Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36389) > Сторінка 462 з 607
| Фото | Назва | Виробник | Інформація |
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CBT3384PW,112 | NXP USA Inc. |
Description: IC BUS SWITCH 5 X 1:1 24TSSOPPart Status: Active Supplier Device Package: 24-TSSOP Voltage Supply Source: Single Supply Independent Circuits: 2 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Type: Bus Switch Circuit: 5 x 1:1 Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Packaging: Bulk |
на замовлення 3150 шт: термін постачання 21-31 дні (днів) |
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CBTD3384D,118 | NXP USA Inc. |
Description: IC BUS SWITCH 5 X 1:1 24SOVoltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Type: Bus Switch Circuit: 5 x 1:1 Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Packaging: Bulk Part Status: Active Supplier Device Package: 24-SO Voltage Supply Source: Single Supply Independent Circuits: 2 |
на замовлення 3183 шт: термін постачання 21-31 дні (днів) |
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| DEMO-BYL1-EVB | NXP USA Inc. |
Description: EVAL BOARD FOR FS8500 Contents: Board(s), Cable(s) Part Status: Active Supplied Contents: Board(s), Cable(s) Utilized IC / Part: FS8500, PF5020, PF5024 Type: Power Management Function: Special Purpose: Mobiles Packaging: Bulk |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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MC33FS8530A0ES | NXP USA Inc. |
Description: SYSTEM BASIS CHIP FS8500Part Status: Active Supplier Device Package: 56-HVQFN (8x8) Current - Supply: 15mA Applications: System Basis Chip Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tray |
на замовлення 160 шт: термін постачання 21-31 дні (днів) |
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S912XDT256F1MAL | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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SPC5644BK0MLU8R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP DigiKey Programmable: Not Verified Number of I/O: 147 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 27x10b, 5x12b Core Processor: e200z4d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 128K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC33PF8200ESESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX8 PRE-PR |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC56F84789VLL557 | NXP USA Inc. |
Description: MICROCONTROLLER 32-BIT FLASH |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74LVC3G06GN,115 | NXP USA Inc. |
Description: IC INVERTER OD 3CH 3-INP 8XSON |
на замовлення 189977 шт: термін постачання 21-31 дні (днів) |
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BGA2851,115 | NXP USA Inc. |
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOPSupplier Device Package: 6-TSSOP Test Frequency: 2.15GHz P1dB: -5dBm Noise Figure: 3dB Current - Supply: 7mA Gain: 25.2dB Voltage - Supply: 4.5V ~ 5.5V RF Type: General Purpose Frequency: 0Hz ~ 2.2GHz Mounting Type: Surface Mount Package / Case: 6-TSSOP, SC-88, SOT-363 Packaging: Cut Tape (CT) |
на замовлення 8637 шт: термін постачання 21-31 дні (днів) |
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BGA2815,115 | NXP USA Inc. |
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOPRF Type: General Purpose Frequency: 0Hz ~ 2.2GHz Mounting Type: Surface Mount Package / Case: 6-TSSOP, SC-88, SOT-363 Packaging: Cut Tape (CT) Part Status: Active Supplier Device Package: 6-TSSOP Test Frequency: 2.15GHz P1dB: 1dBm Noise Figure: 3.7dB Current - Supply: 55mA Gain: 25.2dB Voltage - Supply: 3V ~ 3.6V |
на замовлення 2984 шт: термін постачання 21-31 дні (днів) |
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| MIMXRT117HCVM8A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 800MHz RAM Size: 2M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4, Cortex®-M7 Data Converters: A/D 20x12b SAR; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active Number of I/O: 13 DigiKey Programmable: Not Verified |
на замовлення 728 шт: термін постачання 21-31 дні (днів) |
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| BGA2866 | NXP USA Inc. |
Description: WIDE BAND LOW POWER AMPLIFIER 0DigiKey Programmable: Not Verified Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BGA2866115 | NXP USA Inc. |
Description: WIDE BAND LOW POWER AMPLIFIER 0 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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BGA2850,115 | NXP USA Inc. |
