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MC33772CTC0AER2 MC33772CTC0AER2 NXP USA Inc. MC33772C-DS.pdf Description: BATTERY CELL CONTROLLER, CURRENT
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
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MC33772CTC1AER2 MC33772CTC1AER2 NXP USA Inc. MC33772C-DS.pdf Description: BATTERY CELL CONTROLLER, CURRENT
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
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MC33772CTA1AER2 MC33772CTA1AER2 NXP USA Inc. MC33772C-DS.pdf Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
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MC33772CTP2AER2 MC33772CTP2AER2 NXP USA Inc. MC33772C-DS.pdf Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
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MC33772CTP1AER2 MC33772CTP1AER2 NXP USA Inc. MC33772C-DS.pdf Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
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MC33775ATA1AER2 MC33775ATA1AER2 NXP USA Inc. MC33775A_SDS.pdf Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 4 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature
Grade: Automotive
Qualification: AEC-Q100
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MC32PF1510A5EPR2 MC32PF1510A5EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Voltage - Supply: 3.8V ~ 7V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MC32PF1510A5EP MC32PF1510A5EP NXP USA Inc. PF1510.pdf Description: PF1510
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Voltage - Supply: 3.8V ~ 7V
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PCT2075DP-ARD NXP USA Inc. UM11581.pdf Description: PCT2075DP-ARD
Packaging: Bulk
Function: Temperature
Type: Sensor
Contents: Board(s)
Utilized IC / Part: PCT2075
Platform: Arduino
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+12212.39 грн
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FS32K116LAT0VFMR NXP USA Inc. Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tape & Reel (TR)
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FS32K116LFT0VFMR NXP USA Inc. S32K1xx.pdf Description: S32K116, M0+, FLASH 128K, RAM 17
Number of I/O: 43
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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FS32K116LAT0MFMR NXP USA Inc. S32K1xx.pdf Description: S32K116 ARM CORTEX-M0+, 48 MHZ,
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of I/O: 28
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FB32K116LFT0MLFR NXP USA Inc. Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
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FB32K116LFT0MLFT NXP USA Inc. Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
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FS32K116LAT0VLFR FS32K116LAT0VLFR NXP USA Inc. S32K1xx.pdf Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
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FS32K116LIT0MFMR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 128MB FLASH 32VFQFN
Number of I/O: 43
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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FS32K116LFT0VFMT FS32K116LFT0VFMT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 128KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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FX32K116LAT0MFMR NXP USA Inc. S32K1xx.pdf Description: S32K116 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tape & Reel (TR)
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FS32K116BRT0VFMT FS32K116BRT0VFMT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
DigiKey Programmable: Not Verified
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FS32K116LAT0VFMT FS32K116LAT0VFMT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 128KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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FX32K116LAT0MLFR NXP USA Inc. S32K1xx.pdf Description: S32K116 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tape & Reel (TR)
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FS32K116LFT0VLFT FS32K116LFT0VLFT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 43
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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FS32K116LFT0MLFT FS32K116LFT0MLFT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 43
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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FX32K116LAT0MLFT NXP USA Inc. S32K1xx.pdf Description: S32K116 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
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FS32K116LIT0VFMT FS32K116LIT0VFMT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
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FD32K116BRT0VFMT NXP USA Inc. Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
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FH32K116BRT0VFMR NXP USA Inc. Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tape & Reel (TR)
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FD32K116BRT0VFMR NXP USA Inc. Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tape & Reel (TR)
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FH32K116LFT0MFMR NXP USA Inc. Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
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FB32K116BFT0MFMR NXP USA Inc. Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tape & Reel (TR)
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FB32K116BRT0MFMR NXP USA Inc. Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tape & Reel (TR)
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FH32K116BRT0VFMT NXP USA Inc. Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
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FH32K116LFT0VLFR NXP USA Inc. Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
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SPC5602SF2VLQ6R SPC5602SF2VLQ6R NXP USA Inc. MPC5606S.pdf Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 105
DigiKey Programmable: Not Verified
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S912XES384F1MAA S912XES384F1MAA NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 80QFP
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
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74LVC1GU04GN,132 74LVC1GU04GN,132 NXP USA Inc. PHGLS27066-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
на замовлення 187200 шт:
термін постачання 21-31 дні (днів)
2882+7.57 грн
Мінімальне замовлення: 2882
