Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35348) > Сторінка 484 з 590
Фото | Назва | Виробник | Інформація |
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T2080NXN8P1B | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
T2080NXN8TTB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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1PS70SB16,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 30V 200MA SOT323 Packaging: Bulk Part Status: Active |
на замовлення 320700 шт: термін постачання 21-31 дні (днів) |
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1PS70SB46,115 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
на замовлення 418659 шт: термін постачання 21-31 дні (днів) |
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1PS70SB45,115 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
на замовлення 366000 шт: термін постачання 21-31 дні (днів) |
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MPC5566MZP132 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 3MB (3M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Part Status: Active Number of I/O: 256 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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QN9022/DY | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 128kB Flash Type: TxRx Only Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Power - Output: 4dBm Protocol: Bluetooth v4.0 Current - Receiving: 9.2mA Current - Transmitting: 8.8mA Supplier Device Package: 40-HVQFN (5x5) GPIO: 31 RF Family/Standard: Bluetooth Serial Interfaces: I²C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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QN9022/DY | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 128kB Flash Type: TxRx Only Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Power - Output: 4dBm Protocol: Bluetooth v4.0 Current - Receiving: 9.2mA Current - Transmitting: 8.8mA Supplier Device Package: 40-HVQFN (5x5) GPIO: 31 RF Family/Standard: Bluetooth Serial Interfaces: I²C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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IP4364CX8/LF/P,135 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
на замовлення 28422 шт: термін постачання 21-31 дні (днів) |
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LPC54S016JBD100 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100LQFP Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 180MHz RAM Size: 360K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 2899 шт: термін постачання 21-31 дні (днів) |
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74LVC1G58GW/S901125 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PCA9550D,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Outputs: 2 Frequency: 400kHz Type: Linear Operating Temperature: -40°C ~ 85°C (TA) Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 8-SO Dimming: I²C Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Part Status: Obsolete |
на замовлення 3925 шт: термін постачання 21-31 дні (днів) |
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MPC8314VRAGDA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Part Status: Active Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM |
на замовлення 205 шт: термін постачання 21-31 дні (днів) |
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MK22FX512VMD12 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 42x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-MAPBGA (13x13) Part Status: Not For New Designs Number of I/O: 100 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TEF6640HW/V101518 | NXP USA Inc. |
Description: IC ONE-CHIP RADIO 64HTQFP Packaging: Bulk Part Status: Active |
на замовлення 161850 шт: термін постачання 21-31 дні (днів) |
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SAF4000EL/101S23EK | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MC33FS5502Y0ES | NXP USA Inc. |
Description: HIGH VOLTAGE PMIC QFN56 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Power Supplies Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 512 шт: термін постачання 21-31 дні (днів) |
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74ALVCH16374DGG11 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-TFSOP (0.240", 6.10mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 2 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.2V ~ 3.6V Current - Quiescent (Iq): 40 µA Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 350 MHz Input Capacitance: 5 pF Supplier Device Package: 48-TSSOP Max Propagation Delay @ V, Max CL: 3.4ns @ 3.3V, 50pF Part Status: Active Number of Bits per Element: 8 |
на замовлення 897 шт: термін постачання 21-31 дні (днів) |
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74ALVCH16823DL,512 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 56-BSSOP (0.295", 7.50mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 2 Function: Master Reset Type: D-Type Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 350 MHz Input Capacitance: 5 pF Supplier Device Package: 56-SSOP Max Propagation Delay @ V, Max CL: 3.7ns @ 3.3V, 50pF Part Status: Active Number of Bits per Element: 9 |
на замовлення 1326 шт: термін постачання 21-31 дні (днів) |
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P5CD016UE/T1AL828V | NXP USA Inc. |
Description: P5CD016UE/T1AL828V Packaging: Bulk Speed: 30MHz Program Memory Size: 264KB (264K x 8) RAM Size: 7.5K x 8 Operating Temperature: -25°C ~ 85°C Program Memory Type: ROM EEPROM Size: 16K x 8 Core Processor: Secure MX51 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.6V Connectivity: ISO 7816, ISO 14443, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MK51DN512CLQ10 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 41x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 94 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74AUP1G175GN,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Current - Quiescent (Iq): 500 nA Current - Output High, Low: 4mA, 4mA Trigger Type: Positive Edge Clock Frequency: 300 MHz Input Capacitance: 0.8 pF Supplier Device Package: 6-XSON (0.9x1) Max Propagation Delay @ V, Max CL: 5.7ns @ 3.3V, 30pF Part Status: Active Number of Bits per Element: 1 |
