Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36384) > Сторінка 485 з 607
| Фото | Назва | Виробник | Інформація |
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MC9S12DB128MPVE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFPPackaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Obsolete Number of I/O: 91 DigiKey Programmable: Not Verified |
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MC9S12DB128CFUE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFPPackaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Obsolete Number of I/O: 59 DigiKey Programmable: Not Verified |
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N74F541D,623 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 20SOPackaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 20-SO Part Status: Obsolete |
на замовлення 946 шт: термін постачання 21-31 дні (днів) |
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| PMMA2241KEG | NXP USA Inc. |
Description: IC ACCEL X-LATERAL 10G Packaging: Tube Part Status: Obsolete |
товару немає в наявності |
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LM75BDP/DG,118 | NXP USA Inc. |
Description: SENSOR DIGITAL -55C-125C 8TSSOPFeatures: Output Switch, Programmable Limit Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: I2C Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.8V ~ 5.5V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 8-TSSOP Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Accuracy - Highest (Lowest): ±2°C (±3°C) Sensing Temperature - Local: -55°C ~ 125°C Part Status: Obsolete |
товару немає в наявності |
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MC56F83766VLK | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFPDigiKey Programmable: Not Verified Number of I/O: 68 Part Status: Active Supplier Device Package: 80-FQFP (12x12) Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Connectivity: CANbus, I²C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 20x12b; D/A 2x12b Core Processor: 56800EX Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 48K x 8 Program Memory Size: 128KB (128K x 8) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Tray |
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MPXV2202DP | NXP USA Inc. |
Description: SENSOR 29.01PSID 0.13" .04V 8SOPFeatures: Temperature Compensated Packaging: Tray Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side Output Type: Wheatstone Bridge Mounting Type: Surface Mount Output: 0 mV ~ 40 mV (10V) Operating Pressure: 29.01PSI (200kPa) Pressure Type: Differential Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 10V ~ 16V Port Size: Male - 0.13" (3.17mm) Tube Applications: Board Mount Supplier Device Package: 8-SOP Port Style: Barbed Maximum Pressure: 58.02PSI (400kPa) Part Status: Obsolete |
товару немає в наявності |
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MC9S08GT8AMFCE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 32QFNDigiKey Programmable: Not Verified Number of I/O: 24 Part Status: Active Supplier Device Package: 32-HVQFN (5x5) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 8-Bit Data Converters: A/D 4x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Bulk |
на замовлення 490 шт: термін постачання 21-31 дні (днів) |
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MKL05Z32VLF4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFPDigiKey Programmable: Not Verified Number of I/O: 41 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 14x12b; D/A 1x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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S9KEAZN8AMFKR | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 24QFNPackaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Part Status: Active Number of I/O: 22 DigiKey Programmable: Not Verified |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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S9KEAZN8AMFKR | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 24QFNPackaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Part Status: Active Number of I/O: 22 DigiKey Programmable: Not Verified |
на замовлення 8505 шт: термін постачання 21-31 дні (днів) |
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PTN3222CUKZ | NXP USA Inc. |
Description: IC EUSB2 TO USB2 WLCSP12Packaging: Tape & Reel (TR) Package / Case: 12-XFBGA, WLCSP Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 55mA Data Rate (Max): 480Mbps Supplier Device Package: 12-WLCSP (1.55x1.18) Signal Conditioning: Input Equalization, Output De-Emphasis Part Status: Active Capacitance - Input: 10 pF |
на замовлення 8000 шт: термін постачання 21-31 дні (днів) |
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PTN3222CUKZ | NXP USA Inc. |
Description: IC EUSB2 TO USB2 WLCSP12Packaging: Cut Tape (CT) Package / Case: 12-XFBGA, WLCSP Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 55mA Data Rate (Max): 480Mbps Supplier Device Package: 12-WLCSP (1.55x1.18) Signal Conditioning: Input Equalization, Output De-Emphasis Part Status: Active Capacitance - Input: 10 pF |
на замовлення 15654 шт: термін постачання 21-31 дні (днів) |
