Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35296) > Сторінка 457 з 589
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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| TDA18250AHN/C1,551 | NXP USA Inc. | Description: IC VIDEO SILICON TUNER |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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74HCT3G04DP-Q100125 | NXP USA Inc. |
Description: IC INVERTER 3CH 3-INP 8TSSOP |
на замовлення 2521 шт: термін постачання 21-31 дні (днів) |
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BGA3023Y | NXP USA Inc. |
Description: IC RF AMP CATV 40MHZ-1.2GHZ 8HSO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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BGA3023Y | NXP USA Inc. |
Description: IC RF AMP CATV 40MHZ-1.2GHZ 8HSO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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PZM5.6NB2,115 | NXP USA Inc. |
Description: DIODE ZENER 5.6V 300MW SMT3 Tolerance: ±2% Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 5.6 V Impedance (Max) (Zzt): 40 Ohms Supplier Device Package: SMT3; MPAK Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 2 µA @ 2.5 V |
на замовлення 501990 шт: термін постачання 21-31 дні (днів) |
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MCIMX6G2CVM05ABR | NXP USA Inc. |
Description: IC MPU I.MX6G 528MHZ 289MAPBGAPackaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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BUK6E2R0-30C127 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFETPackaging: Bulk Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 2.2mOhm @ 25A, 10V Power Dissipation (Max): 306W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: I2PAK Grade: Automotive Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 229 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 14964 pF @ 25 V Qualification: AEC-Q101 |
на замовлення 4728 шт: термін постачання 21-31 дні (днів) |
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BZX84-C24/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 24V 250MW SOT23Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 24 V Impedance (Max) (Zzt): 70 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V Qualification: AEC-Q101 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC35FS6500NAER2 | NXP USA Inc. |
Description: FS6500Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC9S08JS16LCFK557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| LS1027ASN7KQA | NXP USA Inc. | Description: LS1027A-1000 ST NO SEC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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LS1027ASE7NQA | NXP USA Inc. |
Description: IC MPU QORIQ 1.3GHZ 448FBGAPackaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Additional Interfaces: CANbus, I2C, SPI, UART Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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LS1017AXN7HNA | NXP USA Inc. |
Description: IC MPU QORIQ 800MHZ 448FBGAPackaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Additional Interfaces: CANbus, I2C, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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LS1017AXN7NQA | NXP USA Inc. |
Description: IC MPU QORIQ 1.3GHZ 448FBGAPackaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Additional Interfaces: CANbus, I2C, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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74AVC16T245DGG,112 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 48TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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SSTU32865ET/G,518 | NXP USA Inc. |
Description: IC REG BUFFER 28BIT 160-TFBGAPackaging: Bulk Package / Case: 160-TFBGA Mounting Type: Surface Mount Number of Bits: 28 Logic Type: 1:2 Registered Buffer with Parity Operating Temperature: 0°C ~ 70°C Supply Voltage: 1.7V ~ 1.9V Supplier Device Package: 160-TFBGA (13x9) Part Status: Obsolete |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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74LVTH244ADB,118 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 20SSOP |
на замовлення 2921 шт: термін постачання 21-31 дні (днів) |
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74LVTH244AD,118 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 20SO |
на замовлення 17890 шт: термін постачання 21-31 дні (днів) |
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| NXH3670ADK | NXP USA Inc. |
Description: NXH3670ADKPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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S9S08SL16F1MTJ | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC15XS3400DHFK557 | NXP USA Inc. |
Description: BUFFER/INVERTER BASED PERIPHERAL |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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NX3L4053HR,115 | NXP USA Inc. |
Description: IC SWITCH SPDTX3 800MOHM 16HXQFNPackaging: Bulk Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 800mOhm -3db Bandwidth: 60MHz Supplier Device Package: 16-HXQFN (3x3) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 100kHz Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 120mOhm Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Discontinued at Digi-Key Number of Circuits: 3 |
на замовлення 28091 шт: термін постачання 21-31 дні (днів) |
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| BUK9614-60E118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK9614-60E - POWER |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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S912XEQ512BMALR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFPPackaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| ASL5115EVBMST | NXP USA Inc. |
