Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35310) > Сторінка 502 з 589

Обрати Сторінку:   [  << Попередня Сторінка ]  1 58 116 174 232 290 348 406 464 497 498 499 500 501 502 503 504 505 506 507 522 580 589  [ Наступна Сторінка >> ]
Фото Назва Виробник Інформація Доступність
Ціна
S32K342NHT0MPAST S32K342NHT0MPAST NXP USA Inc. S32K3xx.pdf Description: S32K342, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
GTL2014PWZ GTL2014PWZ NXP USA Inc. GTL2014.pdf Description: IC XLTR MS BIDIR 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: LVTTL
Number of Circuits: 1
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+30.35 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
GTL2014PWZ GTL2014PWZ NXP USA Inc. GTL2014.pdf Description: IC XLTR MS BIDIR 14-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: LVTTL
Number of Circuits: 1
на замовлення 3703 шт:
термін постачання 21-31 дні (днів)
6+64.44 грн
10+44.47 грн
25+40.12 грн
100+33.11 грн
250+30.94 грн
500+29.64 грн
1000+29.07 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
GTL2034PWZ GTL2034PWZ NXP USA Inc. GTL2034.pdf Description: IC BUS BUFFER 3.6V 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Bus Buffer
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: -, 40mA
Supplier Device Package: 14-TSSOP
товару немає в наявності
В кошику  од. на суму  грн.
S9S12G64AMLF S9S12G64AMLF NXP USA Inc. S12GFS.pdf Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 1250 шт:
термін постачання 21-31 дні (днів)
1+435.35 грн
10+321.30 грн
25+296.94 грн
100+253.54 грн
250+241.56 грн
500+234.34 грн
1250+223.00 грн
В кошику  од. на суму  грн.
FRDM-MC-LVBLDC FRDM-MC-LVBLDC NXP USA Inc. KV3XFS.pdf Description: EVAL BOARD FOR FAN7888
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: FAN7888
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC)
товару немає в наявності
В кошику  од. на суму  грн.
S912XDG128F2CAA S912XDG128F2CAA NXP USA Inc. MC9S12XDP512RMV2.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
P2040NSN1MMB NXP USA Inc. P2040_Rev2.pdf Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA
Packaging: Tray
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
товару немає в наявності
В кошику  од. на суму  грн.
MC9S08AC128MFUE MC9S08AC128MFUE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
TDA6111Q/N4,112 TDA6111Q/N4,112 NXP USA Inc. TDA6111Q.pdf Description: IC AMP GENERAL PURPOSE DBS9MPF
Packaging: Tube
Package / Case: 9-SIP Exposed Tab, Formed Leads
Mounting Type: Through Hole
Applications: Standard (General Purpose)
Slew Rate: 3000V/µs
Supplier Device Package: DBS9MPF
Number of Circuits: 1
Current - Supply: 9 mA
Current - Output / Channel: 10 A
-3db Bandwidth: 16 MHz
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41052AFPBR KW45Z41052AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41052AFTBR KW45Z41052AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41053AFPBR KW45Z41053AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41082AFPBR KW45Z41082AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41053AFTBR KW45Z41053AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45B41Z52AFPBR KW45B41Z52AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41082AFTBR KW45Z41082AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41083AFPBR KW45Z41083AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45B41Z53AFPBR KW45B41Z53AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41083AFTBR KW45Z41083AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MVR5510AMMALESR2 MVR5510AMMALESR2 NXP USA Inc. VR5510.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MVR5510AMBALESR2 NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
товару немає в наявності
В кошику  од. на суму  грн.
MVR5510AMDALESR2 NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
товару немає в наявності
В кошику  од. на суму  грн.
MC33PF8200CLESR2 MC33PF8200CLESR2 NXP USA Inc. Description: PF8200
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
товару немає в наявності
В кошику  од. на суму  грн.
