Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2684) > Сторінка 24 з 45
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||
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NANOCOAT200UV-2-500ML | Chip Quik Inc. |
Description: LIQUID NANO COATING - 2% POLYMERFeatures: Coating Packaging: Bulk Color: Light Yellow Type: Coating Remover Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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NANOCOAT200UV-2-AERO | Chip Quik Inc. |
Description: LIQUID NANO COATING - 2% POLYMERFeatures: Coating Packaging: Bulk Color: Light Yellow Type: Coating Remover Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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NANOCOAT200UV-4-500ML | Chip Quik Inc. |
Description: LIQUID NANO COATING - 4% POLYMERFeatures: Coating Packaging: Bulk Color: Light Yellow Type: Coating Remover Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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NANOCOMP-CRC-10X10 | Chip Quik Inc. |
Description: SENSOR FORCE FLAT MEMBRANEPackaging: Bulk Accessory Type: Force Sensing Material Utilized IC / Part: NANOCOMP |
на замовлення 43 шт: термін постачання 21-31 дні (днів) |
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NANOCOMP-CRC-15X15 | Chip Quik Inc. |
Description: SENSOR FORCE FLAT MEMBRANEPackaging: Bulk Accessory Type: Force Sensing Material Utilized IC / Part: NANOCOMP |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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NANOCOMP-CRC-20X20 | Chip Quik Inc. |
Description: SENSOR FORCE 0.10KGFPackaging: Bulk Accessory Type: Force Sensing Material Utilized IC / Part: NANOCOMP |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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NANOCOMP-SQR-10X10 | Chip Quik Inc. |
Description: SENSOR FORCE FLAT MEMBRANEPackaging: Bulk Accessory Type: Force Sensing Material Utilized IC / Part: NANOCOMP |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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NANOCOMP-SQR-15X15 | Chip Quik Inc. |
Description: SENSOR FORCE FLAT MEMBRANEPackaging: Bulk Accessory Type: Force Sensing Material Utilized IC / Part: NANOCOMP |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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NANOCOMP-SQR-20X20 | Chip Quik Inc. |
Description: SENSOR FORCE FLAT MEMBRANEPackaging: Bulk Accessory Type: Force Sensing Material Utilized IC / Part: NANOCOMP |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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NANOCOMP-SQR-50X50 | Chip Quik Inc. |
Description: SENSOR FORCE FLAT MEMBRANEPackaging: Bulk Accessory Type: Force Sensing Material Utilized IC / Part: NANOCOMP |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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NC191 | Chip Quik Inc. |
Description: SMOOTH FLOW TACK FLUX NO-CLEAN IPackaging: Bulk Type: Flux - No Clean Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 2859 шт: термін постачання 21-31 дні (днів) |
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NC191-10M | Chip Quik Inc. |
Description: ROL0 SMOOTH FLOW TACK FLUX NO-CLPackaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.35 oz (10g), 10cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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NC191150G | Chip Quik Inc. |
Description: SMOOTH FLOW TACK FLUX NO-CLEAN IPackaging: Bulk Type: Flux - No Clean Form: Jar, 5.29 oz (150g) Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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NC191-2CC6 | Chip Quik Inc. |
Description: SMOOTH FLOW TACK FLUX NO-CLEAN IPackaging: Bulk Type: Flux - No Clean Form: Tube, 0.07 oz (2g), 2cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 71 шт: термін постачання 21-31 дні (днів) |
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NC191-30CC | Chip Quik Inc. |
Description: SMOOTH FLOW TACK FLUX NO-CLEAN IPackaging: Bulk Type: Flux - No Clean Form: Syringe, 1.06 oz (30g), 30cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 727 шт: термін постачання 21-31 дні (днів) |
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NC191-5M | Chip Quik Inc. |
Description: ROL0 SMOOTH FLOW TACK FLUX NO-CLPackaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.18 oz (5g), 5cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 77 шт: термін постачання 21-31 дні (днів) |
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NC19175G | Chip Quik Inc. |
Description: SMOOTH FLOW TACK FLUX NO-CLEAN IPackaging: Bulk Type: Flux - No Clean Form: Jar, 2.65 oz (75g) Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C) |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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NC191AX15 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTEShelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Part Status: Active Flux Type: No-Clean Process: Leaded Mesh Type: 4 Form: Syringe, 0.53 oz (15g), 5cc Melting Point: 361°F (183°C) Type: Solder Paste Composition: Sn63Pb37 (63/37) Packaging: Bulk |
на замовлення 52 шт: термін постачання 21-31 дні (днів) |
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NC191AX15T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTE |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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NC191AX250 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTEPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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NC191AX250T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTEPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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NC191AX35 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTEPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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NC191AX35T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTEShelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Part Status: Active Flux Type: No-Clean Process: Leaded Mesh Type: 5 Form: Syringe, 1.23 oz (35g), 10cc Melting Point: 361°F (183°C) Type: Solder Paste Composition: Sn63Pb37 (63/37) Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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NC191AX50 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTEShelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Part Status: Active Flux Type: No-Clean Process: Leaded Mesh Type: 4 Form: Jar, 1.76 oz (50g) Melting Point: 361°F (183°C) Type: Solder Paste Composition: Sn63Pb37 (63/37) Packaging: Bulk |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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NC191AX500C | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTE |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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NC191AX500T5C | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTE |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||
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NC191AX50T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTEPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 1.76 oz (50g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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NC191LT10 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 0.35 oz (10g), 5cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 491 шт: термін постачання 21-31 дні (днів) |
