Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36389) > Сторінка 466 з 607
| Фото | Назва | Виробник | Інформація |
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PDTC144EE,115 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 50V 0.1A SC75Resistor - Emitter Base (R2): 47 kOhms Resistor - Base (R1): 47 kOhms Power - Max: 150 mW Voltage - Collector Emitter Breakdown (Max): 50 V Current - Collector (Ic) (Max): 100 mA Part Status: Obsolete Supplier Device Package: SC-75 DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V Current - Collector Cutoff (Max): 1µA Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Transistor Type: NPN - Pre-Biased Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Packaging: Tape & Reel (TR) Resistors Included: R1 and R2 |
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PDTC144EE,115 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 50V 0.1A SC75Resistor - Emitter Base (R2): 47 kOhms Resistor - Base (R1): 47 kOhms Power - Max: 150 mW Voltage - Collector Emitter Breakdown (Max): 50 V Current - Collector (Ic) (Max): 100 mA Part Status: Obsolete Supplier Device Package: SC-75 DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V Current - Collector Cutoff (Max): 1µA Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Resistors Included: R1 and R2 Transistor Type: NPN - Pre-Biased Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Packaging: Cut Tape (CT) |
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| FRDM-HB2002ESEVM | NXP USA Inc. |
Description: EVB FOR MC33772 SPIPackaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: HB2002 Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Part Status: Active |
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MC33772CTC1AE | NXP USA Inc. |
Description: IC 6-CH LI-ION BATT CTRL 48LQFPPackaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: I2C, SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
на замовлення 276 шт: термін постачання 21-31 дні (днів) |
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MC9S12H128VPVE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFPPackaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 128KB (128K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I²C, SCI, SPI Peripherals: LCD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Obsolete Number of I/O: 85 |
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SVF332R3K2CKU2R | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 176HLQFPAdditional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART Part Status: Active Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR3, DRAM Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 OTG + PHY (1) Ethernet: 10/100Mbps (2) Supplier Device Package: 176-HLQFP (24x24) Voltage - I/O: 3.3V Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Operating Temperature: -40°C ~ 85°C (TA) Speed: 266MHz, 133MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
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SVF332R3K2CKU2 | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 176HLQFPAdditional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART Part Status: Active Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR3, DRAM Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 OTG + PHY (1) Ethernet: 10/100Mbps (2) Supplier Device Package: 176-HLQFP (24x24) Voltage - I/O: 3.3V Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Operating Temperature: -40°C ~ 85°C (TA) Speed: 266MHz, 133MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Packaging: Tray |
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PHB66NQ03LT | NXP USA Inc. |
Description: NOW NEXPERIA 66A, 25V, 0.0136OHMPart Status: Active Packaging: Bulk |
на замовлення 800 шт: термін постачання 21-31 дні (днів) |
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PHB66NQ03LT118 | NXP USA Inc. |
Description: NOW NEXPERIA PHB66NQ03LT 66A, 25Part Status: Active Packaging: Bulk DigiKey Programmable: Not Verified |
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MC7457VG1000NC | NXP USA Inc. |
Description: IC MPU MPC74XX 1.0GHZ 483FCCBGAPackaging: Tray Package / Case: 483-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 483-FCCBGA (29x29) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Part Status: Obsolete |
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SPC5602BAVLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Number of I/O: 79 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 28x10b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 24K x 8 Program Memory Size: 256KB (256K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
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SPC5607BAVLQ6 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 144LQFPCore Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 96K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray Number of I/O: 121 Part Status: Active Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 15x10b, 5x12b DigiKey Programmable: Not Verified |
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SPC5603BAVLQ4 | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 144LQFP Number of I/O: 123 Part Status: Active Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 36x10b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 28K x 8 Program Memory Size: 384KB (384K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
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SPC5602BAVLL4R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 79 |
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SPC5607BAVLU6R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFPPackaging: Tape & Reel (TR) Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 29x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 149 DigiKey Programmable: Not Verified |
