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MC9S08QG8CFFER MC9S08QG8CFFER NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
2500+167.46 грн
Мінімальне замовлення: 2500
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MPC8313E-RDB MPC8313E-RDB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
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MC9S08GT16ACFBER MC9S08GT16ACFBER NXP USA Inc. MC9S08GT16A.pdf Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 575 шт:
термін постачання 21-31 дні (днів)
1+647.60 грн
10+484.23 грн
25+449.37 грн
100+385.73 грн
250+368.59 грн
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MC9S08GT60ACFDER MC9S08GT60ACFDER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
на замовлення 3755 шт:
термін постачання 21-31 дні (днів)
1+1190.02 грн
10+823.70 грн
25+740.87 грн
100+608.51 грн
250+566.52 грн
500+540.96 грн
1000+528.90 грн
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MC9S08GT8ACFBER MC9S08GT8ACFBER NXP USA Inc. MC9S08GT16A.pdf Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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MC9S08QG8CFFER MC9S08QG8CFFER NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 10001 шт:
термін постачання 21-31 дні (днів)
2+306.92 грн
10+223.75 грн
25+205.76 грн
100+174.54 грн
250+165.69 грн
500+160.36 грн
1000+153.41 грн
Мінімальне замовлення: 2
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BAP51-04W,115 BAP51-04W,115 NXP USA Inc. BAP51-04W_N.pdf Description: RF DIODE PIN 50V 240MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Current - Max: 50 mA
Power Dissipation (Max): 240 mW
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BAP65-05,215 BAP65-05,215 NXP USA Inc. BAP65-05.pdf Description: RF DIODE PIN 30V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
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BAP70-04W,115 BAP70-04W,115 NXP USA Inc. BAP70-04W.pdf Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
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BAP70AM,135 BAP70AM,135 NXP USA Inc. BAP70AM.pdf Description: RF DIODE PIN 50V 300MW 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Diode Type: PIN - 2 Pair Series
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: 6-TSSOP
Current - Max: 100 mA
Power Dissipation (Max): 300 mW
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BB178LX,315 BB178LX,315 NXP USA Inc. BB178LX_Rev2.pdf Description: DIODE UHF VAR CAP 32V SOD882T
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15.0
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BB179LX,315 BB179LX,315 NXP USA Inc. BB179LX_Rev1.pdf Description: DIODE UHF VAR CAP 30V SOD882T
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
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BFG25A/X,215 BFG25A/X,215 NXP USA Inc. BFG25A_X_Rev4.pdf Description: RF TRANS NPN 5V 5GHZ SOT-143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 32mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500µA, 1V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 1.8dB ~ 2dB @ 1GHz
Supplier Device Package: SOT-143B
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BFG520/XR,215 BFG520/XR,215 NXP USA Inc. BFG520%28X%2CXR%29_Rev4.pdf Description: RF TRANS NPN 15V 9GHZ SOT-143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Supplier Device Package: SOT-143R
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BFQ591,115 BFQ591,115 NXP USA Inc. BFQ591_Rev4.pdf Description: RF TRANS NPN 15V 7GHZ SOT89-3
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 2.25W
Current - Collector (Ic) (Max): 200mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 70mA, 8V
Frequency - Transition: 7GHz
Supplier Device Package: SOT-89-3
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BFR93AR,215 BFR93AR,215 NXP USA Inc. BFR93AR_Rev1.pdf Description: RF TRANS NPN 12V 6GHZ SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.9dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
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BFU725F,115 BFU725F,115 NXP USA Inc. Description: RF TRANS NPN 2.8V 70GHZ 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 10dB ~ 24dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 10mA, 2V
Frequency - Transition: 70GHz
Noise Figure (dB Typ @ f): 0.42dB ~ 1.1dB @ 1.5GHz ~ 12GHz
Supplier Device Package: 4-DFP
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BGW200EG/01,518 NXP USA Inc. BGW200EG.pdf Description: IC RF TXRX+MCU WIFI 68LFLGA
Packaging: Tape & Reel (TR)
Package / Case: 68-LFLGA Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kb ROM, 1280kb SRAM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.7V ~ 3V
Power - Output: 17.6dBm
Protocol: 802.11b
Current - Receiving: 93.7mA ~ 111.5mA
Data Rate (Max): 11Mbps
Current - Transmitting: 16mA ~ 94.2mA
Supplier Device Package: 68-HLLGAR (10x15)
GPIO: 11
Modulation: CCK, DSSS, QPSK
RF Family/Standard: WiFi
Serial Interfaces: JTAG, SDIO, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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BLF6G10LS-200,112 NXP USA Inc. BLF6G10LS-200.pdf Description: FET RF 65V 871.5MHZ SOT502B
Packaging: Tray
Package / Case: SOT-502B
Current Rating (Amps): 49A
Mounting Type: Chassis Mount
Frequency: 871.5MHz
Power - Output: 40W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
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BLF6G10LS-200,118 NXP USA Inc. BLF6G10LS-200.pdf Description: FET RF 65V 871.5MHZ SOT502B
Packaging: Tape & Reel (TR)
Package / Case: SOT-502B
Current Rating (Amps): 49A
Mounting Type: Chassis Mount
