Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35301) > Сторінка 496 з 589
| Фото | Назва | Виробник | Інформація | Доступність | Ціна | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SLRC61003HNY | NXP USA Inc. |  Description: CL READER IC'S Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SLRC61003HNY | NXP USA Inc. |  Description: CL READER IC'S Packaging: Cut Tape (CT) | на замовлення 6873 шт:термін постачання 21-31 дні (днів) | 
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| P60D144PU12/9A201V | NXP USA Inc. | Description: IC SMART CARD CTLR UNCASED Packaging: Bulk DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | MC33FS6512CAER2 | NXP USA Inc. |  Description: SYSTEM BASIS CHIP DCDC 1.5A VCO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MC33FS6512LAER2 | NXP USA Inc. |  Description: SYSTEM BASIS CHIP DCDC 1.5A VCO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MC35FS6512NAER2 | NXP USA Inc. |  Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MC35FS6512CAER2 | NXP USA Inc. |  Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MC33FS6512CAE | NXP USA Inc. |  Description: SYSTEM BASIS CHIP DCDC 1.5A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MC33FS6512LAE | NXP USA Inc. |  Description: SYSTEM BASIS CHIP DCDC 1.5A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MC35FS6512CAE | NXP USA Inc. |  Description: FS6500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MC35FS6512NAE | NXP USA Inc. |  Description: FS6500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | TJA1124AHG/1Z | NXP USA Inc. |  Description: IC TRANSCEIVER HALF 4/4 24DHVQFN Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 4/4 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 24-DHVQFN (5.5x3.5) Duplex: Half Grade: Automotive Qualification: AEC-Q100 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | TJA1124AHG/1Z | NXP USA Inc. |  Description: IC TRANSCEIVER HALF 4/4 24DHVQFN Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 4/4 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 24-DHVQFN (5.5x3.5) Duplex: Half Grade: Automotive Qualification: AEC-Q100 | на замовлення 2493 шт:термін постачання 21-31 дні (днів) | 
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| 74LVC16240ADGG/C4118 | NXP USA Inc. |  Description: BUS DRIVER, LVC/LCX/Z SERIES Packaging: Bulk | на замовлення 6093 шт:термін постачання 21-31 дні (днів) | 
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|   | MPF5020CMMACESR2 | NXP USA Inc. |  Description: POWER MANAGEMENT IC, PRE-PROG, 3 Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MC34VR500VCESR2 | NXP USA Inc. |  Description: REGULATOR, BUCK, QUAD WITH UP TO Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: Processor Current - Supply: 297µA Supplier Device Package: 56-QFN-EP (8x8) Grade: Automotive Qualification: AEC-Q100 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MX93AUD-HAT | NXP USA Inc. |  Description: ACCESSORY BOARD:AUDIO HAT Packaging: Box | на замовлення 9 шт:термін постачання 21-31 дні (днів) | 
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|  | MKL36Z256VMC4 | NXP USA Inc. |  Description: IC MCU 32B 256KB FLASH 121MAPBGA Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D - 16bit; D/A - 12bit Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Number of I/O: 84 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| T2080NSN8MQB | NXP USA Inc. |  Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|  | P3041NSE7NNC | NXP USA Inc. |  Description: IC MPU QORIQ 1.333GHZ 1295FCPBGA Packaging: Tray Package / Case: 1295-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 1295-FCPBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox SATA: SATA 3Gbps (2) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| .jpg)  | SCC2692AC1A44,518 | NXP USA Inc. |  Description: SERIAL I/O CONTROLLER, 2 CHANNEL Features: Configurable GPIO, Internal Oscillator, Timer/Counter Packaging: Tape & Reel (TR) Package / Case: 44-LCC (J-Lead) Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 5V Data Rate (Max): 1Mbps Supplier Device Package: 44-PLCC With Auto Flow Control: Yes With False Start Bit Detection: Yes | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| .jpg)  | SCC2692AC1A44,512 | NXP USA Inc. |  Description: UART IC 2, DUART CHANNEL 44-PLCC Features: Configurable GPIO, Internal Oscillator, Timer/Counter Packaging: Tube Package / Case: 44-LCC (J-Lead) Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 5V Data Rate (Max): 1Mbps Supplier Device Package: 44-PLCC With Auto Flow Control: Yes With False Start Bit Detection: Yes | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MPC8349EVVAJDB | NXP USA Inc. |  Description: IC MPU MPC83XX 533MHZ 672LBGA Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator | на замовлення 24 шт:термін постачання 21-31 дні (днів) | 