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74LVC32245AEC,518 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 3.6V 96LFBGAPart Status: Active Supplier Device Package: 96-LFBGA (13.5x5.5) Current - Output High, Low: 24mA, 24mA Number of Bits per Element: 8 Voltage - Supply: 1.65V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Transceiver, Non-Inverting Number of Elements: 4 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 96-LFBGA Packaging: Bulk |
на замовлення 80605 шт: термін постачання 21-31 дні (днів) |
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MPXHZ6116A6U | NXP USA Inc. |
Description: SENSOR 16.68PSIA 4.645V 8SSOPOutput Type: Analog Voltage Package / Case: 8-SOIC (0.295", 7.50mm Width) Features: Temperature Compensated Packaging: Tube Part Status: Obsolete Maximum Pressure: 58.02PSI (400kPa) Port Style: No Port Supplier Device Package: 8-SSOP Applications: Board Mount Voltage - Supply: 4.75V ~ 5.25V Termination Style: Gull Wing Operating Temperature: -40°C ~ 125°C Accuracy: ±1.5% Pressure Type: Absolute Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa) Output: 0.399 V ~ 4.645 V Mounting Type: Surface Mount |
товару немає в наявності |
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MPXHZ6116A6T1 | NXP USA Inc. |
Description: SENSOR 16.68PSIA 4.645V 8SSOPPart Status: Active Maximum Pressure: 58.02PSI (400kPa) Port Style: No Port Supplier Device Package: 8-SSOP Applications: Board Mount Voltage - Supply: 4.75V ~ 5.25V Termination Style: Gull Wing Operating Temperature: -40°C ~ 125°C Accuracy: ±1.5% Pressure Type: Absolute Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa) Output: 0.399 V ~ 4.645 V Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 8-SOIC (0.295", 7.50mm Width) Features: Temperature Compensated Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| STMP3770XXLAEA2N | NXP USA Inc. |
Description: STMP3770 - PMP CONTROLLERPackaging: Bulk Part Status: Obsolete |
на замовлення 6836 шт: термін постачання 21-31 дні (днів) |
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| STMP3770XXBJEA3N | NXP USA Inc. |
Description: STMP3770XXBJEA3N Packaging: Bulk Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| STMP3770XXLAEA3N | NXP USA Inc. |
Description: STMP3770XXLAEA3N Packaging: Bulk Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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LX2160XN72232B | NXP USA Inc. |
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGAAdditional Interfaces: CANbus, I2C, MMC/SD, SPI, UART Speed: 2.2GHz Mounting Type: Surface Mount Package / Case: 1517-BBGA, FCBGA Packaging: Tray Part Status: Active SATA: SATA 3.0 (4) Security Features: Secure Boot, TrustZone® Graphics Acceleration: Yes RAM Controllers: DDR4 Number of Cores/Bus Width: 16 Core, 64-Bit USB: USB 3.0 (2) + PHY (2) Ethernet: 100Gbps (2) Supplier Device Package: 1517-FCPBGA (40x40) Voltage - I/O: 1.2V, 1.8V, 3.3V Core Processor: ARM® Cortex®-A72 Operating Temperature: -40°C ~ 105°C (TJ) |
на замовлення 33 шт: термін постачання 21-31 дні (днів) |
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MPC8560VTAQFC | NXP USA Inc. |
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGAPackaging: Tray Package / Case: 783-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9S08GT8ACFBE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 44QFPDigiKey Programmable: Not Verified Package / Case: 44-QFP Number of I/O: 36 Part Status: Active Supplier Device Package: 44-QFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 40MHz Mounting Type: Surface Mount Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| NCF29A1XHN/0500IJ | NXP USA Inc. |
Description: IC REMOTE KEYLESS ENTRY 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| NCF29A1XHN/0500IJ | NXP USA Inc. |
Description: IC REMOTE KEYLESS ENTRY 32HVQFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5x5) |
на замовлення 5964 шт: термін постачання 21-31 дні (днів) |
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PESD5V0L5UV/DG125 | NXP USA Inc. |
Description: TVS DIODE 5VWM 12VC SOT666Packaging: Bulk Package / Case: SOT-563, SOT-666 Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Applications: General Purpose Capacitance @ Frequency: 16pF @ 1MHz Current - Peak Pulse (10/1000µs): 2.5A Voltage - Reverse Standoff (Typ): 5V (Max) Supplier Device Package: SOT-666 Unidirectional Channels: 5 Voltage - Breakdown (Min): 6.4V Voltage - Clamping (Max) @ Ipp: 12V Power - Peak Pulse: 25W Power Line Protection: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KITPF5200SKTEVM | NXP USA Inc. |
Description: EVAL BOARD FOR KL25Z, PF5200Packaging: Box Function: Automotive Type: Power Management Contents: Board(s), Cable(s), Accessories Utilized IC / Part: KL25Z, PF5200 Supplied Contents: Board(s), Cable(s), Accessories Primary Attributes: 2-Channel (Dual) Secondary Attributes: On-Board LEDs, Test Points Embedded: Yes, MCU |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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| SAF776DEL/200SK | NXP USA Inc. |
Description: SAF776DEL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| KC13237CHT | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| NT2H1001G0DUDV | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIEPackaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443 Supplier Device Package: Die |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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NCF3340AHN/00330Y | NXP USA Inc. |
