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MF3D2301DUD/00Z NXP USA Inc. Description: MF3D2301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
Part Status: Active
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ASL5008FHNZ NXP USA Inc. PB_ASL5xxxyHz.pdf Description: IC LED DRVR CTRLR PWM 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive
Current - Output / Channel: 800mA
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Part Status: Active
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74LVCH2T45GM125 74LVCH2T45GM125 NXP USA Inc. 74LVC_LVCH2T45.pdf Description: NOW NEXPERIA 74LVCH2T45GM - BUS
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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NX3L2G384GM125 NXP USA Inc. PHGLS27096-1.pdf?t.download=true&u=5oefqw Description: IC ANALOG SWITCH SPST
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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NCX2222GM125 NCX2222GM125 NXP USA Inc. PHGLS25881-1.pdf?t.download=true&u=5oefqw Description: DUAL COMPARATOR
Packaging: Bulk
Part Status: Active
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74AXP2G14GM125 74AXP2G14GM125 NXP USA Inc. 74AXP2G14.pdf Description: INVERTER, AXP SERIES
Packaging: Bulk
Part Status: Active
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SPC5645CF0VLT1 SPC5645CF0VLT1 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Part Status: Active
Number of I/O: 177
DigiKey Programmable: Not Verified
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SPC5644BK0MLU1 SPC5644BK0MLU1 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
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S9S12ZVL32F0MLCR S9S12ZVL32F0MLCR NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
2000+209.19 грн
Мінімальне замовлення: 2000
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S9S12ZVL32F0MLCR S9S12ZVL32F0MLCR NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
1+372.62 грн
10+273.98 грн
25+252.74 грн
100+215.25 грн
250+204.80 грн
500+198.50 грн
1000+190.14 грн
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S9KEAZN32AMLCR S9KEAZN32AMLCR NXP USA Inc. S9KEA64P64M20SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
2000+120.27 грн
4000+110.45 грн
Мінімальне замовлення: 2000
В кошику  од. на суму  грн.
S9KEAZN32AMLCR S9KEAZN32AMLCR NXP USA Inc. S9KEA64P64M20SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 7985 шт:
термін постачання 21-31 дні (днів)
2+224.40 грн
10+154.77 грн
25+147.26 грн
100+125.39 грн
250+118.73 грн
500+114.72 грн
1000+109.74 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
S9S12GN48J1VLCR S9S12GN48J1VLCR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
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TEA2016DB1519 TEA2016DB1519 NXP USA Inc. TEA2016AAT.pdf Description: EVAL BOARD TEA1995T TEA2016AAT
Packaging: Box
Voltage - Output: 12V
Current - Output: 20A
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1995T, TEA2016AAT
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary and Secondary Side with PFC
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 240W
Contents: Board(s)
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
1+27334.83 грн
В кошику  од. на суму  грн.
TEA2016AAT/1/S30Y TEA2016AAT/1/S30Y NXP USA Inc. TEA2016AAT.pdf Description: DCM/QR PFC + RESONANT POWER SUPP
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Part Status: Active
Current - Supply: 4.8 mA
на замовлення 2261 шт:
термін постачання 21-31 дні (днів)
2+231.85 грн
10+167.45 грн
25+153.51 грн
100+129.69 грн
250+122.84 грн
500+118.71 грн
1000+113.42 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
TEA2095T/1J TEA2095T/1J NXP USA Inc. TEA2095T.pdf Description: DUAL SYNCHRONOUS RECTIFICATION C
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.75V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: 8-SO
Part Status: Active
Current - Supply: 90 µA
на замовлення 1105 шт:
термін постачання 21-31 дні (днів)
4+105.16 грн
10+74.00 грн
25+67.20 грн
100+55.98 грн
250+52.59 грн
500+50.56 грн
1000+48.08 грн
Мінімальне замовлення: 4
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TEA2017DB1580 TEA2017DB1580 NXP USA Inc. UM11397.pdf Description: EVAL BOARD FOR TEA2017
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA2017
Supplied Contents: Board(s)
Primary Attributes: 90 ~ 264VAC Input Voltage
Embedded: No
Part Status: Active
Contents: Board(s)
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RDK01DB1563 RDK01DB1563 NXP USA Inc. UM11521.pdf Description: TEA2016 USB-I2C INTERFACE
