Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2705) > Сторінка 22 з 46
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| IPC0202 | Chip Quik Inc. |
Description: MODULE-40 TO DIP-40 SMT ADAPTER Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.051" (1.30mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0203 | Chip Quik Inc. |
Description: SUPERSOT-3 TO DIP-4 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 3 Pitch: 0.051" (1.30mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0204 | Chip Quik Inc. |
Description: SOIC-24 TO DIP-24 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0204-S | Chip Quik Inc. |
Description: SOIC-24 (1.27 MM PITCH 15.4 X 7. Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: SOIC Inner Dimension: 0.606" L x 0.295" W (15.40mm x 7.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 24 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0205 | Chip Quik Inc. |
Description: LGA-12 TO DIP-12 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0205-S | Chip Quik Inc. |
Description: LGA-12 (0.8 MM PITCH 4.4 X 2.4 M Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: LGA Inner Dimension: 0.173" L x 0.094" W (4.40mm x 2.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 12 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0206 | Chip Quik Inc. | Description: DFN-20 TO DIP-24 SMT ADAPTER (0. |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0206-S | Chip Quik Inc. | Description: DFN-20 (0.5 MM PITCH 5 X 4 MM BO |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0207 | Chip Quik Inc. |
Description: QFN-24 TO DIP-28 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 319 шт В кошику од. на суму грн. | |||||||
| IPC0207-S | Chip Quik Inc. | Description: QFN-24 (0.4 MM PITCH 3 X 3 MM BO |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0208 | Chip Quik Inc. |
Description: POWERQSOP-16 TO DIP-20 SMT ADAPT Packaging: Bulk Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.025" (0.64mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0208-S | Chip Quik Inc. |
Description: POWERQSOP-16 (0.635 MM PITCH 4.9 Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Type: PowerQSOP Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm) Number of Positions: 16 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0209 | Chip Quik Inc. |
Description: POWERQSOP-28 TO DIP-32 SMT ADAPT Packaging: Bulk Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.025" (0.64mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0209-S | Chip Quik Inc. |
Description: POWERQSOP-28 (0.635 MM PITCH 9.9 Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Type: PowerQSOP Inner Dimension: 0.390" L x 0.154" W (9.90mm x 3.90mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.287" L x 0.087" W (7.29mm x 2.20mm) Number of Positions: 28 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0210 | Chip Quik Inc. | Description: DFN-12 TO DIP-16 SMT ADAPTER (0. |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0212 | Chip Quik Inc. |
Description: QFN-54 TO DIP-58 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 2.900" L x 1.000" W (73.66mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 54 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0213 | Chip Quik Inc. |
Description: QFN-10 TO DIP-14 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0215 | Chip Quik Inc. |
Description: QFN-20 TO DIP-24 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0215-S | Chip Quik Inc. |
Description: QFN-20 (0.5 MM PITCH 4.5 X 2.5 M Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN Inner Dimension: 0.177" L x 0.098" W (4.50mm x 2.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 20 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0216 | Chip Quik Inc. |
Description: LED-6 TO DIP-10 SMT ADAPTER (1.6 Packaging: Bulk Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.063" (1.60mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LED |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0217 | Chip Quik Inc. | Description: QFN-18 TO DIP-22 SMT ADAPTER (0. |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0218 | Chip Quik Inc. |
Description: QFN-20 TO DIP-24 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0218-S | Chip Quik Inc. |
Description: QFN-20 (0.5 MM PITCH 3.5 X 3.5 M Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.081" L x 0.081" W (2.05mm x 2.05mm) Number of Positions: 20 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
IPC0219 | Chip Quik Inc. |
 Description: DFN-6/SON-6 TO DIP-6 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.014" (0.35mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
|
||||||
| IPC0219-S | Chip Quik Inc. |
Description: DFN-6/SON-6 (0.35 MM PITCH 1 X 1 Packaging: Bulk Material: Stainless Steel Pitch: 0.014" (0.35mm) Type: DFN/SON Inner Dimension: 0.039" L x 0.039" W (1.00mm x 1.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 6 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0220 | Chip Quik Inc. |
