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DSC6001CI2B-008.1920T DSC6001CI2B-008.1920T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8.192 MHz
Base Resonator: MEMS
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DSC6001CI2B-032K768T DSC6001CI2B-032K768T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6001CI2B-040.0000T DSC6001CI2B-040.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
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DSC6001CI2B-025.0000 DSC6001CI2B-025.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6001CI2B-008.1920 DSC6001CI2B-008.1920 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 8.1920MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8.192 MHz
Base Resonator: MEMS
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DSC6001CI2B-032K768 DSC6001CI2B-032K768 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6001CI2B-040.0000 DSC6001CI2B-040.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 40.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
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DSC6001CI2B-004.0000 DSC6001CI2B-004.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
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DSC6001CI2B-012.0000 DSC6001CI2B-012.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6001CI2B-004.0000T DSC6001CI2B-004.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
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DSC6001CI2B-012.0000T DSC6001CI2B-012.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6001CI2B-100K000T DSC6001CI2B-100K000T Microchip Technology Description: OSCILLATOR MEMS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 kHz
Base Resonator: MEMS
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DSC6001CI2B-100K000 DSC6001CI2B-100K000 Microchip Technology Description: OSCILLATOR MEMS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 kHz
Base Resonator: MEMS
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DSC6001CI2B-016.0000 DSC6001CI2B-016.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSC1001CC1-125.0000T DSC1001CC1-125.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1001CC1-125.0000 DSC1001CC1-125.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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BZV55C10 BZV55C10 Microchip Technology 8298-bzv55-c2v4-c75-datasheet Description: DIODE ZENER 10V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 10 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
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SG1549Y-883B Microchip Technology 11130-sg1549-datasheet Description: IC SUPERVISOR 1 CHANNEL 8CERDIP
Packaging: Tray
Package / Case: 8-CDIP (0.300", 7.62mm)
Mounting Type: Through Hole
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 300ns Typical
Voltage - Threshold: 0.1V
Supplier Device Package: 8-CERDIP
Grade: Military
DigiKey Programmable: Not Verified
Qualification: MIL-STD-883
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SG1549Y-DESC Microchip Technology 11130-sg1549-datasheet Description: IC SUPERVISOR 1 CHANNEL 8CERDIP
Packaging: Tray
Package / Case: 8-CDIP (0.300", 7.62mm)
Mounting Type: Through Hole
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 300ns Typical
Voltage - Threshold: 0.1V
Supplier Device Package: 8-CERDIP
Grade: Military
DigiKey Programmable: Not Verified
Qualification: MIL-STD-883
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M15KP150A M15KP150A Microchip Technology 9460-rf01011-m15kp-rev-e-datasheet Description: TVS DIODE 150VWM 243VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 62A
Voltage - Reverse Standoff (Typ): 150V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 167V
Voltage - Clamping (Max) @ Ipp: 243V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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ZL80640BLDG1 Microchip Technology Description: 1-CHANNEL 6-OUTPUT INTEL PLATFOR
Packaging: Tray
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JAN1N757AUR-1 JAN1N757AUR-1 Microchip Technology 1N746AUR-1N759AUR%2C1N4370AUR-1N4372AUR.pdf Description: DIODE ZENER 9.1V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 7 V
Qualification: MIL-PRF-19500/127
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MASMLG12A MASMLG12A Microchip Technology msmlg5_j5_series_datasheet_revd.pdf Description: TVS DIODE 12VWM 19.9VC DO215AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 150.6A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: DO-215AB (SMLG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 19.9V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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JANTX1N5536BUR-1 JANTX1N5536BUR-1 Microchip Technology 1N5518BUR-1_1N5546BUR-1.pdf Description: DIODE ZENER 16V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 14.4 V
Qualification: MIL-PRF-19500/437
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JAN1N6132AUS JAN1N6132AUS Microchip Technology lds-0277-1.pdf Description: TVS DIODE 91.2VWM 165.1VC SQMELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 3A
Voltage - Reverse Standoff (Typ): 91.2V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 114V
Voltage - Clamping (Max) @ Ipp: 165.1V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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MART100KP64A MART100KP64A Microchip Technology MRT100KP40A%E2%80%93MXLRT100KP400CA.pdf Description: TVS DIODE 64VWM 126VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: Case 5A (DO-204AR)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.1V
Voltage - Clamping (Max) @ Ipp: 126V
Power - Peak Pulse: 100000W (100kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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JAN1N5611 JAN1N5611 Microchip Technology 11569-lds-0241-datasheet Description: TVS DIODE 40.3VWM 63.5VC G AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 24A
Voltage - Reverse Standoff (Typ): 40.3V
