Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36849) > Сторінка 114 з 615
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||
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EVB9S12XEP100 | NXP USA Inc. | Description: MC9S12XEP100 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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KMPC8321ECZQADDC | NXP USA Inc. |
 Description: IC MPU MPC83XX 266MHZ PBGA516Packaging: Box Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||
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KMPC8321ECZQAFDC | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516BGA |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||
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KMPC8321EZQADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Box Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||
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KMPC8321EZQAFDC | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516BGA |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||
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KMPC8321ZQADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Box Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||
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KMPC8323ECZQADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Box Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||
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KMPC8323EZQADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Box Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||
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KMPC8347VRAGDB | NXP USA Inc. | Description: IC MPU MPC83XX 266MHZ 620BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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M5208EVBE | NXP USA Inc. | Description: MCF5207/MCF5208 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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M52233DEMO | NXP USA Inc. |
Description: MCF52223 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Power Supply Core Processor: Coldfire V2 Utilized IC / Part: MCF52223 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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M52235EVB | NXP USA Inc. | Description: MCF52235 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| M5235BCCE | NXP USA Inc. |
Description: MCF5235 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| M5235BCCKITE | NXP USA Inc. |
Description: MCF5235 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| M5282LITEKITE | NXP USA Inc. |
Description: MCF5280/MCF5281/MCF5282 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: Coldfire V2 Board Type: Evaluation Platform Utilized IC / Part: MCF5280, MCF5281, MCF5282 Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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M5329AFE | NXP USA Inc. | Description: ZOOM MCF5329 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| M5329EVBE | NXP USA Inc. | Description: ZOOM MCF5329 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MC56F8367EVME | NXP USA Inc. |
Description: MC56F83X5/F83X6/F83X7 EVAL BRD Packaging: Box Mounting Type: Fixed Type: DSP Contents: Board(s), Cable(s), Power Supply Core Processor: 56800E Utilized IC / Part: MC56F83x5, MC56F83x6, MC56F83x7 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC9S08AW16CFGER | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44LQFP Packaging: Tape & Reel (TR) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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MC9S08AW60CPUER | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Verified |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | ||||||||||||
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MC9S08DN16CLC | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP DigiKey Programmable: Not Verified Number of I/O: 25 Part Status: Obsolete Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 10x12b Core Processor: S08 EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||
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MC9S08DN16CLF | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 48LQFP Number of I/O: 39 Part Status: Obsolete Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I²C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x12b Core Processor: S08 EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC9S08DN16MLC | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP Number of I/O: 25 Part Status: Obsolete Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I²C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 10x12b Core Processor: S08 EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC9S08QD2CSCR | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 2KB (2K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Part Status: Active Number of I/O: 4 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||||
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MCF52211CVM80 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA |
товару немає в наявності |
Мінімальне замовлення: 240 шт В кошику од. на суму грн. | ||||||||||||
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MCZ34653EF | NXP USA Inc. |
Description: IC HOTSWAP CTRLR 1A NEG 8-SOIC |
товару немає в наявності |
Мінімальне замовлення: 98 шт В кошику од. на суму грн. | ||||||||||||
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MCZ34653EFR2 | NXP USA Inc. |
Description: IC HOTSWAP CTRLR 1A NEG 8-SOIC |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||||
| MPC5553EVBE | NXP USA Inc. |
Description: MPC5553 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5553 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MPC5554EVBE | NXP USA Inc. |
Description: MPC5554 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5554 Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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| MPC555CMEE | NXP USA Inc. |
Description: MPC555 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Power Supply Board Type: Evaluation Platform Utilized IC / Part: MPC555 Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MPXV7002GC6T1 | NXP USA Inc. |