на замовлення 19000 шт: термін постачання 21-31 дні (днів) |
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S912XHY256F0MLM | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP Packaging: Bulk Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 8K x 8 Core Processor: HCS12X Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 88 DigiKey Programmable: Not Verified |
на замовлення 212 шт: термін постачання 21-31 дні (днів) |
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S912XHY256F0CLM | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 8K x 8 Core Processor: HCS12X Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 88 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MK51DN256ZCMD10 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LBGA Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 41x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 144-MAPBGA (13x13) Part Status: Not For New Designs Number of I/O: 94 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TJA1042BT/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Supplier Device Package: 8-SO Part Status: Active Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.5 ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Receiver Hysteresis: 120 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TJA1042BT/0Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Supplier Device Package: 8-SO Part Status: Active Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.5 ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Receiver Hysteresis: 120 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TJA1042CT/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Supplier Device Package: 8-SO Part Status: Active Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.5 ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Receiver Hysteresis: 120 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TJA1042CT/0Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Supplier Device Package: 8-SO Part Status: Active Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.5 ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Receiver Hysteresis: 120 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
на замовлення 1335 шт: термін постачання 21-31 дні (днів) |
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FS32K116BRT0MLFT | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 17K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 13x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 43 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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BA891,115 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SC-79, SOD-523 Diode Type: Standard - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz Resistance @ If, F: 500mOhm @ 10mA, 100MHz Voltage - Peak Reverse (Max): 35V Supplier Device Package: SOD-523 Part Status: Active Current - Max: 100 mA Power Dissipation (Max): 715 mW |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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BA891,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: SC-79, SOD-523 Diode Type: Standard - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz Resistance @ If, F: 500mOhm @ 10mA, 100MHz Voltage - Peak Reverse (Max): 35V Supplier Device Package: SOD-523 Part Status: Active Current - Max: 100 mA Power Dissipation (Max): 715 mW |
на замовлення 1475 шт: термін постачання 21-31 дні (днів) |
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MPC8343CZQADDB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: DUART, I2C, PCI, SPI |
на замовлення 105 шт: термін постачання 21-31 дні (днів) |
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MPC8343CZQADDB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: DUART, I2C, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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S912XEP768W1CAG | NXP USA Inc. |
Description: IC MCU 16BIT 768KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 768KB (768K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 119 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LS2088AXN7TTB | NXP USA Inc. |
Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA Packaging: Tray Package / Case: 1292-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 1292-FCPBGA (37.5x37.5) Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 8 Core, 64-Bit RAM Controllers: DDR4 SATA: SATA 6Gbps (2) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MMA25312BT1 | NXP USA Inc. |
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN Packaging: Tape & Reel (TR) Package / Case: 12-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.7GHz RF Type: WiMax, WLAN Voltage - Supply: 3V ~ 5V Gain: 26dB Current - Supply: 124mA Noise Figure: 3.8dB P1dB: 31dBm Test Frequency: 2.5GHz Supplier Device Package: 12-QFN (3x3) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MMA25312BT1 | NXP USA Inc. |
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN Packaging: Cut Tape (CT) Package / Case: 12-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.7GHz RF Type: WiMax, WLAN Voltage - Supply: 3V ~ 5V Gain: 26dB Current - Supply: 124mA Noise Figure: 3.8dB P1dB: 31dBm Test Frequency: 2.5GHz Supplier Device Package: 12-QFN (3x3) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC56F83783AVLHA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 20x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, I2C, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 68 DigiKey Programmable: Not Verified |
на замовлення 160 шт: термін постачання 21-31 дні (днів) |
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MC56F83783AMLHA | NXP USA Inc. |
