Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35974) > Сторінка 482 з 600
| Фото | Назва | Виробник | Інформація |
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MC34PF1510A2EPR2 | NXP USA Inc. |
 Description: PF1510Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
товару немає в наявності |
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| SC16C654BIA529 | NXP USA Inc. |
Description: QUAD UART WITH 64-BYTE FIFOS AND Packaging: Bulk Part Status: Active |
товару немає в наявності |
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BZX79-B24133 | NXP USA Inc. |
Description: NOW NEXPERIA BZX79-B24 - ZENER D Packaging: Bulk Part Status: Active |
товару немає в наявності |
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MCIMX27LVOP4A | NXP USA Inc. |
Description: IC MPU I.MX27 400MHZ 404LFBGA Packaging: Tray Package / Case: 404-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -20°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V Supplier Device Package: 404-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SAHARAH2 RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory Part Status: Not For New Designs Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART |
товару немає в наявності |
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| TWR-SB0800-36EVB | NXP USA Inc. |
Description: EVALUATION BOARD - SB0800 SOLEN Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Contents: Board(s) Utilized IC / Part: MC34SB0800 Platform: Freescale Tower System Part Status: Active |
товару немає в наявності |
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PHPT61002PYC115 | NXP USA Inc. |
Description: POWER BIPOLAR TRANSISTOR, PNP Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PHPT61006NY115 | NXP USA Inc. |
Description: POWER BIPOLAR TRANSISTOR NPN Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PCA9450AAHNY | NXP USA Inc. |
Description: PMIC FOR I.MX8M MINI 845S 56HVQF Packaging: Cut Tape (CT) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 5.5V Applications: i.MX Processors Current - Supply: 23µA Supplier Device Package: 56-HVQFN (7x7) Part Status: Active |
на замовлення 833 шт: термін постачання 21-31 дні (днів) |
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SPC5747CK1MMJ6R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
товару немає в наявності |
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| 88W8887-A2-CBKE/AZ | NXP USA Inc. |
Description: IC RF TXRX BLE 124WLCSP Packaging: Tape & Reel (TR) Package / Case: 124-BGA, WLCSP Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Type: TxRx Only Protocol: 802.11ac, Bluetooth v4.2 Dual Mode Data Rate (Max): 433Mbps Supplier Device Package: 124-WLCSP RF Family/Standard: Bluetooth, WiFi Serial Interfaces: I2C, I2S, PCM, SDIO, UART Part Status: Active |
товару немає в наявності |
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| 88W8787-A1-BRDA/BZ | NXP USA Inc. |
Description: IC RF TXRX BLE 120VFBGA Packaging: Tape & Reel (TR) Package / Case: 120-VFBGA Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Type: TxRx Only Data Rate (Max): 150Mbps Supplier Device Package: 120-VFBGA (7x7) RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART Part Status: Active Protocol: 802.11a/g/b, Bluetooth v2.1 +EDR Modulation: 4DQPSK, 8DPSK, DSSS, GFSK, OFDM |
товару немає в наявності |
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| PESD5V0U1BL/315 | NXP USA Inc. |
Description: TVS DIODE 5VWM DFN1006-2 Packaging: Bulk Package / Case: SOD-882 Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Applications: General Purpose Capacitance @ Frequency: 2.9pF @ 1MHz Voltage - Reverse Standoff (Typ): 5V (Max) Supplier Device Package: DFN1006-2 Bidirectional Channels: 1 Voltage - Breakdown (Min): 5.5V Power Line Protection: No Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MCIMX6L7DVN10AB | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34PF1510A4EP | NXP USA Inc. |
Description: PF1510 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MKW21Z512VHT4 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 64VFLGA Packaging: Tray Package / Case: 64-VFLGA Sensitivity: -100dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 3.6V Power - Output: 3.5dBm Protocol: Zigbee® Current - Receiving: 6.2mA Data Rate (Max): 1Mbps Current - Transmitting: 6mA Supplier Device Package: 64-VFLGA (7x7) Modulation: FSK, GFSK, MSK, O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 1300 шт: термін постачання 21-31 дні (днів) |
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MC9RS08KA4CPJ | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 126 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-DIP Part Status: Obsolete Number of I/O: 18 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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LPC54102J256BD64QL | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 50 DigiKey Programmable: Not Verified |
на замовлення 208 шт: термін постачання 21-31 дні (днів) |
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S9S12G64BMLC | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 26 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S9S12GN48BCLC | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 26 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PTN3356R1BSMP | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HVQFN Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 2.8V ~ 3.6V Applications: DisplayPort Supplier Device Package: 32-HVQFN (5x5) Part Status: Active |
на замовлення 47655 шт: термін постачання 21-31 дні (днів) |
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S9S08DZ32F2CLFR | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912ZVMBA6F0VLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 5x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: LINbus, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 15 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| RD33775ACNTEVB | NXP USA Inc. |