Supplier Device Package: G, Axial
Unidirectional Channels: 1
Voltage - Breakdown (Min): 43.7V
Voltage - Clamping (Max) @ Ipp: 63.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/434
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LXS301-23-0/TR LXS301-23-0/TR Microchip Technology Description: RF DIODE SCHOTTKY 20V SOT23-3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 1.4pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 20V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
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LXS301-23-0/TR LXS301-23-0/TR Microchip Technology Description: RF DIODE SCHOTTKY 20V SOT23-3
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 1.4pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 20V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
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DSC6101CI2A-020.0000T DSC6101CI2A-020.0000T Microchip Technology 20005624B.pdf Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 20 MHz
Base Resonator: MEMS
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24C02CT-I/ST 24C02CT-I/ST Microchip Technology Description: IC EEPROM 2KBIT I2C 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 1ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
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24C02CT-I/ST 24C02CT-I/ST Microchip Technology Description: IC EEPROM 2KBIT I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 1ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
на замовлення 2447 шт:
термін постачання 21-31 дні (днів)
12+28.91 грн
Мінімальне замовлення: 12
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M1.5KE75A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 64.1VWM 103VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.6A
Voltage - Reverse Standoff (Typ): 64.1V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.3V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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WBZ451PE-E WBZ451PE-E Microchip Technology Description: BLUETOOTH LOW ENERGY/ZIGBEE COMB
Packaging: Tray
Package / Case: 39-SMD Module
Sensitivity: -107.1dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB RAM
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 20dBm
Data Rate: 2Mbps
Protocol: Bluetooth v5.2, Class 2, Thread, Zigbee®
Current - Receiving: 21.2mA ~ 43.9mA
Current - Transmitting: 23.6mA ~ 146.7mA
Antenna Type: PCB Trace
Utilized IC / Part: PIC32CX1012BZ25048- E/MYX
Modulation: DSSS, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, I2C, PWM, QSPI, SPI, SWD, USART
на замовлення 144 шт:
термін постачання 21-31 дні (днів)
1+433.63 грн
100+404.56 грн
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EV59Y78A Microchip Technology Description: WILCS02 M.2 WI-FI MODULE CARD
Packaging: Box
Package / Case: Module
Mounting Type: Card Edge
Voltage - Supply: 3.3V
Protocol: 802.11b/g/n
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: WiFi
Serial Interfaces: SDIO, SPI
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JAN1N6051A/TR JAN1N6051A/TR Microchip Technology Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
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JANTX1N6051A/TR JANTX1N6051A/TR Microchip Technology Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
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JANTXV1N6051A JANTXV1N6051A Microchip Technology Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
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JANTXV1N6051A/TR JANTXV1N6051A/TR Microchip Technology 1N6036A-1N6072A.pdf Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
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BZV55C18 BZV55C18 Microchip Technology 8298-bzv55-c2v4-c75-datasheet Description: DIODE ZENER 18V DO213AA
Tolerance: ±6.39%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
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1N6327US/TR 1N6327US/TR Microchip Technology 150_1N6309US%20thru%201N6355DUS.pdf Description: DIODE ZENER 13V 500MW SQ-MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: B, SQ-MELF
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
100+981.50 грн
Мінімальне замовлення: 100
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1N6327US/TR 1N6327US/TR Microchip Technology 150_1N6309US%20thru%201N6355DUS.pdf Description: DIODE ZENER 13V 500MW SQ-MELF
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: B, SQ-MELF
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
1+1056.77 грн
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T7023-PEQ T7023-PEQ Microchip Technology T7023.pdf Description: IC AMP BLUETOOTH 2.4GHZ 16QFN
Packaging: Tube
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
RF Type: Bluetooth
Voltage - Supply: 2.7V ~ 4.6V
Gain: 23dB
Current - Supply: 165mA
Supplier Device Package: 16-QFN (4x4)
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1N6360/TR 1N6360/TR Microchip Technology 129294-lds-0292-datasheet Description: TVS DIODE 15VWM 20.6VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 60A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-13
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.6V
Voltage - Clamping (Max) @ Ipp: 20.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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PIC32AK3208GC41064-I/PT PIC32AK3208GC41064-I/PT Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
3+134.10 грн
25+117.17 грн
100+107.01 грн
Мінімальне замовлення: 3
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PIC32AK6416GC41064-I/PT PIC32AK6416GC41064-I/PT Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
3+140.53 грн
25+123.26 грн
100+111.75 грн
Мінімальне замовлення: 3
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PIC32AK6416GC41064-I/M7 PIC32AK6416GC41064-I/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
3+142.13 грн
25+123.94 грн
100+113.10 грн
Мінімальне замовлення: 3
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PIC32AK1216GC41064-I/PT PIC32AK1216GC41064-I/PT Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