Description: AUTOMOTIVE QUALIFIED NFC CONTROL Supplier Device Package: 40-HVQFN (6x6) Standards: FeliCa, ISO 14443, MIFARE, NFC Voltage - Supply: 2.3V ~ 5.5V Type: RFID Reader/Transponder Interface: I²C, SPI Frequency: 24.12MHz Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| NCJ3340AHN/00330Y | NXP USA Inc. |
Description: NFC Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MC56F8013VFAE | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 32LQFPPackaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 16KB (8K x 16) RAM Size: 2K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 6x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
на замовлення 1259 шт: термін постачання 21-31 дні (днів) |
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| LFBGAINTPU3A | NXP USA Inc. |
Description: NXP LEAD FREE 324 PIN 1.0 MM PIT Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| LFBGAINTPY2A | NXP USA Inc. |
Description: 473 PIN 0.8MM BGA TO PGA ADAPTER Packaging: Bulk Module/Board Type: Socket Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| LFBGAINTPT5A | NXP USA Inc. |
Description: NXP LEAD FREE 269 PIN. 0.80 MM P Packaging: Bulk Module/Board Type: Socket Module - BGA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| LFBGAINTPS1A | NXP USA Inc. |
Description: 256 PIN 1.0MM BGA TO PGA ADAPTER Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| LFBGAINTPH1A | NXP USA Inc. |
Description: 100 PIN 1.0MM BGA TO PGA ADAPTER Packaging: Bulk Module/Board Type: Socket Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| LFBGAINTPV1A | NXP USA Inc. |
Description: 356 PIN 0.8 MM BGA TO PGA ADAPTE Packaging: Bulk Module/Board Type: Socket Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| LFBGAINTPS2A | NXP USA Inc. |
Description: 252 PIN 0.8MM BGA TO PGA ADAPTER Packaging: Bulk Module/Board Type: Socket Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| LFBGAINTPT3A | NXP USA Inc. |
Description: 257 PIN 0.8MM BGA TO PGA ADAPTER Packaging: Bulk Module/Board Type: Socket Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| LFBGAINTPT4A | NXP USA Inc. |
Description: 292 PIN 0.8MM BGA TO PGA ADAPTER Packaging: Bulk Module/Board Type: Socket Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| LFBGAINTPZ3A | NXP USA Inc. |
Description: 512 PIN 0.8MM BGA TO PGA ADAPTER Packaging: Bulk Module/Board Type: Socket Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| LFBGAINTJ33QLT | NXP USA Inc. |
Description: 208 PIN 1.0MM PGA TO 144 PIN 0.5 Packaging: Bulk For Use With/Related Products: MPC563x Module/Board Type: Socket Adapter Utilized IC / Part: MPC563x |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MPC8270VVUPEA | NXP USA Inc. |
Description: IC MPU MPC82XX 450MHZ 480TBGAPackaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 450MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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S912XDG128F2MAL | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFPPackaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TEA1938T/1J | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 10SO Control Features: EN, Soft Start Voltage - Start Up: 17.5 V Fault Protection: Over Power, Over Temperature, Over Voltage Supplier Device Package: 10-SO Voltage - Supply (Vcc/Vdd): 0V ~ 120V Topology: Flyback Output Isolation: Isolated Internal Switch(s): No Frequency - Switching: 25.5kHz ~ 128kHz Operating Temperature: -25°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 10-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| HT2ICS2002W/V6F/RZ | NXP USA Inc. |
Description: HITAG 2 TRANSPONDER ICPackaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 125kHz Type: RFID Transponder Operating Temperature: -55°C ~ 140°C Voltage - Supply: -0.5V ~ 6.5V Standards: ISO 11784, ISO 11785 Supplier Device Package: Wafer |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| MC908QVY4CDWER | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16SOICPackaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Number of I/O: 14 DigiKey Programmable: Not Verified |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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MC908JK8MDWE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20SOICDigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 20-SOIC Peripherals: LED, LVD, POR, PWM Connectivity: SCI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 13x8b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 256 x 8 Program Memory Size: 8KB (8K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Bulk |
на замовлення 4522 шт: термін постачання 21-31 дні (днів) |
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MC908EY8AMFJE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 32LQFPPackaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, SPI Peripherals: POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 24 DigiKey Programmable: Not Verified |
на замовлення 5439 шт: термін постачання 21-31 дні (днів) |
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MC908LK24CFUE | NXP USA Inc. |
