Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35348) > Сторінка 496 з 590
Фото | Назва | Виробник | Інформація |
Доступність |
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MC32PF3000A3EP | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) |
на замовлення 225 шт: термін постачання 21-31 дні (днів) |
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SPC5675KFK0MJM2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF7755HV/N205W/CY | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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TEA2017DK1007 | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: TEA2017 Type: Programmer Contents: Board(s) Utilized IC / Part: TEA2017 |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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TEA2016DK1008 | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: TEA2016 Type: Programmer Contents: Board(s), Accessories Utilized IC / Part: TEA2016 |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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SPC5775BSK3MME2R | NXP USA Inc. |
Description: NXP 32-BIT MCU, 4MB FLASH FCACS Packaging: Tape & Reel (TR) Package / Case: 416-BGA Mounting Type: Surface Mount Speed: 220MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI Peripherals: DMA, LVD, POR Supplier Device Package: 416-MAPBGA (27x27) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SPC5775BSK3MME2 | NXP USA Inc. |
Description: NXP 32-BIT MCU, 4MB FLASH FCACS Packaging: Tray Package / Case: 416-BGA Mounting Type: Surface Mount Speed: 220MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI Peripherals: DMA, LVD, POR Supplier Device Package: 416-MAPBGA (27x27) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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SPC5775EDK3MME3R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 416-BGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 40x12b eQADCx2 Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Supplier Device Package: 416-MAPBGA (27x27) Number of I/O: 293 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
SAF775DHN/N208WMP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF775DHN/N208WK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF775DHV/N208WK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF775DHV/N208W/KY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF775DHV/N208W/KK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF7751HN/N208WMP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF775DHN/N208W/MP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF775DHV/N208WY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF7754HN/N208WMP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF7751HN/N208WK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF775DHV/N208W/DY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF775DHN/N208WAMP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF775DHV/N208W/CY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF775DHN/N208W/KK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF775DHV/N208W/DK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF775DHV/N208W/AY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF775DHV/N208W/CK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF7754HN/N208WK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF775DHV/N208W/AK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SAF775DHV/N208W/BY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MHW8188AN | NXP USA Inc. |
![]() Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Applications: CATV Supplier Device Package: 7-CATV Module Number of Circuits: 1 Current - Supply: 425 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
BSC9131NSE1KHKB | NXP USA Inc. |
Description: QORIQ QONVERGE MULTICORE BASEBAN Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FS32R294KCK0MJDT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FS32R294KAK0MJDT | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FS32R294KCK0MJDR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FS32R294KAK0MJDR | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FS32R294JCK0MJDT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount RAM Size: 5.5M x 8 Program Memory Type: ROMless Core Processor: e200z4, e200z7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI Peripherals: Temp Sensor Supplier Device Package: 269-LFBGA (14x14) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FS32R294JAK0MJDT | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FS32R294JAK0MJDR | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FS32R294JCK0MJDR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FS32R294HBK0MJDT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FS32R294HBK0MJDR | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FS32R294LBK0MJDT | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 500MHz, 430MHz Program Memory Size: 3MB (3M x 8) RAM Size: 2.5M x 8 Oscillator Type: Internal Program Memory Type: SRAM Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit 5-Core Connectivity: CAN, Ethernet, FlexRay Supplier Device Package: 269-LFBGA (14x14) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FS32R294LBK0MJDR | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 500MHz, 430MHz Program Memory Size: 3MB (3M x 8) RAM Size: 2.5M x 8 Oscillator Type: Internal Program Memory Type: SRAM Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit 5-Core Connectivity: CAN, Ethernet, FlexRay Supplier Device Package: 269-LFBGA (14x14) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FS32R294LAK0MJDT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 500MHz, 430MHz Program Memory Size: 3MB (3M x 8) RAM Size: 2.5M x 8 Oscillator Type: Internal Program Memory Type: SRAM Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit 5-Core Connectivity: CAN, Ethernet, FlexRay Supplier Device Package: 269-LFBGA (14x14) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
