Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2705) > Сторінка 23 з 46
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||
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IPC0245-S | Chip Quik Inc. |
Description: BGA-4 (0.4 MM PITCH, 0.88 X 0.88Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: BGA Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 4 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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IPC0246 | Chip Quik Inc. |
Description: MODULE-5 TO DIP-6 SMT ADAPTER (0Packaging: Bulk Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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IPC0246-S | Chip Quik Inc. |
Description: MODULE-5 (0.822 MM PITCH, 3.5 XPackaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: Module Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 5 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0247 | Chip Quik Inc. |
Description: MODULE-6 TO DIP-6 SMT ADAPTER (0Packaging: Bulk Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.038" (0.97mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
на замовлення 49 шт: термін постачання 21-31 дні (днів) |
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IPC0247-S | Chip Quik Inc. |
Description: MODULE-6 (0.966 MM PITCH, 3.76 XPackaging: Bulk Material: Stainless Steel Pitch: 0.038" (0.97mm) Type: Module Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 6 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0248 | Chip Quik Inc. |
Description: PLCC-12 TO DIP-12 SMT ADAPTER (1Packaging: Bulk Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: PLCC Part Status: Active |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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IPC0248-S | Chip Quik Inc. |
Description: PLCC-12 (1.27 MM PITCH, 5 X 5 MMPackaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 12 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0249 | Chip Quik Inc. |
Description: RAD-PAK-70 TO DIP-70 SMT ADAPTERPackaging: Bulk Size / Dimension: 3.500" L x 1.000" W (88.90mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 70 Pitch: 0.025" (0.64mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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IPC0249-S | Chip Quik Inc. |
Description: RAD-PAK-70 (0.635 MM PITCH, 20.8Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Inner Dimension: 1.000" L x 0.819" W (25.40mm x 20.80mm) Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 70 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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IPC0250 | Chip Quik Inc. |
Description: SMD-0.5 TO DIP-8 SMT ADAPTER (3.Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.156" (3.96mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 513 шт В кошику од. на суму грн. | ||||||||||||
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IPC0250-S | Chip Quik Inc. |
Description: SMD-0.5 (3.81 MM PITCH, 10.28 XPackaging: Bulk Material: Stainless Steel Pitch: 0.150" (3.81mm) Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 8 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0251 | Chip Quik Inc. |
Description: DFN-18 TO DIP-22 SMT ADAPTER (0.Packaging: Bulk Size / Dimension: 1.000" x 1.100" (25.40mm x 27.94mm) Material: FR4 Epoxy Glass Number of Positions: 22 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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IPC0251-S | Chip Quik Inc. |
Description: DFN-18 (0.5 MM PITCH, 5 X 5 MM BPackaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 18 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0252 | Chip Quik Inc. |
Description: POWERPAK 1212-8 SINGLE TO DIP-8Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
на замовлення 74 шт: термін постачання 21-31 дні (днів) |
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IPC0252-S | Chip Quik Inc. |
Description: POWERPAK 1212-8 SINGLE (0.65 MMPackaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: PowerPAK Inner Dimension: 0.130" L x 0.130" W (3.30mm x 3.30mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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IPC0253 | Chip Quik Inc. |
Description: POWERPAK 1212-8 DOUBLE TO DIP-8Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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IPC0253-S | Chip Quik Inc. |
Description: POWERPAK 1212-8 DOUBLE (0.65 MMPackaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: PowerPAK Inner Dimension: 0.130" L x 0.130" W (3.30mm x 3.30mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 8 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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IPC0254 | Chip Quik Inc. |
Description: SOT89-5 TO DIP-6 SMT ADAPTER (1.Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.059" (1.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-89 Part Status: Active |
на замовлення 65 шт: термін постачання 21-31 дні (днів) |
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IPC0254-S | Chip Quik Inc. |
Description: SOT89-5 (1.5 MM PITCH, 4.6 X 2.6Packaging: Bulk Material: Stainless Steel Pitch: 0.059" (1.50mm) Inner Dimension: 0.102" L x 0.063" W (2.60mm x 1.60mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 5 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0255 | Chip Quik Inc. |
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.6Packaging: Bulk Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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IPC0255-S | Chip Quik Inc. |
