Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35301) > Сторінка 494 з 589
| Фото | Назва | Виробник | Інформація | Доступність | Ціна | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|   | SPC5775EDK3MME3R | NXP USA Inc. |  Description: IC MCU 32BIT 4MB FLASH 416MAPBGA Packaging: Tape & Reel (TR) Package / Case: 416-BGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 40x12b eQADCx2 Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Supplier Device Package: 416-MAPBGA (27x27) Number of I/O: 293 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| SAF775DHN/N208WMP | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF775DHN/N208WK | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF775DHV/N208WK | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF775DHV/N208W/KY | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF775DHV/N208W/KK | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF7751HN/N208WMP | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF775DHN/N208W/MP | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF775DHV/N208WY | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF7754HN/N208WMP | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF7751HN/N208WK | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF775DHV/N208W/DY | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF775DHN/N208WAMP | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF775DHV/N208W/CY | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF775DHN/N208W/KK | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF775DHV/N208W/DK | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF775DHV/N208W/AY | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF775DHV/N208W/CK | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF7754HN/N208WK | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF775DHV/N208W/AK | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF775DHV/N208W/BY | NXP USA Inc. | Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|  | MHW8188AN | NXP USA Inc. |  Description: IC AMP CATV 7-CATV MODULE Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Applications: CATV Supplier Device Package: 7-CATV Module Number of Circuits: 1 Current - Supply: 425 mA | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| BSC9131NSE1KHKB | NXP USA Inc. | Description: QORIQ QONVERGE MULTICORE BASEBAN Packaging: Bulk | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| FS32R294KCK0MJDT | NXP USA Inc. |  Description: IC MCU Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| FS32R294KAK0MJDT | NXP USA Inc. | Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| FS32R294KCK0MJDR | NXP USA Inc. |  Description: IC MCU Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| FS32R294KAK0MJDR | NXP USA Inc. | Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| FS32R294JCK0MJDT | NXP USA Inc. |  Description: IC MCU 32BIT 269LFBGA Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount RAM Size: 5.5M x 8 Program Memory Type: ROMless Core Processor: e200z4, e200z7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI Peripherals: Temp Sensor Supplier Device Package: 269-LFBGA (14x14) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| FS32R294JAK0MJDT | NXP USA Inc. | Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| FS32R294JAK0MJDR | NXP USA Inc. | Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| FS32R294JCK0MJDR | NXP USA Inc. |  Description: IC MCU Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| FS32R294HBK0MJDT | NXP USA Inc. |  Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| FS32R294HBK0MJDR | NXP USA Inc. | Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| FS32R294LBK0MJDT | NXP USA Inc. | Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 500MHz, 430MHz Program Memory Size: 3MB (3M x 8) RAM Size: 2.5M x 8 Oscillator Type: Internal Program Memory Type: SRAM Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit 5-Core Connectivity: CAN, Ethernet, FlexRay Supplier Device Package: 269-LFBGA (14x14) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| FS32R294LBK0MJDR | NXP USA Inc. | Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 500MHz, 430MHz Program Memory Size: 3MB (3M x 8) RAM Size: 2.5M x 8 Oscillator Type: Internal Program Memory Type: SRAM Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit 5-Core Connectivity: CAN, Ethernet, FlexRay Supplier Device Package: 269-LFBGA (14x14) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| FS32R294LAK0MJDT | NXP USA Inc. |  Description: IC MCU 32BIT 3MB 269LFBGA Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 500MHz, 430MHz Program Memory Size: 3MB (3M x 8) RAM Size: 2.5M x 8 Oscillator Type: Internal Program Memory Type: SRAM Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit 5-Core Connectivity: CAN, Ethernet, FlexRay Supplier Device Package: 269-LFBGA (14x14) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| FS32R294LAK0MJDR | NXP USA Inc. |  Description: IC MCU Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| OM5578/PN7150ARD | NXP USA Inc. | Description: DEV KIT PN7150 PLUG/PLAY NFC CTL Packaging: Bulk | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | MC9S08AC128CFUE | NXP USA Inc. |  Description: IC MCU 8BIT 128KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Number of I/O: 54 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MC9RS08KA8CPJ | NXP USA Inc. |  Description: IC MCU 8BIT 8KB FLASH 20DIP Packaging: Bulk Package / Case: 20-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 254 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I²C Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-DIP Number of I/O: 18 DigiKey Programmable: Not Verified | на замовлення 518 шт:термін постачання 21-31 дні (днів) | 
