Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2415) > Сторінка 1 з 41
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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5CC-PLUNGER | Chip Quik Inc. |
Description: PLUNGER AND RETAINER FOR 5CC SYR Packaging: Bulk For Use With/Related Products: Syringes Accessory Type: Plunger Retainer |
на замовлення 129 шт: термін постачання 21-31 дні (днів) |
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AD1-10S | Chip Quik Inc. | Description: THERMOSET CHIP GLUE (RED) - 10CC |
товар відсутній |
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AD1-200S | Chip Quik Inc. | Description: THERMOSET CHIP GLUE RED 200G |
товар відсутній |
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AD1-30S | Chip Quik Inc. | Description: THERMOSET CHIP GLUE (RED) - 30CC |
товар відсутній |
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ADAPT_COMBO | Chip Quik Inc. | Description: SMT ADAPTER VALUE PACK |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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BARSN42BI57AG1 | Chip Quik Inc. |
Description: SOLDER BAR SN42/BI57/AG1 1LB SUP Packaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Bar Solder Melting Point: 280°F (138°C) Form: Bar, 1 lb (454g) Process: Lead Free |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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BARSN42BI57AG1-8OZ | Chip Quik Inc. |
Description: SOLDER BAR SN42/BI57/AG1 8OZ 227 Packaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Bar Solder Melting Point: 280°F (138°C) Form: Bar, 0.5 lb (227g) Process: Lead Free |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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BARSN60PB40 | Chip Quik Inc. |
Description: SOLDER BAR SN60/PB40 1LB SUPER L Packaging: Bulk Composition: Sn60Pb40 (60/40) Type: Bar Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Bar, 1 lb (454g) Process: Leaded Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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BARSN60PB40-8OZ | Chip Quik Inc. |
Description: SOLDER BAR SN60/PB40 8OZ 227G SU Packaging: Bulk Composition: Sn60Pb40 (60/40) Type: Bar Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Bar, 0.5 lb (227g) Process: Leaded Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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BARSN62PB36AG2 | Chip Quik Inc. |
Description: SOLDER BAR SN62/PB36/AG2 1LB SUP Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Bar Solder Melting Point: 354°F (179°C) Form: Bar, 1 lb (454g) Process: Leaded Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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BARSN62PB36AG2-8OZ | Chip Quik Inc. |
Description: SOLDER BAR SN62/PB36/AG2 8OZ 227 Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Bar Solder Melting Point: 354°F (179°C) Form: Bar, 0.5 lb (227g) Process: Leaded Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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BARSN63PB37 | Chip Quik Inc. |
Description: SOLDER BAR SN63/PB37 1LB SUPER L Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Bar Solder Melting Point: 361°F (183°C) Form: Bar, 1 lb (454g) Process: Leaded Part Status: Active |
на замовлення 350 шт: термін постачання 21-31 дні (днів) |
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BARSN63PB37-8OZ | Chip Quik Inc. |
Description: SOLDER BAR SN63/PB37 8OZ 227G SU Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Bar Solder Melting Point: 361°F (183°C) Form: Bar, 0.5 lb (227g) Process: Leaded Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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BARSN96.5AG3.0CU0.5 | Chip Quik Inc. |
Description: SOLDER BAR SN96.5/AG3.0/CU0.5 1L Packaging: Bulk Composition: Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) Type: Bar Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Bar, 1 lb (454g) Process: Lead Free |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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BARSN96.5AG3.0CU0.5-8OZ | Chip Quik Inc. |
Description: SOLDER BAR SN96.5/AG3.0/CU0.5 8O Packaging: Bulk Composition: Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) Type: Bar Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Bar, 0.5 lb (227g) Process: Lead Free Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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BARSN99.3CU0.7 | Chip Quik Inc. |
Description: SOLDER BAR SN99.3/CU0.7 1LB SUPE Packaging: Bulk Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Bar Solder Melting Point: 441°F (227°C) Form: Bar, 1 lb (454g) Process: Lead Free Part Status: Active |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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BARSN99.3CU0.7-8OZ | Chip Quik Inc. |
Description: SOLDER BAR SN99.3/CU0.7 8OZ 227G Packaging: Bulk Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Bar Solder Melting Point: 441°F (227°C) Form: Bar, 0.5 lb (227g) Process: Lead Free Part Status: Active |
на замовлення 93 шт: термін постачання 21-31 дні (днів) |
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BGA0001 | Chip Quik Inc. |
Description: BGA-100 SMT ADAPTER 0.8 MM PITCH Packaging: Bulk Size / Dimension: 1.900" x 1.900" (48.26mm x 48.26mm) Material: FR4 Epoxy Glass Number of Positions: 100 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to PGA Package Accepted: BGA Part Status: Active |
товар відсутній |
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BGA0001-S | Chip Quik Inc. |
Description: STENCIL BGA-100 .8MM Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: BGA Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 100 |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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BGA0002 | Chip Quik Inc. | Description: BGA-324 SMT ADAPTER 0.8 MM PITCH |