Description: IC MCU 8BIT 24KB FLASH 64QFPPackaging: Bulk Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 24KB (24K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: I²C, IRSCI, SPI Peripherals: LCD, LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Number of I/O: 40 DigiKey Programmable: Not Verified |
на замовлення 2688 шт: термін постачання 21-31 дні (днів) |
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MC908JL16CDWE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 28SOICProgram Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Program Memory Size: 16KB (16K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 28-SOIC (0.295", 7.50mm Width) Packaging: Tube DigiKey Programmable: Not Verified Number of I/O: 23 Supplier Device Package: 28-SOIC Peripherals: LED, LVD, POR, PWM Connectivity: I²C, SCI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 12x10b Core Processor: HC08 |
на замовлення 1594 шт: термін постачання 21-31 дні (днів) |
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MC908GT16CFBER | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44QFPDigiKey Programmable: Not Verified Number of I/O: 36 Supplier Device Package: 44-QFP (10x10) Peripherals: LVD, POR, PWM Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Program Memory Size: 16KB (16K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 44-QFP Packaging: Tape & Reel (TR) |
на замовлення 1470 шт: термін постачання 21-31 дні (днів) |
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MC908GT16CFBE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44QFPDigiKey Programmable: Not Verified Number of I/O: 36 Supplier Device Package: 44-QFP (10x10) Peripherals: LVD, POR, PWM Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Program Memory Size: 16KB (16K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 44-QFP Packaging: Bulk |
на замовлення 110 шт: термін постачання 21-31 дні (днів) |
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MC908AP8CFAE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 48LQFPDigiKey Programmable: Not Verified Number of I/O: 32 Supplier Device Package: 48-LQFP (7x7) Peripherals: LED, LVD, POR, PWM Connectivity: I2C, IRSCI, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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BY359-1500,127 | NXP USA Inc. |
Description: DIODE GEN PURP 1.5KV 10A TO220ACPackaging: Tube Package / Case: TO-220-2 Mounting Type: Through Hole Speed: Standard Recovery >500ns, > 200mA (Io) Reverse Recovery Time (trr): 600 ns Technology: Standard Current - Average Rectified (Io): 10A Supplier Device Package: TO-220AC Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 1500 V Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 20 A Current - Reverse Leakage @ Vr: 100 µA @ 1300 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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BY359X-1500S,127 | NXP USA Inc. |
Description: DIODE GEN PURP 1.5KV 7A TO220FPPackaging: Tube Package / Case: TO-220-2 Full Pack Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 350 ns Technology: Standard Current - Average Rectified (Io): 7A Supplier Device Package: TO-220FP Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 1500 V Voltage - Forward (Vf) (Max) @ If: 2 V @ 20 A Current - Reverse Leakage @ Vr: 100 µA @ 1300 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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BY359X-1500,127 | NXP USA Inc. |
Description: DIODE GEN PURP 1.5KV 10A TO220FPPackaging: Tube Package / Case: TO-220-2 Full Pack Mounting Type: Through Hole Speed: Standard Recovery >500ns, > 200mA (Io) Reverse Recovery Time (trr): 600 ns Technology: Standard Current - Average Rectified (Io): 10A Supplier Device Package: TO-220FP Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 1500 V Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 20 A Current - Reverse Leakage @ Vr: 100 µA @ 1300 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
FRDM665SPIEVB | NXP USA Inc. |
Description: MC33665A SPI EVAL BOARD Packaging: Box Function: CANbus Type: Interface Utilized IC / Part: MC33665A Supplied Contents: Board(s), Cable(s) Embedded: Yes, MCU |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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MC56F82748VLH | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 64KB (32K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 16x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
на замовлення 1519 шт: термін постачання 21-31 дні (днів) |
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| MC9S12DB128MPVE |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| MC9S12DB128CFUE |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| N74F541D,623 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Part Status: Obsolete
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Part Status: Obsolete
на замовлення 946 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 946+ | 23.87 грн |
| LM75BDP/DG,118 |
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Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
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В кошику
од. на суму грн.
