Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35480) > Сторінка 505 з 592
Фото | Назва | Виробник | Інформація |
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ISI-QMC-DB02 | NXP USA Inc. |
![]() Packaging: Bulk Function: Expansion Board Type: Interface Contents: Board(s) Utilized IC / Part: NAFE13388, PCT2075, PN7462, SE05x, TJA146x |
товару немає в наявності |
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XC7SH86GV,125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-74A, SOT-753 Mounting Type: Surface Mount Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 5.5V Current - Output High, Low: 8mA, 8mA Number of Inputs: 2 Supplier Device Package: 5-TSOP Input Logic Level - High: 1.5V ~ 3.85V Input Logic Level - Low: 0.5V ~ 1.65V Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF Number of Circuits: 1 Current - Quiescent (Max): 1 µA |
на замовлення 147000 шт: термін постачання 21-31 дні (днів) |
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FRDMDUAL33664EVB | NXP USA Inc. |
![]() Packaging: Bulk Function: Transceiver Type: Interface Utilized IC / Part: MC33664 Supplied Contents: Board(s) Primary Attributes: Isolated Embedded: Yes, MCU Contents: Board(s) Secondary Attributes: On-Board LEDs |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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MC32PF4210A3ESR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: 0°C ~ 85°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: Audio, Video Supplier Device Package: 56-QFN-EP (8x8) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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S9S08DV16F2MLF | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MKE16F512VLL16 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 168MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 68K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 89 DigiKey Programmable: Not Verified |
на замовлення 450 шт: термін постачання 21-31 дні (днів) |
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MCIMX6Y1CVK05AA | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 272MAPBGA Packaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Additional Interfaces: CAN, I2C, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MIMXRT595SFAWCR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 141-XFBGA, WLCSP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 192KB (192K x 8) RAM Size: 5M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 141-WLCSP (4.53x4.53) Number of I/O: 136 DigiKey Programmable: Not Verified |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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SPC5744PK1AMMM9 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 2.5MB (2.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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SPC5746CHK0AMMH6 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 100-MAPBGA (11x11) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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SPC5746CHK0AMMJ6 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Number of I/O: 178 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
T1022NSE7WQB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 1Gbps (5) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
товару немає в наявності |
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T4161NSN7PQB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Voltage - I/O: 1.8V, 2.5V Supplier Device Package: 1932-FCPBGA (45x45) Ethernet: 1Gbps (13), 10Gbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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MCIMX6G1AVM07AA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 696MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MKV31F512VLL12P | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 70 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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LS1043AXN7QQA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.6GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (21x21) Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
MRF377HR3 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-860C3 Current Rating (Amps): 17A Mounting Type: Chassis Mount Frequency: 860MHz Power - Output: 45W Gain: 18.2dB Technology: LDMOS Supplier Device Package: NI-860C3 Voltage - Rated: 65 V Voltage - Test: 32 V Current - Test: 2 A |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
MCIMX6G1AVM07AA557 | NXP USA Inc. |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
MCIMX6Y1DVM05AA557 | NXP USA Inc. |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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MCIMX6G2DVK05AA557-NXP | NXP USA Inc. |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
MCIMX6G0DVM05AA557 | NXP USA Inc. |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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UBA2024T/N1,518 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 14-SO Dimming: No Current - Output Source/Sink: 900mA Current - Supply: 5 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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UBA2024T/N1,518 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 14-SO Dimming: No Current - Output Source/Sink: 900mA Current - Supply: 5 mA |
на замовлення 4413 шт: термін постачання 21-31 дні (днів) |
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UBA2024AP/N1,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 8-DIP Dimming: No Current - Output Source/Sink: 1.35A Current - Supply: 5 mA |
на замовлення 1825 шт: термін постачання 21-31 дні (днів) |
