Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36249) > Сторінка 114 з 605
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P89V52X2FBD,157 | NXP USA Inc. |
 Description: IC MCU 8BIT 8KB FLASH 44LQFPPackaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 192 x 8 Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: UART/USART Peripherals: POR Supplier Device Package: 44-LQFP (10x10) Number of I/O: 32 DigiKey Programmable: Not Verified |
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P89V52X2FN,112 | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 40DIP Packaging: Tube Package / Case: 40-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 192 x 8 Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: UART/USART Peripherals: POR Supplier Device Package: 40-DIP Number of I/O: 32 DigiKey Programmable: Not Verified |
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P89CV51RB2FBC,557 | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44TQFP Packaging: Tray Package / Case: 44-TQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-TQFP (10x10) Part Status: Obsolete Number of I/O: 32 DigiKey Programmable: Not Verified |
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.jpg "P89CV51RC2FA,512") |
P89CV51RC2FA,512 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 32 DigiKey Programmable: Not Verified |
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P89CV51RD2FA,512 | NXP USA Inc. |
Description: IC MCU 8BIT 64KB FLASH 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 32 DigiKey Programmable: Not Verified |
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P89CV51RD2FBC,557 | NXP USA Inc. |
Description: IC MCU 8BIT 64KB FLASH 44TQFP Packaging: Tray Package / Case: 44-TQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-TQFP (10x10) Part Status: Obsolete Number of I/O: 32 DigiKey Programmable: Not Verified |
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LPC2458FET180,551 | NXP USA Inc. |
Description: IC MCU 16/32BIT 512KB 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 512KB (512K x 8) RAM Size: 98K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Not For New Designs Number of I/O: 136 DigiKey Programmable: Not Verified |
на замовлення 180 шт: термін постачання 21-31 дні (днів) |
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LPC2460FBD208,551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 72MHz RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Not For New Designs Number of I/O: 160 DigiKey Programmable: Not Verified |
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LPC2460FET208,551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 208TFBGA Packaging: Tray Package / Case: 208-TFBGA Mounting Type: Surface Mount Speed: 72MHz RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 208-TFBGA (15x15) Part Status: Not For New Designs Number of I/O: 160 DigiKey Programmable: Not Verified |
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LPC2468FBD208,551 | NXP USA Inc. |
Description: IC MCU 16/32B 512KB FLSH 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 512KB (512K x 8) RAM Size: 98K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Discontinued at Digi-Key Number of I/O: 160 DigiKey Programmable: Not Verified |
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LPC2468FET208,551 | NXP USA Inc. |
Description: IC MCU 16/32BIT 512KB 208TFBGA |
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GTL2012DP,118 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 8-TSSOP Channel Type: Bidirectional Output Signal: GTL Translator Type: Mixed Signal Channels per Circuit: 2 Input Signal: LVTTL Part Status: Active Number of Circuits: 1 |
на замовлення 2522 шт: термін постачання 21-31 дні (днів) |
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PCA9306DP1,125 | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-TSSOP Packaging: Cut Tape (CT) Features: Auto-Direction Sensing Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Supplier Device Package: 8-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
на замовлення 8923 шт: термін постачання 21-31 дні (днів) |
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PESD12VS4UD,115 | NXP USA Inc. |
Description: TVS DIODE 12VWM 24VC SC74 Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Applications: General Purpose Capacitance @ Frequency: 73pF @ 1MHz Current - Peak Pulse (10/1000µs): 10A (8/20µs) Voltage - Reverse Standoff (Typ): 12V (Max) Supplier Device Package: SC-74 Unidirectional Channels: 4 Voltage - Breakdown (Min): 12.5V Voltage - Clamping (Max) @ Ipp: 24V Power - Peak Pulse: 200W Power Line Protection: No Part Status: Obsolete |
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PESD15VS4UD,115 | NXP USA Inc. |
Description: TVS DIODE 15VWM 33VC 6TSOP Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Applications: General Purpose Capacitance @ Frequency: 60pF @ 1MHz Current - Peak Pulse (10/1000µs): 6A (8/20µs) Voltage - Reverse Standoff (Typ): 15V (Max) Supplier Device Package: SC-74 Unidirectional Channels: 4 Voltage - Breakdown (Min): 15.5V Voltage - Clamping (Max) @ Ipp: 33V Power - Peak Pulse: 200W Power Line Protection: No Part Status: Obsolete |
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PESD15VS4UD,115 | NXP USA Inc. |