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IP4253CZ8-4-TTL132 IP4253CZ8-4-TTL132 NXP USA Inc. IP4251_52_53_54-TTL.pdf Description: DATA LINE FILTER
Packaging: Bulk
на замовлення 5860 шт:
термін постачання 21-31 дні (днів)
2959+7.29 грн
Мінімальне замовлення: 2959
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S9S12ZVLS1AMFMR NXP USA Inc. Description: S12Z CPU, 16K FLASH
Packaging: Tape & Reel (TR)
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S9S12ZVLS1AMFM NXP USA Inc. Description: S12Z CPU, 16K FLASH
Packaging: Tray
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S9S12ZVLS3AMFMR S9S12ZVLS3AMFMR NXP USA Inc. Description: S12Z CPU, 32K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 18
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S9S12ZVLS3AMFM S9S12ZVLS3AMFM NXP USA Inc. MC9S12ZVLRM.pdf Description: S12Z CPU, 32K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 18
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S912ZVLA12AMFM NXP USA Inc. Description: S12Z CPU, 128K FLASH
Packaging: Tray
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S912ZVLA12AMFMR NXP USA Inc. Description: S12Z CPU, 128K FLASH
Packaging: Tape & Reel (TR)
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S912ZVLA64AMFM NXP USA Inc. MC9S12ZVLRM.pdf Description: S12Z CPU, 64K FLASH
Packaging: Tray
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S912ZVLA64AMFMR NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
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74LVC14APW 74LVC14APW NXP USA Inc. PHGLS24066-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74LVC14APW - INVERT
Current - Quiescent (Max): 40 µA
Number of Circuits: 6
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 50pF
Input Logic Level - Low: 0.12V ~ 0.8V
Input Logic Level - High: 1V ~ 2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 1
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Packaging: Bulk
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74AUP2G157GM,125 74AUP2G157GM,125 NXP USA Inc. PHGLS25967-1.pdf?t.download=true&u=5oefqw Description: IC MULTIPLEXER 1 X 2:1 8XQFN
Mounting Type: Surface Mount
Package / Case: 8-XFQFN Exposed Pad
Packaging: Bulk
Supplier Device Package: 8-XQFN (1.6x1.6)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: Multiplexer
Circuit: 1 x 2:1
на замовлення 89597 шт:
термін постачання 21-31 дні (днів)
2036+11.39 грн
Мінімальне замовлення: 2036
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MMA5248KW NXP USA Inc. MMA52xxWR2.pdf Description: IC SENSOR ACCELEROMETER 16QFN
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Axis: X
Acceleration Range: ±480g
Voltage - Supply: 4.2V ~ 17V
Bandwidth: 400Hz
Supplier Device Package: 16-QFN (6x6)
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MK10FN1M0VLQ12 MK10FN1M0VLQ12 NXP USA Inc. KNTSK1XFMLYFS.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 66x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
на замовлення 964 шт:
термін постачання 21-31 дні (днів)
1+1251.62 грн
10+817.63 грн
60+784.82 грн
120+725.94 грн
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MF1P2230DA8/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFARE PLUS EV1
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
Supplier Device Package: PLLMC
Standards: Mifare, NFC
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MF1P2230DA4/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFARE PLUS EV1
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
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S912ZVMC25F1WKK557 NXP USA Inc. Description: MAGNIV 16 BIT MCU, S12Z CORE, 25
Packaging: Bulk
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
DigiKey Programmable: Not Verified
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S912ZVMC25F1MKK557 S912ZVMC25F1MKK557 NXP USA Inc. _S12ZVMBFS.pdf?t.download=true&u=ovmfp3 Description: MICROCONTROLLER, 16-BIT, HCS12 C
Packaging: Bulk
DigiKey Programmable: Not Verified
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S912ZVMC25F1MKKR NXP USA Inc. Description: MAGNIV 16-BIT MCU, S12Z CORE, 25
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
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S912ZVMC25F1VKK S912ZVMC25F1VKK NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 256KB FLASH 80TQFP
Packaging: Tray
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
DigiKey Programmable: Not Verified
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S912ZVMC25F1MKK S912ZVMC25F1MKK NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 256KB FLASH 80TQFP
Packaging: Tray
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
DigiKey Programmable: Not Verified
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S9S12XS128J1CAE S9S12XS128J1CAE NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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S912XEQ384J3MAL S912XEQ384J3MAL NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
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74HC08BQ-Q100,115 74HC08BQ-Q100,115 NXP USA Inc. PHGLS25303-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 4CH 2-INP 14DHVQFN
Packaging: Bulk
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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PCA9306DC1/DG,125 PCA9306DC1/DG,125 NXP USA Inc. PCA9306.pdf Description: IC XLTR VL BIDIR 8-VSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
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MC33772CTC0AER2 MC33772C-DS.pdf
MC33772CTC0AER2
Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, CURRENT
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
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MC33772CTC1AER2 MC33772C-DS.pdf
MC33772CTC1AER2
Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, CURRENT
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
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MC33772CTA1AER2 MC33772C-DS.pdf
MC33772CTA1AER2
Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
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MC33772CTP2AER2 MC33772C-DS.pdf
MC33772CTP2AER2
Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
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MC33772CTP1AER2 MC33772C-DS.pdf
MC33772CTP1AER2
Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
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MC33775ATA1AER2 MC33775A_SDS.pdf
MC33775ATA1AER2
Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 4 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature
Grade: Automotive
Qualification: AEC-Q100
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MC32PF1510A5EPR2 PF1510.pdf
MC32PF1510A5EPR2
Виробник: NXP USA Inc.
