Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36384) > Сторінка 440 з 607
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
||
|---|---|---|---|---|---|---|---|
|
LPC54607J256BD208E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 208LQFPPackaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 171 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 36 шт В кошику од. на суму грн. | ||
|
SPC5744BBK1AVKU2 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 200 шт В кошику од. на суму грн. | ||
|
MVR5510AMMA4ESR2 | NXP USA Inc. |
Description: IC PMIC VR5510 Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 56-HVQFN (8x8) Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||
|
S9S08SG32E1CTJR | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 20TSSOPDigiKey Programmable: Not Verified Number of I/O: 16 Part Status: Active Supplier Device Package: 20-TSSOP Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 12x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 32KB (32K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
NZX4V7A,133 | NXP USA Inc. |
Description: DIODE ZENER 4.7V 500MW ALF2 |
на замовлення 38470 шт: термін постачання 21-31 дні (днів) |
|
||
| OM13030598 | NXP USA Inc. |
Description: HITEX LPC1850 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M3 Utilized IC / Part: LPC1850 Platform: Hitex |
товару немає в наявності |
В кошику од. на суму грн. | |||
| OM40003,598 | NXP USA Inc. |
Description: LPCXPRESSO LPC54018 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM® Cortex®-M4 Utilized IC / Part: LPC54018 Platform: LPCXpresso™ |
товару немає в наявності |
В кошику од. на суму грн. | |||
| OM13024598 | NXP USA Inc. |
Description: LPC12D27 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC12D27 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| OM16000598 | NXP USA Inc. |
Description: DEMO BOARD Primary Attributes: AND, Buffer, Inverter, NAND, NOR, OR, XNOR Supplied Contents: Board(s) Utilized IC / Part: 74AXP1G57 Type: Logic Function: Configurable Multiple Function Gate Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
|
OM7606/BGA2712598 | NXP USA Inc. |
Description: EVAL BOARD FOR BGA2712 Part Status: Active Supplied Contents: Board(s) Type: Amplifier Frequency: 1GHz ~ 3.2GHz For Use With/Related Products: BGA2712 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
PCA9450AAHNY | NXP USA Inc. |
Description: PMIC FOR I.MX8M MINI 845S 56HVQFPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 5.5V Applications: i.MX Processors Current - Supply: 23µA Supplier Device Package: 56-HVQFN (7x7) Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||
| MC9S08SU8VFK | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 24QFNPackaging: Tray Package / Case: 24-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V Connectivity: I2C, SCI Peripherals: PWM, WDT Supplier Device Package: 24-QFN (4x4) Part Status: Active Number of I/O: 17 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 2450 шт В кошику од. на суму грн. | |||
|
PEMI8QFN/WT,132 | NXP USA Inc. |
Description: FILTER RC(PI) 200 OHM/23PF SMDPackaging: Bulk Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 200Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 32dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 200 ESD Protection: Yes Number of Channels: 8 |
на замовлення 8000 шт: термін постачання 21-31 дні (днів) |
|
||
| 74LVC04AD | NXP USA Inc. |
Description: IC INVERTER 6CH 1-INP 14SOPackaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 3.6V Current - Output High, Low: 24mA, 24mA Number of Inputs: 1 Supplier Device Package: 14-SO Input Logic Level - High: 1.08V ~ 2V Input Logic Level - Low: 0.12V ~ 0.8V Max Propagation Delay @ V, Max CL: 6ns @ 3.3V, 50pF Part Status: Active Number of Circuits: 6 Current - Quiescent (Max): 40 µA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| LPC54607J256BD208 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Active Number of I/O: 171 DigiKey Programmable: Not Verified |
на замовлення 392 шт: термін постачання 21-31 дні (днів) |
|
|||
| 74LVC2G08GS115 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC2G08GS AND GATPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| 74LVC2G08GF115 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC2G08GF - AND G |
товару немає в наявності |
В кошику од. на суму грн. | |||
|
LD6806F/16P,115 | NXP USA Inc. |