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UBA2024AP/N1,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 8-DIP Dimming: No Current - Output Source/Sink: 1.35A Current - Supply: 5 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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UBA2024AT/N1,518 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 14-SO Dimming: No Current - Output Source/Sink: 1.2A Current - Supply: 5 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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UBA2024BP/N1,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 8-DIP Dimming: No Current - Output Source/Sink: 2.5A Current - Supply: 5 mA |
на замовлення 400 шт: термін постачання 21-31 дні (днів) |
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UBA2024BP/N1,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 8-DIP Dimming: No Current - Output Source/Sink: 2.5A Current - Supply: 5 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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UBA2211CP/N1,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 10.7V ~ 13.8V Supplier Device Package: 8-DIP Dimming: No Current - Output Source/Sink: 1.85A |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MCIMX6X4EVM10AB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 529-LFBGA Mounting Type: Surface Mount Speed: 227MHz, 1GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 529-MAPBGA (19x19) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC |
на замовлення 669 шт: термін постачання 21-31 дні (днів) |
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MIMXRT555SFAWCR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 141-XFBGA, WLCSP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 192KB (192K x 8) RAM Size: 5M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 141-WLCSP (4.53x4.53) Number of I/O: 136 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
MIMXRT555SFFOCR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 249-WFBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 192KB (192K x 8) RAM Size: 5M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 249-FOWLP (7x7) Number of I/O: 136 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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MIMXRT555SFFOC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 249-WFBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 192KB (192K x 8) RAM Size: 5M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 249-FOWLP (7x7) Number of I/O: 136 DigiKey Programmable: Not Verified |
на замовлення 260 шт: термін постачання 21-31 дні (днів) |
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MIMXRT595SFFOCR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 249-WFBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 192KB (192K x 8) RAM Size: 5M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 249-FOWLP (7x7) Number of I/O: 136 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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MK10DX256VLL7557 | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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PCA9601DPZ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Delay Time: 100ns Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 15V Applications: I2C Current - Supply: 5.5mA Data Rate (Max): 1MHz Supplier Device Package: 8-TSSOP Capacitance - Input: 10 pF |
на замовлення 4344 шт: термін постачання 21-31 дні (днів) |
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MC33814AER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 36V Applications: Small Engine Current - Supply: 10mA Supplier Device Package: 48-LQFP-EP (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC33814AER2 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 36V Applications: Small Engine Current - Supply: 10mA Supplier Device Package: 48-LQFP-EP (7x7) |
на замовлення 1985 шт: термін постачання 21-31 дні (днів) |
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SC900950AER2 | NXP USA Inc. |
Description: SOLENOID DRIVER, 8 DRV, MOTOR PU Packaging: Tape & Reel (TR) |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
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SC900950AER2 | NXP USA Inc. |
Description: SOLENOID DRIVER, 8 DRV, MOTOR PU Packaging: Cut Tape (CT) |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
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LPC865M201JHI33/0E | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 29 |
на замовлення 446 шт: термін постачання 21-31 дні (днів) |
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LPC865M201JHI33/0K | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32VFQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, I³C, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 29 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
HEF4043BT-Q100118 | NXP USA Inc. |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
HEF4043BP | NXP USA Inc. |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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HEF4043BP,652 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Output Type: Tri-State Mounting Type: Through Hole Circuit: 1:1 Logic Type: S-R Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 15V Independent Circuits: 4 Current - Output High, Low: 3mA, 3mA Delay Time - Propagation: 15ns Supplier Device Package: 16-DIP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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PTN3222CUK-EVB | NXP USA Inc. |