на замовлення 223 шт:
термін постачання 21-31 дні (днів)
3+146.95 грн
25+128.67 грн
100+117.16 грн
Мінімальне замовлення: 3
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PIC32AK1216GC41064-I/M7 PIC32AK1216GC41064-I/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
на замовлення 213 шт:
термін постачання 21-31 дні (днів)
3+150.16 грн
25+130.71 грн
100+119.19 грн
Мінімальне замовлення: 3
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EV25Z08A Microchip Technology Description: PIC32AK1216GC41064 EVAL
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: PIC32
Utilized IC / Part: PIC32AK1216GC41064
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
1+1291.25 грн
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PIC32AK3208GC41064-I/M7 PIC32AK3208GC41064-I/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
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PIC32AK3208GC41064T-I/PT PIC32AK3208GC41064T-I/PT Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
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PIC32AK3208GC41064T-I/M7 PIC32AK3208GC41064T-I/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
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PIC32AK6416GC41064T-I/PT PIC32AK6416GC41064T-I/PT Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
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PIC32AK6416GC41064T-I/M7 PIC32AK6416GC41064T-I/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
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PIC32AK3208GC41064-E/M7 PIC32AK3208GC41064-E/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
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PIC32AK3208GC41064-E/PT PIC32AK3208GC41064-E/PT Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
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PIC32AK1216GC41064T-I/PT PIC32AK1216GC41064T-I/PT Microchip Technology PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
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PIC32AK1216GC41064T-I/M7 PIC32AK1216GC41064T-I/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
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PIC32AK6416GC41064-E/PT PIC32AK6416GC41064-E/PT Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
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DSC6001CI2B-008.1920T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-008.1920T
Виробник: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8.192 MHz
Base Resonator: MEMS
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DSC6001CI2B-032K768T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-032K768T
Виробник: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6001CI2B-040.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-040.0000T
Виробник: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
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DSC6001CI2B-025.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-025.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6001CI2B-008.1920 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-008.1920
Виробник: Microchip Technology
Description: MEMS OSC XO 8.1920MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8.192 MHz
Base Resonator: MEMS
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DSC6001CI2B-032K768 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-032K768
Виробник: Microchip Technology
Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6001CI2B-040.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-040.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 40.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
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DSC6001CI2B-004.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001CI2B-004.0000
Виробник: Microchip Technology
Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
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DSC6001CI2B-012.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001CI2B-012.0000
Виробник: Microchip Technology
Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6001CI2B-004.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001CI2B-004.0000T
Виробник: Microchip Technology
Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
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DSC6001CI2B-012.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001CI2B-012.0000T
Виробник: Microchip Technology
Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6001CI2B-100K000T
DSC6001CI2B-100K000T
Виробник: Microchip Technology
Description: OSCILLATOR MEMS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 kHz
Base Resonator: MEMS
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DSC6001CI2B-100K000
DSC6001CI2B-100K000
Виробник: Microchip Technology
Description: OSCILLATOR MEMS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 kHz
Base Resonator: MEMS
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DSC6001CI2B-016.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-016.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSC1001CC1-125.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CC1-125.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1001CC1-125.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CC1-125.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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BZV55C10 8298-bzv55-c2v4-c75-datasheet
BZV55C10
Виробник: Microchip Technology
Description: DIODE ZENER 10V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 10 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
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SG1549Y-883B 11130-sg1549-datasheet
Виробник: Microchip Technology
Description: IC SUPERVISOR 1 CHANNEL 8CERDIP
Packaging: Tray
Package / Case: 8-CDIP (0.300", 7.62mm)
Mounting Type: Through Hole
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 300ns Typical
Voltage - Threshold: 0.1V