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|   | BFT25,215 | NXP USA Inc. |  Description: RF TRANS NPN 5V 2.3GHZ TO236AB Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 30mW Current - Collector (Ic) (Max): 6.5mA Voltage - Collector Emitter Breakdown (Max): 5V DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V Frequency - Transition: 2.3GHz Noise Figure (dB Typ @ f): 5.5dB @ 500MHz Supplier Device Package: SOT-23 (TO-236AB) | на замовлення 4782 шт:термін постачання 21-31 дні (днів) | В кошику од. на суму грн. | ||||||||||||||
| MC33MR3003AXVKR2 | NXP USA Inc. | Description: RF TXRX MOD ISM>1GHZSMD Packaging: Bulk Package / Case: 214-UFBGA, WLCSP Mounting Type: Surface Mount Frequency: 76GHz ~ 81GHz Operating Temperature: 125°C Antenna Type: Antenna Not Included Modulation: BPSK RF Family/Standard: General ISM > 1GHz | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| 74AHCT08PW/C1118 | NXP USA Inc. |  Description: AND GATE, AHCT/VHCT/VT SERIES Packaging: Bulk | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | MPX2010D | NXP USA Inc. |  Description: SENSOR 1.45PSID .025V Features: Temperature Compensated Packaging: Tray Package / Case: 4-SIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 25 mV (10V) Operating Pressure: 1.45PSI (10kPa) Pressure Type: Differential Accuracy: ±1% Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 10V ~ 16V Applications: Board Mount Port Style: No Port Maximum Pressure: 10.88PSI (75kPa) | на замовлення 1225 шт:термін постачання 21-31 дні (днів) | 
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|  | MC68040FE25V | NXP USA Inc. |  Description: IC MPU M680X0 25MHZ 184CQFP Packaging: Tray Package / Case: 184-BCQFP Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68040 Voltage - I/O: 5.0V Supplier Device Package: 184-CQFP (31.3x31.3) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | MC68EC040FE40A | NXP USA Inc. |  Description: IC MPU M680X0 40MHZ 184CQFP Packaging: Tray Package / Case: 184-BCQFP Mounting Type: Surface Mount Speed: 40MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68040 Voltage - I/O: 5.0V Supplier Device Package: 184-CQFP (31.3x31.3) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| PESD5V0C1UZF315 | NXP USA Inc. |  Description: PESD5V0C1UZF - ULTRA LOW CAPACIT Packaging: Bulk | на замовлення 171000 шт:термін постачання 21-31 дні (днів) | 
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|   | S9S08SL8F1MTLR | NXP USA Inc. | Description: IC MCU 8BIT 8KB FLASH 28TSSOP Packaging: Tape & Reel (TR) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-TSSOP Number of I/O: 22 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | S9S08SL8F1MTL | NXP USA Inc. | Description: IC MCU 8BIT 8KB FLASH 28TSSOP Packaging: Tube Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-TSSOP Number of I/O: 22 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MPC8272CVRMIBA | NXP USA Inc. |  Description: IC MPU MPC82XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | TEA1936XDB1530UL | NXP USA Inc. |  Description: TEA1936X DEMOBOARD 1530 Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: TEA1936x Supplied Contents: Board(s) | на замовлення 5 шт:термін постачання 21-31 дні (днів) | 
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| SAF4000EL/101Z224Y | NXP USA Inc. | Description: SAF4000EL Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| SAF4000EL/101Q224Y | NXP USA Inc. | Description: AUDIO DSPS SAF4000EL/101Q2240 Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | S912XEQ512J3VALR | NXP USA Inc. |  Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | SPC5603BK0MLH6 | NXP USA Inc. | Description: IC MCU 32BIT 384KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 12x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | HEF4515BP,652 | NXP USA Inc. | Description: IC DECODER/DEMUX 1X4:16 24DIP Packaging: Tube Package / Case: 24-DIP (0.600", 15.24mm) Mounting Type: Through Hole Circuit: 1 x 4:16 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 15.5V Independent Circuits: 1 Current - Output High, Low: 3mA, 3mA Voltage Supply Source: Dual Supply Supplier Device Package: 24-DIP | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| 74AUP1T58GF | NXP USA Inc. |  Description: IC TRANSLTR UNIDIRECTIONAL 6XSON Features: Configurable Gate Logic Functions Packaging: Bulk Package / Case: 6-XFDFN Output Type: Single-Ended Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Supplier Device Package: 6-XSON (1x1) Channel Type: Unidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.8 V ~ 2.7 V Voltage - VCCB: 2.3 V ~ 3.6 V Number of Circuits: 1 | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | MCIMX6G2DVM05AB | NXP USA Inc. |  Description: IC MPU I.MX6UL 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | на замовлення 283 шт:термін постачання 21-31 дні (днів) | 
