Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35486) > Сторінка 463 з 592
Фото | Назва | Виробник | Інформація |
Доступність |
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LPC1820FBD144K | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz RAM Size: 168K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b SAR; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 83 DigiKey Programmable: Not Verified |
на замовлення 300 шт: термін постачання 21-31 дні (днів) |
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MFRC53001T/0FE | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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K32W041AMZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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K32W041AMZ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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SE98PW,118 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: I²C/SMBus Mounting Type: Surface Mount Function: Temp Monitoring System (Sensor) Accuracy: ±4°C(Max) Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.7V ~ 3.6V Sensor Type: Internal Sensing Temperature: -40°C ~ 125°C Topology: ADC (Sigma Delta), Register Bank Output Alarm: Yes Output Fan: Yes Supplier Device Package: 8-TSSOP Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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FRDM665CANFDEVB | NXP USA Inc. |
![]() Packaging: Box Function: CANbus Type: Interface Utilized IC / Part: MC33665A Supplied Contents: Board(s), Cable(s) Embedded: Yes, MCU Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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RD33775ACNCEVB | NXP USA Inc. |
![]() Packaging: Box Function: CANbus Type: Interface Contents: Board(s) Supplied Contents: Board(s) |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SAF7755HV/N205ZK | NXP USA Inc. | Description: DSP AUDIO MULTI-TUNER |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF7755HV/N205ZY | NXP USA Inc. | Description: DSP AUDIO MULTI-TUNER |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MC9S08GT32ACFDE | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74ALVCH162827DGG518 | NXP USA Inc. |
![]() Packaging: Bulk |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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74ALVCH162827DGG118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 56-TFSOP (0.240", 6.10mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 3.6V Number of Bits per Element: 10 Current - Output High, Low: 12mA, 12mA Supplier Device Package: 56-TSSOP Part Status: Active |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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74ALVT162827DGG | NXP USA Inc. |
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на замовлення 161 шт: термін постачання 21-31 дні (днів) |
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MCHC912B32VFUE8-NXP | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 768 x 8 Core Processor: CPU12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 63 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MC908AP48CFBER528 | NXP USA Inc. | Description: MICROCONTROLLER, 8-BIT, HC08/S08 |
на замовлення 2250 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
MPC8544EVTANGA | NXP USA Inc. |
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на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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FRDMGD31RPEVM | NXP USA Inc. |
![]() Packaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: GD3160, KL25Z Supplied Contents: Board(s), Cable(s) Primary Attributes: 1-Channel (Single) Embedded: Yes, MCU Part Status: Active Secondary Attributes: SPI/USB Interface(s) Contents: Board(s), Cable(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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PNX9535E/V1518 | NXP USA Inc. |
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на замовлення 400 шт: термін постачання 21-31 дні (днів) |
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74LV393D118 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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LPC1115FBD48/303 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LPC1115FBD48/303151 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 42 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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FS32K148HFT0VLLT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 89 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9S08AW32CFDER | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 38 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCSPTR2A5775E | NXP USA Inc. |
![]() Packaging: Bulk Mounting Type: Socket Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: eTPU Utilized IC / Part: FS6520, MC33937, MPC5775E |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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MC9S08FL8CBM | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 32-SDIP (0.400", 10.16mm) Mounting Type: Through Hole Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI Peripherals: LVD, PWM, WDT Supplier Device Package: 32-SDIP Part Status: Obsolete Number of I/O: 30 |
на замовлення 893 шт: термін постачання 21-31 дні (днів) |
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CGY888C,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: SOT-115J Mounting Type: Chassis Mount Applications: CATV Supplier Device Package: SOT115J Number of Circuits: 1 Current - Supply: 280 mA |
на замовлення 5553 шт: термін постачання 21-31 дні (днів) |
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PCA85263ATL-ARD | NXP USA Inc. | Description: PCF85263 EVAL BOARD ARDUINO |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
MCIMX6QP4AVT1AB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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SPC5603BK0MLQ6 | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 36x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 123 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9S12XA256VAA | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: EBI/EMI, I²C, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 59 DigiKey Programmable: Not Verified |
на замовлення 70 шт: термін постачання 21-31 дні (днів) |
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MC9S08PA8VLC-NXP | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9S08PT16VLC-NXP | NXP USA Inc. |
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на замовлення 1254 шт: термін постачання 21-31 дні (днів) |
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74HCT2G66GT,115 | NXP USA Inc. |
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на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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74HCT2G66DC,125 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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NX3L2G66GD | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