Supplier Device Package: 8-CERDIP
Grade: Military
DigiKey Programmable: Not Verified
Qualification: MIL-STD-883
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SG1549Y-DESC 11130-sg1549-datasheet
Виробник: Microchip Technology
Description: IC SUPERVISOR 1 CHANNEL 8CERDIP
Packaging: Tray
Package / Case: 8-CDIP (0.300", 7.62mm)
Mounting Type: Through Hole
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 300ns Typical
Voltage - Threshold: 0.1V
Supplier Device Package: 8-CERDIP
Grade: Military
DigiKey Programmable: Not Verified
Qualification: MIL-STD-883
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M15KP150A 9460-rf01011-m15kp-rev-e-datasheet
M15KP150A
Виробник: Microchip Technology
Description: TVS DIODE 150VWM 243VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 62A
Voltage - Reverse Standoff (Typ): 150V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 167V
Voltage - Clamping (Max) @ Ipp: 243V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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ZL80640BLDG1
Виробник: Microchip Technology
Description: 1-CHANNEL 6-OUTPUT INTEL PLATFOR
Packaging: Tray
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JAN1N757AUR-1 1N746AUR-1N759AUR%2C1N4370AUR-1N4372AUR.pdf
JAN1N757AUR-1
Виробник: Microchip Technology
Description: DIODE ZENER 9.1V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 7 V
Qualification: MIL-PRF-19500/127
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MASMLG12A msmlg5_j5_series_datasheet_revd.pdf
MASMLG12A
Виробник: Microchip Technology
Description: TVS DIODE 12VWM 19.9VC DO215AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 150.6A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: DO-215AB (SMLG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 19.9V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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JANTX1N5536BUR-1 1N5518BUR-1_1N5546BUR-1.pdf
JANTX1N5536BUR-1
Виробник: Microchip Technology
Description: DIODE ZENER 16V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 14.4 V
Qualification: MIL-PRF-19500/437
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JAN1N6132AUS lds-0277-1.pdf
JAN1N6132AUS
Виробник: Microchip Technology
Description: TVS DIODE 91.2VWM 165.1VC SQMELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 3A
Voltage - Reverse Standoff (Typ): 91.2V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 114V
Voltage - Clamping (Max) @ Ipp: 165.1V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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MART100KP64A MRT100KP40A%E2%80%93MXLRT100KP400CA.pdf
MART100KP64A
Виробник: Microchip Technology
Description: TVS DIODE 64VWM 126VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: Case 5A (DO-204AR)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.1V
Voltage - Clamping (Max) @ Ipp: 126V
Power - Peak Pulse: 100000W (100kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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JAN1N5611 11569-lds-0241-datasheet
JAN1N5611
Виробник: Microchip Technology
Description: TVS DIODE 40.3VWM 63.5VC G AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 24A
Voltage - Reverse Standoff (Typ): 40.3V
Supplier Device Package: G, Axial
Unidirectional Channels: 1
Voltage - Breakdown (Min): 43.7V
Voltage - Clamping (Max) @ Ipp: 63.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/434
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LXS301-23-0/TR
LXS301-23-0/TR
Виробник: Microchip Technology
Description: RF DIODE SCHOTTKY 20V SOT23-3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 1.4pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 20V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
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LXS301-23-0/TR
LXS301-23-0/TR
Виробник: Microchip Technology
Description: RF DIODE SCHOTTKY 20V SOT23-3
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 1.4pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 20V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
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DSC6101CI2A-020.0000T 20005624B.pdf
DSC6101CI2A-020.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 20 MHz
Base Resonator: MEMS
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24C02CT-I/ST
24C02CT-I/ST
Виробник: Microchip Technology
Description: IC EEPROM 2KBIT I2C 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 1ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
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24C02CT-I/ST
24C02CT-I/ST
Виробник: Microchip Technology
Description: IC EEPROM 2KBIT I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 1ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
на замовлення 2447 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
12+28.91 грн
Мінімальне замовлення: 12
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M1.5KE75A RF01008_rE.pdf
Виробник: Microchip Technology
Description: TVS DIODE 64.1VWM 103VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.6A
Voltage - Reverse Standoff (Typ): 64.1V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.3V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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WBZ451PE-E
WBZ451PE-E
Виробник: Microchip Technology
Description: BLUETOOTH LOW ENERGY/ZIGBEE COMB
Packaging: Tray
Package / Case: 39-SMD Module
Sensitivity: -107.1dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB RAM
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 20dBm
Data Rate: 2Mbps
Protocol: Bluetooth v5.2, Class 2, Thread, Zigbee®
Current - Receiving: 21.2mA ~ 43.9mA
Current - Transmitting: 23.6mA ~ 146.7mA
Antenna Type: PCB Trace
Utilized IC / Part: PIC32CX1012BZ25048- E/MYX
Modulation: DSSS, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, I2C, PWM, QSPI, SPI, SWD, USART
на замовлення 144 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+433.63 грн
100+404.56 грн
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EV59Y78A