товар відсутній |
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BGA0002-S | Chip Quik Inc. |
Description: STENCIL BGA-324 .8MM Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: BGA Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 324 |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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BGA0004 | Chip Quik Inc. | Description: BGA-100 SMT ADAPTER 1.0 MM PITCH |
товар відсутній |
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BGA0004-S | Chip Quik Inc. |
Description: STENCIL BGA-100 1MM Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: BGA Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 100 |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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BGA0006 | Chip Quik Inc. | Description: BGA-484 SMT ADAPTER 1.0 MM PITCH |
товар відсутній |
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BGA0006-S | Chip Quik Inc. |
Description: STENCIL BGA-484 1MM Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: BGA Outer Dimension: 2.600" L x 1.800" W (66.04mm x 45.72mm) Part Status: Active Number of Positions: 484 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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BGA0007 | Chip Quik Inc. | Description: BGA-100 SMT ADAPTER 1.27 MM PITC |
товар відсутній |
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BGA0007-S | Chip Quik Inc. | Description: STENCIL BGA-100 1.27MM |
товар відсутній |
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BGA0009 | Chip Quik Inc. | Description: BGA-484 SMT ADAPTER 1.27 MM PITC |
товар відсутній |
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BGA0009-S | Chip Quik Inc. |
Description: STENCIL BGA-484 1.27MM Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: BGA Outer Dimension: 2.600" L x 1.800" W (66.04mm x 45.72mm) Part Status: Active Number of Positions: 484 |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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BGA0010 | Chip Quik Inc. |
Description: BGA-42 TO DIP-42 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 2.100" (17.78mm x 53.34mm) Material: FR4 Epoxy Glass Number of Positions: 42 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: BGA Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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BGA0010-S | Chip Quik Inc. |
Description: BGA-42 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: BGA Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 42 |
товар відсутній |
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BGA0011 | Chip Quik Inc. |
Description: BGA-25 TO DIP-25 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm) Material: FR4 Epoxy Glass Number of Positions: 25 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: BGA |
товар відсутній |
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BGA0011-S | Chip Quik Inc. | Description: BGA-25 STENCIL |
товар відсутній |
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BGA0012 | Chip Quik Inc. |
Description: BGA-54 TO DIP-54 SMT ADAPTER (1. Packaging: Bulk Number of Positions: 54 Pitch: 0.047" (1.20mm) Proto Board Type: SMD to DIP Package Accepted: BGA Part Status: Active |
товар відсутній |
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BGA0014 | Chip Quik Inc. |
Description: BGA-54 TO DIP-54 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm) Material: FR4 Epoxy Glass Number of Positions: 54 Pitch: 0.029" (0.75mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: BGA Part Status: Active |
товар відсутній |
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BGA0014-S | Chip Quik Inc. | Description: BGA-54 STENCIL |
товар відсутній |
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BGA0015 | Chip Quik Inc. | Description: BGA-100 SMT ADAPTER (0.65 MM PIT |
товар відсутній |
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BGA0015-S | Chip Quik Inc. | Description: BGA-100 (0.65MM PITCH) STENCIL |
товар відсутній |
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BGA0016 | Chip Quik Inc. |
Description: BGA-25 TO DIP-25 SMT ADAPTER (0. Packaging: Bulk Number of Positions: 25 Pitch: 0.016" (0.40mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
товар відсутній |
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BGA0019 | Chip Quik Inc. |
Description: BGA-36 TO DIP-36 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 36 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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BGA0019-S | Chip Quik Inc. |
Description: BGA-36 (0.4 MM PITCH, 6 X 6 GRID Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: BGA Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 36 |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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BGA0023 | Chip Quik Inc. |
Description: BGA-100 SMT ADAPTER (0.4 MM PITC Packaging: Bulk Size / Dimension: 1.900" x 1.900" (48.26mm x 48.26mm) Material: FR4 Epoxy Glass Number of Positions: 100 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to PGA Package Accepted: BGA |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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BGA0023-S | Chip Quik Inc. |
Description: BGA-100 (0.4 MM PITCH, 10 X 10 G Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: BGA Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 100 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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BGA0027 | Chip Quik Inc. | Description: BGA-121 SMT ADAPTER (0.65MM PITC |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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BGA0027-S | Chip Quik Inc. |
