Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35985) > Сторінка 441 з 600
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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| MF1P4131DUD/02V | NXP USA Inc. |
Description: MIFARE PLUS EV1 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MF1P2101DUD/02V | NXP USA Inc. |
Description: MIFARE PLUS EV1 Packaging: Tray Package / Case: Die Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: ISO 14443, MIFARE Supplier Device Package: Wafer |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MC908AP64CFAE,557 | NXP USA Inc. | Description: MICROCONTROLLER, 8 BIT, HC08/S08 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| BLF184XR112 | NXP USA Inc. |
Description: RF MOSFET LDMOSPackaging: Bulk |
на замовлення 80 шт: термін постачання 21-31 дні (днів) |
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PCA9614DPZ | NXP USA Inc. |
Description: IC REDRIVER I2C 2CH 10TSSOPPackaging: Tape & Reel (TR) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Delay Time: 150ns Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V Applications: I2C Current - Supply: 16µA Data Rate (Max): 400kHz Supplier Device Package: 10-TSSOP Part Status: Active Capacitance - Input: 7 pF |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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PCA9614DPZ | NXP USA Inc. |
Description: IC REDRIVER I2C 2CH 10TSSOPPackaging: Cut Tape (CT) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Delay Time: 150ns Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V Applications: I2C Current - Supply: 16µA Data Rate (Max): 400kHz Supplier Device Package: 10-TSSOP Part Status: Active Capacitance - Input: 7 pF |
на замовлення 3776 шт: термін постачання 21-31 дні (днів) |
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74AXP1G06GNH | NXP USA Inc. |
Description: IC INVERTER OD 1CH 1-INP 6XSONPackaging: Bulk Features: Open Drain Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.7V ~ 2.75V Current - Output High, Low: -, 8mA Number of Inputs: 1 Supplier Device Package: 6-XSON (0.9x1) Input Logic Level - High: 1.6V Input Logic Level - Low: 0.7V Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 600 nA |
на замовлення 159500 шт: термін постачання 21-31 дні (днів) |
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74AUP1G06GN,132 | NXP USA Inc. |
Description: IC INVERTER OD 1CH 1-INP 6XSON |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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74AUP1G06GFH | NXP USA Inc. |
Description: IC INVERTER OD 1CH 1-INP 6XSON |
на замовлення 14656 шт: термін постачання 21-31 дні (днів) |
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74AUP2G06GF,132 | NXP USA Inc. |
Description: IC INVERTER OD 2CH 2-INP 6XSON |
на замовлення 96533 шт: термін постачання 21-31 дні (днів) |
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MCF54418CMJ250R | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912XDT384J1MAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 384KB (384K x 8) RAM Size: 20K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912XDT384J1VAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 384KB (384K x 8) RAM Size: 20K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912XDT384J1MALR | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 384KB (384K x 8) RAM Size: 20K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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LPC54S018JET180K | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGAPackaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 360K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 145 DigiKey Programmable: Not Verified |
на замовлення 235 шт: термін постачання 21-31 дні (днів) |
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MKV31F256VLL12 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PDTD1113ET215 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| A2T18S260W12NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM880X-2L2LPackaging: Tape & Reel (TR) Package / Case: OM-880X-2L2L Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 1.805GHz ~ 1.88GHz Power - Output: 280W Gain: 18.7dB Technology: LDMOS Supplier Device Package: OM-880X-2L2L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.5 A |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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BAT54/6215 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKY |
на замовлення 18000 шт: термін постачання 21-31 дні (днів) |
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MPC8321VRAFDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ PBGA516Packaging: Bulk Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART Part Status: Active |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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LS1027AXN7HNA | NXP USA Inc. |
Description: IC MPU QORIQ 800MHZ 448FBGA Packaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Additional Interfaces: CANbus, I2C, SPI, UART Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NX3008NBKT115 | NXP USA Inc. |
Description: SMALL SIGNAL FETPackaging: Bulk Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 350mA (Ta) Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V Power Dissipation (Max): 250mW (Ta), 770mW (Tc) Vgs(th) (Max) @ Id: 1.1V @ 250µA Supplier Device Package: SC-75 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V |
на замовлення 217719 шт: термін постачання 21-31 дні (днів) |
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TJA1442BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 7500 шт: термін постачання 21-31 дні (днів) |
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TJA1442BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 8929 шт: термін постачання 21-31 дні (днів) |