74LVCV2G66GT115 | NXP USA Inc. |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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SPC5742PK1AMLQ5 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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SPC5643LFAMMM1R | NXP USA Inc. | Description: IC MCU 32BIT 1MB FLASH 257MAPBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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SPC5643LFAMMM1 | NXP USA Inc. | Description: IC MCU 32BIT 1MB FLASH 257MAPBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LPC4310FET100 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 168K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 4x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 49 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9S08FL8CLCR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI Peripherals: LVD, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 30 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
RDGD3160I3PH5EVB | NXP USA Inc. |
Description: 3-PHASE REF DESIGN GD3160 Packaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: FS6500, GD3160, MPC5777C Supplied Contents: Board(s) Embedded: Yes, MCU |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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KITFS6507LAEEVM | NXP USA Inc. |
Description: FS6507 EVAL BOARD Packaging: Box Function: System Basis Chip (SBC) Type: Interface Utilized IC / Part: FS6507 Supplied Contents: Board(s) Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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XC7SET125GM,132 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
74LVC2G125GF115 | NXP USA Inc. |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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S912XET256BVAL | NXP USA Inc. | Description: IC MCU 16BIT 256KB FLASH 112LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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NX5DV330D,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: Video On-State Resistance (Max): 10Ohm -3db Bandwidth: 300MHz Supplier Device Package: 16-SO Voltage - Supply, Single (V+): 4V ~ 5.5V Multiplexer/Demultiplexer Circuit: 2:1 Number of Channels: 4 |
на замовлення 9354 шт: термін постачання 21-31 дні (днів) |
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NX5DV330PW,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: Video On-State Resistance (Max): 10Ohm -3db Bandwidth: 300MHz Supplier Device Package: 16-TSSOP Voltage - Supply, Single (V+): 4V ~ 5.5V Multiplexer/Demultiplexer Circuit: 2:1 Number of Channels: 4 |
на замовлення 17253 шт: термін постачання 21-31 дні (днів) |
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NX5DV330D,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: Video On-State Resistance (Max): 10Ohm -3db Bandwidth: 300MHz Supplier Device Package: 16-SO Voltage - Supply, Single (V+): 4V ~ 5.5V Multiplexer/Demultiplexer Circuit: 2:1 Number of Channels: 4 |
на замовлення 5024 шт: термін постачання 21-31 дні (днів) |
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SPC5747CBK0AVKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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SPC5605BK0CLQ4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 121 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PCF2131TFY | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Alarm, Leap Year, Watchdog Timer Package / Case: 16-LFDFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Interface: I2C, SPI Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.2V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 16-HLSON (4.5x3.5) Voltage - Supply, Battery: 1.2V ~ 5.5V Current - Timekeeping (Max): 770nA ~ 2.135µA @ 1.2V ~ 5.5V Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 2650 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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PCF2131TFY | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Features: Alarm, Leap Year, Watchdog Timer Package / Case: 16-LFDFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Interface: I2C, SPI Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.2V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 16-HLSON (4.5x3.5) Voltage - Supply, Battery: 1.2V ~ 5.5V Current - Timekeeping (Max): 770nA ~ 2.135µA @ 1.2V ~ 5.5V Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 2837 шт: термін постачання 21-31 дні (днів) |
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S9S12Q12J2VFAE1R | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 128KB (128K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Not For New Designs Number of I/O: 31 DigiKey Programmable: Not Verified |
на замовлення 8932 шт: термін постачання 21-31 дні (днів) |
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NX30P0121UKAZ | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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TJR1441BTK/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 175°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 50 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TJR1441DTK/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 175°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 50 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PESD2NFC-SF315 | NXP USA Inc. | Description: NOW NEXPERIA PESD2NFC - NFC ANTE |
на замовлення 99000 шт: термін постачання 21-31 дні (днів) |
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PMEG1201AESF315 | NXP USA Inc. |
Description: RECTIFIER DIODE, SOD962 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PMEG3005AESF315 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. |
LPC1820FBD144K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 300 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 805.43 грн |
10+ | 606.17 грн |
25+ | 563.84 грн |
80+ | 491.41 грн |
230+ | 466.33 грн |
MFRC53001T/0FE |
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Виробник: NXP USA Inc.
Description: IC MIFARE HS READER 32SO
Description: IC MIFARE HS READER 32SO
товару немає в наявності
В кошику
од. на суму грн.
K32W041AMZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1000+ | 317.51 грн |
K32W041AMZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 511.52 грн |
SE98PW,118 |
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Виробник: NXP USA Inc.
Description: IC TEMP SENSOR I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I²C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor)
Accuracy: ±4°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Description: IC TEMP SENSOR I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I²C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor)
Accuracy: ±4°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
FRDM665CANFDEVB |
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Виробник: NXP USA Inc.
Description: MC33665A CAN FD EVB
Packaging: Box
Function: CANbus
Type: Interface
Utilized IC / Part: MC33665A
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Part Status: Active
Description: MC33665A CAN FD EVB
Packaging: Box
Function: CANbus
Type: Interface
Utilized IC / Part: MC33665A
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 22273.29 грн |
RD33775ACNCEVB |
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Виробник: NXP USA Inc.