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOPPart Status: Obsolete Supplier Device Package: 6-TSSOP Test Frequency: 2.15GHz P1dB: -2dBm Noise Figure: 4dB Current - Supply: 36mA Gain: 22.9dB Voltage - Supply: 4.5V ~ 5.5V RF Type: General Purpose Frequency: 0Hz ~ 2.2GHz Mounting Type: Surface Mount Package / Case: 6-TSSOP, SC-88, SOT-363 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCF5270VM100 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196MAPBGAPackaging: Tray Package / Case: 196-LBGA Mounting Type: Surface Mount Speed: 100MHz RAM Size: 64K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, WDT Supplier Device Package: 196-LBGA (15x15) Part Status: Not For New Designs Number of I/O: 61 DigiKey Programmable: Not Verified |
на замовлення 330 шт: термін постачання 21-31 дні (днів) |
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S912ZVCA19F0WKH | NXP USA Inc. |
Description: IC MCU 16BIT 192KB FLASH 64LQFPQualification: AEC-Q100 DigiKey Programmable: Not Verified Number of I/O: 42 Grade: Automotive Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Core Size: 16-Bit Data Converters: A/D 16x12b; D/A 1x8b Core Processor: S12Z EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) RAM Size: 12K x 8 Program Memory Size: 192KB (192K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TDA8023TT/C1,118 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28TSSOPPackage / Case: 28-TSSOP (0.173", 4.40mm Width) Packaging: Tape & Reel (TR) Part Status: Obsolete Supplier Device Package: 28-TSSOP Voltage - Supply: 2.7V ~ 6.5V Interface: I2C Mounting Type: Surface Mount |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TDA8023TT/C1,118 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28TSSOPSupplier Device Package: 28-TSSOP Voltage - Supply: 2.7V ~ 6.5V Interface: I2C Mounting Type: Surface Mount Package / Case: 28-TSSOP (0.173", 4.40mm Width) Packaging: Cut Tape (CT) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74LV4020N,112 | NXP USA Inc. |
Description: IC 14BIT BINARY RIPPLE 16-DIP |
на замовлення 547 шт: термін постачання 21-31 дні (днів) |
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| MIMXRT117HDVMAA | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 800MHz RAM Size: 2M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4, Cortex®-M7 Data Converters: A/D 20x12b SAR; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active Number of I/O: 13 DigiKey Programmable: Not Verified |
на замовлення 369 шт: термін постачання 21-31 дні (днів) |
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MPC8314ECVRAFDA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 620HBGAPackaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9S12C32VFAE16 | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 31 DigiKey Programmable: Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9S08QB4CWL | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 28SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| LS2088ASE7QQB | NXP USA Inc. | Description: LS2088A ST WE 1600 R1.1 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MRFX1K80H-64MHZ | NXP USA Inc. |
Description: MRFX1K80H REF BRD 64MHZ 1800WUtilized IC / Part: MRFX1K80H Contents: Board(s) Supplied Contents: Board(s) Type: Transistor Frequency: 64MHz For Use With/Related Products: MRFX1K80H Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| MRFX1K80HR5178 | NXP USA Inc. |
Description: WIDEBAND RF POWER TRANSISTOR, 18 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MRFX1K80H-VHFDHY | NXP USA Inc. |
Description: MRFX1K80H REF BRD 230MHZ 1200WUtilized IC / Part: MRFX1K80H Contents: Board(s) Type: Transistor Frequency: 174MHz ~ 230MHz For Use With/Related Products: MRFX1K80H Packaging: Bulk Supplied Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MRFX1K80N-230MHZ | NXP USA Inc. |
Description: MRFX1K80N REF BOARD - 230MHZPackaging: Bulk Part Status: Active Supplied Contents: Board(s) Type: Transistor Frequency: 230MHz For Use With/Related Products: MRFX1K80N Utilized IC / Part: MRFX1K80N Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| A5G26H110NT4 | NXP USA Inc. |
Description: RF MOSFET GAN 48V 6DFNPackage / Case: 6-LDFN Exposed Pad Packaging: Tape & Reel (TR) Current - Test: 50 mA Voltage - Test: 48 V Voltage - Rated: 125 V Part Status: Active Supplier Device Package: 6-PDFN (7x6.5) Technology: GaN Gain: 17.7dB Power - Output: 15W Frequency: 2.496GHz ~ 2.69GHz Mounting Type: Surface Mount |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| A5G37H110NT4 | NXP USA Inc. |
Description: RF MOSFET GAN 48V 6DFNPackaging: Tape & Reel (TR) Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.6GHz ~ 3.8GHz Power - Output: 13.5W Gain: 15.1dB Technology: GaN Supplier Device Package: 6-PDFN (7x6.5) Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 70 mA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| A5G35H110NT4 | NXP USA Inc. |
