Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35301) > Сторінка 498 з 589
| Фото | Назва | Виробник | Інформація | Доступність | Ціна | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|  | MIMX8DX5AVLFZACR | NXP USA Inc. |  Description: I.MX 8DUALXPLUS Packaging: Tape & Reel (TR) Package / Case: 609-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 609-FBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MIMX8QX2FVOFZAC | NXP USA Inc. |  Description: I.MX 8QUADXPLUS 17X17 Packaging: Tray Package / Case: 417-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 417-FBGA (17x17) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | MIMX8DX1FVLFZAC | NXP USA Inc. |  Description: I.MX 8DUALXPLUS 21X21 Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 609-FBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | MIMX8DX5GVLFZAC | NXP USA Inc. |  Description: I.MX 8X FIPS Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 609-FBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | MIMX8DX6GVLFZAC | NXP USA Inc. |  Description: I.MX 8X FIPS Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 609-FBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | MIMX8DX2FVLFZAC | NXP USA Inc. |  Description: I.MX 8DUALXPLUS 21X21 Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 609-FBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | MIMX8QX5GVLFZAC | NXP USA Inc. | Description: I.MX 8X FIPS Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 609-FBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | MIMX8DX5FVLFZAC | NXP USA Inc. |  Description: I.MX 8DUALXPLUS 21X21 Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 609-FBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | MIMX8UX5FVLFZAC | NXP USA Inc. | Description: I.MX8 QXP 21X21 Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 609-FBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | MIMX8QX1FVLFZAC | NXP USA Inc. |  Description: I.MX 8QUADXPLUS 21X21 Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 609-FBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| MIMX8QX6GVLFZAC | NXP USA Inc. | Description: I.MX 8X FIPS Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 609-FBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|  | MIMX8DX6FVLFZAC | NXP USA Inc. |  Description: I.MX 8DUALXPLUS 21X21 Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 609-FBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| MIMX8UX6FVLFZAC | NXP USA Inc. | Description: I.MX8 QXP 21X21 Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 609-FBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|  | MIMX8QX2FVLFZAC | NXP USA Inc. |  Description: I.MX 8QUADXPLUS 21X21 Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 609-FBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | MIMX8QX5FVLFZAC | NXP USA Inc. |  Description: I.MX 8QUADXPLUS 21X21 Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 609-FBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | MIMX8QX6FVLFZAC | NXP USA Inc. | Description: I.MX 8QUADXPLUS 21X21 Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz, 264MHz Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 609-FBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | A7102CGHN1/T0B0AEL | NXP USA Inc. | Description: AU10TICS Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: I²C Operating Temperature: -40°C ~ 90°C (TA) Voltage - Supply: 1.62V ~ 3.6V Controller Series: A710x Program Memory Type: EEPROM (20kB) Applications: Authentication Core Processor: MX51 Supplier Device Package: 32-HVQFN (5x5) DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MC908GR16CFAE | NXP USA Inc. |  Description: IC MCU 8BIT 16KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: LINbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 37 DigiKey Programmable: Not Verified | на замовлення 1105 шт:термін постачання 21-31 дні (днів) | 
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|   | PDTC114TMB315 | NXP USA Inc. |  Description: TRANS PREBIAS Packaging: Bulk | на замовлення 110000 шт:термін постачання 21-31 дні (днів) | 
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|  | MC56F82748VLHR | NXP USA Inc. |  Description: IC MCU 32BIT 64KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 64KB (32K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 16x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | MC56F82748VLHR | NXP USA Inc. |  Description: IC MCU 32BIT 64KB FLASH 64LQFP Packaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 64KB (32K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 16x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified | на замовлення 1450 шт:термін постачання 21-31 дні (днів) | 
