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PEMI6QFN/WG,132 PEMI6QFN/WG,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/11PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
на замовлення 24000 шт:
термін постачання 21-31 дні (днів)
1902+12.66 грн
Мінімальне замовлення: 1902
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PEMI2STD/RG,115 PEMI2STD/RG,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/11PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 11pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
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PEMI2STD/RG,115 PEMI2STD/RG,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 11pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
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T1013NSN7KQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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MC34VR500V6ESR2 MC34VR500V6ESR2 NXP USA Inc. MC34VR500.pdf Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
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MC33FS6510LAER2 MC33FS6510LAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
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MC908MR32VFUE-NXP NXP USA Inc. FSCLS07124-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 44
DigiKey Programmable: Not Verified
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MC908JL3ECDWE MC908JL3ECDWE NXP USA Inc. MC68HC908JL3E.pdf Description: IC MCU 8BIT 4KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Part Status: Not For New Designs
Number of I/O: 23
DigiKey Programmable: Verified
на замовлення 244 шт:
термін постачання 21-31 дні (днів)
1+490.52 грн
10+364.70 грн
26+336.74 грн
104+288.46 грн
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MCF51JM64VLH MCF51JM64VLH NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
на замовлення 950 шт:
термін постачання 21-31 дні (днів)
1+931.20 грн
10+704.57 грн
25+656.54 грн
80+573.33 грн
230+544.89 грн
800+520.56 грн
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PBLS2024D115 PBLS2024D115 NXP USA Inc. PBLS2024D.pdf Description: TRANS PREBIAS 1PNP 1PNP 6-TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Transistor Type: 1 PNP Pre-Biased, 1 PNP
Power - Max: 760mW
Current - Collector (Ic) (Max): 100mA, 1.8A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 210mV @ 100mA, 1.8A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V / 200 @ 1A, 2V
Frequency - Transition: 130MHz
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: 6-TSOP
Part Status: Active
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MC908QY4AMDTE MC908QY4AMDTE NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 13
Part Status: Not For New Designs
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: HC08
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S912XEG384BCAL S912XEG384BCAL NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
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SC505713MZP33R2 NXP USA Inc. Description: IC
Packaging: Bulk
Part Status: Obsolete
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MC908QY4ACPE MC908QY4ACPE NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 4KB FLASH 16DIP
Packaging: Bulk
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 13
DigiKey Programmable: Not Verified
на замовлення 44563 шт:
термін постачання 21-31 дні (днів)
160+253.17 грн
Мінімальне замовлення: 160
В кошику  од. на суму  грн.
SC141715VFUER NXP USA Inc. Description: IC
Packaging: Bulk
Part Status: Obsolete
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PCA9306JKZ PCA9306JKZ NXP USA Inc. PCA9306.pdf Description: IC XLTR VL BIDIR 8-X2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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MCHC908QT4CDWE MCHC908QT4CDWE NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Verified
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PZU14DB2,115 NXP USA Inc. PHGLS15472-1.pdf?t.download=true&u=5oefqw Description: ZENER DIODE, 14V V(Z), 2.14%, 0.
Tolerance: ±2%
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Configuration: 2 Independent
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 14 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: 5-TSSOP
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 11 V
на замовлення 45000 шт:
термін постачання 21-31 дні (днів)
8876+2.37 грн
Мінімальне замовлення: 8876
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SPC5607BF1VLU6R SPC5607BF1VLU6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5607BF1VLU6R SPC5607BF1VLU6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
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PN7120A0EV/C10801 NXP USA Inc. PN7120.pdf Description: NFC FORUM COMPLIANT CONTROLLER W
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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MC9S12C32CFAE25 MC9S12C32CFAE25 NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Verified
на замовлення 691 шт:
термін постачання 21-31 дні (днів)
1+1502.42 грн
10+1156.96 грн
25+1084.58 грн
100+943.15 грн
250+907.55 грн
500+886.10 грн
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MK22FN1M0VMC12R MK22FN1M0VMC12R NXP USA Inc. K22P121M120SF5.pdf Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
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MK22FN1M0VMC12R MK22FN1M0VMC12R NXP USA Inc. K22P121M120SF5.pdf Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
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KITPF0100SKTEVBE KITPF0100SKTEVBE NXP USA Inc. MMPF0100.pdf Description: EVALUATION BOARD - MMPF0100 OTP
Packaging: Bulk
For Use With/Related Products: PF0x00
Module/Board Type: Socket Module - QFN
Part Status: Active
Utilized IC / Part: PF0x00
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
1+15589.07 грн
В кошику  од. на суму  грн.