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4 Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0220-S | Chip Quik Inc. | Description: BGA-6 (0.4 MM PITCH 1.16 X 0.76 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0221 | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0222 | Chip Quik Inc. |
Description: QFN-12 TO DIP-16 SMT ADAPTER (1. Packaging: Bulk Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 21 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0222-S | Chip Quik Inc. |
Description: QFN-12 (1.0 MM PITCH 4 X 4 MM BO Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: QFN Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm) Number of Positions: 12 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0224 | Chip Quik Inc. | Description: LED-2 TO DIP-4 SMT ADAPTER (0.57 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0225 | Chip Quik Inc. | Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0226 | Chip Quik Inc. | Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0227 | Chip Quik Inc. | Description: LED-4 TO DIP-4 SMT ADAPTER (0.85 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0228 | Chip Quik Inc. | Description: LED-4 TO DIP-4 SMT ADAPTER (0.8 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
IPC0229 | Chip Quik Inc. |
Description: LED-6/PLCC-6 TO DIP-6 SMT ADAPTE Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.043" (1.10mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LED, PLCC Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 647 шт В кошику од. на суму грн. | ||||||
| IPC0229-S | Chip Quik Inc. |
Description: LED-6/PLCC-6 (1.1 MM PITCH 3.3 X Packaging: Bulk Material: Stainless Steel Pitch: 0.043" (1.10mm) Type: LED/PLCC Inner Dimension: 0.134" L x 0.130" W (3.40mm x 3.30mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 6 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0230 | Chip Quik Inc. |
Description: LED-6/DFN-6 TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN, LED |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0231 | Chip Quik Inc. | Description: LED-3 TO DIP-4 SMT ADAPTER (1.1 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0232 | Chip Quik Inc. |
Description: HTQFP-64 TO DIP-68 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0232-S | Chip Quik Inc. |
Description: HTQFP-64 (0.8 MM PITCH 14 X 14 M Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: HTQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm) Number of Positions: 64 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0233 | Chip Quik Inc. |
Description: HTQFP-100 TO DIP-104 SMT ADAPTER Packaging: Bulk Size / Dimension: 5.200" L x 1.000" W (132.08mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 100 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0233-S | Chip Quik Inc. |
Description: HTQFP-100 (0.5 MM PITCH 14 X 14 Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm) Number of Positions: 100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0234 | Chip Quik Inc. |
Description: HTQFP-80 TO DIP-84 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 4.200" L x 1.000" W (106.68mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 80 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0234-S | Chip Quik Inc. |
Description: HTQFP-80 (0.5 MM PITCH 12 X 12 M Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTQFP Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.354" L x 0.354" W (9.00mm x 9.00mm) Number of Positions: 80 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0235 | Chip Quik Inc. |
Description: HTQFP-44 TO DIP-48 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.400" L x 1.000" W (60.96mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0235-S | Chip Quik Inc. |
Description: HTQFP-44 (0.8 MM PITCH 10 X 10 M Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: HTQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm) Number of Positions: 44 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0236 | Chip Quik Inc. |
Description: HTQFP-52 TO DIP-56 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.800" L x 1.000" W (71.12mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 52 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0236-S | Chip Quik Inc. |
Description: HTQFP-52 (0.65 MM PITCH 10 X 10 Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: HTQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm) Number of Positions: 52 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0237 | Chip Quik Inc. |
Description: HTQFP-48 TO DIP-52 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.600" L x 1.000" W (66.04mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 194 шт В кошику од. на суму грн. | |||||||
| IPC0237-S | Chip Quik Inc. |