Description: AIRFAST RF POWER GAN TRANSISTOR, |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MC9S08SH16CTG,574 | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 16TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9S08SH16CTLR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 28TSSOPDigiKey Programmable: Not Verified Number of I/O: 23 Supplier Device Package: 28-TSSOP Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 28-TSSOP (0.173", 4.40mm Width) Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| MRF9002NR2 | NXP USA Inc. |
Description: RF MOSFET LDMOS 26V 16PFP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PXLS83333AESR2 | NXP USA Inc. |
Description: 2 AXIS HI/HI XY Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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PSMN7R5-25YLC,115 | NXP USA Inc. |
Description: MOSFET N-CH 25V 56A LFPAK56 Part Status: Obsolete Supplier Device Package: LFPAK56, Power-SO8 Vgs(th) (Max) @ Id: 1.95V @ 1mA Power Dissipation (Max): 42W (Tc) Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V Current - Continuous Drain (Id) @ 25°C: 56A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Package / Case: SC-100, SOT-669 Packaging: Tape & Reel (TR) Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V Drain to Source Voltage (Vdss): 25 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PSMN7R5-25YLC,115 | NXP USA Inc. |
Description: MOSFET N-CH 25V 56A LFPAK56 Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V Drain to Source Voltage (Vdss): 25 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Part Status: Obsolete Supplier Device Package: LFPAK56, Power-SO8 Vgs(th) (Max) @ Id: 1.95V @ 1mA Power Dissipation (Max): 42W (Tc) Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V Current - Continuous Drain (Id) @ 25°C: 56A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Package / Case: SC-100, SOT-669 Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| NCF2922AHN3/0212CY | NXP USA Inc. |
Description: RECEIVER 014 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| FRDMPKPT2000EVM | NXP USA Inc. |
Description: FREEDOM BOARD KIT - PT2000 PROG Embedded: Yes, MCU, 32-Bit Supplied Contents: Board(s) Utilized IC / Part: PT2000 Type: Power Management Function: Gate Driver Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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S9S12HY64J0CLLR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 100LQFPNumber of I/O: 80 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: LCD, Motor control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: HCS12 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Cut Tape (CT) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC68LK332GCAG16-NXP | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PEMI1QFN/RP,315 | NXP USA Inc. |
Description: FILTER RC(PI) 100 OHM/18.5PF SMDTechnology: RC (Pi) Applications: LAN, PCS, WAN Filter Order: 2nd Attenuation Value: 23dB @ 800MHz ~ 3GHz Height: 0.020" (0.50mm) Values: R = 100Ohms, C = 18.5pF (Total) Operating Temperature: -40°C ~ 85°C Type: Low Pass Mounting Type: Surface Mount Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm) Package / Case: SC-101, SOT-883 Packaging: Tape & Reel (TR) Number of Channels: 1 Part Status: Obsolete ESD Protection: Yes Resistance - Channel (Ohms): 100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74AHCT2G126GD,125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 8XSONPart Status: Active Supplier Device Package: 8-XSON (2x3) Current - Output High, Low: 8mA, 8mA Number of Bits per Element: 1 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 2 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 8-XFDFN Packaging: Bulk |
на замовлення 68069 шт: термін постачання 21-31 дні (днів) |
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| 74AHCT2G241DP125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 8TSSOPPart Status: Active Supplier Device Package: 8-TSSOP Current - Output High, Low: 8mA, 8mA Number of Bits per Element: 1 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 2 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Packaging: Bulk |
на замовлення 3087 шт: термін постачання 21-31 дні (днів) |
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| 74AHCT2G125GD,125-NX | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 8XSON Part Status: Active Supplier Device Package: 8-XSON (2x3) Current - Output High, Low: 8mA, 8mA Number of Bits per Element: 1 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 2 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 8-XFDFN Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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LD6836TD/36H,125 | NXP USA Inc. |
Description: IC REG LINEAR 3.6V 300MA 5TSOP |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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LD6836TD/22H,125 | NXP USA Inc. |