Description: IC REG LINEAR 1.6V 200MA 6XSONPackaging: Bulk Package / Case: 6-XFDFN Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Output (Min/Fixed): 1.6V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
|
||
|
MC34PF8100CHEP | NXP USA Inc. |
Description: POWER MANAGEMENT IC, I.MX8, PRE-Packaging: Bulk |
на замовлення 780 шт: термін постачання 21-31 дні (днів) |
|
||
|
MC34PF8100CHEPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC, I.MX8, PRE-Packaging: Bulk |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
|
||
|
TJA1128ATK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 14HVSONPackaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 1/1 Data Rate: 20kBd Protocol: LIN Supplier Device Package: 14-HVSON (3x4.5) Duplex: Full |
товару немає в наявності |
Мінімальне замовлення: 6000 шт В кошику од. на суму грн. | ||
|
TJA1128ATK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 14HVSONPackaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 1/1 Data Rate: 20kBd Protocol: LIN Supplier Device Package: 14-HVSON (3x4.5) Duplex: Full |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
PCF8579HT/1,518 | NXP USA Inc. |
Description: INTERFACE CIRCUIT, CMOS, PQFP64Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
| MF1P4101DUD/02V | NXP USA Inc. |
Description: MIFARE PLUS EV1 Operating Temperature: -25°C ~ 70°C (TA) Type: RFID Transponder Frequency: 13.56MHz Package / Case: Die Packaging: Tray Supplier Device Package: Wafer Standards: ISO 14443, MIFARE |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TFA9887UK/N2AZ | NXP USA Inc. |
Description: IC AMP CLSS D MONO 2.65W 29WLCSPMax Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Type: Class D Mounting Type: Surface Mount Output Type: 1-Channel (Mono) Package / Case: 29-UFBGA, WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Tape & Reel (TR) Part Status: Obsolete Supplier Device Package: 29-WLCSP (3.19x2.07) |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TFA9895UK/N2BZ | NXP USA Inc. |
Description: IC AMP D 1 JACK 2.5W 29WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Bulk Part Status: Active Supplier Device Package: 29-WLCSP (3.19x2.07) Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Type: Class D Mounting Type: Surface Mount Output Type: 1 Jack, Filtered Package / Case: 29-UFBGA, WLCSP |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TFA9895UK/N2AZ | NXP USA Inc. |
Description: IC AMP D 1 JACK 2.5W 29WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Bulk Part Status: Active Supplier Device Package: 29-WLCSP (3.19x2.07) Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Type: Class D Mounting Type: Surface Mount Output Type: 1 Jack, Filtered Package / Case: 29-UFBGA, WLCSP |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||
| TFA9895BUK/N1Z | NXP USA Inc. |
Description: IC AMP D 1 JACK 2.5W 29WLCSP Type: Class D Output Type: 1 Jack, Filtered Features: Depop, Short-Circuit and Thermal Protection Packaging: Bulk Part Status: Obsolete Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TFA9887UK/N2BZ | NXP USA Inc. |
Description: IC AMP CLSS D MONO 2.65W 29WLCSPPart Status: Obsolete Supplier Device Package: 29-WLCSP (3.19x2.07) Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Type: Class D Mounting Type: Surface Mount Output Type: 1-Channel (Mono) Package / Case: 29-UFBGA, WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
| BZX84-A16215 | NXP USA Inc. |
Description: NOW NEXPERIA BZX84-A13 - ZENER D |
товару немає в наявності |
В кошику од. на суму грн. | |||
| MC34931SEKR2 | NXP USA Inc. |
Description: H-BRIDGE BRUSHED DC MOTOR DRIVE |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||
|
BZV90-C39115 | NXP USA Inc. |
Description: DIODE ZENER 36V 1.5W 5% UNICurrent - Reverse Leakage @ Vr: 50 nA @ 27.3 V Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Power - Max: 1.5 W Part Status: Active Supplier Device Package: SOT-223 Impedance (Max) (Zzt): 130 Ohms Voltage - Zener (Nom) (Vz): 39 V Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-261-4, TO-261AA Tolerance: ±5% Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
| LX2082RE82029B | NXP USA Inc. |
Description: IC MPU QORIQ LX 2GHZ 1150FBGA Additional Interfaces: CANbus, I2C, PCIe, SPI, UART SATA: SATA 6Gbps (4) Graphics Acceleration: No RAM Controllers: DDR4, SDRAM Number of Cores/Bus Width: 8 Core, 64-Bit USB: USB 3.0 (1) Supplier Device Package: 1150-FBGA (23x23) Core Processor: ARM® Cortex®-A72 Operating Temperature: 5°C ~ 105°C (TA) Speed: 2GHz Mounting Type: Surface Mount Package / Case: 1150-FBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | |||