Description: ASL5115EVBMST Features: Dimmable Packaging: Bulk Voltage - Input: 4.5V ~ 5.5V Current - Output / Channel: 1.5A Utilized IC / Part: ASL5115 Supplied Contents: Board(s) Outputs and Type: 12, Non-Isolated Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| MK21FX512AVMD12 | NXP USA Inc. |
Description: KINETIS K21: 120MHZ CORTEX-M4F M |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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S9S12G240F0VLH | NXP USA Inc. |
Description: IC MCU 16BIT 240KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 240KB (240K x 8) RAM Size: 11K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: 12V1 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MKL33Z32VLK4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 80FQFPPackaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Part Status: Active Number of I/O: 70 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| SEN-GEN6-SKT | NXP USA Inc. | Description: SOCKET EVALUATION BOARD FOR FXLS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| MM912J637AM2EPR2564 | NXP USA Inc. |
Description: MM912 - MAGNIV S12 RELAY DRIVER, |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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SPC5673KAVMM1 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGAPackaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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SPC5673KAVMM1R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGAPackaging: Tape & Reel (TR) Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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74LVT241PW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVT SERIES, 4-BIT |
на замовлення 12500 шт: термін постачання 21-31 дні (днів) |
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74LVT240PW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVT SERIES, 4-BIT |
на замовлення 4800 шт: термін постачання 21-31 дні (днів) |
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FS32K142WAT0WLHT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 29x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
на замовлення 719 шт: термін постачання 21-31 дні (днів) |
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LD6806TD/14H,125 | NXP USA Inc. |
Description: IC REG LINEAR 1.4V 200MA 5TSOPPackaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 1.4V Control Features: Enable Part Status: Obsolete PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
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| MRF8VP13350NR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V OM780G-4Packaging: Tape & Reel (TR) Package / Case: OM-780G-4L Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 700MHz ~ 1.3GHz Power - Output: 350W Gain: 19.2dB Technology: LDMOS Supplier Device Package: OM-780G-4L Part Status: Active Voltage - Rated: 100 V Voltage - Test: 50 V Current - Test: 100 mA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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PBSS4260PAN | NXP USA Inc. |
Description: NOW NEXPERIA PBSS4260PAN - SMALL |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| PBSS4260PANPS115 | NXP USA Inc. |
Description: NOW NEXPERIA PBSS4260PANPS SMALL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| MF3D2200DU15/02V | NXP USA Inc. | Description: MIFARE SMART CARD DESFIRE EV2 XL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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74HCT4520DB,112 | NXP USA Inc. |
Description: BINARY COUNTER |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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74AHCT74PW112 | NXP USA Inc. |
Description: NOW NEXPERIA 74AHCT74PW - D FLIPPackaging: Bulk Part Status: Active |
на замовлення 5885 шт: термін постачання 21-31 дні (днів) |
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| A2I09VD050GNR1 | NXP USA Inc. |
Description: IC AMP GPS 575-960MHZ TO270WBGPackaging: Tape & Reel (TR) Package / Case: TO-270-15 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 575MHz ~ 960MHz RF Type: General Purpose Voltage - Supply: 48V ~ 55V Gain: 38dB Current - Supply: 240mA Test Frequency: 920MHz Supplier Device Package: TO-270WBG-15 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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MIMX8MN3CVPIZAA | NXP USA Inc. |
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGAPackaging: Tray Package / Case: 306-TFBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 306-TFBGA (11x11) Ethernet: GbE USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: I2C, PCIe, SDHC, SPI, UART |
на замовлення 123 шт: термін постачання 21-31 дні (днів) |
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LPC2470FET208,551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 208TFBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| K32L2B21VFM0A | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 32QFNPackaging: Tray Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.2V Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 32-QFN (5x5) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| K32L2B11VFM0A | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32QFNPackaging: Tray Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 32K x 8 Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.2V Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 32-QFN (5x5) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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PCA9547PW118 | NXP USA Inc. |
Description: IC MUX 8CH I2C BUS 24TSSOPPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| PCA9955BTW-ARD | NXP USA Inc. |
Description: PCA9955 EVK LED ARDPackaging: Bulk Function: LED Driver Type: Opto Contents: Board(s) Utilized IC / Part: PCA9955B Platform: Arduino Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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PESD3V3L5U115 | NXP USA Inc. |