Description: PF1510
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Voltage - Supply: 3.8V ~ 7V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MC32PF1510A5EP PF1510.pdf
MC32PF1510A5EP
Виробник: NXP USA Inc.
Description: PF1510
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Voltage - Supply: 3.8V ~ 7V
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PCT2075DP-ARD UM11581.pdf
Виробник: NXP USA Inc.
Description: PCT2075DP-ARD
Packaging: Bulk
Function: Temperature
Type: Sensor
Contents: Board(s)
Utilized IC / Part: PCT2075
Platform: Arduino
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+12212.39 грн
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FS32K116LAT0VFMR
Виробник: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tape & Reel (TR)
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FS32K116LFT0VFMR S32K1xx.pdf
Виробник: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Number of I/O: 43
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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FS32K116LAT0MFMR S32K1xx.pdf
Виробник: NXP USA Inc.
Description: S32K116 ARM CORTEX-M0+, 48 MHZ,
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of I/O: 28
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FB32K116LFT0MLFR
Виробник: NXP USA Inc.
Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
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FB32K116LFT0MLFT
Виробник: NXP USA Inc.
Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
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FS32K116LAT0VLFR S32K1xx.pdf
FS32K116LAT0VLFR
Виробник: NXP USA Inc.
Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
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FS32K116LIT0MFMR S32K1xx.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128MB FLASH 32VFQFN
Number of I/O: 43
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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FS32K116LFT0VFMT S32K1xx.pdf
FS32K116LFT0VFMT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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FX32K116LAT0MFMR S32K1xx.pdf
Виробник: NXP USA Inc.
Description: S32K116 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tape & Reel (TR)
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FS32K116BRT0VFMT S32K1xx.pdf
FS32K116BRT0VFMT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
DigiKey Programmable: Not Verified
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FS32K116LAT0VFMT S32K-DS.pdf
FS32K116LAT0VFMT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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FX32K116LAT0MLFR S32K1xx.pdf
Виробник: NXP USA Inc.
Description: S32K116 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tape & Reel (TR)
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FS32K116LFT0VLFT S32K1xx.pdf
FS32K116LFT0VLFT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 43
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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FS32K116LFT0MLFT S32K-DS.pdf
FS32K116LFT0MLFT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 43
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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FX32K116LAT0MLFT S32K1xx.pdf
Виробник: NXP USA Inc.
Description: S32K116 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
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FS32K116LIT0VFMT S32K-DS.pdf
FS32K116LIT0VFMT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
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FD32K116BRT0VFMT
Виробник: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
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FH32K116BRT0VFMR
Виробник: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tape & Reel (TR)
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FD32K116BRT0VFMR
Виробник: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tape & Reel (TR)
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FH32K116LFT0MFMR
Виробник: NXP USA Inc.
Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
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FB32K116BFT0MFMR
Виробник: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tape & Reel (TR)
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FB32K116BRT0MFMR
Виробник: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tape & Reel (TR)
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FH32K116BRT0VFMT
Виробник: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
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FH32K116LFT0VLFR
Виробник: NXP USA Inc.
Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
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SPC5602SF2VLQ6R MPC5606S.pdf
SPC5602SF2VLQ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 105
DigiKey Programmable: Not Verified
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S912XES384F1MAA
S912XES384F1MAA
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
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74LVC1GU04GN,132 PHGLS27066-1.pdf?t.download=true&u=5oefqw
74LVC1GU04GN,132
Виробник: NXP USA Inc.
Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
на замовлення 187200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2882+7.57 грн
Мінімальне замовлення: 2882
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IP4253CZ8-4-TTL132 IP4251_52_53_54-TTL.pdf
IP4253CZ8-4-TTL132
Виробник: NXP USA Inc.