|
TJA1086HNJ | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 44HVQFNNumber of Drivers/Receivers: 1/1 Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 125°C Type: Transceiver Mounting Type: Surface Mount Package / Case: 44-VQFN Exposed Pad Packaging: Bulk Duplex: Full Supplier Device Package: 44-HVQFN (9x9) Protocol: FlexRay |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
|
||
|
|
S9S08RN32W1MLH | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 55 Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x12b Core Processor: S08 EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. | ||
|
SPC5675KF0MMS2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 473MAPBGADigiKey Programmable: Not Verified Supplier Device Package: 473-MAPBGA (19x19) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 34x12b Core Processor: e200z7d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 2MB (2M x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 473-LFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
| MCIMX6QP4AVT8AB | NXP USA Inc. |
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGASATA: SATA 3Gbps (1) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR3L, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 4 Core, 32-Bit USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-FCBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | |||
|
P1010NSN5HHB | NXP USA Inc. |
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGASATA: SATA 3Gbps (2) Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 425-TEPBGA I (19x19) Core Processor: PowerPC e500v2 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 425-FBGA Packaging: Tray Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
NVT2002TLH | NXP USA Inc. |
Description: IC XLTR VL BIDIR HXSON8UNumber of Circuits: 1 Voltage - VCCB: 1.8 V ~ 5.5 V Voltage - VCCA: 1 V ~ 3.6 V Channels per Circuit: 2 Translator Type: Voltage Level Channel Type: Bidirectional Supplier Device Package: HXSON8U Data Rate: 33MHz Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Output Type: Open Drain, Push-Pull Package / Case: 8-XFDFN Exposed Pad Packaging: Tape & Reel (TR) Part Status: Active |
на замовлення 12000 шт: термін постачання 21-31 дні (днів) |
|
||
|
74AXP1G10GMH | NXP USA Inc. |
Description: IC GATE NAND 1CH 3-INP 6XSONCurrent - Quiescent (Max): 600 nA Number of Circuits: 1 Part Status: Active Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF Supplier Device Package: 6-XSON (1.45x1) Number of Inputs: 3 Current - Output High, Low: 8mA, 8mA Voltage - Supply: 0.7V ~ 2.75V Operating Temperature: -40°C ~ 85°C Logic Type: NAND Gate Mounting Type: Surface Mount Package / Case: 6-XFDFN Packaging: Bulk |
на замовлення 4653 шт: термін постачання 21-31 дні (днів) |
|
||
|
74AXP2G34GMH | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 2.75V 6XSONPart Status: Active Supplier Device Package: 6-XSON (1.45x1) Current - Output High, Low: 8mA, 8mA Number of Bits per Element: 1 Voltage - Supply: 0.7V ~ 2.75V Operating Temperature: -40°C ~ 85°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 2 Mounting Type: Surface Mount Output Type: Push-Pull Package / Case: 6-XFDFN Packaging: Bulk |
на замовлення 4784 шт: термін постачання 21-31 дні (днів) |
|
||
| A5G35S004N-3400 | NXP USA Inc. |
Description: RF MOSFET 48V 6DFNCurrent - Test: 12 mA Voltage - Test: 48 V Voltage - Rated: 125 V Supplier Device Package: 6-PDFN (4x4.5) Gain: 16.9dB Power - Output: 24.5dBm Frequency: 3.3GHz ~ 4.3GHz Mounting Type: Surface Mount Package / Case: 6-LDFN Exposed Pad Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
|
PSMN7R8-120PS127 | NXP USA Inc. |
Description: NOW NEXPERIA PSMN7R8-120PS - POW |
товару немає в наявності |
Мінімальне замовлення: 276 шт В кошику од. на суму грн. | ||
| PDZ10B/ZLX | NXP USA Inc. | Description: DIODE ZENER SOD323 |
товару немає в наявності |
В кошику од. на суму грн. | |||
|
SPC5605BK0CLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 100LQFPDigiKey Programmable: Not Verified Number of I/O: 77 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 7x10b, 5x12b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 64K x 8 Program Memory Size: 768KB (768K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
|
