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AFT27S010NT1 AFT27S010NT1 NXP USA Inc. AFT27S010N.pdf Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
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AFT27S010NT1 AFT27S010NT1 NXP USA Inc. AFT27S010N.pdf Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
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MPC870ZT133 MPC870ZT133 NXP USA Inc. MPC875%2C870.pdf Description: IC MPU MPC8XX 133MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
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MPC870CVR66 MPC870CVR66 NXP USA Inc. MPC875EC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
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S912ZVL12AVLFR NXP USA Inc. Description: S12Z CPU, 6128K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
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SL3S1214FTB0/1X SL3S1214FTB0/1X NXP USA Inc. SL3S1214.pdf Description: IC RFID TRANSP 860-960MHZ 6XSON
Standards: EPC
Operating Temperature: -40°C ~ 85°C (TA)
Type: RFID Transponder
Frequency: 860MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
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SL3S1214FTB0/1X SL3S1214FTB0/1X NXP USA Inc. SL3S1214.pdf Description: IC RFID TRANSP 860-960MHZ 6XSON
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Standards: EPC
Operating Temperature: -40°C ~ 85°C (TA)
Type: RFID Transponder
Frequency: 860MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
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NZH3V0B115 NZH3V0B115 NXP USA Inc. NZH_SER.pdf Description: NOW NEXPERIA NZH3V0B - ZENER DIO
Tolerance: ±5%
Packaging: Bulk
Package / Case: SOD-123F
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOD-123F
Grade: Automotive
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
Qualification: AEC-Q100
на замовлення 25950 шт:
термін постачання 21-31 дні (днів)
11823+2.25 грн
Мінімальне замовлення: 11823 шт
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MPC8377VRANGA MPC8377VRANGA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Number of Cores/Bus Width: 1 Core, 32-Bit
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S912ZVC19AVKHR S912ZVC19AVKHR NXP USA Inc. Description: IC MCU 16BIT 192KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 42
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S912ZVC19AVKH S912ZVC19AVKH NXP USA Inc. Description: IC MCU 16BIT 192KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 28
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STMP3780XXBBEA5N NXP USA Inc. Description: STMP3780XXBBEA5N
Packaging: Bulk
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PH5830DLX NXP USA Inc. Description: PH5830 - N-CHANNEL TRENCHMOS LOG
Packaging: Bulk
на замовлення 152950 шт:
термін постачання 21-31 дні (днів)
1268+17.37 грн
Мінімальне замовлення: 1268 шт
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PH5830DL,115 PH5830DL,115 NXP USA Inc. Description: PH5830 - N-CHANNEL TRENCHMOS LOG
Packaging: Bulk
на замовлення 106500 шт:
термін постачання 21-31 дні (днів)
1268+17.37 грн
Мінімальне замовлення: 1268 шт
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ASL2416SHNY ASL2416SHNY NXP USA Inc. ASL2416SHN.pdf Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 2.5V ~ 70V
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 100kHz ~ 2MHz
Type: Linear
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive, Lighting
Current - Output / Channel: 1.5A
Internal Switch(s): No
Topology: Buck
Supplier Device Package: 32-HVQFN (5x5)
Dimming: PWM
Voltage - Supply (Min): 10V
Voltage - Supply (Max): 80V
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ASL2416SHNY ASL2416SHNY NXP USA Inc. ASL2416SHN.pdf Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Voltage - Supply (Max): 80V
Voltage - Supply (Min): 10V
Dimming: PWM
Supplier Device Package: 32-HVQFN (5x5)
Topology: Buck
Internal Switch(s): No
Current - Output / Channel: 1.5A
Applications: Automotive, Lighting
Operating Temperature: -40°C ~ 125°C (TA)
Type: Linear
Frequency: 100kHz ~ 2MHz
Number of Outputs: 2
Mounting Type: Surface Mount
Voltage - Output: 2.5V ~ 70V
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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ASL2416SHN/L1Y NXP USA Inc. Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Voltage - Supply (Min): 10V
Dimming: PWM
Supplier Device Package: 32-HVQFN (5x5)
Topology: Buck
Internal Switch(s): No
Current - Output / Channel: 1.5A
Applications: Automotive, Lighting
Operating Temperature: -40°C ~ 125°C (TA)
Type: Linear
Frequency: 100kHz ~ 2MHz
Number of Outputs: 2
Mounting Type: Surface Mount
Voltage - Output: 2.5V ~ 70V
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Voltage - Supply (Max): 80V
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S912ZVCA96F0MLFR S912ZVCA96F0MLFR NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 96KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x12b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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S912ZVCA96F0MLF S912ZVCA96F0MLF NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 96KB FLASH 48LQFP