Description: DATA LINE FILTER
Packaging: Bulk
на замовлення 5860 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2959+7.29 грн
Мінімальне замовлення: 2959
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S9S12ZVLS1AMFMR
Виробник: NXP USA Inc.
Description: S12Z CPU, 16K FLASH
Packaging: Tape & Reel (TR)
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S9S12ZVLS1AMFM
Виробник: NXP USA Inc.
Description: S12Z CPU, 16K FLASH
Packaging: Tray
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S9S12ZVLS3AMFMR
S9S12ZVLS3AMFMR
Виробник: NXP USA Inc.
Description: S12Z CPU, 32K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 18
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S9S12ZVLS3AMFM MC9S12ZVLRM.pdf
S9S12ZVLS3AMFM
Виробник: NXP USA Inc.
Description: S12Z CPU, 32K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 18
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S912ZVLA12AMFM
Виробник: NXP USA Inc.
Description: S12Z CPU, 128K FLASH
Packaging: Tray
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S912ZVLA12AMFMR
Виробник: NXP USA Inc.
Description: S12Z CPU, 128K FLASH
Packaging: Tape & Reel (TR)
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S912ZVLA64AMFM MC9S12ZVLRM.pdf
Виробник: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tray
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S912ZVLA64AMFMR
Виробник: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
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74LVC14APW PHGLS24066-1.pdf?t.download=true&u=5oefqw
74LVC14APW
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74LVC14APW - INVERT
Current - Quiescent (Max): 40 µA
Number of Circuits: 6
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 50pF
Input Logic Level - Low: 0.12V ~ 0.8V
Input Logic Level - High: 1V ~ 2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 1
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Packaging: Bulk
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74AUP2G157GM,125 PHGLS25967-1.pdf?t.download=true&u=5oefqw
74AUP2G157GM,125
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 1 X 2:1 8XQFN
Mounting Type: Surface Mount
Package / Case: 8-XFQFN Exposed Pad
Packaging: Bulk
Supplier Device Package: 8-XQFN (1.6x1.6)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: Multiplexer
Circuit: 1 x 2:1
на замовлення 89597 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2036+11.39 грн
Мінімальне замовлення: 2036
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MMA5248KW MMA52xxWR2.pdf
Виробник: NXP USA Inc.
Description: IC SENSOR ACCELEROMETER 16QFN
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Axis: X
Acceleration Range: ±480g
Voltage - Supply: 4.2V ~ 17V
Bandwidth: 400Hz
Supplier Device Package: 16-QFN (6x6)
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MK10FN1M0VLQ12 KNTSK1XFMLYFS.pdf
MK10FN1M0VLQ12
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 66x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
на замовлення 964 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1251.62 грн
10+817.63 грн
60+784.82 грн
120+725.94 грн
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MF1P2230DA8/00J MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFARE PLUS EV1
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
Supplier Device Package: PLLMC
Standards: Mifare, NFC
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MF1P2230DA4/00J MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFARE PLUS EV1
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
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S912ZVMC25F1WKK557
Виробник: NXP USA Inc.
Description: MAGNIV 16 BIT MCU, S12Z CORE, 25
Packaging: Bulk
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
DigiKey Programmable: Not Verified
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S912ZVMC25F1MKK557 _S12ZVMBFS.pdf?t.download=true&u=ovmfp3
S912ZVMC25F1MKK557
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Packaging: Bulk
DigiKey Programmable: Not Verified
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S912ZVMC25F1MKKR
Виробник: NXP USA Inc.
Description: MAGNIV 16-BIT MCU, S12Z CORE, 25
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
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S912ZVMC25F1VKK S12ZVMFS.pdf
S912ZVMC25F1VKK
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80TQFP
Packaging: Tray
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
DigiKey Programmable: Not Verified
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S912ZVMC25F1MKK S12ZVMFS.pdf
S912ZVMC25F1MKK
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80TQFP
Packaging: Tray
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
DigiKey Programmable: Not Verified
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S9S12XS128J1CAE MC9S12XS256RMV1.pdf
S9S12XS128J1CAE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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S912XEQ384J3MAL MC9S12XEPB.pdf
S912XEQ384J3MAL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
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74HC08BQ-Q100,115 PHGLS25303-1.pdf?t.download=true&u=5oefqw
74HC08BQ-Q100,115
Виробник: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14DHVQFN
Packaging: Bulk
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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PCA9306DC1/DG,125 PCA9306.pdf
PCA9306DC1/DG,125
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-VSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
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