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MC68MH360ZQ33L MC68MH360ZQ33L NXP USA Inc. MC68MH360UM.pdf Description: IC MPU M683XX 33MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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MC68MH360ZQ25LR2 MC68MH360ZQ25LR2 NXP USA Inc. MC68MH360UM.pdf Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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MC68MH360ZQ25L MC68MH360ZQ25L NXP USA Inc. MC68MH360UM.pdf Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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MC68MH360CZQ25L MC68MH360CZQ25L NXP USA Inc. MC68MH360UM.pdf Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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MC68SZ328AVM66 NXP USA Inc. Description: IC MPU M683XX 66MHZ 196BGA
Packaging: Tray
Package / Case: 196-PBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 196-BGA
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MC705B16NCBE MC705B16NCBE NXP USA Inc. MC68HC05B6.pdf Description: IC MCU 8BIT 15KB OTP 56PSDIP
Packaging: Tube
Package / Case: 56-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 15KB (15K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: POR, WDT
Supplier Device Package: 56-PSDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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MC68VZ328CVPR2 MC68VZ328CVPR2 NXP USA Inc. Description: IC MPU M683XX 33MHZ 144MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-MAPBGA (13x13)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MC705B16NBE MC705B16NBE NXP USA Inc. MC68HC05B6.pdf Description: IC MCU 8BIT 15KB OTP 56PSDIP
Packaging: Tube
Package / Case: 56-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 15KB (15K x 8)
RAM Size: 352 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: POR, WDT
Supplier Device Package: 56-PSDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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MC68VZ328VP MC68VZ328VP NXP USA Inc. Description: IC MPU M683XX 33MHZ 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-MAPBGA (13x13)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MC68VZ328AG MC68VZ328AG NXP USA Inc. Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MC68VZ328CAGR2 MC68VZ328CAGR2 NXP USA Inc. Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MC68VZ328CAG MC68VZ328CAG NXP USA Inc. Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MC68VZ328AGR2 MC68VZ328AGR2 NXP USA Inc. Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MCZ145012EG MCZ145012EG NXP USA Inc. MC145012.pdf Description: IC SMOKE DETECT PHOTOELEC 16SOIC
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MCZ33287EG MCZ33287EG NXP USA Inc. MC33287.pdf Description: IC INTERFACE SPECIALIZED 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 5V, 12V
Supplier Device Package: 20-SOIC
Grade: Automotive
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MCZ33290EF MCZ33290EF NXP USA Inc. MC33290.pdf description Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
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MCZ33291EG MCZ33291EG NXP USA Inc. MC33291.pdf Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MCZ33298EG MCZ33298EG NXP USA Inc. MC33298.pdf Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 350mOhm
Voltage - Load: 5.5V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3A
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MCZ33390EF MCZ33390EF NXP USA Inc. MC33390.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
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MCZ33883EG MCZ33883EG NXP USA Inc. MC33883.pdf Description: IC GATE DRVR HALF-BRIDGE 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 55V
Input Type: Non-Inverting
Supplier Device Package: 20-SOIC
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 4
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 0.8V, 2V
Current - Peak Output (Source, Sink): 1A, 1A
DigiKey Programmable: Not Verified
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MCZ33897AEF MCZ33897AEF NXP USA Inc. 33897%28A%2CB%2CC%2CD%2CT%29.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MCZ33897EF MCZ33897EF NXP USA Inc. 33897%28A%2CB%2CC%2CD%2CT%29.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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PBSS2515E,115 PBSS2515E,115 NXP USA Inc. PBSS2515E.pdf Description: TRANS NPN 15V 0.5A SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 420MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 250 mW
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DEMOQE128 DEMOQE128 NXP USA Inc. DEMOQE128_QSG.pdf Description: MC9S08QE128/MCF51QE128 EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s), Accessories
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08QE128, MCF51QE128