Description: DFN-6 (0.65 MM PITCH, 2.5 X 2.5Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: DFN Inner Dimension: 0.098" L x 0.098" W (2.50mm x 2.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 6 |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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IPC0256 | Chip Quik Inc. |
Description: LGA-28 TO DIP-28 SMT ADAPTER (0.Packaging: Bulk Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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IPC0256-S | Chip Quik Inc. |
Description: LGA-28 (0.5 MM PITCH, 5.2 X 3.8Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LGA Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 28 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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IPC0257 | Chip Quik Inc. |
Description: QFN-34 TO DIP-38 SMT ADAPTER (0.Packaging: Bulk Size / Dimension: 1.000" L x 1.900" W (25.40mm x 48.26mm) Material: FR4 Epoxy Glass Number of Positions: 38 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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IPC0257-S | Chip Quik Inc. |
Description: QFN-34 (0.4 MM PITCH, 5 X 4 MM BPackaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: QFN Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 34 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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IPC0258 | Chip Quik Inc. |
Description: WQFN-14 (510BR) TO DIP-18 SMT ADPackaging: Bulk Size / Dimension: 1.000" L x 0.900" W (25.40mm x 22.86mm) Material: FR4 Epoxy Glass Number of Positions: 18 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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IPC0258-S | Chip Quik Inc. |
Description: WQFN-14 (510BR) (0.5 MM PITCH, 2Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Inner Dimension: 0.098" L x 0.098" W (2.50mm x 2.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 14 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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IPC0261 | Chip Quik Inc. |
Description: QFN-12 TO DIP-12 SMT ADAPTER (0.Packaging: Bulk Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
на замовлення 99 шт: термін постачання 21-31 дні (днів) |
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IPC0261-S | Chip Quik Inc. |
Description: QFN-12 (0.4 MM PITCH, 1.6 X 1.6Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: QFN Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 12 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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IPC0266C | Chip Quik Inc. |
Description: SOIC-8 TO TO-8 SMT ADAPTER (1.27Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SOIC to TO-8 Package Accepted: SOIC |
на замовлення 134 шт: термін постачання 21-31 дні (днів) |
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IPC0266-S | Chip Quik Inc. |
Description: SOIC-8 (1.27 MM PITCH, 150/200 MPackaging: Bulk Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
товару немає в наявності |
Мінімальне замовлення: 233 шт В кошику од. на суму грн. | ||||||||||||
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IPC0267C | Chip Quik Inc. |
Description: DIP-8 SOCKET TO TO-8 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to TO-8 Package Accepted: DIP |
товару немає в наявності |
Мінімальне замовлення: 272 шт В кошику од. на суму грн. | ||||||||||||
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IPC-TEST-FLUX-1-DRY | Chip Quik Inc. |
Description: SOLDERABILITY TESTING FLUX #1 FOPackaging: Bulk Type: Flux - No Clean, Liquid Form: Bottle, 1 oz (28.35g) Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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IPC-TEST-FLUX-2-DRY | Chip Quik Inc. |
Description: SOLDERABILITY TESTING FLUX #2 FOPackaging: Bulk Type: Flux - No Clean, Liquid Form: Bottle, 1 oz (28.35g) Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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JET551AX10T5 | Chip Quik Inc. |
Description: JET PRINTING SOLDER PASTE SN63/PPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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JET551AX30T5 | Chip Quik Inc. |
Description: JET PRINTING SOLDER PASTE SN63/PPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 3.53 oz (100g) Process: Leaded Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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JET551LT10T5 | Chip Quik Inc. |
Description: JET PRINTING SOLDER PASTE SN42/BPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F ~ 338°F (138°C ~ 170°C) Form: Syringe, 1.23 oz (35g), 10cc Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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JET551LT30T5 | Chip Quik Inc. |
Description: JET PRINTING SOLDER PASTE SN42/BPackaging: Bulk Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 3.53 oz (100g) Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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JET551SNL10T5 | Chip Quik Inc. |
Description: JET PRINTING SOLDER PASTE SN96.5Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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JET551SNL30T5 | Chip Quik Inc. |
Description: JET PRINTING SOLDER PASTE SN96.5Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 3.53 oz (100g) Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| JMP100IMP-G | Chip Quik Inc. | Description: 0.1" 2 PIN JUMPER GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| JMP100IMP-G-OT | Chip Quik Inc. | Description: 0.1" 2 PIN JUMPER GOLD - OPEN TO |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | |||||||||||||