Description: IC REG LINEAR 2.2V 300MA 5TSOPProtection Features: Over Current, Over Temperature Voltage Dropout (Max): 0.2V @ 300mA PSRR: 55dB (1kHz) Part Status: Obsolete Control Features: Enable Voltage - Output (Min/Fixed): 2.2V Supplier Device Package: 5-TSOP Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 100 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 300mA Output Type: Fixed Package / Case: SC-74A, SOT-753 Packaging: Bulk Current - Supply (Max): 250 µA Mounting Type: Surface Mount |
на замовлення 9000 шт: термін постачання 21-31 дні (днів) |
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74HCT2G08DP | NXP USA Inc. |
Description: IC GATE AND 2CH 2-INP 8TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| BZX79-C51143 | NXP USA Inc. |
Description: NOW NEXPERIA BZX79-C51 - ZENER D |
на замовлення 35000 шт: термін постачання 21-31 дні (днів) |
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| BZX79-C56133 | NXP USA Inc. |
Description: NOW NEXPERIA BZX79-C56 - ZENER D |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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BAP51L,315 | NXP USA Inc. |
Description: RF DIODE PIN 60V 500MW DFN1006-2Power Dissipation (Max): 500 mW Current - Max: 100 mA Supplier Device Package: DFN1006-2 Voltage - Peak Reverse (Max): 60V Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz Operating Temperature: -65°C ~ 150°C (TJ) Diode Type: PIN - Single Package / Case: SOD-882 Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC35FS6511NAER2 | NXP USA Inc. |
Description: FS6500Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC35FS6511NAE | NXP USA Inc. |
Description: FS6500 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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RAPIDRF-26E39 | NXP USA Inc. |
Description: 28 V LDMOS RF FRONT END 5G 50WContents: Board(s) Part Status: Active Supplied Contents: Board(s) Type: Front End Frequency: 2.496GHz ~ 2.69GHz Packaging: Bulk |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| PCAL6408AHK | NXP USA Inc. |
Description: LOW-VOLTAGE TRANSLATING, 8-BIT I |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MC9S08AW16MFUE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 64QFPVoltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 64-QFP Packaging: Bulk DigiKey Programmable: Not Verified Number of I/O: 54 Part Status: Active Supplier Device Package: 64-QFP (14x14) Peripherals: LVD, POR, PWM, WDT Connectivity: I²C, SCI, SPI |
на замовлення 163 шт: термін постачання 21-31 дні (днів) |
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BZV90-C56115 | NXP USA Inc. |
Description: NOW NEXPERIA BZV90-C56 ZENER DIOPower - Max: 1.5 W Supplier Device Package: SOT-223 Impedance (Max) (Zzt): 200 Ohms Voltage - Zener (Nom) (Vz): 56 V Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Qualification: AEC-Q100 Grade: Automotive Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Package / Case: TO-261-4, TO-261AA Tolerance: ±5% Packaging: Bulk |
на замовлення 1990 шт: термін постачання 21-31 дні (днів) |
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74AHCT374D118 | NXP USA Inc. |
Description: NOW NEXPERIA 74AHCT374D - BUS DRNumber of Bits per Element: 8 Max Propagation Delay @ V, Max CL: 10.4ns @ 5V, 50pF Supplier Device Package: 20-SO Input Capacitance: 3 pF Clock Frequency: 130 MHz Trigger Type: Positive Edge Current - Output High, Low: 8mA, 8mA Current - Quiescent (Iq): 4 µA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Type: D-Type Function: Standard Number of Elements: 1 Mounting Type: Surface Mount Output Type: Tri-State, Non-Inverted Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Bulk |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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MCIMX537CVP8C2 | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGAPackaging: Tray Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
на замовлення 239 шт: термін постачання 21-31 дні (днів) |
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| CBT3384PW,112 |
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Виробник: NXP USA Inc.
Description: IC BUS SWITCH 5 X 1:1 24TSSOP
Part Status: Active
Supplier Device Package: 24-TSSOP
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 5 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Description: IC BUS SWITCH 5 X 1:1 24TSSOP
Part Status: Active
Supplier Device Package: 24-TSSOP
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 5 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
на замовлення 3150 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1100+ | 19.52 грн |
| CBTD3384D,118 |
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Виробник: NXP USA Inc.