Description: BGA-121 (0.65MM PITCH, 11 X 11 G Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: BGA Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 121 |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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BGA0028 | Chip Quik Inc. |
Description: BGA-36 TO DIP-36 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 36 Pitch: 0.012" (0.30mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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BGA0028-S | Chip Quik Inc. |
Description: BGA-36 STAINLESS STEEL STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.012" (0.30mm) Type: BGA Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 36 |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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BGA0029 | Chip Quik Inc. |
Description: BGA-36 TO DIP-36 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 36 Pitch: 0.014" (0.35mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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BGA0029-S | Chip Quik Inc. |
Description: BGA-36 (0.35 MM PITCH, 6 X 6 GRI Packaging: Bulk Material: Stainless Steel Pitch: 0.014" (0.35mm) Type: BGA Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 36 |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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BGA0030 | Chip Quik Inc. |
Description: BGA-36 TO DIP-36 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 36 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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BGA0030-S | Chip Quik Inc. |
Description: BGA-36 (0.5 MM PITCH, 6 X 6 GRID Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: BGA Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 36 |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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BGA0033 | Chip Quik Inc. |
Description: BGA-144 TO PGA-144 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.100" L x 2.000" W (53.34mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 144 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to Plated Through Hole Board Package Accepted: BGA |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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BGA0033-S | Chip Quik Inc. |
Description: BGA-144 (0.5 MM PITCH, 12 X 12 G Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: BGA Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 144 |
товар відсутній |
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BGA0034 | Chip Quik Inc. |
Description: BGA-676 TO PGA-676 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 4.400" L x 3.500" W (111.76mm x 88.90mm) Material: FR4 Epoxy Glass Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to Plated Through Hole Board Package Accepted: BGA |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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BGA0034-S | Chip Quik Inc. |
Description: BGA-676 (1.0 MM PITCH, 26 X 26 G Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: BGA Inner Dimension: 1.024" L x 1.024" W (26.00mm x 26.00mm) Outer Dimension: 2.600" L x 1.800" W (66.04mm x 45.72mm) Part Status: Active Number of Positions: 676 |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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BGA0035 | Chip Quik Inc. |
Description: BGA-196 TO PGA-196 Packaging: Bulk Size / Dimension: 2.300" L x 2.200" W (58.42mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 196 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to PGA Package Accepted: BGA |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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BGA0035-S | Chip Quik Inc. |
Description: BGA-196 STAINLESS STEEL STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: BGA Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 196 |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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BGA0036 | Chip Quik Inc. |
Description: BGA-169 TO PGA-169 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.300" L x 2.200" W (58.42mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 169 Pitch: 0.030" (0.75mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to PGA Package Accepted: BGA Part Status: Active |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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BGA0036-S | Chip Quik Inc. |
Description: BGA-169 (0.75MM PITCH, 13X13 GRI Packaging: Bulk Material: Stainless Steel Pitch: 0.029" (0.75mm) Type: BGA Inner Dimension: 0.512" L x 0.512" W (13.00mm x 13.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 169 |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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CN0002 | Chip Quik Inc. |
Description: HDMI ADAPTER BOARD Packaging: Bulk Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 19 Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: Connector to DIP Package Accepted: HDMI |
на замовлення 66 шт: термін постачання 21-31 дні (днів) |
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5CC-PLUNGER |
Виробник: Chip Quik Inc.
Description: PLUNGER AND RETAINER FOR 5CC SYR
Packaging: Bulk
For Use With/Related Products: Syringes
Accessory Type: Plunger Retainer
Description: PLUNGER AND RETAINER FOR 5CC SYR
Packaging: Bulk
For Use With/Related Products: Syringes
Accessory Type: Plunger Retainer
на замовлення 129 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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2+ | 162.08 грн |
10+ | 144.84 грн |
100+ | 111.43 грн |
ADAPT_COMBO |
Виробник: Chip Quik Inc.