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NC191LT15 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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NC191LT15T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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NC191LT250 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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NC191LT250T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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NC191LT35 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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NC191LT35T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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NC191LT50 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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NC191LT500C | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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NC191LT500T5C | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 5 Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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NC191LT50T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Jar, 1.76 oz (50g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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NC191LTA10 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST |
на замовлення 562 шт: термін постачання 21-31 дні (днів) |
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NC191LTA15 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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NC191LTA15T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 5 Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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NC191LTA250 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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NC191LTA250T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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NC191LTA35 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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NC191LTA35T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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NC191LTA50 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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NC191LTA500C | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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NC191LTA500T5C | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 5 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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NC191LTA50T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PASTPackaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Jar, 1.76 oz (50g) Mesh Type: 5 Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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NC191SNL15 | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PASPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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NC191SNL15T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PASPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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NC191SNL250 | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PASPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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NC191SNL250T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PASPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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NC191SNL35 | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PASPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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NC191SNL35T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PASPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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NC191SNL50 | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PASPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 39 шт: термін постачання 21-31 дні (днів) |
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NC191SNL500C | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PASPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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NC191SNL500T5C | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PASPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 5 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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NC191SNL50T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PASPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Jar, 1.76 oz (50g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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NC2SW.015 0.2OZ | Chip Quik Inc. |
Description: SOLDER WIRE MINI POCKET PACK 60/Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361°F ~ 370°F (183°C ~ 188°C) Form: Tube, 0.2 oz (5.66g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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| NANOCOAT200UV-2-500ML |
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Виробник: Chip Quik Inc.
Description: LIQUID NANO COATING - 2% POLYMER
Features: Coating
Packaging: Bulk
Color: Light Yellow
Type: Coating Remover
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: LIQUID NANO COATING - 2% POLYMER
Features: Coating
Packaging: Bulk
Color: Light Yellow
Type: Coating Remover
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
товару немає в наявності
В кошику
од. на суму грн.
| NANOCOAT200UV-2-AERO |
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Виробник: Chip Quik Inc.
Description: LIQUID NANO COATING - 2% POLYMER
Features: Coating
Packaging: Bulk
Color: Light Yellow
Type: Coating Remover
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: LIQUID NANO COATING - 2% POLYMER
Features: Coating
Packaging: Bulk
Color: Light Yellow
Type: Coating Remover
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6021.93 грн |
| NANOCOAT200UV-4-500ML |
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Виробник: Chip Quik Inc.
Description: LIQUID NANO COATING - 4% POLYMER
Features: Coating
Packaging: Bulk
Color: Light Yellow
Type: Coating Remover
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: LIQUID NANO COATING - 4% POLYMER
Features: Coating
Packaging: Bulk
Color: Light Yellow
Type: Coating Remover
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 16292.06 грн |
| NANOCOMP-CRC-10X10 |
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Виробник: Chip Quik Inc.
Description: SENSOR FORCE FLAT MEMBRANE
Packaging: Bulk
Accessory Type: Force Sensing Material
Utilized IC / Part: NANOCOMP
Description: SENSOR FORCE FLAT MEMBRANE
Packaging: Bulk
Accessory Type: Force Sensing Material
Utilized IC / Part: NANOCOMP
на замовлення 43 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 598.28 грн |
| 5+ | 520.70 грн |
| 10+ | 500.06 грн |
| 25+ | 446.25 грн |
| NANOCOMP-CRC-15X15 |
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Виробник: Chip Quik Inc.