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SPC5607BAVLU6 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFPPackaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 29x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 149 |
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SPC5603BAVLQ4R | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 36x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 123 DigiKey Programmable: Not Verified |
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MPC8313VRAFF | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516BGAPackaging: Tray Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-TEPBGA (27x27) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Part Status: Obsolete |
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MCF5281CVM66J | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 256MAPBGAPackaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 256-MAPBGA (17x17) Part Status: Obsolete Number of I/O: 150 |
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MC68SEC000AA20R2 | NXP USA Inc. |
Description: IC MPU M680X0 20MHZ 64QFPGraphics Acceleration: No Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 64-QFP (14x14) Voltage - I/O: 3.3V, 5.0V Core Processor: EC000 Operating Temperature: 0°C ~ 70°C (TA) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 64-QFP Packaging: Tape & Reel (TR) Part Status: Obsolete |
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MC68HC908GR4CFAE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 32LQFPNumber of I/O: 21 Part Status: Last Time Buy Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 6x8b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 384 x 8 Program Memory Size: 4KB (4K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
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MPC8308VMAGD | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 473MAPBGAPackaging: Tray Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DDR2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 473-MAPBGA (19x19) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: 0°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 473-LFBGA |
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| SAF7751HN/N207WMP | NXP USA Inc. |
Description: CAR DISP Part Status: Active Packaging: Bulk |
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BC847QASX | NXP USA Inc. |
Description: TRANS NPN/PNP 45V DFN1010B-6 Part Status: Active Supplier Device Package: DFN1010B-6 Frequency - Transition: 100MHz DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V Current - Collector Cutoff (Max): 15nA (ICBO) Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA Voltage - Collector Emitter Breakdown (Max): 45V Current - Collector (Ic) (Max): 100mA Power - Max: 230mW Operating Temperature: 150°C (TJ) Transistor Type: 1 NPN, 1 PNP Complementary Mounting Type: Surface Mount Package / Case: 6-XFDFN Exposed Pad Packaging: Tape & Reel (TR) Qualification: AEC-Q101 Grade: Automotive |
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| T1024NXE7MQA557 | NXP USA Inc. |
Description: QORIQ RISC MICROPROCESSOR 64-BI Part Status: Active Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
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NX6020NBKS115 | NXP USA Inc. |
Description: MOSFET N-CHPart Status: Active Packaging: Bulk |
на замовлення 162000 шт: термін постачання 21-31 дні (днів) |
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BUK98180-100A,115 | NXP USA Inc. |
Description: MOSFET N-CH 100V 4.6A SOT-223Packaging: Cut Tape (CT) Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 4.6A (Tc) Rds On (Max) @ Id, Vgs: 173mOhm @ 5A, 10V Power Dissipation (Max): 8W (Tc) Vgs(th) (Max) @ Id: 2V @ 1mA Supplier Device Package: SC-73 Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±10V Drain to Source Voltage (Vdss): 100 V Input Capacitance (Ciss) (Max) @ Vds: 619 pF @ 25 V Grade: Automotive Qualification: AEC-Q101 |
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MPC5553MVZ132 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 324PBGAPackaging: Tray Package / Case: 324-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 324-PBGA (23x23) Part Status: Active Number of I/O: 220 DigiKey Programmable: Not Verified |
на замовлення 1130 шт: термін постачання 21-31 дні (днів) |
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PDZ5.1B/ZL115 | NXP USA Inc. |
Description: DIODE ZENERPackaging: Bulk Part Status: Active |
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PDZ5.1B145 | NXP USA Inc. |
Description: PDZ5.1B - VOLTAGE REGULATOR DIODPackaging: Bulk Part Status: Active |
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MK22FN128VDC10 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 121BGAProgram Memory Size: 128KB (128K x 8) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 121-XFBGA Packaging: Tray Number of I/O: 67 Part Status: Active Supplier Device Package: 121-BGA (10x10) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 34x16b; D/A 1x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 24K x 8 DigiKey Programmable: Not Verified |
на замовлення 1595 шт: термін постачання 21-31 дні (днів) |
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FS32K146HFT0VLLT | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100LQFPOperating Temperature: -40°C ~ 105°C (TA) RAM Size: 128K x 8 Program Memory Size: 1MB (1M x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 89 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: POR, PWM, WDT Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 24x12b SAR; D/A1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal |
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PDTA144EE,115 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 50V 0.1A SC75Packaging: Tape & Reel (TR) Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Transistor Type: PNP - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V Supplier Device Package: SC-75 Part Status: Obsolete Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 150 mW Resistor - Base (R1): 47 kOhms Resistor - Emitter Base (R2): 47 kOhms Resistors Included: R1 and R2 |