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| NCF2951BTT/T0E081J | NXP USA Inc. | Description: IC ACTIC 4G 3D 38TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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BGM1014,115 | NXP USA Inc. |
Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TL431ASDT,215 | NXP USA Inc. |
Description: IC VREF SHUNT ADJ 1% TO236ABPackaging: Cut Tape (CT) Tolerance: ±1% Package / Case: TO-236-3, SC-59, SOT-23-3 Output Type: Adjustable Mounting Type: Surface Mount Reference Type: Shunt Operating Temperature: -40°C ~ 125°C (TA) Supplier Device Package: SOT-23 (TO-236AB) Voltage - Output (Min/Fixed): 2.495V Part Status: Obsolete Current - Cathode: 600 µA Current - Output: 100 mA Voltage - Output (Max): 36 V Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MMPF0100F5AZESR2 | NXP USA Inc. | Description: IC REG CONV I.MX6 12OUT 56QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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K32W061K | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNPackaging: Tray Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0 Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 2429 шт: термін постачання 21-31 дні (днів) |
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PXT4403115 | NXP USA Inc. |
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S9S12ZVLS1F0VFM | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 32QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PCA24S08AD,118 | NXP USA Inc. |
Description: IC EEPROM 8KBIT I2C 400KHZ 8SOPackaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 8Kbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 3.6V Technology: EEPROM Clock Frequency: 400 kHz Memory Format: EEPROM Supplier Device Package: 8-SO Memory Interface: I2C Memory Organization: 1K x 8 DigiKey Programmable: Not Verified |
на замовлення 32000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||
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S912ZVMC64F3WKH | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Active Number of I/O: 31 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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74LVT00PW,118 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14TSSOPPackaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V Current - Output High, Low: 20mA, 32mA Number of Inputs: 2 Supplier Device Package: 14-TSSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF Part Status: Obsolete Number of Circuits: 4 |
на замовлення 992 шт: термін постачання 21-31 дні (днів) |
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MC68SEC000CAA16 | NXP USA Inc. |
Description: IC MPU M680X0 16MHZ 64QFPPackaging: Bulk Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 16MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: EC000 Voltage - I/O: 3.3V, 5.0V Supplier Device Package: 64-QFP (14x14) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No Part Status: Obsolete |
на замовлення 1544 шт: термін постачання 21-31 дні (днів) |
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RDGD31603PSMKEVM | NXP USA Inc. |
Description: EVAL BOARD FOR GD3160, KL25Z Packaging: Box Function: Gate Driver Type: Power Management Contents: Board(s), Cable(s) Utilized IC / Part: GD3160, KL25Z Supplied Contents: Board(s), Cable(s) Primary Attributes: 6-Channel (Hex) Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI) Embedded: Yes, MCU |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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RDGD31603PHSEVM | NXP USA Inc. |
Description: EVAL BOARD FOR FS6500 Packaging: Bulk Function: Gate Driver Type: Power Management Contents: Board(s), Cable(s) Utilized IC / Part: FS6500, GD3160, MPC5777C Secondary Attributes: SPI Interface(s) Embedded: Yes, MCU |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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74AHCT123APW-Q100118 | NXP USA Inc. |
Description: IC MULTIVIBRATOR |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TJA1441BTK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSONPackaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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TJA1441BTK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSONPackaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 11614 шт: термін постачання 21-31 дні (днів) |
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MPC885CVR66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGAPackaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
на замовлення 54 шт: термін постачання 21-31 дні (днів) |
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MPC875VR66-NXP | NXP USA Inc. |
Description: IC MPU 66MHZ 256BGAPackaging: Bulk Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART Part Status: Active |
на замовлення 110 шт: термін постачання 21-31 дні (днів) |
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74AHC164D112 | NXP USA Inc. |
Description: NOW NEXPERIA 74AHC164D - SERIAL |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TEA2206T/1J | NXP USA Inc. |
Description: IC ACTIVE BRIDGE CTRL SO8Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 440V Applications: Desktop, Notebook PCs Current - Supply: 2mA Supplier Device Package: 8-SO Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TEA2206T/1J | NXP USA Inc. |
Description: IC ACTIVE BRIDGE CTRL SO8Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 440V Applications: Desktop, Notebook PCs Current - Supply: 2mA Supplier Device Package: 8-SO Part Status: Active |
на замовлення 4464 шт: термін постачання 21-31 дні (днів) |
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74ABT162245ADL112 | NXP USA Inc. |
Description: NOW NEXPERIA 74ABT162245ADL - BU |
на замовлення 816 шт: термін постачання 21-31 дні (днів) |
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SC18IS606PWJ | NXP USA Inc. |