MRFX1K80NR5 MRFX1K80NR5 NXP USA Inc. MRFX1K80N.pdf Description: RF MOSFET LDMOS 65V OM1230-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Voltage - Test: 65 V
на замовлення 48 шт:
термін постачання 21-31 дні (днів)
1+14996.84 грн
10+12335.49 грн
25+11809.81 грн
В кошику  од. на суму  грн.
PSMN1R7-25YLC,115 PSMN1R7-25YLC,115 NXP USA Inc. Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Power Dissipation (Max): 164W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 59 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3735 pF @ 12 V
товару немає в наявності
В кошику  од. на суму  грн.
RPI-CAM-MIPI RPI-CAM-MIPI NXP USA Inc. rpi-cam-mipi_overview.html?_gl=1*ongqnl*_ga*MTEwNjQyMjAzOS4xNzAxMjAxMTg0*_ga_WM5LE0KMSH*MTcwNDkwNDE3OS4xMS4xLjE3MDQ5MDg1ODcuMC4wLjA. Description: ACCESSORY BOARD:MIPI CAMERA CARD
Packaging: Box
For Use With/Related Products: AP1302, AR0144
Accessory Type: Adapter Board
Utilized IC / Part: AP1302, AR0144
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+8961.43 грн
В кошику  од. на суму  грн.
A2I22D050NR1 A2I22D050NR1 NXP USA Inc. Description: IC AMP W-CDMA 1.8-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 34dB
Current - Supply: 520mA
P1dB: 16.5dBm
Test Frequency: 1.8GHz
Supplier Device Package: TO-270WB-15
товару немає в наявності
В кошику  од. на суму  грн.
A2I22D050NR1 A2I22D050NR1 NXP USA Inc. Description: IC AMP W-CDMA 1.8-2.2GHZ TO270WB
Packaging: Cut Tape (CT)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 34dB
Current - Supply: 520mA
P1dB: 16.5dBm
Test Frequency: 1.8GHz
Supplier Device Package: TO-270WB-15
товару немає в наявності
В кошику  од. на суму  грн.
BGU8M1UK/SZ NXP USA Inc. Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB
Current - Supply: 5mA
Noise Figure: 0.7dB
P1dB: -5dBm
Test Frequency: 1.843GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
товару немає в наявності
В кошику  од. на суму  грн.
S32K314EHT1MMMST S32K314EHT1MMMST NXP USA Inc. S32K3xx.pdf Description: S32K344 PHANTOM, 257MAPBGA, PROD
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
на замовлення 686 шт:
термін постачання 21-31 дні (днів)
1+1621.61 грн
10+1250.99 грн
25+1173.32 грн
100+1020.98 грн
250+982.78 грн
В кошику  од. на суму  грн.
S32K314NHT1MMMST S32K314NHT1MMMST NXP USA Inc. S32K3xx.pdf Description: S32K344 PHANTOM, 257MAPBGA, PROD
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K344NHT1VMMST S32K344NHT1VMMST NXP USA Inc. Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K344NHT1VPBST S32K344NHT1VPBST NXP USA Inc. Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K344NHT1MMMST S32K344NHT1MMMST NXP USA Inc. Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K344NHT1MPBSR S32K344NHT1MPBSR NXP USA Inc. Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K344NHT1MPBST S32K344NHT1MPBST NXP USA Inc. Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K344EHT1MMMST S32K344EHT1MMMST NXP USA Inc. Description: LOCKSTEP CORE M7, 160MHZ, 4M FLA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K344EHT1MPBST S32K344EHT1MPBST NXP USA Inc. Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K3X4EVBQ172NE NXP USA Inc. S32KBRA4.pdf Description: S32K3X4EVBQ172NE
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
товару немає в наявності
В кошику  од. на суму  грн.
S32K3X4EVBQ172ND NXP USA Inc. Description: S32K3X4EVBQ172ND
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
товару немає в наявності
В кошику  од. на суму  грн.