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PDTA144EE,115 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 50V 0.1A SC75Packaging: Cut Tape (CT) Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Transistor Type: PNP - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V Supplier Device Package: SC-75 Part Status: Obsolete Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 150 mW Resistor - Base (R1): 47 kOhms Resistor - Emitter Base (R2): 47 kOhms Resistors Included: R1 and R2 |
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PDTA144TK,115 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 50V 0.1A SMT3Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: PNP - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V Supplier Device Package: SMT3; MPAK Part Status: Obsolete Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Resistor - Base (R1): 47 kOhms Resistors Included: R1 Only |
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| BZX884-B15315 | NXP USA Inc. |
Description: DIODE ZENER 12V 0.25W 2% UNIDIR Tolerance: ±2% Packaging: Bulk Package / Case: SOD-882 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 15 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: DFN1006-2 Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MMRF1008GHR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780GH-2L Current Rating (Amps): 100µA Mounting Type: Chassis Mount Frequency: 900MHz ~ 1.215GHz Power - Output: 275W Gain: 20.3dB Technology: LDMOS Supplier Device Package: NI-780GH-2L Part Status: Last Time Buy Voltage - Rated: 100 V Voltage - Test: 50 V Current - Test: 100 mA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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FS32K142UIT0VLHR | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPPackaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 112MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||||||||||||||||
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FS32K142UIT0VLHT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 112MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PMV25ENEA215 | NXP USA Inc. |
Description: PMV25E SMALL SIGNAL FET, SOT23Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| PSMN7R5-30YLD115 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFET Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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SPC5567MVR132 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 2MB (2M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Part Status: Active Number of I/O: 238 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCF51JE256CMB | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 81MAPBGAPackaging: Box Package / Case: 81-LBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 12x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: EBI/EMI, I²C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 81-MAPBGA (10x10) Part Status: Active Number of I/O: 48 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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FS32K144UIT0VLHR | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFPPackaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 112MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S9S08RN60W1MLH | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 55 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x12b Core Processor: S08 EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 60KB (60K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S9S08RN60W1MLHR | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64LQFPPackaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 55 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8555VTALF | NXP USA Inc. |
Description: IC MPU MPC85XX 667MHZ 783FCPBGACore Processor: PowerPC e500 Operating Temperature: 0°C ~ 105°C (TA) Speed: 667MHz Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DDR, SDRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 783-FCPBGA (29x29) Voltage - I/O: 2.5V, 3.3V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MVF51NN151CMK50 | NXP USA Inc. |
Description: IC MPU VYBRID 500MHZ 364LFBGAPart Status: Active Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR3, DRAM Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 OTG + PHY (1) Ethernet: 10/100Mbps (2) Supplier Device Package: 364-LFBGA (17x17) Voltage - I/O: 3.3V Core Processor: ARM® Cortex®-A5 Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART Operating Temperature: -40°C ~ 85°C (TA) Speed: 500MHz Mounting Type: Surface Mount Package / Case: 364-LFBGA Packaging: Tray |
на замовлення 447 шт: термін постачання 21-31 дні (днів) |
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P3S0200GMX | NXP USA Inc. |
Description: IC BUS SW 2X1:2,2X2:1 10-XQFNPackaging: Tape & Reel (TR) Package / Case: 10-XFQFN Mounting Type: Surface Mount Circuit: 2 x 1:2, 2 x 2:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 3.6V Independent Circuits: 2 Voltage Supply Source: Single Supply Supplier Device Package: 10-XQFN (1.55x2) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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P3S0200GMX | NXP USA Inc. |
Description: IC BUS SW 2X1:2,2X2:1 10-XQFNPackaging: Cut Tape (CT) Package / Case: 10-XFQFN Mounting Type: Surface Mount Circuit: 2 x 1:2, 2 x 2:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 3.6V Independent Circuits: 2 Voltage Supply Source: Single Supply Supplier Device Package: 10-XQFN (1.55x2) Part Status: Active |
на замовлення 4207 шт: термін постачання 21-31 дні (днів) |
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74AVCH16245DGG112 | NXP USA Inc. |
Description: NOW NEXPERIA 74AVCH16245DGG - BUPart Status: Active Packaging: Bulk |
на замовлення 945 шт: термін постачання 21-31 дні (днів) |