Frequency: 871.5MHz
Power - Output: 40W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
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BLT50,115 BLT50,115 NXP USA Inc. Description: RF TRANS NPN 10V 470MHZ SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 2W
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 300mA, 5V
Frequency - Transition: 470MHz
Supplier Device Package: SC-73
Part Status: Obsolete
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CBT3857PW,118 CBT3857PW,118 NXP USA Inc. CBT3857.pdf Description: IC BUS SWITCH 10 X 1:1 24-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-TSSOP
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CBT6820DGG,512 CBT6820DGG,512 NXP USA Inc. CBT6820_2.pdf Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Packaging: Tube
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
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CBT6820DGG,518 CBT6820DGG,518 NXP USA Inc. CBT6820_2.pdf Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
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CBTU4411EE,557 CBTU4411EE,557 NXP USA Inc. CBTU4411.pdf Description: IC BUS SWITCH 11 X 4:1 72LFBGA
Packaging: Tray
Package / Case: 72-LFBGA
Mounting Type: Surface Mount
Circuit: 11 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 72-LFBGA (7x7)
Part Status: Obsolete
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CBTU4411EE,551 CBTU4411EE,551 NXP USA Inc. CBTU4411.pdf Description: IC BUS SWITCH 11 X 4:1 72LFBGA
Packaging: Tray
Package / Case: 72-LFBGA
Mounting Type: Surface Mount
Circuit: 11 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 72-LFBGA (7x7)
Part Status: Obsolete
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CGD1042H,112 CGD1042H,112 NXP USA Inc. CGD1042H_1.pdf Description: IC AMP CATV SOT115J
Packaging: Tray
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Part Status: Obsolete
Number of Circuits: 1
Current - Supply: 450 mA
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CGD1044H,112 CGD1044H,112 NXP USA Inc. 75016714.pdf Description: IC AMP CATV SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 450 mA
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GTL2002D,118 GTL2002D,118 NXP USA Inc. GTL2002.pdf Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-SO
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
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GTL2003PW,118 GTL2003PW,118 NXP USA Inc. GTL2003.pdf Description: IC TRANSLATOR BIDIR 20TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 0.8 V ~ 5.5 V
Voltage - VCCB: 0.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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GTL2010PW,112 GTL2010PW,112 NXP USA Inc. GTL2010.pdf Description: IC TRANSLATOR BIDIR 24TSSOP
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GTL2012DC,125 GTL2012DC,125 NXP USA Inc. GTL2012.pdf Description: IC TRANSLTR BIDIRECTIONAL 8VSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 2
Input Signal: LVTTL
Number of Circuits: 1
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GTL2018PW,118 GTL2018PW,118 NXP USA Inc. GTL2018.pdf Description: IC TRANSLATOR BIDIR 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 8
Input Signal: LVTTL
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
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GTL2107PW,112 GTL2107PW,112 NXP USA Inc. GTL2107.pdf Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 12
Input Signal: GTL
Number of Circuits: 1
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GTL2107PW,118 GTL2107PW,118 NXP USA Inc. GTL2107.pdf Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 12
Input Signal: GTL
Part Status: Obsolete
Number of Circuits: 1
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J174,126 J174,126 NXP USA Inc. J174_175_176_177_CNV.pdf Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 85 Ohms
Voltage - Cutoff (VGS off) @ Id: 5 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
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J175,116 J175,116 NXP USA Inc. J174_175_176_177_CNV.pdf Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 125 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 7 mA @ 15 V
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J176,126 J176,126 NXP USA Inc. J174_175_176_177_CNV.pdf Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 250 Ohms
Voltage - Cutoff (VGS off) @ Id: 1 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 2 mA @ 15 V
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J177,126 J177,126 NXP USA Inc. J174_175_176_177_CNV.pdf Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 300 Ohms
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 1.5 mA @ 15 V
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LM75AD,118 LM75AD,118 NXP USA Inc. LM75A.pdf Description: SENSOR DIGITAL -55C-125C 8SO
Features: Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
на замовлення 82000 шт:
термін постачання 21-31 дні (днів)
2500+26.51 грн
5000+24.61 грн
7500+24.11 грн
12500+22.06 грн
17500+21.71 грн
25000+21.36 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
LPC2119FBD64/01,15 LPC2119FBD64/01,15 NXP USA Inc. LPC2109_2119_2129.pdf Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
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LPC2124FBD64/01,15 LPC2124FBD64/01,15 NXP USA Inc. LPC2114_2124.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
на замовлення 162 шт:
термін постачання 21-31 дні (днів)
1+1389.40 грн
10+1067.86 грн
25+1000.42 грн
160+851.23 грн
В кошику  од. на суму  грн.