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x12b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
на замовлення 2470 шт:
термін постачання 21-31 дні (днів)
1+596.54 грн
10+444.62 грн
25+412.17 грн
80+357.84 грн
230+338.60 грн
440+329.32 грн
1250+312.31 грн
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MIMXRT1042XFP5B MIMXRT1042XFP5B NXP USA Inc. IMXRT1040XEC.pdf Description: IC MCU 32BIT 128KB ROM 169LFBGA
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 512K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Supplier Device Package: 169-LFBGA (9x9)
Peripherals: DMA, I2S, LCD, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, MMC/SD, SAI, SPI, UART/USART, USB
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M7
на замовлення 502 шт:
термін постачання 21-31 дні (днів)
1+1041.17 грн
10+801.71 грн
80+677.08 грн
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MIMXRT1041DFP6B MIMXRT1041DFP6B NXP USA Inc. Description: IC MCU 32BIT 128KB ROM 169LFBGA
DigiKey Programmable: Not Verified
Package / Case: 169-LFBGA
Packaging: Tray
Supplier Device Package: 169-LFBGA (9x9)
Peripherals: DMA, I²S, LCD, PWM, WDT
Connectivity: CANbus, Ethernet, I²C, MMC/SD, SAI, SPI, UART/USART, USB
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 90°C (TJ)
RAM Size: 512K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 600MHz
Mounting Type: Surface Mount
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MIMXRT1042DFP6B MIMXRT1042DFP6B NXP USA Inc. Description: IC MCU 32BIT 128KB ROM 169LFBGA
Connectivity: CANbus, Ethernet, I2C, MMC/SD, SAI, SPI, UART/USART, USB
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 90°C (TJ)
RAM Size: 512K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Supplier Device Package: 169-LFBGA (9x9)
Peripherals: DMA, I2S, LCD, PWM, WDT
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)
1+852.08 грн
10+644.61 грн
80+533.67 грн
1300+436.82 грн
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S9KEAZ128AMLHR S9KEAZ128AMLHR NXP USA Inc. S9KEAZ128AMLHR.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
на замовлення 1033 шт:
термін постачання 21-31 дні (днів)
84+271.90 грн
Мінімальне замовлення: 84 шт
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MC9S08QG4CDNER MC9S08QG4CDNER NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 8SOIC
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 4
Supplier Device Package: 8-SOIC
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MC9S08GT16AMFBE MC9S08GT16AMFBE NXP USA Inc. MC9S08GT16A.pdf Description: IC MCU 8BIT 16KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
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MCHC908LK24CFQE MCHC908LK24CFQE NXP USA Inc. MC68HC908LJ24.pdf Description: IC MCU 8BIT 24KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 80-QFP (14x14)
Peripherals: LCD, LVD, POR, PWM
Connectivity: I2C, IRSCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 768 x 8
Program Memory Size: 24KB (24K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: HC08
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SL3S1003FUD/BG,003 NXP USA Inc. SL3S1003_1013.pdf Description: IC UCODE G2IM TRANSPONDER DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0V ~ 1.85V
Standards: EPC
Supplier Device Package: Wafer
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MPC8377EVRAGD MPC8377EVRAGD NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8377EVRAJF MPC8377EVRAJF NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8379EVRAGD MPC8379EVRAGD NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (4)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8379EVRAJF MPC8379EVRAJF NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 533MHZ PBGA689
SATA: SATA 3Gbps (4)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.0
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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В кошику  од. на суму  грн.
MPC8379EVRANG MPC8379EVRANG NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
SATA: SATA 3Gbps (4)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.0
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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В кошику  од. на суму  грн.
MPC8378EVRAGD MPC8378EVRAGD NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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В кошику  од. на суму  грн.
MPC8377CVRALG MPC8377CVRALG NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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В кошику  од. на суму  грн.
MPC8377EVRANG MPC8377EVRANG NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8377EWLANB NXP USA Inc. MPC837XFFS.pdf Description: ACCESS POINT/ROUTER MPC8377
Packaging: Box
Function: Router
Interface: USB
Applications: General Purpose
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В кошику  од. на суму  грн.