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N74F125N,602 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 14DIPNumber of Bits per Element: 1 Number of Elements: 4 Part Status: Obsolete Supplier Device Package: 14-DIP Current - Output High, Low: 15mA, 64mA Mounting Type: Through Hole Output Type: 3-State Package / Case: 14-DIP (0.300", 7.62mm) Packaging: Tube Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Logic Type: Buffer, Non-Inverting |
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В кошику од. на суму грн. | ||||||||||||||||
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MPC8349CZUAJDB | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 672LBGAAdditional Interfaces: DUART, I2C, PCI, SPI Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DDR, DDR2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 672-LBGA (35x35) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: -40°C ~ 105°C (TA) Speed: 533MHz Mounting Type: Surface Mount Package / Case: 672-LBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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LPC43S30FET100K | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGAConnectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 4x10b SAR; D/A 1x10b Core Processor: ARM® Cortex®-M4/M0 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 264K x 8 Speed: 204MHz Mounting Type: Surface Mount Package / Case: 100-TFBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 49 Part Status: Active Supplier Device Package: 100-TFBGA (9x9) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT |
на замовлення 1200 шт: термін постачання 21-31 дні (днів) |
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MIMXRT1040-EVK | NXP USA Inc. |
Description: EVAL KIT I.MX RT1040Core Processor: ARM® Cortex®-M7 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box Part Status: Active Utilized IC / Part: i.MX RT1040 Board Type: Evaluation Platform |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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SLN-TLHMI-IOT | NXP USA Inc. |
Description: EVAL KIT I.MX RT117HPart Status: Active Platform: EdgeReady Utilized IC / Part: RT117H Board Type: Evaluation Platform Core Processor: ARM® Cortex®-M4, Cortex®-M7 Contents: Board(s), Cable(s) Type: MCU Mounting Type: Fixed Packaging: Bulk |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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FS32K144HAT0VMHR | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 100MAPBGANumber of I/O: 89 Part Status: Active Supplier Device Package: 100-MAPBGA (11x11) Peripherals: POR, PWM, WDT Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b SAR; D/A1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 64K x 8 Program Memory Size: 512KB (512K x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 100-LFBGA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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FS32K144HFT0MMHT | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 100MAPBGADigiKey Programmable: Not Verified Number of I/O: 89 Part Status: Active Supplier Device Package: 100-MAPBGA (11x11) Peripherals: POR, PWM, WDT Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b SAR; D/A1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 64K x 8 Program Memory Size: 512KB (512K x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 100-LFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MKW22D512VHA5 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 63MAPLGAFrequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -102dBm Package / Case: 63-VFLGA Packaging: Tray Serial Interfaces: I2C, JTAG, SPI, UART, USB RF Family/Standard: 802.15.4 Modulation: DSSS, O-QPSK GPIO: 2 Supplier Device Package: 63-MAPLGA (8x8) Current - Transmitting: 19mA Data Rate (Max): 250kbps Current - Receiving: 15mA Protocol: Zigbee® Power - Output: 8dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 105°C Type: TxRx + MCU Memory Size: 512kB Flash, 64kB SRAM DigiKey Programmable: Not Verified Part Status: Active |
на замовлення 1214 шт: термін постачання 21-31 дні (днів) |
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74AXP2G34GSH | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 2.75V 6XSONPart Status: Active Supplier Device Package: 6-XSON, SOT1202 (1x1) Current - Output High, Low: 8mA, 8mA Number of Bits per Element: 1 Voltage - Supply: 0.7V ~ 2.75V Operating Temperature: -40°C ~ 85°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 2 Mounting Type: Surface Mount Output Type: Push-Pull Package / Case: 6-XFDFN Packaging: Bulk |
на замовлення 4180 шт: термін постачання 21-31 дні (днів) |
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| PDTC144EE,115 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Resistor - Emitter Base (R2): 47 kOhms
Resistor - Base (R1): 47 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Tape & Reel (TR)
Resistors Included: R1 and R2
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Resistor - Emitter Base (R2): 47 kOhms
Resistor - Base (R1): 47 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Tape & Reel (TR)
Resistors Included: R1 and R2
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В кошику
од. на суму грн.
| PDTC144EE,115 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Resistor - Emitter Base (R2): 47 kOhms
Resistor - Base (R1): 47 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Resistors Included: R1 and R2
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Cut Tape (CT)
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Resistor - Emitter Base (R2): 47 kOhms
Resistor - Base (R1): 47 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Resistors Included: R1 and R2
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Cut Tape (CT)
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В кошику
од. на суму грн.
| FRDM-HB2002ESEVM |
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Виробник: NXP USA Inc.