Part Status: Active
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LPC2292FET144/G,55 LPC2292FET144/G,55 NXP USA Inc. LPC2292_2294.pdf Description: IC MCU 16/32BIT 256KB 144TFBGA
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DEMO1985MC34940E DEMO1985MC34940E NXP USA Inc. MC34940.pdf Description: KIT DEMO FOR MC34940E FAMILY
Packaging: Box
Interface: Analog
Voltage - Supply: 9V ~ 18V
Sensor Type: Touch, Capacitive
Utilized IC / Part: MC34940
Supplied Contents: Board(s)
Embedded: No
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DEMO9S08RG60E NXP USA Inc. DEMO9S08RG60UM.pdf Description: MC9S08RG60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08RG60
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EVBQE128 EVBQE128 NXP USA Inc. MCF51QE128FS.pdf description Description: MC9S08QE128/MCF51QE128 EVAL BRD
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M5253EVBE NXP USA Inc. Description: MCF5253 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5253
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MC33493ADTBE MC33493ADTBE NXP USA Inc. MC33493A.pdf Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC33493ADTBER2 MC33493ADTBER2 NXP USA Inc. MC33493A.pdf Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC33493DTBE MC33493DTBE NXP USA Inc. MC33493.pdf Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC33596FJE MC33596FJE NXP USA Inc. mc33596.pdf Description: RF RX FSK/OOK 304/315/426 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-LQFP (5x5)
Part Status: Obsolete
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MC33696FCE MC33696FCE NXP USA Inc. MC33696.pdf Description: IC RF TXRX ISM<1GHZ 32VFQFN
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MC33696FJE MC33696FJE NXP USA Inc. MC33696.pdf Description: IC RF TXRX ISM<1GHZ 32LQFP
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MC33696MOD434EV NXP USA Inc. MC33696.pdf Description: KIT RF MODULE 434MHZ MC33696
Packaging: Box
For Use With/Related Products: MC33696 434MHz RF Module
Frequency: 433.92MHz
Type: Transceiver, ISM
Supplied Contents: Board(s)
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MC33972TEW MC33972TEW NXP USA Inc. MC33972%28A%2CT%29.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
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MC33972TEWR2 MC33972TEWR2 NXP USA Inc. MC33972%28A%2CT%29.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
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MC34712EP MC34712EP NXP USA Inc. MC34712.pdf Description: IC REG CONV DDR 1OUT 24QFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 1.35V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 24-QFN-EP (4x4)
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MC34713EP MC34713EP NXP USA Inc. MC34713.pdf Description: IC REG CONV DDR 1OUT 24QFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 24-QFN-EP (4x4)
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MC34716EP MC34716EP NXP USA Inc. MC34716.pdf Description: IC REG CONV DDR 2OUT 26QFN
Packaging: Tray
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
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MC34717EP MC34717EP NXP USA Inc. MC34717.pdf Description: IC REG CONV DDR 2OUT 26QFN
Packaging: Tray
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Part Status: Obsolete
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MC9S08QG8CFKE MC9S08QG8CFKE NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 8KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN-EP (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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MC9S08QG8MFFE MC9S08QG8MFFE NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 2405 шт:
термін постачання 21-31 дні (днів)
2+237.37 грн
10+173.69 грн
25+165.31 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MCF5327CVM240 MCF5327CVM240 NXP USA Inc. MCF5329DS.pdf Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 94
DigiKey Programmable: Not Verified
на замовлення 630 шт:
термін постачання 21-31 дні (днів)
1+2306.26 грн
10+1740.36 грн
25+1620.17 грн
80+1413.30 грн
230+1342.08 грн
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MCF5372LCVM240 MCF5372LCVM240 NXP USA Inc. MCF5373DS.pdf Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 62
DigiKey Programmable: Not Verified
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MMA7330LT MMA7330LT NXP USA Inc. MMA7330L.pdf Description: ACCELEROMETER 4-12G ANALOG 14LGA
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MMA7340LT MMA7340LT NXP USA Inc. MMA7340L.pdf description Description: ACCELEROMETER 3-11G ANALOG 14LGA
Packaging: Tray
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±3g, 11g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 440 (±3g) ~ 117.8 (±9g)