Packaging: Bulk
For Use With/Related Products: TEA2016
Type: Programmer
Contents: Board(s), Cable(s)
Part Status: Active
Utilized IC / Part: TEA2016
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
1+15425.79 грн
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BUK764R0-75C,118 BUK764R0-75C,118 NXP USA Inc. BUK764R0-75C.pdf Description: PFET, 100A I(D), 75V, 0.004OHM,
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
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MRF6VP121KHR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Not For New Designs
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
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74HCT377D118 NXP USA Inc. PHGL-S-A0001541547-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 4mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 53 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Part Status: Active
Number of Bits per Element: 8
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)
1500+20.70 грн
Мінімальне замовлення: 1500
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PJF7992ATW/C1C/DJ PJF7992ATW/C1C/DJ NXP USA Inc. Description: IMMOBIL BASESTATION IC 20HTSSOP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Part Status: Obsolete
на замовлення 940 шт:
термін постачання 21-31 дні (днів)
2+321.28 грн
10+276.29 грн
25+248.66 грн
100+212.60 грн
250+191.86 грн
500+172.16 грн
Мінімальне замовлення: 2
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MIMX8SL1AVNFZAB MIMX8SL1AVNFZAB NXP USA Inc. IMX8XLB0AEC.pdf Description: I.MX8 DXL 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 388-LBGA (15x15)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4F
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Part Status: Active
Core Processor: ARM® Cortex®-A35
Ethernet: 1Gbps (2)
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX8DL1CVNFZAB MIMX8DL1CVNFZAB NXP USA Inc. IMX8XLB0IEC.pdf Description: I.MX 8DUALXLITE 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 388-LBGA (15x15)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4F
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Part Status: Active
Core Processor: ARM® Cortex®-A35
Ethernet: 1Gbps (2)
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX8SL1CVNFZAB MIMX8SL1CVNFZAB NXP USA Inc. IMX8XLB0IEC.pdf Description: I.MX 8DUALXLITE 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 388-LBGA (15x15)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4F
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Part Status: Active
Core Processor: ARM® Cortex®-A35
Ethernet: 1Gbps (2)
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX8DL1AVNFZABR MIMX8DL1AVNFZABR NXP USA Inc. IMX8XLB0AEC.pdf Description: I.MX8 DXL 15SQ
Packaging: Tape & Reel (TR)
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 388-LBGA (15x15)
Part Status: Active
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MIMX8DL1AVNFZAB MIMX8DL1AVNFZAB NXP USA Inc. IMX8XLB0AEC.pdf Description: I.MX8 DXL 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 388-LBGA (15x15)
Part Status: Active
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MC9S08AW48CFGER MC9S08AW48CFGER NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S08AW48CFGE MC9S08AW48CFGE NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S08AW48CPUE MC9S08AW48CPUE NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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P3041NSN7MMC P3041NSN7MMC NXP USA Inc. P3041PB.pdf Description: IC MPU QORIQ P3 1.2GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
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S9S12G48J1VLCR S9S12G48J1VLCR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
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JN5148/Z01515 NXP USA Inc. Description: IC RF TXRX+MCU 802.15.4 56-VFQFN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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JN5142N/001,515 JN5142N/001,515 NXP USA Inc. Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 16.5mA
Current - Transmitting: 15mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: 802.15.4
Part Status: Obsolete
DigiKey Programmable: Not Verified
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74LVC240APW/AU118 74LVC240APW/AU118 NXP USA Inc. PHGLS23711-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
на замовлення 37195 шт:
термін постачання 21-31 дні (днів)
1902+12.08 грн
Мінімальне замовлення: 1902
В кошику  од. на суму  грн.