Description: CAN FD CENTRALIZED EVB
Packaging: Box
Function: CANbus
Type: Interface
Contents: Board(s)
Supplied Contents: Board(s)
Description: CAN FD CENTRALIZED EVB
Packaging: Box
Function: CANbus
Type: Interface
Contents: Board(s)
Supplied Contents: Board(s)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 33105.99 грн |
SAF7755HV/N205ZK |
Виробник: NXP USA Inc.
Description: DSP AUDIO MULTI-TUNER
Description: DSP AUDIO MULTI-TUNER
товару немає в наявності
В кошику
од. на суму грн.
SAF7755HV/N205ZY |
Виробник: NXP USA Inc.
Description: DSP AUDIO MULTI-TUNER
Description: DSP AUDIO MULTI-TUNER
товару немає в наявності
В кошику
од. на суму грн.
MC9S08GT32ACFDE |
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Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
товару немає в наявності
В кошику
од. на суму грн.
74ALVCH162827DGG518 |
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на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
355+ | 68.26 грн |
74ALVCH162827DGG118 |
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Виробник: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Number of Bits per Element: 10
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 56-TSSOP
Part Status: Active
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Number of Bits per Element: 10
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 56-TSSOP
Part Status: Active
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
364+ | 63.80 грн |
74ALVT162827DGG |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74ALVT162827DGG - B
Description: NOW NEXPERIA 74ALVT162827DGG - B
на замовлення 161 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
79+ | 306.23 грн |
MCHC912B32VFUE8-NXP |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 63
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 63
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MC908AP48CFBER528 |
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
на замовлення 2250 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
MPC8544EVTANGA |
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Виробник: NXP USA Inc.
Description: POWERQUICC RISC MICROPROCESSORS,
Description: POWERQUICC RISC MICROPROCESSORS,
на замовлення 11 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 9275.92 грн |
FRDMGD31RPEVM |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Part Status: Active
Secondary Attributes: SPI/USB Interface(s)
Contents: Board(s), Cable(s)
Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Part Status: Active
Secondary Attributes: SPI/USB Interface(s)
Contents: Board(s), Cable(s)
товару немає в наявності
В кошику
од. на суму грн.
PNX9535E/V1518 |
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Виробник: NXP USA Inc.
Description: SOFTWARE ENABLED VIDEO AND MULTI
Description: SOFTWARE ENABLED VIDEO AND MULTI
на замовлення 400 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
17+ | 1415.72 грн |
74LV393D118 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74LV393D - BINARY C
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74LV393D - BINARY C
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
LPC1115FBD48/303 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Description: IC MCU 32BIT 64KB FLASH 48LQFP
товару немає в наявності
В кошику
од. на суму грн.
LPC1115FBD48/303151 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
товару немає в наявності
В кошику
од. на суму грн.
FS32K148HFT0VLLT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MC9S08AW32CFDER |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MCSPTR2A5775E |
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Виробник: NXP USA Inc.
Description: MPC5775E DEV KIT FOR PMSM MOTOR
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: eTPU
Utilized IC / Part: FS6520, MC33937, MPC5775E
Description: MPC5775E DEV KIT FOR PMSM MOTOR
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: eTPU
Utilized IC / Part: FS6520, MC33937, MPC5775E
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 129551.58 грн |
MC9S08FL8CBM |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32SDIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-SDIP
Part Status: Obsolete
Number of I/O: 30
Description: IC MCU 8BIT 8KB FLASH 32SDIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-SDIP
Part Status: Obsolete
Number of I/O: 30
на замовлення 893 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
283+ | 132.95 грн |
CGY888C,112 |
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Виробник: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 280 mA
Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 280 mA
на замовлення 5553 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
14+ | 1681.86 грн |
PCA85263ATL-ARD |
Виробник: NXP USA Inc.
Description: PCF85263 EVAL BOARD ARDUINO
Description: PCF85263 EVAL BOARD ARDUINO
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MCIMX6QP4AVT1AB |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
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SPC5603BK0MLQ6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
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MC9S12XA256VAA |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
на замовлення 70 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
11+ | 2349.63 грн |
MC9S08PA8VLC-NXP |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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MC9S08PT16VLC-NXP |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Description: IC MCU 8BIT 16KB FLASH 32LQFP
на замовлення 1254 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
152+ | 160.49 грн |
74HCT2G66GT,115 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74HCT2G66GT - SPST,
Description: NOW NEXPERIA 74HCT2G66GT - SPST,
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1502+ | 15.49 грн |
74HCT2G66DC,125 |
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Виробник: NXP USA Inc.