S32K3X4EVBQ172NS NXP USA Inc. S32KBRA4.pdf Description: S32K3X4EVBQ172NS
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
товару немає в наявності
В кошику  од. на суму  грн.
S32K3X4EVB-Q257 NXP USA Inc. S32K3X4EVB-Q257%20and%20Q257ND%20Evaluation%20Board%20%E2%80%93%20HW%20User%20Manual.pdf Description: S32K3X4EVB-Q257 FULL-FEATURED EV
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
товару немає в наявності
В кошику  од. на суму  грн.
RD-K344BMU NXP USA Inc. Description: RD-K344BMU
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: S32K344
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
товару немає в наявності
В кошику  од. на суму  грн.
S32K314EHT1VPBST S32K314EHT1VPBST NXP USA Inc. S32K3xx.pdf Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MPC603RRX266LC MPC603RRX266LC NXP USA Inc. MPC603E7TEC.pdf Description: IC MPU MPC6XX 266MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товару немає в наявності
В кошику  од. на суму  грн.
BLF8G27LS-100V,112 NXP USA Inc. PHGLS25948-1.pdf?t.download=true&u=5oefqw Description: NOW AMPLEON, BLF8G27LS-100V, POW
Packaging: Bulk
Package / Case: SOT-1244B
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Power - Output: 25W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM6
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 900 mA
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
6+4328.71 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
BLF8G27LS-100V,118 NXP USA Inc. PHGLS25948-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 28V CDFM6
Packaging: Bulk
Package / Case: SOT-1244B
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Power - Output: 25W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM6
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 900 mA
на замовлення 74 шт:
термін постачання 21-31 дні (днів)
6+4310.26 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
S9S12G128AVLFR S9S12G128AVLFR NXP USA Inc. MC9S12G_Family_Manual_and_Datasheet.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
2000+357.38 грн
Мінімальне замовлення: 2000
В кошику  од. на суму  грн.
S9S12G128AVLFR S9S12G128AVLFR NXP USA Inc. MC9S12G_Family_Manual_and_Datasheet.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
1+654.26 грн
10+494.96 грн
100+409.75 грн
1000+335.39 грн
В кошику  од. на суму  грн.
S9S12GN48F0WLFR S9S12GN48F0WLFR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
S9S12G96ACLFR S9S12G96ACLFR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
S9S12G96F0MLFR S9S12G96F0MLFR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
S9S12G64AMLHR S9S12G64AMLHR NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
74AVCH2T45GS115 NXP USA Inc. 74AVCH2T45.pdf Description: NOW NEXPERIA 74AVCH2T45GS - BUS
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
TEA19032BAAT/1J TEA19032BAAT/1J NXP USA Inc. TEA19032BT.pdf Description: IC SMPS CTRLR SMART CHARGE SO10
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Function: Controller
Interface: USB
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 10-SO
DigiKey Programmable: Not Verified
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)
2500+90.22 грн
5000+83.66 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
TEA19032BAAT/1J TEA19032BAAT/1J NXP USA Inc. TEA19032BT.pdf Description: IC SMPS CTRLR SMART CHARGE SO10
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Function: Controller
Interface: USB
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 10-SO
DigiKey Programmable: Not Verified
на замовлення 9994 шт:
термін постачання 21-31 дні (днів)
2+197.44 грн
10+170.55 грн
25+160.88 грн
100+128.64 грн
250+120.79 грн
500+105.69 грн
1000+86.14 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
PDTC114EE,115 PDTC114EE,115 NXP USA Inc. PDTC114E_SER.pdf description Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
товару немає в наявності
В кошику  од. на суму  грн.
PDTC114EE,115 PDTC114EE,115 NXP USA Inc. PDTC114E_SER.pdf description Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
товару немає в наявності
В кошику  од. на суму  грн.