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| TEA88182HT/1J | NXP USA Inc. | Description: PFC CONTROLLER Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| MF4SAM3X84/9BA6AUJ | NXP USA Inc. | Description: MF4SAM3X84 Packaging: Tape & Reel (TR) Package / Case: Module Mounting Type: Surface Mount Interface: I2C Type: RFID Reader Operating Temperature: -25°C ~ 85°C Voltage - Supply: 6V Standards: Mifare, ISO 14443, ISO 7816 Supplier Device Package: PCM1.1 | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| LFVBBJ76ZA | NXP USA Inc. | Description: QORIVVA MPC5676R 516 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5676R Accessory Type: Logic Analyzer | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| LFLAIBW1A | NXP USA Inc. | Description: 422 PIN 1.0MM PITCH LOGIC ANALYZ Packaging: Bulk Module/Board Type: Adapter Board | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| LFLAIBS1A | NXP USA Inc. | Description: 256 PIN 1.0 MM LOGIC ANALYZER BO Packaging: Bulk Module/Board Type: Adapter Board | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| LFVDBVLAIB | NXP USA Inc. | Description: VERTICAL LOGIC ANALYZER BOARD FO Packaging: Bulk For Use With/Related Products: MPC55xx, MPC56xx, MPC57xx Accessory Type: Logic Analyzer | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| LFLAIBHT | NXP USA Inc. | Description: 100 PIN 0.5MM QFP LOGIC ANALYZER Packaging: Bulk Module/Board Type: Adapter Board | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| LFLAIBLT | NXP USA Inc. | Description: 144 PIN 0.5MM QFP LOGIC ANALYZER Packaging: Bulk Module/Board Type: Adapter Board | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | PCA9515AD | NXP USA Inc. |    Description: PCA9515A DUAL BIDIRECTIONAL I2C Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Applications: I2C Current - Supply: 500µA Data Rate (Max): 400kHz Supplier Device Package: 8-SOIC Capacitance - Input: 7 pF | на замовлення 1509 шт:термін постачання 21-31 дні (днів) | 
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|   | S32K342EHT0MPAST | NXP USA Inc. |  Description: S32K342, 2MB FLASH, ARM M7 Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Qualification: AEC-Q100 | на замовлення 385 шт:термін постачання 21-31 дні (днів) | 
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|   | S32K310NHT0VPASR | NXP USA Inc. |  Description: S32K310, 512KB FLASH, ARM M7 Packaging: Tape & Reel (TR) Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Number of I/O: 84 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | S32K310NHT0VPAST | NXP USA Inc. |  Description: IC MCU 32BIT 512KB FLASH 100QFP Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Number of I/O: 84 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | S32K312NHT0VPASR | NXP USA Inc. |  Description: S32K312, 2MB FLASH, ARM M7 Packaging: Tape & Reel (TR) Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Qualification: AEC-Q100 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | S32K312NHT0VPAST | NXP USA Inc. |  Description: S32K312, 2MB FLASH, ARM M7 Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Qualification: AEC-Q100 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | S32K312NHT0VPBST | NXP USA Inc. |  Description: S32K312, 2MB FLASH, ARM M7 Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART Peripherals: DMA, Serial Audio, WDT Supplier Device Package: 172-QFP (16x16) Grade: Automotive Number of I/O: 143 Qualification: AEC-Q100 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | PSMN3R9-60PSQ | NXP USA Inc. |  Description: TRANSISTOR >30MHZ Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 130A (Tc) Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V Power Dissipation (Max): 263W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-220AB Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 60 V Gate Charge (Qg) (Max) @ Vgs: 103 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 5600 pF @ 25 V | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | PX1011BI-EL1/G,551 | NXP USA Inc. |  Description: INTERFACE CIRCUIT, PBGA81 Packaging: Tray Package / Case: 81-LFBGA Mounting Type: Surface Mount Interface: JTAG Voltage - Supply: 1.2V Applications: PCI Express MAX to PCI Express PHY Supplier Device Package: 81-LFBGA (9x9) | на замовлення 4735 шт:термін постачання 21-31 дні (днів) | 
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|   | MKE02Z64VLD4R | NXP USA Inc. |  Description: IC MCU 32BIT 64KB FLASH 44LQFP Packaging: Tape & Reel (TR) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 37 DigiKey Programmable: Not Verified | на замовлення 1500 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||||||
|   | MKE02Z64VLD4R | NXP USA Inc. |  Description: IC MCU 32BIT 64KB FLASH 44LQFP Packaging: Cut Tape (CT) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 37 DigiKey Programmable: Not Verified | на замовлення 1500 шт:термін постачання 21-31 дні (днів) | 
 | 
| SLRC61003HNY |  | 
на замовлення 6873 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 602.22 грн | 
| 10+ | 448.66 грн | 
| 25+ | 408.79 грн | 
| 100+ | 337.42 грн | 
| 250+ | 312.77 грн | 
| 500+ | 296.78 грн | 
| 1000+ | 278.16 грн | 
| P60D144PU12/9A201V | 
Виробник: NXP USA Inc.