Description: TVS DIODEPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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S912ZVML32F3VKH | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Number of I/O: 31 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| LPC1820FBD144K | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz RAM Size: 168K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b SAR; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 83 DigiKey Programmable: Not Verified |
на замовлення 300 шт: термін постачання 21-31 дні (днів) |
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MFRC53001T/0FE | NXP USA Inc. |
Description: IC MIFARE HS READER 32SO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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K32W041AMZ | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNPackaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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K32W041AMZ | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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SE98PW,118 | NXP USA Inc. |
Description: IC TEMP SENSOR I2C 8TSSOPPackaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: I²C/SMBus Mounting Type: Surface Mount Function: Temp Monitoring System (Sensor) Accuracy: ±4°C(Max) Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.7V ~ 3.6V Sensor Type: Internal Sensing Temperature: -40°C ~ 125°C Topology: ADC (Sigma Delta), Register Bank Output Alarm: Yes Output Fan: Yes Supplier Device Package: 8-TSSOP Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
|
FRDM665CANFDEVB | NXP USA Inc. |
Description: MC33665A CAN FD EVBPackaging: Box Function: CANbus Type: Interface Utilized IC / Part: MC33665A Supplied Contents: Board(s), Cable(s) Embedded: Yes, MCU Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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RD33775ACNCEVB | NXP USA Inc. |
Description: CAN FD CENTRALIZED EVBPackaging: Box Function: CANbus Type: Interface Contents: Board(s) Supplied Contents: Board(s) |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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| SAF7755HV/N205ZK | NXP USA Inc. | Description: DSP AUDIO MULTI-TUNER |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| SAF7755HV/N205ZY | NXP USA Inc. | Description: DSP AUDIO MULTI-TUNER |
товару немає в наявності |
В кошику од. на суму грн. |
| TDA18250AHN/C1,551 |
Виробник: NXP USA Inc.
Description: IC VIDEO SILICON TUNER
Description: IC VIDEO SILICON TUNER
товару немає в наявності
В кошику
од. на суму грн.
| 74HCT3G04DP-Q100125 |
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Виробник: NXP USA Inc.
Description: IC INVERTER 3CH 3-INP 8TSSOP
Description: IC INVERTER 3CH 3-INP 8TSSOP
на замовлення 2521 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1656+ | 14.84 грн |
| BGA3023Y |
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Виробник: NXP USA Inc.
Description: IC RF AMP CATV 40MHZ-1.2GHZ 8HSO
Description: IC RF AMP CATV 40MHZ-1.2GHZ 8HSO
товару немає в наявності
В кошику
од. на суму грн.
| BGA3023Y |
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Виробник: NXP USA Inc.
Description: IC RF AMP CATV 40MHZ-1.2GHZ 8HSO
Description: IC RF AMP CATV 40MHZ-1.2GHZ 8HSO
товару немає в наявності
В кошику
од. на суму грн.
| PZM5.6NB2,115 |
Виробник: NXP USA Inc.
Description: DIODE ZENER 5.6V 300MW SMT3
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SMT3; MPAK
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2.5 V
Description: DIODE ZENER 5.6V 300MW SMT3
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SMT3; MPAK
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2.5 V
на замовлення 501990 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 8876+ | 2.36 грн |
| MCIMX6G2CVM05ABR |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6G 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
Description: IC MPU I.MX6G 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| BUK6E2R0-30C127 |
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Виробник: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: I2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 229 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 14964 pF @ 25 V
Qualification: AEC-Q101
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: I2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 229 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 14964 pF @ 25 V
Qualification: AEC-Q101
на замовлення 4728 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 329+ | 68.54 грн |
| BZX84-C24/LF1VL |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 24V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 70 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
Qualification: AEC-Q101
Description: DIODE ZENER 24V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 70 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
Qualification: AEC-Q101
товару немає в наявності
В кошику
од. на суму грн.
| MC35FS6500NAER2 |
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Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
| MC9S08JS16LCFK557 |
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Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
товару немає в наявності
В кошику
од. на суму грн.
| LS1027ASN7KQA |
Виробник: NXP USA Inc.
Description: LS1027A-1000 ST NO SEC
Description: LS1027A-1000 ST NO SEC
товару немає в наявності
В кошику
од. на суму грн.
| LS1027ASE7NQA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| LS1017AXN7HNA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
товару немає в наявності
В кошику
од. на суму грн.
| LS1017AXN7NQA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
товару немає в наявності
В кошику
од. на суму грн.
| 74AVC16T245DGG,112 |
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Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 48TSSOP
Description: IC TRANSLATOR BIDIR 48TSSOP
товару немає в наявності
В кошику
од. на суму грн.
| SSTU32865ET/G,518 |
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Виробник: NXP USA Inc.