Description: HTQFP-48 (0.5 MM PITCH 7 X 7 MM Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTQFP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm) Number of Positions: 48 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0238 | Chip Quik Inc. |
Description: HTQFP-64 TO DIP-68 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 3.200" L x 1.000" W (81.28mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| IPC0238-S | Chip Quik Inc. |
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: HTQFP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm) Number of Positions: 64 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
IPC0242 | Chip Quik Inc. |
Description: MODULE-29 TO DIP-32 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
IPC0242-S | Chip Quik Inc. |
Description: MODULE-29 (1.016 MM PITCH, 21.72 Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: Module Inner Dimension: 0.855" L x 0.580" W (21.72mm x 14.73mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 29 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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 |
IPC0243 | Chip Quik Inc. |
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.8 Packaging: Bulk Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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 |
IPC0243-S | Chip Quik Inc. |
Description: DFN-6 (0.8 MM PITCH, 2.45 X 2.45 Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: DFN Inner Dimension: 0.094" L x 0.079" W (2.40mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 6 |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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 |
IPC0244 | Chip Quik Inc. |
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.35 Packaging: Bulk Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.014" (0.35mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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 |
IPC0244-S | Chip Quik Inc. |
Description: BGA-4 (0.35 MM PITCH, 0.64 X 0.6 Packaging: Bulk Material: Stainless Steel Pitch: 0.014" (0.35mm) Type: BGA Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 4 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
IPC0245 | Chip Quik Inc. |
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.4 Packaging: Bulk Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
|
| IPC0202 |
Виробник: Chip Quik Inc.
Description: MODULE-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: MODULE-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| IPC0203 |
Виробник: Chip Quik Inc.
Description: SUPERSOT-3 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT
Description: SUPERSOT-3 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT
товару немає в наявності
В кошику
од. на суму грн.
| IPC0204 |
Виробник: Chip Quik Inc.
Description: SOIC-24 TO DIP-24 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: SOIC-24 TO DIP-24 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
товару немає в наявності
В кошику
од. на суму грн.
| IPC0204-S |
Виробник: Chip Quik Inc.
Description: SOIC-24 (1.27 MM PITCH 15.4 X 7.
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Inner Dimension: 0.606" L x 0.295" W (15.40mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 24
Description: SOIC-24 (1.27 MM PITCH 15.4 X 7.
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Inner Dimension: 0.606" L x 0.295" W (15.40mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 24
товару немає в наявності
В кошику
од. на суму грн.
| IPC0205 |
Виробник: Chip Quik Inc.
Description: LGA-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| IPC0205-S |
Виробник: Chip Quik Inc.
Description: LGA-12 (0.8 MM PITCH 4.4 X 2.4 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.173" L x 0.094" W (4.40mm x 2.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Description: LGA-12 (0.8 MM PITCH 4.4 X 2.4 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.173" L x 0.094" W (4.40mm x 2.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
товару немає в наявності
В кошику
од. на суму грн.
| IPC0206 |
Виробник: Chip Quik Inc.
Description: DFN-20 TO DIP-24 SMT ADAPTER (0.
Description: DFN-20 TO DIP-24 SMT ADAPTER (0.
товару немає в наявності
В кошику
од. на суму грн.
| IPC0206-S |
Виробник: Chip Quik Inc.
Description: DFN-20 (0.5 MM PITCH 5 X 4 MM BO
Description: DFN-20 (0.5 MM PITCH 5 X 4 MM BO
товару немає в наявності
В кошику
од. на суму грн.
| IPC0207 |
Виробник: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 319 шт
В кошику
од. на суму грн.
| IPC0207-S |
Виробник: Chip Quik Inc.
Description: QFN-24 (0.4 MM PITCH 3 X 3 MM BO
Description: QFN-24 (0.4 MM PITCH 3 X 3 MM BO
товару немає в наявності
В кошику
од. на суму грн.
| IPC0208 |
Виробник: Chip Quik Inc.
Description: POWERQSOP-16 TO DIP-20 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: POWERQSOP-16 TO DIP-20 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| IPC0208-S |
Виробник: Chip Quik Inc.