Description: IC SMART CARD CTLR UNCASED
Packaging: Bulk
DigiKey Programmable: Not Verified
    Description: IC SMART CARD CTLR UNCASED
Packaging: Bulk
DigiKey Programmable: Not Verified
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| MC33FS6512CAER2 |  | 
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
    Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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| MC33FS6512LAER2 |  | 
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
    Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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| MC35FS6512NAER2 |  | 
Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
    Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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| MC35FS6512CAER2 |  | 
Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
    Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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| MC33FS6512CAE |  | 
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
    Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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| MC33FS6512LAE |  | 
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
    Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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| MC35FS6512CAE |  | 
Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
    Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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| MC35FS6512NAE |  | 
Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
    Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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| TJA1124AHG/1Z |  | 
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
    Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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| TJA1124AHG/1Z |  | 
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
    Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2493 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 2+ | 241.22 грн | 
| 10+ | 174.29 грн | 
| 25+ | 159.74 грн | 
| 100+ | 134.82 грн | 
| 250+ | 127.63 грн | 
| 500+ | 123.30 грн | 
| 1000+ | 117.77 грн | 
| 74LVC16240ADGG/C4118 |  | 
на замовлення 6093 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 452+ | 54.52 грн | 
| MC34VR500VCESR2 |  | 
Виробник: NXP USA Inc.
Description: REGULATOR, BUCK, QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Processor
Current - Supply: 297µA
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
    Description: REGULATOR, BUCK, QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Processor
Current - Supply: 297µA
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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| MX93AUD-HAT |  | 
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 10848.22 грн | 
| MKL36Z256VMC4 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 84
DigiKey Programmable: Not Verified
    Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 84
DigiKey Programmable: Not Verified
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| T2080NSN8MQB |  | 
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
    Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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| P3041NSE7NNC |  | 
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.333GHZ 1295FCPBGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
    Description: IC MPU QORIQ 1.333GHZ 1295FCPBGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
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| SCC2692AC1A44,518 |  | 
Виробник: NXP USA Inc.
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
    Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
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| SCC2692AC1A44,512 |  | 
Виробник: NXP USA Inc.
Description: UART IC 2, DUART CHANNEL 44-PLCC
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
    Description: UART IC 2, DUART CHANNEL 44-PLCC
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
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| MPC8349EVVAJDB |  | 
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
    Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 12499.57 грн | 
| 24+ | 9971.55 грн | 
| BFT25,215 |  | 
Виробник: NXP USA Inc.
Description: RF TRANS NPN 5V 2.3GHZ TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 30mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V
Frequency - Transition: 2.3GHz
Noise Figure (dB Typ @ f): 5.5dB @ 500MHz
Supplier Device Package: SOT-23 (TO-236AB)
    Description: RF TRANS NPN 5V 2.3GHZ TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 30mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V
Frequency - Transition: 2.3GHz
Noise Figure (dB Typ @ f): 5.5dB @ 500MHz
Supplier Device Package: SOT-23 (TO-236AB)
на замовлення 4782 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| MC33MR3003AXVKR2 | 
Виробник: NXP USA Inc.
