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M52235EVB M52235EVB NXP USA Inc. Description: MCF52235 EVAL BRD
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M5235BCCE NXP USA Inc. M5235BCC,%20M5235BCCKIT.pdf Description: MCF5235 EVAL BRD
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M5235BCCKITE NXP USA Inc. M5235BCC,%20M5235BCCKIT.pdf Description: MCF5235 EVAL BRD
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M5282LITEKITE NXP USA Inc. Description: MCF5280/MCF5281/MCF5282 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Board Type: Evaluation Platform
Utilized IC / Part: MCF5280, MCF5281, MCF5282
Part Status: Obsolete
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M5329AFE M5329AFE NXP USA Inc. Description: ZOOM MCF5329 EVAL BRD
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M5329EVBE NXP USA Inc. Description: ZOOM MCF5329 EVAL BRD
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MC56F8367EVME MC56F8367EVME NXP USA Inc. 56F800_Series_FS.pdf Description: MC56F83X5/F83X6/F83X7 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s), Power Supply
Core Processor: 56800E
Utilized IC / Part: MC56F83x5, MC56F83x6, MC56F83x7
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MC9S08AW16CFGER MC9S08AW16CFGER NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
1500+409.50 грн
Мінімальне замовлення: 1500 шт
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MC9S08AW60CPUER MC9S08AW60CPUER NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
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MC9S08DN16CLC MC9S08DN16CLC NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MC9S08DN16CLF MC9S08DN16CLF NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Number of I/O: 39
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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MC9S08DN16MLC MC9S08DN16MLC NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MC9S08QD2CSCR MC9S08QD2CSCR NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
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MCF52211CVM80 MCF52211CVM80 NXP USA Inc. MCF52211.pdf Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
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MCZ34653EF MCZ34653EF NXP USA Inc. MC34653.pdf Description: IC HOTSWAP CTRLR 1A NEG 8-SOIC
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MCZ34653EFR2 MCZ34653EFR2 NXP USA Inc. MC34653.pdf Description: IC HOTSWAP CTRLR 1A NEG 8-SOIC
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MPC5553EVBE NXP USA Inc. MPC5553.pdf Description: MPC5553 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5553
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MPC5554EVBE MPC5554EVBE NXP USA Inc. MPC5554.pdf Description: MPC5554 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5554
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+102388.33 грн
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MPC555CMEE NXP USA Inc. Description: MPC555 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Board Type: Evaluation Platform
Utilized IC / Part: MPC555
Part Status: Active
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MPXV7002GC6T1 MPXV7002GC6T1 NXP USA Inc. MPXV7002.pdf Description: SENSOR 0.29PSIC 0.13" 4.5V AXIAL
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Compound
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: ±10.88PSI (±75kPa)
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DEMO9S08DZ60 DEMO9S08DZ60 NXP USA Inc. MC9S08DZ60.pdf Description: MC9S08DZ60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08DZ60
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
1+22143.86 грн
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M5213EVBE M5213EVBE NXP USA Inc. Description: MCF5213 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5213
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MC9S08DN60CLC MC9S08DN60CLC NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MC9S08DN60MLC MC9S08DN60MLC NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MC9S08DN60MLH MC9S08DN60MLH NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MC9S08DV60MLC MC9S08DV60MLC NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
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MC9S08DZ32CLC MC9S08DZ32CLC NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
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MC9S08DZ32MLC MC9S08DZ32MLC NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
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MC9S08DZ32MLF MC9S08DZ32MLF NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08DZ32MLH MC9S08DZ32MLH NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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MC9S08DZ60CLF MC9S08DZ60CLF NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08DZ60CLH MC9S08DZ60CLH NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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MC9S08DZ60MLF MC9S08DZ60MLF NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08GT16ACFBER MC9S08GT16ACFBER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 2250 шт:
термін постачання 21-31 дні (днів)
750+356.74 грн
1500+336.15 грн
Мінімальне замовлення: 750 шт
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MC9S08GT60ACFDER MC9S08GT60ACFDER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
2000+634.30 грн
Мінімальне замовлення: 2000 шт
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MC9S08GT8ACFBER MC9S08GT8ACFBER NXP USA Inc. MC9S08GT16A.pdf Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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MC9S08QG8CFFER MC9S08QG8CFFER NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)
2500+154.60 грн
Мінімальне замовлення: 2500 шт
В кошику  од. на суму  грн.