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|   | S912XDG128F2CAL | NXP USA Inc. |  Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | MFS8623BMBA0ES | NXP USA Inc. | Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 36V Applications: Camera Supplier Device Package: 48-QFN (7x7) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MCF5280CVF66 | NXP USA Inc. |  Description: IC MCU 32BIT ROMLESS 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 66MHz RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 256-MAPBGA (17x17) Number of I/O: 142 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | S32G378ASAK1VUCT | NXP USA Inc. |  Description: MICROPROCESSORS - MPU 4X CORTEX- Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | S32G378ASAK1VUCR | NXP USA Inc. |  Description: MICROPROCESSORS - MPU 4X CORTEX- Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | MC68en360ai33l | NXP USA Inc. |  Description: IC MPU M683XX 33MHZ 240FQFP Packaging: Bulk Package / Case: 240-BFQFP Mounting Type: Surface Mount Speed: 33MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 240-FQFP (32x32) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: SCC, SMC, SPI | на замовлення 156 шт:термін постачання 21-31 дні (днів) | 
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|   | MFS2613AMDA4AD | NXP USA Inc. |  Description: SAFETY SYSTEM BASIS CHIP WITH LO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive | на замовлення 133 шт:термін постачання 21-31 дні (днів) | 
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|   | MFS2613AMDA3AD | NXP USA Inc. |  Description: SAFETY SYSTEM BASIS CHIP WITH LO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive | на замовлення 249 шт:термін постачання 21-31 дні (днів) | 
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|   | MFS2633AMDA0AD | NXP USA Inc. |  Description: SAFETY SYSTEM BASIS CHIP WITH LO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Applications: System Basis Chip Current - Supply: 29µA Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive Qualification: AEC-Q100 | на замовлення 156 шт:термін постачання 21-31 дні (днів) | 
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| MF3D2300DA4/00J | NXP USA Inc. |  Description: MF3D2300DA4 Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: PLLMC | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| MF3D8300DA4/00J | NXP USA Inc. | Description: MF3D8300DA4 Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: PLLMC | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | MFRC63103HNY | NXP USA Inc. |  Description: CL READER IC'S Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad For Use With/Related Products: MFRC631 Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Standards: ISO 14443, MIFARE Supplied Contents: Board(s) Supplier Device Package: 32-HVQFN (5x5) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MFRC63103HNY | NXP USA Inc. |  Description: CL READER IC'S Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad For Use With/Related Products: MFRC631 Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Standards: ISO 14443, MIFARE Supplied Contents: Board(s) Supplier Device Package: 32-HVQFN (5x5) | на замовлення 4835 шт:термін постачання 21-31 дні (днів) | 
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| MFS2633AMVA0AD | NXP USA Inc. | Description: SAFETY SYSTEM BASIS CHIP WITH LO Packaging: Tray | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| MF0UL2101DUD,005 | NXP USA Inc. |  Description: IC RFID TRANSP 13.56MHZ DIE Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443, MIFARE Supplier Device Package: Die | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| MF0ICU2001DUD,005 | NXP USA Inc. | Description: MIFARE ULTRALIGHT SGL FCC Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: 25°C ~ 70°C (TA) Standards: ISO 14443, MIFARE Supplier Device Package: Wafer | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| MF0ICU2101DUD,005 | NXP USA Inc. | Description: MIFARE ULTRALIGHT SGL FCC Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 70°C (TA) Standards: ISO 14443, MIFARE Supplier Device Package: Wafer | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| MF0ICU2001DUF,005 | NXP USA Inc. |  Description: MIFARE ULTRALIGHT C - CONTACTLES Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 70°C (TA) Standards: ISO 14443, MIFARE Supplier Device Package: Wafer | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| MF0AESH2001DUFZ | NXP USA Inc. |  Description: MIFARE ULTRALIGHT AES - CONTACTL Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 70°C (TA) Standards: Mifare, NFC Supplier Device Package: Wafer | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| MF0AES2001DUFZ | NXP USA Inc. |  Description: MIFARE ULTRALIGHT AES - CONTACTL Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 70°C (TA) Standards: Mifare, NFC Supplier Device Package: Wafer | товару немає в наявності | В кошику од. на суму грн. | 
| SPC5775EDK3MME3R |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Number of I/O: 293
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Number of I/O: 293
DigiKey Programmable: Not Verified
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| MHW8188AN |  | 
Виробник: NXP USA Inc.