Description: SENSOR 0.29PSIC 0.13" 4.5V AXIAL Features: Temperature Compensated Packaging: Tape & Reel (TR) Package / Case: 8-SMD, Gull Wing, Top Port Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.5 V ~ 4.5 V Operating Pressure: ±0.29PSI (±2kPa) Pressure Type: Compound Accuracy: ±5% Operating Temperature: 10°C ~ 60°C Termination Style: Gull Wing Voltage - Supply: 4.75V ~ 5.25V Port Size: Male - 0.13" (3.17mm) Tube Applications: Board Mount Port Style: Barbless Maximum Pressure: ±10.88PSI (±75kPa) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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DEMO9S08DZ60 | NXP USA Inc. |
Description: MC9S08DZ60 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s), Cable(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08DZ60 Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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M5213EVBE | NXP USA Inc. |
Description: MCF5213 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: Coldfire V2 Utilized IC / Part: MCF5213 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC9S08DN60CLC | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 32LQFP Number of I/O: 25 Part Status: Obsolete Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I²C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 10x12b Core Processor: S08 EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Program Memory Size: 60KB (60K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC9S08DN60MLC | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 32LQFP Number of I/O: 25 Part Status: Obsolete Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I²C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 10x12b Core Processor: S08 EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Program Memory Size: 60KB (60K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC9S08DN60MLH | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 53 Part Status: Obsolete Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x12b Core Processor: S08 EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Program Memory Size: 60KB (60K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC9S08DV60MLC | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 3K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 25 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC9S08DZ32CLC | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 25 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||
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MC9S08DZ32MLC | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 25 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||
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MC9S08DZ32MLF | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 250 шт В кошику од. на суму грн. | ||||||||||||
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MC9S08DZ32MLH | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 24x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||
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MC9S08DZ60CLF | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 250 шт В кошику од. на суму грн. | ||||||||||||
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MC9S08DZ60CLH | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S08 Data Converters: A/D 24x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||
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MC9S08DZ60MLF | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 250 шт В кошику од. на суму грн. | ||||||||||||
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MC9S08GT16ACFBER | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44QFP Packaging: Tape & Reel (TR) Package / Case: 44-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-QFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
на замовлення 2250 шт: термін постачання 21-31 дні (днів) |
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MC9S08GT8ACFBER | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 44QFP Packaging: Tape & Reel (TR) Package / Case: 44-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-QFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 750 шт В кошику од. на суму грн. | ||||||||||||
 |
MC9S08QG8CFFER | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16QFN Packaging: Tape & Reel (TR) Package / Case: 16-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-QFN-EP (5x5) Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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MPC8313E-RDB | NXP USA Inc. |
Description: MPC8313E EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: e300 Utilized IC / Part: MPC8313E |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC9S08GT16ACFBER | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44QFP Packaging: Cut Tape (CT) Package / Case: 44-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-QFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
на замовлення 2302 шт: термін постачання 21-31 дні (днів) |
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MC9S08GT8ACFBER | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 44QFP DigiKey Programmable: Not Verified Number of I/O: 36 Part Status: Active Supplier Device Package: 44-QFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 44-QFP Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC9S08QG8CFFER | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16QFN Packaging: Cut Tape (CT) Package / Case: 16-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-QFN-EP (5x5) Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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BAP51-04W,115 | NXP USA Inc. |
Description: RF DIODE PIN 50V 240MW SC-70 Power Dissipation (Max): 240 mW Current - Max: 50 mA Supplier Device Package: SC-70 Voltage - Peak Reverse (Max): 50V Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz Operating Temperature: -65°C ~ 150°C (TJ) Diode Type: PIN - 1 Pair Series Connection Package / Case: SC-70, SOT-323 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
BAP65-05,215 | NXP USA Inc. |