P2010NXN2KFC NXP USA Inc. FSCLS11436-1.pdf?t.download=true&u=5oefqw Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Active
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P2010NSE2HFC NXP USA Inc. FSCLS11436-1.pdf?t.download=true&u=5oefqw Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
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P2010NXE2KFC P2010NXE2KFC NXP USA Inc. QP20XXFS.pdf Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Box
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
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P2010NXN2KFC P2010NXN2KFC NXP USA Inc. QP20XXFS.pdf Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Obsolete
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MPXAZ4115A6T1 MPXAZ4115A6T1 NXP USA Inc. MPXAZ4115A.pdf Description: SENSOR 16.68PSIA 4.8V
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.85V ~ 5.35V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
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MPXAZ4115A6T1 MPXAZ4115A6T1 NXP USA Inc. MPXAZ4115A.pdf Description: SENSOR 16.68PSIA 4.8V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.85V ~ 5.35V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
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PCU9661B,118 PCU9661B,118 NXP USA Inc. PCU9661.pdf Description: IC CONTROLLER 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Function: Controller
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 15mA
Protocol: I2C
Standards: IEEE 1149.1
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PCU9661B,118 PCU9661B,118 NXP USA Inc. PCU9661.pdf Description: IC CONTROLLER 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Function: Controller
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 15mA
Protocol: I2C
Standards: IEEE 1149.1
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PRF13750HR9697 NXP USA Inc. _MRF13750H.pdf?t.download=true&u=ovmfp3 Description: PRF13750HR - RF MOSFET LDMOS (DU
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
2+17424.70 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MF3MOD4101DA4/05,1 NXP USA Inc. Description: IC RFID TRANSP 13.56MHZ MOA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
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MPC8569ECVJANKGB MPC8569ECVJANKGB NXP USA Inc. MPC8569EEC.pdf Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100Mbps (8), 1Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR2, DDR3, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
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MKM14Z64CHH5 MKM14Z64CHH5 NXP USA Inc. MKMxxZxxCxx5.pdf Description: IC MCU 32BIT 64KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Part Status: Not For New Designs
Number of I/O: 20
DigiKey Programmable: Not Verified
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A5G35S004NT6 NXP USA Inc. A5G35S004N.pdf Description: AIRFAST RF POWER GAN TRANSISTOR,
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 4.3GHz
Power - Output: 24.5dBm
Gain: 16.9dB
Supplier Device Package: 6-PDFN (4x4.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 12 mA
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LPC55S69JBD64Y LPC55S69JBD64Y NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
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LPC55S69JEV98E LPC55S69JEV98E NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
на замовлення 239 шт:
термін постачання 21-31 дні (днів)
1+625.18 грн
10+468.06 грн
25+434.45 грн
100+373.10 грн
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LPC55S69JEV98Y LPC55S69JEV98Y NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH
Packaging: Tape & Reel (TR)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
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LPC55S69JBD64E LPC55S69JBD64E NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
на замовлення 57 шт:
термін постачання 21-31 дні (днів)
1+475.30 грн
10+426.60 грн
25+400.32 грн
В кошику  од. на суму  грн.
LPC55S69JBD100E LPC55S69JBD100E NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
на замовлення 15 шт:
термін постачання 21-31 дні (днів)
1+527.47 грн
10+473.01 грн
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MC9S08AC60CFGE MC9S08AC60CFGE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S08AC60MFUE MC9S08AC60MFUE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 1222 шт:
термін постачання 21-31 дні (днів)
49+472.78 грн
Мінімальне замовлення: 49
В кошику  од. на суму  грн.
MC9S08AC60MFUE MC9S08AC60MFUE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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BZX384-C27/ZLX BZX384-C27/ZLX NXP USA Inc. BZX384_SER.pdf Description: DIODE ZENER 27V 300MW SOD323
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOD-323
Part Status: Obsolete
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
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P5040NXN7TMC NXP USA Inc. FSCLS11784-1.pdf?t.download=true&u=5oefqw Description: QORIQ, 64-BIT POWER ARCH SOC, 4
Packaging: Bulk
Part Status: Active
на замовлення 63 шт:
термін постачання 21-31 дні (днів)
1+31698.67 грн
В кошику  од. на суму  грн.