Description: IC AMP CATV 7-CATV MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-CATV Module
Number of Circuits: 1
Current - Supply: 425 mA
    Description: IC AMP CATV 7-CATV MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-CATV Module
Number of Circuits: 1
Current - Supply: 425 mA
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| FS32R294KCK0MJDT |  | 
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
    Description: IC MCU
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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| FS32R294KAK0MJDT | 
Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
    Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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| FS32R294KCK0MJDR |  | 
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
    Description: IC MCU
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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| FS32R294KAK0MJDR | 
Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
    Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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| FS32R294JCK0MJDT |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
RAM Size: 5.5M x 8
Program Memory Type: ROMless
Core Processor: e200z4, e200z7
Core Size: 32-Bit Dual-Core
Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI
Peripherals: Temp Sensor
Supplier Device Package: 269-LFBGA (14x14)
    Description: IC MCU 32BIT 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
RAM Size: 5.5M x 8
Program Memory Type: ROMless
Core Processor: e200z4, e200z7
Core Size: 32-Bit Dual-Core
Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI
Peripherals: Temp Sensor
Supplier Device Package: 269-LFBGA (14x14)
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| FS32R294JAK0MJDT | 
Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
    Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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| FS32R294JAK0MJDR | 
Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
    Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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| FS32R294HBK0MJDT |  | 
Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
    Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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| FS32R294HBK0MJDR | 
Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
    Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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| FS32R294LBK0MJDT | 
Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
    Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
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| FS32R294LBK0MJDR | 
Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
    Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
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| FS32R294LAK0MJDT |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
    Description: IC MCU 32BIT 3MB 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
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| FS32R294LAK0MJDR |  | 
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
    Description: IC MCU
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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| MC9S08AC128CFUE |  | 
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
    Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
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| MC9RS08KA8CPJ |  | 
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Bulk
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 18
DigiKey Programmable: Not Verified
    Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Bulk
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 518 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 518+ | 80.13 грн | 
| S912XDG128F2CAL |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
    Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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| MFS8623BMBA0ES | 
Виробник: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
    Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
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| MCF5280CVF66 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 142
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 142
DigiKey Programmable: Not Verified
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| S32G378ASAK1VUCT |  | 
Виробник: NXP USA Inc.
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
    Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
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| S32G378ASAK1VUCR |  | 
Виробник: NXP USA Inc.
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
    Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
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| MC68en360ai33l |  | 
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
    Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
на замовлення 156 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 2+ | 11943.61 грн | 
| MFS2613AMDA4AD |  | 
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
    Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
на замовлення 133 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 636.92 грн | 
| 10+ | 477.30 грн | 
| 25+ | 443.15 грн | 
| 100+ | 380.68 грн | 
| MFS2613AMDA3AD |  | 
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
    Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
на замовлення 249 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 637.74 грн | 
| 10+ | 477.69 грн | 
| 25+ | 443.60 грн | 
| 100+ | 381.06 грн | 
| MFS2633AMDA0AD |  | 
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Applications: System Basis Chip
Current - Supply: 29µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Qualification: AEC-Q100
    Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Applications: System Basis Chip
Current - Supply: 29µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 156 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 652.61 грн | 
| 10+ | 488.91 грн | 
| 25+ | 453.88 грн | 
| 100+ | 389.86 грн | 
| MF3D2300DA4/00J |  | 
Виробник: NXP USA Inc.
Description: MF3D2300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
    Description: MF3D2300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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| MF3D8300DA4/00J | 
Виробник: NXP USA Inc.
Description: MF3D8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
    Description: MF3D8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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| MFRC63103HNY |  | 
Виробник: NXP USA Inc.
Description: CL READER IC'S
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
For Use With/Related Products: MFRC631
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplied Contents: Board(s)
Supplier Device Package: 32-HVQFN (5x5)
    Description: CL READER IC'S
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
For Use With/Related Products: MFRC631
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplied Contents: Board(s)
Supplier Device Package: 32-HVQFN (5x5)
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| MFRC63103HNY |  | 
Виробник: NXP USA Inc.
Description: CL READER IC'S
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
For Use With/Related Products: MFRC631
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplied Contents: Board(s)
Supplier Device Package: 32-HVQFN (5x5)
    Description: CL READER IC'S
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
For Use With/Related Products: MFRC631
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplied Contents: Board(s)
Supplier Device Package: 32-HVQFN (5x5)
на замовлення 4835 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 530.35 грн | 
| 10+ | 394.25 грн | 
| 25+ | 365.29 грн | 
| 100+ | 312.91 грн | 
| 250+ | 298.65 грн | 
| 500+ | 290.05 грн | 
| 1000+ | 282.32 грн | 
| MF0UL2101DUD,005 |  | 
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
    Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
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| MF0ICU2001DUD,005 | 
Виробник: NXP USA Inc.
Description: MIFARE ULTRALIGHT SGL FCC
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: 25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
    Description: MIFARE ULTRALIGHT SGL FCC
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: 25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
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| MF0ICU2101DUD,005 | 
Виробник: NXP USA Inc.
Description: MIFARE ULTRALIGHT SGL FCC
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
    Description: MIFARE ULTRALIGHT SGL FCC
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
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| MF0ICU2001DUF,005 |  | 
Виробник: NXP USA Inc.
Description: MIFARE ULTRALIGHT C - CONTACTLES
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
    Description: MIFARE ULTRALIGHT C - CONTACTLES
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
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| MF0AESH2001DUFZ |  | 
Виробник: NXP USA Inc.
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
    Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
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| MF0AES2001DUFZ |  | 
Виробник: NXP USA Inc.
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
    Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
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     од. на суму     грн.