MPC8377VRALG MPC8377VRALG NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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PEMI2QFN/WR,115 PEMI2QFN/WR,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/21PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 2
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)
3806+5.84 грн
Мінімальне замовлення: 3806 шт
В кошику  од. на суму  грн.
MPC8569CVTANKGB MPC8569CVTANKGB NXP USA Inc. MPC8569EEC.pdf Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3, SDRAM
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (8), 1Gbps (4)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
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В кошику  од. на суму  грн.
MPC8569CVTAQLJB MPC8569CVTAQLJB NXP USA Inc. MPC8569EEC.pdf Description: IC MPU MPC85XX 1.067GHZ 783BGA
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3, SDRAM
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (8), 1Gbps (4)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.067GHz
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MC9S12A512CPVER MC9S12A512CPVER NXP USA Inc. 9S12DT128DGV2.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 14K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
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S32K314EHT1MPBST S32K314EHT1MPBST NXP USA Inc. S32K3xx.pdf Description: SINGLE CORE M7, 160MHZ, 4M FLASH
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
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FS32K144HFT0MLLT FS32K144HFT0MLLT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 635 шт:
термін постачання 21-31 дні (днів)
1+744.48 грн
10+559.28 грн
25+519.77 грн
80+452.60 грн
230+429.20 грн
450+417.56 грн
В кошику  од. на суму  грн.
FS32K144HAT0MLHT FS32K144HAT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 698 шт:
термін постачання 21-31 дні (днів)
1+667.74 грн
10+500.62 грн
25+465.01 грн
100+399.72 грн
250+382.24 грн
В кошику  од. на суму  грн.
FS32K144HFT0VLHT FS32K144HFT0VLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 752 шт:
термін постачання 21-31 дні (днів)
1+683.56 грн
10+511.67 грн
25+475.07 грн
80+413.23 грн
230+391.57 грн
В кошику  од. на суму  грн.
FS32K144HFT0MLHT FS32K144HFT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 745 шт:
термін постачання 21-31 дні (днів)
1+712.84 грн
10+534.60 грн
25+496.64 грн
80+432.22 грн
230+409.74 грн
В кошику  од. на суму  грн.
FX32K144HAT0MLLT NXP USA Inc. Description: S32K144 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tray
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В кошику  од. на суму  грн.
FS32K144UAT0VLLT FS32K144UAT0VLLT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 253 шт:
термін постачання 21-31 дні (днів)
1+788.79 грн
10+593.57 грн
25+552.07 грн
80+481.08 грн
230+456.50 грн
В кошику  од. на суму  грн.
SA58631TK,115 SA58631TK,115 NXP USA Inc. SA58631.pdf Description: IC AMP CLASS AB MONO 3W 8HVSON
Supplier Device Package: 8-HVSON (4x4)
Max Output Power x Channels @ Load: 3W x 1 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 8-VDFN Exposed Pad
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
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В кошику  од. на суму  грн.
SC667644DVL6B NXP USA Inc. Description: I.MXRT1050 CUSTOM
Packaging: Tray
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В кошику  од. на суму  грн.
MC9S08PT16VTJ MC9S08PT16VTJ NXP USA Inc. MC9S08PT16.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
DigiKey Programmable: Not Verified
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74ALVCH16543DGG512 74ALVCH16543DGG512 NXP USA Inc. 74ALVCH16543.pdf Description: REGISTERED BUS TRANSCEIVER
Packaging: Bulk
на замовлення 875 шт:
термін постачання 21-31 дні (днів)
182+123.82 грн
Мінімальне замовлення: 182 шт
В кошику  од. на суму  грн.
MC56F8246MLF MC56F8246MLF NXP USA Inc. FSCLS11848-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 16-BIT, FLASH,
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 10x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 900 шт:
термін постачання 21-31 дні (днів)
40+568.91 грн
Мінімальне замовлення: 40 шт
В кошику  од. на суму  грн.
NCF2952XTT/T0E080J NCF2952XTT/T0E080J NXP USA Inc. 75017275.pdf Description: IC REMOTE KEYLESS 125KHZ 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 125kHz
Interface: SPI
Supplier Device Package: 38-TSSOP
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SAF7755HV/N208W/SY NXP USA Inc. Description: CAR DISP
Packaging: Bulk
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В кошику  од. на суму  грн.