S9S08SG16E1WTL S9S08SG16E1WTL NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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MC8640DTHJ1250HE MC8640DTHJ1250HE NXP USA Inc. Description: IC MPU MPC86XX 1.25GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
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PMMA1270KEG NXP USA Inc. Description: IC ACCEL COLOSSUS 2.5G
Packaging: Tube
Part Status: Obsolete
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BCP56-10H,115 BCP56-10H,115 NXP USA Inc. Description: 80 V, 1 A NPN MEDIUM POWER TRAN
Packaging: Bulk
Part Status: Active
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LPC5534JBD100K LPC5534JBD100K NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 128KB FLSH 100HLQFP
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 66
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Data Converters: A/D 23x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
1+825.18 грн
10+624.19 грн
80+516.76 грн
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MIMXRT106ADVL6AR MIMXRT106ADVL6AR NXP USA Inc. IMXRT1060CEC_SUPPLEMENT.pdf Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
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MIMXRT106ADVL6A MIMXRT106ADVL6A NXP USA Inc. IMXRT1060CEC_SUPPLEMENT.pdf Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
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MIMXRT1171AVM8AR MIMXRT1171AVM8AR NXP USA Inc. IMXRT1170AEC.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
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MIMXRT1176AVM8AR MIMXRT1176AVM8AR NXP USA Inc. IMXRT1170AEC.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
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LPC1769FBD100/P1K LPC1769FBD100/P1K NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
на замовлення 321 шт:
термін постачання 21-31 дні (днів)
1+1436.75 грн
10+1104.77 грн
25+1035.12 грн
100+899.51 грн
В кошику  од. на суму  грн.
MCF5249LAG120 MCF5249LAG120 NXP USA Inc. MCF5249.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
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SCF5249LAG120 SCF5249LAG120 NXP USA Inc. Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
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PCAL9539APW,118 PCAL9539APW,118 NXP USA Inc. PCAL9539A.pdf Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+95.23 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
PCAL9539APW,118 PCAL9539APW,118 NXP USA Inc. PCAL9539A.pdf Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2506 шт:
термін постачання 21-31 дні (днів)
2+181.97 грн
10+130.66 грн
25+119.43 грн
100+100.53 грн
250+95.01 грн
500+91.68 грн
1000+89.55 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
T1042NSE7PQPB NXP USA Inc. T1FAMILYFS.pdf Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
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SAF7741HV/N118518 NXP USA Inc. _SAF7741HV.pdf?t.download=true&u=ovmfp3 Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
на замовлення 2250 шт:
термін постачання 21-31 дні (днів)
55+435.14 грн
Мінімальне замовлення: 55
В кошику  од. на суму  грн.
SAF3561EL/V1101,51 NXP USA Inc. Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
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SAF3561EL/V1103,51 NXP USA Inc. Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
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SAF3561EL/V1102,51 NXP USA Inc. Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
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SAF3561EL/V1100K NXP USA Inc. Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tray
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SAF3561EL/V1101,55 NXP USA Inc. Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tray
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SAF3561HV/V1103,55 NXP USA Inc. Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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SAF3560HV/V1100,51 NXP USA Inc. SAF3560.pdf Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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В кошику  од. на суму  грн.
SAF3560HV/V1102,55 NXP USA Inc. SAF3560.pdf Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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SAF3561HV/V1101,51 NXP USA Inc. Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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В кошику  од. на суму  грн.