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|   | S9S12G48BVLCR | NXP USA Inc. |  Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MC32PF3001A5EPR2 | NXP USA Inc. |  Description: POWER MANAGEMENT IC I.MX7 PRE- Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | S9S12G64AMLFR | NXP USA Inc. | Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MC34PF3001A2EPR2 | NXP USA Inc. |  Description: POWER MANAGEMENT IC I.MX7 PRE- Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | FS32K142HRT0VLHR | NXP USA Inc. |  Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | SPC5607BK0VLL6R | NXP USA Inc. |  Description: IC MCU 32BIT 1.5MB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 7x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 77 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MC32PF1510A6EPR2 | NXP USA Inc. |  Description: PF1510 Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | FS32K118BRT0VLHR | NXP USA Inc. |  Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 25K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | FS32K118LAT0MLFR | NXP USA Inc. |  Description: IC MCU 32BIT 256KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 43 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | FS32K146HAT0MLLR | NXP USA Inc. |  Description: IC MCU 32BIT 1MB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 89 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MK61FX512VMD15 | NXP USA Inc. |  Description: IC MCU 32B 512KB FLASH 144MAPBGA Packaging: Tray Package / Case: 144-LBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 53x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-MAPBGA (13x13) Number of I/O: 95 DigiKey Programmable: Not Verified | на замовлення 800 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||||||
|   | PMN52XP115 | NXP USA Inc. |  Description: P-CHANNEL MOSFET Packaging: Bulk | на замовлення 636000 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||||||
| NCF2961EHN2/0200EJ | NXP USA Inc. | Description: COMBI KEY TX 014 Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | P2020NSE2KHC | NXP USA Inc. |  Description: IC MPU QORIQ P2 1.2GHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, MMC/SD, SPI | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| FRDMSTBANBP8XD | NXP USA Inc. |  Description: BPMS FREEDOM SHIELD EVAL BOARD Packaging: Box Interface: SPI Sensor Type: Pressure Utilized IC / Part: NBP8FD4T1 Supplied Contents: Board(s) Embedded: Yes, MCU Sensing Range: 40 ~ 250 kPa | на замовлення 8 шт:термін постачання 21-31 дні (днів) | 
 | |||||||||||||||
|   | LPC811M001JDH16FP | NXP USA Inc. |  Description: IC MCU 32BIT 8KB FLASH 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 8KB (8K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 14 DigiKey Programmable: Not Verified | на замовлення 659 шт:термін постачання 21-31 дні (днів) | 
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| XC56309VF100A-NXP | NXP USA Inc. | Description: 24-BIT DIGITAL SIGNAL PROCESSOR Packaging: Bulk | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | SPAKXC309AG100A | NXP USA Inc. |  Description: IC DSP 24BIT 100MHZ 144-LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Interface: Host Interface, SSI, SCI Type: Fixed Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (576B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 144-LQFP (20x20) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | XC56309AG100A | NXP USA Inc. |  Description: IC DSP 24BIT 100MHZ 144-TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Interface: Host Interface, SSI, SCI Type: Fixed Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (576B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 144-LQFP (20x20) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | XC56309AG100AR2 | NXP USA Inc. |  Description: IC DSP 24BIT 100MHZ 144-LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Interface: Host Interface, SSI, SCI Type: Fixed Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (576B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 144-LQFP (20x20) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| NBP9FD4T1 | NXP USA Inc. | Description: SENSOR BATTERY PRESSURE Packaging: Tape & Reel (TR) Sensor Type: Battery Pressure | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| NBP9FD4T1 | NXP USA Inc. | Description: SENSOR BATTERY PRESSURE Packaging: Cut Tape (CT) Sensor Type: Battery Pressure | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| NBP8FD5T1 | NXP USA Inc. | Description: IC PRESSURE SENSOR 24HQFN Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | 74HCT423N,112 | NXP USA Inc. |  Description: IC MULTIVIBRATOR 22NS 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: Monostable Operating Temperature: -40°C ~ 125°C Propagation Delay: 22 ns Independent Circuits: 2 Current - Output High, Low: 4mA, 4mA Schmitt Trigger Input: No Supplier Device Package: 16-DIP Voltage - Supply: 4.5 V ~ 5.5 V | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | SPC5744PK1MLQ8 | NXP USA Inc. | Description: IC MCU 32BIT 2.5MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2.5MB (2.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 79 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | TDA3683J/N2S,112 | NXP USA Inc. |  Description: IC REG MULTIPLE VOLTAGE DBS23P Packaging: Tube Package / Case: 23-SIP Formed Leads Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C Voltage - Supply: 9V ~ 18V Applications: Ignition Buffer, Regulator Current - Supply: 300µA Supplier Device Package: DBS23P | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | S32K322EHT0MPBST | NXP USA Inc. |  Description: S32K322 ARM CORTEX-M7, 160 MHZ, Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP (16x16) Grade: Automotive Number of I/O: 143 Qualification: AEC-Q100 | на замовлення 161 шт:термін постачання 21-31 дні (днів) | 
