBGA (14x14) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Package / Case: 400-LFBGA Packaging: Tray Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Display & Interface Controllers: Keypad, LCD, LVDS Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit |
товару немає в наявності |
Мінімальне замовлення: 760 шт В кошику од. на суму грн. | ||||||||
|
MCIMX6X3EVK10ACR | NXP USA Inc. |
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Display & Interface Controllers: Keypad, LCD, LVDS Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 400-MAPBGA (14x14) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Operating Temperature: -20°C ~ 105°C (TJ) Speed: 227MHz, 1GHz Mounting Type: Surface Mount Package / Case: 400-LFBGA Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||
|
MCIMX6S4AVM08ABR | NXP USA Inc. |
Description: IC MPU I.MX6S 800MHZ 624MAPBGAAdditional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-MAPBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 624-LFBGA Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||||
|
|
MC22XS4200BEK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:2 32HSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
| SL2S5302FTB115 | NXP USA Inc. | Description: ICODE SLIX-S SMART LABEL IC |
товару немає в наявності |
Мінімальне замовлення: 997 шт В кошику од. на суму грн. | |||||||||
| A3V09H521-24SR6 | NXP USA Inc. |
Description: AIRFAST RF POWER LDMOS TRANSISTOPackaging: Tape & Reel (TR) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. |
| FXPS7165DI4ST1 |
Виробник: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Description: IC PRESSURE SENSOR 16HQFN
товару немає в наявності
В кошику
од. на суму грн.
| FXPS7400DI4T1 |
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Виробник: NXP USA Inc.
Description: 20-400 KPA BAP DIG I2C
Description: 20-400 KPA BAP DIG I2C
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| FXPS7400DI4ST1 |
Виробник: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Description: IC PRESSURE SENSOR 16HQFN
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| FXPS7165DI4T1 |
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Виробник: NXP USA Inc.
Description: 60-165 KPA BAP DIG I2C
Description: 60-165 KPA BAP DIG I2C
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| FXPS7115DI4ST1 |
Виробник: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Description: IC PRESSURE SENSOR 16HQFN
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MC9328MXLCVM15 |
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Виробник: NXP USA Inc.
Description: IC MPU I.MXL 150MHZ 256BGA
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Supplier Device Package: 256-PBGA (14x14)
Voltage - I/O: 1.8V, 3.0V
Core Processor: ARM920T
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 256-LFBGA
Packaging: Tray
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: SDRAM
Description: IC MPU I.MXL 150MHZ 256BGA
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Supplier Device Package: 256-PBGA (14x14)
Voltage - I/O: 1.8V, 3.0V
Core Processor: ARM920T
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 256-LFBGA
Packaging: Tray
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: SDRAM
товару немає в наявності
В кошику
од. на суму грн.
| MC68302RC20C |
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Виробник: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 132PGA
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 132-PGA (34.5x34.5)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Through Hole
Package / Case: 132-BPGA Exposed Pad
Packaging: Tray
Description: IC MPU M683XX 20MHZ 132PGA
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 132-PGA (34.5x34.5)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Through Hole
Package / Case: 132-BPGA Exposed Pad
Packaging: Tray
товару немає в наявності
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од. на суму грн.
| MC68302EH20C |
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Виробник: NXP USA Inc.
Description: M68000 MICROPROCESSOR IC SERIES
Description: M68000 MICROPROCESSOR IC SERIES
на замовлення 1268 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 7336.36 грн |
| SPC5746CFK1ACMH6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
товару немає в наявності
Мінімальне замовлення: 880 шт
В кошику
од. на суму грн.
| SPC5744CBK1ACMH6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 880 шт
В кошику
од. на суму грн.
| BBY31,215 |
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Виробник: NXP USA Inc.
Description: DIODE UHF VAR CAP 30V SOT-23
Capacitance Ratio: 8.3
Voltage - Peak Reverse (Max): 30 V
Part Status: Obsolete
Supplier Device Package: SOT-23 (TO-236AB)
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Cut Tape (CT)
Description: DIODE UHF VAR CAP 30V SOT-23
Capacitance Ratio: 8.3
Voltage - Peak Reverse (Max): 30 V
Part Status: Obsolete
Supplier Device Package: SOT-23 (TO-236AB)
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Cut Tape (CT)
товару немає в наявності
В кошику
од. на суму грн.
| TJA1042AT/0Z |
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2500+ | 94.33 грн |
| NX20P5090UK041 |
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Виробник: NXP USA Inc.