Description: SMT ADAPTER VALUE PACK
Description: SMT ADAPTER VALUE PACK
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 659.13 грн |
BARSN42BI57AG1 |
Виробник: Chip Quik Inc.
Description: SOLDER BAR SN42/BI57/AG1 1LB SUP
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Bar Solder
Melting Point: 280°F (138°C)
Form: Bar, 1 lb (454g)
Process: Lead Free
Description: SOLDER BAR SN42/BI57/AG1 1LB SUP
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Bar Solder
Melting Point: 280°F (138°C)
Form: Bar, 1 lb (454g)
Process: Lead Free
на замовлення 15 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 3591.73 грн |
BARSN42BI57AG1-8OZ |
Виробник: Chip Quik Inc.
Description: SOLDER BAR SN42/BI57/AG1 8OZ 227
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Bar Solder
Melting Point: 280°F (138°C)
Form: Bar, 0.5 lb (227g)
Process: Lead Free
Description: SOLDER BAR SN42/BI57/AG1 8OZ 227
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Bar Solder
Melting Point: 280°F (138°C)
Form: Bar, 0.5 lb (227g)
Process: Lead Free
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1929.13 грн |
BARSN60PB40 |
Виробник: Chip Quik Inc.
Description: SOLDER BAR SN60/PB40 1LB SUPER L
Packaging: Bulk
Composition: Sn60Pb40 (60/40)
Type: Bar Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Bar, 1 lb (454g)
Process: Leaded
Part Status: Active
Description: SOLDER BAR SN60/PB40 1LB SUPER L
Packaging: Bulk
Composition: Sn60Pb40 (60/40)
Type: Bar Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Bar, 1 lb (454g)
Process: Leaded
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1914.72 грн |
BARSN60PB40-8OZ |
Виробник: Chip Quik Inc.
Description: SOLDER BAR SN60/PB40 8OZ 227G SU
Packaging: Bulk
Composition: Sn60Pb40 (60/40)
Type: Bar Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Bar, 0.5 lb (227g)
Process: Leaded
Part Status: Active
Description: SOLDER BAR SN60/PB40 8OZ 227G SU
Packaging: Bulk
Composition: Sn60Pb40 (60/40)
Type: Bar Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Bar, 0.5 lb (227g)
Process: Leaded
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1089.91 грн |
BARSN62PB36AG2 |
Виробник: Chip Quik Inc.
Description: SOLDER BAR SN62/PB36/AG2 1LB SUP
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Bar Solder
Melting Point: 354°F (179°C)
Form: Bar, 1 lb (454g)
Process: Leaded
Part Status: Active
Description: SOLDER BAR SN62/PB36/AG2 1LB SUP
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Bar Solder
Melting Point: 354°F (179°C)
Form: Bar, 1 lb (454g)
Process: Leaded
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 3667.37 грн |
BARSN62PB36AG2-8OZ |
Виробник: Chip Quik Inc.
Description: SOLDER BAR SN62/PB36/AG2 8OZ 227
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Bar Solder
Melting Point: 354°F (179°C)
Form: Bar, 0.5 lb (227g)
Process: Leaded
Part Status: Active
Description: SOLDER BAR SN62/PB36/AG2 8OZ 227
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Bar Solder
Melting Point: 354°F (179°C)
Form: Bar, 0.5 lb (227g)
Process: Leaded
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1966.59 грн |
BARSN63PB37 |
Виробник: Chip Quik Inc.
Description: SOLDER BAR SN63/PB37 1LB SUPER L
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Bar Solder
Melting Point: 361°F (183°C)
Form: Bar, 1 lb (454g)
Process: Leaded
Part Status: Active
Description: SOLDER BAR SN63/PB37 1LB SUPER L
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Bar Solder
Melting Point: 361°F (183°C)
Form: Bar, 1 lb (454g)
Process: Leaded
Part Status: Active
на замовлення 350 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1978.84 грн |
BARSN63PB37-8OZ |
Виробник: Chip Quik Inc.