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LS0001 | Chip Quik Inc. |
Description: OR GATE TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.037" (0.95mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23 Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 4163 шт В кошику од. на суму грн. | ||||||||||||
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LS0002 | Chip Quik Inc. |
Description: INVERTER TO DIP-6 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.400" x 0.300" (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-23 Part Status: Active |
на замовлення 145 шт: термін постачання 21-31 дні (днів) |
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LS0003 | Chip Quik Inc. |
Description: AND GATE TO DIP-6 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.400" x 0.300" (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-23 Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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LS0004 | Chip Quik Inc. |
Description: NAND GATE TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.037" (0.95mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23 Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 4163 шт В кошику од. на суму грн. | ||||||||||||
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LS0005 | Chip Quik Inc. |
Description: NOR GATE TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.037" (0.95mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23 Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 4163 шт В кошику од. на суму грн. | ||||||||||||
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LS0006 | Chip Quik Inc. |
Description: EX-OR GATE TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.037" (0.95mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23 Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 4163 шт В кошику од. на суму грн. | ||||||||||||
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LS0007 | Chip Quik Inc. |
Description: INVERTER SCHMITT TRIGGERED TO DI Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.037" (0.95mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23 Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 4163 шт В кошику од. на суму грн. | ||||||||||||
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METAL-WIPES | Chip Quik Inc. |
Description: METAL CHELATING WIPES (IPA/WATERPackaging: Bulk Type: Wipes, Pre-Saturated Size: 9" x 6.1" Applications: General Purpose Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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METAL-WIPES-ANTISTATIC | Chip Quik Inc. |
Description: METAL CHELATING WIPES ANTI-STATIPackaging: Bulk Type: Wipes, Pre-Saturated Size: 9" x 6.1" Applications: General Purpose |
на замовлення 44 шт: термін постачання 21-31 дні (днів) |
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MINISQUEEGE-1 | Chip Quik Inc. |
Description: STENCIL SQUEEGEE 2.125" x 1.125"Packaging: Bulk For Use With/Related Products: Boards, Stencils Accessory Type: Stencil Squeegee Part Status: Active |
на замовлення 391 шт: термін постачання 21-31 дні (днів) |
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MLU1 | Chip Quik Inc. |
Description: LED HANDHELD MAGNIFIER 10X (40 DPackaging: Bulk Color: White Mounting Type: Handheld Lens Style/Size: 40 Diopter (10x), 0.800" (20.32mm) Diameter Bulb: LED Lamp/Magnifier Type: Lamp, Magnifier Part Status: Active |
на замовлення 147 шт: термін постачання 21-31 дні (днів) |
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MLU2 | Chip Quik Inc. |
Description: LED MAGNIFIER 2.5X (10 DIOPTER)Packaging: Bulk Color: White Mounting Type: Handheld Lens Style/Size: 10 Diopter, 2.5x, 1.80" (45.72mm) Diameter Bulb: LED Lamp/Magnifier Type: Lamp, Magnifier |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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MLU-8066-2BHC | Chip Quik Inc. |
Description: LAMP MAGNIFIER 3 DIOPT 120V 22WPackaging: Box Color: White Voltage: 120V Mounting Type: Base, Weighted Lens Style/Size: 3 Diopter (1.75x), 5.00" (127.00mm) Diameter Bulb: Fluorescent, 22W Lamp/Magnifier Type: Lamp, Magnifier Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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MLU-8093 | Chip Quik Inc. |
Description: LAMP MAGNIFIER 3 DIOPT 120V 12WPackaging: Box Color: White Voltage: 120V Mounting Type: Base, Weighted Lens Style/Size: 3 Diopter (1.75x), 3.94" (100.00mm) Diameter Bulb: Fluorescent, 12W Lamp/Magnifier Type: Lamp, Magnifier |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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MLU-8093-B | Chip Quik Inc. |
Description: LAMP MAGNIFIER 3 DIOPT 120V 12W |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||
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MPH100IMP40F-G-V-SM | Chip Quik Inc. |
Description: 0.1" 40 PIN MACHINE PIN VERTICALPackaging: Bulk For Use With/Related Products: Prototyping Board Accessory Type: Header, 40 Pin Part Status: Active |
на замовлення 147 шт: термін постачання 21-31 дні (днів) |
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MPH100IMP40F-G-V-SP | Chip Quik Inc. |
Description: 0.1" 40 PIN MACHINE PIN VERTICAL |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPH100IMP40M-G-V-SM | Chip Quik Inc. |
Description: 0.1" 40 PIN MACHINE PIN VERTICALPackaging: Bulk Accessory Type: Header, 40 Pin |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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| IPC0245-S |
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Виробник: Chip Quik Inc.