Description: NX20P5090UK - BUFFER/INVERTER BA
Description: NX20P5090UK - BUFFER/INVERTER BA
товару немає в наявності
В кошику
од. на суму грн.
| MCF5272VM66 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 196-LBGA (15x15)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
Program Memory Type: ROM
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 1K x 32
Program Memory Size: 16KB (4K x 32)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Packaging: Tray
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 196-LBGA (15x15)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
Program Memory Type: ROM
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 1K x 32
Program Memory Size: 16KB (4K x 32)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MCF5206EAB40 |
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Виробник: NXP USA Inc.
Description: IC MPU MCF520X 40MHZ 160QFP
Part Status: Obsolete
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 160-QFP (28x28)
Voltage - I/O: 3.3V
Core Processor: Coldfire V2
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
Description: IC MPU MCF520X 40MHZ 160QFP
Part Status: Obsolete
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 160-QFP (28x28)
Voltage - I/O: 3.3V
Core Processor: Coldfire V2
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MRF24301HR5178 |
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Виробник: NXP USA Inc.
Description: 300W 32V RF POWER TRANSISTOR
Description: 300W 32V RF POWER TRANSISTOR
товару немає в наявності
В кошику
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| mpc8250aczumhbc |
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Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC82XX 266MHZ 480TBGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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| MPC8250ACVVMHBC |
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Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Part Status: Obsolete
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ 480TBGA
Part Status: Obsolete
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
товару немає в наявності
Мінімальне замовлення: 21 шт
В кошику
од. на суму грн.
| 74LV132N,112 |
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Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2IN 14DIP
Description: IC GATE NAND 4CH 2IN 14DIP
товару немає в наявності
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| 74LV367D,112 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16SO
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Supplier Device Package: 16-SO
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 2, 4 (Hex)
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Description: IC BUFFER NON-INVERT 3.6V 16SO
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Supplier Device Package: 16-SO
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 2, 4 (Hex)
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
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| 74LV367N,112 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16DIP
Part Status: Obsolete
Supplier Device Package: 16-DIP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 2, 4 (Hex)
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 16-DIP (0.300", 7.62mm)
Packaging: Tube
Description: IC BUFFER NON-INVERT 3.6V 16DIP
Part Status: Obsolete
Supplier Device Package: 16-DIP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 2, 4 (Hex)
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 16-DIP (0.300", 7.62mm)
Packaging: Tube
товару немає в наявності
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| SPC5603BF2CLL6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Description: IC MCU 32BIT 384KB FLASH 100LQFP
товару немає в наявності
Мінімальне замовлення: 450 шт
В кошику
од. на суму грн.
| PDTA113ZE,115 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 35 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 35 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
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| PDTA113EE,115 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Resistor - Emitter Base (R2): 1 kOhms
Resistor - Base (R1): 1 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 40mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 1.5mA, 30mA
Transistor Type: PNP - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Tape & Reel (TR)
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Resistor - Emitter Base (R2): 1 kOhms
Resistor - Base (R1): 1 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 40mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 1.5mA, 30mA
Transistor Type: PNP - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Tape & Reel (TR)
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| MC33665ATF4AE |
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Виробник: NXP USA Inc.
Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 249 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 740.04 грн |
| 10+ | 556.22 грн |
| 25+ | 517.27 грн |
| 100+ | 445.25 грн |
| A3I20D040WNR1 |
Виробник: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
товару немає в наявності
Мінімальне замовлення: 500 шт
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| A3I20D040WGNR1 |
Виробник: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
товару немає в наявності
Мінімальне замовлення: 500 шт
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| AFSC5G23D37T2 |
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Виробник: NXP USA Inc.