S9S12P96J0CQKR S9S12P96J0CQKR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
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MC33FS8430G0ESR2 MC33FS8430G0ESR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SYSTEM BASIS CHIP FS8430
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 56-HVQFN (8x8)
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MK10DX128VLH7R MK10DX128VLH7R NXP USA Inc. Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 26x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
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SL3ICS1002FUGV7AFZ NXP USA Inc. Description: UCODE G2XM AND G2XL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15962, ISO 15963, ISO 18000-1, ISO 18000-6, ISO 19762
Supplier Device Package: Wafer
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SL2ICS2001DW/V1D,0 NXP USA Inc. 058031.pdf Description: IC I-CODE SLI SMART LABEL DIE
Packaging: Bulk
Style: Inlay
Frequency: 13.56MHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 15693
Writable Memory: 1024b (User)
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AFT27S010NT1 AFT27S010N.pdf
AFT27S010NT1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
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AFT27S010NT1 AFT27S010N.pdf
AFT27S010NT1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
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MPC870ZT133 MPC875%2C870.pdf
MPC870ZT133
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
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MPC870CVR66 MPC875EC.pdf
MPC870CVR66
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
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S912ZVL12AVLFR
Виробник: NXP USA Inc.
Description: S12Z CPU, 6128K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
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SL3S1214FTB0/1X SL3S1214.pdf
SL3S1214FTB0/1X
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 860-960MHZ 6XSON
Standards: EPC
Operating Temperature: -40°C ~ 85°C (TA)
Type: RFID Transponder
Frequency: 860MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
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SL3S1214FTB0/1X SL3S1214.pdf
SL3S1214FTB0/1X
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 860-960MHZ 6XSON
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Standards: EPC
Operating Temperature: -40°C ~ 85°C (TA)
Type: RFID Transponder
Frequency: 860MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
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NZH3V0B115 NZH_SER.pdf
NZH3V0B115
Виробник: NXP USA Inc.
Description: NOW NEXPERIA NZH3V0B - ZENER DIO
Tolerance: ±5%
Packaging: Bulk
Package / Case: SOD-123F
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOD-123F
Grade: Automotive
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
Qualification: AEC-Q100
на замовлення 25950 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
11823+2.25 грн
Мінімальне замовлення: 11823 шт
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MPC8377VRANGA MPC8377E.pdf
MPC8377VRANGA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Number of Cores/Bus Width: 1 Core, 32-Bit
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S912ZVC19AVKHR
S912ZVC19AVKHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 42
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S912ZVC19AVKH
S912ZVC19AVKH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 28
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STMP3780XXBBEA5N
Виробник: NXP USA Inc.
Description: STMP3780XXBBEA5N
Packaging: Bulk
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PH5830DLX
Виробник: NXP USA Inc.
Description: PH5830 - N-CHANNEL TRENCHMOS LOG
Packaging: Bulk
на замовлення 152950 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1268+17.37 грн
Мінімальне замовлення: 1268 шт
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PH5830DL,115
PH5830DL,115
Виробник: NXP USA Inc.
Description: PH5830 - N-CHANNEL TRENCHMOS LOG
Packaging: Bulk
на замовлення 106500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1268+17.37 грн
Мінімальне замовлення: 1268 шт
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ASL2416SHNY ASL2416SHN.pdf
ASL2416SHNY
Виробник: NXP USA Inc.
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 2.5V ~ 70V
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 100kHz ~ 2MHz
Type: Linear
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive, Lighting
Current - Output / Channel: 1.5A
Internal Switch(s): No
Topology: Buck
Supplier Device Package: 32-HVQFN (5x5)
Dimming: PWM
Voltage - Supply (Min): 10V
Voltage - Supply (Max): 80V
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ASL2416SHNY ASL2416SHN.pdf
ASL2416SHNY
Виробник: NXP USA Inc.
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Voltage - Supply (Max): 80V
Voltage - Supply (Min): 10V
Dimming: PWM
Supplier Device Package: 32-HVQFN (5x5)
Topology: Buck
Internal Switch(s): No
Current - Output / Channel: 1.5A
Applications: Automotive, Lighting
Operating Temperature: -40°C ~ 125°C (TA)
Type: Linear
Frequency: 100kHz ~ 2MHz
Number of Outputs: 2
Mounting Type: Surface Mount
Voltage - Output: 2.5V ~ 70V
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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ASL2416SHN/L1Y
Виробник: NXP USA Inc.