Description: RF TXRX MOD ISM>1GHZSMD
Packaging: Bulk
Package / Case: 214-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Operating Temperature: 125°C
Antenna Type: Antenna Not Included
Modulation: BPSK
RF Family/Standard: General ISM > 1GHz
    Description: RF TXRX MOD ISM>1GHZSMD
Packaging: Bulk
Package / Case: 214-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Operating Temperature: 125°C
Antenna Type: Antenna Not Included
Modulation: BPSK
RF Family/Standard: General ISM > 1GHz
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| MPX2010D |  | 
Виробник: NXP USA Inc.
Description: SENSOR 1.45PSID .025V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
    Description: SENSOR 1.45PSID .025V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
на замовлення 1225 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 1304.40 грн | 
| 5+ | 1143.92 грн | 
| 10+ | 1102.40 грн | 
| 25+ | 987.91 грн | 
| 40+ | 965.95 грн | 
| 125+ | 917.80 грн | 
| 500+ | 853.48 грн | 
| MC68040FE25V |  | 
Виробник: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
    Description: IC MPU M680X0 25MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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| MC68EC040FE40A |  | 
Виробник: NXP USA Inc.
Description: IC MPU M680X0 40MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
    Description: IC MPU M680X0 40MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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| PESD5V0C1UZF315 |  | 
на замовлення 171000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 8876+ | 2.48 грн | 
| S9S08SL8F1MTLR | 
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
    Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
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| S9S08SL8F1MTL | 
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
    Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
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| MPC8272CVRMIBA |  | 
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
    Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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| TEA1936XDB1530UL |  | 
Виробник: NXP USA Inc.
Description: TEA1936X DEMOBOARD 1530
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
    Description: TEA1936X DEMOBOARD 1530
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 26684.36 грн | 
| S912XEQ512J3VALR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
    Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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| SPC5603BK0MLH6 | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
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| HEF4515BP,652 | 
Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 1X4:16 24DIP
Packaging: Tube
Package / Case: 24-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 15.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 3mA
Voltage Supply Source: Dual Supply
Supplier Device Package: 24-DIP
    Description: IC DECODER/DEMUX 1X4:16 24DIP
Packaging: Tube
Package / Case: 24-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 15.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 3mA
Voltage Supply Source: Dual Supply
Supplier Device Package: 24-DIP
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| 74AUP1T58GF |  | 
Виробник: NXP USA Inc.
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Features: Configurable Gate Logic Functions
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 6-XSON (1x1)
Channel Type: Unidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.8 V ~ 2.7 V
Voltage - VCCB: 2.3 V ~ 3.6 V
Number of Circuits: 1
    Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Features: Configurable Gate Logic Functions
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 6-XSON (1x1)
Channel Type: Unidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.8 V ~ 2.7 V
Voltage - VCCB: 2.3 V ~ 3.6 V
Number of Circuits: 1
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| MCIMX6G2DVM05AB |  | 
Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
    Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
на замовлення 283 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 1249.05 грн | 
| 10+ | 955.95 грн | 
| 25+ | 894.36 грн | 
| 152+ | 761.01 грн | 
| TEA88182HT/1J | 
Виробник: NXP USA Inc.
Description: PFC CONTROLLER
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
    Description: PFC CONTROLLER
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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| MF4SAM3X84/9BA6AUJ | 
Виробник: NXP USA Inc.
Description: MF4SAM3X84
Packaging: Tape & Reel (TR)
Package / Case: Module
Mounting Type: Surface Mount
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 6V
Standards: Mifare, ISO 14443, ISO 7816
Supplier Device Package: PCM1.1
    Description: MF4SAM3X84
Packaging: Tape & Reel (TR)
Package / Case: Module
Mounting Type: Surface Mount
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 6V
Standards: Mifare, ISO 14443, ISO 7816
Supplier Device Package: PCM1.1
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| LFVBBJ76ZA | 
Виробник: NXP USA Inc.
Description: QORIVVA MPC5676R 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5676R
Accessory Type: Logic Analyzer
    Description: QORIVVA MPC5676R 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5676R
Accessory Type: Logic Analyzer
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| LFLAIBW1A | 
Виробник: NXP USA Inc.
Description: 422 PIN 1.0MM PITCH LOGIC ANALYZ
Packaging: Bulk
Module/Board Type: Adapter Board
    Description: 422 PIN 1.0MM PITCH LOGIC ANALYZ
Packaging: Bulk
Module/Board Type: Adapter Board
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| LFLAIBS1A | 
Виробник: NXP USA Inc.