MR-T1ETH8 MR-T1ETH8 NXP USA Inc. Description: EVAL BOARD FOR SE050
Packaging: Bulk
Function: Ethernet
Type: Interface
Utilized IC / Part: SE050, SJA1110, VR5510
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 40V Operating Voltage
Embedded: No
Part Status: Active
Contents: Board(s), Cable(s), Accessories
Secondary Attributes: On-Board LEDs
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BAP64LX,315 BAP64LX,315 NXP USA Inc. BAP64LX.pdf Description: RF DIODE PIN 60V 150MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)
10000+6.30 грн
20000+5.92 грн
Мінімальне замовлення: 10000
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MF3D2301DUD/00Z
Виробник: NXP USA Inc.
Description: MF3D2301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
Part Status: Active
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ASL5008FHNZ PB_ASL5xxxyHz.pdf
Виробник: NXP USA Inc.
Description: IC LED DRVR CTRLR PWM 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive
Current - Output / Channel: 800mA
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Part Status: Active
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74LVCH2T45GM125 74LVC_LVCH2T45.pdf
74LVCH2T45GM125
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74LVCH2T45GM - BUS
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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NX3L2G384GM125 PHGLS27096-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: IC ANALOG SWITCH SPST
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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NCX2222GM125 PHGLS25881-1.pdf?t.download=true&u=5oefqw
NCX2222GM125
Виробник: NXP USA Inc.
Description: DUAL COMPARATOR
Packaging: Bulk
Part Status: Active
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74AXP2G14GM125 74AXP2G14.pdf
74AXP2G14GM125
Виробник: NXP USA Inc.
Description: INVERTER, AXP SERIES
Packaging: Bulk
Part Status: Active
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SPC5645CF0VLT1
SPC5645CF0VLT1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Part Status: Active
Number of I/O: 177
DigiKey Programmable: Not Verified
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SPC5644BK0MLU1
SPC5644BK0MLU1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
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S9S12ZVL32F0MLCR S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVL32F0MLCR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2000+209.19 грн
Мінімальне замовлення: 2000
В кошику  од. на суму  грн.
S9S12ZVL32F0MLCR S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVL32F0MLCR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+372.62 грн
10+273.98 грн
25+252.74 грн
100+215.25 грн
250+204.80 грн
500+198.50 грн
1000+190.14 грн
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S9KEAZN32AMLCR S9KEA64P64M20SF0.pdf
S9KEAZN32AMLCR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2000+120.27 грн
4000+110.45 грн
Мінімальне замовлення: 2000
В кошику  од. на суму  грн.
S9KEAZN32AMLCR S9KEA64P64M20SF0.pdf
S9KEAZN32AMLCR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 7985 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+224.40 грн
10+154.77 грн
25+147.26 грн
100+125.39 грн
250+118.73 грн
500+114.72 грн
1000+109.74 грн
Мінімальне замовлення: 2
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S9S12GN48J1VLCR
S9S12GN48J1VLCR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
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TEA2016DB1519 TEA2016AAT.pdf
TEA2016DB1519
Виробник: NXP USA Inc.
Description: EVAL BOARD TEA1995T TEA2016AAT
Packaging: Box
Voltage - Output: 12V
Current - Output: 20A
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1995T, TEA2016AAT
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary and Secondary Side with PFC
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 240W
Contents: Board(s)
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+27334.83 грн
В кошику  од. на суму  грн.
TEA2016AAT/1/S30Y TEA2016AAT.pdf
TEA2016AAT/1/S30Y
Виробник: NXP USA Inc.
Description: DCM/QR PFC + RESONANT POWER SUPP
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Part Status: Active
Current - Supply: 4.8 mA
на замовлення 2261 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+231.85 грн
10+167.45 грн
25+153.51 грн
100+129.69 грн
250+122.84 грн
500+118.71 грн
1000+113.42 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
TEA2095T/1J TEA2095T.pdf
TEA2095T/1J
Виробник: NXP USA Inc.