Description: TVS DIODE 15VWM 33VC 6TSOP Packaging: Cut Tape (CT) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Applications: General Purpose Capacitance @ Frequency: 60pF @ 1MHz Current - Peak Pulse (10/1000µs): 6A (8/20µs) Voltage - Reverse Standoff (Typ): 15V (Max) Supplier Device Package: SC-74 Unidirectional Channels: 4 Voltage - Breakdown (Min): 15.5V Voltage - Clamping (Max) @ Ipp: 33V Power - Peak Pulse: 200W Power Line Protection: No Part Status: Obsolete |
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JN5139-001-M/04R1T | NXP USA Inc. |
Description: RF TXRX MODULE 802.15.4U.FL SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -100dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 192kB ROM, 96kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Power - Output: 19dBm Protocol: Zigbee® Current - Receiving: 45mA Current - Transmitting: 125mA Antenna Type: Antenna Not Included, U.FL RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
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SA58670BS,115 | NXP USA Inc. |
Description: IC AMP CLASS D STER 2.1W 20HVQFN Packaging: Tape & Reel (TR) Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown Package / Case: 20-VFQFN Exposed Pad Output Type: 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm Supplier Device Package: 20-HVQFN (4x4) Part Status: Obsolete |
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LH75401N0Q100C0,55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 84MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Obsolete Number of I/O: 76 DigiKey Programmable: Not Verified |
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LH75411N0Q100C0,55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 84MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V Connectivity: EBI/EMI, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 76 DigiKey Programmable: Not Verified |
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LH79520N0Q000B1,55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 176LQFP |
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LH79524N0F100A1,55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 208LFBGA Packaging: Tray Package / Case: 208-LFBGA Mounting Type: Surface Mount Speed: 76.2MHz RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 10x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 208-LFBGA (14x14) Number of I/O: 108 DigiKey Programmable: Not Verified |
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LH7A400N0F000B5,55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256LFBGA Packaging: Tray Package / Case: 256-LFBGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM9® Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC'97, DMA, LCD, POR, PWM, WDT Supplier Device Package: 256-LFBGA (14x14) Part Status: Obsolete Number of I/O: 60 DigiKey Programmable: Not Verified |
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LH7A400N0G000B5,55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256BGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM9® Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC'97, DMA, LCD, POR, PWM, WDT Supplier Device Package: 256-BGA (17x17) Number of I/O: 60 DigiKey Programmable: Not Verified |
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LH7A404N0F000B3,55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 324LFBGA Packaging: Tray Package / Case: 324-LFBGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM9® Data Converters: A/D 9x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC'97, DMA, LCD, POR, PWM, WDT Supplier Device Package: 324-LFBGA (17x17) Number of I/O: 64 DigiKey Programmable: Not Verified |
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LH7A404N0F092B3,55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 324LFBGA Packaging: Tray Package / Case: 324-LFBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM9® Data Converters: A/D 9x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC'97, DMA, LCD, POR, PWM, WDT Supplier Device Package: 324-LFBGA (17x17) Number of I/O: 64 DigiKey Programmable: Not Verified |
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JN5139/001,515 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 56VFQFN |
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JN5139/Z01,515 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 56VFQFN |
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JN5139-001-M/00R1T | NXP USA Inc. |
Description: RF TXRX MOD 802.15.4 TH SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 192kB ROM, 96kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Power - Output: 2.5dBm Protocol: Zigbee® Current - Receiving: 37mA Current - Transmitting: 37mA Antenna Type: Integrated, Trace RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified |
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JN5139-001-M/01R1V | NXP USA Inc. |
Description: RF TXRX MODULE 802.15.4SMA SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 192kB ROM, 96kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Power - Output: 2.5dBm Protocol: Zigbee® Current - Receiving: 37mA Current - Transmitting: 37mA Antenna Type: Antenna Not Included, SMA RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
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JN5139-001-M/02R1V | NXP USA Inc. |