SPC5602CACLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 79 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 28x10b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 24K x 8 Program Memory Size: 256KB (256K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 450 шт В кошику од. на суму грн. | ||
|
BZX384-B16115 | NXP USA Inc. |
Description: NOW NEXPERIA BZX384-B16 - ZENERPart Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
SPC5603BK0VLH4R | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 45 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 12x10b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 28K x 8 Program Memory Size: 384KB (384K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | ||
|
IMXRT600-AUD-EVK | NXP USA Inc. |
Description: I.MX RT685 AUDIO EVAL KITPackaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M33 Board Type: Evaluation Platform Utilized IC / Part: i.MX RT685 Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
|
||
|
74ALVCH16827DGGS | NXP USA Inc. |
Description: IC BUF NON-INVERT 3.6V 56TSSOP |
на замовлення 2605 шт: термін постачання 21-31 дні (днів) |
|
||
|
PCF1252-4T/F4,112 | NXP USA Inc. |
Description: IC SUPERVISOR 1 CHANNEL 8SO |
товару немає в наявності |
Мінімальне замовлення: 145 шт В кошику од. на суму грн. | ||
| BGU7258115 | NXP USA Inc. |
Description: IC AMP ISM 4.9GHZ-5.925GHZ 6DFNNoise Figure: 1.6dB Current - Supply: 13mA Gain: 15dB Voltage - Supply: 3V ~ 3.6V RF Type: ISM Frequency: 4.9GHz ~ 5.925GHz Mounting Type: Surface Mount Package / Case: 6-XFDFN Exposed Pad Packaging: Bulk Supplier Device Package: DFN1616-6 Test Frequency: 5.5GHz P1dB: -4dBm |
товару немає в наявності |
В кошику од. на суму грн. | |||
|
SPC5644BAMLU8 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP DigiKey Programmable: Not Verified Number of I/O: 147 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 27x10b, 5x12b Core Processor: e200z4d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 128K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 200 шт В кошику од. на суму грн. | ||
|
S912XEQ384BCALR | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP DigiKey Programmable: Not Verified Number of I/O: 91 Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 24K x 8 Program Memory Size: 384KB (384K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||
|
S912XEQ384BCAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 24K x 8 Program Memory Size: 384KB (384K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 91 Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH |
товару немає в наявності |
Мінімальне замовлення: 300 шт В кошику од. на суму грн. | ||
|
S912XEG384AVAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Package / Case: 112-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 91 Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 24K x 8 Program Memory Size: 384KB (384K x 8) Speed: 50MHz Mounting Type: Surface Mount |
товару немає в наявності |
Мінімальне замовлення: 300 шт В кошику од. на суму грн. | ||
|
SPC5644BAMLU8R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Data Converters: A/D 27x10b, 5x12b Core Processor: e200z4d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 128K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 147 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||
|
SPC5644BAMLU1R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 128K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 147 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 27x10b, 5x12b Core Processor: e200z4d EEPROM Size: 64K x 8 Program Memory Type: FLASH |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||
|
MMDS36254HT1 | NXP USA Inc. |
Description: ADAM - ADVANCED DOHERTY ALIGNMENSupplier Device Package: 32-QFN (6x6) RF Type: General Purpose Frequency: 3.4GHz ~ 3.8GHz Function: Advanced Doherty Alignment Module Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
74ALVC16245DL,112-NXP | NXP USA Inc. | Description: IC TXRX NON-INVERT 3.6V 48SSOP |
товару немає в наявності |
Мінімальне замовлення: 368 шт В кошику од. на суму грн. |
| LPC54607J256BD208E |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 171
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 171
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 36 шт
В кошику
од. на суму грн.
| SPC5744BBK1AVKU2 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 200 шт
В кошику
од. на суму грн.
| MVR5510AMMA4ESR2 |
Виробник: NXP USA Inc.