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Voltage - Supply (Min): 10V
Dimming: PWM
Supplier Device Package: 32-HVQFN (5x5)
Topology: Buck
Internal Switch(s): No
Current - Output / Channel: 1.5A
Applications: Automotive, Lighting
Operating Temperature: -40°C ~ 125°C (TA)
Type: Linear
Frequency: 100kHz ~ 2MHz
Number of Outputs: 2
Mounting Type: Surface Mount
Voltage - Output: 2.5V ~ 70V
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Voltage - Supply (Max): 80V
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S912ZVCA96F0MLFR S12ZVCFS.pdf
S912ZVCA96F0MLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x12b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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S912ZVCA96F0MLF S12ZVCFS.pdf
S912ZVCA96F0MLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x12b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
на замовлення 2470 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+596.54 грн
10+444.62 грн
25+412.17 грн
80+357.84 грн
230+338.60 грн
440+329.32 грн
1250+312.31 грн
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MIMXRT1042XFP5B IMXRT1040XEC.pdf
MIMXRT1042XFP5B
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 512K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Supplier Device Package: 169-LFBGA (9x9)
Peripherals: DMA, I2S, LCD, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, MMC/SD, SAI, SPI, UART/USART, USB
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M7
на замовлення 502 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1041.17 грн
10+801.71 грн
80+677.08 грн
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MIMXRT1041DFP6B
MIMXRT1041DFP6B
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 169LFBGA
DigiKey Programmable: Not Verified
Package / Case: 169-LFBGA
Packaging: Tray
Supplier Device Package: 169-LFBGA (9x9)
Peripherals: DMA, I²S, LCD, PWM, WDT
Connectivity: CANbus, Ethernet, I²C, MMC/SD, SAI, SPI, UART/USART, USB
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 90°C (TJ)
RAM Size: 512K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 600MHz
Mounting Type: Surface Mount
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MIMXRT1042DFP6B
MIMXRT1042DFP6B
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Connectivity: CANbus, Ethernet, I2C, MMC/SD, SAI, SPI, UART/USART, USB
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 90°C (TJ)
RAM Size: 512K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Supplier Device Package: 169-LFBGA (9x9)
Peripherals: DMA, I2S, LCD, PWM, WDT
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+852.08 грн
10+644.61 грн
80+533.67 грн
1300+436.82 грн
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S9KEAZ128AMLHR S9KEAZ128AMLHR.pdf
S9KEAZ128AMLHR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
на замовлення 1033 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
84+271.90 грн
Мінімальне замовлення: 84 шт
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MC9S08QG4CDNER
MC9S08QG4CDNER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 4
Supplier Device Package: 8-SOIC
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MC9S08GT16AMFBE MC9S08GT16A.pdf
MC9S08GT16AMFBE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
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MCHC908LK24CFQE MC68HC908LJ24.pdf
MCHC908LK24CFQE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 24KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 80-QFP (14x14)
Peripherals: LCD, LVD, POR, PWM
Connectivity: I2C, IRSCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 768 x 8
Program Memory Size: 24KB (24K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: HC08
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SL3S1003FUD/BG,003 SL3S1003_1013.pdf
Виробник: NXP USA Inc.
Description: IC UCODE G2IM TRANSPONDER DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0V ~ 1.85V
Standards: EPC
Supplier Device Package: Wafer
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MPC8377EVRAGD MPC8377E.pdf
MPC8377EVRAGD
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8377EVRAJF MPC8377E.pdf
MPC8377EVRAJF
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8379EVRAGD MPC837XFFS.pdf
MPC8379EVRAGD
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (4)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8379EVRAJF MPC837XFFS.pdf
MPC8379EVRAJF
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
SATA: SATA 3Gbps (4)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.0
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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MPC8379EVRANG MPC837XFFS.pdf
MPC8379EVRANG
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
SATA: SATA 3Gbps (4)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.0
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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MPC8378EVRAGD MPC837XFFS.pdf
MPC8378EVRAGD
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8377CVRALG MPC8377E.pdf
MPC8377CVRALG
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8377EVRANG MPC8377E.pdf
MPC8377EVRANG
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8377EWLANB MPC837XFFS.pdf
Виробник: NXP USA Inc.