Description: RF TXRX MODULE 802.15.4 SMA SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -100dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 192kB ROM, 96kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Power - Output: 19dBm Protocol: Zigbee® Current - Receiving: 45mA Current - Transmitting: 125mA Antenna Type: Antenna Not Included, SMA RF Family/Standard: 802.15.4 Serial Interfaces: I²C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
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JN5139-001-M/03R1T | NXP USA Inc. |
Description: RF TXRX MODULE 802.15.4U.FL SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 192kB ROM, 96kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Power - Output: 2.5dBm Protocol: Zigbee® Current - Receiving: 37mA Current - Transmitting: 37mA Antenna Type: Antenna Not Included, U.FL RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
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JN5139-Z01-M/03R1T | NXP USA Inc. |
Description: RF TXRX MODULE 802.15.4U.FL SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 192kB ROM, 96kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Power - Output: 2.5dBm Protocol: Zigbee® Current - Receiving: 37mA Current - Transmitting: 37mA Antenna Type: Antenna Not Included, U.FL RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
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JN5139-Z01-M/04R1T | NXP USA Inc. |
Description: RF TXRX MODULE 802.15.4U.FL SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -100dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 192kB ROM, 96kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Power - Output: 19dBm Protocol: Zigbee® Current - Receiving: 45mA Current - Transmitting: 125mA Antenna Type: Antenna Not Included, U.FL RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
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JN5139/Z01,515 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 56VFQFN |
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JN5139-001-M/00R1T | NXP USA Inc. |
Description: RF TXRX MOD 802.15.4 TH SMD Packaging: Cut Tape (CT) Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 192kB ROM, 96kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Power - Output: 2.5dBm Protocol: Zigbee® Current - Receiving: 37mA Current - Transmitting: 37mA Antenna Type: Integrated, Trace RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
P89LPC932A1FA,112 | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 28PLCC Packaging: Tube Package / Case: 28-LCC (J-Lead) Mounting Type: Surface Mount Speed: 18MHz Program Memory Size: 8KB (8K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: 28-PLCC (11.48x11.48) Number of I/O: 26 DigiKey Programmable: Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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DEMO56F8013-EE | NXP USA Inc. |
Description: MC56F8013 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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DEMO9S12XEP100 | NXP USA Inc. |
Description: MC9S12XEP100 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s), Cable(s) Core Processor: HCS12X Board Type: Evaluation Platform Utilized IC / Part: MC9S12XEP100 Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
EVB9S08DZ60 | NXP USA Inc. |
Description: MC9S08DZ60 EVAL BRD Packaging: Box Mounting Type: Socket Type: MCU 8-Bit Contents: Board(s), Cable(s), Power Supply Core Processor: HCS08 Utilized IC / Part: MC9S08DZ60 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EVB9S12XEP100 | NXP USA Inc. | Description: MC9S12XEP100 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KMPC8321ECZQADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Box Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KMPC8321ECZQAFDC | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KMPC8321EZQADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Box Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KMPC8321EZQAFDC | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KMPC8321ZQADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Box Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KMPC8323ECZQADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Box Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KMPC8323EZQADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Box Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
KMPC8347VRAGDB | NXP USA Inc. | Description: IC MPU MPC83XX 266MHZ 620BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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M5208EVBE | NXP USA Inc. | Description: MCF5207/MCF5208 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
M52233DEMO | NXP USA Inc. |
Description: MCF52223 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Power Supply Core Processor: Coldfire V2 Utilized IC / Part: MCF52223 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
M52235EVB | NXP USA Inc. | Description: MCF52235 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| M5235BCCE | NXP USA Inc. |
Description: MCF5235 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| M5235BCCKITE | NXP USA Inc. |
Description: MCF5235 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| M5282LITEKITE | NXP USA Inc. |
Description: MCF5280/MCF5281/MCF5282 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: Coldfire V2 Board Type: Evaluation Platform Utilized IC / Part: MCF5280, MCF5281, MCF5282 Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
 |