SAF3561HV/V1103,51 NXP USA Inc. Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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SAF3560HV/V1106K NXP USA Inc. SAF3560.pdf Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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74AHCT2G32GD,125 74AHCT2G32GD,125 NXP USA Inc. PHGLS28140-1.pdf?t.download=true&u=5oefqw Description: IC GATE OR 2CH 2-INP 8XSON
Current - Quiescent (Max): 1 µA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
на замовлення 5387 шт:
термін постачання 21-31 дні (днів)
2049+10.96 грн
Мінімальне замовлення: 2049
В кошику  од. на суму  грн.
PRF13750HR9 PRF13750HR9 NXP USA Inc. Description: RF MOSFET LDMOS NI1230
Gain: 20.6dB
Power - Output: 650W
Configuration: Dual
Frequency: 700MHz ~ 1.3GHz
Current Rating (Amps): 10µA
Package / Case: SOT-979A
Packaging: Strip
Voltage - Rated: 105 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4H
Technology: LDMOS
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В кошику  од. на суму  грн.
K32W1480VFTBT K32W1480VFTBT NXP USA Inc. K32W1480.pdf Description: IC RF TXRX+MCU 802.15.4 48HVQFN
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Part Status: Active
Serial Interfaces: I2C, I2S, SPI, UART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Current - Transmitting: 22.4mA
Data Rate (Max): 2Mbps
Current - Receiving: 8.7mA
Protocol: Bluetooth v5.2, Thread, Zigbee®
Power - Output: 10dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
на замовлення 1258 шт:
термін постачання 21-31 дні (днів)
1+459.67 грн
10+392.59 грн
25+374.44 грн
40+342.94 грн
80+330.86 грн
260+321.74 грн
В кошику  од. на суму  грн.
74AHCT1G04GV NXP USA Inc. PHGL-S-A0000727970-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74AHCT1G04GV - INVE
Part Status: Active
Packaging: Bulk
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74AHCT1G04GW-Q100125 NXP USA Inc. 74AHC_AHCT1G04_Q100.pdf Description: INVERTER, AHCT/VHCT/VT SERIES
Part Status: Active
Packaging: Bulk
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74AHCT1G04GM115 NXP USA Inc. 74AHC_AHCT1G04.pdf Description: NOW NEXPERIA 74AHCT1G04GM - INVE
Part Status: Active
Packaging: Bulk
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MMW9014KZ NXP USA Inc. Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 24.25GHz
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MMW9012KZ NXP USA Inc. Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
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PEMI6QFN/WG,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/WG,132
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/11PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
на замовлення 24000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1902+12.66 грн
Мінімальне замовлення: 1902
В кошику  од. на суму  грн.
PEMI2STD/RG,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/RG,115
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/11PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 11pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
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PEMI2STD/RG,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/RG,115
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 11pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
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T1013NSN7KQA T1024FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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MC34VR500V6ESR2 MC34VR500.pdf
MC34VR500V6ESR2
Виробник: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
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MC33FS6510LAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6510LAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
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MC908MR32VFUE-NXP FSCLS07124-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 44
DigiKey Programmable: Not Verified
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MC908JL3ECDWE MC68HC908JL3E.pdf
MC908JL3ECDWE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Part Status: Not For New Designs
Number of I/O: 23
DigiKey Programmable: Verified
на замовлення 244 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+490.52 грн
10+364.70 грн
26+336.74 грн
104+288.46 грн
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MCF51JM64VLH MCF51JM128.pdf
MCF51JM64VLH
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
на замовлення 950 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+931.20 грн
10+704.57 грн
25+656.54 грн
80+573.33 грн
230+544.89 грн
800+520.56 грн
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PBLS2024D115 PBLS2024D.pdf
PBLS2024D115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS 1PNP 1PNP 6-TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Transistor Type: 1 PNP Pre-Biased, 1 PNP
Power - Max: 760mW
Current - Collector (Ic) (Max): 100mA, 1.8A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 210mV @ 100mA, 1.8A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V / 200 @ 1A, 2V
Frequency - Transition: 130MHz
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: 6-TSOP
Part Status: Active
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MC908QY4AMDTE MC68HC908QY4A.pdf
MC908QY4AMDTE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 13
Part Status: Not For New Designs
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: HC08
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S912XEG384BCAL
S912XEG384BCAL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
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SC505713MZP33R2
Виробник: NXP USA Inc.