Description: SENSOR FORCE FLAT MEMBRANE
Packaging: Bulk
Accessory Type: Force Sensing Material
Utilized IC / Part: NANOCOMP
Description: SENSOR FORCE FLAT MEMBRANE
Packaging: Bulk
Accessory Type: Force Sensing Material
Utilized IC / Part: NANOCOMP
на замовлення 48 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1143.38 грн |
| 5+ | 1002.98 грн |
| 10+ | 966.38 грн |
| 25+ | 866.01 грн |
| NANOCOMP-CRC-20X20 |
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Виробник: Chip Quik Inc.
Description: SENSOR FORCE 0.10KGF
Packaging: Bulk
Accessory Type: Force Sensing Material
Utilized IC / Part: NANOCOMP
Description: SENSOR FORCE 0.10KGF
Packaging: Bulk
Accessory Type: Force Sensing Material
Utilized IC / Part: NANOCOMP
на замовлення 48 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1790.16 грн |
| 5+ | 1578.50 грн |
| 10+ | 1524.36 грн |
| 25+ | 1369.78 грн |
| NANOCOMP-SQR-10X10 |
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Виробник: Chip Quik Inc.
Description: SENSOR FORCE FLAT MEMBRANE
Packaging: Bulk
Accessory Type: Force Sensing Material
Utilized IC / Part: NANOCOMP
Description: SENSOR FORCE FLAT MEMBRANE
Packaging: Bulk
Accessory Type: Force Sensing Material
Utilized IC / Part: NANOCOMP
на замовлення 48 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 494.27 грн |
| 5+ | 429.27 грн |
| 10+ | 411.87 грн |
| 25+ | 367.09 грн |
| NANOCOMP-SQR-15X15 |
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Виробник: Chip Quik Inc.
Description: SENSOR FORCE FLAT MEMBRANE
Packaging: Bulk
Accessory Type: Force Sensing Material
Utilized IC / Part: NANOCOMP
Description: SENSOR FORCE FLAT MEMBRANE
Packaging: Bulk
Accessory Type: Force Sensing Material
Utilized IC / Part: NANOCOMP
на замовлення 48 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1031.55 грн |
| 5+ | 904.03 грн |
| 10+ | 870.74 грн |
| 25+ | 779.75 грн |
| NANOCOMP-SQR-20X20 |
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Виробник: Chip Quik Inc.
Description: SENSOR FORCE FLAT MEMBRANE
Packaging: Bulk
Accessory Type: Force Sensing Material
Utilized IC / Part: NANOCOMP
Description: SENSOR FORCE FLAT MEMBRANE
Packaging: Bulk
Accessory Type: Force Sensing Material
Utilized IC / Part: NANOCOMP
на замовлення 48 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1719.77 грн |
| 5+ | 1515.55 грн |
| 10+ | 1463.28 грн |
| 25+ | 1314.54 грн |
| NANOCOMP-SQR-50X50 |
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Виробник: Chip Quik Inc.
Description: SENSOR FORCE FLAT MEMBRANE
Packaging: Bulk
Accessory Type: Force Sensing Material
Utilized IC / Part: NANOCOMP
Description: SENSOR FORCE FLAT MEMBRANE
Packaging: Bulk
Accessory Type: Force Sensing Material
Utilized IC / Part: NANOCOMP
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5841.27 грн |
| 5+ | 4846.82 грн |
| 10+ | 4545.21 грн |
| NC191 |
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Виробник: Chip Quik Inc.
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 2859 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 680.40 грн |
| NC191-10M |
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Виробник: Chip Quik Inc.
Description: ROL0 SMOOTH FLOW TACK FLUX NO-CL
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: ROL0 SMOOTH FLOW TACK FLUX NO-CL
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1381.13 грн |
| 5+ | 1146.52 грн |
| 10+ | 1075.28 грн |
| 25+ | 927.21 грн |
| NC191150G |
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Виробник: Chip Quik Inc.
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Jar, 5.29 oz (150g)
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Jar, 5.29 oz (150g)
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5666.09 грн |
| 5+ | 4701.47 грн |
| 10+ | 4408.89 грн |
| NC191-2CC6 |
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Виробник: Chip Quik Inc.
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Tube, 0.07 oz (2g), 2cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Tube, 0.07 oz (2g), 2cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 71 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 789.11 грн |
| NC191-30CC |
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Виробник: Chip Quik Inc.