Description: AIRFAST PWR AMP 5G 27DB HLQFN26
Description: AIRFAST PWR AMP 5G 27DB HLQFN26
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| AFSC5G35D37T2 |
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Виробник: NXP USA Inc.
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Gain: 31dB
Voltage - Supply: 0V ~ 32V
RF Type: 5G, LTE
Frequency: 3.4GHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: 26-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 26-HLQFN (10x6)
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Gain: 31dB
Voltage - Supply: 0V ~ 32V
RF Type: 5G, LTE
Frequency: 3.4GHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: 26-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 26-HLQFN (10x6)
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Мінімальне замовлення: 2000 шт
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| AFSC5G35D37T2 |
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Виробник: NXP USA Inc.
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Supplier Device Package: 26-HLQFN (10x6)
Gain: 31dB
Voltage - Supply: 0V ~ 32V
RF Type: 5G, LTE
Frequency: 3.4GHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: 26-LQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Supplier Device Package: 26-HLQFN (10x6)
Gain: 31dB
Voltage - Supply: 0V ~ 32V
RF Type: 5G, LTE
Frequency: 3.4GHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: 26-LQFN Exposed Pad
Packaging: Cut Tape (CT)
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| A3I35D012WGNR1 |
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Виробник: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
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| PMGD130UN,115 |
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Виробник: NXP USA Inc.
Description: MOSFET 2N-CH 20V 1.2A 6TSSOP
Supplier Device Package: 6-TSSOP
Vgs(th) (Max) @ Id: 1V @ 250µA
FET Feature: Logic Level Gate
Gate Charge (Qg) (Max) @ Vgs: 1.3nC @ 4.5V
Rds On (Max) @ Id, Vgs: 145mOhm @ 1.2A, 4.5V
Input Capacitance (Ciss) (Max) @ Vds: 83pF @ 10V
Current - Continuous Drain (Id) @ 25°C: 1.2A
Drain to Source Voltage (Vdss): 20V
Power - Max: 390mW
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Configuration: 2 N-Channel (Dual)
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
Description: MOSFET 2N-CH 20V 1.2A 6TSSOP
Supplier Device Package: 6-TSSOP
Vgs(th) (Max) @ Id: 1V @ 250µA
FET Feature: Logic Level Gate
Gate Charge (Qg) (Max) @ Vgs: 1.3nC @ 4.5V
Rds On (Max) @ Id, Vgs: 145mOhm @ 1.2A, 4.5V
Input Capacitance (Ciss) (Max) @ Vds: 83pF @ 10V
Current - Continuous Drain (Id) @ 25°C: 1.2A
Drain to Source Voltage (Vdss): 20V
Power - Max: 390mW
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Configuration: 2 N-Channel (Dual)
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
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| MPC8255ACVVMHBB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Graphics Acceleration: No
Description: IC MPU MPC82XX 266MHZ 480TBGA
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Graphics Acceleration: No
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Мінімальне замовлення: 21 шт
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| MPC8347ECVRADDB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620BGA
Part Status: Active
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-PBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Bulk
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 266MHZ 620BGA
Part Status: Active
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-PBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Bulk
Additional Interfaces: DUART, I2C, PCI, SPI
на замовлення 22 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 7883.65 грн |
| LPC4310FBD144,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 168K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 168K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
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| 74AUP3G0434GD125 |
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Виробник: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Number of Circuits: 3
Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Number of Circuits: 3
на замовлення 92750 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1031+ | 21.02 грн |
| 74AUP3G0434DC125 |
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Виробник: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Number of Circuits: 3
Part Status: Active
Supplier Device Package: 8-VSSOP
Schmitt Trigger Input: No
Number of Inputs: 3 Input (2, 1)
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Buffer/Inverter
Mounting Type: Surface Mount
Output Type: Single-Ended
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Packaging: Bulk
Description: INVERTER, AUP/ULP/V SERIES
Number of Circuits: 3
Part Status: Active
Supplier Device Package: 8-VSSOP
Schmitt Trigger Input: No
Number of Inputs: 3 Input (2, 1)
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Buffer/Inverter
Mounting Type: Surface Mount
Output Type: Single-Ended
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Packaging: Bulk
на замовлення 2600 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 764+ | 28.27 грн |
| 74AUP3G0434GT115 |
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Виробник: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Supplier Device Package: 8-XSON (1.95x1)
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Supplier Device Package: 8-XSON (1.95x1)
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
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| 74AUP3G0434GS115 |
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Виробник: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Description: INVERTER, AUP/ULP/V SERIES
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| S9S12ZVL16F0VLC |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 19
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC MCU 16BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 19
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 1250 шт
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| S9S08SG4E2VTGR518 |
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Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
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| 74AXP1T34GS,125 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
на замовлення 4967 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2402+ | 9.43 грн |
| 74AXP1T34GN,125 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
на замовлення 3199 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1718+ | 13.36 грн |
| 74AXP1T34GN125 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
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| 74AXP1T34GM125 |
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Виробник: NXP USA Inc.