Description: POWERQSOP-16 (0.635 MM PITCH 4.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm)
Number of Positions: 16
Description: POWERQSOP-16 (0.635 MM PITCH 4.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm)
Number of Positions: 16
товару немає в наявності
В кошику
од. на суму грн.
| IPC0209 |
Виробник: Chip Quik Inc.
Description: POWERQSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: POWERQSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| IPC0209-S |
Виробник: Chip Quik Inc.
Description: POWERQSOP-28 (0.635 MM PITCH 9.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.390" L x 0.154" W (9.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.287" L x 0.087" W (7.29mm x 2.20mm)
Number of Positions: 28
Description: POWERQSOP-28 (0.635 MM PITCH 9.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.390" L x 0.154" W (9.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.287" L x 0.087" W (7.29mm x 2.20mm)
Number of Positions: 28
товару немає в наявності
В кошику
од. на суму грн.
| IPC0210 |
Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
товару немає в наявності
В кошику
од. на суму грн.
| IPC0212 |
Виробник: Chip Quik Inc.
Description: QFN-54 TO DIP-58 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.900" L x 1.000" W (73.66mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-54 TO DIP-58 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.900" L x 1.000" W (73.66mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| IPC0213 |
Виробник: Chip Quik Inc.
Description: QFN-10 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-10 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
В кошику
од. на суму грн.
| IPC0215 |
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
В кошику
од. на суму грн.
| IPC0215-S |
Виробник: Chip Quik Inc.
Description: QFN-20 (0.5 MM PITCH 4.5 X 2.5 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN
Inner Dimension: 0.177" L x 0.098" W (4.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 20
Description: QFN-20 (0.5 MM PITCH 4.5 X 2.5 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN
Inner Dimension: 0.177" L x 0.098" W (4.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 20
товару немає в наявності
В кошику
од. на суму грн.
| IPC0216 |
Виробник: Chip Quik Inc.
Description: LED-6 TO DIP-10 SMT ADAPTER (1.6
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.063" (1.60mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED
Description: LED-6 TO DIP-10 SMT ADAPTER (1.6
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.063" (1.60mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED
товару немає в наявності
В кошику
од. на суму грн.
| IPC0217 |
Виробник: Chip Quik Inc.
Description: QFN-18 TO DIP-22 SMT ADAPTER (0.
Description: QFN-18 TO DIP-22 SMT ADAPTER (0.
товару немає в наявності
В кошику
од. на суму грн.
| IPC0218 |
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
В кошику
од. на суму грн.
| IPC0218-S |
Виробник: Chip Quik Inc.
Description: QFN-20 (0.5 MM PITCH 3.5 X 3.5 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.081" L x 0.081" W (2.05mm x 2.05mm)
Number of Positions: 20
Description: QFN-20 (0.5 MM PITCH 3.5 X 3.5 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.081" L x 0.081" W (2.05mm x 2.05mm)
Number of Positions: 20
товару немає в наявності
В кошику
од. на суму грн.
| IPC0219 |
|
Виробник: Chip Quik Inc.
Description: DFN-6/SON-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6/SON-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 34 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 381.03 грн |
| 10+ | 311.51 грн |
| 25+ | 292.02 грн |
| IPC0219-S |
Виробник: Chip Quik Inc.
Description: DFN-6/SON-6 (0.35 MM PITCH 1 X 1
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: DFN/SON
Inner Dimension: 0.039" L x 0.039" W (1.00mm x 1.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
Description: DFN-6/SON-6 (0.35 MM PITCH 1 X 1
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: DFN/SON
Inner Dimension: 0.039" L x 0.039" W (1.00mm x 1.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
товару немає в наявності
В кошику
од. на суму грн.
| IPC0220 |
Виробник: Chip Quik Inc.
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
товару немає в наявності
В кошику
од. на суму грн.
| IPC0220-S |
Виробник: Chip Quik Inc.