Description: RD33775ACNTEVB Packaging: Bulk Function: Battery Cell Controller Type: Power Management Utilized IC / Part: MC33775A Supplied Contents: Board(s), Cable(s) Embedded: No Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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UJA1076ATW/5V0/WDJ | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Tape & Reel (TR) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 4.5V ~ 28V Supplier Device Package: 32-HTSSOP Part Status: Active Grade: Automotive |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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MMA5148KWR2528 | NXP USA Inc. |
Description: PSI INERTIAL SENSOR Packaging: Bulk Part Status: Active |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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| FXLS90322AESR2 | NXP USA Inc. |
Description: XY DUAL-AXIS MEDIUM-G INERTIAL Packaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) Part Status: Active Mounting Type: Surface Mount, Wettable Flank |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| FXLS90322AESR2 | NXP USA Inc. |
Description: XY DUAL-AXIS MEDIUM-G INERTIAL Packaging: Cut Tape (CT) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) Part Status: Active Mounting Type: Surface Mount, Wettable Flank |
на замовлення 1958 шт: термін постачання 21-31 дні (днів) |
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| SAF7751HN/N207ZMP | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7755HN/N207ZK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7751HV/N205/S3K | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7755HV/N207ZK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7755HV/N207ZY | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7753HV/N205ZY | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7751HV/N207ZY | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7758HV/N205ZK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7755HN/N208Z/MP | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7753HV/N205Y | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7753HV/N205K | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7753HV/N207ZK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7751HN/N207ZK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7753HV/N205ZK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7758HV/N207ZY | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7758HN/N207ZMP | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7751HN/N208Z/MP | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7751HV/N207ZK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF7758HV/N205Y | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MPC8548CVJAUJD | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 783BGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MRFX1K80N-88MHZ | NXP USA Inc. |
Description: MRFX1K80N REF BOARD 108MHZ 1670W Packaging: Bulk For Use With/Related Products: MRFX1K80N Frequency: 87.5MHz ~ 108MHz Type: Transistor Supplied Contents: Board(s) Part Status: Active Contents: Board(s) Utilized IC / Part: MRFX1K80N |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| MC33FS8430G4ES | NXP USA Inc. |
Description: SYSTEM BASIS CHIP FS8430 Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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SGTL5000XNBA3R2 | NXP USA Inc. |
Description: IC AUDIO CODEC STEREO 32HVQFN Packaging: Cut Tape (CT) Type: Stereo Audio Data Interface: I2C, I2S, PCM, SPI Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply, Analog: 1.62V ~ 3.6V Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V Dynamic Range, ADCs / DACs (db) Typ: 87 / 100 Number of ADCs / DACs: 1 / 1 S/N Ratio, ADCs / DACs (db) Typ: 90 / 100 Sigma Delta: No Part Status: Active |
на замовлення 1640 шт: термін постачання 21-31 дні (днів) |
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| S9S12KG25J2MPVE | NXP USA Inc. |
Description: IC Packaging: Bulk Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
 |
MRFX1K80H-128MHZ | NXP USA Inc. |
Description: MRFX1K80H REF BRD 128MHZ 3775W Packaging: Bulk For Use With/Related Products: MRFX1K80H Frequency: 128MHz Type: Transistor Supplied Contents: Board(s) Part Status: Active Contents: Board(s) Utilized IC / Part: MRFX1K80H |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
|
S9S12GN48F0VLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Cut Tape (CT) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| A3T21H400W23SR6 | NXP USA Inc. |
Description: AIRFAST RF POWER LDMOS TRANSISTO Packaging: Tape & Reel (TR) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| BUK7Y20-30B115 | NXP USA Inc. |
Description: NOW NEXPERIA BUK7Y20-30B 39.5A, Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
 |
WCT-5WTXAUTO | NXP USA Inc. |
Description: DEVELOPMENT TOOL 5W AUTO Packaging: Bulk Function: Wireless Power Supply/Charging Type: Power Management Utilized IC / Part: MWCT1001A, MWCT1003A Supplied Contents: Board(s) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
 |
FS32K148UAT0VMHT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA Packaging: Tray Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 112MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Supplier Device Package: 100-MAPBGA (11x11) Part Status: Active Number of I/O: 89 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| MF0UL1101DUD,005 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIE Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443, MIFARE Supplier Device Package: Die Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
 |
MPC8548EVJAUJD | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 783BGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
 |
MM908E624AYPEW | NXP USA Inc. |
Description: IC SW TRPL HISIDE MCU/LIN 54SOIC Packaging: Tube Package / Case: 54-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SCI, SPI RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5.5V ~ 18V Controller Series: 908E Program Memory Type: FLASH (16kB) Applications: Mirror Control Core Processor: HC08 Supplier Device Package: 54-SOIC Part Status: Active Number of I/O: 16 DigiKey Programmable: Not Verified Grade: Automotive |
товару немає в наявності |
В кошику од. на суму грн. |
| MC34PF1510A2EPR2 |
|
Виробник: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| SC16C654BIA529 |
|
Виробник: NXP USA Inc.