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| 74AUP1T1326GT115 | NXP USA Inc. |  Description: IC BUFFER NON-INVERT 3.6V 8XSON Packaging: Bulk Package / Case: 8-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.1V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 8-XSON (1.95x1) | на замовлення 4700 шт:термін постачання 21-31 дні (днів) | 
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| 74LVC3G06GT115 | NXP USA Inc. |  Description: NOW NEXPERIA 74LVC3G06GT INVERTE Packaging: Bulk | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| BUK7E3R1-40E,127-NXP | NXP USA Inc. | Description: PFET, 100A I(D), 40V, 0.0031OHM, Packaging: Tube Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V Power Dissipation (Max): 234W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: I2PAK Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 79 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 6200 pF @ 25 V | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | ON5233,118 | NXP USA Inc. | Description: RF MOSFET SOT428 DPAK Packaging: Tape & Reel (TR) Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Supplier Device Package: DPAK | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | P1010NSN5HFB | NXP USA Inc. |  Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA Packaging: Tray Package / Case: 425-FBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 425-TEPBGA I (19x19) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| BZX585-C36115 | NXP USA Inc. |  Description: NOW NEXPERIA BZX585-C36 ZENER DI Tolerance: ±5% Packaging: Bulk Package / Case: SC-79, SOD-523 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 36 V Impedance (Max) (Zzt): 90 Ohms Supplier Device Package: SOD-523 Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| 74ALVCH16843DGG653 | NXP USA Inc. |  Description: BUS DRIVER, ALVC/VCX/A SERIES Packaging: Bulk | на замовлення 2000 шт:термін постачання 21-31 дні (днів) | 
 | |||||||||||||||
| 74ALVCH16843DGG518 | NXP USA Inc. |  Description: BUS DRIVER, ALVC/VCX/A SERIES Packaging: Bulk | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | MC908JK3EMDWE | NXP USA Inc. |  Description: IC MCU 8BIT 4KB FLASH 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 12x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Peripherals: LED, LVD, POR, PWM Supplier Device Package: 20-SOIC Number of I/O: 15 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | TDF8541JV/N3ZU | NXP USA Inc. |  Description: TDF8541JV Packaging: Tube Package / Case: 27-SIP, Formed Leads Mounting Type: Through Hole Supplier Device Package: DBS27P | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | TJA1103AHN/0Z | NXP USA Inc. |  Description: IC TRANSCEIVER FULL 1/1 36HVQFN Packaging: Tape & Reel (TR) Package / Case: 36-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Type: Transceiver Number of Drivers/Receivers: 1/1 Data Rate: 100Mbps Protocol: IEEE 802.3 Supplier Device Package: 36-HVQFN (6x6) Duplex: Full Grade: Automotive Qualification: AEC-Q100 | на замовлення 4000 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||||||
|   | TJA1103AHN/0Z | NXP USA Inc. |  Description: IC TRANSCEIVER FULL 1/1 36HVQFN Packaging: Cut Tape (CT) Package / Case: 36-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Type: Transceiver Number of Drivers/Receivers: 1/1 Data Rate: 100Mbps Protocol: IEEE 802.3 Supplier Device Package: 36-HVQFN (6x6) Duplex: Full Grade: Automotive Qualification: AEC-Q100 | на замовлення 5698 шт:термін постачання 21-31 дні (днів) | 
 | 
| MIMX8DX5AVLFZACR |  | 
Виробник: NXP USA Inc.
Description: I.MX 8DUALXPLUS
Packaging: Tape & Reel (TR)
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
    Description: I.MX 8DUALXPLUS
Packaging: Tape & Reel (TR)
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
товару немає в наявності
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     од. на суму     грн.
| MIMX8QX2FVOFZAC |  | 
Виробник: NXP USA Inc.
Description: I.MX 8QUADXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
    Description: I.MX 8QUADXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
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| MIMX8DX1FVLFZAC |  | 
Виробник: NXP USA Inc.
Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
    Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
товару немає в наявності
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     од. на суму     грн.
| MIMX8DX5GVLFZAC |  | 
Виробник: NXP USA Inc.
Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
    Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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| MIMX8DX6GVLFZAC |  | 
Виробник: NXP USA Inc.
Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
    Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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| MIMX8DX2FVLFZAC |  | 
Виробник: NXP USA Inc.
Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
    Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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| MIMX8QX5GVLFZAC | 
Виробник: NXP USA Inc.
Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
    Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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| MIMX8DX5FVLFZAC |  | 
Виробник: NXP USA Inc.
Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
    Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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| MIMX8UX5FVLFZAC | 
Виробник: NXP USA Inc.
Description: I.MX8 QXP 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
    Description: I.MX8 QXP 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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| MIMX8QX1FVLFZAC |  | 
Виробник: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
    Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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| MIMX8QX6GVLFZAC | 
Виробник: NXP USA Inc.
Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
    Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
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| MIMX8DX6FVLFZAC |  | 
Виробник: NXP USA Inc.
Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
    Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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| MIMX8UX6FVLFZAC | 
Виробник: NXP USA Inc.
Description: I.MX8 QXP 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
    Description: I.MX8 QXP 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
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| MIMX8QX2FVLFZAC |  | 
Виробник: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
    Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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| MIMX8QX5FVLFZAC |  | 
Виробник: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
    Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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| MIMX8QX6FVLFZAC | 
Виробник: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
    Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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| A7102CGHN1/T0B0AEL | 
Виробник: NXP USA Inc.
Description: AU10TICS
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
    Description: AU10TICS
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
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| MC908GR16CFAE |  | 
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
    Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
на замовлення 1105 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 1007.83 грн | 
| 10+ | 769.80 грн | 
| 25+ | 719.70 грн | 
| 100+ | 623.81 грн | 
| 250+ | 621.33 грн | 
| PDTC114TMB315 |  | 
на замовлення 110000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 11225+ | 2.27 грн | 
| MC56F82748VLHR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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| MC56F82748VLHR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 1450 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 647.65 грн | 
| 10+ | 485.09 грн | 
| 25+ | 450.44 грн | 
| 100+ | 387.01 грн | 
| 250+ | 369.97 грн | 
| 500+ | 359.71 грн | 
| S9S12G48BVLCR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
    Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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| MC32PF3001A5EPR2 |  | 
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
    Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
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| S9S12G64AMLFR | 
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
    Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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| MC34PF3001A2EPR2 |  | 
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
    Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
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| FS32K142HRT0VLHR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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| SPC5607BK0VLL6R |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
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| MC32PF1510A6EPR2 |  | 
Виробник: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
    Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
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| FS32K118BRT0VLHR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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| FS32K118LAT0MLFR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
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| FS32K146HAT0MLLR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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| MK61FX512VMD15 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 53x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 95
DigiKey Programmable: Not Verified
    Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 53x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 95
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 1024.35 грн | 
| 10+ | 946.32 грн | 
| PMN52XP115 |  | 
на замовлення 636000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 3723+ | 6.61 грн | 
| P2020NSE2KHC |  | 
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
    Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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| FRDMSTBANBP8XD |  | 
Виробник: NXP USA Inc.
Description: BPMS FREEDOM SHIELD EVAL BOARD
Packaging: Box
Interface: SPI
Sensor Type: Pressure
Utilized IC / Part: NBP8FD4T1
Supplied Contents: Board(s)
Embedded: Yes, MCU
Sensing Range: 40 ~ 250 kPa
    Description: BPMS FREEDOM SHIELD EVAL BOARD
Packaging: Box
Interface: SPI
Sensor Type: Pressure
Utilized IC / Part: NBP8FD4T1
Supplied Contents: Board(s)
Embedded: Yes, MCU
Sensing Range: 40 ~ 250 kPa
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 5027.58 грн | 
| LPC811M001JDH16FP |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 659 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 3+ | 117.30 грн | 
| 10+ | 82.57 грн | 
| 96+ | 63.45 грн | 
| 192+ | 58.80 грн | 
| 288+ | 58.06 грн | 
| 576+ | 50.87 грн | 
| SPAKXC309AG100A |  | 
Виробник: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 144-LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 144-LQFP (20x20)
    Description: IC DSP 24BIT 100MHZ 144-LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 144-LQFP (20x20)
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| XC56309AG100A |  | 
Виробник: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 144-TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 144-LQFP (20x20)
    Description: IC DSP 24BIT 100MHZ 144-TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 144-LQFP (20x20)
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| XC56309AG100AR2 |  | 
Виробник: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 144-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 144-LQFP (20x20)
    Description: IC DSP 24BIT 100MHZ 144-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 144-LQFP (20x20)
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| NBP9FD4T1 | 
Виробник: NXP USA Inc.