Description: BGA-4 (0.4 MM PITCH, 0.88 X 0.88
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
Description: BGA-4 (0.4 MM PITCH, 0.88 X 0.88
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
товару немає в наявності
В кошику
од. на суму грн.
| IPC0246 |
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Виробник: Chip Quik Inc.
Description: MODULE-5 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: MODULE-5 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 274.59 грн |
| IPC0246-S |
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Виробник: Chip Quik Inc.
Description: MODULE-5 (0.822 MM PITCH, 3.5 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: Module
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
Description: MODULE-5 (0.822 MM PITCH, 3.5 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: Module
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 785.98 грн |
| IPC0247 |
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Виробник: Chip Quik Inc.
Description: MODULE-6 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.038" (0.97mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: MODULE-6 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.038" (0.97mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 49 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 304.67 грн |
| IPC0247-S |
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Виробник: Chip Quik Inc.
Description: MODULE-6 (0.966 MM PITCH, 3.76 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.038" (0.97mm)
Type: Module
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
Description: MODULE-6 (0.966 MM PITCH, 3.76 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.038" (0.97mm)
Type: Module
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 785.98 грн |
| IPC0248 |
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Виробник: Chip Quik Inc.
Description: PLCC-12 TO DIP-12 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
Description: PLCC-12 TO DIP-12 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 598.54 грн |
| IPC0248-S |
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Виробник: Chip Quik Inc.
Description: PLCC-12 (1.27 MM PITCH, 5 X 5 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Description: PLCC-12 (1.27 MM PITCH, 5 X 5 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 785.98 грн |
| IPC0249 |
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Виробник: Chip Quik Inc.
Description: RAD-PAK-70 TO DIP-70 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.500" L x 1.000" W (88.90mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 70
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: RAD-PAK-70 TO DIP-70 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.500" L x 1.000" W (88.90mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 70
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1099.90 грн |
| IPC0249-S |
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Виробник: Chip Quik Inc.
Description: RAD-PAK-70 (0.635 MM PITCH, 20.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Inner Dimension: 1.000" L x 0.819" W (25.40mm x 20.80mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 70
Description: RAD-PAK-70 (0.635 MM PITCH, 20.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Inner Dimension: 1.000" L x 0.819" W (25.40mm x 20.80mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 70
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 785.98 грн |
| IPC0250 |
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Виробник: Chip Quik Inc.
Description: SMD-0.5 TO DIP-8 SMT ADAPTER (3.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.156" (3.96mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: SMD-0.5 TO DIP-8 SMT ADAPTER (3.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.156" (3.96mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 513 шт
В кошику
од. на суму грн.
| IPC0250-S |
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Виробник: Chip Quik Inc.