Description: 256 PIN 1.0 MM LOGIC ANALYZER BO
Packaging: Bulk
Module/Board Type: Adapter Board
    Description: 256 PIN 1.0 MM LOGIC ANALYZER BO
Packaging: Bulk
Module/Board Type: Adapter Board
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| LFVDBVLAIB | 
Виробник: NXP USA Inc.
Description: VERTICAL LOGIC ANALYZER BOARD FO
Packaging: Bulk
For Use With/Related Products: MPC55xx, MPC56xx, MPC57xx
Accessory Type: Logic Analyzer
    Description: VERTICAL LOGIC ANALYZER BOARD FO
Packaging: Bulk
For Use With/Related Products: MPC55xx, MPC56xx, MPC57xx
Accessory Type: Logic Analyzer
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| LFLAIBHT | 
Виробник: NXP USA Inc.
Description: 100 PIN 0.5MM QFP LOGIC ANALYZER
Packaging: Bulk
Module/Board Type: Adapter Board
    Description: 100 PIN 0.5MM QFP LOGIC ANALYZER
Packaging: Bulk
Module/Board Type: Adapter Board
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| LFLAIBLT | 
Виробник: NXP USA Inc.
Description: 144 PIN 0.5MM QFP LOGIC ANALYZER
Packaging: Bulk
Module/Board Type: Adapter Board
    Description: 144 PIN 0.5MM QFP LOGIC ANALYZER
Packaging: Bulk
Module/Board Type: Adapter Board
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| PCA9515AD |  |  | 
Виробник: NXP USA Inc.
Description: PCA9515A DUAL BIDIRECTIONAL I2C
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: I2C
Current - Supply: 500µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SOIC
Capacitance - Input: 7 pF
    Description: PCA9515A DUAL BIDIRECTIONAL I2C
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: I2C
Current - Supply: 500µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SOIC
Capacitance - Input: 7 pF
на замовлення 1509 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 239+ | 99.86 грн | 
| S32K342EHT0MPAST |  | 
Виробник: NXP USA Inc.
Description: S32K342, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
    Description: S32K342, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 385 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 975.61 грн | 
| 10+ | 868.20 грн | 
| 25+ | 841.92 грн | 
| 100+ | 747.66 грн | 
| S32K310NHT0VPASR |  | 
Виробник: NXP USA Inc.
Description: S32K310, 512KB FLASH, ARM M7
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
    Description: S32K310, 512KB FLASH, ARM M7
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
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| S32K310NHT0VPAST |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100QFP
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
    Description: IC MCU 32BIT 512KB FLASH 100QFP
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
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| S32K312NHT0VPASR |  | 
Виробник: NXP USA Inc.
Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
    Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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| S32K312NHT0VPAST |  | 
Виробник: NXP USA Inc.
Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
    Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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| S32K312NHT0VPBST |  | 
Виробник: NXP USA Inc.
Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 143
Qualification: AEC-Q100
    Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 143
Qualification: AEC-Q100
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| PSMN3R9-60PSQ |  | 
Виробник: NXP USA Inc.
Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 103 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5600 pF @ 25 V
    Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 103 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5600 pF @ 25 V
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| PX1011BI-EL1/G,551 |  | 
Виробник: NXP USA Inc.
Description: INTERFACE CIRCUIT, PBGA81
Packaging: Tray
Package / Case: 81-LFBGA
Mounting Type: Surface Mount
Interface: JTAG
Voltage - Supply: 1.2V
Applications: PCI Express MAX to PCI Express PHY
Supplier Device Package: 81-LFBGA (9x9)
    Description: INTERFACE CIRCUIT, PBGA81
Packaging: Tray
Package / Case: 81-LFBGA
Mounting Type: Surface Mount
Interface: JTAG
Voltage - Supply: 1.2V
Applications: PCI Express MAX to PCI Express PHY
Supplier Device Package: 81-LFBGA (9x9)
на замовлення 4735 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 50+ | 826.09 грн | 
| MKE02Z64VLD4R |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1500+ | 146.20 грн | 
| MKE02Z64VLD4R |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 2+ | 277.57 грн | 
| 10+ | 179.07 грн | 
| 25+ | 174.28 грн | 
| 100+ | 159.76 грн | 
| 250+ | 151.52 грн | 
| 500+ | 146.45 грн |