Description: IC REG BUFFER 28BIT 160-TFBGA
Packaging: Bulk
Package / Case: 160-TFBGA
Mounting Type: Surface Mount
Number of Bits: 28
Logic Type: 1:2 Registered Buffer with Parity
Operating Temperature: 0°C ~ 70°C
Supply Voltage: 1.7V ~ 1.9V
Supplier Device Package: 160-TFBGA (13x9)
Part Status: Obsolete
Description: IC REG BUFFER 28BIT 160-TFBGA
Packaging: Bulk
Package / Case: 160-TFBGA
Mounting Type: Surface Mount
Number of Bits: 28
Logic Type: 1:2 Registered Buffer with Parity
Operating Temperature: 0°C ~ 70°C
Supply Voltage: 1.7V ~ 1.9V
Supplier Device Package: 160-TFBGA (13x9)
Part Status: Obsolete
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 96+ | 247.53 грн |
| 74LVTH244ADB,118 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20SSOP
Description: IC BUFFER NON-INVERT 3.6V 20SSOP
на замовлення 2921 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1104+ | 21.87 грн |
| 74LVTH244AD,118 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20SO
Description: IC BUFFER NON-INVERT 3.6V 20SO
на замовлення 17890 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1303+ | 18.63 грн |
| S9S08SL16F1MTJ |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
товару немає в наявності
В кошику
од. на суму грн.
| MC15XS3400DHFK557 |
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Виробник: NXP USA Inc.
Description: BUFFER/INVERTER BASED PERIPHERAL
Description: BUFFER/INVERTER BASED PERIPHERAL
товару немає в наявності
В кошику
од. на суму грн.
| NX3L4053HR,115 |
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Виробник: NXP USA Inc.
Description: IC SWITCH SPDTX3 800MOHM 16HXQFN
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 800mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 120mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 3
Description: IC SWITCH SPDTX3 800MOHM 16HXQFN
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 800mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 120mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 3
на замовлення 28091 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 499+ | 47.26 грн |
| BUK9614-60E118 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BUK9614-60E - POWER
Description: NOW NEXPERIA BUK9614-60E - POWER
товару немає в наявності
В кошику
од. на суму грн.
| S912XEQ512BMALR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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| ASL5115EVBMST |
Виробник: NXP USA Inc.
Description: ASL5115EVBMST
Features: Dimmable
Packaging: Bulk
Voltage - Input: 4.5V ~ 5.5V
Current - Output / Channel: 1.5A
Utilized IC / Part: ASL5115
Supplied Contents: Board(s)
Outputs and Type: 12, Non-Isolated
Part Status: Active
Description: ASL5115EVBMST
Features: Dimmable
Packaging: Bulk
Voltage - Input: 4.5V ~ 5.5V
Current - Output / Channel: 1.5A
Utilized IC / Part: ASL5115
Supplied Contents: Board(s)
Outputs and Type: 12, Non-Isolated
Part Status: Active
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| MK21FX512AVMD12 |
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Виробник: NXP USA Inc.
Description: KINETIS K21: 120MHZ CORTEX-M4F M
Description: KINETIS K21: 120MHZ CORTEX-M4F M
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| S9S12G240F0VLH |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 240KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 240KB (240K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 240KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 240KB (240K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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| MKL33Z32VLK4 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
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| SEN-GEN6-SKT |
Виробник: NXP USA Inc.
Description: SOCKET EVALUATION BOARD FOR FXLS
Description: SOCKET EVALUATION BOARD FOR FXLS
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| MM912J637AM2EPR2564 |
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Виробник: NXP USA Inc.
Description: MM912 - MAGNIV S12 RELAY DRIVER,
Description: MM912 - MAGNIV S12 RELAY DRIVER,
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| SPC5673KAVMM1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
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| SPC5673KAVMM1R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
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| 74LVT241PW/AU118 |
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Виробник: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Description: BUS DRIVER, LVT SERIES, 4-BIT
на замовлення 12500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1312+ | 18.63 грн |
| 74LVT240PW/AU118 |
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Виробник: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Description: BUS DRIVER, LVT SERIES, 4-BIT
на замовлення 4800 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1312+ | 18.63 грн |
| FS32K142WAT0WLHT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 29x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 29x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 719 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 588.18 грн |
| 10+ | 481.67 грн |
| LD6806TD/14H,125 |
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Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.4V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.4V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3206+ | 7.43 грн |
| MRF8VP13350NR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 700MHz ~ 1.3GHz
Power - Output: 350W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 700MHz ~ 1.3GHz
Power - Output: 350W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
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| PBSS4260PAN |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PBSS4260PAN - SMALL
Description: NOW NEXPERIA PBSS4260PAN - SMALL
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| PBSS4260PANPS115 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PBSS4260PANPS SMALL
Description: NOW NEXPERIA PBSS4260PANPS SMALL
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| MF3D2200DU15/02V |
Виробник: NXP USA Inc.