MPC8313E-RDB MPC8313E-RDB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
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MC9S08GT16ACFBER MC9S08GT16ACFBER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 2302 шт:
термін постачання 21-31 дні (днів)
1+591.00 грн
10+442.11 грн
25+410.28 грн
100+352.20 грн
250+336.55 грн
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MC9S08GT60ACFDER MC9S08GT60ACFDER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
на замовлення 3153 шт:
термін постачання 21-31 дні (днів)
1+1097.34 грн
10+837.67 грн
25+782.83 грн
100+678.12 грн
250+651.17 грн
500+634.93 грн
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MC9S08GT8ACFBER MC9S08GT8ACFBER NXP USA Inc. MC9S08GT16A.pdf Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Cut Tape (CT)
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MC9S08QG8CFFER MC9S08QG8CFFER NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 9301 шт:
термін постачання 21-31 дні (днів)
2+306.18 грн
10+223.53 грн
25+205.79 грн
100+174.81 грн
250+166.08 грн
500+160.82 грн
1000+153.93 грн
Мінімальне замовлення: 2 шт
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BAP51-04W,115 BAP51-04W,115 NXP USA Inc. BAP51-04W_N.pdf Description: RF DIODE PIN 50V 240MW SC-70
Power Dissipation (Max): 240 mW
Current - Max: 50 mA
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
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BAP65-05,215 BAP65-05,215 NXP USA Inc. BAP65-05.pdf Description: RF DIODE PIN 30V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
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BAP70-04W,115 BAP70-04W,115 NXP USA Inc. BAP70-04W.pdf Description: RF DIODE PIN 50V 260MW SC-70
Power Dissipation (Max): 260 mW
Current - Max: 100 mA
Part Status: Obsolete
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
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BAP70AM,135 BAP70AM,135 NXP USA Inc. BAP70AM.pdf Description: RF DIODE PIN 50V 300MW 6TSSOP
Power Dissipation (Max): 300 mW
Current - Max: 100 mA
Supplier Device Package: 6-TSSOP
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 2 Pair Series
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
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BB178LX,315 BB178LX,315 NXP USA Inc. BB178LX_Rev2.pdf Description: DIODE UHF VAR CAP 32V SOD882T
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Tape & Reel (TR)
Capacitance Ratio: 15.0
Voltage - Peak Reverse (Max): 32 V
Supplier Device Package: SOD2
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
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BB179LX,315 BB179LX,315 NXP USA Inc. BB179LX_Rev1.pdf Description: DIODE VARACTOR 30V SINGLE SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
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BFG25A/X,215 BFG25A/X,215 NXP USA Inc. BFG25A_X_Rev4.pdf Description: RF TRANS NPN 5V 5GHZ SOT-143B
Supplier Device Package: SOT-143B
Noise Figure (dB Typ @ f): 1.8dB ~ 2dB @ 1GHz
Frequency - Transition: 5GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500µA, 1V
Voltage - Collector Emitter Breakdown (Max): 5V
Current - Collector (Ic) (Max): 6.5mA
Power - Max: 32mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-253-4, TO-253AA
Packaging: Tape & Reel (TR)
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BFG520/XR,215 BFG520/XR,215 NXP USA Inc. BFG520%28X%2CXR%29_Rev4.pdf Description: RF TRANS NPN 15V 9GHZ SOT-143R
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Frequency - Transition: 9GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Voltage - Collector Emitter Breakdown (Max): 15V
Current - Collector (Ic) (Max): 70mA
Power - Max: 300mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
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BFQ591,115 BFQ591,115 NXP USA Inc. BFQ591_Rev4.pdf Description: RF TRANS NPN 15V 7GHZ SOT89-3