Description: IC BUS SWITCH 5 X 1:1 24SO
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 5 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Part Status: Active
Supplier Device Package: 24-SO
Voltage Supply Source: Single Supply
Independent Circuits: 2
Description: IC BUS SWITCH 5 X 1:1 24SO
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 5 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Part Status: Active
Supplier Device Package: 24-SO
Voltage Supply Source: Single Supply
Independent Circuits: 2
на замовлення 3183 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 927+ | 23.38 грн |
| DEMO-BYL1-EVB |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR FS8500
Contents: Board(s), Cable(s)
Part Status: Active
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: FS8500, PF5020, PF5024
Type: Power Management
Function: Special Purpose: Mobiles
Packaging: Bulk
Description: EVAL BOARD FOR FS8500
Contents: Board(s), Cable(s)
Part Status: Active
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: FS8500, PF5020, PF5024
Type: Power Management
Function: Special Purpose: Mobiles
Packaging: Bulk
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 25707.25 грн |
| MC33FS8530A0ES |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8500
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Description: SYSTEM BASIS CHIP FS8500
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
на замовлення 160 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 857.62 грн |
| 10+ | 646.90 грн |
| 25+ | 602.20 грн |
| 80+ | 525.34 грн |
| S912XDT256F1MAL |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Description: IC MCU 16BIT 256KB FLASH 112LQFP
товару немає в наявності
В кошику
од. на суму грн.
| SPC5644BK0MLU8R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| MC33PF8200ESESR2 |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
товару немає в наявності
В кошику
од. на суму грн.
| MC56F84789VLL557 |
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Виробник: NXP USA Inc.
Description: MICROCONTROLLER 32-BIT FLASH
Description: MICROCONTROLLER 32-BIT FLASH
товару немає в наявності
В кошику
од. на суму грн.
| 74LVC3G06GN,115 |
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Виробник: NXP USA Inc.
Description: IC INVERTER OD 3CH 3-INP 8XSON
Description: IC INVERTER OD 3CH 3-INP 8XSON
на замовлення 189977 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1381+ | 15.91 грн |
| BGA2851,115 |
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Виробник: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Supplier Device Package: 6-TSSOP
Test Frequency: 2.15GHz
P1dB: -5dBm
Noise Figure: 3dB
Current - Supply: 7mA
Gain: 25.2dB
Voltage - Supply: 4.5V ~ 5.5V
RF Type: General Purpose
Frequency: 0Hz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Cut Tape (CT)
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Supplier Device Package: 6-TSSOP
Test Frequency: 2.15GHz
P1dB: -5dBm
Noise Figure: 3dB
Current - Supply: 7mA
Gain: 25.2dB
Voltage - Supply: 4.5V ~ 5.5V
RF Type: General Purpose
Frequency: 0Hz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Cut Tape (CT)
на замовлення 8637 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10+ | 33.23 грн |
| 12+ | 27.66 грн |
| 25+ | 26.03 грн |
| 100+ | 22.34 грн |
| 250+ | 21.09 грн |
| 500+ | 20.20 грн |
| 1000+ | 19.05 грн |
| BGA2815,115 |
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Виробник: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
RF Type: General Purpose
Frequency: 0Hz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Cut Tape (CT)
Part Status: Active
Supplier Device Package: 6-TSSOP
Test Frequency: 2.15GHz
P1dB: 1dBm
Noise Figure: 3.7dB
Current - Supply: 55mA
Gain: 25.2dB
Voltage - Supply: 3V ~ 3.6V
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
RF Type: General Purpose
Frequency: 0Hz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Cut Tape (CT)
Part Status: Active
Supplier Device Package: 6-TSSOP
Test Frequency: 2.15GHz
P1dB: 1dBm
Noise Figure: 3.7dB
Current - Supply: 55mA
Gain: 25.2dB
Voltage - Supply: 3V ~ 3.6V
на замовлення 2984 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 13+ | 25.32 грн |
| 15+ | 20.95 грн |
| 25+ | 19.66 грн |
| 100+ | 16.87 грн |
| 250+ | 15.91 грн |
| 500+ | 15.23 грн |
| 1000+ | 14.36 грн |
| MIMXRT117HCVM8A |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
на замовлення 728 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1927.27 грн |
| 10+ | 1495.46 грн |
| 25+ | 1405.36 грн |
| 100+ | 1225.93 грн |
| 250+ | 1181.64 грн |
| BGA2866 |
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Виробник: NXP USA Inc.