Description: SOLDER BAR SN63/PB37 8OZ 227G SU
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Bar Solder
Melting Point: 361°F (183°C)
Form: Bar, 0.5 lb (227g)
Process: Leaded
Part Status: Active
Description: SOLDER BAR SN63/PB37 8OZ 227G SU
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Bar Solder
Melting Point: 361°F (183°C)
Form: Bar, 0.5 lb (227g)
Process: Leaded
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1169.87 грн |
BARSN96.5AG3.0CU0.5 |
Виробник: Chip Quik Inc.
Description: SOLDER BAR SN96.5/AG3.0/CU0.5 1L
Packaging: Bulk
Composition: Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)
Type: Bar Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Bar, 1 lb (454g)
Process: Lead Free
Description: SOLDER BAR SN96.5/AG3.0/CU0.5 1L
Packaging: Bulk
Composition: Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)
Type: Bar Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Bar, 1 lb (454g)
Process: Lead Free
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 5342.93 грн |
BARSN96.5AG3.0CU0.5-8OZ |
Виробник: Chip Quik Inc.
Description: SOLDER BAR SN96.5/AG3.0/CU0.5 8O
Packaging: Bulk
Composition: Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)
Type: Bar Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Bar, 0.5 lb (227g)
Process: Lead Free
Part Status: Active
Description: SOLDER BAR SN96.5/AG3.0/CU0.5 8O
Packaging: Bulk
Composition: Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)
Type: Bar Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Bar, 0.5 lb (227g)
Process: Lead Free
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2815.9 грн |
BARSN99.3CU0.7 |
Виробник: Chip Quik Inc.
Description: SOLDER BAR SN99.3/CU0.7 1LB SUPE
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Bar Solder
Melting Point: 441°F (227°C)
Form: Bar, 1 lb (454g)
Process: Lead Free
Part Status: Active
Description: SOLDER BAR SN99.3/CU0.7 1LB SUPE
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Bar Solder
Melting Point: 441°F (227°C)
Form: Bar, 1 lb (454g)
Process: Lead Free
Part Status: Active
на замовлення 34 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2991.67 грн |
BARSN99.3CU0.7-8OZ |
Виробник: Chip Quik Inc.
Description: SOLDER BAR SN99.3/CU0.7 8OZ 227G
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Bar Solder
Melting Point: 441°F (227°C)
Form: Bar, 0.5 lb (227g)
Process: Lead Free
Part Status: Active
Description: SOLDER BAR SN99.3/CU0.7 8OZ 227G
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Bar Solder
Melting Point: 441°F (227°C)
Form: Bar, 0.5 lb (227g)
Process: Lead Free
Part Status: Active
на замовлення 93 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1707.26 грн |
BGA0001 |
Виробник: Chip Quik Inc.
Description: BGA-100 SMT ADAPTER 0.8 MM PITCH
Packaging: Bulk
Size / Dimension: 1.900" x 1.900" (48.26mm x 48.26mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: BGA
Part Status: Active
Description: BGA-100 SMT ADAPTER 0.8 MM PITCH
Packaging: Bulk
Size / Dimension: 1.900" x 1.900" (48.26mm x 48.26mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: BGA
Part Status: Active
товар відсутній
BGA0001-S |
Виробник: Chip Quik Inc.
Description: STENCIL BGA-100 .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 100
Description: STENCIL BGA-100 .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 100
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1396.06 грн |
BGA0002-S |
Виробник: Chip Quik Inc.
Description: STENCIL BGA-324 .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: BGA
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 324
Description: STENCIL BGA-324 .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: BGA
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 324
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1396.06 грн |
BGA0004-S |
Виробник: Chip Quik Inc.
Description: STENCIL BGA-100 1MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 100
Description: STENCIL BGA-100 1MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 100
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1378.77 грн |
BGA0006-S |
Виробник: Chip Quik Inc.
Description: STENCIL BGA-484 1MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: BGA
Outer Dimension: 2.600" L x 1.800" W (66.04mm x 45.72mm)
Part Status: Active
Number of Positions: 484
Description: STENCIL BGA-484 1MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: BGA
Outer Dimension: 2.600" L x 1.800" W (66.04mm x 45.72mm)
Part Status: Active
Number of Positions: 484
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1396.06 грн |
BGA0009-S |
Виробник: Chip Quik Inc.