Supplier Device Package: SOT-89-3
Frequency - Transition: 7GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 70mA, 8V
Voltage - Collector Emitter Breakdown (Max): 15V
Current - Collector (Ic) (Max): 200mA
Power - Max: 2.25W
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
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BFR93AR,215 BFR93AR,215 NXP USA Inc. BFR93AR_Rev1.pdf Description: RF TRANS NPN 12V 6GHZ SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.9dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
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BFU725F,115 BFU725F,115 NXP USA Inc. Description: RF TRANS NPN 2.8V 70GHZ 4DFP
Packaging: Tape & Reel (TR)
Supplier Device Package: 4-DFP
Noise Figure (dB Typ @ f): 0.42dB ~ 1.1dB @ 1.5GHz ~ 12GHz
Frequency - Transition: 70GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 2.8V
Current - Collector (Ic) (Max): 40mA
Power - Max: 136mW
Gain: 10dB ~ 24dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343F
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BGW200EG/01,518 NXP USA Inc. BGW200EG.pdf Description: IC RF TXRX+MCU WIFI 68LFLGA
Operating Temperature: -30°C ~ 85°C
Type: TxRx + MCU
Memory Size: 256kb ROM, 1280kb SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -91dBm
Package / Case: 68-LFLGA Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: JTAG, SDIO, SPI, UART
RF Family/Standard: WiFi
Modulation: CCK, DSSS, QPSK
GPIO: 11
Supplier Device Package: 68-HLLGAR (10x15)
Current - Transmitting: 16mA ~ 94.2mA
Data Rate (Max): 11Mbps
Current - Receiving: 93.7mA ~ 111.5mA
Protocol: 802.11b
Power - Output: 17.6dBm
Voltage - Supply: 2.7V ~ 3V
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BLF6G10LS-200,112 NXP USA Inc. BLF6G10LS-200.pdf Description: FET RF 65V 871.5MHZ SOT502B
Packaging: Tray
Package / Case: SOT-502B
Current Rating (Amps): 49A
Mounting Type: Chassis Mount
Frequency: 871.5MHz
Power - Output: 40W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
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BLF6G10LS-200,118 NXP USA Inc. BLF6G10LS-200.pdf Description: FET RF 65V 871.5MHZ SOT502B
Current - Test: 1.4 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: SOT502B
Technology: LDMOS
Gain: 20.2dB
Power - Output: 40W
Frequency: 871.5MHz
Mounting Type: Chassis Mount
Current Rating (Amps): 49A
Package / Case: SOT-502B
Packaging: Tape & Reel (TR)
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BLT50,115 BLT50,115 NXP USA Inc. Description: RF TRANS NPN 10V 470MHZ SC-73
Part Status: Obsolete
Supplier Device Package: SC-73
Frequency - Transition: 470MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 300mA, 5V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 500mA
Power - Max: 2W
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
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CBT3857PW,118 CBT3857PW,118 NXP USA Inc. CBT3857.pdf Description: IC BUS SWITCH 10 X 1:1 24-TSSOP
Supplier Device Package: 24-TSSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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CBT6820DGG,512 CBT6820DGG,512 NXP USA Inc. CBT6820_2.pdf Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Part Status: Obsolete
Supplier Device Package: 48-TSSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 4V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Tube
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CBT6820DGG,518 CBT6820DGG,518 NXP USA Inc. CBT6820_2.pdf Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Part Status: Obsolete
Supplier Device Package: 48-TSSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 4V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Tape & Reel (TR)
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M52235EVB
M52235EVB
Виробник: NXP USA Inc.