Description: 32-BIT DSC, 56800EX CORE, 256KB Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 20x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FXLS93733AESR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Output Type: I2C, SPI Operating Temperature: -40°C ~ 125°C Part Status: Active Package / Case: 16-LQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 16-HLQFNR (4x4) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FS32K116LIT0MFMT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 17K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 13x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 43 Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FX32K116LAT0MFMT | NXP USA Inc. |
![]() Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FB32K116BFT0MFMT | NXP USA Inc. |
Description: S32K116, M0+, FLASH 128K, RAM 17 Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FH32K116LAT0MFMT | NXP USA Inc. |
Description: S32K116, M0+, FLASH 128K, RAM 17 Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FB32K116BRT0MFMT | NXP USA Inc. |
Description: S32K116, M0+, FLASH 128K, RAM 17 Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FH32K116LFT0MFMT | NXP USA Inc. |
Description: S32K116 32-BIT MCU, ARM CORTEX-M Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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NCX2200GS125 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
на замовлення 744606 шт: термін постачання 21-31 дні (днів) |
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NCX2202GM | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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NCX2220GU,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-XFDFN Exposed Pad Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 2 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: DFN1714-8 Propagation Delay (Max): 0.8µs Current - Quiescent (Max): 5µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV Part Status: Obsolete |
на замовлення 81829 шт: термін постачання 21-31 дні (днів) |
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NCX2220GT,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-XFDFN Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 2 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 8-XSON, SOT833-1 (1.95x1) Propagation Delay (Max): 0.8µs Current - Quiescent (Max): 5µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA Current - Output (Typ): 68mA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 9mV Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
MKM34Z128ACLL5557 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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SA606DK/01,118 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 20-LSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Frequency: 150MHz RF Type: Cellular, ASK, FSK, VHF Voltage - Supply: 2.7V ~ 7V Gain: 17dB Current - Supply: 3.5mA Secondary Attributes: Up Converter Noise Figure: 6.2dB Number of Mixers: 2 Supplier Device Package: 20-SSOP Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KW45Z41083AFPBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: DMA, PWM, WDT Supplier Device Package: 40-HVQFN (6x6) Part Status: Active Number of I/O: 22 Data Converters: A/D 14x16b SAR Connectivity: CANbus, HMI, I2C, SPI, UART/USART Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KW45Z41082AFTBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: DMA, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 29 Data Converters: A/D 14x16b SAR Connectivity: CANbus, HMI, I2C, SPI, UART/USART Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KW45Z41052AFPBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: DMA, PWM, WDT Supplier Device Package: 40-HVQFN (6x6) Part Status: Active Number of I/O: 22 Data Converters: A/D 14x16b SAR Connectivity: CANbus, HMI, I2C, SPI, UART/USART Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KW45Z41082AFPBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: DMA, PWM, WDT Supplier Device Package: 40-HVQFN (6x6) Part Status: Active Number of I/O: 22 Data Converters: A/D 14x16b SAR Connectivity: CANbus, HMI, I2C, SPI, UART/USART Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KW45Z41053AFTBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: DMA, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 29 Data Converters: A/D 14x16b SAR Connectivity: CANbus, HMI, I2C, SPI, UART/USART Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KW45Z41083AFTBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: DMA, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 29 Data Converters: A/D 14x16b SAR Connectivity: CANbus, HMI, I2C, SPI, UART/USART Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KW45Z41053AFPBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: DMA, PWM, WDT Supplier Device Package: 40-HVQFN (6x6) Part Status: Active Number of I/O: 22 Data Converters: A/D 14x16b SAR Connectivity: CANbus, HMI, I2C, SPI, UART/USART Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. |
T2080NXN8P1B |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
T2080NXN8TTB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
1PS70SB16,115 |
Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 30V 200MA SOT323
Packaging: Bulk
Part Status: Active
Description: DIODE SCHOTTKY 30V 200MA SOT323
Packaging: Bulk
Part Status: Active
на замовлення 320700 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
9982+ | 2.36 грн |
1PS70SB46,115 |
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Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 40V 120MA SOT323
Packaging: Bulk
Part Status: Active
Description: DIODE SCHOTTKY 40V 120MA SOT323
Packaging: Bulk
Part Status: Active
на замовлення 418659 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
10051+ | 2.47 грн |
1PS70SB45,115 |
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Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 40V 120MA SOT323
Packaging: Bulk
Part Status: Active
Description: DIODE SCHOTTKY 40V 120MA SOT323
Packaging: Bulk
Part Status: Active
на замовлення 366000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
9982+ | 2.35 грн |
MPC5566MZP132 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 256
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
QN9022/DY |
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Виробник: NXP USA Inc.