Description: DUAL SYNCHRONOUS RECTIFICATION C
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.75V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: 8-SO
Part Status: Active
Current - Supply: 90 µA
на замовлення 1105 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+105.16 грн
10+74.00 грн
25+67.20 грн
100+55.98 грн
250+52.59 грн
500+50.56 грн
1000+48.08 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
TEA2017DB1580 UM11397.pdf
TEA2017DB1580
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TEA2017
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA2017
Supplied Contents: Board(s)
Primary Attributes: 90 ~ 264VAC Input Voltage
Embedded: No
Part Status: Active
Contents: Board(s)
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RDK01DB1563 UM11521.pdf
RDK01DB1563
Виробник: NXP USA Inc.
Description: TEA2016 USB-I2C INTERFACE
Packaging: Bulk
For Use With/Related Products: TEA2016
Type: Programmer
Contents: Board(s), Cable(s)
Part Status: Active
Utilized IC / Part: TEA2016
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+15425.79 грн
В кошику  од. на суму  грн.
BUK764R0-75C,118 BUK764R0-75C.pdf
BUK764R0-75C,118
Виробник: NXP USA Inc.
Description: PFET, 100A I(D), 75V, 0.004OHM,
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
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MRF6VP121KHR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Not For New Designs
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
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74HCT377D118 PHGL-S-A0001541547-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 4mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 53 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Part Status: Active
Number of Bits per Element: 8
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1500+20.70 грн
Мінімальне замовлення: 1500
В кошику  од. на суму  грн.
PJF7992ATW/C1C/DJ
PJF7992ATW/C1C/DJ
Виробник: NXP USA Inc.
Description: IMMOBIL BASESTATION IC 20HTSSOP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Part Status: Obsolete
на замовлення 940 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+321.28 грн
10+276.29 грн
25+248.66 грн
100+212.60 грн
250+191.86 грн
500+172.16 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MIMX8SL1AVNFZAB IMX8XLB0AEC.pdf
MIMX8SL1AVNFZAB
Виробник: NXP USA Inc.
Description: I.MX8 DXL 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 388-LBGA (15x15)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4F
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Part Status: Active
Core Processor: ARM® Cortex®-A35
Ethernet: 1Gbps (2)
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX8DL1CVNFZAB IMX8XLB0IEC.pdf
MIMX8DL1CVNFZAB
Виробник: NXP USA Inc.
Description: I.MX 8DUALXLITE 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 388-LBGA (15x15)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4F
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Part Status: Active
Core Processor: ARM® Cortex®-A35
Ethernet: 1Gbps (2)
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX8SL1CVNFZAB IMX8XLB0IEC.pdf
MIMX8SL1CVNFZAB
Виробник: NXP USA Inc.
Description: I.MX 8DUALXLITE 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 388-LBGA (15x15)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4F
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Part Status: Active
Core Processor: ARM® Cortex®-A35
Ethernet: 1Gbps (2)
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX8DL1AVNFZABR IMX8XLB0AEC.pdf
MIMX8DL1AVNFZABR
Виробник: NXP USA Inc.
Description: I.MX8 DXL 15SQ
Packaging: Tape & Reel (TR)
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 388-LBGA (15x15)
Part Status: Active
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MIMX8DL1AVNFZAB IMX8XLB0AEC.pdf
MIMX8DL1AVNFZAB
Виробник: NXP USA Inc.
Description: I.MX8 DXL 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 388-LBGA (15x15)
Part Status: Active
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MC9S08AW48CFGER MC9S08AW60.pdf
MC9S08AW48CFGER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S08AW48CFGE MC9S08AW60.pdf
MC9S08AW48CFGE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S08AW48CPUE MC9S08AW60.pdf
MC9S08AW48CPUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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P3041NSN7MMC P3041PB.pdf
P3041NSN7MMC
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P3 1.2GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
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S9S12G48J1VLCR
S9S12G48J1VLCR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
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JN5148/Z01515
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56-VFQFN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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JN5142N/001,515
JN5142N/001,515
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 16.5mA
Current - Transmitting: 15mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: 802.15.4
Part Status: Obsolete
DigiKey Programmable: Not Verified
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74LVC240APW/AU118 PHGLS23711-1.pdf?t.download=true&u=5oefqw
74LVC240APW/AU118
Виробник: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
на замовлення 37195 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1902+12.08 грн
Мінімальне замовлення: 1902
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P2010NXN2KFC FSCLS11436-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Active
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P2010NSE2HFC FSCLS11436-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
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P2010NXE2KFC QP20XXFS.pdf
P2010NXE2KFC
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Box
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
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P2010NXN2KFC QP20XXFS.pdf
P2010NXN2KFC
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Obsolete
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MPXAZ4115A6T1 MPXAZ4115A.pdf
MPXAZ4115A6T1
Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.8V
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.85V ~ 5.35V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
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MPXAZ4115A6T1 MPXAZ4115A.pdf
MPXAZ4115A6T1
Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.8V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.85V ~ 5.35V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
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PCU9661B,118 PCU9661.pdf
PCU9661B,118
Виробник: NXP USA Inc.