Description: MCF52235 EVAL BRD
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M5235BCCE M5235BCC,%20M5235BCCKIT.pdf
Виробник: NXP USA Inc.
Description: MCF5235 EVAL BRD
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M5235BCCKITE M5235BCC,%20M5235BCCKIT.pdf
Виробник: NXP USA Inc.
Description: MCF5235 EVAL BRD
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M5282LITEKITE
Виробник: NXP USA Inc.
Description: MCF5280/MCF5281/MCF5282 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Board Type: Evaluation Platform
Utilized IC / Part: MCF5280, MCF5281, MCF5282
Part Status: Obsolete
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M5329AFE
M5329AFE
Виробник: NXP USA Inc.
Description: ZOOM MCF5329 EVAL BRD
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M5329EVBE
Виробник: NXP USA Inc.
Description: ZOOM MCF5329 EVAL BRD
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MC56F8367EVME 56F800_Series_FS.pdf
MC56F8367EVME
Виробник: NXP USA Inc.
Description: MC56F83X5/F83X6/F83X7 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s), Power Supply
Core Processor: 56800E
Utilized IC / Part: MC56F83x5, MC56F83x6, MC56F83x7
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MC9S08AW16CFGER MC9S08AW60.pdf
MC9S08AW16CFGER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1500+409.50 грн
Мінімальне замовлення: 1500 шт
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MC9S08AW60CPUER MC9S08AW60.pdf
MC9S08AW60CPUER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
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MC9S08DN16CLC MC9S08DN60.pdf
MC9S08DN16CLC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MC9S08DN16CLF MC9S08DN60.pdf
MC9S08DN16CLF
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Number of I/O: 39
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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MC9S08DN16MLC MC9S08DN60.pdf
MC9S08DN16MLC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MC9S08QD2CSCR MC9S08QD4.pdf
MC9S08QD2CSCR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
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MCF52211CVM80 MCF52211.pdf
MCF52211CVM80
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
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MCZ34653EF MC34653.pdf
MCZ34653EF
Виробник: NXP USA Inc.
Description: IC HOTSWAP CTRLR 1A NEG 8-SOIC
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MCZ34653EFR2 MC34653.pdf
MCZ34653EFR2
Виробник: NXP USA Inc.
Description: IC HOTSWAP CTRLR 1A NEG 8-SOIC
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MPC5553EVBE MPC5553.pdf
Виробник: NXP USA Inc.
Description: MPC5553 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5553
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MPC5554EVBE MPC5554.pdf
MPC5554EVBE
Виробник: NXP USA Inc.
Description: MPC5554 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5554
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+102388.33 грн
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MPC555CMEE
Виробник: NXP USA Inc.
Description: MPC555 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Board Type: Evaluation Platform
Utilized IC / Part: MPC555
Part Status: Active
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MPXV7002GC6T1 MPXV7002.pdf
MPXV7002GC6T1
Виробник: NXP USA Inc.
Description: SENSOR 0.29PSIC 0.13" 4.5V AXIAL
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Compound
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: ±10.88PSI (±75kPa)
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DEMO9S08DZ60 MC9S08DZ60.pdf
DEMO9S08DZ60
Виробник: NXP USA Inc.
Description: MC9S08DZ60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08DZ60
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+22143.86 грн
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M5213EVBE
M5213EVBE
Виробник: NXP USA Inc.