Description: MIFARE SMART CARD DESFIRE EV2 XL
Description: MIFARE SMART CARD DESFIRE EV2 XL
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| 74HCT4520DB,112 |
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Виробник: NXP USA Inc.
Description: BINARY COUNTER
Description: BINARY COUNTER
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| 74AHCT74PW112 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT74PW - D FLIP
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74AHCT74PW - D FLIP
Packaging: Bulk
Part Status: Active
на замовлення 5885 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2377+ | 9.89 грн |
| A2I09VD050GNR1 |
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Виробник: NXP USA Inc.
Description: IC AMP GPS 575-960MHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 575MHz ~ 960MHz
RF Type: General Purpose
Voltage - Supply: 48V ~ 55V
Gain: 38dB
Current - Supply: 240mA
Test Frequency: 920MHz
Supplier Device Package: TO-270WBG-15
Description: IC AMP GPS 575-960MHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 575MHz ~ 960MHz
RF Type: General Purpose
Voltage - Supply: 48V ~ 55V
Gain: 38dB
Current - Supply: 240mA
Test Frequency: 920MHz
Supplier Device Package: TO-270WBG-15
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| MIMX8MN3CVPIZAA |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
на замовлення 123 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1787.66 грн |
| 10+ | 1384.48 грн |
| 25+ | 1300.25 грн |
| LPC2470FET208,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
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| K32L2B21VFM0A |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
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| K32L2B11VFM0A |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
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| PCA9955BTW-ARD |
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Виробник: NXP USA Inc.
Description: PCA9955 EVK LED ARD
Packaging: Bulk
Function: LED Driver
Type: Opto
Contents: Board(s)
Utilized IC / Part: PCA9955B
Platform: Arduino
Part Status: Active
Description: PCA9955 EVK LED ARD
Packaging: Bulk
Function: LED Driver
Type: Opto
Contents: Board(s)
Utilized IC / Part: PCA9955B
Platform: Arduino
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8436.03 грн |
| S912ZVML32F3VKH |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
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| LPC1820FBD144K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 300 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 828.57 грн |
| 10+ | 623.59 грн |
| 25+ | 580.04 грн |
| 80+ | 505.53 грн |
| 230+ | 479.72 грн |
| MFRC53001T/0FE |
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Виробник: NXP USA Inc.
Description: IC MIFARE HS READER 32SO
Description: IC MIFARE HS READER 32SO
товару немає в наявності
В кошику
од. на суму грн.
| K32W041AMZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1000+ | 326.63 грн |
| K32W041AMZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 526.22 грн |
| SE98PW,118 |
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Виробник: NXP USA Inc.
Description: IC TEMP SENSOR I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I²C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor)
Accuracy: ±4°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Description: IC TEMP SENSOR I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I²C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor)
Accuracy: ±4°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| FRDM665CANFDEVB |
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Виробник: NXP USA Inc.
Description: MC33665A CAN FD EVB
Packaging: Box
Function: CANbus
Type: Interface
Utilized IC / Part: MC33665A
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Part Status: Active
Description: MC33665A CAN FD EVB
Packaging: Box
Function: CANbus
Type: Interface
Utilized IC / Part: MC33665A
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 22913.26 грн |
| RD33775ACNCEVB |
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Виробник: NXP USA Inc.
Description: CAN FD CENTRALIZED EVB
Packaging: Box
Function: CANbus
Type: Interface
Contents: Board(s)
Supplied Contents: Board(s)
Description: CAN FD CENTRALIZED EVB
Packaging: Box
Function: CANbus
Type: Interface
Contents: Board(s)
Supplied Contents: Board(s)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 34057.22 грн |
| SAF7755HV/N205ZK |
Виробник: NXP USA Inc.
Description: DSP AUDIO MULTI-TUNER
Description: DSP AUDIO MULTI-TUNER
товару немає в наявності
В кошику
од. на суму грн.
| SAF7755HV/N205ZY |
Виробник: NXP USA Inc.
Description: DSP AUDIO MULTI-TUNER
Description: DSP AUDIO MULTI-TUNER
товару немає в наявності
В кошику
од. на суму грн.














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