| MC56F83766VLK |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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В кошику
од. на суму грн.
| MPXV2202DP | ![]() |
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Виробник: NXP USA Inc.
Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
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В кошику
од. на суму грн.
| MC9S08GT8AMFCE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 24
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Description: IC MCU 8BIT 8KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 24
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
на замовлення 490 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 58+ | 354.65 грн |
| MKL05Z32VLF4 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 41
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 14x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 41
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 14x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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В кошику
од. на суму грн.
| S9KEAZN8AMFKR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5000+ | 89.97 грн |
| S9KEAZN8AMFKR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
на замовлення 8505 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 176.43 грн |
| 10+ | 126.39 грн |
| 25+ | 115.47 грн |
| 100+ | 97.09 грн |
| 250+ | 91.72 грн |
| 500+ | 88.48 грн |
| 1000+ | 86.26 грн |
| PTN3222CUKZ |
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Виробник: NXP USA Inc.
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 8000+ | 75.18 грн |
| PTN3222CUKZ |
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Виробник: NXP USA Inc.
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
на замовлення 15654 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 148.74 грн |
| 10+ | 105.90 грн |
| 25+ | 96.54 грн |
| 100+ | 80.97 грн |
| 250+ | 76.38 грн |
| 500+ | 73.97 грн |
| 74LVC32245AEC,518 |
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Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Part Status: Active
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Bulk
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Part Status: Active
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Bulk
на замовлення 80605 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 89+ | 267.41 грн |
| MPXHZ6116A6U |
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Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Features: Temperature Compensated
Packaging: Tube
Part Status: Obsolete
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Supplier Device Package: 8-SSOP
Applications: Board Mount
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Output: 0.399 V ~ 4.645 V
Mounting Type: Surface Mount
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Features: Temperature Compensated
Packaging: Tube
Part Status: Obsolete
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Supplier Device Package: 8-SSOP
Applications: Board Mount
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Output: 0.399 V ~ 4.645 V
Mounting Type: Surface Mount
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| MPXHZ6116A6T1 |
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Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Part Status: Active
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Supplier Device Package: 8-SSOP
Applications: Board Mount
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Output: 0.399 V ~ 4.645 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Part Status: Active
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Supplier Device Package: 8-SSOP
Applications: Board Mount
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Output: 0.399 V ~ 4.645 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
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| STMP3770XXLAEA2N |
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на замовлення 6836 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 44+ | 474.39 грн |
| LX2160XN72232B |
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Виробник: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4
Number of Cores/Bus Width: 16 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4
Number of Cores/Bus Width: 16 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
на замовлення 33 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 46361.35 грн |
| MPC8560VTAQFC |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART
Part Status: Obsolete
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART
Part Status: Obsolete
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| MC9S08GT8ACFBE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Package / Case: 44-QFP
Number of I/O: 36
Part Status: Active
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Packaging: Tray
Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Package / Case: 44-QFP
Number of I/O: 36
Part Status: Active
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Packaging: Tray
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| NCF29A1XHN/0500IJ |
Виробник: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
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| NCF29A1XHN/0500IJ |
Виробник: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
на замовлення 5964 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 803.03 грн |
| 10+ | 604.92 грн |
| 25+ | 562.83 грн |
| 100+ | 484.81 грн |
| 250+ | 464.13 грн |
| 500+ | 451.66 грн |
| 1000+ | 441.53 грн |
| PESD5V0L5UV/DG125 |
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Виробник: NXP USA Inc.