Description: IC
Packaging: Bulk
Part Status: Obsolete
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MC908QY4ACPE MC68HC908QY4A.pdf
MC908QY4ACPE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16DIP
Packaging: Bulk
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 13
DigiKey Programmable: Not Verified
на замовлення 44563 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
160+253.17 грн
Мінімальне замовлення: 160
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SC141715VFUER
Виробник: NXP USA Inc.
Description: IC
Packaging: Bulk
Part Status: Obsolete
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PCA9306JKZ PCA9306.pdf
PCA9306JKZ
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-X2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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MCHC908QT4CDWE MC68HC908QY4.pdf
MCHC908QT4CDWE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Verified
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PZU14DB2,115 PHGLS15472-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: ZENER DIODE, 14V V(Z), 2.14%, 0.
Tolerance: ±2%
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Configuration: 2 Independent
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 14 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: 5-TSSOP
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 11 V
на замовлення 45000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8876+2.37 грн
Мінімальне замовлення: 8876
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SPC5607BF1VLU6R MPC560XBFAMFS.pdf
SPC5607BF1VLU6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5607BF1VLU6R MPC560XBFAMFS.pdf
SPC5607BF1VLU6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
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PN7120A0EV/C10801 PN7120.pdf
Виробник: NXP USA Inc.
Description: NFC FORUM COMPLIANT CONTROLLER W
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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MC9S12C32CFAE25 MC9S12C128V1.pdf
MC9S12C32CFAE25
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Verified
на замовлення 691 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1502.42 грн
10+1156.96 грн
25+1084.58 грн
100+943.15 грн
250+907.55 грн
500+886.10 грн
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MK22FN1M0VMC12R K22P121M120SF5.pdf
MK22FN1M0VMC12R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
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MK22FN1M0VMC12R K22P121M120SF5.pdf
MK22FN1M0VMC12R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
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KITPF0100SKTEVBE MMPF0100.pdf
KITPF0100SKTEVBE
Виробник: NXP USA Inc.
Description: EVALUATION BOARD - MMPF0100 OTP
Packaging: Bulk
For Use With/Related Products: PF0x00
Module/Board Type: Socket Module - QFN
Part Status: Active
Utilized IC / Part: PF0x00
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+15589.07 грн
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S9S08SG16E1WTL MC9S08SG32.pdf
S9S08SG16E1WTL
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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MC8640DTHJ1250HE
MC8640DTHJ1250HE
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.25GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
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PMMA1270KEG
Виробник: NXP USA Inc.
Description: IC ACCEL COLOSSUS 2.5G
Packaging: Tube
Part Status: Obsolete
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BCP56-10H,115
BCP56-10H,115
Виробник: NXP USA Inc.
Description: 80 V, 1 A NPN MEDIUM POWER TRAN
Packaging: Bulk
Part Status: Active
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LPC5534JBD100K LPC553x.pdf
LPC5534JBD100K
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 66
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Data Converters: A/D 23x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+825.18 грн
10+624.19 грн
80+516.76 грн
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MIMXRT106ADVL6AR IMXRT1060CEC_SUPPLEMENT.pdf
MIMXRT106ADVL6AR
Виробник: NXP USA Inc.
Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
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MIMXRT106ADVL6A IMXRT1060CEC_SUPPLEMENT.pdf
MIMXRT106ADVL6A
Виробник: NXP USA Inc.
Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
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MIMXRT1171AVM8AR IMXRT1170AEC.pdf
MIMXRT1171AVM8AR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
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MIMXRT1176AVM8AR IMXRT1170AEC.pdf
MIMXRT1176AVM8AR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
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LPC1769FBD100/P1K LPC1769_68_67_66_65_64_63.pdf
LPC1769FBD100/P1K
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
на замовлення 321 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1436.75 грн
10+1104.77 грн
25+1035.12 грн
100+899.51 грн
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MCF5249LAG120 MCF5249.pdf
MCF5249LAG120
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
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SCF5249LAG120
SCF5249LAG120
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
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PCAL9539APW,118 PCAL9539A.pdf
PCAL9539APW,118
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+95.23 грн
Мінімальне замовлення: 2500
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PCAL9539APW,118 PCAL9539A.pdf
PCAL9539APW,118
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2506 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+181.97 грн
10+130.66 грн
25+119.43 грн
100+100.53 грн
250+95.01 грн
500+91.68 грн
1000+89.55 грн
Мінімальне замовлення: 2
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T1042NSE7PQPB T1FAMILYFS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
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SAF7741HV/N118518 _SAF7741HV.pdf?t.download=true&u=ovmfp3
Виробник: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
на замовлення 2250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
55+435.14 грн
Мінімальне замовлення: 55
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SAF3561EL/V1101,51
Виробник: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
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SAF3561EL/V1103,51
Виробник: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
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SAF3561EL/V1102,51
Виробник: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
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SAF3561EL/V1100K
Виробник: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tray
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SAF3561EL/V1101,55
Виробник: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tray
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SAF3561HV/V1103,55
Виробник: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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SAF3560HV/V1100,51 SAF3560.pdf
Виробник: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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SAF3560HV/V1102,55 SAF3560.pdf
Виробник: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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SAF3561HV/V1101,51
Виробник: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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SAF3561HV/V1103,51
Виробник: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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SAF3560HV/V1106K SAF3560.pdf
Виробник: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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74AHCT2G32GD,125 PHGLS28140-1.pdf?t.download=true&u=5oefqw
74AHCT2G32GD,125
Виробник: NXP USA Inc.
Description: IC GATE OR 2CH 2-INP 8XSON
Current - Quiescent (Max): 1 µA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
на замовлення 5387 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2049+10.96 грн
Мінімальне замовлення: 2049
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PRF13750HR9
PRF13750HR9
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS NI1230
Gain: 20.6dB
Power - Output: 650W
Configuration: Dual
Frequency: 700MHz ~ 1.3GHz
Current Rating (Amps): 10µA
Package / Case: SOT-979A
Packaging: Strip
Voltage - Rated: 105 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4H
Technology: LDMOS
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K32W1480VFTBT K32W1480.pdf
K32W1480VFTBT
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 48HVQFN
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Part Status: Active
Serial Interfaces: I2C, I2S, SPI, UART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Current - Transmitting: 22.4mA
Data Rate (Max): 2Mbps
Current - Receiving: 8.7mA
Protocol: Bluetooth v5.2, Thread, Zigbee®
Power - Output: 10dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
на замовлення 1258 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+459.67 грн
10+392.59 грн
25+374.44 грн
40+342.94 грн
80+330.86 грн
260+321.74 грн
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74AHCT1G04GV PHGL-S-A0000727970-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT1G04GV - INVE
Part Status: Active
Packaging: Bulk
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74AHCT1G04GW-Q100125 74AHC_AHCT1G04_Q100.pdf
Виробник: NXP USA Inc.
Description: INVERTER, AHCT/VHCT/VT SERIES
Part Status: Active
Packaging: Bulk
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74AHCT1G04GM115 74AHC_AHCT1G04.pdf
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT1G04GM - INVE
Part Status: Active
Packaging: Bulk
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MMW9014KZ
Виробник: NXP USA Inc.
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 24.25GHz
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MMW9012KZ
Виробник: NXP USA Inc.
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
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