Description: BGA-6 (0.4 MM PITCH 1.16 X 0.76
Description: BGA-6 (0.4 MM PITCH 1.16 X 0.76
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В кошику
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| IPC0221 |
Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
товару немає в наявності
В кошику
од. на суму грн.
| IPC0222 |
Виробник: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 21
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-12 TO DIP-16 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 21
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
В кошику
од. на суму грн.
| IPC0222-S |
Виробник: Chip Quik Inc.
Description: QFN-12 (1.0 MM PITCH 4 X 4 MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: QFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
Description: QFN-12 (1.0 MM PITCH 4 X 4 MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: QFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
товару немає в наявності
В кошику
од. на суму грн.
| IPC0224 |
Виробник: Chip Quik Inc.
Description: LED-2 TO DIP-4 SMT ADAPTER (0.57
Description: LED-2 TO DIP-4 SMT ADAPTER (0.57
товару немає в наявності
В кошику
од. на суму грн.
| IPC0225 |
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
товару немає в наявності
В кошику
од. на суму грн.
| IPC0226 |
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
товару немає в наявності
В кошику
од. на суму грн.
| IPC0227 |
Виробник: Chip Quik Inc.
Description: LED-4 TO DIP-4 SMT ADAPTER (0.85
Description: LED-4 TO DIP-4 SMT ADAPTER (0.85
товару немає в наявності
В кошику
од. на суму грн.
| IPC0228 |
Виробник: Chip Quik Inc.
Description: LED-4 TO DIP-4 SMT ADAPTER (0.8
Description: LED-4 TO DIP-4 SMT ADAPTER (0.8
товару немає в наявності
В кошику
од. на суму грн.
| IPC0229 |
Виробник: Chip Quik Inc.
Description: LED-6/PLCC-6 TO DIP-6 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.043" (1.10mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED, PLCC
Part Status: Active
Description: LED-6/PLCC-6 TO DIP-6 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.043" (1.10mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED, PLCC
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 647 шт
В кошику
од. на суму грн.
| IPC0229-S |
Виробник: Chip Quik Inc.
Description: LED-6/PLCC-6 (1.1 MM PITCH 3.3 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.043" (1.10mm)
Type: LED/PLCC
Inner Dimension: 0.134" L x 0.130" W (3.40mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Description: LED-6/PLCC-6 (1.1 MM PITCH 3.3 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.043" (1.10mm)
Type: LED/PLCC
Inner Dimension: 0.134" L x 0.130" W (3.40mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
товару немає в наявності
В кошику
од. на суму грн.
| IPC0230 |
Виробник: Chip Quik Inc.
Description: LED-6/DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN, LED
Description: LED-6/DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN, LED
товару немає в наявності
В кошику
од. на суму грн.
| IPC0231 |
Виробник: Chip Quik Inc.
Description: LED-3 TO DIP-4 SMT ADAPTER (1.1
Description: LED-3 TO DIP-4 SMT ADAPTER (1.1
товару немає в наявності
В кошику
од. на суму грн.
| IPC0232 |
Виробник: Chip Quik Inc.
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
товару немає в наявності
В кошику
од. на суму грн.
| IPC0232-S |
Виробник: Chip Quik Inc.
Description: HTQFP-64 (0.8 MM PITCH 14 X 14 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 64
Description: HTQFP-64 (0.8 MM PITCH 14 X 14 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 64
товару немає в наявності
В кошику
од. на суму грн.
| IPC0233 |
Виробник: Chip Quik Inc.
Description: HTQFP-100 TO DIP-104 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 5.200" L x 1.000" W (132.08mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Description: HTQFP-100 TO DIP-104 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 5.200" L x 1.000" W (132.08mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
товару немає в наявності
В кошику
од. на суму грн.
| IPC0233-S |
Виробник: Chip Quik Inc.
Description: HTQFP-100 (0.5 MM PITCH 14 X 14
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 100
Description: HTQFP-100 (0.5 MM PITCH 14 X 14
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 100
товару немає в наявності
В кошику
од. на суму грн.
| IPC0234 |
Виробник: Chip Quik Inc.