Description: MCF5213 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5213
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MC9S08DN60CLC MC9S08DN60.pdf
MC9S08DN60CLC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MC9S08DN60MLC MC9S08DN60.pdf
MC9S08DN60MLC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MC9S08DN60MLH MC9S08DN60.pdf
MC9S08DN60MLH
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MC9S08DV60MLC MC9S08DV60.pdf
MC9S08DV60MLC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
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MC9S08DZ32CLC
MC9S08DZ32CLC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
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MC9S08DZ32MLC
MC9S08DZ32MLC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
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MC9S08DZ32MLF
MC9S08DZ32MLF
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08DZ32MLH
MC9S08DZ32MLH
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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MC9S08DZ60CLF
MC9S08DZ60CLF
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08DZ60CLH
MC9S08DZ60CLH
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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MC9S08DZ60MLF
MC9S08DZ60MLF
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08GT16ACFBER MC9S08GB60A.pdf
MC9S08GT16ACFBER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 2250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
750+356.74 грн
1500+336.15 грн
Мінімальне замовлення: 750 шт
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MC9S08GT60ACFDER MC9S08GB60A.pdf
MC9S08GT60ACFDER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2000+634.30 грн
Мінімальне замовлення: 2000 шт
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MC9S08GT8ACFBER MC9S08GT16A.pdf
MC9S08GT8ACFBER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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MC9S08QG8CFFER MC9S08QG8.pdf
MC9S08QG8CFFER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+154.60 грн
Мінімальне замовлення: 2500 шт
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MPC8313E-RDB MPC8313E_Hrdw_Spec.pdf
MPC8313E-RDB
Виробник: NXP USA Inc.
Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
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MC9S08GT16ACFBER MC9S08GB60A.pdf
MC9S08GT16ACFBER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 2302 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+591.00 грн
10+442.11 грн
25+410.28 грн
100+352.20 грн
250+336.55 грн
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MC9S08GT60ACFDER MC9S08GB60A.pdf
MC9S08GT60ACFDER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
на замовлення 3153 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1097.34 грн
10+837.67 грн
25+782.83 грн
100+678.12 грн
250+651.17 грн
500+634.93 грн
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MC9S08GT8ACFBER MC9S08GT16A.pdf
MC9S08GT8ACFBER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Cut Tape (CT)
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MC9S08QG8CFFER MC9S08QG8.pdf
MC9S08QG8CFFER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 9301 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+306.18 грн
10+223.53 грн
25+205.79 грн
100+174.81 грн
250+166.08 грн
500+160.82 грн
1000+153.93 грн
Мінімальне замовлення: 2 шт
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BAP51-04W,115 BAP51-04W_N.pdf
BAP51-04W,115
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 240MW SC-70
Power Dissipation (Max): 240 mW
Current - Max: 50 mA
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
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BAP65-05,215 BAP65-05.pdf
BAP65-05,215
Виробник: NXP USA Inc.
Description: RF DIODE PIN 30V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
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BAP70-04W,115 BAP70-04W.pdf
BAP70-04W,115
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SC-70
Power Dissipation (Max): 260 mW
Current - Max: 100 mA
Part Status: Obsolete
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
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BAP70AM,135 BAP70AM.pdf
BAP70AM,135
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
Power Dissipation (Max): 300 mW
Current - Max: 100 mA
Supplier Device Package: 6-TSSOP
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 2 Pair Series
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
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BB178LX,315 BB178LX_Rev2.pdf
BB178LX,315
Виробник: NXP USA Inc.
Description: DIODE UHF VAR CAP 32V SOD882T
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Tape & Reel (TR)
Capacitance Ratio: 15.0
Voltage - Peak Reverse (Max): 32 V
Supplier Device Package: SOD2
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
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BB179LX,315 BB179LX_Rev1.pdf
BB179LX,315
Виробник: NXP USA Inc.
Description: DIODE VARACTOR 30V SINGLE SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
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BFG25A/X,215 BFG25A_X_Rev4.pdf
BFG25A/X,215
Виробник: NXP USA Inc.
Description: RF TRANS NPN 5V 5GHZ SOT-143B
Supplier Device Package: SOT-143B
Noise Figure (dB Typ @ f): 1.8dB ~ 2dB @ 1GHz
Frequency - Transition: 5GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500µA, 1V
Voltage - Collector Emitter Breakdown (Max): 5V
Current - Collector (Ic) (Max): 6.5mA
Power - Max: 32mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-253-4, TO-253AA
Packaging: Tape & Reel (TR)
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BFG520/XR,215 BFG520%28X%2CXR%29_Rev4.pdf
BFG520/XR,215
Виробник: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SOT-143R
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Frequency - Transition: 9GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Voltage - Collector Emitter Breakdown (Max): 15V
Current - Collector (Ic) (Max): 70mA
Power - Max: 300mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
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BFQ591,115 BFQ591_Rev4.pdf
BFQ591,115
Виробник: NXP USA Inc.