Description: IC I2C TO SPI BRIDGEPackaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.71V ~ 3.6V Current - Supply: 4mA Protocol: I2C Supplier Device Package: 16-TSSOP Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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SC18IS606PWJ | NXP USA Inc. |
Description: IC I2C TO SPI BRIDGEPackaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.71V ~ 3.6V Current - Supply: 4mA Protocol: I2C Supplier Device Package: 16-TSSOP Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 3419 шт: термін постачання 21-31 дні (днів) |
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SC18IS604PWJ | NXP USA Inc. |
Description: IC SPI TO I2C BRIDGEPackaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.71V ~ 3.6V Current - Supply: 4mA Protocol: I2C Supplier Device Package: 16-TSSOP Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||
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SC18IS604PWJ | NXP USA Inc. |
Description: IC SPI TO I2C BRIDGEPackaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.71V ~ 3.6V Current - Supply: 4mA Protocol: I2C Supplier Device Package: 16-TSSOP Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 2200 шт: термін постачання 21-31 дні (днів) |
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| MCIMX6Q4AVT10ADR518 | NXP USA Inc. |
Description: CORTEX A9 RISC MICROPROCESSOR 32Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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74AHC32PW/S400118 | NXP USA Inc. |
Description: OR GATE, AHC SERIES |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912XEQ512F1VAA | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFPPackaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912XEQ512F1VAAR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFPPackaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| OMA1007TL-SKT | NXP USA Inc. |
Description: EVAL BOARD FOR A1007TL Packaging: Bulk Function: Anti Tamper and Security Type: Interface Utilized IC / Part: A1007TL Supplied Contents: Board(s) Part Status: Active Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MC32PF1550A3EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGS Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| MC33VR5500V3ES | NXP USA Inc. | Description: VR5500 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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FRDMGD3160DSBHB | NXP USA Inc. |
Description: GD3160 HALF-BRIDGE EVAL KITPackaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: GD3160, KL25Z Supplied Contents: Board(s), Cable(s) Primary Attributes: 1-Channel (Single) Embedded: Yes, MCU, 32-Bit Secondary Attributes: Graphical User Interface (GUI) |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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BGA2771,115 | NXP USA Inc. |
Description: IC AMP ISM 20MHZ-2.5GHZ 6TSSOPPackaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 20MHz ~ 2.5GHz RF Type: ISM Voltage - Supply: 3V ~ 4V Gain: 21.4dB Current - Supply: 33.3mA Noise Figure: 4.5dB P1dB: 12.1dBm Test Frequency: 1GHz Supplier Device Package: 6-TSSOP Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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74AUP2G07GX147 | NXP USA Inc. |
Description: IC BUFF NON-INVERT 3.6V 6-X2SONPackaging: Bulk Package / Case: 6-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: -, 4mA Supplier Device Package: 6-X2SON (1.0x0.8) Part Status: Active |
на замовлення 80000 шт: термін постачання 21-31 дні (днів) |
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| MF1P4131DUD/02V |
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Виробник: NXP USA Inc.
Description: MIFARE PLUS EV1
Description: MIFARE PLUS EV1
товару немає в наявності
В кошику
од. на суму грн.
| MF1P2101DUD/02V |
Виробник: NXP USA Inc.
Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
товару немає в наявності
В кошику
од. на суму грн.
| MC908AP64CFAE,557 |
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Description: MICROCONTROLLER, 8 BIT, HC08/S08
товару немає в наявності
В кошику
од. на суму грн.
| BLF184XR112 |
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на замовлення 80 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 43021.59 грн |
| PCA9614DPZ |
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Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 120.07 грн |
| PCA9614DPZ |
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Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
на замовлення 3776 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 225.67 грн |
| 10+ | 162.98 грн |
| 25+ | 149.32 грн |
| 100+ | 126.09 грн |
| 250+ | 119.38 грн |
| 500+ | 115.35 грн |
| 1000+ | 110.18 грн |
| 74AXP1G06GNH |
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Виробник: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
Packaging: Bulk
Features: Open Drain
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: -, 8mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.6V
Input Logic Level - Low: 0.7V
Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
Description: IC INVERTER OD 1CH 1-INP 6XSON
Packaging: Bulk
Features: Open Drain
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: -, 8mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.6V
Input Logic Level - Low: 0.7V
Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
на замовлення 159500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2002+ | 11.73 грн |
| 74AUP1G06GN,132 |
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Виробник: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
Description: IC INVERTER OD 1CH 1-INP 6XSON
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2179+ | 10.81 грн |
| 74AUP1G06GFH |
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Виробник: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
Description: IC INVERTER OD 1CH 1-INP 6XSON
на замовлення 14656 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1697+ | 13.90 грн |
| 74AUP2G06GF,132 |
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Виробник: NXP USA Inc.