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 727 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 885.30 грн |
| NC191-5M |
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Виробник: Chip Quik Inc.
Description: ROL0 SMOOTH FLOW TACK FLUX NO-CL
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: ROL0 SMOOTH FLOW TACK FLUX NO-CL
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 77 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1175.45 грн |
| 5+ | 975.72 грн |
| 10+ | 915.25 грн |
| 25+ | 789.14 грн |
| 50+ | 740.12 грн |
| NC19175G |
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Виробник: Chip Quik Inc.
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Jar, 2.65 oz (75g)
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Jar, 2.65 oz (75g)
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3165.03 грн |
| 5+ | 2626.37 грн |
| 10+ | 2463.10 грн |
| NC191AX15 |
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Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Part Status: Active
Flux Type: No-Clean
Process: Leaded
Mesh Type: 4
Form: Syringe, 0.53 oz (15g), 5cc
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
Description: SMOOTH FLOW LEADED SOLDER PASTE
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Part Status: Active
Flux Type: No-Clean
Process: Leaded
Mesh Type: 4
Form: Syringe, 0.53 oz (15g), 5cc
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
на замовлення 52 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 803.18 грн |
| NC191AX15T5 |
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Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Description: SMOOTH FLOW LEADED SOLDER PASTE
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 925.97 грн |
| NC191AX250 |
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Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3515.40 грн |
| NC191AX250T5 |
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Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6096.23 грн |
| NC191AX35 |
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Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1325.61 грн |
| NC191AX35T5 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Part Status: Active
Flux Type: No-Clean
Process: Leaded
Mesh Type: 5
Form: Syringe, 1.23 oz (35g), 10cc
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
Description: SMOOTH FLOW LEADED SOLDER PASTE
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Part Status: Active
Flux Type: No-Clean
Process: Leaded
Mesh Type: 5
Form: Syringe, 1.23 oz (35g), 10cc
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| NC191AX50 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Part Status: Active
Flux Type: No-Clean
Process: Leaded
Mesh Type: 4
Form: Jar, 1.76 oz (50g)
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
Description: SMOOTH FLOW LEADED SOLDER PASTE
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Part Status: Active
Flux Type: No-Clean
Process: Leaded
Mesh Type: 4
Form: Jar, 1.76 oz (50g)
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1169.19 грн |
| NC191AX500C |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Description: SMOOTH FLOW LEADED SOLDER PASTE
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6427.04 грн |
| NC191AX500T5C |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Description: SMOOTH FLOW LEADED SOLDER PASTE
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| NC191AX50T5 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1951.26 грн |
| NC191LT10 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.35 oz (10g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.35 oz (10g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 491 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 543.54 грн |
| NC191LT15 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| NC191LT15T5 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 986.97 грн |
| NC191LT250 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3825.88 грн |
| NC191LT250T5 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 21 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5146.01 грн |
| NC191LT35 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1184.83 грн |
| NC191LT35T5 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| NC191LT50 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1251.31 грн |
| NC191LT500C |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| NC191LT500T5C |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 8971.11 грн |
| NC191LT50T5 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1872.27 грн |
| NC191LTA10 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
на замовлення 562 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 543.54 грн |
| NC191LTA15 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 736.71 грн |
| NC191LTA15T5 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| NC191LTA250 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3900.18 грн |
| NC191LTA250T5 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| NC191LTA35 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1208.30 грн |
| NC191LTA35T5 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1611.84 грн |
| NC191LTA50 |
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Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1275.55 грн |
| NC191LTA500C |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7800.36 грн |
| NC191LTA500T5C |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| NC191LTA50T5 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| NC191SNL15 |
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Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 854.80 грн |
| NC191SNL15T5 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1119.14 грн |
| NC191SNL250 |
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Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3825.88 грн |
| NC191SNL250T5 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5806.08 грн |
| NC191SNL35 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1251.31 грн |
| NC191SNL35T5 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2109.24 грн |
| NC191SNL50 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 39 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 921.28 грн |
| NC191SNL500C |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| NC191SNL500T5C |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 11612.16 грн |
| NC191SNL50T5 |
![]() |
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2373.58 грн |
| NC2SW.015 0.2OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE MINI POCKET PACK 60/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Tube, 0.2 oz (5.66g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE MINI POCKET PACK 60/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Tube, 0.2 oz (5.66g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 588.90 грн |
| 5+ | 489.07 грн |




























