![]() Packaging: Box Function: Re-Driver Type: Interface Utilized IC / Part: PTN3222 Supplied Contents: Board(s) Embedded: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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PTN3222GMJ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 12-XFQFN Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 55mA Data Rate (Max): 480Mbps Supplier Device Package: 12-XQFN (1.75x2.2) Signal Conditioning: Input Equalization, Output De-Emphasis Capacitance - Input: 10 pF |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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PTN3222GMJ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 12-XFQFN Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 55mA Data Rate (Max): 480Mbps Supplier Device Package: 12-XQFN (1.75x2.2) Signal Conditioning: Input Equalization, Output De-Emphasis Capacitance - Input: 10 pF |
на замовлення 13439 шт: термін постачання 21-31 дні (днів) |
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PTN3222EUKZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 12-XFBGA, WLCSP Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 55mA (Max) Data Rate (Max): 480Mbps Supplier Device Package: 12-WLCSP (1.55x1.18) Signal Conditioning: Input Equalization, Output De-Emphasis Capacitance - Input: 10 pF |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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AFT20P140-4WNR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-4 Packaging: Bulk Package / Case: OM-780-4L Mounting Type: Surface Mount Frequency: 1.88GHz ~ 1.91GHz Configuration: Dual Power - Output: 24W Gain: 17.8dB Technology: LDMOS Supplier Device Package: OM-780-4L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 500 mA |
на замовлення 9810 шт: термін постачання 21-31 дні (днів) |
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AFRX5G372T4 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 20-LFLGA Exposed Pad Frequency: 3.3GHz ~ 5GHz RF Type: 5G, LTE Supplier Device Package: 21-HLLGA (6.2x6.2) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
S908QY4AE0CDTE | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, 8MHZ, CM Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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S908QY4AE0MDTER | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Number of I/O: 13 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
WLAN7205CY | NXP USA Inc. |
Description: WI-FI 6E FRONT-END IC, 5-7 GHZ Packaging: Tape & Reel (TR) Features: SPDT Package / Case: 16-WFLGA Exposed Pad Frequency: 5.15GHz ~ 7.125GHz RF Type: WLAN Supplier Device Package: 16-HWFLGA (2x2) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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MPC8378EVRANGA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC9S08MM64CLH | NXP USA Inc. |
Description: IC MCU 8BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 6x16b; D/A 1x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI, USB Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 33 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MX8-DSI-OLED1A | NXP USA Inc. |
![]() Packaging: Box Function: OLED Type: Display Contents: Board(s) Utilized IC / Part: i.MX 8M Mini |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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BZB784-C10,115 | NXP USA Inc. |
![]() Packaging: Bulk Tolerance: ±5% Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 10 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOT-323 Power - Max: 180 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 200 nA @ 7 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
BZB784-C4V3115 | NXP USA Inc. |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
BZB784-C4V3,115 | NXP USA Inc. |
![]() Packaging: Bulk |
на замовлення 113500 шт: термін постачання 21-31 дні (днів) |
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ISI-QMC-DB02 |
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Виробник: NXP USA Inc.
Description: INTERFACE DEVELOPMENT TOOLS ISI-
Packaging: Bulk
Function: Expansion Board
Type: Interface
Contents: Board(s)
Utilized IC / Part: NAFE13388, PCT2075, PN7462, SE05x, TJA146x
Description: INTERFACE DEVELOPMENT TOOLS ISI-
Packaging: Bulk
Function: Expansion Board
Type: Interface
Contents: Board(s)
Utilized IC / Part: NAFE13388, PCT2075, PN7462, SE05x, TJA146x
товару немає в наявності
В кошику
од. на суму грн.
XC7SH86GV,125 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA XC7SH86GV - XOR GAT
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
Description: NOW NEXPERIA XC7SH86GV - XOR GAT
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
на замовлення 147000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1679+ | 14.49 грн |
FRDMDUAL33664EVB |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33664
Packaging: Bulk
Function: Transceiver
Type: Interface
Utilized IC / Part: MC33664
Supplied Contents: Board(s)
Primary Attributes: Isolated
Embedded: Yes, MCU
Contents: Board(s)
Secondary Attributes: On-Board LEDs
Description: EVAL BOARD FOR MC33664
Packaging: Bulk
Function: Transceiver
Type: Interface
Utilized IC / Part: MC33664
Supplied Contents: Board(s)
Primary Attributes: Isolated
Embedded: Yes, MCU
Contents: Board(s)
Secondary Attributes: On-Board LEDs
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 31167.93 грн |
MC32PF4210A3ESR2 |
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Виробник: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
товару немає в наявності
В кошику
од. на суму грн.
S9S08DV16F2MLF |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MKE16F512VLL16 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 450 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 755.85 грн |
10+ | 568.10 грн |
25+ | 528.03 грн |
90+ | 456.78 грн |
270+ | 433.02 грн |
450+ | 424.24 грн |
MCIMX6Y1CVK05AA |
Виробник: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
товару немає в наявності
В кошику
од. на суму грн.
