Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2429) > Сторінка 22 з 41
| Фото | Назва | Виробник | Інформація |
Доступність |
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NANOCOAT200-THINNER-500ML | Chip Quik Inc. |
 Description: LIQUID NANO COATING - THINNER 50Packaging: Bulk Features: Coating Color: Light Yellow Type: Coating Remover Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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NANOCOAT200UV-10-500ML | Chip Quik Inc. |
Description: LIQUID NANO COATING - 10% POLYME Packaging: Bulk Part Status: Active Features: Coating Color: Light Yellow Type: Coating Remover Shelf Life Start: Date of Manufacture Shelf Life: 24 Months Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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NANOCOAT200UV-2-500ML | Chip Quik Inc. |
Description: LIQUID NANO COATING - 2% POLYMER Packaging: Bulk Features: Coating Color: Light Yellow Type: Coating Remover Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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NANOCOAT200UV-2-AERO | Chip Quik Inc. |
Description: LIQUID NANO COATING - 2% POLYMER Packaging: Bulk Features: Coating Color: Light Yellow Type: Coating Remover Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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NANOCOAT200UV-4-500ML | Chip Quik Inc. |
Description: LIQUID NANO COATING - 4% POLYMER Packaging: Bulk Features: Coating Color: Light Yellow Type: Coating Remover Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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NC191 | Chip Quik Inc. |
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I Packaging: Bulk Type: Flux - No Clean Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 648 шт: термін постачання 21-31 дні (днів) |
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NC191-2CC6 | Chip Quik Inc. |
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I Packaging: Bulk Type: Flux - No Clean Form: Tube, 0.07 oz (2g), 2cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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NC191-30CC | Chip Quik Inc. |
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I Packaging: Bulk Type: Flux - No Clean Form: Syringe, 1.06 oz (30g), 30cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 222 шт: термін постачання 21-31 дні (днів) |
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NC191AX15 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTE Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 52 шт: термін постачання 21-31 дні (днів) |
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NC191AX15T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTE |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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NC191AX250 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTE Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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NC191AX250T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTE Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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NC191AX35 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTE Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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NC191AX35T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTE Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товар відсутній |
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NC191AX50 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTE Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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NC191AX500C | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTE |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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NC191AX500T5C | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTE |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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NC191AX50T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEADED SOLDER PASTE Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 1.76 oz (50g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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NC191LT10 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 0.35 oz (10g), 5cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 61 шт: термін постачання 21-31 дні (днів) |
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NC191LT15 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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NC191LT15T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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NC191LT250 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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NC191LT250T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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NC191LT35 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
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NC191LT35T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
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NC191LT50 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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NC191LT500T5C | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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NC191LT50T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Jar, 1.76 oz (50g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
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NC191LTA10 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Syringe, 0.35 oz (10g), 3cc Mesh Type: 4 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 69 шт: термін постачання 21-31 дні (днів) |
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NC191LTA15 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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NC191LTA15T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 5 Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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NC191LTA250 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товар відсутній |