Description: SMD-0.5 (3.81 MM PITCH, 10.28 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.150" (3.81mm)
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
Description: SMD-0.5 (3.81 MM PITCH, 10.28 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.150" (3.81mm)
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 785.98 грн |
| IPC0251 |
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Виробник: Chip Quik Inc.
Description: DFN-18 TO DIP-22 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" x 1.100" (25.40mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-18 TO DIP-22 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" x 1.100" (25.40mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 517.56 грн |
| IPC0251-S |
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Виробник: Chip Quik Inc.
Description: DFN-18 (0.5 MM PITCH, 5 X 5 MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 18
Description: DFN-18 (0.5 MM PITCH, 5 X 5 MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 18
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 785.98 грн |
| IPC0252 |
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Виробник: Chip Quik Inc.
Description: POWERPAK 1212-8 SINGLE TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: POWERPAK 1212-8 SINGLE TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 74 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 349.41 грн |
| IPC0252-S |
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Виробник: Chip Quik Inc.
Description: POWERPAK 1212-8 SINGLE (0.65 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerPAK
Inner Dimension: 0.130" L x 0.130" W (3.30mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: POWERPAK 1212-8 SINGLE (0.65 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerPAK
Inner Dimension: 0.130" L x 0.130" W (3.30mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 850.77 грн |
| IPC0253 |
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Виробник: Chip Quik Inc.
Description: POWERPAK 1212-8 DOUBLE TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: POWERPAK 1212-8 DOUBLE TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 349.41 грн |
| IPC0253-S |
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Виробник: Chip Quik Inc.
Description: POWERPAK 1212-8 DOUBLE (0.65 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerPAK
Inner Dimension: 0.130" L x 0.130" W (3.30mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
Description: POWERPAK 1212-8 DOUBLE (0.65 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerPAK
Inner Dimension: 0.130" L x 0.130" W (3.30mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 785.98 грн |
| IPC0254 |
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Виробник: Chip Quik Inc.
Description: SOT89-5 TO DIP-6 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.059" (1.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-89
Part Status: Active
Description: SOT89-5 TO DIP-6 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.059" (1.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-89
Part Status: Active
на замовлення 65 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 181.26 грн |
| IPC0254-S |
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Виробник: Chip Quik Inc.
Description: SOT89-5 (1.5 MM PITCH, 4.6 X 2.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.059" (1.50mm)
Inner Dimension: 0.102" L x 0.063" W (2.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
Description: SOT89-5 (1.5 MM PITCH, 4.6 X 2.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.059" (1.50mm)
Inner Dimension: 0.102" L x 0.063" W (2.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 785.98 грн |
| IPC0255 |
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Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 313.93 грн |
| IPC0255-S |
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Виробник: Chip Quik Inc.
Description: DFN-6 (0.65 MM PITCH, 2.5 X 2.5
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.098" L x 0.098" W (2.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Description: DFN-6 (0.65 MM PITCH, 2.5 X 2.5
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.098" L x 0.098" W (2.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 830.71 грн |
| IPC0256 |
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Виробник: Chip Quik Inc.
Description: LGA-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 785.98 грн |
| IPC0256-S |
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Виробник: Chip Quik Inc.
Description: LGA-28 (0.5 MM PITCH, 5.2 X 3.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Description: LGA-28 (0.5 MM PITCH, 5.2 X 3.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 847.68 грн |
| IPC0257 |
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Виробник: Chip Quik Inc.
Description: QFN-34 TO DIP-38 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.900" W (25.40mm x 48.26mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-34 TO DIP-38 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.900" W (25.40mm x 48.26mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 48 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 771.32 грн |
| IPC0257-S |
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Виробник: Chip Quik Inc.
Description: QFN-34 (0.4 MM PITCH, 5 X 4 MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 34
Description: QFN-34 (0.4 MM PITCH, 5 X 4 MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 34
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 785.98 грн |
| IPC0258 |
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Виробник: Chip Quik Inc.
Description: WQFN-14 (510BR) TO DIP-18 SMT AD
Packaging: Bulk
Size / Dimension: 1.000" L x 0.900" W (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: WQFN-14 (510BR) TO DIP-18 SMT AD
Packaging: Bulk
Size / Dimension: 1.000" L x 0.900" W (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 523.73 грн |
| IPC0258-S |
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Виробник: Chip Quik Inc.