Description: QUAD UART WITH 64-BYTE FIFOS AND
Packaging: Bulk
Part Status: Active
Description: QUAD UART WITH 64-BYTE FIFOS AND
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| BZX79-B24133 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZX79-B24 - ZENER D
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BZX79-B24 - ZENER D
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MCIMX27LVOP4A |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tray
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Part Status: Not For New Designs
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tray
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Part Status: Not For New Designs
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
товару немає в наявності
В кошику
од. на суму грн.
| TWR-SB0800-36EVB |
Виробник: NXP USA Inc.
Description: EVALUATION BOARD - SB0800 SOLEN
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC34SB0800
Platform: Freescale Tower System
Part Status: Active
Description: EVALUATION BOARD - SB0800 SOLEN
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC34SB0800
Platform: Freescale Tower System
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| PCA9450AAHNY |
|
Виробник: NXP USA Inc.
Description: PMIC FOR I.MX8M MINI 845S 56HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
Description: PMIC FOR I.MX8M MINI 845S 56HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
на замовлення 833 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 409.55 грн |
| 10+ | 301.82 грн |
| 25+ | 278.74 грн |
| 100+ | 237.72 грн |
| 250+ | 226.35 грн |
| 500+ | 219.49 грн |
| SPC5747CK1MMJ6R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| 88W8887-A2-CBKE/AZ |
Виробник: NXP USA Inc.
Description: IC RF TXRX BLE 124WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 124-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v4.2 Dual Mode
Data Rate (Max): 433Mbps
Supplier Device Package: 124-WLCSP
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PCM, SDIO, UART
Part Status: Active
Description: IC RF TXRX BLE 124WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 124-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v4.2 Dual Mode
Data Rate (Max): 433Mbps
Supplier Device Package: 124-WLCSP
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PCM, SDIO, UART
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 88W8787-A1-BRDA/BZ |
Виробник: NXP USA Inc.
Description: IC RF TXRX BLE 120VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 120-VFBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Data Rate (Max): 150Mbps
Supplier Device Package: 120-VFBGA (7x7)
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Part Status: Active
Protocol: 802.11a/g/b, Bluetooth v2.1 +EDR
Modulation: 4DQPSK, 8DPSK, DSSS, GFSK, OFDM
Description: IC RF TXRX BLE 120VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 120-VFBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Data Rate (Max): 150Mbps
Supplier Device Package: 120-VFBGA (7x7)
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Part Status: Active
Protocol: 802.11a/g/b, Bluetooth v2.1 +EDR
Modulation: 4DQPSK, 8DPSK, DSSS, GFSK, OFDM
товару немає в наявності
В кошику
од. на суму грн.
| PESD5V0U1BL/315 |
Виробник: NXP USA Inc.
Description: TVS DIODE 5VWM DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 2.9pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 5.5V
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 5VWM DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 2.9pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 5.5V
Power Line Protection: No
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MCIMX6L7DVN10AB |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MC34PF1510A4EP |
|
Виробник: NXP USA Inc.
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MKW21Z512VHT4 |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Zigbee®
Current - Receiving: 6.2mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Zigbee®
Current - Receiving: 6.2mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 317.61 грн |
| 10+ | 302.71 грн |
| MC9RS08KA4CPJ |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| LPC54102J256BD64QL |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
на замовлення 208 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 643.57 грн |
| 10+ | 481.46 грн |
| 25+ | 447.02 грн |
| 160+ | 374.71 грн |
| S9S12G64BMLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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| S9S12GN48BCLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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| PTN3356R1BSMP |
|
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 2.8V ~ 3.6V
Applications: DisplayPort
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 2.8V ~ 3.6V
Applications: DisplayPort
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
на замовлення 47655 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 179+ | 133.65 грн |
| S9S08DZ32F2CLFR |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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| S912ZVMBA6F0VLF |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 15
DigiKey Programmable: Not Verified
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| RD33775ACNTEVB |
Виробник: NXP USA Inc.