Description: WIDE BAND LOW POWER AMPLIFIER 0
DigiKey Programmable: Not Verified
Packaging: Bulk
Description: WIDE BAND LOW POWER AMPLIFIER 0
DigiKey Programmable: Not Verified
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| BGA2866115 |
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Виробник: NXP USA Inc.
Description: WIDE BAND LOW POWER AMPLIFIER 0
Description: WIDE BAND LOW POWER AMPLIFIER 0
товару немає в наявності
В кошику
од. на суму грн.
| BGA2850,115 |
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Виробник: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Test Frequency: 2.15GHz
P1dB: -2dBm
Noise Figure: 4dB
Current - Supply: 36mA
Gain: 22.9dB
Voltage - Supply: 4.5V ~ 5.5V
RF Type: General Purpose
Frequency: 0Hz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Test Frequency: 2.15GHz
P1dB: -2dBm
Noise Figure: 4dB
Current - Supply: 36mA
Gain: 22.9dB
Voltage - Supply: 4.5V ~ 5.5V
RF Type: General Purpose
Frequency: 0Hz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| MCF5270VM100 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 61
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 61
DigiKey Programmable: Not Verified
на замовлення 330 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2182.82 грн |
| 10+ | 1701.01 грн |
| 25+ | 1600.91 грн |
| 100+ | 1399.11 грн |
| 250+ | 1349.88 грн |
| S912ZVCA19F0WKH |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 42
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 42
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| TDA8023TT/C1,118 |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28TSSOP
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 28-TSSOP
Voltage - Supply: 2.7V ~ 6.5V
Interface: I2C
Mounting Type: Surface Mount
Description: IC INTERFACE SPECIALIZED 28TSSOP
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 28-TSSOP
Voltage - Supply: 2.7V ~ 6.5V
Interface: I2C
Mounting Type: Surface Mount
товару немає в наявності
В кошику
од. на суму грн.
| TDA8023TT/C1,118 |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28TSSOP
Supplier Device Package: 28-TSSOP
Voltage - Supply: 2.7V ~ 6.5V
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED 28TSSOP
Supplier Device Package: 28-TSSOP
Voltage - Supply: 2.7V ~ 6.5V
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Part Status: Obsolete
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| 74LV4020N,112 |
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Виробник: NXP USA Inc.
Description: IC 14BIT BINARY RIPPLE 16-DIP
Description: IC 14BIT BINARY RIPPLE 16-DIP
на замовлення 547 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 307+ | 74.78 грн |
| MIMXRT117HDVMAA |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
на замовлення 369 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1802.27 грн |
| 10+ | 1395.50 грн |
| 25+ | 1310.49 грн |
| 100+ | 1142.18 грн |
| 250+ | 1100.39 грн |
| MPC8314ECVRAFDA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
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| MC9S12C32VFAE16 |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Verified
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Verified
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| MC9S08QB4CWL |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
Description: IC MCU 8BIT 4KB FLASH 28SOIC
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| LS2088ASE7QQB |
Виробник: NXP USA Inc.
Description: LS2088A ST WE 1600 R1.1
Description: LS2088A ST WE 1600 R1.1
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| MRFX1K80H-64MHZ |
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Виробник: NXP USA Inc.
Description: MRFX1K80H REF BRD 64MHZ 1800W
Utilized IC / Part: MRFX1K80H
Contents: Board(s)
Supplied Contents: Board(s)
Type: Transistor
Frequency: 64MHz
For Use With/Related Products: MRFX1K80H
Packaging: Bulk
Description: MRFX1K80H REF BRD 64MHZ 1800W
Utilized IC / Part: MRFX1K80H
Contents: Board(s)
Supplied Contents: Board(s)
Type: Transistor
Frequency: 64MHz
For Use With/Related Products: MRFX1K80H
Packaging: Bulk
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| MRFX1K80HR5178 |
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Виробник: NXP USA Inc.
Description: WIDEBAND RF POWER TRANSISTOR, 18
Description: WIDEBAND RF POWER TRANSISTOR, 18
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| MRFX1K80H-VHFDHY |
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Виробник: NXP USA Inc.