M5329AFE | NXP USA Inc. | Description: ZOOM MCF5329 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| M5329EVBE | NXP USA Inc. | Description: ZOOM MCF5329 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
 |
MC56F8367EVME | NXP USA Inc. |
Description: MC56F83X5/F83X6/F83X7 EVAL BRD Packaging: Box Mounting Type: Fixed Type: DSP Contents: Board(s), Cable(s), Power Supply Core Processor: 56800E Utilized IC / Part: MC56F83x5, MC56F83x6, MC56F83x7 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
MC9S08AW16CFGER | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44LQFP Packaging: Tape & Reel (TR) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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MC9S08AW60CPUER | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Verified |
товару немає в наявності |
В кошику од. на суму грн. |
| P89V52X2FBD,157 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 192 x 8
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 192 x 8
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| P89V52X2FN,112 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 192 x 8
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 40-DIP
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 192 x 8
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 40-DIP
Number of I/O: 32
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| P89CV51RB2FBC,557 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| P89CV51RC2FA,512 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 32
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| P89CV51RD2FA,512 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 64KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 32
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| P89CV51RD2FBC,557 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 64KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| LPC2458FET180,551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 512KB 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Not For New Designs
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 512KB 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Not For New Designs
Number of I/O: 136
DigiKey Programmable: Not Verified
на замовлення 180 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1671.61 грн |
| 10+ | 1294.21 грн |
| 25+ | 1215.42 грн |
| LPC2460FBD208,551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| LPC2460FET208,551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
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| LPC2468FBD208,551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 512KB FLSH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 160
DigiKey Programmable: Not Verified
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| LPC2468FET208,551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 512KB 208TFBGA
Description: IC MCU 16/32BIT 512KB 208TFBGA
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| GTL2012DP,118 |
|
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 2
Input Signal: LVTTL
Part Status: Active
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 2
Input Signal: LVTTL
Part Status: Active
Number of Circuits: 1
на замовлення 2522 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 88.55 грн |
| 10+ | 61.91 грн |
| 25+ | 56.05 грн |
| 100+ | 46.50 грн |
| 250+ | 43.60 грн |
| 500+ | 41.85 грн |
| 1000+ | 39.75 грн |
| PCA9306DP1,125 |
|
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 8923 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 54.67 грн |
| 10+ | 37.59 грн |
| 25+ | 33.81 грн |
| 100+ | 27.82 грн |
| 250+ | 25.96 грн |
| 500+ | 24.84 грн |
| 1000+ | 23.52 грн |
| PESD12VS4UD,115 |
|
Виробник: NXP USA Inc.
Description: TVS DIODE 12VWM 24VC SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 73pF @ 1MHz
Current - Peak Pulse (10/1000µs): 10A (8/20µs)
Voltage - Reverse Standoff (Typ): 12V (Max)
Supplier Device Package: SC-74
Unidirectional Channels: 4
Voltage - Breakdown (Min): 12.5V
Voltage - Clamping (Max) @ Ipp: 24V
Power - Peak Pulse: 200W
Power Line Protection: No
Part Status: Obsolete
Description: TVS DIODE 12VWM 24VC SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 73pF @ 1MHz
Current - Peak Pulse (10/1000µs): 10A (8/20µs)
Voltage - Reverse Standoff (Typ): 12V (Max)
Supplier Device Package: SC-74
Unidirectional Channels: 4
Voltage - Breakdown (Min): 12.5V
Voltage - Clamping (Max) @ Ipp: 24V
Power - Peak Pulse: 200W
Power Line Protection: No
Part Status: Obsolete
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| PESD15VS4UD,115 |
|
Виробник: NXP USA Inc.
Description: TVS DIODE 15VWM 33VC 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 60pF @ 1MHz
Current - Peak Pulse (10/1000µs): 6A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V (Max)
Supplier Device Package: SC-74
Unidirectional Channels: 4
Voltage - Breakdown (Min): 15.5V
Voltage - Clamping (Max) @ Ipp: 33V
Power - Peak Pulse: 200W
Power Line Protection: No
Part Status: Obsolete
Description: TVS DIODE 15VWM 33VC 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 60pF @ 1MHz
Current - Peak Pulse (10/1000µs): 6A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V (Max)
Supplier Device Package: SC-74
Unidirectional Channels: 4
Voltage - Breakdown (Min): 15.5V
Voltage - Clamping (Max) @ Ipp: 33V
Power - Peak Pulse: 200W
Power Line Protection: No
Part Status: Obsolete
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| PESD15VS4UD,115 |
|
Виробник: NXP USA Inc.