FS32R294LAK0MJDR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
OM5578/PN7150ARD | NXP USA Inc. |
Description: DEV KIT PN7150 PLUG/PLAY NFC CTL Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MC9S08AC128CFUE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Number of I/O: 54 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9RS08KA8CPJ | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 254 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I²C Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-DIP Number of I/O: 18 DigiKey Programmable: Not Verified |
на замовлення 518 шт: термін постачання 21-31 дні (днів) |
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S912XDG128F2CAL | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MFS8623BMBA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 36V Applications: Camera Supplier Device Package: 48-QFN (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCF5280CVF66 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 66MHz RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 256-MAPBGA (17x17) Number of I/O: 142 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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S32G378ASAK1VUCT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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S32G378ASAK1VUCR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC68en360ai33l | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 240-BFQFP Mounting Type: Surface Mount Speed: 33MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 240-FQFP (32x32) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: SCC, SMC, SPI |
на замовлення 156 шт: термін постачання 21-31 дні (днів) |
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MFS2613AMDA4AD | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
на замовлення 133 шт: термін постачання 21-31 дні (днів) |
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MFS2613AMDA3AD | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
на замовлення 249 шт: термін постачання 21-31 дні (днів) |
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MFS2633AMDA0AD | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Applications: System Basis Chip Current - Supply: 29µA Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive Qualification: AEC-Q100 |
на замовлення 156 шт: термін постачання 21-31 дні (днів) |
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MF3D2300DA4/00J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: PLLMC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
MF3D8300DA4/00J | NXP USA Inc. |
Description: MF3D8300DA4 Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: PLLMC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MFRC63103HNY | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad For Use With/Related Products: MFRC631 Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Standards: ISO 14443, MIFARE Supplied Contents: Board(s) Supplier Device Package: 32-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MFRC63103HNY | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad For Use With/Related Products: MFRC631 Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Standards: ISO 14443, MIFARE Supplied Contents: Board(s) Supplier Device Package: 32-HVQFN (5x5) |
на замовлення 4835 шт: термін постачання 21-31 дні (днів) |
|
MC32PF3000A3EP |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
на замовлення 225 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 553.66 грн |
10+ | 411.61 грн |
25+ | 381.17 грн |
100+ | 326.36 грн |
SPC5675KFK0MJM2 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
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TEA2017DK1007 |
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Виробник: NXP USA Inc.
Description: TEA2017AAT/3 PROGRAM BOARD
Packaging: Bulk
For Use With/Related Products: TEA2017
Type: Programmer
Contents: Board(s)
Utilized IC / Part: TEA2017
Description: TEA2017AAT/3 PROGRAM BOARD
Packaging: Bulk
For Use With/Related Products: TEA2017
Type: Programmer
Contents: Board(s)
Utilized IC / Part: TEA2017
на замовлення 12 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3819.59 грн |
TEA2016DK1008 |
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Виробник: NXP USA Inc.
Description: TEA20XX SOCKET DB1586 BOARD
Packaging: Bulk
For Use With/Related Products: TEA2016
Type: Programmer
Contents: Board(s), Accessories
Utilized IC / Part: TEA2016
Description: TEA20XX SOCKET DB1586 BOARD
Packaging: Bulk
For Use With/Related Products: TEA2016
Type: Programmer
Contents: Board(s), Accessories
Utilized IC / Part: TEA2016
на замовлення 19 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3819.59 грн |
SPC5775BSK3MME2R |
Виробник: NXP USA Inc.
Description: NXP 32-BIT MCU, 4MB FLASH FCACS
Packaging: Tape & Reel (TR)
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR
Supplier Device Package: 416-MAPBGA (27x27)
Description: NXP 32-BIT MCU, 4MB FLASH FCACS
Packaging: Tape & Reel (TR)
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR
Supplier Device Package: 416-MAPBGA (27x27)
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SPC5775BSK3MME2 |
Виробник: NXP USA Inc.
Description: NXP 32-BIT MCU, 4MB FLASH FCACS
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR
Supplier Device Package: 416-MAPBGA (27x27)
Description: NXP 32-BIT MCU, 4MB FLASH FCACS
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR
Supplier Device Package: 416-MAPBGA (27x27)
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SPC5775EDK3MME3R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Number of I/O: 293
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Number of I/O: 293
DigiKey Programmable: Not Verified
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MHW8188AN |
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Виробник: NXP USA Inc.