Description: IC RF TXRX BLUETOOTH 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 40-HVQFN (5x5)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX BLUETOOTH 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 40-HVQFN (5x5)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3000+ | 209.65 грн |
QN9022/DY |
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Виробник: NXP USA Inc.
Description: IC RF TXRX BLUETOOTH 40VFQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 40-HVQFN (5x5)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX BLUETOOTH 40VFQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 40-HVQFN (5x5)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
IP4364CX8/LF/P,135 |
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на замовлення 28422 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2959+ | 7.85 грн |
LPC54S016JBD100 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 2899 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
82+ | 505.87 грн |
PCA9550D,112 |
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Виробник: NXP USA Inc.
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I²C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I²C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
на замовлення 3925 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
357+ | 69.21 грн |
MPC8314VRAGDA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Active
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Active
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
на замовлення 205 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 4820.62 грн |
10+ | 3836.56 грн |
36+ | 3568.74 грн |
108+ | 3195.03 грн |
MK22FX512VMD12 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Not For New Designs
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Not For New Designs
Number of I/O: 100
DigiKey Programmable: Not Verified
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TEF6640HW/V101518 |
на замовлення 161850 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
39+ | 612.66 грн |
MC33FS5502Y0ES |
Виробник: NXP USA Inc.
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 512 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 467.97 грн |
10+ | 345.76 грн |
25+ | 319.45 грн |
80+ | 276.33 грн |
260+ | 259.22 грн |
74ALVCH16374DGG11 |
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Виробник: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 48-TSSOP
Max Propagation Delay @ V, Max CL: 3.4ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 48-TSSOP
Max Propagation Delay @ V, Max CL: 3.4ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
на замовлення 897 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
602+ | 41.19 грн |
74ALVCH16823DL,512 |
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Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 9BIT 56SSOP
Packaging: Bulk
Package / Case: 56-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 56-SSOP
Max Propagation Delay @ V, Max CL: 3.7ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 9
Description: IC FF D-TYPE DUAL 9BIT 56SSOP
Packaging: Bulk
Package / Case: 56-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 56-SSOP
Max Propagation Delay @ V, Max CL: 3.7ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 9
на замовлення 1326 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
268+ | 87.83 грн |
P5CD016UE/T1AL828V |
Виробник: NXP USA Inc.
Description: P5CD016UE/T1AL828V
Packaging: Bulk
Speed: 30MHz
Program Memory Size: 264KB (264K x 8)
RAM Size: 7.5K x 8
Operating Temperature: -25°C ~ 85°C
Program Memory Type: ROM
EEPROM Size: 16K x 8
Core Processor: Secure MX51
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.6V
Connectivity: ISO 7816, ISO 14443, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: P5CD016UE/T1AL828V
Packaging: Bulk
Speed: 30MHz
Program Memory Size: 264KB (264K x 8)
RAM Size: 7.5K x 8
Operating Temperature: -25°C ~ 85°C
Program Memory Type: ROM
EEPROM Size: 16K x 8
Core Processor: Secure MX51
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.6V
Connectivity: ISO 7816, ISO 14443, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MK51DN512CLQ10 |
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Виробник: NXP USA Inc.
Description: KINETIS K51: 100MHZ CORTEX-M4 ME
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 94
DigiKey Programmable: Not Verified
Description: KINETIS K51: 100MHZ CORTEX-M4 ME
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 94
DigiKey Programmable: Not Verified
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74AUP1G175GN,132 |
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Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON (0.9x1)
Max Propagation Delay @ V, Max CL: 5.7ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON (0.9x1)
Max Propagation Delay @ V, Max CL: 5.7ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
на замовлення 19000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1362+ | 16.85 грн |
S912XHY256F0MLM |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 88
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 88
DigiKey Programmable: Not Verified
на замовлення 212 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
33+ | 714.49 грн |
S912XHY256F0CLM |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 88
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 88
DigiKey Programmable: Not Verified
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MK51DN256ZCMD10 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Not For New Designs
Number of I/O: 94
DigiKey Programmable: Not Verified
Description: IC MCU 32B 256KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Not For New Designs
Number of I/O: 94
DigiKey Programmable: Not Verified
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TJA1042BT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1042BT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1042CT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1042CT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1335 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
6+ | 58.50 грн |
10+ | 40.15 грн |
25+ | 36.08 грн |
100+ | 29.72 грн |
250+ | 27.73 грн |
500+ | 26.54 грн |
1000+ | 25.13 грн |
FS32K116BRT0MLFT |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
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BA891,115 |
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Виробник: NXP USA Inc.
Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
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BA891,115 |
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Виробник: NXP USA Inc.
Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
на замовлення 1475 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
37+ | 9.06 грн |
55+ | 5.87 грн |
62+ | 5.17 грн |
100+ | 4.09 грн |
250+ | 3.73 грн |
500+ | 3.51 грн |
1000+ | 3.28 грн |
MPC8343CZQADDB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: DUART, I2C, PCI, SPI
на замовлення 105 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
7+ | 3846.42 грн |
MPC8343CZQADDB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: DUART, I2C, PCI, SPI
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S912XEP768W1CAG |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
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LS2088AXN7TTB |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Part Status: Active
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MMA25312BT1 |
Виробник: NXP USA Inc.
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
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MMA25312BT1 |
Виробник: NXP USA Inc.
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
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MC56F83783AVLHA |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
на замовлення 160 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1345.42 грн |
10+ | 1035.44 грн |
160+ | 874.50 грн |
MC56F83783AMLHA |
Виробник: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 256KB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
Description: 32-BIT DSC, 56800EX CORE, 256KB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
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FXLS93733AESR2 |
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Виробник: NXP USA Inc.
Description: PSI5 YZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Output Type: I2C, SPI
Operating Temperature: -40°C ~ 125°C
Part Status: Active
Package / Case: 16-LQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 16-HLQFNR (4x4)
Description: PSI5 YZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Output Type: I2C, SPI
Operating Temperature: -40°C ~ 125°C
Part Status: Active
Package / Case: 16-LQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 16-HLQFNR (4x4)
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FS32K116LIT0MFMT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128MB FLASH 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 43
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Description: IC MCU 32BIT 128MB FLASH 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 43
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
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FX32K116LAT0MFMT |
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Виробник: NXP USA Inc.
Description: S32K116 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
Part Status: Active
Description: S32K116 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
Part Status: Active
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FB32K116BFT0MFMT |
Виробник: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
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FH32K116LAT0MFMT |
Виробник: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
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FB32K116BRT0MFMT |
Виробник: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
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FH32K116LFT0MFMT |
Виробник: NXP USA Inc.
Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Part Status: Active
Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Part Status: Active
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NCX2200GS125 |
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на замовлення 744606 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2240+ | 10.71 грн |
NCX2202GM |
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Виробник: NXP USA Inc.
Description: LOW VOLTAGE COMPARATOR; OPEN-DRA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: LOW VOLTAGE COMPARATOR; OPEN-DRA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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NCX2220GU,115 |
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Виробник: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Bulk
Package / Case: 8-XFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Bulk
Package / Case: 8-XFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
на замовлення 81829 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
751+ | 30.86 грн |
NCX2220GT,115 |
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Виробник: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
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MKM34Z128ACLL5557 |
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Виробник: NXP USA Inc.
Description: KINETIS KM34: 50MHZ CORTEX-M0+ M
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: KINETIS KM34: 50MHZ CORTEX-M0+ M
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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SA606DK/01,118 |
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Виробник: NXP USA Inc.
Description: IC MIXER 150MHZ UP CONVRT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: Cellular, ASK, FSK, VHF
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: Up Converter
Noise Figure: 6.2dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Description: IC MIXER 150MHZ UP CONVRT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: Cellular, ASK, FSK, VHF
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: Up Converter
Noise Figure: 6.2dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Part Status: Obsolete
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KW45Z41083AFPBT |
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Виробник: NXP USA Inc.
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41082AFTBT |
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Виробник: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 29
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 29
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41052AFPBT |
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Виробник: NXP USA Inc.
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41082AFPBT |
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Виробник: NXP USA Inc.
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
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KW45Z41053AFTBT |
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Виробник: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 29
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 29
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
KW45Z41083AFTBT |
![]() |
Виробник: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 29
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 29
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
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од. на суму грн.
KW45Z41053AFPBT |
![]() |
Виробник: NXP USA Inc.
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
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В кошику
од. на суму грн.