Description: RD33775ACNTEVB
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33775A
Supplied Contents: Board(s), Cable(s)
Embedded: No
Part Status: Active
Description: RD33775ACNTEVB
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33775A
Supplied Contents: Board(s), Cable(s)
Embedded: No
Part Status: Active
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| UJA1076ATW/5V0/WDJ |
|
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Part Status: Active
Grade: Automotive
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Part Status: Active
Grade: Automotive
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2000+ | 176.89 грн |
| MMA5148KWR2528 |
|
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 48+ | 484.75 грн |
| FXLS90322AESR2 |
|
Виробник: NXP USA Inc.
Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Mounting Type: Surface Mount, Wettable Flank
Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Mounting Type: Surface Mount, Wettable Flank
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| FXLS90322AESR2 |
|
Виробник: NXP USA Inc.
Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Packaging: Cut Tape (CT)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Mounting Type: Surface Mount, Wettable Flank
Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Packaging: Cut Tape (CT)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Mounting Type: Surface Mount, Wettable Flank
на замовлення 1958 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 501.49 грн |
| 10+ | 428.75 грн |
| 25+ | 408.90 грн |
| 50+ | 370.21 грн |
| 100+ | 357.16 грн |
| 250+ | 340.58 грн |
| 500+ | 323.14 грн |
| 1000+ | 311.68 грн |
| SAF7751HN/N207ZMP |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
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| SAF7755HN/N207ZK |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
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| SAF7751HV/N205/S3K |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
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| SAF7755HV/N207ZK |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
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| SAF7755HV/N207ZY |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
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| SAF7753HV/N205ZY |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
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| SAF7751HV/N207ZY |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
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| SAF7758HV/N205ZK |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
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| SAF7755HN/N208Z/MP |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
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| SAF7753HV/N205Y |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
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| SAF7753HV/N205K |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
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| SAF7753HV/N207ZK |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
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| SAF7751HN/N207ZK |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
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| SAF7753HV/N205ZK |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
од. на суму грн.
| SAF7758HV/N207ZY |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
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| SAF7758HN/N207ZMP |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
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| SAF7751HN/N208Z/MP |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
од. на суму грн.
| SAF7751HV/N207ZK |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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В кошику
од. на суму грн.
| SAF7758HV/N205Y |
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
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| MPC8548CVJAUJD |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
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| MRFX1K80N-88MHZ |
|
Виробник: NXP USA Inc.
Description: MRFX1K80N REF BOARD 108MHZ 1670W
Packaging: Bulk
For Use With/Related Products: MRFX1K80N
Frequency: 87.5MHz ~ 108MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: MRFX1K80N
Description: MRFX1K80N REF BOARD 108MHZ 1670W
Packaging: Bulk
For Use With/Related Products: MRFX1K80N
Frequency: 87.5MHz ~ 108MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: MRFX1K80N
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| SGTL5000XNBA3R2 |
|
Виробник: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Cut Tape (CT)
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Cut Tape (CT)
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
на замовлення 1640 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 375.28 грн |
| 10+ | 275.98 грн |
| 25+ | 254.53 грн |
| 100+ | 216.76 грн |
| 250+ | 206.21 грн |
| 500+ | 199.86 грн |
| 1000+ | 191.44 грн |
| S9S12KG25J2MPVE |
Виробник: NXP USA Inc.
Description: IC
Packaging: Bulk
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC
Packaging: Bulk
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| MRFX1K80H-128MHZ |
|
Виробник: NXP USA Inc.
Description: MRFX1K80H REF BRD 128MHZ 3775W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 128MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: MRFX1K80H
Description: MRFX1K80H REF BRD 128MHZ 3775W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 128MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: MRFX1K80H
товару немає в наявності
В кошику
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| S9S12GN48F0VLFR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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| A3T21H400W23SR6 |
|
Виробник: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Active
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Active
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В кошику
од. на суму грн.
| BUK7Y20-30B115 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BUK7Y20-30B 39.5A,
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BUK7Y20-30B 39.5A,
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| WCT-5WTXAUTO |
Виробник: NXP USA Inc.
Description: DEVELOPMENT TOOL 5W AUTO
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: MWCT1001A, MWCT1003A
Supplied Contents: Board(s)
Part Status: Active
Description: DEVELOPMENT TOOL 5W AUTO
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: MWCT1001A, MWCT1003A
Supplied Contents: Board(s)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| FS32K148UAT0VMHT |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| MF0UL1101DUD,005 |
|
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Part Status: Active
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| MPC8548EVJAUJD |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
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В кошику
од. на суму грн.
| MM908E624AYPEW |
|
Виробник: NXP USA Inc.
Description: IC SW TRPL HISIDE MCU/LIN 54SOIC
Packaging: Tube
Package / Case: 54-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 18V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Grade: Automotive
Description: IC SW TRPL HISIDE MCU/LIN 54SOIC
Packaging: Tube
Package / Case: 54-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 18V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Grade: Automotive
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