Description: STENCIL BGA-484 1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: BGA
Outer Dimension: 2.600" L x 1.800" W (66.04mm x 45.72mm)
Part Status: Active
Number of Positions: 484
Description: STENCIL BGA-484 1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: BGA
Outer Dimension: 2.600" L x 1.800" W (66.04mm x 45.72mm)
Part Status: Active
Number of Positions: 484
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1396.06 грн |
BGA0010 |
Виробник: Chip Quik Inc.
Description: BGA-42 TO DIP-42 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 2.100" (17.78mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 42
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: BGA
Part Status: Active
Description: BGA-42 TO DIP-42 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 2.100" (17.78mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 42
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: BGA
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2327.49 грн |
BGA0010-S |
Виробник: Chip Quik Inc.
Description: BGA-42 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 42
Description: BGA-42 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 42
товар відсутній
BGA0011 |
Виробник: Chip Quik Inc.
Description: BGA-25 TO DIP-25 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 25
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-25 TO DIP-25 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 25
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: BGA
товар відсутній
BGA0012 |
Виробник: Chip Quik Inc.
Description: BGA-54 TO DIP-54 SMT ADAPTER (1.
Packaging: Bulk
Number of Positions: 54
Pitch: 0.047" (1.20mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Part Status: Active
Description: BGA-54 TO DIP-54 SMT ADAPTER (1.
Packaging: Bulk
Number of Positions: 54
Pitch: 0.047" (1.20mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Part Status: Active
товар відсутній
BGA0014 |
Виробник: Chip Quik Inc.
Description: BGA-54 TO DIP-54 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.029" (0.75mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: BGA
Part Status: Active
Description: BGA-54 TO DIP-54 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.029" (0.75mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: BGA
Part Status: Active
товар відсутній
BGA0016 |
Виробник: Chip Quik Inc.
Description: BGA-25 TO DIP-25 SMT ADAPTER (0.
Packaging: Bulk
Number of Positions: 25
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-25 TO DIP-25 SMT ADAPTER (0.
Packaging: Bulk
Number of Positions: 25
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
товар відсутній
BGA0019 |
Виробник: Chip Quik Inc.
Description: BGA-36 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-36 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2194.23 грн |
BGA0019-S |
Виробник: Chip Quik Inc.
Description: BGA-36 (0.4 MM PITCH, 6 X 6 GRID
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 36
Description: BGA-36 (0.4 MM PITCH, 6 X 6 GRID
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 36
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1512.04 грн |
BGA0023 |
Виробник: Chip Quik Inc.
Description: BGA-100 SMT ADAPTER (0.4 MM PITC
Packaging: Bulk
Size / Dimension: 1.900" x 1.900" (48.26mm x 48.26mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: BGA
Description: BGA-100 SMT ADAPTER (0.4 MM PITC
Packaging: Bulk
Size / Dimension: 1.900" x 1.900" (48.26mm x 48.26mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: BGA
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 3961.28 грн |
BGA0023-S |
Виробник: Chip Quik Inc.
Description: BGA-100 (0.4 MM PITCH, 10 X 10 G
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: BGA
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 100
Description: BGA-100 (0.4 MM PITCH, 10 X 10 G
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: BGA
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 100
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1396.06 грн |
BGA0027 |
Виробник: Chip Quik Inc.
Description: BGA-121 SMT ADAPTER (0.65MM PITC
Description: BGA-121 SMT ADAPTER (0.65MM PITC
на замовлення 22 шт:
термін постачання 21-31 дні (днів)BGA0027-S |
Виробник: Chip Quik Inc.
Description: BGA-121 (0.65MM PITCH, 11 X 11 G
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 121
Description: BGA-121 (0.65MM PITCH, 11 X 11 G
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 121
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1512.04 грн |
BGA0028 |
Виробник: Chip Quik Inc.
Description: BGA-36 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.012" (0.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-36 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.012" (0.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4581.51 грн |
BGA0028-S |
Виробник: Chip Quik Inc.
Description: BGA-36 STAINLESS STEEL STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.012" (0.30mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 36
Description: BGA-36 STAINLESS STEEL STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.012" (0.30mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 36
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1648.91 грн |
5+ | 1543.58 грн |
BGA0029 |
Виробник: Chip Quik Inc.
Description: BGA-36 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-36 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2892.98 грн |
BGA0029-S |
Виробник: Chip Quik Inc.