Description: 74AXP1T34GM - BUFFER, AXP SERIES
Part Status: Active
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 1
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
Description: 74AXP1T34GM - BUFFER, AXP SERIES
Part Status: Active
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 1
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
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| 74AXP1T34GS125 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
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| 74AXP1T34GW125 |
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Виробник: NXP USA Inc.
Description: 74AXP1T34GW - BUFFER, AXP SERIES
Description: 74AXP1T34GW - BUFFER, AXP SERIES
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| 74LV365N,112 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16DIP
Part Status: Obsolete
Supplier Device Package: 16-DIP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 6
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 16-DIP (0.300", 7.62mm)
Packaging: Tube
Description: IC BUFFER NON-INVERT 3.6V 16DIP
Part Status: Obsolete
Supplier Device Package: 16-DIP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 6
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 16-DIP (0.300", 7.62mm)
Packaging: Tube
на замовлення 1768 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 340+ | 68.19 грн |
| 74LV132DB,118 |
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Виробник: NXP USA Inc.
Description: NAND GATE, LV/LV-A/LVX/H SERIES,
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 9ns @ 5V, 50pF
Input Logic Level - Low: 0.3V ~ 1.2V
Input Logic Level - High: 1.4V ~ 3.9V
Supplier Device Package: 14-SSOP
Number of Inputs: 2
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Features: Schmitt Trigger
Packaging: Bulk
Description: NAND GATE, LV/LV-A/LVX/H SERIES,
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 9ns @ 5V, 50pF
Input Logic Level - Low: 0.3V ~ 1.2V
Input Logic Level - High: 1.4V ~ 3.9V
Supplier Device Package: 14-SSOP
Number of Inputs: 2
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Features: Schmitt Trigger
Packaging: Bulk
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1569+ | 13.81 грн |
| 74LV132DB,112 |
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Виробник: NXP USA Inc.
Description: NAND GATE, LV/LV-A/LVX/H SERIES,
Description: NAND GATE, LV/LV-A/LVX/H SERIES,
на замовлення 2492 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1443+ | 16.51 грн |
| 74ALVT162241DL,112 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Supplier Device Package: 48-SSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 4
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Supplier Device Package: 48-SSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 4
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 1581 шт
В кошику
од. на суму грн.
| FS32K116LAT0VLFT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
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| MCIMX6X3EVK10AC |
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Package / Case: 400-LFBGA
Packaging: Tray
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD, LVDS
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Package / Case: 400-LFBGA
Packaging: Tray
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD, LVDS
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
товару немає в наявності
Мінімальне замовлення: 760 шт
В кошику
од. на суму грн.
| MCIMX6X3EVK10ACR |
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD, LVDS
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD, LVDS
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| MCIMX6S4AVM08ABR |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 500 шт
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од. на суму грн.
| MC22XS4200BEK |
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Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:2 32HSOP
Description: IC PWR SWITCH N-CHAN 1:2 32HSOP
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| SL2S5302FTB115 |
Виробник: NXP USA Inc.
Description: ICODE SLIX-S SMART LABEL IC
Description: ICODE SLIX-S SMART LABEL IC
товару немає в наявності
Мінімальне замовлення: 997 шт
В кошику
од. на суму грн.
| A3V09H521-24SR6 |
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Виробник: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
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