Description: TVS DIODE 5VWM 12VC SOT666
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: SOT-666
Unidirectional Channels: 5
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 25W
Power Line Protection: No
Description: TVS DIODE 5VWM 12VC SOT666
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: SOT-666
Unidirectional Channels: 5
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 25W
Power Line Protection: No
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| KITPF5200SKTEVM |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR KL25Z, PF5200
Packaging: Box
Function: Automotive
Type: Power Management
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: KL25Z, PF5200
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 2-Channel (Dual)
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
Description: EVAL BOARD FOR KL25Z, PF5200
Packaging: Box
Function: Automotive
Type: Power Management
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: KL25Z, PF5200
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 2-Channel (Dual)
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 26340.18 грн |
| NT2H1001G0DUDV |
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Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: Die
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: Die
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| NCF3340AHN/00330Y |
Виробник: NXP USA Inc.
Description: AUTOMOTIVE QUALIFIED NFC CONTROL
Supplier Device Package: 40-HVQFN (6x6)
Standards: FeliCa, ISO 14443, MIFARE, NFC
Voltage - Supply: 2.3V ~ 5.5V
Type: RFID Reader/Transponder
Interface: I²C, SPI
Frequency: 24.12MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: AUTOMOTIVE QUALIFIED NFC CONTROL
Supplier Device Package: 40-HVQFN (6x6)
Standards: FeliCa, ISO 14443, MIFARE, NFC
Voltage - Supply: 2.3V ~ 5.5V
Type: RFID Reader/Transponder
Interface: I²C, SPI
Frequency: 24.12MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| MC56F8013VFAE |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
на замовлення 1259 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 870.28 грн |
| 10+ | 658.48 грн |
| 25+ | 613.57 грн |
| 100+ | 529.50 грн |
| 250+ | 507.42 грн |
| 500+ | 494.12 грн |
| 1250+ | 472.20 грн |
| LFBGAINTPY2A |
Виробник: NXP USA Inc.
Description: 473 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Description: 473 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
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| LFBGAINTPT5A |
Виробник: NXP USA Inc.
Description: NXP LEAD FREE 269 PIN. 0.80 MM P
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Description: NXP LEAD FREE 269 PIN. 0.80 MM P
Packaging: Bulk
Module/Board Type: Socket Module - BGA
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| LFBGAINTPH1A |
Виробник: NXP USA Inc.
Description: 100 PIN 1.0MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Description: 100 PIN 1.0MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
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| LFBGAINTPV1A |
Виробник: NXP USA Inc.
Description: 356 PIN 0.8 MM BGA TO PGA ADAPTE
Packaging: Bulk
Module/Board Type: Socket Adapter
Description: 356 PIN 0.8 MM BGA TO PGA ADAPTE
Packaging: Bulk
Module/Board Type: Socket Adapter
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| LFBGAINTPS2A |
Виробник: NXP USA Inc.
Description: 252 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Description: 252 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
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| LFBGAINTPT3A |
Виробник: NXP USA Inc.
Description: 257 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Description: 257 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
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| LFBGAINTPT4A |
Виробник: NXP USA Inc.
Description: 292 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Description: 292 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
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| LFBGAINTPZ3A |
Виробник: NXP USA Inc.
Description: 512 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Description: 512 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
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| LFBGAINTJ33QLT |
Виробник: NXP USA Inc.