Description: IC INVERTER OD 2CH 2-INP 6XSON
Description: IC INVERTER OD 2CH 2-INP 6XSON
на замовлення 96533 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2036+ | 11.81 грн |
| MCF54418CMJ250R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Description: IC MCU 32BIT ROMLESS 256MAPBGA
товару немає в наявності
В кошику
од. на суму грн.
| S912XDT384J1MAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| S912XDT384J1VAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| S912XDT384J1MALR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| LPC54S018JET180K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
на замовлення 235 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 808.23 грн |
| 10+ | 609.92 грн |
| 25+ | 567.84 грн |
| 189+ | 474.55 грн |
| MKV31F256VLL12 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
товару немає в наявності
В кошику
од. на суму грн.
| PDTD1113ET215 |
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Виробник: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
товару немає в наявності
В кошику
од. на суму грн.
| A2T18S260W12NR3 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 280W
Gain: 18.7dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 280W
Gain: 18.7dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
товару немає в наявності
В кошику
од. на суму грн.
| BAT54/6215 |
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Виробник: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Description: RECTIFIER DIODE, SCHOTTKY
на замовлення 18000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 18000+ | 1.69 грн |
| MPC8321VRAFDCA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ PBGA516
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Part Status: Active
Description: IC MPU MPC83XX 333MHZ PBGA516
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Part Status: Active
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 7+ | 2996.61 грн |
| LS1027AXN7HNA |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
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| NX3008NBKT115 |
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Виробник: NXP USA Inc.
Description: SMALL SIGNAL FET
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
Description: SMALL SIGNAL FET
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
на замовлення 217719 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 9616+ | 2.35 грн |
| TJA1442BT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 58.41 грн |
| 5000+ | 55.00 грн |
| 7500+ | 54.37 грн |
| TJA1442BT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 8929 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 117.01 грн |
| 10+ | 82.50 грн |
| 25+ | 74.95 грн |
| 100+ | 62.53 грн |
| 250+ | 58.82 грн |
| 500+ | 56.58 грн |
| 1000+ | 53.84 грн |
| NCF2951BTT/T0E081J |
Виробник: NXP USA Inc.
Description: IC ACTIC 4G 3D 38TSSOP
Description: IC ACTIC 4G 3D 38TSSOP
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| BGM1014,115 |
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Виробник: NXP USA Inc.
Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP
Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP
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| TL431ASDT,215 |
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Виробник: NXP USA Inc.
Description: IC VREF SHUNT ADJ 1% TO236AB
Packaging: Cut Tape (CT)
Tolerance: ±1%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Grade: Automotive
Qualification: AEC-Q100
Description: IC VREF SHUNT ADJ 1% TO236AB
Packaging: Cut Tape (CT)
Tolerance: ±1%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Grade: Automotive
Qualification: AEC-Q100
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| MMPF0100F5AZESR2 |
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Description: IC REG CONV I.MX6 12OUT 56QFN
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| K32W061K |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2429 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 556.65 грн |
| 10+ | 413.29 грн |
| 25+ | 376.99 грн |
| 80+ | 318.30 грн |
| 230+ | 292.37 грн |
| 440+ | 282.85 грн |
| PXT4403115 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
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| S9S12ZVLS1F0VFM |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32QFN
Description: IC MCU 16BIT 16KB FLASH 32QFN
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| PCA24S08AD,118 |
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Виробник: NXP USA Inc.
Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
на замовлення 32000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| S912ZVMC64F3WKH |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
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| 74LVT00PW,118 |
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Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
на замовлення 992 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 683+ | 33.92 грн |
| MC68SEC000CAA16 |
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Виробник: NXP USA Inc.
Description: IC MPU M680X0 16MHZ 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M680X0 16MHZ 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
на замовлення 1544 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 11+ | 1988.16 грн |
| RDGD31603PSMKEVM |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Box
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Box
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
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| RDGD31603PHSEVM |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS6500, GD3160, MPC5777C
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS6500, GD3160, MPC5777C
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 78403.88 грн |
| 74AHCT123APW-Q100118 |
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Виробник: NXP USA Inc.
Description: IC MULTIVIBRATOR
Description: IC MULTIVIBRATOR
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| TJA1441BTK/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6000+ | 49.76 грн |
| TJA1441BTK/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 11614 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 105.31 грн |
| 10+ | 73.32 грн |
| 25+ | 66.45 грн |
| 100+ | 55.21 грн |
| 250+ | 51.81 грн |
| 500+ | 49.76 грн |
| 1000+ | 47.29 грн |
| 2500+ | 45.53 грн |
| MPC885CVR66 |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 54 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 4035.56 грн |
| MPC875VR66-NXP |
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Виробник: NXP USA Inc.