Description: IC AMP CATV 7-CATV MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-CATV Module
Number of Circuits: 1
Current - Supply: 425 mA
Description: IC AMP CATV 7-CATV MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-CATV Module
Number of Circuits: 1
Current - Supply: 425 mA
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FS32R294KCK0MJDT |
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Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: IC MCU
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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FS32R294KAK0MJDT |
Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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FS32R294KCK0MJDR |
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Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: IC MCU
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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FS32R294KAK0MJDR |
Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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FS32R294JCK0MJDT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
RAM Size: 5.5M x 8
Program Memory Type: ROMless
Core Processor: e200z4, e200z7
Core Size: 32-Bit Dual-Core
Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI
Peripherals: Temp Sensor
Supplier Device Package: 269-LFBGA (14x14)
Description: IC MCU 32BIT 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
RAM Size: 5.5M x 8
Program Memory Type: ROMless
Core Processor: e200z4, e200z7
Core Size: 32-Bit Dual-Core
Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI
Peripherals: Temp Sensor
Supplier Device Package: 269-LFBGA (14x14)
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FS32R294JAK0MJDT |
Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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FS32R294JAK0MJDR |
Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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FS32R294HBK0MJDT |
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Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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FS32R294HBK0MJDR |
Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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FS32R294LBK0MJDT |
Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
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FS32R294LBK0MJDR |
Виробник: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
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FS32R294LAK0MJDT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Description: IC MCU 32BIT 3MB 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
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FS32R294LAK0MJDR |
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Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: IC MCU
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
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MC9S08AC128CFUE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
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MC9RS08KA8CPJ |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Bulk
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Bulk
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 518 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
518+ | 79.92 грн |
S912XDG128F2CAL |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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MFS8623BMBA0ES |
Виробник: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
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MCF5280CVF66 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 142
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 142
DigiKey Programmable: Not Verified
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S32G378ASAK1VUCT |
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Виробник: NXP USA Inc.
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
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S32G378ASAK1VUCR |
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Виробник: NXP USA Inc.
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
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MC68en360ai33l |
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Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
на замовлення 156 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 11911.90 грн |
MFS2613AMDA4AD |
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Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
на замовлення 133 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 635.22 грн |
10+ | 476.03 грн |
25+ | 441.98 грн |
100+ | 379.67 грн |
MFS2613AMDA3AD |
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Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
на замовлення 249 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 636.05 грн |
10+ | 476.43 грн |
25+ | 442.42 грн |
100+ | 380.05 грн |
MFS2633AMDA0AD |
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Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Applications: System Basis Chip
Current - Supply: 29µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Applications: System Basis Chip
Current - Supply: 29µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 156 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 650.88 грн |
10+ | 487.61 грн |
25+ | 452.67 грн |
100+ | 388.82 грн |
MF3D2300DA4/00J |
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Виробник: NXP USA Inc.
Description: MF3D2300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Description: MF3D2300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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MF3D8300DA4/00J |
Виробник: NXP USA Inc.
Description: MF3D8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Description: MF3D8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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MFRC63103HNY |
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Виробник: NXP USA Inc.
Description: CL READER IC'S
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
For Use With/Related Products: MFRC631
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplied Contents: Board(s)
Supplier Device Package: 32-HVQFN (5x5)
Description: CL READER IC'S
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
For Use With/Related Products: MFRC631
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplied Contents: Board(s)
Supplier Device Package: 32-HVQFN (5x5)
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MFRC63103HNY |
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Виробник: NXP USA Inc.
Description: CL READER IC'S
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
For Use With/Related Products: MFRC631
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplied Contents: Board(s)
Supplier Device Package: 32-HVQFN (5x5)
Description: CL READER IC'S
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
For Use With/Related Products: MFRC631
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplied Contents: Board(s)
Supplier Device Package: 32-HVQFN (5x5)
на замовлення 4835 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 528.94 грн |
10+ | 393.20 грн |
25+ | 364.32 грн |
100+ | 312.07 грн |
250+ | 297.85 грн |
500+ | 289.28 грн |
1000+ | 281.57 грн |