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NC191LTA250T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товар відсутній |
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NC191LTA35 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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NC191LTA35T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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NC191LTA50 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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NC191LTA500C | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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NC191LTA500T5C | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 5 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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NC191LTA50T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LOW TEMP SOLDER PAST Packaging: Bulk Composition: Bi57Sn42Ag1 (57/42/1) Type: Solder Paste Melting Point: 279°F (137°C) Form: Jar, 1.76 oz (50g) Mesh Type: 5 Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товар відсутній |
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NC191SNL15 | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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NC191SNL15T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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NC191SNL250T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
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NC191SNL35 | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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NC191SNL35T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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NC191SNL50 | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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NC191SNL500C | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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NC191SNL500T5C | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 5 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
 |
NC191SNL50T5 | Chip Quik Inc. |
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Jar, 1.76 oz (50g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
 |
NC2SW.015 0.2OZ | Chip Quik Inc. |
Description: SOLDER WIRE MINI POCKET PACK 60/ Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361°F ~ 370°F (183°C ~ 188°C) Form: Tube, 0.2 oz (5.66g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
 |
NC2SW.015 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60 Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361°F ~ 370°F (183°C ~ 188°C) Form: Spool, 1 lb (453.592g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
 |
NC2SW.015 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60 Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361°F ~ 370°F (183°C ~ 188°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
 |
NC2SW.015 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60 Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361°F ~ 370°F (183°C ~ 188°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
 |
NC2SW.015 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60 Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361°F ~ 370°F (183°C ~ 188°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
 |
NC2SW.015 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60 Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361°F ~ 370°F (183°C ~ 188°C) Form: Spool, 8 oz (226.80g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
 |
NC2SW.020 0.3OZ | Chip Quik Inc. |
Description: SOLDER WIRE MINI POCKET PACK 60/ Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Tube, 0.3 oz (8.51g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
 |
NC2SW.020 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
 |
NC2SW.031 0.5OZ | Chip Quik Inc. |
Description: SOLDER WIRE MINI POCKET PACK 60/ Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Tube, 0.50 oz (14.17g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 225 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
 |
NC2SW.031 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
 |
NC2SWLF.015 0.2OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE MINI POCKET PACK Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Tube, 0.2 oz (5.66g) Flux Type: No-Clean Part Status: Active |
на замовлення 53 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
 |
NC2SWLF.015 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 lb (453.592g) Flux Type: No-Clean Part Status: Active |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
|
| NANOCOAT200-THINNER-500ML |
|
Виробник: Chip Quik Inc.
Description: LIQUID NANO COATING - THINNER 50
Packaging: Bulk
Features: Coating
Color: Light Yellow
Type: Coating Remover
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: LIQUID NANO COATING - THINNER 50
Packaging: Bulk
Features: Coating
Color: Light Yellow
Type: Coating Remover
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 8824.05 грн |
| NANOCOAT200UV-10-500ML |
|
Виробник: Chip Quik Inc.
Description: LIQUID NANO COATING - 10% POLYME
Packaging: Bulk
Part Status: Active
Features: Coating
Color: Light Yellow
Type: Coating Remover
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Description: LIQUID NANO COATING - 10% POLYME
Packaging: Bulk
Part Status: Active
Features: Coating
Color: Light Yellow
Type: Coating Remover
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 28602.01 грн |
| NANOCOAT200UV-2-500ML |
|
Виробник: Chip Quik Inc.
Description: LIQUID NANO COATING - 2% POLYMER
Packaging: Bulk
Features: Coating
Color: Light Yellow
Type: Coating Remover
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: LIQUID NANO COATING - 2% POLYMER
Packaging: Bulk
Features: Coating
Color: Light Yellow
Type: Coating Remover
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 13810.9 грн |
| NANOCOAT200UV-2-AERO |
|
Виробник: Chip Quik Inc.
Description: LIQUID NANO COATING - 2% POLYMER
Packaging: Bulk
Features: Coating
Color: Light Yellow
Type: Coating Remover
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: LIQUID NANO COATING - 2% POLYMER
Packaging: Bulk
Features: Coating
Color: Light Yellow
Type: Coating Remover
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5748.32 грн |
| NANOCOAT200UV-4-500ML |
|
Виробник: Chip Quik Inc.