Description: IC PMIC VR5510
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC PMIC VR5510
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| S9S08SG32E1CTJR |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 20TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 16
Part Status: Active
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Description: IC MCU 8BIT 32KB FLASH 20TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 16
Part Status: Active
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
товару немає в наявності
В кошику
од. на суму грн.
| NZX4V7A,133 |
![]() |
Виробник: NXP USA Inc.
Description: DIODE ZENER 4.7V 500MW ALF2
Description: DIODE ZENER 4.7V 500MW ALF2
на замовлення 38470 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 15000+ | 1.52 грн |
| OM13030598 |
Виробник: NXP USA Inc.
Description: HITEX LPC1850 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1850
Platform: Hitex
Description: HITEX LPC1850 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1850
Platform: Hitex
товару немає в наявності
В кошику
од. на суму грн.
| OM40003,598 |
Виробник: NXP USA Inc.
Description: LPCXPRESSO LPC54018 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: LPC54018
Platform: LPCXpresso™
Description: LPCXPRESSO LPC54018 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: LPC54018
Platform: LPCXpresso™
товару немає в наявності
В кошику
од. на суму грн.
| OM13024598 |
Виробник: NXP USA Inc.
Description: LPC12D27 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC12D27
Description: LPC12D27 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC12D27
товару немає в наявності
В кошику
од. на суму грн.
| OM16000598 |
Виробник: NXP USA Inc.
Description: DEMO BOARD
Primary Attributes: AND, Buffer, Inverter, NAND, NOR, OR, XNOR
Supplied Contents: Board(s)
Utilized IC / Part: 74AXP1G57
Type: Logic
Function: Configurable Multiple Function Gate
Packaging: Bulk
Description: DEMO BOARD
Primary Attributes: AND, Buffer, Inverter, NAND, NOR, OR, XNOR
Supplied Contents: Board(s)
Utilized IC / Part: 74AXP1G57
Type: Logic
Function: Configurable Multiple Function Gate
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| OM7606/BGA2712598 |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2712
Part Status: Active
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 1GHz ~ 3.2GHz
For Use With/Related Products: BGA2712
Packaging: Bulk
Description: EVAL BOARD FOR BGA2712
Part Status: Active
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 1GHz ~ 3.2GHz
For Use With/Related Products: BGA2712
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| PCA9450AAHNY |
![]() |
Виробник: NXP USA Inc.
Description: PMIC FOR I.MX8M MINI 845S 56HVQF
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
Description: PMIC FOR I.MX8M MINI 845S 56HVQF
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MC9S08SU8VFK |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 2450 шт
В кошику
од. на суму грн.
| PEMI8QFN/WT,132 |
![]() |
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/23PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 8
Description: FILTER RC(PI) 200 OHM/23PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 8
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1567+ | 14.02 грн |
| 74LVC04AD |
![]() |
Виробник: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
товару немає в наявності
В кошику
од. на суму грн.
| LPC54607J256BD208 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 171
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 171
DigiKey Programmable: Not Verified
на замовлення 392 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 31+ | 1286.43 грн |
| 74LVC2G08GS115 |
![]() |
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74LVC2G08GS AND GAT
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74LVC2G08GS AND GAT
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 74LVC2G08GF115 |
![]() |
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74LVC2G08GF - AND G
Description: NOW NEXPERIA 74LVC2G08GF - AND G
товару немає в наявності
В кошику
од. на суму грн.
| LD6806F/16P,115 |
![]() |
Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.6V 200MA 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 1.6V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.6V 200MA 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 1.6V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2219+ | 9.95 грн |
| MC34PF8100CHEP |
![]() |
на замовлення 780 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 50+ | 457.70 грн |
| MC34PF8100CHEPR2 |
![]() |
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 50+ | 457.70 грн |
| TJA1128ATK/0Z |
![]() |
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
товару немає в наявності
Мінімальне замовлення: 6000 шт
В кошику
од. на суму грн.
| TJA1128ATK/0Z |
![]() |
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
товару немає в наявності
В кошику
од. на суму грн.
| PCF8579HT/1,518 |
![]() |
Виробник: NXP USA Inc.
Description: INTERFACE CIRCUIT, CMOS, PQFP64
Part Status: Active
Packaging: Bulk
Description: INTERFACE CIRCUIT, CMOS, PQFP64
Part Status: Active
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| MF1P4101DUD/02V |
Виробник: NXP USA Inc.