Description: SENSOR BATTERY PRESSURE
Packaging: Tape & Reel (TR)
Sensor Type: Battery Pressure
    Description: SENSOR BATTERY PRESSURE
Packaging: Tape & Reel (TR)
Sensor Type: Battery Pressure
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| NBP9FD4T1 | 
Виробник: NXP USA Inc.
Description: SENSOR BATTERY PRESSURE
Packaging: Cut Tape (CT)
Sensor Type: Battery Pressure
    Description: SENSOR BATTERY PRESSURE
Packaging: Cut Tape (CT)
Sensor Type: Battery Pressure
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| 74HCT423N,112 |  | 
Виробник: NXP USA Inc.
Description: IC MULTIVIBRATOR 22NS 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 22 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-DIP
Voltage - Supply: 4.5 V ~ 5.5 V
    Description: IC MULTIVIBRATOR 22NS 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 22 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-DIP
Voltage - Supply: 4.5 V ~ 5.5 V
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| SPC5744PK1MLQ8 | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
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| TDA3683J/N2S,112 |  | 
Виробник: NXP USA Inc.
Description: IC REG MULTIPLE VOLTAGE DBS23P
Packaging: Tube
Package / Case: 23-SIP Formed Leads
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Applications: Ignition Buffer, Regulator
Current - Supply: 300µA
Supplier Device Package: DBS23P
    Description: IC REG MULTIPLE VOLTAGE DBS23P
Packaging: Tube
Package / Case: 23-SIP Formed Leads
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Applications: Ignition Buffer, Regulator
Current - Supply: 300µA
Supplier Device Package: DBS23P
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| S32K322EHT0MPBST |  | 
Виробник: NXP USA Inc.
Description: S32K322 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 143
Qualification: AEC-Q100
    Description: S32K322 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 143
Qualification: AEC-Q100
на замовлення 161 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 873.18 грн | 
| 10+ | 780.94 грн | 
| 25+ | 743.79 грн | 
| 100+ | 682.79 грн | 
| 74AUP1T1326GT115 |  | 
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 8-XSON (1.95x1)
    Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 8-XSON (1.95x1)
на замовлення 4700 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1664+ | 14.87 грн | 
| BUK7E3R1-40E,127-NXP | 
Виробник: NXP USA Inc.
Description: PFET, 100A I(D), 40V, 0.0031OHM,
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 234W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 79 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6200 pF @ 25 V
    Description: PFET, 100A I(D), 40V, 0.0031OHM,
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 234W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 79 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6200 pF @ 25 V
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| ON5233,118 | 
Виробник: NXP USA Inc.
Description: RF MOSFET SOT428 DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Supplier Device Package: DPAK
    Description: RF MOSFET SOT428 DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Supplier Device Package: DPAK
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| P1010NSN5HFB |  | 
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
    Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
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| BZX585-C36115 |  | 
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZX585-C36 ZENER DI
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOD-523
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
    Description: NOW NEXPERIA BZX585-C36 ZENER DI
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOD-523
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
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| 74ALVCH16843DGG653 |  | 
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 423+ | 58.65 грн | 
| MC908JK3EMDWE |  | 
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
    Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
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| TDF8541JV/N3ZU |  | 
Виробник: NXP USA Inc.
Description: TDF8541JV
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Mounting Type: Through Hole
Supplier Device Package: DBS27P
    Description: TDF8541JV
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Mounting Type: Through Hole
Supplier Device Package: DBS27P
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| TJA1103AHN/0Z |  | 
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
    Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 4000+ | 74.58 грн | 
| TJA1103AHN/0Z |  | 
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
    Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
на замовлення 5698 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 2+ | 219.74 грн | 
| 10+ | 158.30 грн | 
| 25+ | 145.07 грн | 
| 100+ | 122.48 грн | 
| 250+ | 115.97 грн | 
| 500+ | 112.04 грн | 
| 1000+ | 107.03 грн |