Description: ACCESS POINT/ROUTER MPC8377
Packaging: Box
Function: Router
Interface: USB
Applications: General Purpose
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MPC8377VRALG MPC8377E.pdf
MPC8377VRALG
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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PEMI2QFN/WR,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/WR,115
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/21PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 2
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3806+5.84 грн
Мінімальне замовлення: 3806 шт
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MPC8569CVTANKGB MPC8569EEC.pdf
MPC8569CVTANKGB
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3, SDRAM
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (8), 1Gbps (4)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
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MPC8569CVTAQLJB MPC8569EEC.pdf
MPC8569CVTAQLJB
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.067GHZ 783BGA
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3, SDRAM
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (8), 1Gbps (4)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.067GHz
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MC9S12A512CPVER 9S12DT128DGV2.pdf
MC9S12A512CPVER
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 14K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
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S32K314EHT1MPBST S32K3xx.pdf
S32K314EHT1MPBST
Виробник: NXP USA Inc.
Description: SINGLE CORE M7, 160MHZ, 4M FLASH
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
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FS32K144HFT0MLLT S32K1xx.pdf
FS32K144HFT0MLLT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 635 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+744.48 грн
10+559.28 грн
25+519.77 грн
80+452.60 грн
230+429.20 грн
450+417.56 грн
В кошику  од. на суму  грн.
FS32K144HAT0MLHT S32K1xx.pdf
FS32K144HAT0MLHT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 698 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+667.74 грн
10+500.62 грн
25+465.01 грн
100+399.72 грн
250+382.24 грн
В кошику  од. на суму  грн.
FS32K144HFT0VLHT S32K1xx.pdf
FS32K144HFT0VLHT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 752 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+683.56 грн
10+511.67 грн
25+475.07 грн
80+413.23 грн
230+391.57 грн
В кошику  од. на суму  грн.
FS32K144HFT0MLHT S32K1xx.pdf
FS32K144HFT0MLHT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 745 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+712.84 грн
10+534.60 грн
25+496.64 грн
80+432.22 грн
230+409.74 грн
В кошику  од. на суму  грн.
FX32K144HAT0MLLT
Виробник: NXP USA Inc.
Description: S32K144 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tray
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FS32K144UAT0VLLT S32K1xx.pdf
FS32K144UAT0VLLT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 253 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+788.79 грн
10+593.57 грн
25+552.07 грн
80+481.08 грн
230+456.50 грн
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SA58631TK,115 SA58631.pdf
SA58631TK,115
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB MONO 3W 8HVSON
Supplier Device Package: 8-HVSON (4x4)
Max Output Power x Channels @ Load: 3W x 1 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 8-VDFN Exposed Pad
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
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SC667644DVL6B
Виробник: NXP USA Inc.
Description: I.MXRT1050 CUSTOM
Packaging: Tray
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MC9S08PT16VTJ MC9S08PT16.pdf
MC9S08PT16VTJ
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
DigiKey Programmable: Not Verified
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74ALVCH16543DGG512 74ALVCH16543.pdf
74ALVCH16543DGG512
Виробник: NXP USA Inc.
Description: REGISTERED BUS TRANSCEIVER
Packaging: Bulk
на замовлення 875 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
182+123.82 грн
Мінімальне замовлення: 182 шт
В кошику  од. на суму  грн.
MC56F8246MLF FSCLS11848-1.pdf?t.download=true&u=5oefqw
MC56F8246MLF
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, FLASH,
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 10x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 900 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
40+568.91 грн
Мінімальне замовлення: 40 шт
В кошику  од. на суму  грн.
NCF2952XTT/T0E080J 75017275.pdf
NCF2952XTT/T0E080J
Виробник: NXP USA Inc.
Description: IC REMOTE KEYLESS 125KHZ 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 125kHz
Interface: SPI
Supplier Device Package: 38-TSSOP
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SAF7755HV/N208W/SY
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
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S9S12P96J0CQKR
S9S12P96J0CQKR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
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MC33FS8430G0ESR2 FS84_FS85C_DS.pdf
MC33FS8430G0ESR2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8430
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 56-HVQFN (8x8)
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MK10DX128VLH7R
MK10DX128VLH7R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 26x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
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SL3ICS1002FUGV7AFZ
Виробник: NXP USA Inc.
Description: UCODE G2XM AND G2XL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15962, ISO 15963, ISO 18000-1, ISO 18000-6, ISO 19762
Supplier Device Package: Wafer
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SL2ICS2001DW/V1D,0 058031.pdf
Виробник: NXP USA Inc.
Description: IC I-CODE SLI SMART LABEL DIE
Packaging: Bulk
Style: Inlay
Frequency: 13.56MHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 15693
Writable Memory: 1024b (User)
товару немає в наявності
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