Description: HTQFP-80 TO DIP-84 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 4.200" L x 1.000" W (106.68mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-80 TO DIP-84 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 4.200" L x 1.000" W (106.68mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| IPC0234-S |
Виробник: Chip Quik Inc.
Description: HTQFP-80 (0.5 MM PITCH 12 X 12 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Number of Positions: 80
Description: HTQFP-80 (0.5 MM PITCH 12 X 12 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Number of Positions: 80
товару немає в наявності
В кошику
од. на суму грн.
| IPC0235 |
Виробник: Chip Quik Inc.
Description: HTQFP-44 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.400" L x 1.000" W (60.96mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-44 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.400" L x 1.000" W (60.96mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| IPC0235-S |
Виробник: Chip Quik Inc.
Description: HTQFP-44 (0.8 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 44
Description: HTQFP-44 (0.8 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 44
товару немає в наявності
В кошику
од. на суму грн.
| IPC0236 |
Виробник: Chip Quik Inc.
Description: HTQFP-52 TO DIP-56 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.800" L x 1.000" W (71.12mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-52 TO DIP-56 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.800" L x 1.000" W (71.12mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| IPC0236-S |
Виробник: Chip Quik Inc.
Description: HTQFP-52 (0.65 MM PITCH 10 X 10
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 52
Description: HTQFP-52 (0.65 MM PITCH 10 X 10
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 52
товару немає в наявності
В кошику
од. на суму грн.
| IPC0237 |
Виробник: Chip Quik Inc.
Description: HTQFP-48 TO DIP-52 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.600" L x 1.000" W (66.04mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-48 TO DIP-52 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.600" L x 1.000" W (66.04mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 194 шт
В кошику
од. на суму грн.
| IPC0237-S |
Виробник: Chip Quik Inc.
Description: HTQFP-48 (0.5 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 48
Description: HTQFP-48 (0.5 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 48
товару немає в наявності
В кошику
од. на суму грн.
| IPC0238 |
Виробник: Chip Quik Inc.
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.200" L x 1.000" W (81.28mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.200" L x 1.000" W (81.28mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
товару немає в наявності
В кошику
од. на суму грн.
| IPC0238-S |
Виробник: Chip Quik Inc.
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 64
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 64
товару немає в наявності
В кошику
од. на суму грн.
| IPC0242 |
|
Виробник: Chip Quik Inc.
Description: MODULE-29 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: MODULE-29 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| IPC0242-S |
|
Виробник: Chip Quik Inc.
Description: MODULE-29 (1.016 MM PITCH, 21.72
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: Module
Inner Dimension: 0.855" L x 0.580" W (21.72mm x 14.73mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 29
Description: MODULE-29 (1.016 MM PITCH, 21.72
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: Module
Inner Dimension: 0.855" L x 0.580" W (21.72mm x 14.73mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 29
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 785.98 грн |
| IPC0243 |
|
Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.8
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.8
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 313.93 грн |
| IPC0243-S |
|
Виробник: Chip Quik Inc.
Description: DFN-6 (0.8 MM PITCH, 2.45 X 2.45
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.094" L x 0.079" W (2.40mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Description: DFN-6 (0.8 MM PITCH, 2.45 X 2.45
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.094" L x 0.079" W (2.40mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 830.71 грн |
| IPC0244 |
|
Виробник: Chip Quik Inc.
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.35
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.35
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 243.74 грн |
| IPC0244-S |
|
Виробник: Chip Quik Inc.
Description: BGA-4 (0.35 MM PITCH, 0.64 X 0.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
Description: BGA-4 (0.35 MM PITCH, 0.64 X 0.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
товару немає в наявності
В кошику
од. на суму грн.
| IPC0245 |
|
Виробник: Chip Quik Inc.
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 243.74 грн |