MIMX8US3DVK08SC MIMX8US3DVK08SC NXP USA Inc. IMX8ULPCEC.pdf Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Supplier Device Package: 512-VFBGA (9.4x9.4)
товару немає в наявності
В кошику  од. на суму  грн.
S32K342NHT0MPAST S32K3xx.pdf
S32K342NHT0MPAST
Виробник: NXP USA Inc.
Description: S32K342, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
GTL2014PWZ GTL2014.pdf
GTL2014PWZ
Виробник: NXP USA Inc.
Description: IC XLTR MS BIDIR 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: LVTTL
Number of Circuits: 1
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+30.35 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
GTL2014PWZ GTL2014.pdf
GTL2014PWZ
Виробник: NXP USA Inc.
Description: IC XLTR MS BIDIR 14-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: LVTTL
Number of Circuits: 1
на замовлення 3703 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+64.44 грн
10+44.47 грн
25+40.12 грн
100+33.11 грн
250+30.94 грн
500+29.64 грн
1000+29.07 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
GTL2034PWZ GTL2034.pdf
GTL2034PWZ
Виробник: NXP USA Inc.
Description: IC BUS BUFFER 3.6V 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Bus Buffer
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: -, 40mA
Supplier Device Package: 14-TSSOP
товару немає в наявності
В кошику  од. на суму  грн.
S9S12G64AMLF S12GFS.pdf
S9S12G64AMLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 1250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+435.35 грн
10+321.30 грн
25+296.94 грн
100+253.54 грн
250+241.56 грн
500+234.34 грн
1250+223.00 грн
В кошику  од. на суму  грн.
FRDM-MC-LVBLDC KV3XFS.pdf
FRDM-MC-LVBLDC
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR FAN7888
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: FAN7888
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC)
товару немає в наявності
В кошику  од. на суму  грн.
S912XDG128F2CAA MC9S12XDP512RMV2.pdf
S912XDG128F2CAA
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
P2040NSN1MMB P2040_Rev2.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA
Packaging: Tray
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
товару немає в наявності
В кошику  од. на суму  грн.
MC9S08AC128MFUE MC9S08AC60AD.pdf
MC9S08AC128MFUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
TDA6111Q/N4,112 TDA6111Q.pdf
TDA6111Q/N4,112
Виробник: NXP USA Inc.
Description: IC AMP GENERAL PURPOSE DBS9MPF
Packaging: Tube
Package / Case: 9-SIP Exposed Tab, Formed Leads
Mounting Type: Through Hole
Applications: Standard (General Purpose)
Slew Rate: 3000V/µs
Supplier Device Package: DBS9MPF
Number of Circuits: 1
Current - Supply: 9 mA
Current - Output / Channel: 10 A
-3db Bandwidth: 16 MHz
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41052AFPBR KW45.pdf
KW45Z41052AFPBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41052AFTBR KW45.pdf
KW45Z41052AFTBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41053AFPBR KW45.pdf
KW45Z41053AFPBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41082AFPBR KW45.pdf
KW45Z41082AFPBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41053AFTBR KW45.pdf
KW45Z41053AFTBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45B41Z52AFPBR KW45.pdf
KW45B41Z52AFPBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41082AFTBR KW45.pdf
KW45Z41082AFTBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41083AFPBR KW45.pdf
KW45Z41083AFPBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45B41Z53AFPBR KW45.pdf
KW45B41Z53AFPBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KW45Z41083AFTBR KW45.pdf
KW45Z41083AFTBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MVR5510AMMALESR2 VR5510.pdf
MVR5510AMMALESR2
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MVR5510AMBALESR2
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
товару немає в наявності
В кошику  од. на суму  грн.
MVR5510AMDALESR2
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
товару немає в наявності
В кошику  од. на суму  грн.
MC33PF8200CLESR2
MC33PF8200CLESR2
Виробник: NXP USA Inc.
Description: PF8200
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
товару немає в наявності
В кошику  од. на суму  грн.
