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HEF4043BP NXP USA Inc. PHGLS23663-1.pdf?t.download=true&u=5oefqw Description: R-S LATCH, HIGH LEVEL TRIGGERED
Packaging: Bulk
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HEF4043BP,652 HEF4043BP,652 NXP USA Inc. HEF4043B.pdf Description: IC R/S LATCH 3-STATE QUAD 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 1:1
Logic Type: S-R Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Independent Circuits: 4
Current - Output High, Low: 3mA, 3mA
Delay Time - Propagation: 15ns
Supplier Device Package: 16-DIP
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PTN3222CUK-EVB PTN3222CUK-EVB NXP USA Inc. getting-started-with-the-ptn3222cuk-evb-evaluation-board:GS-PTN3222CUK-EVB Description: EUSB2 USB2 REDRIVER EVAL
Packaging: Box
Function: Re-Driver
Type: Interface
Utilized IC / Part: PTN3222
Supplied Contents: Board(s)
Embedded: No
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PTN3222GMJ PTN3222GMJ NXP USA Inc. PTN3222_CUK.pdf Description: IC EUSB2 TO USB2 QFN12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-XQFN (1.75x2.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
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PTN3222GMJ PTN3222GMJ NXP USA Inc. PTN3222_CUK.pdf Description: IC EUSB2 TO USB2 QFN12
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-XQFN (1.75x2.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
на замовлення 13439 шт:
термін постачання 21-31 дні (днів)
3+126.38 грн
10+89.20 грн
25+81.15 грн
100+67.87 грн
250+63.92 грн
500+61.53 грн
1000+58.59 грн
2500+56.55 грн
5000+55.33 грн
Мінімальне замовлення: 3
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PTN3222EUKZ NXP USA Inc. PTN3222EUK.pdf Description: USB INTERFACE IC PTN3222EUK
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
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AFT20P140-4WNR3 AFT20P140-4WNR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 1.88GHz ~ 1.91GHz
Configuration: Dual
Power - Output: 24W
Gain: 17.8dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
на замовлення 9810 шт:
термін постачання 21-31 дні (днів)
4+6219.72 грн
Мінімальне замовлення: 4
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AFRX5G372T4 NXP USA Inc. AFRX5G372.pdf Description: AIRFAST RX MODULE, 3300-5000 MHZ
Packaging: Tape & Reel (TR)
Package / Case: 20-LFLGA Exposed Pad
Frequency: 3.3GHz ~ 5GHz
RF Type: 5G, LTE
Supplier Device Package: 21-HLLGA (6.2x6.2)
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S908QY4AE0CDTE NXP USA Inc. Description: MICROCONTROLLER, 8-BIT, 8MHZ, CM
Packaging: Bulk
DigiKey Programmable: Not Verified
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S908QY4AE0MDTER S908QY4AE0MDTER NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
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WLAN7205CY NXP USA Inc. Description: WI-FI 6E FRONT-END IC, 5-7 GHZ
Packaging: Tape & Reel (TR)
Features: SPDT
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5.15GHz ~ 7.125GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
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MPC8378EVRANGA MPC8378EVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MC9S08MM64CLH MC9S08MM64CLH NXP USA Inc. Description: IC MCU 8BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x16b; D/A 1x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
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MX8-DSI-OLED1A MX8-DSI-OLED1A NXP USA Inc. IMX8MDQLQIEC.pdf Description: OLED DISPLAY MIPI-DSI 1080P
Packaging: Box
Function: OLED
Type: Display
Contents: Board(s)
Utilized IC / Part: i.MX 8M Mini
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+43985.12 грн
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BZB784-C10,115 BZB784-C10,115 NXP USA Inc. PHGLS17646-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BZB784-C10 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
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BZB784-C4V3115 NXP USA Inc. BZB784_SERIES.pdf Description: NOW NEXPERIA BZB784-C4V3 - ZENER
Packaging: Bulk
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BZB784-C4V3,115 NXP USA Inc. BZB784_SERIES.pdf Description: DIODE ZENER DUAL 4.3V SOT323
Packaging: Bulk
на замовлення 113500 шт:
термін постачання 21-31 дні (днів)
10452+2.35 грн
Мінімальне замовлення: 10452
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BZB784-C2V4,115 NXP USA Inc. BZB784_SERIES.pdf Description: DIODE ZENER DUAL 2.4V SOT323
Packaging: Bulk
на замовлення 23500 шт:
термін постачання 21-31 дні (днів)
10452+2.35 грн
Мінімальне замовлення: 10452
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MBC13917EPR2 MBC13917EPR2 NXP USA Inc. MBC13917.pdf Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Tape & Reel (TR)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
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MBC13917EPR2 MBC13917EPR2 NXP USA Inc. MBC13917.pdf Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
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S9S12VR48AACLCR S9S12VR48AACLCR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
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S9S12VR48AACLC NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
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S9S12VR48AACLFR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
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S9S12VR48AACLF NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
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S9S12VR48AAVLCR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
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S9S12VR48AAMLCR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
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S9S12VR48AAMLC NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
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S9S12VR48AAMLFR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
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S9S12VR48AAVLC NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
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S9S12VR48AAVLFR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
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S9S12VR48AAMLF NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
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S9S12VR48AAVLF NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
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PCA9450B-EVK NXP USA Inc. Description: PCA9450B-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
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PCA9450C-EVK NXP USA Inc. Description: PCA9450C-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
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PCA9450AA-EVK NXP USA Inc. getting-started-with-the-pca9450-evaluation-board:GS-PCA9450-EVK Description: PCA9450AA-EVK
Packaging: Bulk
Contents: Board(s)