Description: EVB FOR MC33772 SPI
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: HB2002
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: EVB FOR MC33772 SPI
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: HB2002
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
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В кошику
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| MC33772CTC1AE |
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Виробник: NXP USA Inc.
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
на замовлення 276 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 657.46 грн |
| 10+ | 493.23 грн |
| 25+ | 458.34 грн |
| 100+ | 394.07 грн |
| 250+ | 376.90 грн |
| MC9S12H128VPVE |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LCD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 85
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LCD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 85
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В кошику
од. на суму грн.
| SVF332R3K2CKU2R |
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Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MPU VYBRID 133MHZ 176HLQFP
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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| SVF332R3K2CKU2 |
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Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Description: IC MPU VYBRID 133MHZ 176HLQFP
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
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| PHB66NQ03LT |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 66A, 25V, 0.0136OHM
Part Status: Active
Packaging: Bulk
Description: NOW NEXPERIA 66A, 25V, 0.0136OHM
Part Status: Active
Packaging: Bulk
на замовлення 800 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 800+ | 34.81 грн |
| PHB66NQ03LT118 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PHB66NQ03LT 66A, 25
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: NOW NEXPERIA PHB66NQ03LT 66A, 25
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
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| MC7457VG1000NC |
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Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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| SPC5602BAVLL4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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| SPC5607BAVLQ6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
DigiKey Programmable: Not Verified
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| SPC5603BAVLQ4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Number of I/O: 123
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Number of I/O: 123
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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| SPC5602BAVLL4R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
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| SPC5607BAVLU6R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
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| SPC5607BAVLU6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
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| SPC5603BAVLQ4R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 123
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 123
DigiKey Programmable: Not Verified
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| MPC8313VRAFF |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516BGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC83XX 333MHZ 516BGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
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| MCF5281CVM66J |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 150
Description: IC MCU 32B 256KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 150
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| MC68SEC000AA20R2 |
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Виробник: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64QFP
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-QFP (14x14)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC MPU M680X0 20MHZ 64QFP
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-QFP (14x14)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
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| MC68HC908GR4CFAE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 32LQFP
Number of I/O: 21
Part Status: Last Time Buy
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 384 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC MCU 8BIT 4KB FLASH 32LQFP
Number of I/O: 21
Part Status: Last Time Buy
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 384 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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| MPC8308VMAGD |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 473MAPBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 473-MAPBGA (19x19)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 473-LFBGA
Description: IC MPU MPC83XX 400MHZ 473MAPBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 473-MAPBGA (19x19)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 473-LFBGA
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| BC847QASX |
Виробник: NXP USA Inc.
Description: TRANS NPN/PNP 45V DFN1010B-6
Part Status: Active
Supplier Device Package: DFN1010B-6
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Voltage - Collector Emitter Breakdown (Max): 45V
Current - Collector (Ic) (Max): 100mA
Power - Max: 230mW
Operating Temperature: 150°C (TJ)
Transistor Type: 1 NPN, 1 PNP Complementary
Mounting Type: Surface Mount
Package / Case: 6-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Grade: Automotive
Description: TRANS NPN/PNP 45V DFN1010B-6
Part Status: Active
Supplier Device Package: DFN1010B-6
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Voltage - Collector Emitter Breakdown (Max): 45V
Current - Collector (Ic) (Max): 100mA
Power - Max: 230mW
Operating Temperature: 150°C (TJ)
Transistor Type: 1 NPN, 1 PNP Complementary
Mounting Type: Surface Mount
Package / Case: 6-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Grade: Automotive
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| T1024NXE7MQA557 |
Виробник: NXP USA Inc.