Description: WQFN-14 (510BR) (0.5 MM PITCH, 2
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Inner Dimension: 0.098" L x 0.098" W (2.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Description: WQFN-14 (510BR) (0.5 MM PITCH, 2
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Inner Dimension: 0.098" L x 0.098" W (2.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 857.71 грн |
| IPC0261 |
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Виробник: Chip Quik Inc.
Description: QFN-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
на замовлення 99 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 451.99 грн |
| IPC0261-S |
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Виробник: Chip Quik Inc.
Description: QFN-12 (0.4 MM PITCH, 1.6 X 1.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN
Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Description: QFN-12 (0.4 MM PITCH, 1.6 X 1.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN
Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 825.31 грн |
| IPC0266C |
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Виробник: Chip Quik Inc.
Description: SOIC-8 TO TO-8 SMT ADAPTER (1.27
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SOIC to TO-8
Package Accepted: SOIC
Description: SOIC-8 TO TO-8 SMT ADAPTER (1.27
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SOIC to TO-8
Package Accepted: SOIC
на замовлення 134 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 924.81 грн |
| 5+ | 771.27 грн |
| 10+ | 728.71 грн |
| 25+ | 637.43 грн |
| 50+ | 606.57 грн |
| 100+ | 578.94 грн |
| IPC0266-S |
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Виробник: Chip Quik Inc.
Description: SOIC-8 (1.27 MM PITCH, 150/200 M
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: SOIC-8 (1.27 MM PITCH, 150/200 M
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
товару немає в наявності
Мінімальне замовлення: 233 шт
В кошику
од. на суму грн.
| IPC0267C |
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Виробник: Chip Quik Inc.
Description: DIP-8 SOCKET TO TO-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to TO-8
Package Accepted: DIP
Description: DIP-8 SOCKET TO TO-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to TO-8
Package Accepted: DIP
товару немає в наявності
Мінімальне замовлення: 272 шт
В кошику
од. на суму грн.
| IPC-TEST-FLUX-1-DRY |
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Виробник: Chip Quik Inc.
Description: SOLDERABILITY TESTING FLUX #1 FO
Packaging: Bulk
Type: Flux - No Clean, Liquid
Form: Bottle, 1 oz (28.35g)
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDERABILITY TESTING FLUX #1 FO
Packaging: Bulk
Type: Flux - No Clean, Liquid
Form: Bottle, 1 oz (28.35g)
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 980.35 грн |
| IPC-TEST-FLUX-2-DRY |
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Виробник: Chip Quik Inc.
Description: SOLDERABILITY TESTING FLUX #2 FO
Packaging: Bulk
Type: Flux - No Clean, Liquid
Form: Bottle, 1 oz (28.35g)
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDERABILITY TESTING FLUX #2 FO
Packaging: Bulk
Type: Flux - No Clean, Liquid
Form: Bottle, 1 oz (28.35g)
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 980.35 грн |
| JET551AX10T5 |
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Виробник: Chip Quik Inc.
Description: JET PRINTING SOLDER PASTE SN63/P
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: JET PRINTING SOLDER PASTE SN63/P
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| JET551AX30T5 |
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Виробник: Chip Quik Inc.
Description: JET PRINTING SOLDER PASTE SN63/P
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: JET PRINTING SOLDER PASTE SN63/P
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| JET551LT10T5 |
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Виробник: Chip Quik Inc.
Description: JET PRINTING SOLDER PASTE SN42/B
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: JET PRINTING SOLDER PASTE SN42/B
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| JET551LT30T5 |
![]() |
Виробник: Chip Quik Inc.
Description: JET PRINTING SOLDER PASTE SN42/B
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 3.53 oz (100g)
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: JET PRINTING SOLDER PASTE SN42/B
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 3.53 oz (100g)
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| JET551SNL10T5 |
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Виробник: Chip Quik Inc.