MIMXRT595SFAWCR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
6000+ | 1080.82 грн |
SPC5744PK1AMMM9 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 2.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 2.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
SPC5746CHK0AMMH6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
SPC5746CHK0AMMJ6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
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T1022NSE7WQB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1.5GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.5GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
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T4161NSN7PQB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ T4 1.5GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Description: IC MPU QORIQ T4 1.5GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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MCIMX6G1AVM07AA |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MKV31F512VLL12P |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
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LS1043AXN7QQA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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MRF377HR3 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Tape & Reel (TR)
Package / Case: NI-860C3
Current Rating (Amps): 17A
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 45W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 2 A
Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Tape & Reel (TR)
Package / Case: NI-860C3
Current Rating (Amps): 17A
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 45W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 2 A
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UBA2024T/N1,518 |
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Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
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UBA2024T/N1,518 |
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Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
на замовлення 4413 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
376+ | 61.29 грн |
UBA2024AP/N1,112 |
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Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.35A
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.35A
Current - Supply: 5 mA
на замовлення 1825 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
290+ | 79.68 грн |
UBA2024AP/N1,112 |
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Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.35A
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.35A
Current - Supply: 5 mA
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UBA2024AT/N1,518 |
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Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 1.2A
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 1.2A
Current - Supply: 5 mA
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UBA2024BP/N1,112 |
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Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 2.5A
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 2.5A
Current - Supply: 5 mA
на замовлення 400 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
290+ | 79.68 грн |
UBA2024BP/N1,112 |
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Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 2.5A
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 2.5A
Current - Supply: 5 mA
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UBA2211CP/N1,112 |
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Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 10.7V ~ 13.8V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.85A
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 10.7V ~ 13.8V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.85A
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MCIMX6X4EVM10AB |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 529MAPBGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Description: IC MPU I.MX6SX 1GHZ 529MAPBGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
на замовлення 669 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2880.14 грн |
10+ | 2259.54 грн |
84+ | 2005.05 грн |
168+ | 1829.99 грн |
252+ | 1804.14 грн |
MIMXRT555SFAWCR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
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MIMXRT555SFFOCR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 249FOWLP
Packaging: Tape & Reel (TR)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 192KB ROM 249FOWLP
Packaging: Tape & Reel (TR)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2000+ | 1333.35 грн |
MIMXRT555SFFOC |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 249FOWLP
Packaging: Tray
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 192KB ROM 249FOWLP
Packaging: Tray
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
на замовлення 260 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2042.18 грн |
10+ | 1577.26 грн |
80+ | 1346.88 грн |
MIMXRT595SFFOCR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 249FOWLP
Packaging: Tape & Reel (TR)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 192KB ROM 249FOWLP
Packaging: Tape & Reel (TR)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2000+ | 1482.53 грн |
MK10DX256VLL7557 |
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Виробник: NXP USA Inc.
Description: KINETIS K10: MICROCONTROLLER COR
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: KINETIS K10: MICROCONTROLLER COR
Packaging: Bulk
DigiKey Programmable: Not Verified
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PCA9601DPZ |
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Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 100ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 100ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
на замовлення 4344 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 350.16 грн |
10+ | 255.87 грн |
25+ | 235.58 грн |
100+ | 200.17 грн |
250+ | 190.20 грн |
500+ | 184.20 грн |
1000+ | 176.31 грн |
MC33814AER2 |
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Виробник: NXP USA Inc.
Description: IC CTRL SMALL ENG 2CYL 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: IC CTRL SMALL ENG 2CYL 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 48-LQFP-EP (7x7)
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MC33814AER2 |
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Виробник: NXP USA Inc.
Description: IC CTRL SMALL ENG 2CYL 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: IC CTRL SMALL ENG 2CYL 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 48-LQFP-EP (7x7)
на замовлення 1985 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 839.57 грн |
10+ | 632.75 грн |
25+ | 588.83 грн |
100+ | 507.25 грн |
250+ | 485.64 грн |
500+ | 472.62 грн |
1000+ | 454.32 грн |
SC900950AER2 |
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1500+ | 488.16 грн |
SC900950AER2 |
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 813.81 грн |
10+ | 612.36 грн |
25+ | 569.61 грн |
100+ | 490.48 грн |
250+ | 469.46 грн |
500+ | 456.80 грн |
LPC865M201JHI33/0E |
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Виробник: NXP USA Inc.
Description: IC MCU CORTEX M0+ HVQFN32
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
Description: IC MCU CORTEX M0+ HVQFN32
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
на замовлення 446 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 243.90 грн |
10+ | 153.09 грн |
25+ | 131.87 грн |
80+ | 104.42 грн |
230+ | 91.32 грн |
LPC865M201JHI33/0K |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, I³C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
Description: IC MCU 32BIT 64KB FLASH 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, I³C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
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HEF4043BP,652 |
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Виробник: NXP USA Inc.