Description: RF DIODE PIN 30V 250MW SOT-23 Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Diode Type: PIN - 1 Pair Common Cathode Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz Resistance @ If, F: 350mOhm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 30V Supplier Device Package: SOT-23 (TO-236AB) Part Status: Obsolete Current - Max: 100 mA Power Dissipation (Max): 250 mW |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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BAP70-04W,115 | NXP USA Inc. |
Description: RF DIODE PIN 50V 260MW SC-70 Power Dissipation (Max): 260 mW Current - Max: 100 mA Part Status: Obsolete Supplier Device Package: SC-70 Voltage - Peak Reverse (Max): 50V Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz Operating Temperature: -65°C ~ 150°C (TJ) Diode Type: PIN - 1 Pair Series Connection Package / Case: SC-70, SOT-323 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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BAP70AM,135 | NXP USA Inc. |
Description: RF DIODE PIN 50V 300MW 6TSSOP Power Dissipation (Max): 300 mW Current - Max: 100 mA Supplier Device Package: 6-TSSOP Voltage - Peak Reverse (Max): 50V Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz Operating Temperature: -65°C ~ 150°C (TJ) Diode Type: PIN - 2 Pair Series Package / Case: 6-TSSOP, SC-88, SOT-363 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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BB178LX,315 | NXP USA Inc. |
Description: DIODE UHF VAR CAP 32V SOD882T Mounting Type: Surface Mount Package / Case: SOD-882 Packaging: Tape & Reel (TR) Capacitance Ratio: 15.0 Voltage - Peak Reverse (Max): 32 V Supplier Device Package: SOD2 Capacitance Ratio Condition: C1/C28 Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz Operating Temperature: -55°C ~ 125°C (TJ) Diode Type: Single |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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BB179LX,315 | NXP USA Inc. |
Description: DIODE VARACTOR 30V SINGLE SOD2 Packaging: Tape & Reel (TR) Package / Case: SOD-882 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz Capacitance Ratio Condition: C1/C28 Supplier Device Package: SOD2 Voltage - Peak Reverse (Max): 30 V Capacitance Ratio: 10.9 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
BFG25A/X,215 | NXP USA Inc. |
Description: RF TRANS NPN 5V 5GHZ SOT-143B Supplier Device Package: SOT-143B Noise Figure (dB Typ @ f): 1.8dB ~ 2dB @ 1GHz Frequency - Transition: 5GHz DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500µA, 1V Voltage - Collector Emitter Breakdown (Max): 5V Current - Collector (Ic) (Max): 6.5mA Power - Max: 32mW Operating Temperature: 175°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: TO-253-4, TO-253AA Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 3000 шт В кошику од. на суму грн. | ||||||||||||
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BFG520/XR,215 | NXP USA Inc. |
Description: RF TRANS NPN 15V 9GHZ SOT-143R Supplier Device Package: SOT-143R Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz Frequency - Transition: 9GHz DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V Voltage - Collector Emitter Breakdown (Max): 15V Current - Collector (Ic) (Max): 70mA Power - Max: 300mW Operating Temperature: 175°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: SOT-143R Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
BFQ591,115 | NXP USA Inc. |
Description: RF TRANS NPN 15V 7GHZ SOT89-3 Supplier Device Package: SOT-89-3 Frequency - Transition: 7GHz DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 70mA, 8V Voltage - Collector Emitter Breakdown (Max): 15V Current - Collector (Ic) (Max): 200mA Power - Max: 2.25W Operating Temperature: 175°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: TO-243AA Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. |
| EVB9S12XEP100 |
Виробник: NXP USA Inc.
Description: MC9S12XEP100 EVAL BRD
Description: MC9S12XEP100 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| KMPC8321ECZQADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| KMPC8321ECZQAFDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516BGA
Description: IC MPU MPC83XX 333MHZ 516BGA
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| KMPC8321EZQADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| KMPC8321EZQAFDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516BGA
Description: IC MPU MPC83XX 333MHZ 516BGA
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| KMPC8321ZQADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| KMPC8323ECZQADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| KMPC8323EZQADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Box
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| KMPC8347VRAGDB |
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620BGA
Description: IC MPU MPC83XX 266MHZ 620BGA
товару немає в наявності
В кошику
од. на суму грн.
| M5208EVBE |
Виробник: NXP USA Inc.
Description: MCF5207/MCF5208 EVAL BRD
Description: MCF5207/MCF5208 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| M52233DEMO |
Виробник: NXP USA Inc.
Description: MCF52223 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: Coldfire V2
Utilized IC / Part: MCF52223
Description: MCF52223 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: Coldfire V2
Utilized IC / Part: MCF52223
товару немає в наявності
В кошику
од. на суму грн.
| M52235EVB |
Виробник: NXP USA Inc.
Description: MCF52235 EVAL BRD
Description: MCF52235 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| M5235BCCE |
|
Виробник: NXP USA Inc.
Description: MCF5235 EVAL BRD
Description: MCF5235 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| M5235BCCKITE |
|
Виробник: NXP USA Inc.
Description: MCF5235 EVAL BRD
Description: MCF5235 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| M5282LITEKITE |
Виробник: NXP USA Inc.
Description: MCF5280/MCF5281/MCF5282 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Board Type: Evaluation Platform
Utilized IC / Part: MCF5280, MCF5281, MCF5282
Part Status: Obsolete
Description: MCF5280/MCF5281/MCF5282 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Board Type: Evaluation Platform
Utilized IC / Part: MCF5280, MCF5281, MCF5282
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| M5329AFE |
Виробник: NXP USA Inc.
Description: ZOOM MCF5329 EVAL BRD
Description: ZOOM MCF5329 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| M5329EVBE |
Виробник: NXP USA Inc.