Description: MIFARE PLUS EV1
Operating Temperature: -25°C ~ 70°C (TA)
Type: RFID Transponder
Frequency: 13.56MHz
Package / Case: Die
Packaging: Tray
Supplier Device Package: Wafer
Standards: ISO 14443, MIFARE
Description: MIFARE PLUS EV1
Operating Temperature: -25°C ~ 70°C (TA)
Type: RFID Transponder
Frequency: 13.56MHz
Package / Case: Die
Packaging: Tray
Supplier Device Package: Wafer
Standards: ISO 14443, MIFARE
товару немає в наявності
В кошику
од. на суму грн.
| TFA9887UK/N2AZ |
![]() |
Виробник: NXP USA Inc.
Description: IC AMP CLSS D MONO 2.65W 29WLCSP
Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 29-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 29-WLCSP (3.19x2.07)
Description: IC AMP CLSS D MONO 2.65W 29WLCSP
Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 29-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 29-WLCSP (3.19x2.07)
товару немає в наявності
В кошику
од. на суму грн.
| TFA9895UK/N2BZ |
Виробник: NXP USA Inc.
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Part Status: Active
Supplier Device Package: 29-WLCSP (3.19x2.07)
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1 Jack, Filtered
Package / Case: 29-UFBGA, WLCSP
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Part Status: Active
Supplier Device Package: 29-WLCSP (3.19x2.07)
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1 Jack, Filtered
Package / Case: 29-UFBGA, WLCSP
товару немає в наявності
В кошику
од. на суму грн.
| TFA9895UK/N2AZ |
Виробник: NXP USA Inc.
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Part Status: Active
Supplier Device Package: 29-WLCSP (3.19x2.07)
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1 Jack, Filtered
Package / Case: 29-UFBGA, WLCSP
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Part Status: Active
Supplier Device Package: 29-WLCSP (3.19x2.07)
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1 Jack, Filtered
Package / Case: 29-UFBGA, WLCSP
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| TFA9895BUK/N1Z |
Виробник: NXP USA Inc.
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Type: Class D
Output Type: 1 Jack, Filtered
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Part Status: Obsolete
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Type: Class D
Output Type: 1 Jack, Filtered
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Part Status: Obsolete
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
товару немає в наявності
В кошику
од. на суму грн.
| TFA9887UK/N2BZ |
![]() |
Виробник: NXP USA Inc.
Description: IC AMP CLSS D MONO 2.65W 29WLCSP
Part Status: Obsolete
Supplier Device Package: 29-WLCSP (3.19x2.07)
Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 29-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Description: IC AMP CLSS D MONO 2.65W 29WLCSP
Part Status: Obsolete
Supplier Device Package: 29-WLCSP (3.19x2.07)
Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 29-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| BZX84-A16215 |
![]() |
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZX84-A13 - ZENER D
Description: NOW NEXPERIA BZX84-A13 - ZENER D
товару немає в наявності
В кошику
од. на суму грн.
| MC34931SEKR2 |
![]() |
Виробник: NXP USA Inc.
Description: H-BRIDGE BRUSHED DC MOTOR DRIVE
Description: H-BRIDGE BRUSHED DC MOTOR DRIVE
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| BZV90-C39115 |
![]() |
Виробник: NXP USA Inc.