Description: BGA-36 (0.35 MM PITCH, 6 X 6 GRI
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 36
Description: BGA-36 (0.35 MM PITCH, 6 X 6 GRI
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 36
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1512.04 грн |
BGA0030 |
Виробник: Chip Quik Inc.
Description: BGA-36 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-36 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2826.7 грн |
BGA0030-S |
Виробник: Chip Quik Inc.
Description: BGA-36 (0.5 MM PITCH, 6 X 6 GRID
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 36
Description: BGA-36 (0.5 MM PITCH, 6 X 6 GRID
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 36
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1512.04 грн |
BGA0033 |
Виробник: Chip Quik Inc.
Description: BGA-144 TO PGA-144 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.100" L x 2.000" W (53.34mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 144
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to Plated Through Hole Board
Package Accepted: BGA
Description: BGA-144 TO PGA-144 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.100" L x 2.000" W (53.34mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 144
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to Plated Through Hole Board
Package Accepted: BGA
на замовлення 16 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4333.7 грн |
BGA0033-S |
Виробник: Chip Quik Inc.
Description: BGA-144 (0.5 MM PITCH, 12 X 12 G
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 144
Description: BGA-144 (0.5 MM PITCH, 12 X 12 G
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 144
товар відсутній
BGA0034 |
Виробник: Chip Quik Inc.
Description: BGA-676 TO PGA-676 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 4.400" L x 3.500" W (111.76mm x 88.90mm)
Material: FR4 Epoxy Glass
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to Plated Through Hole Board
Package Accepted: BGA
Description: BGA-676 TO PGA-676 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 4.400" L x 3.500" W (111.76mm x 88.90mm)
Material: FR4 Epoxy Glass
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to Plated Through Hole Board
Package Accepted: BGA
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4542.61 грн |
BGA0034-S |
Виробник: Chip Quik Inc.
Description: BGA-676 (1.0 MM PITCH, 26 X 26 G
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: BGA
Inner Dimension: 1.024" L x 1.024" W (26.00mm x 26.00mm)
Outer Dimension: 2.600" L x 1.800" W (66.04mm x 45.72mm)
Part Status: Active
Number of Positions: 676
Description: BGA-676 (1.0 MM PITCH, 26 X 26 G
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: BGA
Inner Dimension: 1.024" L x 1.024" W (26.00mm x 26.00mm)
Outer Dimension: 2.600" L x 1.800" W (66.04mm x 45.72mm)
Part Status: Active
Number of Positions: 676
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1381.66 грн |
BGA0035 |
Виробник: Chip Quik Inc.
Description: BGA-196 TO PGA-196
Packaging: Bulk
Size / Dimension: 2.300" L x 2.200" W (58.42mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 196
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: BGA
Description: BGA-196 TO PGA-196
Packaging: Bulk
Size / Dimension: 2.300" L x 2.200" W (58.42mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 196
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: BGA
на замовлення 28 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4988.51 грн |
BGA0035-S |
Виробник: Chip Quik Inc.
Description: BGA-196 STAINLESS STEEL STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 196
Description: BGA-196 STAINLESS STEEL STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 196
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1396.06 грн |
BGA0036 |
Виробник: Chip Quik Inc.
Description: BGA-169 TO PGA-169 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.300" L x 2.200" W (58.42mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 169
Pitch: 0.030" (0.75mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: BGA
Part Status: Active
Description: BGA-169 TO PGA-169 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.300" L x 2.200" W (58.42mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 169
Pitch: 0.030" (0.75mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: BGA
Part Status: Active
на замовлення 19 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 3325.2 грн |
BGA0036-S |
Виробник: Chip Quik Inc.
Description: BGA-169 (0.75MM PITCH, 13X13 GRI
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.029" (0.75mm)
Type: BGA
Inner Dimension: 0.512" L x 0.512" W (13.00mm x 13.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 169
Description: BGA-169 (0.75MM PITCH, 13X13 GRI
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.029" (0.75mm)
Type: BGA
Inner Dimension: 0.512" L x 0.512" W (13.00mm x 13.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 169
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1396.06 грн |
CN0002 |
Виробник: Chip Quik Inc.
Description: HDMI ADAPTER BOARD
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 19
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: Connector to DIP
Package Accepted: HDMI
Description: HDMI ADAPTER BOARD
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 19
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: Connector to DIP
Package Accepted: HDMI
на замовлення 66 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 688.67 грн |