Description: MRFX1K80H REF BRD 230MHZ 1200W
Utilized IC / Part: MRFX1K80H
Contents: Board(s)
Type: Transistor
Frequency: 174MHz ~ 230MHz
For Use With/Related Products: MRFX1K80H
Packaging: Bulk
Supplied Contents: Board(s)
Description: MRFX1K80H REF BRD 230MHZ 1200W
Utilized IC / Part: MRFX1K80H
Contents: Board(s)
Type: Transistor
Frequency: 174MHz ~ 230MHz
For Use With/Related Products: MRFX1K80H
Packaging: Bulk
Supplied Contents: Board(s)
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| MRFX1K80N-230MHZ |
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Виробник: NXP USA Inc.
Description: MRFX1K80N REF BOARD - 230MHZ
Packaging: Bulk
Part Status: Active
Supplied Contents: Board(s)
Type: Transistor
Frequency: 230MHz
For Use With/Related Products: MRFX1K80N
Utilized IC / Part: MRFX1K80N
Contents: Board(s)
Description: MRFX1K80N REF BOARD - 230MHZ
Packaging: Bulk
Part Status: Active
Supplied Contents: Board(s)
Type: Transistor
Frequency: 230MHz
For Use With/Related Products: MRFX1K80N
Utilized IC / Part: MRFX1K80N
Contents: Board(s)
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| A5G26H110NT4 |
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Виробник: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Package / Case: 6-LDFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Test: 50 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: 6-PDFN (7x6.5)
Technology: GaN
Gain: 17.7dB
Power - Output: 15W
Frequency: 2.496GHz ~ 2.69GHz
Mounting Type: Surface Mount
Description: RF MOSFET GAN 48V 6DFN
Package / Case: 6-LDFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Test: 50 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: 6-PDFN (7x6.5)
Technology: GaN
Gain: 17.7dB
Power - Output: 15W
Frequency: 2.496GHz ~ 2.69GHz
Mounting Type: Surface Mount
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| A5G37H110NT4 |
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Виробник: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
Power - Output: 13.5W
Gain: 15.1dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 70 mA
Description: RF MOSFET GAN 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
Power - Output: 13.5W
Gain: 15.1dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 70 mA
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| A5G35H110NT4 |
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Виробник: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR,
Description: AIRFAST RF POWER GAN TRANSISTOR,
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| MC9S08SH16CTG,574 |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
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| MC9S08SH16CTLR |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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| MRF9002NR2 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 26V 16PFP
Description: RF MOSFET LDMOS 26V 16PFP
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| PSMN7R5-25YLC,115 |
Виробник: NXP USA Inc.
Description: MOSFET N-CH 25V 56A LFPAK56
Part Status: Obsolete
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 42W (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Description: MOSFET N-CH 25V 56A LFPAK56
Part Status: Obsolete
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 42W (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
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| PSMN7R5-25YLC,115 |
Виробник: NXP USA Inc.
Description: MOSFET N-CH 25V 56A LFPAK56
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 42W (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Cut Tape (CT)
Description: MOSFET N-CH 25V 56A LFPAK56
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 42W (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Cut Tape (CT)
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| FRDMPKPT2000EVM |
Виробник: NXP USA Inc.
Description: FREEDOM BOARD KIT - PT2000 PROG
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Utilized IC / Part: PT2000
Type: Power Management
Function: Gate Driver
Packaging: Bulk
Description: FREEDOM BOARD KIT - PT2000 PROG
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Utilized IC / Part: PT2000
Type: Power Management
Function: Gate Driver
Packaging: Bulk
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| S9S12HY64J0CLLR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Number of I/O: 80
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Number of I/O: 80
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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| MC68LK332GCAG16-NXP |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Description: IC MCU 32BIT ROMLESS 144LQFP
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| PEMI1QFN/RP,315 |
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Виробник: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 100Ohms, C = 18.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Tape & Reel (TR)
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 100
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 100Ohms, C = 18.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Tape & Reel (TR)
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 100
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| 74AHCT2G126GD,125 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
на замовлення 68069 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2049+ | 10.85 грн |
| 74AHCT2G241DP125 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8TSSOP
Part Status: Active
Supplier Device Package: 8-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Bulk
Description: IC BUFFER NON-INVERT 5.5V 8TSSOP
Part Status: Active
Supplier Device Package: 8-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Bulk
на замовлення 3087 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1567+ | 15.03 грн |
| 74AHCT2G125GD,125-NX |
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
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| LD6836TD/36H,125 |
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Виробник: NXP USA Inc.