Description: LIQUID NANO COATING - 4% POLYMER
Packaging: Bulk
Features: Coating
Color: Light Yellow
Type: Coating Remover
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: LIQUID NANO COATING - 4% POLYMER
Packaging: Bulk
Features: Coating
Color: Light Yellow
Type: Coating Remover
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 18140.81 грн |
| NC191 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 648 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 695.77 грн |
| NC191-2CC6 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Tube, 0.07 oz (2g), 2cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Tube, 0.07 oz (2g), 2cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 15 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 823.43 грн |
| NC191-30CC |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 222 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 905.55 грн |
| NC191AX15 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 52 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 766.69 грн |
| NC191AX15T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Description: SMOOTH FLOW LEADED SOLDER PASTE
на замовлення 17 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 883.9 грн |
| NC191AX250 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3355.68 грн |
| NC191AX250T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5819.24 грн |
| NC191AX35 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1265.38 грн |
| NC191AX35T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товар відсутній
| NC191AX50 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1116.07 грн |
| NC191AX500C |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Description: SMOOTH FLOW LEADED SOLDER PASTE
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6135.03 грн |
| NC191AX500T5C |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Description: SMOOTH FLOW LEADED SOLDER PASTE
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| NC191AX50T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1862.61 грн |
| NC191LT10 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.35 oz (10g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.35 oz (10g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 61 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 547.96 грн |
| NC191LT15 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 38 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 745.04 грн |
| NC191LT15T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 12 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1045.15 грн |
| NC191LT250 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4094.75 грн |
| NC191LT250T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4800.97 грн |
| NC191LT35 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| NC191LT35T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| NC191LT50 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1293 грн |
| NC191LT500T5C |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
на замовлення 12 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 9274.21 грн |
| NC191LT50T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| NC191LTA10 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.35 oz (10g), 3cc
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.35 oz (10g), 3cc
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 69 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 555.42 грн |
| NC191LTA15 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 754.75 грн |
| NC191LTA15T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 13 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1030.22 грн |
| NC191LTA250 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товар відсутній
| NC191LTA250T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товар відсутній
| NC191LTA35 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 19 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1237.76 грн |
| NC191LTA35T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1651.34 грн |
| NC191LTA50 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1306.44 грн |
| NC191LTA500C |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7989.42 грн |
| NC191LTA500T5C |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 9368.27 грн |
| NC191LTA50T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товар відсутній
| NC191SNL15 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 30 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 881.66 грн |
| NC191SNL15T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1156.38 грн |
| NC191SNL250T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| NC191SNL35 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1293 грн |
| NC191SNL35T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2385.18 грн |
| NC191SNL50 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 961.54 грн |
| NC191SNL500C |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7989.42 грн |
| NC191SNL500T5C |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 12125.97 грн |
| NC191SNL50T5 |
|
Виробник: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2478.5 грн |
| NC2SW.015 0.2OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE MINI POCKET PACK 60/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Tube, 0.2 oz (5.66g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE MINI POCKET PACK 60/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Tube, 0.2 oz (5.66g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 530.79 грн |
| 10+ | 481.01 грн |
| NC2SW.015 1LB |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 1 lb (453.592g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 1 lb (453.592g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4098.48 грн |
| NC2SW.015 1OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 905.55 грн |
| 5+ | 854.47 грн |
| NC2SW.015 2OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1287.03 грн |
| 10+ | 1164.67 грн |
| NC2SW.015 4OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1933.53 грн |
| 10+ | 1672.27 грн |
| NC2SW.015 8OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 8 oz (226.80g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 8 oz (226.80g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2689.77 грн |
| 10+ | 2050.48 грн |
| NC2SW.020 0.3OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE MINI POCKET PACK 60/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.3 oz (8.51g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE MINI POCKET PACK 60/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.3 oz (8.51g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 15 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 213.51 грн |
| NC2SW.020 1LB |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2759.94 грн |
| NC2SW.031 0.5OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE MINI POCKET PACK 60/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.50 oz (14.17g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE MINI POCKET PACK 60/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.50 oz (14.17g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 225 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 202.31 грн |
| NC2SW.031 1LB |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 48 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2671.85 грн |
| NC2SWLF.015 0.2OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.2 oz (5.66g)
Flux Type: No-Clean
Part Status: Active
Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.2 oz (5.66g)
Flux Type: No-Clean
Part Status: Active
на замовлення 53 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 350.87 грн |
| 5+ | 330.83 грн |
| 10+ | 317.68 грн |
| 25+ | 260.87 грн |
| 50+ | 236.05 грн |
| NC2SWLF.015 1LB |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (453.592g)
Flux Type: No-Clean
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (453.592g)
Flux Type: No-Clean
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4565.06 грн |