MRFX1K80NR5 MRFX1K80N.pdf
MRFX1K80NR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 65V OM1230-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Voltage - Test: 65 V
на замовлення 48 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+14996.84 грн
10+12335.49 грн
25+11809.81 грн
В кошику  од. на суму  грн.
PSMN1R7-25YLC,115
PSMN1R7-25YLC,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Power Dissipation (Max): 164W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 59 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3735 pF @ 12 V
товару немає в наявності
В кошику  од. на суму  грн.
RPI-CAM-MIPI rpi-cam-mipi_overview.html?_gl=1*ongqnl*_ga*MTEwNjQyMjAzOS4xNzAxMjAxMTg0*_ga_WM5LE0KMSH*MTcwNDkwNDE3OS4xMS4xLjE3MDQ5MDg1ODcuMC4wLjA.
RPI-CAM-MIPI
Виробник: NXP USA Inc.
Description: ACCESSORY BOARD:MIPI CAMERA CARD
Packaging: Box
For Use With/Related Products: AP1302, AR0144
Accessory Type: Adapter Board
Utilized IC / Part: AP1302, AR0144
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+8961.43 грн
В кошику  од. на суму  грн.
A2I22D050NR1
A2I22D050NR1
Виробник: NXP USA Inc.
Description: IC AMP W-CDMA 1.8-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 34dB
Current - Supply: 520mA
P1dB: 16.5dBm
Test Frequency: 1.8GHz
Supplier Device Package: TO-270WB-15
товару немає в наявності
В кошику  од. на суму  грн.
A2I22D050NR1
A2I22D050NR1
Виробник: NXP USA Inc.
Description: IC AMP W-CDMA 1.8-2.2GHZ TO270WB
Packaging: Cut Tape (CT)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 34dB
Current - Supply: 520mA
P1dB: 16.5dBm
Test Frequency: 1.8GHz
Supplier Device Package: TO-270WB-15
товару немає в наявності
В кошику  од. на суму  грн.
BGU8M1UK/SZ
Виробник: NXP USA Inc.
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB
Current - Supply: 5mA
Noise Figure: 0.7dB
P1dB: -5dBm
Test Frequency: 1.843GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
товару немає в наявності
В кошику  од. на суму  грн.
S32K314EHT1MMMST S32K3xx.pdf
S32K314EHT1MMMST
Виробник: NXP USA Inc.
Description: S32K344 PHANTOM, 257MAPBGA, PROD
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
на замовлення 686 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1621.61 грн
10+1250.99 грн
25+1173.32 грн
100+1020.98 грн
250+982.78 грн
В кошику  од. на суму  грн.
S32K314NHT1MMMST S32K3xx.pdf
S32K314NHT1MMMST
Виробник: NXP USA Inc.
Description: S32K344 PHANTOM, 257MAPBGA, PROD
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K344NHT1VMMST
S32K344NHT1VMMST
Виробник: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K344NHT1VPBST
S32K344NHT1VPBST
Виробник: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K344NHT1MMMST
S32K344NHT1MMMST
Виробник: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K344NHT1MPBSR
S32K344NHT1MPBSR
Виробник: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K344NHT1MPBST
S32K344NHT1MPBST
Виробник: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K344EHT1MMMST
S32K344EHT1MMMST
Виробник: NXP USA Inc.
Description: LOCKSTEP CORE M7, 160MHZ, 4M FLA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K344EHT1MPBST
S32K344EHT1MPBST
Виробник: NXP USA Inc.
Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S32K3X4EVBQ172NE S32KBRA4.pdf
Виробник: NXP USA Inc.
Description: S32K3X4EVBQ172NE
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
товару немає в наявності
В кошику  од. на суму  грн.
S32K3X4EVBQ172ND
Виробник: NXP USA Inc.
Description: S32K3X4EVBQ172ND
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
товару немає в наявності
В кошику  од. на суму  грн.