Description: QORIQ RISC MICROPROCESSOR 64-BI
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: QORIQ RISC MICROPROCESSOR 64-BI
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
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| NX6020NBKS115 |
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на замовлення 162000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2959+ | 7.24 грн |
| BUK98180-100A,115 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 100V 4.6A SOT-223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.6A (Tc)
Rds On (Max) @ Id, Vgs: 173mOhm @ 5A, 10V
Power Dissipation (Max): 8W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 619 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Description: MOSFET N-CH 100V 4.6A SOT-223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.6A (Tc)
Rds On (Max) @ Id, Vgs: 173mOhm @ 5A, 10V
Power Dissipation (Max): 8W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 619 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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| MPC5553MVZ132 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Part Status: Active
Number of I/O: 220
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Part Status: Active
Number of I/O: 220
DigiKey Programmable: Not Verified
на замовлення 1130 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5245.41 грн |
| 10+ | 4195.79 грн |
| 25+ | 3982.18 грн |
| 100+ | 3516.79 грн |
| PDZ5.1B145 |
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Виробник: NXP USA Inc.
Description: PDZ5.1B - VOLTAGE REGULATOR DIOD
Packaging: Bulk
Part Status: Active
Description: PDZ5.1B - VOLTAGE REGULATOR DIOD
Packaging: Bulk
Part Status: Active
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| MK22FN128VDC10 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 121BGA
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 121-XFBGA
Packaging: Tray
Number of I/O: 67
Part Status: Active
Supplier Device Package: 121-BGA (10x10)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 121BGA
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 121-XFBGA
Packaging: Tray
Number of I/O: 67
Part Status: Active
Supplier Device Package: 121-BGA (10x10)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
DigiKey Programmable: Not Verified
на замовлення 1595 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 429.60 грн |
| 10+ | 318.91 грн |
| 25+ | 295.24 грн |
| 80+ | 258.04 грн |
| FS32K146HFT0VLLT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
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| PDTA144EE,115 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
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| PDTA144EE,115 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
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| PDTA144TK,115 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SMT3
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: SMT3; MPAK
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 47 kOhms
Resistors Included: R1 Only
Description: TRANS PREBIAS PNP 50V 0.1A SMT3
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: SMT3; MPAK
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 47 kOhms
Resistors Included: R1 Only
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| BZX884-B15315 |
Виробник: NXP USA Inc.
Description: DIODE ZENER 12V 0.25W 2% UNIDIR
Tolerance: ±2%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
Description: DIODE ZENER 12V 0.25W 2% UNIDIR
Tolerance: ±2%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
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| MMRF1008GHR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GH-2L
Current Rating (Amps): 100µA
Mounting Type: Chassis Mount
Frequency: 900MHz ~ 1.215GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780GH-2L
Part Status: Last Time Buy
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GH-2L
Current Rating (Amps): 100µA
Mounting Type: Chassis Mount
Frequency: 900MHz ~ 1.215GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780GH-2L
Part Status: Last Time Buy
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
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| FS32K142UIT0VLHR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
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| FS32K142UIT0VLHT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
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| SPC5567MVR132 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 238
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 238
DigiKey Programmable: Not Verified
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| MCF51JE256CMB |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Active
Number of I/O: 48
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Active
Number of I/O: 48
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| FS32K144UIT0VLHR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
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| S9S08RN60W1MLH |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 8BIT 60KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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| S9S08RN60W1MLHR |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
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| MPC8555VTALF |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 667MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 667MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
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| MVF51NN151CMK50 |
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Виробник: NXP USA Inc.
Description: IC MPU VYBRID 500MHZ 364LFBGA
Part Status: Active
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Description: IC MPU VYBRID 500MHZ 364LFBGA
Part Status: Active
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
на замовлення 447 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1704.16 грн |
| P3S0200GMX |
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Виробник: NXP USA Inc.
Description: IC BUS SW 2X1:2,2X2:1 10-XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 2 x 1:2, 2 x 2:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 10-XQFN (1.55x2)
Part Status: Active
Description: IC BUS SW 2X1:2,2X2:1 10-XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 2 x 1:2, 2 x 2:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 10-XQFN (1.55x2)
Part Status: Active
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| P3S0200GMX |
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Виробник: NXP USA Inc.