Description: IC R/S LATCH 3-STATE QUAD 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 1:1
Logic Type: S-R Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Independent Circuits: 4
Current - Output High, Low: 3mA, 3mA
Delay Time - Propagation: 15ns
Supplier Device Package: 16-DIP
Description: IC R/S LATCH 3-STATE QUAD 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 1:1
Logic Type: S-R Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Independent Circuits: 4
Current - Output High, Low: 3mA, 3mA
Delay Time - Propagation: 15ns
Supplier Device Package: 16-DIP
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PTN3222CUK-EVB |
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Виробник: NXP USA Inc.
Description: EUSB2 USB2 REDRIVER EVAL
Packaging: Box
Function: Re-Driver
Type: Interface
Utilized IC / Part: PTN3222
Supplied Contents: Board(s)
Embedded: No
Description: EUSB2 USB2 REDRIVER EVAL
Packaging: Box
Function: Re-Driver
Type: Interface
Utilized IC / Part: PTN3222
Supplied Contents: Board(s)
Embedded: No
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PTN3222GMJ |
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Виробник: NXP USA Inc.
Description: IC EUSB2 TO USB2 QFN12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-XQFN (1.75x2.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Description: IC EUSB2 TO USB2 QFN12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-XQFN (1.75x2.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
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PTN3222GMJ |
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Виробник: NXP USA Inc.
Description: IC EUSB2 TO USB2 QFN12
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-XQFN (1.75x2.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Description: IC EUSB2 TO USB2 QFN12
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-XQFN (1.75x2.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
на замовлення 13439 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 129.60 грн |
10+ | 91.47 грн |
25+ | 83.22 грн |
100+ | 69.59 грн |
250+ | 65.54 грн |
500+ | 63.10 грн |
1000+ | 60.08 грн |
2500+ | 57.99 грн |
5000+ | 56.73 грн |
PTN3222EUKZ |
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Виробник: NXP USA Inc.
Description: USB INTERFACE IC PTN3222EUK
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Description: USB INTERFACE IC PTN3222EUK
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
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AFT20P140-4WNR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 1.88GHz ~ 1.91GHz
Configuration: Dual
Power - Output: 24W
Gain: 17.8dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 1.88GHz ~ 1.91GHz
Configuration: Dual
Power - Output: 24W
Gain: 17.8dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
на замовлення 9810 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
4+ | 6378.08 грн |
AFRX5G372T4 |
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Виробник: NXP USA Inc.
Description: AIRFAST RX MODULE, 3300-5000 MHZ
Packaging: Tape & Reel (TR)
Package / Case: 20-LFLGA Exposed Pad
Frequency: 3.3GHz ~ 5GHz
RF Type: 5G, LTE
Supplier Device Package: 21-HLLGA (6.2x6.2)
Description: AIRFAST RX MODULE, 3300-5000 MHZ
Packaging: Tape & Reel (TR)
Package / Case: 20-LFLGA Exposed Pad
Frequency: 3.3GHz ~ 5GHz
RF Type: 5G, LTE
Supplier Device Package: 21-HLLGA (6.2x6.2)
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S908QY4AE0CDTE |
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, 8MHZ, CM
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8-BIT, 8MHZ, CM
Packaging: Bulk
DigiKey Programmable: Not Verified
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S908QY4AE0MDTER |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
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WLAN7205CY |
Виробник: NXP USA Inc.
Description: WI-FI 6E FRONT-END IC, 5-7 GHZ
Packaging: Tape & Reel (TR)
Features: SPDT
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5.15GHz ~ 7.125GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
Description: WI-FI 6E FRONT-END IC, 5-7 GHZ
Packaging: Tape & Reel (TR)
Features: SPDT
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5.15GHz ~ 7.125GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
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MPC8378EVRANGA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MC9S08MM64CLH |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x16b; D/A 1x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x16b; D/A 1x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
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MX8-DSI-OLED1A |
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Виробник: NXP USA Inc.
Description: OLED DISPLAY MIPI-DSI 1080P
Packaging: Box
Function: OLED
Type: Display
Contents: Board(s)
Utilized IC / Part: i.MX 8M Mini
Description: OLED DISPLAY MIPI-DSI 1080P
Packaging: Box
Function: OLED
Type: Display
Contents: Board(s)
Utilized IC / Part: i.MX 8M Mini
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 45104.96 грн |
BZB784-C10,115 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C10 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
Description: NOW NEXPERIA BZB784-C10 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
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од. на суму грн.
BZB784-C4V3,115 |
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на замовлення 113500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
10452+ | 2.41 грн |