Description: TVS DIODE 15VWM 33VC 6TSOP
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 60pF @ 1MHz
Current - Peak Pulse (10/1000µs): 6A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V (Max)
Supplier Device Package: SC-74
Unidirectional Channels: 4
Voltage - Breakdown (Min): 15.5V
Voltage - Clamping (Max) @ Ipp: 33V
Power - Peak Pulse: 200W
Power Line Protection: No
Part Status: Obsolete
Description: TVS DIODE 15VWM 33VC 6TSOP
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 60pF @ 1MHz
Current - Peak Pulse (10/1000µs): 6A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V (Max)
Supplier Device Package: SC-74
Unidirectional Channels: 4
Voltage - Breakdown (Min): 15.5V
Voltage - Clamping (Max) @ Ipp: 33V
Power - Peak Pulse: 200W
Power Line Protection: No
Part Status: Obsolete
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| JN5139-001-M/04R1T |
|
Виробник: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 19dBm
Protocol: Zigbee®
Current - Receiving: 45mA
Current - Transmitting: 125mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 19dBm
Protocol: Zigbee®
Current - Receiving: 45mA
Current - Transmitting: 125mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| SA58670BS,115 |
|
Виробник: NXP USA Inc.
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Packaging: Tape & Reel (TR)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Packaging: Tape & Reel (TR)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
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| LH75401N0Q100C0,55 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 84MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 76
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 84MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 76
DigiKey Programmable: Not Verified
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| LH75411N0Q100C0,55 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 84MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 76
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 84MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 76
DigiKey Programmable: Not Verified
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| LH79520N0Q000B1,55 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 176LQFP
Description: IC MCU 32BIT ROMLESS 176LQFP
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| LH79524N0F100A1,55 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208LFBGA
Packaging: Tray
Package / Case: 208-LFBGA
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LFBGA (14x14)
Number of I/O: 108
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 208LFBGA
Packaging: Tray
Package / Case: 208-LFBGA
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LFBGA (14x14)
Number of I/O: 108
DigiKey Programmable: Not Verified
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| LH7A400N0F000B5,55 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LFBGA
Packaging: Tray
Package / Case: 256-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 256-LFBGA (14x14)
Part Status: Obsolete
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256LFBGA
Packaging: Tray
Package / Case: 256-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 256-LFBGA (14x14)
Part Status: Obsolete
Number of I/O: 60
DigiKey Programmable: Not Verified
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| LH7A400N0G000B5,55 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256BGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 256-BGA (17x17)
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256BGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 256-BGA (17x17)
Number of I/O: 60
DigiKey Programmable: Not Verified
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| LH7A404N0F000B3,55 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
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| LH7A404N0F092B3,55 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
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| JN5139/001,515 |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
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| JN5139/Z01,515 |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
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| JN5139-001-M/00R1T |
|
Виробник: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Current - Transmitting: 37mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Current - Transmitting: 37mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
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| JN5139-001-M/01R1V |
|
Виробник: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4SMA SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Current - Transmitting: 37mA
Antenna Type: Antenna Not Included, SMA
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE 802.15.4SMA SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Current - Transmitting: 37mA
Antenna Type: Antenna Not Included, SMA
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| JN5139-001-M/02R1V |
|
Виробник: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4 SMA SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 19dBm
Protocol: Zigbee®
Current - Receiving: 45mA
Current - Transmitting: 125mA
Antenna Type: Antenna Not Included, SMA
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE 802.15.4 SMA SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 19dBm
Protocol: Zigbee®
Current - Receiving: 45mA
Current - Transmitting: 125mA
Antenna Type: Antenna Not Included, SMA
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| JN5139-001-M/03R1T |
|
Виробник: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Current - Transmitting: 37mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Current - Transmitting: 37mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| JN5139-Z01-M/03R1T |
|
Виробник: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Current - Transmitting: 37mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Current - Transmitting: 37mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| JN5139-Z01-M/04R1T |
|
Виробник: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 19dBm
Protocol: Zigbee®
Current - Receiving: 45mA
Current - Transmitting: 125mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 19dBm
Protocol: Zigbee®
Current - Receiving: 45mA
Current - Transmitting: 125mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| JN5139/Z01,515 |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
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| JN5139-001-M/00R1T |
|
Виробник: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Cut Tape (CT)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Current - Transmitting: 37mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Cut Tape (CT)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Current - Transmitting: 37mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
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| P89LPC932A1FA,112 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Number of I/O: 26
DigiKey Programmable: Verified
Description: IC MCU 8BIT 8KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Number of I/O: 26
DigiKey Programmable: Verified
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| DEMO56F8013-EE |
|
Виробник: NXP USA Inc.