Description: JET PRINTING SOLDER PASTE SN96.5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: JET PRINTING SOLDER PASTE SN96.5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3557.33 грн |
| JET551SNL30T5 |
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Виробник: Chip Quik Inc.
Description: JET PRINTING SOLDER PASTE SN96.5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 3.53 oz (100g)
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: JET PRINTING SOLDER PASTE SN96.5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 3.53 oz (100g)
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| JMP100IMP-G |
Виробник: Chip Quik Inc.
Description: 0.1" 2 PIN JUMPER GOLD
Description: 0.1" 2 PIN JUMPER GOLD
товару немає в наявності
В кошику
од. на суму грн.
| JMP100IMP-G-OT |
Виробник: Chip Quik Inc.
Description: 0.1" 2 PIN JUMPER GOLD - OPEN TO
Description: 0.1" 2 PIN JUMPER GOLD - OPEN TO
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| LS0001 |
Виробник: Chip Quik Inc.
Description: OR GATE TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
Description: OR GATE TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 4163 шт
В кошику
од. на суму грн.
| LS0002 |
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Виробник: Chip Quik Inc.
Description: INVERTER TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" x 0.300" (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
Description: INVERTER TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" x 0.300" (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
на замовлення 145 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 8+ | 40.11 грн |
| LS0003 |
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Виробник: Chip Quik Inc.
Description: AND GATE TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" x 0.300" (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
Description: AND GATE TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" x 0.300" (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 8+ | 40.11 грн |
| LS0004 |
Виробник: Chip Quik Inc.
Description: NAND GATE TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
Description: NAND GATE TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 4163 шт
В кошику
од. на суму грн.
| LS0005 |
Виробник: Chip Quik Inc.
Description: NOR GATE TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
Description: NOR GATE TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 4163 шт
В кошику
од. на суму грн.
| LS0006 |
Виробник: Chip Quik Inc.
Description: EX-OR GATE TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
Description: EX-OR GATE TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 4163 шт
В кошику
од. на суму грн.
| LS0007 |
Виробник: Chip Quik Inc.
Description: INVERTER SCHMITT TRIGGERED TO DI
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
Description: INVERTER SCHMITT TRIGGERED TO DI
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 4163 шт
В кошику
од. на суму грн.
| METAL-WIPES |
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Виробник: Chip Quik Inc.
Description: METAL CHELATING WIPES (IPA/WATER
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: General Purpose
Part Status: Active
Description: METAL CHELATING WIPES (IPA/WATER
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: General Purpose
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 941.01 грн |
| METAL-WIPES-ANTISTATIC |
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Виробник: Chip Quik Inc.
Description: METAL CHELATING WIPES ANTI-STATI
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: General Purpose
Description: METAL CHELATING WIPES ANTI-STATI
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: General Purpose
на замовлення 44 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1149.27 грн |
| MINISQUEEGE-1 |
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Виробник: Chip Quik Inc.
Description: STENCIL SQUEEGEE 2.125" x 1.125"
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
Part Status: Active
Description: STENCIL SQUEEGEE 2.125" x 1.125"
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
Part Status: Active
на замовлення 391 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 131.90 грн |
| MLU1 |
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Виробник: Chip Quik Inc.
Description: LED HANDHELD MAGNIFIER 10X (40 D
Packaging: Bulk
Color: White
Mounting Type: Handheld
Lens Style/Size: 40 Diopter (10x), 0.800" (20.32mm) Diameter
Bulb: LED
Lamp/Magnifier Type: Lamp, Magnifier
Part Status: Active
Description: LED HANDHELD MAGNIFIER 10X (40 D
Packaging: Bulk
Color: White
Mounting Type: Handheld
Lens Style/Size: 40 Diopter (10x), 0.800" (20.32mm) Diameter
Bulb: LED
Lamp/Magnifier Type: Lamp, Magnifier
Part Status: Active
на замовлення 147 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1308.16 грн |
| MLU2 |
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Виробник: Chip Quik Inc.