Description: RF TRANS NPN 15V 7GHZ SOT89-3
Supplier Device Package: SOT-89-3
Frequency - Transition: 7GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 70mA, 8V
Voltage - Collector Emitter Breakdown (Max): 15V
Current - Collector (Ic) (Max): 200mA
Power - Max: 2.25W
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
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BFR93AR,215 BFR93AR_Rev1.pdf
BFR93AR,215
Виробник: NXP USA Inc.
Description: RF TRANS NPN 12V 6GHZ SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.9dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
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BFU725F,115
BFU725F,115
Виробник: NXP USA Inc.
Description: RF TRANS NPN 2.8V 70GHZ 4DFP
Packaging: Tape & Reel (TR)
Supplier Device Package: 4-DFP
Noise Figure (dB Typ @ f): 0.42dB ~ 1.1dB @ 1.5GHz ~ 12GHz
Frequency - Transition: 70GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 2.8V
Current - Collector (Ic) (Max): 40mA
Power - Max: 136mW
Gain: 10dB ~ 24dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343F
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BGW200EG/01,518 BGW200EG.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU WIFI 68LFLGA
Operating Temperature: -30°C ~ 85°C
Type: TxRx + MCU
Memory Size: 256kb ROM, 1280kb SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -91dBm
Package / Case: 68-LFLGA Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: JTAG, SDIO, SPI, UART
RF Family/Standard: WiFi
Modulation: CCK, DSSS, QPSK
GPIO: 11
Supplier Device Package: 68-HLLGAR (10x15)
Current - Transmitting: 16mA ~ 94.2mA
Data Rate (Max): 11Mbps
Current - Receiving: 93.7mA ~ 111.5mA
Protocol: 802.11b
Power - Output: 17.6dBm
Voltage - Supply: 2.7V ~ 3V
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BLF6G10LS-200,112 BLF6G10LS-200.pdf
Виробник: NXP USA Inc.
Description: FET RF 65V 871.5MHZ SOT502B
Packaging: Tray
Package / Case: SOT-502B
Current Rating (Amps): 49A
Mounting Type: Chassis Mount
Frequency: 871.5MHz
Power - Output: 40W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
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BLF6G10LS-200,118 BLF6G10LS-200.pdf
Виробник: NXP USA Inc.
Description: FET RF 65V 871.5MHZ SOT502B
Current - Test: 1.4 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: SOT502B
Technology: LDMOS
Gain: 20.2dB
Power - Output: 40W
Frequency: 871.5MHz
Mounting Type: Chassis Mount
Current Rating (Amps): 49A
Package / Case: SOT-502B
Packaging: Tape & Reel (TR)
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BLT50,115
BLT50,115
Виробник: NXP USA Inc.
Description: RF TRANS NPN 10V 470MHZ SC-73
Part Status: Obsolete
Supplier Device Package: SC-73
Frequency - Transition: 470MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 300mA, 5V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 500mA
Power - Max: 2W
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
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CBT3857PW,118 CBT3857.pdf
CBT3857PW,118
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 24-TSSOP
Supplier Device Package: 24-TSSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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CBT6820DGG,512 CBT6820_2.pdf
CBT6820DGG,512
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Part Status: Obsolete
Supplier Device Package: 48-TSSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 4V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Tube
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CBT6820DGG,518 CBT6820_2.pdf
CBT6820DGG,518
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Part Status: Obsolete
Supplier Device Package: 48-TSSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 4V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Tape & Reel (TR)
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