Description: MC56F8013 EVAL BRD
Description: MC56F8013 EVAL BRD
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В кошику
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| DEMO9S12XEP100 |
|
Виробник: NXP USA Inc.
Description: MC9S12XEP100 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS12X
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12XEP100
Part Status: Obsolete
Description: MC9S12XEP100 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS12X
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12XEP100
Part Status: Obsolete
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| EVB9S08DZ60 |
|
Виробник: NXP USA Inc.
Description: MC9S08DZ60 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU 8-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: HCS08
Utilized IC / Part: MC9S08DZ60
Description: MC9S08DZ60 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU 8-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: HCS08
Utilized IC / Part: MC9S08DZ60
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| EVB9S12XEP100 |
Виробник: NXP USA Inc.
Description: MC9S12XEP100 EVAL BRD
Description: MC9S12XEP100 EVAL BRD
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| KMPC8321ECZQADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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| KMPC8321ECZQAFDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516BGA
Description: IC MPU MPC83XX 333MHZ 516BGA
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| KMPC8321EZQADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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| KMPC8321EZQAFDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516BGA
Description: IC MPU MPC83XX 333MHZ 516BGA
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| KMPC8321ZQADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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| KMPC8323ECZQADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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| KMPC8323EZQADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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| KMPC8347VRAGDB |
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620BGA
Description: IC MPU MPC83XX 266MHZ 620BGA
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| M5208EVBE |
Виробник: NXP USA Inc.
Description: MCF5207/MCF5208 EVAL BRD
Description: MCF5207/MCF5208 EVAL BRD
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| M52233DEMO |
Виробник: NXP USA Inc.
Description: MCF52223 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: Coldfire V2
Utilized IC / Part: MCF52223
Description: MCF52223 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: Coldfire V2
Utilized IC / Part: MCF52223
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| M52235EVB |
Виробник: NXP USA Inc.
Description: MCF52235 EVAL BRD
Description: MCF52235 EVAL BRD
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| M5235BCCE |
|
Виробник: NXP USA Inc.
Description: MCF5235 EVAL BRD
Description: MCF5235 EVAL BRD
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| M5235BCCKITE |
|
Виробник: NXP USA Inc.
Description: MCF5235 EVAL BRD
Description: MCF5235 EVAL BRD
товару немає в наявності
В кошику
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| M5282LITEKITE |
Виробник: NXP USA Inc.
Description: MCF5280/MCF5281/MCF5282 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Board Type: Evaluation Platform
Utilized IC / Part: MCF5280, MCF5281, MCF5282
Part Status: Obsolete
Description: MCF5280/MCF5281/MCF5282 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Board Type: Evaluation Platform
Utilized IC / Part: MCF5280, MCF5281, MCF5282
Part Status: Obsolete
товару немає в наявності
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| M5329AFE |
Виробник: NXP USA Inc.
Description: ZOOM MCF5329 EVAL BRD
Description: ZOOM MCF5329 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| M5329EVBE |
Виробник: NXP USA Inc.
Description: ZOOM MCF5329 EVAL BRD
Description: ZOOM MCF5329 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| MC56F8367EVME |
|
Виробник: NXP USA Inc.
Description: MC56F83X5/F83X6/F83X7 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s), Power Supply
Core Processor: 56800E
Utilized IC / Part: MC56F83x5, MC56F83x6, MC56F83x7
Description: MC56F83X5/F83X6/F83X7 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s), Power Supply
Core Processor: 56800E
Utilized IC / Part: MC56F83x5, MC56F83x6, MC56F83x7
товару немає в наявності
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од. на суму грн.
| MC9S08AW16CFGER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1500+ | 398.53 грн |
| MC9S08AW60CPUER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
товару немає в наявності
В кошику
од. на суму грн.