LPC2129FBD64/01,15 LPC2129FBD64/01,15 NXP USA Inc. LPC2109_2119_2129.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
на замовлення 268 шт:
термін постачання 21-31 дні (днів)
1+1577.79 грн
10+1217.38 грн
25+1142.07 грн
160+973.92 грн
В кошику  од. на суму  грн.
LPC2194HBD64/01,15 LPC2194HBD64/01,15 NXP USA Inc. LPC2194.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
на замовлення 55 шт:
термін постачання 21-31 дні (днів)
1+2045.64 грн
10+1580.28 грн
В кошику  од. на суму  грн.
LPC2212FBD144/01,5 LPC2212FBD144/01,5 NXP USA Inc. LPC2212_2214.pdf Description: IC MCU 16/32B 128KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
на замовлення 35 шт:
термін постачання 21-31 дні (днів)
1+1729.29 грн
10+1335.67 грн
В кошику  од. на суму  грн.
LPC2292FBD144/01,5 LPC2292FBD144/01,5 NXP USA Inc. LPC2292_2294.pdf Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
1+2096.66 грн
10+1618.91 грн
В кошику  од. на суму  грн.
LPC2292FET144/01,5 LPC2292FET144/01,5 NXP USA Inc. LPC2292_2294.pdf Description: IC MCU 16/32BIT 256KB 144TFBGA
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-TFBGA (12x12)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
на замовлення 114 шт:
термін постачання 21-31 дні (днів)
1+2137.48 грн
10+1650.81 грн
В кошику  од. на суму  грн.
LPC2294HBD144/01,5 LPC2294HBD144/01,5 NXP USA Inc. LPC2292_2294.pdf Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Discontinued at Digi-Key
Number of I/O: 112
DigiKey Programmable: Not Verified
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MF1MOA2S50/D3F,118 NXP USA Inc. Description: IC RFID TRANSP 13.56MHZ MOA4
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OM4068H/2,518 OM4068H/2,518 NXP USA Inc. OM4068.pdf Description: IC DRVR 32 SEGMENT 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: Serial
Configuration: 32 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Supplier Device Package: 44-PQFP (10x10)
Current - Supply: 12 µA
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OM6274,598 OM6274,598 NXP USA Inc. Description: EVAL BRD FOR SC18IS602 SC18IS603
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Contents: Board(s), Accessories
Utilized IC / Part: SC18IS602, SC18IS603
Supplied Contents: Board(s), Accessories
Embedded: No
Part Status: Obsolete
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OM6276,598 NXP USA Inc. Description: EVAL BOARD FOR PCA9633
Packaging: Bulk
Function: RGB LED Controller
Type: Opto/Lighting
Contents: Board(s)
Utilized IC / Part: PCA9633
Supplied Contents: Board(s)
Part Status: Obsolete
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P87C51X2FA,512 P87C51X2FA,512 NXP USA Inc. P80C3XX2_8XC5XX2.pdf Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
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P89LPC9107FN,112 P89LPC9107FN,112 NXP USA Inc. P89LPC9102_9103_9107.pdf Description: IC MCU 8BIT 1KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-DIP
Number of I/O: 12
DigiKey Programmable: Not Verified
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P89LPC916FDH,118 P89LPC916FDH,118 NXP USA Inc. P89LPC915_916_917.pdf Description: IC MCU 8BIT 2KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Verified
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P89LPC920FN,112 P89LPC920FN,112 NXP USA Inc. P89LPC920,921,922,9221.pdf Description: IC MCU 8BIT 2KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
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P89LPC924FDH,518 P89LPC924FDH,518 NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC936FA,529 P89LPC936FA,529 NXP USA Inc. P89LPC933_934_935_936.pdf Description: IC MCU 8BIT 16KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Verified
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P89LPC936FDH,518 P89LPC936FDH,518 NXP USA Inc. P89LPC933_934_935_936.pdf Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
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PBRN113EK,115 PBRN113EK,115 NXP USA Inc. PBRN113E_SER.pdf Description: TRANS PREBIAS NPN 40V 0.6A SMT3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 1.15V @ 8mA, 800mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 300mA, 5V
Supplier Device Package: SMT3; MPAK
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 1 kOhms
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MC9S08QG8CFFER MC9S08QG8.pdf
MC9S08QG8CFFER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+167.46 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
MPC8313E-RDB MPC8313E_Hrdw_Spec.pdf
MPC8313E-RDB
Виробник: NXP USA Inc.
Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
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MC9S08GT16ACFBER MC9S08GT16A.pdf
MC9S08GT16ACFBER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 575 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+647.60 грн
10+484.23 грн
25+449.37 грн
100+385.73 грн
250+368.59 грн
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MC9S08GT60ACFDER MC9S08GB60A.pdf
MC9S08GT60ACFDER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
на замовлення 3755 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1190.02 грн
10+823.70 грн
25+740.87 грн
100+608.51 грн
250+566.52 грн
500+540.96 грн
1000+528.90 грн
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MC9S08GT8ACFBER MC9S08GT16A.pdf
MC9S08GT8ACFBER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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MC9S08QG8CFFER MC9S08QG8.pdf
MC9S08QG8CFFER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 10001 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+306.92 грн
10+223.75 грн
25+205.76 грн
100+174.54 грн
250+165.69 грн
500+160.36 грн
1000+153.41 грн
Мінімальне замовлення: 2
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BAP51-04W,115 BAP51-04W_N.pdf
BAP51-04W,115
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 240MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Current - Max: 50 mA
Power Dissipation (Max): 240 mW
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BAP65-05,215 BAP65-05.pdf
BAP65-05,215
Виробник: NXP USA Inc.
Description: RF DIODE PIN 30V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
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BAP70-04W,115 BAP70-04W.pdf
BAP70-04W,115
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
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BAP70AM,135 BAP70AM.pdf
BAP70AM,135
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Diode Type: PIN - 2 Pair Series
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: 6-TSSOP
Current - Max: 100 mA
Power Dissipation (Max): 300 mW
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BB178LX,315 BB178LX_Rev2.pdf
BB178LX,315
Виробник: NXP USA Inc.
Description: DIODE UHF VAR CAP 32V SOD882T
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15.0
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BB179LX,315 BB179LX_Rev1.pdf
BB179LX,315
Виробник: NXP USA Inc.
Description: DIODE UHF VAR CAP 30V SOD882T
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
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BFG25A/X,215 BFG25A_X_Rev4.pdf
BFG25A/X,215
Виробник: NXP USA Inc.
Description: RF TRANS NPN 5V 5GHZ SOT-143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 32mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500µA, 1V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 1.8dB ~ 2dB @ 1GHz
Supplier Device Package: SOT-143B
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BFG520/XR,215 BFG520%28X%2CXR%29_Rev4.pdf
BFG520/XR,215
Виробник: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SOT-143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Supplier Device Package: SOT-143R
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BFQ591,115 BFQ591_Rev4.pdf
BFQ591,115
Виробник: NXP USA Inc.
Description: RF TRANS NPN 15V 7GHZ SOT89-3
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 2.25W
Current - Collector (Ic) (Max): 200mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 70mA, 8V
Frequency - Transition: 7GHz
Supplier Device Package: SOT-89-3
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BFR93AR,215 BFR93AR_Rev1.pdf
BFR93AR,215
Виробник: NXP USA Inc.
Description: RF TRANS NPN 12V 6GHZ SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.9dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
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BFU725F,115
BFU725F,115
Виробник: NXP USA Inc.