Description: LED MAGNIFIER 2.5X (10 DIOPTER)
Packaging: Bulk
Color: White
Mounting Type: Handheld
Lens Style/Size: 10 Diopter, 2.5x, 1.80" (45.72mm) Diameter
Bulb: LED
Lamp/Magnifier Type: Lamp, Magnifier
Description: LED MAGNIFIER 2.5X (10 DIOPTER)
Packaging: Bulk
Color: White
Mounting Type: Handheld
Lens Style/Size: 10 Diopter, 2.5x, 1.80" (45.72mm) Diameter
Bulb: LED
Lamp/Magnifier Type: Lamp, Magnifier
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1565.01 грн |
| 5+ | 1482.68 грн |
| 10+ | 1458.32 грн |
| MLU-8066-2BHC |
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Виробник: Chip Quik Inc.
Description: LAMP MAGNIFIER 3 DIOPT 120V 22W
Packaging: Box
Color: White
Voltage: 120V
Mounting Type: Base, Weighted
Lens Style/Size: 3 Diopter (1.75x), 5.00" (127.00mm) Diameter
Bulb: Fluorescent, 22W
Lamp/Magnifier Type: Lamp, Magnifier
Part Status: Active
Description: LAMP MAGNIFIER 3 DIOPT 120V 22W
Packaging: Box
Color: White
Voltage: 120V
Mounting Type: Base, Weighted
Lens Style/Size: 3 Diopter (1.75x), 5.00" (127.00mm) Diameter
Bulb: Fluorescent, 22W
Lamp/Magnifier Type: Lamp, Magnifier
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 8533.89 грн |
| MLU-8093 |
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Виробник: Chip Quik Inc.
Description: LAMP MAGNIFIER 3 DIOPT 120V 12W
Packaging: Box
Color: White
Voltage: 120V
Mounting Type: Base, Weighted
Lens Style/Size: 3 Diopter (1.75x), 3.94" (100.00mm) Diameter
Bulb: Fluorescent, 12W
Lamp/Magnifier Type: Lamp, Magnifier
Description: LAMP MAGNIFIER 3 DIOPT 120V 12W
Packaging: Box
Color: White
Voltage: 120V
Mounting Type: Base, Weighted
Lens Style/Size: 3 Diopter (1.75x), 3.94" (100.00mm) Diameter
Bulb: Fluorescent, 12W
Lamp/Magnifier Type: Lamp, Magnifier
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3983.87 грн |
| MLU-8093-B |
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Виробник: Chip Quik Inc.
Description: LAMP MAGNIFIER 3 DIOPT 120V 12W
Description: LAMP MAGNIFIER 3 DIOPT 120V 12W
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
| MPH100IMP40F-G-V-SM |
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Виробник: Chip Quik Inc.
Description: 0.1" 40 PIN MACHINE PIN VERTICAL
Packaging: Bulk
For Use With/Related Products: Prototyping Board
Accessory Type: Header, 40 Pin
Part Status: Active
Description: 0.1" 40 PIN MACHINE PIN VERTICAL
Packaging: Bulk
For Use With/Related Products: Prototyping Board
Accessory Type: Header, 40 Pin
Part Status: Active
на замовлення 147 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 139.61 грн |
| MPH100IMP40F-G-V-SP |
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Виробник: Chip Quik Inc.
Description: 0.1" 40 PIN MACHINE PIN VERTICAL
Description: 0.1" 40 PIN MACHINE PIN VERTICAL
товару немає в наявності
В кошику
од. на суму грн.
| MPH100IMP40M-G-V-SM |
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Виробник: Chip Quik Inc.
Description: 0.1" 40 PIN MACHINE PIN VERTICAL
Packaging: Bulk
Accessory Type: Header, 40 Pin
Description: 0.1" 40 PIN MACHINE PIN VERTICAL
Packaging: Bulk
Accessory Type: Header, 40 Pin
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 148.86 грн |


























