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MMA7360L MMA7360L NXP USA Inc. MMA7360L.pdf Description: ACCEL 1.5-6G ANALOG 14LGA
Packaging: Tray
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
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MMA7360LT MMA7360LT NXP USA Inc. MMA7360L.pdf Description: ACCEL 1.5-6G ANALOG 14LGA
Packaging: Tray
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
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MC33493ADTBER2 MC33493ADTBER2 NXP USA Inc. MC33493A.pdf Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC33972TEWR2 MC33972TEWR2 NXP USA Inc. MC33972%28A%2CT%29.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
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MC33794EKR2 MC33794EKR2 NXP USA Inc. MC33794.pdf Description: IC SENSOR ELECTRIC FIELD 54SOIC
Packaging: Cut Tape (CT)
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC-EP
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
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MC34923EGR2 MC34923EGR2 NXP USA Inc. MC34923.pdf Description: IC MOTOR DRIVER 4.5V-5.5V 24SOIC
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MCZ33879AEKR2 MCZ33879AEKR2 NXP USA Inc. MC33879.pdf Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
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MM908E624ACEWR2 MM908E624ACEWR2 NXP USA Inc. MM908E624.pdf Description: IC SWITCH TRPL HI MCU/LIN 54SOIC
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MPVZ2202GC6T1 MPVZ2202GC6T1 NXP USA Inc. MPVZ2202%20Series.pdf Description: IC SENSOR PRESSURE 200KPA 8-SOP
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MCZ33879AEKR2 MCZ33879AEKR2 NXP USA Inc. MC33879.pdf Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
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PCA9306GM,125 PCA9306GM,125 NXP USA Inc. PCA9306.pdf Description: IC TRANSLTR BIDIRECTIONAL 8XQFNU
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XQFNU (1.6x1.6)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 24000 шт:
термін постачання 21-31 дні (днів)
4000+27.05 грн
8000+25.46 грн
12000+25.16 грн
20000+23.30 грн
Мінімальне замовлення: 4000
В кошику  од. на суму  грн.
PCA9671DB,112 PCA9671DB,112 NXP USA Inc. PCA9671.pdf Description: IC XPNDR 1MHZ I2C 24SSOP
Packaging: Tube
Features: POR
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: No
Supplier Device Package: 24-SSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC68MH360ZQ33L MC68MH360UM.pdf
MC68MH360ZQ33L
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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MC68MH360ZQ25LR2 MC68MH360UM.pdf
MC68MH360ZQ25LR2
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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MC68MH360ZQ25L MC68MH360UM.pdf
MC68MH360ZQ25L
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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MC68MH360CZQ25L MC68MH360UM.pdf
MC68MH360CZQ25L
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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MC68SZ328AVM66
Виробник: NXP USA Inc.
Description: IC MPU M683XX 66MHZ 196BGA
Packaging: Tray
Package / Case: 196-PBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 196-BGA
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MC705B16NCBE MC68HC05B6.pdf
MC705B16NCBE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 15KB OTP 56PSDIP
Packaging: Tube
Package / Case: 56-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 15KB (15K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: POR, WDT
Supplier Device Package: 56-PSDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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MC68VZ328CVPR2
MC68VZ328CVPR2
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-MAPBGA (13x13)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MC705B16NBE MC68HC05B6.pdf
MC705B16NBE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 15KB OTP 56PSDIP
Packaging: Tube
Package / Case: 56-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 15KB (15K x 8)
RAM Size: 352 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: POR, WDT
Supplier Device Package: 56-PSDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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MC68VZ328VP
MC68VZ328VP
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-MAPBGA (13x13)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MC68VZ328AG
MC68VZ328AG
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MC68VZ328CAGR2
MC68VZ328CAGR2
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MC68VZ328CAG
MC68VZ328CAG
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MC68VZ328AGR2
MC68VZ328AGR2
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MCZ145012EG MC145012.pdf
MCZ145012EG
Виробник: NXP USA Inc.