Description: 208 PIN 1.0MM PGA TO 144 PIN 0.5
Packaging: Bulk
For Use With/Related Products: MPC563x
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC563x
Description: 208 PIN 1.0MM PGA TO 144 PIN 0.5
Packaging: Bulk
For Use With/Related Products: MPC563x
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC563x
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| MPC8270VVUPEA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 12865.89 грн |
| S912XDG128F2MAL |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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| TEA1938T/1J |
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Control Features: EN, Soft Start
Voltage - Start Up: 17.5 V
Fault Protection: Over Power, Over Temperature, Over Voltage
Supplier Device Package: 10-SO
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 25.5kHz ~ 128kHz
Operating Temperature: -25°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC OFFLINE SWITCH FLYBACK 10SO
Control Features: EN, Soft Start
Voltage - Start Up: 17.5 V
Fault Protection: Over Power, Over Temperature, Over Voltage
Supplier Device Package: 10-SO
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 25.5kHz ~ 128kHz
Operating Temperature: -25°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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| HT2ICS2002W/V6F/RZ |
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Виробник: NXP USA Inc.
Description: HITAG 2 TRANSPONDER IC
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: -0.5V ~ 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: Wafer
Description: HITAG 2 TRANSPONDER IC
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: -0.5V ~ 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: Wafer
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| MC908QVY4CDWER |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 132+ | 300.64 грн |
| MC908JK8MDWE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 20-SOIC
Peripherals: LED, LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 13x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Description: IC MCU 8BIT 8KB FLASH 20SOIC
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 20-SOIC
Peripherals: LED, LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 13x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
на замовлення 4522 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 167+ | 237.35 грн |
| MC908EY8AMFJE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
на замовлення 5439 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 130+ | 306.18 грн |
| MC908LK24CFUE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 24KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I²C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 24KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I²C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 2688 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 79+ | 501.60 грн |
| MC908JL16CDWE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28SOIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-SOIC
Peripherals: LED, LVD, POR, PWM
Connectivity: I²C, SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: HC08
Description: IC MCU 8BIT 16KB FLASH 28SOIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-SOIC
Peripherals: LED, LVD, POR, PWM
Connectivity: I²C, SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: HC08
на замовлення 1594 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 69+ | 580.71 грн |
| MC908GT16CFBER |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tape & Reel (TR)
Description: IC MCU 8BIT 16KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tape & Reel (TR)
на замовлення 1470 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 60+ | 659.83 грн |
| MC908GT16CFBE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Bulk
Description: IC MCU 8BIT 16KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Bulk
на замовлення 110 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 60+ | 659.83 грн |
| MC908AP8CFAE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LED, LVD, POR, PWM
Connectivity: I2C, IRSCI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 8BIT 8KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LED, LVD, POR, PWM
Connectivity: I2C, IRSCI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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| BY359-1500,127 |
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Виробник: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 10A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 600 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 20 A
Current - Reverse Leakage @ Vr: 100 µA @ 1300 V
Description: DIODE GEN PURP 1.5KV 10A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 600 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 20 A
Current - Reverse Leakage @ Vr: 100 µA @ 1300 V
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| BY359X-1500S,127 |
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Виробник: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 7A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 350 ns
Technology: Standard
Current - Average Rectified (Io): 7A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 20 A
Current - Reverse Leakage @ Vr: 100 µA @ 1300 V
Description: DIODE GEN PURP 1.5KV 7A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 350 ns
Technology: Standard
Current - Average Rectified (Io): 7A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 20 A
Current - Reverse Leakage @ Vr: 100 µA @ 1300 V
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| BY359X-1500,127 |
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Виробник: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 10A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 600 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 20 A
Current - Reverse Leakage @ Vr: 100 µA @ 1300 V
Description: DIODE GEN PURP 1.5KV 10A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 600 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 20 A
Current - Reverse Leakage @ Vr: 100 µA @ 1300 V
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| FRDM665SPIEVB |
Виробник: NXP USA Inc.
Description: MC33665A SPI EVAL BOARD
Packaging: Box
Function: CANbus
Type: Interface
Utilized IC / Part: MC33665A
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Description: MC33665A SPI EVAL BOARD
Packaging: Box
Function: CANbus
Type: Interface
Utilized IC / Part: MC33665A
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 21944.48 грн |
| MC56F82748VLH |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 1519 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 686.73 грн |
| 10+ | 514.56 грн |
| 25+ | 477.81 грн |
| 160+ | 400.66 грн |
| 320+ | 388.32 грн |
| 640+ | 378.16 грн |
| 1120+ | 365.20 грн |