Description: IC BUS SW 2X1:2,2X2:1 10-XQFN
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 2 x 1:2, 2 x 2:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 10-XQFN (1.55x2)
Part Status: Active
Description: IC BUS SW 2X1:2,2X2:1 10-XQFN
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 2 x 1:2, 2 x 2:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 10-XQFN (1.55x2)
Part Status: Active
на замовлення 4207 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 57.75 грн |
| 10+ | 39.39 грн |
| 25+ | 35.38 грн |
| 100+ | 29.14 грн |
| 250+ | 27.20 грн |
| 500+ | 26.03 грн |
| 1000+ | 24.66 грн |
| 2500+ | 24.20 грн |
| 74AVCH16245DGG112 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AVCH16245DGG - BU
Part Status: Active
Packaging: Bulk
Description: NOW NEXPERIA 74AVCH16245DGG - BU
Part Status: Active
Packaging: Bulk
на замовлення 945 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 329+ | 67.53 грн |
| N74F125N,602 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14DIP
Number of Bits per Element: 1
Number of Elements: 4
Part Status: Obsolete
Supplier Device Package: 14-DIP
Current - Output High, Low: 15mA, 64mA
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Logic Type: Buffer, Non-Inverting
Description: IC BUFFER NON-INVERT 5.5V 14DIP
Number of Bits per Element: 1
Number of Elements: 4
Part Status: Obsolete
Supplier Device Package: 14-DIP
Current - Output High, Low: 15mA, 64mA
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Logic Type: Buffer, Non-Inverting
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| MPC8349CZUAJDB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
Description: IC MPU MPC83XX 533MHZ 672LBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
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| LPC43S30FET100K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b SAR; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Description: IC MCU 32BIT ROMLESS 100TFBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b SAR; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
на замовлення 1200 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 669.32 грн |
| 10+ | 505.57 грн |
| 25+ | 470.74 грн |
| 100+ | 405.85 грн |
| 260+ | 398.30 грн |
| MIMXRT1040-EVK |
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Виробник: NXP USA Inc.
Description: EVAL KIT I.MX RT1040
Core Processor: ARM® Cortex®-M7
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Utilized IC / Part: i.MX RT1040
Board Type: Evaluation Platform
Description: EVAL KIT I.MX RT1040
Core Processor: ARM® Cortex®-M7
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Utilized IC / Part: i.MX RT1040
Board Type: Evaluation Platform
на замовлення 19 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 6859.38 грн |
| SLN-TLHMI-IOT |
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Виробник: NXP USA Inc.
Description: EVAL KIT I.MX RT117H
Part Status: Active
Platform: EdgeReady
Utilized IC / Part: RT117H
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Contents: Board(s), Cable(s)
Type: MCU
Mounting Type: Fixed
Packaging: Bulk
Description: EVAL KIT I.MX RT117H
Part Status: Active
Platform: EdgeReady
Utilized IC / Part: RT117H
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Contents: Board(s), Cable(s)
Type: MCU
Mounting Type: Fixed
Packaging: Bulk
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 21672.32 грн |
| FS32K144HAT0VMHR |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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| FS32K144HFT0MMHT |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Description: IC MCU 32B 512KB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
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| MKW22D512VHA5 |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Package / Case: 63-VFLGA
Packaging: Tray
Serial Interfaces: I2C, JTAG, SPI, UART, USB
RF Family/Standard: 802.15.4
Modulation: DSSS, O-QPSK
GPIO: 2
Supplier Device Package: 63-MAPLGA (8x8)
Current - Transmitting: 19mA
Data Rate (Max): 250kbps
Current - Receiving: 15mA
Protocol: Zigbee®
Power - Output: 8dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB SRAM
DigiKey Programmable: Not Verified
Part Status: Active
Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Package / Case: 63-VFLGA
Packaging: Tray
Serial Interfaces: I2C, JTAG, SPI, UART, USB
RF Family/Standard: 802.15.4
Modulation: DSSS, O-QPSK
GPIO: 2
Supplier Device Package: 63-MAPLGA (8x8)
Current - Transmitting: 19mA
Data Rate (Max): 250kbps
Current - Receiving: 15mA
Protocol: Zigbee®
Power - Output: 8dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB SRAM
DigiKey Programmable: Not Verified
Part Status: Active
на замовлення 1214 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 776.92 грн |
| 10+ | 650.17 грн |
| 25+ | 616.07 грн |
| 100+ | 534.23 грн |
| 260+ | 506.86 грн |
| 520+ | 488.36 грн |
| 1040+ | 463.23 грн |
| 74AXP2G34GSH |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 2.75V 6XSON
Part Status: Active
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
Description: IC BUFFER NON-INVERT 2.75V 6XSON
Part Status: Active
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
на замовлення 4180 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2862+ | 7.40 грн |














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