Description: IC SMOKE DETECT PHOTOELEC 16SOIC
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MCZ33287EG MC33287.pdf
MCZ33287EG
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 5V, 12V
Supplier Device Package: 20-SOIC
Grade: Automotive
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MCZ33290EF description MC33290.pdf
MCZ33290EF
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
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MCZ33291EG MC33291.pdf
MCZ33291EG
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MCZ33298EG MC33298.pdf
MCZ33298EG
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 350mOhm
Voltage - Load: 5.5V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3A
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MCZ33390EF MC33390.pdf
MCZ33390EF
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
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MCZ33883EG MC33883.pdf
MCZ33883EG
Виробник: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 55V
Input Type: Non-Inverting
Supplier Device Package: 20-SOIC
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 4
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 0.8V, 2V
Current - Peak Output (Source, Sink): 1A, 1A
DigiKey Programmable: Not Verified
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MCZ33897AEF 33897%28A%2CB%2CC%2CD%2CT%29.pdf
MCZ33897AEF
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MCZ33897EF 33897%28A%2CB%2CC%2CD%2CT%29.pdf
MCZ33897EF
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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PBSS2515E,115 PBSS2515E.pdf
PBSS2515E,115
Виробник: NXP USA Inc.
Description: TRANS NPN 15V 0.5A SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 420MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 250 mW
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DEMOQE128 DEMOQE128_QSG.pdf
DEMOQE128
Виробник: NXP USA Inc.
Description: MC9S08QE128/MCF51QE128 EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s), Accessories
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08QE128, MCF51QE128
Part Status: Active
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LPC2292FET144/G,55 LPC2292_2294.pdf
LPC2292FET144/G,55
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 256KB 144TFBGA
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DEMO1985MC34940E MC34940.pdf
DEMO1985MC34940E
Виробник: NXP USA Inc.
Description: KIT DEMO FOR MC34940E FAMILY
Packaging: Box
Interface: Analog
Voltage - Supply: 9V ~ 18V
Sensor Type: Touch, Capacitive
Utilized IC / Part: MC34940
Supplied Contents: Board(s)
Embedded: No
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DEMO9S08RG60E DEMO9S08RG60UM.pdf
Виробник: NXP USA Inc.
Description: MC9S08RG60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08RG60
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EVBQE128 description MCF51QE128FS.pdf
EVBQE128
Виробник: NXP USA Inc.
Description: MC9S08QE128/MCF51QE128 EVAL BRD
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M5253EVBE
Виробник: NXP USA Inc.
Description: MCF5253 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5253
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MC33493ADTBE MC33493A.pdf
MC33493ADTBE
Виробник: NXP USA Inc.
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC33493ADTBER2 MC33493A.pdf
MC33493ADTBER2
Виробник: NXP USA Inc.
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC33493DTBE MC33493.pdf
MC33493DTBE
Виробник: NXP USA Inc.
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC33596FJE mc33596.pdf
MC33596FJE
Виробник: NXP USA Inc.
Description: RF RX FSK/OOK 304/315/426 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-LQFP (5x5)
Part Status: Obsolete
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MC33696FCE MC33696.pdf
MC33696FCE
Виробник: NXP USA Inc.
Description: IC RF TXRX ISM<1GHZ 32VFQFN
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MC33696FJE MC33696.pdf
MC33696FJE
Виробник: NXP USA Inc.
Description: IC RF TXRX ISM<1GHZ 32LQFP
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MC33696MOD434EV MC33696.pdf
Виробник: NXP USA Inc.
Description: KIT RF MODULE 434MHZ MC33696
Packaging: Box
For Use With/Related Products: MC33696 434MHz RF Module
Frequency: 433.92MHz
Type: Transceiver, ISM
Supplied Contents: Board(s)
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MC33972TEW MC33972%28A%2CT%29.pdf
MC33972TEW
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
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MC33972TEWR2 MC33972%28A%2CT%29.pdf
MC33972TEWR2
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
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MC34712EP MC34712.pdf
MC34712EP
Виробник: NXP USA Inc.