Description: DIODE ZENER 36V 1.5W 5% UNI
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Power - Max: 1.5 W
Part Status: Active
Supplier Device Package: SOT-223
Impedance (Max) (Zzt): 130 Ohms
Voltage - Zener (Nom) (Vz): 39 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Tolerance: ±5%
Packaging: Bulk
Description: DIODE ZENER 36V 1.5W 5% UNI
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Power - Max: 1.5 W
Part Status: Active
Supplier Device Package: SOT-223
Impedance (Max) (Zzt): 130 Ohms
Voltage - Zener (Nom) (Vz): 39 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Tolerance: ±5%
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| LX2082RE82029B |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Additional Interfaces: CANbus, I2C, PCIe, SPI, UART
SATA: SATA 6Gbps (4)
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 (1)
Supplier Device Package: 1150-FBGA (23x23)
Core Processor: ARM® Cortex®-A72
Operating Temperature: 5°C ~ 105°C (TA)
Speed: 2GHz
Mounting Type: Surface Mount
Package / Case: 1150-FBGA
Packaging: Tray
Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Additional Interfaces: CANbus, I2C, PCIe, SPI, UART
SATA: SATA 6Gbps (4)
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 (1)
Supplier Device Package: 1150-FBGA (23x23)
Core Processor: ARM® Cortex®-A72
Operating Temperature: 5°C ~ 105°C (TA)
Speed: 2GHz
Mounting Type: Surface Mount
Package / Case: 1150-FBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| TJA1086HNJ |
![]() |
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 44HVQFN
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 44-VQFN Exposed Pad
Packaging: Bulk
Duplex: Full
Supplier Device Package: 44-HVQFN (9x9)
Protocol: FlexRay
Description: IC TRANSCEIVER FULL 1/1 44HVQFN
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 44-VQFN Exposed Pad
Packaging: Bulk
Duplex: Full
Supplier Device Package: 44-HVQFN (9x9)
Protocol: FlexRay
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 34+ | 614.59 грн |
| S9S08RN32W1MLH |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 8BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 800 шт
В кошику
од. на суму грн.
| SPC5675KF0MMS2 |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 473-MAPBGA (19x19)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 34x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 473-LFBGA
Packaging: Tray
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 473-MAPBGA (19x19)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 34x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 473-LFBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MCIMX6QP4AVT8AB |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| P1010NSN5HHB |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 425-TEPBGA I (19x19)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 425-FBGA
Packaging: Tray
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 425-TEPBGA I (19x19)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 425-FBGA
Packaging: Tray
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
товару немає в наявності
В кошику
од. на суму грн.
| NVT2002TLH |
![]() |
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR HXSON8U
Number of Circuits: 1
Voltage - VCCB: 1.8 V ~ 5.5 V
Voltage - VCCA: 1 V ~ 3.6 V
Channels per Circuit: 2
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: HXSON8U
Data Rate: 33MHz
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 8-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Description: IC XLTR VL BIDIR HXSON8U
Number of Circuits: 1
Voltage - VCCB: 1.8 V ~ 5.5 V
Voltage - VCCA: 1 V ~ 3.6 V
Channels per Circuit: 2
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: HXSON8U
Data Rate: 33MHz
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 8-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 4000+ | 20.50 грн |
| 74AXP1G10GMH |
![]() |
Виробник: NXP USA Inc.
Description: IC GATE NAND 1CH 3-INP 6XSON
Current - Quiescent (Max): 600 nA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Supplier Device Package: 6-XSON (1.45x1)
Number of Inputs: 3
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
Description: IC GATE NAND 1CH 3-INP 6XSON
Current - Quiescent (Max): 600 nA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Supplier Device Package: 6-XSON (1.45x1)
Number of Inputs: 3
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
на замовлення 4653 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 4653+ | 5.92 грн |
| 74AXP2G34GMH |
![]() |
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 2.75V 6XSON
Part Status: Active
Supplier Device Package: 6-XSON (1.45x1)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
Description: IC BUFFER NON-INVERT 2.75V 6XSON
Part Status: Active
Supplier Device Package: 6-XSON (1.45x1)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
на замовлення 4784 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 3005+ | 7.40 грн |
| A5G35S004N-3400 |
![]() |
Виробник: NXP USA Inc.
Description: RF MOSFET 48V 6DFN
Current - Test: 12 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Supplier Device Package: 6-PDFN (4x4.5)
Gain: 16.9dB
Power - Output: 24.5dBm
Frequency: 3.3GHz ~ 4.3GHz
Mounting Type: Surface Mount
Package / Case: 6-LDFN Exposed Pad
Packaging: Bulk
Description: RF MOSFET 48V 6DFN
Current - Test: 12 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Supplier Device Package: 6-PDFN (4x4.5)
Gain: 16.9dB
Power - Output: 24.5dBm
Frequency: 3.3GHz ~ 4.3GHz
Mounting Type: Surface Mount
Package / Case: 6-LDFN Exposed Pad
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| PSMN7R8-120PS127 |
![]() |
Виробник: NXP USA Inc.