S32K3X4EVBQ172NS S32KBRA4.pdf
Виробник: NXP USA Inc.
Description: S32K3X4EVBQ172NS
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
товару немає в наявності
В кошику  од. на суму  грн.
S32K3X4EVB-Q257 S32K3X4EVB-Q257%20and%20Q257ND%20Evaluation%20Board%20%E2%80%93%20HW%20User%20Manual.pdf
Виробник: NXP USA Inc.
Description: S32K3X4EVB-Q257 FULL-FEATURED EV
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
товару немає в наявності
В кошику  од. на суму  грн.
RD-K344BMU
Виробник: NXP USA Inc.
Description: RD-K344BMU
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: S32K344
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
товару немає в наявності
В кошику  од. на суму  грн.
S32K314EHT1VPBST S32K3xx.pdf
S32K314EHT1VPBST
Виробник: NXP USA Inc.
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MPC603RRX266LC MPC603E7TEC.pdf
MPC603RRX266LC
Виробник: NXP USA Inc.
Description: IC MPU MPC6XX 266MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товару немає в наявності
В кошику  од. на суму  грн.
BLF8G27LS-100V,112 PHGLS25948-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: NOW AMPLEON, BLF8G27LS-100V, POW
Packaging: Bulk
Package / Case: SOT-1244B
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Power - Output: 25W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM6
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 900 mA
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+4328.71 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
BLF8G27LS-100V,118 PHGLS25948-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V CDFM6
Packaging: Bulk
Package / Case: SOT-1244B
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Power - Output: 25W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM6
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 900 mA
на замовлення 74 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+4310.26 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
S9S12G128AVLFR MC9S12G_Family_Manual_and_Datasheet.pdf
S9S12G128AVLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2000+357.38 грн
Мінімальне замовлення: 2000
В кошику  од. на суму  грн.
S9S12G128AVLFR MC9S12G_Family_Manual_and_Datasheet.pdf
S9S12G128AVLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+654.26 грн
10+494.96 грн
100+409.75 грн
1000+335.39 грн
В кошику  од. на суму  грн.
S9S12GN48F0WLFR
S9S12GN48F0WLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
S9S12G96ACLFR
S9S12G96ACLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
S9S12G96F0MLFR MC9S12GRMV1.pdf
S9S12G96F0MLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
S9S12G64AMLHR
S9S12G64AMLHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
74AVCH2T45GS115 74AVCH2T45.pdf
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AVCH2T45GS - BUS
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
TEA19032BAAT/1J TEA19032BT.pdf
TEA19032BAAT/1J
Виробник: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHARGE SO10
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Function: Controller
Interface: USB
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 10-SO
DigiKey Programmable: Not Verified
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+90.22 грн
5000+83.66 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
TEA19032BAAT/1J TEA19032BT.pdf
TEA19032BAAT/1J
Виробник: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHARGE SO10
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Function: Controller
Interface: USB
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 10-SO
DigiKey Programmable: Not Verified
на замовлення 9994 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+197.44 грн
10+170.55 грн
25+160.88 грн
100+128.64 грн
250+120.79 грн
500+105.69 грн
1000+86.14 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
PDTC114EE,115 description PDTC114E_SER.pdf
PDTC114EE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
товару немає в наявності
В кошику  од. на суму  грн.
PDTC114EE,115 description PDTC114E_SER.pdf
PDTC114EE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
товару немає в наявності
В кошику  од. на суму  грн.
MIMX8US3DVK08SC IMX8ULPCEC.pdf
MIMX8US3DVK08SC
Виробник: NXP USA Inc.
Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Supplier Device Package: 512-VFBGA (9.4x9.4)
товару немає в наявності
В кошику  од. на суму  грн.
Обрати Сторінку:   [  << Попередня Сторінка ]  1 58 116 174 232 290 348 406 464 497 498 499 500 501 502 503 504 505 506 507 522 580 589  [ Наступна Сторінка >> ]