Description: IC REG CONV DDR 1OUT 24QFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 1.35V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 24-QFN-EP (4x4)
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MC34713EP MC34713.pdf
MC34713EP
Виробник: NXP USA Inc.
Description: IC REG CONV DDR 1OUT 24QFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 24-QFN-EP (4x4)
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MC34716EP MC34716.pdf
MC34716EP
Виробник: NXP USA Inc.
Description: IC REG CONV DDR 2OUT 26QFN
Packaging: Tray
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
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MC34717EP MC34717.pdf
MC34717EP
Виробник: NXP USA Inc.
Description: IC REG CONV DDR 2OUT 26QFN
Packaging: Tray
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Part Status: Obsolete
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MC9S08QG8CFKE MC9S08QG8.pdf
MC9S08QG8CFKE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN-EP (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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MC9S08QG8MFFE MC9S08QG8.pdf
MC9S08QG8MFFE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 2405 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+237.37 грн
10+173.69 грн
25+165.31 грн
Мінімальне замовлення: 2
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MCF5327CVM240 MCF5329DS.pdf
MCF5327CVM240
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 94
DigiKey Programmable: Not Verified
на замовлення 630 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2306.26 грн
10+1740.36 грн
25+1620.17 грн
80+1413.30 грн
230+1342.08 грн
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MCF5372LCVM240 MCF5373DS.pdf
MCF5372LCVM240
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 62
DigiKey Programmable: Not Verified
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MMA7330LT MMA7330L.pdf
MMA7330LT
Виробник: NXP USA Inc.
Description: ACCELEROMETER 4-12G ANALOG 14LGA
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MMA7340LT description MMA7340L.pdf
MMA7340LT
Виробник: NXP USA Inc.
Description: ACCELEROMETER 3-11G ANALOG 14LGA
Packaging: Tray
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±3g, 11g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 440 (±3g) ~ 117.8 (±9g)
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MMA7360L MMA7360L.pdf
MMA7360L
Виробник: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 14LGA
Packaging: Tray
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
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MMA7360LT MMA7360L.pdf
MMA7360LT
Виробник: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 14LGA
Packaging: Tray
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
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MC33493ADTBER2 MC33493A.pdf
MC33493ADTBER2
Виробник: NXP USA Inc.
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC33972TEWR2 MC33972%28A%2CT%29.pdf
MC33972TEWR2
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
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MC33794EKR2 MC33794.pdf
MC33794EKR2
Виробник: NXP USA Inc.
Description: IC SENSOR ELECTRIC FIELD 54SOIC
Packaging: Cut Tape (CT)
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC-EP
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
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MC34923EGR2 MC34923.pdf
MC34923EGR2
Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 4.5V-5.5V 24SOIC
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MCZ33879AEKR2 MC33879.pdf
MCZ33879AEKR2
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
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MM908E624ACEWR2 MM908E624.pdf
MM908E624ACEWR2
Виробник: NXP USA Inc.
Description: IC SWITCH TRPL HI MCU/LIN 54SOIC
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MPVZ2202GC6T1 MPVZ2202%20Series.pdf
MPVZ2202GC6T1
Виробник: NXP USA Inc.
Description: IC SENSOR PRESSURE 200KPA 8-SOP
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MCZ33879AEKR2 MC33879.pdf
MCZ33879AEKR2
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
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PCA9306GM,125 PCA9306.pdf
PCA9306GM,125
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XQFNU
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XQFNU (1.6x1.6)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 24000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4000+27.05 грн
8000+25.46 грн
12000+25.16 грн
20000+23.30 грн
Мінімальне замовлення: 4000
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PCA9671DB,112 PCA9671.pdf
PCA9671DB,112
Виробник: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 24SSOP
Packaging: Tube
Features: POR
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: No
Supplier Device Package: 24-SSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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