Description: IC REG LINEAR 3.6V 300MA 5TSOP
Description: IC REG LINEAR 3.6V 300MA 5TSOP
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2885+ | 7.63 грн |
| LD6836TD/22H,125 |
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Виробник: NXP USA Inc.
Description: IC REG LINEAR 2.2V 300MA 5TSOP
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
Current - Supply (Max): 250 µA
Mounting Type: Surface Mount
Description: IC REG LINEAR 2.2V 300MA 5TSOP
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
Current - Supply (Max): 250 µA
Mounting Type: Surface Mount
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2885+ | 7.42 грн |
| 74HCT2G08DP |
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Виробник: NXP USA Inc.
Description: IC GATE AND 2CH 2-INP 8TSSOP
Description: IC GATE AND 2CH 2-INP 8TSSOP
товару немає в наявності
В кошику
од. на суму грн.
| BZX79-C51143 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C51 - ZENER D
Description: NOW NEXPERIA BZX79-C51 - ZENER D
на замовлення 35000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 15000+ | 1.53 грн |
| BZX79-C56133 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C56 - ZENER D
Description: NOW NEXPERIA BZX79-C56 - ZENER D
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В кошику
од. на суму грн.
| BAP51L,315 |
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Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 500MW DFN1006-2
Power Dissipation (Max): 500 mW
Current - Max: 100 mA
Supplier Device Package: DFN1006-2
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SOD-882
Packaging: Cut Tape (CT)
Description: RF DIODE PIN 60V 500MW DFN1006-2
Power Dissipation (Max): 500 mW
Current - Max: 100 mA
Supplier Device Package: DFN1006-2
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SOD-882
Packaging: Cut Tape (CT)
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| MC35FS6511NAER2 |
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Виробник: NXP USA Inc.
Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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| MC35FS6511NAE |
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Виробник: NXP USA Inc.
Description: FS6500
Description: FS6500
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В кошику
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| RAPIDRF-26E39 |
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Виробник: NXP USA Inc.
Description: 28 V LDMOS RF FRONT END 5G 50W
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Front End
Frequency: 2.496GHz ~ 2.69GHz
Packaging: Bulk
Description: 28 V LDMOS RF FRONT END 5G 50W
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Front End
Frequency: 2.496GHz ~ 2.69GHz
Packaging: Bulk
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 68879.42 грн |
| PCAL6408AHK |
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Виробник: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING, 8-BIT I
Description: LOW-VOLTAGE TRANSLATING, 8-BIT I
товару немає в наявності
В кошику
од. на суму грн.
| MC9S08AW16MFUE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 64QFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
Description: IC MCU 8BIT 16KB FLASH 64QFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
на замовлення 163 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 36+ | 678.03 грн |
| BZV90-C56115 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZV90-C56 ZENER DIO
Power - Max: 1.5 W
Supplier Device Package: SOT-223
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 56 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Package / Case: TO-261-4, TO-261AA
Tolerance: ±5%
Packaging: Bulk
Description: NOW NEXPERIA BZV90-C56 ZENER DIO
Power - Max: 1.5 W
Supplier Device Package: SOT-223
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 56 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Package / Case: TO-261-4, TO-261AA
Tolerance: ±5%
Packaging: Bulk
на замовлення 1990 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1990+ | 12.26 грн |
| 74AHCT374D118 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT374D - BUS DR
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 10.4ns @ 5V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 3 pF
Clock Frequency: 130 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 8mA, 8mA
Current - Quiescent (Iq): 4 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Description: NOW NEXPERIA 74AHCT374D - BUS DR
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 10.4ns @ 5V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 3 pF
Clock Frequency: 130 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 8mA, 8mA
Current - Quiescent (Iq): 4 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1348+ | 16.47 грн |
| MCIMX537CVP8C2 |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
на замовлення 239 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4796.82 грн |
| 10+ | 3825.45 грн |
| 84+ | 3432.34 грн |
| 168+ | 3141.36 грн |





