Description: IC CONTROLLER 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Function: Controller
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 15mA
Protocol: I2C
Standards: IEEE 1149.1
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PCU9661B,118 PCU9661.pdf
PCU9661B,118
Виробник: NXP USA Inc.
Description: IC CONTROLLER 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Function: Controller
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 15mA
Protocol: I2C
Standards: IEEE 1149.1
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PRF13750HR9697 _MRF13750H.pdf?t.download=true&u=ovmfp3
Виробник: NXP USA Inc.
Description: PRF13750HR - RF MOSFET LDMOS (DU
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+17424.70 грн
Мінімальне замовлення: 2
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MF3MOD4101DA4/05,1
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ MOA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
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MPC8569ECVJANKGB MPC8569EEC.pdf
MPC8569ECVJANKGB
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100Mbps (8), 1Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR2, DDR3, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
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MKM14Z64CHH5 MKMxxZxxCxx5.pdf
MKM14Z64CHH5
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Part Status: Not For New Designs
Number of I/O: 20
DigiKey Programmable: Not Verified
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A5G35S004NT6 A5G35S004N.pdf
Виробник: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR,
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 4.3GHz
Power - Output: 24.5dBm
Gain: 16.9dB
Supplier Device Package: 6-PDFN (4x4.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 12 mA
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LPC55S69JBD64Y LPC55S6x.pdf
LPC55S69JBD64Y
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
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LPC55S69JEV98E LPC55S6x.pdf
LPC55S69JEV98E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
на замовлення 239 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+625.18 грн
10+468.06 грн
25+434.45 грн
100+373.10 грн
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LPC55S69JEV98Y LPC55S6x.pdf
LPC55S69JEV98Y
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH
Packaging: Tape & Reel (TR)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
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LPC55S69JBD64E LPC55S6x.pdf
LPC55S69JBD64E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
на замовлення 57 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+475.30 грн
10+426.60 грн
25+400.32 грн
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LPC55S69JBD100E LPC55S6x.pdf
LPC55S69JBD100E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
на замовлення 15 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+527.47 грн
10+473.01 грн
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MC9S08AC60CFGE MC9S08AC60AD.pdf
MC9S08AC60CFGE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S08AC60MFUE MC9S08AC60.pdf
MC9S08AC60MFUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 1222 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
49+472.78 грн
Мінімальне замовлення: 49
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MC9S08AC60MFUE MC9S08AC60.pdf
MC9S08AC60MFUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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BZX384-C27/ZLX BZX384_SER.pdf
BZX384-C27/ZLX
Виробник: NXP USA Inc.
Description: DIODE ZENER 27V 300MW SOD323
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOD-323
Part Status: Obsolete
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
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P5040NXN7TMC FSCLS11784-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: QORIQ, 64-BIT POWER ARCH SOC, 4
Packaging: Bulk
Part Status: Active
на замовлення 63 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+31698.67 грн
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MR-T1ETH8
MR-T1ETH8
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR SE050
Packaging: Bulk
Function: Ethernet
Type: Interface
Utilized IC / Part: SE050, SJA1110, VR5510
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 40V Operating Voltage
Embedded: No
Part Status: Active
Contents: Board(s), Cable(s), Accessories
Secondary Attributes: On-Board LEDs
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BAP64LX,315 BAP64LX.pdf
BAP64LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 150MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10000+6.30 грн
20000+5.92 грн
Мінімальне замовлення: 10000
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