Description: 74HCT2G66 - DUAL SINGLE-POLE SIN
Description: 74HCT2G66 - DUAL SINGLE-POLE SIN
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NX3L2G66GD |
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Виробник: NXP USA Inc.
Description: MULTIPLEXERS/SWITCHES, 2 FUNC, C
Description: MULTIPLEXERS/SWITCHES, 2 FUNC, C
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SPC5742PK1AMLQ5 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
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SPC5643LFAMMM1R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
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SPC5643LFAMMM1 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
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LPC4310FET100 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
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MC9S08FL8CLCR |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 30
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 30
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RDGD3160I3PH5EVB |
Виробник: NXP USA Inc.
Description: 3-PHASE REF DESIGN GD3160
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: FS6500, GD3160, MPC5777C
Supplied Contents: Board(s)
Embedded: Yes, MCU
Description: 3-PHASE REF DESIGN GD3160
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: FS6500, GD3160, MPC5777C
Supplied Contents: Board(s)
Embedded: Yes, MCU
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 83986.77 грн |
KITFS6507LAEEVM |
Виробник: NXP USA Inc.
Description: FS6507 EVAL BOARD
Packaging: Box
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS6507
Supplied Contents: Board(s)
Part Status: Active
Description: FS6507 EVAL BOARD
Packaging: Box
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS6507
Supplied Contents: Board(s)
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 24483.19 грн |
XC7SET125GM,132 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 6XSON
Description: IC BUFFER NON-INVERT 5.5V 6XSON
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S912XET256BVAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Description: IC MCU 16BIT 256KB FLASH 112LQFP
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NX5DV330D,118 |
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Виробник: NXP USA Inc.
Description: IC VIDEO MUX/DEMUX 1X2 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
Description: IC VIDEO MUX/DEMUX 1X2 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
на замовлення 9354 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
952+ | 24.65 грн |
NX5DV330PW,112 |
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Виробник: NXP USA Inc.
Description: IC VIDEO MUX/DEMUX 1X2 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
Description: IC VIDEO MUX/DEMUX 1X2 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
на замовлення 17253 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
952+ | 23.49 грн |
NX5DV330D,112 |
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Виробник: NXP USA Inc.
Description: IC VIDEO MUX/DEMUX 1X2 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
Description: IC VIDEO MUX/DEMUX 1X2 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
на замовлення 5024 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
720+ | 32.36 грн |
SPC5747CBK0AVKU6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5605BK0CLQ4 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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PCF2131TFY |
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Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 16HLSON
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 16-LFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HLSON (4.5x3.5)
Voltage - Supply, Battery: 1.2V ~ 5.5V
Current - Timekeeping (Max): 770nA ~ 2.135µA @ 1.2V ~ 5.5V
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RTC CLK/CALENDAR I2C 16HLSON
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 16-LFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HLSON (4.5x3.5)
Voltage - Supply, Battery: 1.2V ~ 5.5V
Current - Timekeeping (Max): 770nA ~ 2.135µA @ 1.2V ~ 5.5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2650 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
PCF2131TFY |
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Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 16HLSON
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 16-LFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HLSON (4.5x3.5)
Voltage - Supply, Battery: 1.2V ~ 5.5V
Current - Timekeeping (Max): 770nA ~ 2.135µA @ 1.2V ~ 5.5V
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RTC CLK/CALENDAR I2C 16HLSON
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 16-LFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HLSON (4.5x3.5)
Voltage - Supply, Battery: 1.2V ~ 5.5V
Current - Timekeeping (Max): 770nA ~ 2.135µA @ 1.2V ~ 5.5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2837 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 220.83 грн |
10+ | 159.37 грн |
25+ | 146.03 грн |
100+ | 123.31 грн |
250+ | 116.76 грн |
500+ | 112.81 грн |
1000+ | 107.76 грн |
S9S12Q12J2VFAE1R |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
на замовлення 8932 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
16+ | 1408.54 грн |
NX30P0121UKAZ |
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Виробник: NXP USA Inc.
Description: COMPANION BACK TO BACK OVP SWITC
Description: COMPANION BACK TO BACK OVP SWITC
товару немає в наявності
В кошику
од. на суму грн.
TJR1441BTK/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
TJR1441DTK/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
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од. на суму грн.
PESD2NFC-SF315 |
Виробник: NXP USA Inc.
Description: NOW NEXPERIA PESD2NFC - NFC ANTE
Description: NOW NEXPERIA PESD2NFC - NFC ANTE
на замовлення 99000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3606+ | 6.48 грн |
PMEG3005AESF315 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PMEG3005AE RECTIFIE
Description: NOW NEXPERIA PMEG3005AE RECTIFIE
товару немає в наявності
В кошику
од. на суму грн.