Description: IC MPU 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Active
Description: IC MPU 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Active
на замовлення 110 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10+ | 2456.78 грн |
| 74AHC164D112 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AHC164D - SERIAL
Description: NOW NEXPERIA 74AHC164D - SERIAL
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| TEA2206T/1J |
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Виробник: NXP USA Inc.
Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
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| TEA2206T/1J |
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Виробник: NXP USA Inc.
Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
на замовлення 4464 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 350.20 грн |
| 10+ | 257.07 грн |
| 25+ | 236.88 грн |
| 100+ | 201.54 грн |
| 250+ | 191.65 грн |
| 500+ | 185.68 грн |
| 1000+ | 177.80 грн |
| 74ABT162245ADL112 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74ABT162245ADL - BU
Description: NOW NEXPERIA 74ABT162245ADL - BU
на замовлення 816 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 512+ | 48.35 грн |
| SC18IS606PWJ |
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Виробник: NXP USA Inc.
Description: IC I2C TO SPI BRIDGE
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC I2C TO SPI BRIDGE
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 146.79 грн |
| SC18IS606PWJ |
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Виробник: NXP USA Inc.
Description: IC I2C TO SPI BRIDGE
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC I2C TO SPI BRIDGE
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3419 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 273.31 грн |
| 10+ | 198.15 грн |
| 25+ | 181.83 грн |
| 100+ | 153.76 грн |
| 250+ | 145.71 грн |
| 500+ | 140.86 грн |
| 1000+ | 134.62 грн |
| SC18IS604PWJ |
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Виробник: NXP USA Inc.
Description: IC SPI TO I2C BRIDGE
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC SPI TO I2C BRIDGE
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| SC18IS604PWJ |
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Виробник: NXP USA Inc.
Description: IC SPI TO I2C BRIDGE
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC SPI TO I2C BRIDGE
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2200 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 276.65 грн |
| 10+ | 201.37 грн |
| 25+ | 185.08 грн |
| 100+ | 156.83 грн |
| 250+ | 148.79 грн |
| 500+ | 143.95 грн |
| 1000+ | 137.66 грн |
| MCIMX6Q4AVT10ADR518 |
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Виробник: NXP USA Inc.
Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Part Status: Active
Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Part Status: Active
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од. на суму грн.
| 74AHC32PW/S400118 |
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Виробник: NXP USA Inc.
Description: OR GATE, AHC SERIES
Description: OR GATE, AHC SERIES
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од. на суму грн.
| S912XEQ512F1VAA |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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од. на суму грн.
| S912XEQ512F1VAAR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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од. на суму грн.
| OMA1007TL-SKT |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR A1007TL
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1007TL
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Description: EVAL BOARD FOR A1007TL
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1007TL
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF1550A3EP |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
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од. на суму грн.
| MC33VR5500V3ES |
Виробник: NXP USA Inc.
Description: VR5500
Description: VR5500
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од. на суму грн.
| FRDMGD3160DSBHB |
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Виробник: NXP USA Inc.
Description: GD3160 HALF-BRIDGE EVAL KIT
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU, 32-Bit
Secondary Attributes: Graphical User Interface (GUI)
Description: GD3160 HALF-BRIDGE EVAL KIT
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU, 32-Bit
Secondary Attributes: Graphical User Interface (GUI)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 58066.14 грн |
| BGA2771,115 |
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Виробник: NXP USA Inc.
Description: IC AMP ISM 20MHZ-2.5GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 20MHz ~ 2.5GHz
RF Type: ISM
Voltage - Supply: 3V ~ 4V
Gain: 21.4dB
Current - Supply: 33.3mA
Noise Figure: 4.5dB
P1dB: 12.1dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Description: IC AMP ISM 20MHZ-2.5GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 20MHz ~ 2.5GHz
RF Type: ISM
Voltage - Supply: 3V ~ 4V
Gain: 21.4dB
Current - Supply: 33.3mA
Noise Figure: 4.5dB
P1dB: 12.1dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
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| 74AUP2G07GX147 |
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Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-X2SON (1.0x0.8)
Part Status: Active
Description: IC BUFF NON-INVERT 3.6V 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-X2SON (1.0x0.8)
Part Status: Active
на замовлення 80000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 403+ | 53.42 грн |





