Виробник: Microchip Technology
Description: WILCS02 M.2 WI-FI MODULE CARD
Packaging: Box
Package / Case: Module
Mounting Type: Card Edge
Voltage - Supply: 3.3V
Protocol: 802.11b/g/n
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: WiFi
Serial Interfaces: SDIO, SPI
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JAN1N6051A/TR
JAN1N6051A/TR
Виробник: Microchip Technology
Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
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JANTX1N6051A/TR
JANTX1N6051A/TR
Виробник: Microchip Technology
Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
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JANTXV1N6051A
JANTXV1N6051A
Виробник: Microchip Technology
Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
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JANTXV1N6051A/TR 1N6036A-1N6072A.pdf
JANTXV1N6051A/TR
Виробник: Microchip Technology
Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
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BZV55C18 8298-bzv55-c2v4-c75-datasheet
BZV55C18
Виробник: Microchip Technology
Description: DIODE ZENER 18V DO213AA
Tolerance: ±6.39%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
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1N6327US/TR 150_1N6309US%20thru%201N6355DUS.pdf
1N6327US/TR
Виробник: Microchip Technology
Description: DIODE ZENER 13V 500MW SQ-MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: B, SQ-MELF
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
100+981.50 грн
Мінімальне замовлення: 100
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1N6327US/TR 150_1N6309US%20thru%201N6355DUS.pdf
1N6327US/TR
Виробник: Microchip Technology
Description: DIODE ZENER 13V 500MW SQ-MELF
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: B, SQ-MELF
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1056.77 грн
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T7023-PEQ T7023.pdf
T7023-PEQ
Виробник: Microchip Technology
Description: IC AMP BLUETOOTH 2.4GHZ 16QFN
Packaging: Tube
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
RF Type: Bluetooth
Voltage - Supply: 2.7V ~ 4.6V
Gain: 23dB
Current - Supply: 165mA
Supplier Device Package: 16-QFN (4x4)
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1N6360/TR 129294-lds-0292-datasheet
1N6360/TR
Виробник: Microchip Technology
Description: TVS DIODE 15VWM 20.6VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 60A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-13
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.6V
Voltage - Clamping (Max) @ Ipp: 20.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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PIC32AK3208GC41064-I/PT
PIC32AK3208GC41064-I/PT
Виробник: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+134.10 грн
25+117.17 грн
100+107.01 грн
Мінімальне замовлення: 3
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PIC32AK6416GC41064-I/PT
PIC32AK6416GC41064-I/PT
Виробник: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+140.53 грн
25+123.26 грн
100+111.75 грн
Мінімальне замовлення: 3
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PIC32AK6416GC41064-I/M7
PIC32AK6416GC41064-I/M7
Виробник: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+142.13 грн
25+123.94 грн
100+113.10 грн
Мінімальне замовлення: 3
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PIC32AK1216GC41064-I/PT
PIC32AK1216GC41064-I/PT
Виробник: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
на замовлення 223 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+146.95 грн
25+128.67 грн
100+117.16 грн
Мінімальне замовлення: 3
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PIC32AK1216GC41064-I/M7
PIC32AK1216GC41064-I/M7
Виробник: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
на замовлення 213 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+150.16 грн
25+130.71 грн
100+119.19 грн
Мінімальне замовлення: 3
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EV25Z08A
Виробник: Microchip Technology
Description: PIC32AK1216GC41064 EVAL
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: PIC32
Utilized IC / Part: PIC32AK1216GC41064
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1291.25 грн
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PIC32AK3208GC41064-I/M7
PIC32AK3208GC41064-I/M7
Виробник: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
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PIC32AK3208GC41064T-I/PT
PIC32AK3208GC41064T-I/PT
Виробник: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
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PIC32AK3208GC41064T-I/M7
PIC32AK3208GC41064T-I/M7
Виробник: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
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PIC32AK6416GC41064T-I/PT
PIC32AK6416GC41064T-I/PT
Виробник: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
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PIC32AK6416GC41064T-I/M7
PIC32AK6416GC41064T-I/M7
Виробник: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
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PIC32AK3208GC41064-E/M7
PIC32AK3208GC41064-E/M7
Виробник: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
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PIC32AK3208GC41064-E/PT
PIC32AK3208GC41064-E/PT
Виробник: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
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PIC32AK1216GC41064T-I/PT PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf
PIC32AK1216GC41064T-I/PT
Виробник: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
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PIC32AK1216GC41064T-I/M7
PIC32AK1216GC41064T-I/M7
Виробник: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
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PIC32AK6416GC41064-E/PT
PIC32AK6416GC41064-E/PT
Виробник: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
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