Description: ZOOM MCF5329 EVAL BRD
Description: ZOOM MCF5329 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| MC56F8367EVME |
|
Виробник: NXP USA Inc.
Description: MC56F83X5/F83X6/F83X7 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s), Power Supply
Core Processor: 56800E
Utilized IC / Part: MC56F83x5, MC56F83x6, MC56F83x7
Description: MC56F83X5/F83X6/F83X7 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s), Power Supply
Core Processor: 56800E
Utilized IC / Part: MC56F83x5, MC56F83x6, MC56F83x7
товару немає в наявності
В кошику
од. на суму грн.
| MC9S08AW16CFGER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1500+ | 471.49 грн |
| MC9S08AW60CPUER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
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| MC9S08DN16CLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC MCU 8BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| MC9S08DN16CLF |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Number of I/O: 39
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Number of I/O: 39
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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| MC9S08DN16MLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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В кошику
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| MC9S08QD2CSCR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 2500 шт
В кошику
од. на суму грн.
| MCF52211CVM80 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
товару немає в наявності
Мінімальне замовлення: 240 шт
В кошику
од. на суму грн.
| MCZ34653EF |
|
Виробник: NXP USA Inc.
Description: IC HOTSWAP CTRLR 1A NEG 8-SOIC
Description: IC HOTSWAP CTRLR 1A NEG 8-SOIC
товару немає в наявності
Мінімальне замовлення: 98 шт
В кошику
од. на суму грн.
| MCZ34653EFR2 |
|
Виробник: NXP USA Inc.
Description: IC HOTSWAP CTRLR 1A NEG 8-SOIC
Description: IC HOTSWAP CTRLR 1A NEG 8-SOIC
товару немає в наявності
Мінімальне замовлення: 2500 шт
В кошику
од. на суму грн.
| MPC5553EVBE |
|
Виробник: NXP USA Inc.
Description: MPC5553 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5553
Description: MPC5553 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5553
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од. на суму грн.
| MPC5554EVBE |
|
Виробник: NXP USA Inc.
Description: MPC5554 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5554
Part Status: Active
Description: MPC5554 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5554
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 102388.33 грн |
| MPC555CMEE |
Виробник: NXP USA Inc.
Description: MPC555 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Board Type: Evaluation Platform
Utilized IC / Part: MPC555
Part Status: Active
Description: MPC555 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Board Type: Evaluation Platform
Utilized IC / Part: MPC555
Part Status: Active
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| MPXV7002GC6T1 |
|
Виробник: NXP USA Inc.
Description: SENSOR 0.29PSIC 0.13" 4.5V AXIAL
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Compound
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: ±10.88PSI (±75kPa)
Description: SENSOR 0.29PSIC 0.13" 4.5V AXIAL
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Compound
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: ±10.88PSI (±75kPa)
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од. на суму грн.
| DEMO9S08DZ60 |
|
Виробник: NXP USA Inc.
Description: MC9S08DZ60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08DZ60
Part Status: Active
Description: MC9S08DZ60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08DZ60
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 22143.86 грн |
| M5213EVBE |
Виробник: NXP USA Inc.
Description: MCF5213 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5213
Description: MCF5213 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5213
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| MC9S08DN60CLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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| MC9S08DN60MLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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| MC9S08DN60MLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 8BIT 60KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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| MC9S08DV60MLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
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| MC9S08DZ32CLC |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
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| MC9S08DZ32MLC |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 1250 шт
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| MC9S08DZ32MLF |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 250 шт
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| MC9S08DZ32MLH |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 160 шт
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| MC9S08DZ60CLF |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 250 шт
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| MC9S08DZ60CLH |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 160 шт
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| MC9S08DZ60MLF |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 250 шт
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| MC9S08GT16ACFBER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 2250 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 750+ | 356.74 грн |
| 1500+ | 336.15 грн |
| MC9S08GT8ACFBER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 750 шт
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| MC9S08QG8CFFER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2500+ | 214.16 грн |
| MPC8313E-RDB |
|
Виробник: NXP USA Inc.
Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
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| MC9S08GT16ACFBER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 2302 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 591.00 грн |
| 10+ | 442.11 грн |
| 25+ | 410.28 грн |
| 100+ | 352.20 грн |
| 250+ | 336.55 грн |
| MC9S08GT8ACFBER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Cut Tape (CT)
Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Cut Tape (CT)
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| MC9S08QG8CFFER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 379.76 грн |
| 10+ | 279.53 грн |
| 25+ | 257.87 грн |
| 100+ | 219.64 грн |
| 250+ | 208.99 грн |
| 500+ | 208.25 грн |
| BAP51-04W,115 |
|
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 240MW SC-70
Power Dissipation (Max): 240 mW
Current - Max: 50 mA
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
Description: RF DIODE PIN 50V 240MW SC-70
Power Dissipation (Max): 240 mW
Current - Max: 50 mA
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
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| BAP65-05,215 |
|
Виробник: NXP USA Inc.
Description: RF DIODE PIN 30V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
Description: RF DIODE PIN 30V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
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| BAP70-04W,115 |
|
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SC-70
Power Dissipation (Max): 260 mW
Current - Max: 100 mA
Part Status: Obsolete
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
Description: RF DIODE PIN 50V 260MW SC-70
Power Dissipation (Max): 260 mW
Current - Max: 100 mA
Part Status: Obsolete
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
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| BAP70AM,135 |
|
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
Power Dissipation (Max): 300 mW
Current - Max: 100 mA
Supplier Device Package: 6-TSSOP
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 2 Pair Series
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
Description: RF DIODE PIN 50V 300MW 6TSSOP
Power Dissipation (Max): 300 mW
Current - Max: 100 mA
Supplier Device Package: 6-TSSOP
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 2 Pair Series
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
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| BB178LX,315 |
|
Виробник: NXP USA Inc.
Description: DIODE UHF VAR CAP 32V SOD882T
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Tape & Reel (TR)
Capacitance Ratio: 15.0
Voltage - Peak Reverse (Max): 32 V
Supplier Device Package: SOD2
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Description: DIODE UHF VAR CAP 32V SOD882T
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Tape & Reel (TR)
Capacitance Ratio: 15.0
Voltage - Peak Reverse (Max): 32 V
Supplier Device Package: SOD2
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
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| BB179LX,315 |
|
Виробник: NXP USA Inc.
Description: DIODE VARACTOR 30V SINGLE SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
Description: DIODE VARACTOR 30V SINGLE SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
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| BFG25A/X,215 |
|
Виробник: NXP USA Inc.
Description: RF TRANS NPN 5V 5GHZ SOT-143B
Supplier Device Package: SOT-143B
Noise Figure (dB Typ @ f): 1.8dB ~ 2dB @ 1GHz
Frequency - Transition: 5GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500µA, 1V
Voltage - Collector Emitter Breakdown (Max): 5V
Current - Collector (Ic) (Max): 6.5mA
Power - Max: 32mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-253-4, TO-253AA
Packaging: Tape & Reel (TR)
Description: RF TRANS NPN 5V 5GHZ SOT-143B
Supplier Device Package: SOT-143B
Noise Figure (dB Typ @ f): 1.8dB ~ 2dB @ 1GHz
Frequency - Transition: 5GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500µA, 1V
Voltage - Collector Emitter Breakdown (Max): 5V
Current - Collector (Ic) (Max): 6.5mA
Power - Max: 32mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-253-4, TO-253AA
Packaging: Tape & Reel (TR)
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Мінімальне замовлення: 3000 шт
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| BFG520/XR,215 |
|
Виробник: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SOT-143R
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Frequency - Transition: 9GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Voltage - Collector Emitter Breakdown (Max): 15V
Current - Collector (Ic) (Max): 70mA
Power - Max: 300mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
Description: RF TRANS NPN 15V 9GHZ SOT-143R
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Frequency - Transition: 9GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Voltage - Collector Emitter Breakdown (Max): 15V
Current - Collector (Ic) (Max): 70mA
Power - Max: 300mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
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| BFQ591,115 |
|
Виробник: NXP USA Inc.
Description: RF TRANS NPN 15V 7GHZ SOT89-3
Supplier Device Package: SOT-89-3
Frequency - Transition: 7GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 70mA, 8V
Voltage - Collector Emitter Breakdown (Max): 15V
Current - Collector (Ic) (Max): 200mA
Power - Max: 2.25W
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
Description: RF TRANS NPN 15V 7GHZ SOT89-3
Supplier Device Package: SOT-89-3
Frequency - Transition: 7GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 70mA, 8V
Voltage - Collector Emitter Breakdown (Max): 15V
Current - Collector (Ic) (Max): 200mA
Power - Max: 2.25W
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
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