Description: RF TRANS NPN 2.8V 70GHZ 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 10dB ~ 24dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 10mA, 2V
Frequency - Transition: 70GHz
Noise Figure (dB Typ @ f): 0.42dB ~ 1.1dB @ 1.5GHz ~ 12GHz
Supplier Device Package: 4-DFP
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BGW200EG/01,518 BGW200EG.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU WIFI 68LFLGA
Packaging: Tape & Reel (TR)
Package / Case: 68-LFLGA Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kb ROM, 1280kb SRAM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.7V ~ 3V
Power - Output: 17.6dBm
Protocol: 802.11b
Current - Receiving: 93.7mA ~ 111.5mA
Data Rate (Max): 11Mbps
Current - Transmitting: 16mA ~ 94.2mA
Supplier Device Package: 68-HLLGAR (10x15)
GPIO: 11
Modulation: CCK, DSSS, QPSK
RF Family/Standard: WiFi
Serial Interfaces: JTAG, SDIO, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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BLF6G10LS-200,112 BLF6G10LS-200.pdf
Виробник: NXP USA Inc.
Description: FET RF 65V 871.5MHZ SOT502B
Packaging: Tray
Package / Case: SOT-502B
Current Rating (Amps): 49A
Mounting Type: Chassis Mount
Frequency: 871.5MHz
Power - Output: 40W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
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BLF6G10LS-200,118 BLF6G10LS-200.pdf
Виробник: NXP USA Inc.
Description: FET RF 65V 871.5MHZ SOT502B
Packaging: Tape & Reel (TR)
Package / Case: SOT-502B
Current Rating (Amps): 49A
Mounting Type: Chassis Mount
Frequency: 871.5MHz
Power - Output: 40W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
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BLT50,115
BLT50,115
Виробник: NXP USA Inc.
Description: RF TRANS NPN 10V 470MHZ SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 2W
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 300mA, 5V
Frequency - Transition: 470MHz
Supplier Device Package: SC-73
Part Status: Obsolete
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CBT3857PW,118 CBT3857.pdf
CBT3857PW,118
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 24-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-TSSOP
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CBT6820DGG,512 CBT6820_2.pdf
CBT6820DGG,512
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Packaging: Tube
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
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CBT6820DGG,518 CBT6820_2.pdf
CBT6820DGG,518
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
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CBTU4411EE,557 CBTU4411.pdf
CBTU4411EE,557
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 11 X 4:1 72LFBGA
Packaging: Tray
Package / Case: 72-LFBGA
Mounting Type: Surface Mount
Circuit: 11 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 72-LFBGA (7x7)
Part Status: Obsolete
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CBTU4411EE,551 CBTU4411.pdf
CBTU4411EE,551
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 11 X 4:1 72LFBGA
Packaging: Tray
Package / Case: 72-LFBGA
Mounting Type: Surface Mount
Circuit: 11 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 72-LFBGA (7x7)
Part Status: Obsolete
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CGD1042H,112 CGD1042H_1.pdf
CGD1042H,112
Виробник: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Tray
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Part Status: Obsolete
Number of Circuits: 1
Current - Supply: 450 mA
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CGD1044H,112 75016714.pdf
CGD1044H,112
Виробник: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 450 mA
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GTL2002D,118 GTL2002.pdf
GTL2002D,118
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-SO
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
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GTL2003PW,118 GTL2003.pdf
GTL2003PW,118
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 20TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 0.8 V ~ 5.5 V
Voltage - VCCB: 0.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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GTL2010PW,112 GTL2010.pdf
GTL2010PW,112
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 24TSSOP
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GTL2012DC,125 GTL2012.pdf
GTL2012DC,125
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8VSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 2
Input Signal: LVTTL
Number of Circuits: 1
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GTL2018PW,118 GTL2018.pdf
GTL2018PW,118
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 8
Input Signal: LVTTL
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
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GTL2107PW,112 GTL2107.pdf
GTL2107PW,112
Виробник: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 12
Input Signal: GTL
Number of Circuits: 1
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GTL2107PW,118 GTL2107.pdf
GTL2107PW,118
Виробник: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 12
Input Signal: GTL
Part Status: Obsolete
Number of Circuits: 1
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J174,126 J174_175_176_177_CNV.pdf
J174,126
Виробник: NXP USA Inc.
Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 85 Ohms
Voltage - Cutoff (VGS off) @ Id: 5 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
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J175,116 J174_175_176_177_CNV.pdf
J175,116
Виробник: NXP USA Inc.
Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 125 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 7 mA @ 15 V
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J176,126 J174_175_176_177_CNV.pdf
J176,126
Виробник: NXP USA Inc.
Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 250 Ohms
Voltage - Cutoff (VGS off) @ Id: 1 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 2 mA @ 15 V
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J177,126 J174_175_176_177_CNV.pdf
J177,126
Виробник: NXP USA Inc.
Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 300 Ohms
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 1.5 mA @ 15 V
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LM75AD,118 LM75A.pdf
LM75AD,118
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8SO
Features: Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
на замовлення 82000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+26.51 грн
5000+24.61 грн
7500+24.11 грн
12500+22.06 грн
17500+21.71 грн
25000+21.36 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
LPC2119FBD64/01,15 LPC2109_2119_2129.pdf
LPC2119FBD64/01,15
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
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LPC2124FBD64/01,15 LPC2114_2124.pdf
LPC2124FBD64/01,15
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
на замовлення 162 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1389.40 грн
10+1067.86 грн
25+1000.42 грн
160+851.23 грн
В кошику  од. на суму  грн.
LPC2129FBD64/01,15 LPC2109_2119_2129.pdf
LPC2129FBD64/01,15
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
на замовлення 268 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1577.79 грн
10+1217.38 грн
25+1142.07 грн
160+973.92 грн
В кошику  од. на суму  грн.
LPC2194HBD64/01,15 LPC2194.pdf
LPC2194HBD64/01,15
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
на замовлення 55 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2045.64 грн
10+1580.28 грн
В кошику  од. на суму  грн.
LPC2212FBD144/01,5 LPC2212_2214.pdf
LPC2212FBD144/01,5
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
на замовлення 35 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1729.29 грн
10+1335.67 грн
В кошику  од. на суму  грн.
LPC2292FBD144/01,5 LPC2292_2294.pdf
LPC2292FBD144/01,5
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2096.66 грн
10+1618.91 грн
В кошику  од. на суму  грн.
LPC2292FET144/01,5 LPC2292_2294.pdf
LPC2292FET144/01,5
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 256KB 144TFBGA
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-TFBGA (12x12)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
на замовлення 114 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2137.48 грн
10+1650.81 грн
В кошику  од. на суму  грн.
LPC2294HBD144/01,5 LPC2292_2294.pdf
LPC2294HBD144/01,5
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Discontinued at Digi-Key
Number of I/O: 112
DigiKey Programmable: Not Verified
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MF1MOA2S50/D3F,118
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ MOA4
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OM4068H/2,518 OM4068.pdf
OM4068H/2,518
Виробник: NXP USA Inc.
Description: IC DRVR 32 SEGMENT 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: Serial
Configuration: 32 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Supplier Device Package: 44-PQFP (10x10)
Current - Supply: 12 µA
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OM6274,598
OM6274,598
Виробник: NXP USA Inc.
Description: EVAL BRD FOR SC18IS602 SC18IS603
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Contents: Board(s), Accessories
Utilized IC / Part: SC18IS602, SC18IS603
Supplied Contents: Board(s), Accessories
Embedded: No
Part Status: Obsolete
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OM6276,598
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PCA9633
Packaging: Bulk
Function: RGB LED Controller
Type: Opto/Lighting
Contents: Board(s)
Utilized IC / Part: PCA9633
Supplied Contents: Board(s)
Part Status: Obsolete
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P87C51X2FA,512 P80C3XX2_8XC5XX2.pdf
P87C51X2FA,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
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P89LPC9107FN,112 P89LPC9102_9103_9107.pdf
P89LPC9107FN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-DIP
Number of I/O: 12
DigiKey Programmable: Not Verified
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P89LPC916FDH,118 P89LPC915_916_917.pdf
P89LPC916FDH,118
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Verified
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P89LPC920FN,112 P89LPC920,921,922,9221.pdf
P89LPC920FN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
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P89LPC924FDH,518
P89LPC924FDH,518
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC936FA,529 P89LPC933_934_935_936.pdf
P89LPC936FA,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Verified
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P89LPC936FDH,518 P89LPC933_934_935_936.pdf
P89LPC936FDH,518
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
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PBRN113EK,115 PBRN113E_SER.pdf
PBRN113EK,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 40V 0.6A SMT3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 1.15V @ 8mA, 800mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 300mA, 5V
Supplier Device Package: SMT3; MPAK
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 1 kOhms
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