Description: NOW NEXPERIA PSMN7R8-120PS - POW
Description: NOW NEXPERIA PSMN7R8-120PS - POW
товару немає в наявності
Мінімальне замовлення: 276 шт
В кошику
од. на суму грн.
| PDZ10B/ZLX |
Виробник: NXP USA Inc.
Description: DIODE ZENER SOD323
Description: DIODE ZENER SOD323
товару немає в наявності
В кошику
од. на суму грн.
| SPC5605BK0CLL4 |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 77
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 7x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 768KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 77
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 7x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| SPC5602CACLL4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 450 шт
В кошику
од. на суму грн.
| BZX384-B16115 |
![]() |
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZX384-B16 - ZENER
Part Status: Active
Packaging: Bulk
Description: NOW NEXPERIA BZX384-B16 - ZENER
Part Status: Active
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| SPC5603BK0VLH4R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 45
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 384KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 45
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
од. на суму грн.
| IMXRT600-AUD-EVK |
![]() |
Виробник: NXP USA Inc.
Description: I.MX RT685 AUDIO EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT685
Part Status: Active
Description: I.MX RT685 AUDIO EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT685
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 13883.32 грн |
| 74ALVCH16827DGGS |
![]() |
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 56TSSOP
Description: IC BUF NON-INVERT 3.6V 56TSSOP
на замовлення 2605 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 402+ | 57.09 грн |
| PCF1252-4T/F4,112 |
![]() |
Виробник: NXP USA Inc.
Description: IC SUPERVISOR 1 CHANNEL 8SO
Description: IC SUPERVISOR 1 CHANNEL 8SO
товару немає в наявності
Мінімальне замовлення: 145 шт
В кошику
од. на суму грн.
| BGU7258115 |
![]() |
Виробник: NXP USA Inc.
Description: IC AMP ISM 4.9GHZ-5.925GHZ 6DFN
Noise Figure: 1.6dB
Current - Supply: 13mA
Gain: 15dB
Voltage - Supply: 3V ~ 3.6V
RF Type: ISM
Frequency: 4.9GHz ~ 5.925GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN Exposed Pad
Packaging: Bulk
Supplier Device Package: DFN1616-6
Test Frequency: 5.5GHz
P1dB: -4dBm
Description: IC AMP ISM 4.9GHZ-5.925GHZ 6DFN
Noise Figure: 1.6dB
Current - Supply: 13mA
Gain: 15dB
Voltage - Supply: 3V ~ 3.6V
RF Type: ISM
Frequency: 4.9GHz ~ 5.925GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN Exposed Pad
Packaging: Bulk
Supplier Device Package: DFN1616-6
Test Frequency: 5.5GHz
P1dB: -4dBm
товару немає в наявності
В кошику
од. на суму грн.
| SPC5644BAMLU8 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 200 шт
В кошику
од. на суму грн.
| S912XEQ384BCALR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| S912XEQ384BCAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
товару немає в наявності
Мінімальне замовлення: 300 шт
В кошику
од. на суму грн.
| S912XEG384AVAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Package / Case: 112-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Package / Case: 112-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
товару немає в наявності
Мінімальне замовлення: 300 шт
В кошику
од. на суму грн.
| SPC5644BAMLU8R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| SPC5644BAMLU1R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| MMDS36254HT1 |
![]() |
Виробник: NXP USA Inc.
Description: ADAM - ADVANCED DOHERTY ALIGNMEN
Supplier Device Package: 32-QFN (6x6)
RF Type: General Purpose
Frequency: 3.4GHz ~ 3.8GHz
Function: Advanced Doherty Alignment Module
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: ADAM - ADVANCED DOHERTY ALIGNMEN
Supplier Device Package: 32-QFN (6x6)
RF Type: General Purpose
Frequency: 3.4GHz ~ 3.8GHz
Function: Advanced Doherty Alignment Module
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| 74ALVC16245DL,112-NXP |
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 48SSOP
Description: IC TXRX NON-INVERT 3.6V 48SSOP
товару немає в наявності
Мінімальне замовлення: 368 шт
В кошику
од. на суму грн.





