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AFLP5G25641T6 NXP USA Inc. Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 32dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 2.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
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A3M40PD012T7 NXP USA Inc. Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 12-WFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: Cellular
Voltage - Supply: 3.3V
Gain: 34dB
Current - Supply: 90mA
P1dB: 25dBm
Test Frequency: 3.5GHz
Supplier Device Package: 12-PLGA (2.2x2.2)
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AFLP5G35645T6 NXP USA Inc. Description: AIRFAST PRE-DRIVER MODULE, 3400-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 31.5dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 3.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
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AFSC5G23E37T2 NXP USA Inc. AFSC5G23E37.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 35dB
Test Frequency: 2.3GHz, 2.4GHz
Supplier Device Package: 26-HLQFN (10x6)
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AFSC5G26E38T2 AFSC5G26E38T2 NXP USA Inc. AFSC5G26E38.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 31V
Gain: 32dB
Current - Supply: 48mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
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AFSC5G26F38T2 NXP USA Inc. AFSC5G26F38.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 36.7dB
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
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AFSC5G35E38T2 NXP USA Inc. AFSC5G35E38.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 24V ~ 31V
Gain: 30.5dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
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AFSC5G40E38T2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dB
Test Frequency: 4GHz
Supplier Device Package: 26-HLQFN (10x6)
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AFSC5G23E39T2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
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AFSC5G26E39T2 NXP USA Inc. AFSC5G26E39.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28dB
Current - Supply: 65mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
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A3M35TL039T2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dBm
Test Frequency: 3.4GHz
Supplier Device Package: 26-HLQFN (10x6)
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A3M39TL039T2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.6dB
Test Frequency: 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
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A3M37TL039T2 NXP USA Inc. A3M37TL039.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.1dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
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A3M34TL139T2 NXP USA Inc. A3M34TL139.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.58GHz
RF Type: LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.3GHz
Supplier Device Package: 26-HLQFN (10x6)
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A3M36SL039SAAT2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: Wireless LAN
Voltage - Supply: 29V
Gain: 29.8dB
Test Frequency: 3.4GHz ~ 3.8GHz
Supplier Device Package: 38-PLGA (10x8)
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A3M36SL039IAAT2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: LTE
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.2dB
Test Frequency: 3.4GHz
Supplier Device Package: 38-PLGA (10x8)
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A3M34SL039IAAT2 NXP USA Inc. A3M34SL039.pdf Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
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A3M38SL039IAAT2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
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A3M39SL039IAAT2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.3dB
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 38-PLGA (10x8)
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A5M39TG140T2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 32.7dB
Current - Supply: 40mA
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
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A5M36TG140T2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.8dB
Test Frequency: 3.3GHz ~ 3.8GHz
Supplier Device Package: 26-HLQFN (10x6)
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74AUP1G885GN115 NXP USA Inc. 74AUP1G885.pdf Description: NOW NEXPERIA 74AUP1G885GN - XOR
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (1.2x1)
Number of Circuits: 1
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PCF85103C-2T/00:11 PCF85103C-2T/00:11 NXP USA Inc. PCF85103C-2.pdf Description: IC EEPROM 2KBIT I2C 100KHZ 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6.0V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
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MC68030CRC25C MC68030CRC25C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MC68030CRC33C MC68030CRC33C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 33MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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HEF4043BP PHGLS23663-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: R-S LATCH, HIGH LEVEL TRIGGERED
Packaging: Bulk
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HEF4043BP,652 HEF4043B.pdf
HEF4043BP,652
Виробник: NXP USA Inc.
Description: IC R/S LATCH 3-STATE QUAD 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 1:1
Logic Type: S-R Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Independent Circuits: 4
Current - Output High, Low: 3mA, 3mA
Delay Time - Propagation: 15ns
Supplier Device Package: 16-DIP
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PTN3222CUK-EVB getting-started-with-the-ptn3222cuk-evb-evaluation-board:GS-PTN3222CUK-EVB
PTN3222CUK-EVB
Виробник: NXP USA Inc.
Description: EUSB2 USB2 REDRIVER EVAL
Packaging: Box
Function: Re-Driver
Type: Interface
Utilized IC / Part: PTN3222
Supplied Contents: Board(s)
Embedded: No
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PTN3222GMJ PTN3222_CUK.pdf
PTN3222GMJ
Виробник: NXP USA Inc.
Description: IC EUSB2 TO USB2 QFN12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-XQFN (1.75x2.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
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PTN3222GMJ PTN3222_CUK.pdf
PTN3222GMJ
Виробник: NXP USA Inc.
Description: IC EUSB2 TO USB2 QFN12
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-XQFN (1.75x2.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
на замовлення 13439 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+126.38 грн
10+89.20 грн
25+81.15 грн
100+67.87 грн
250+63.92 грн
500+61.53 грн
1000+58.59 грн
2500+56.55 грн
5000+55.33 грн
Мінімальне замовлення: 3
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PTN3222EUKZ PTN3222EUK.pdf
Виробник: NXP USA Inc.
Description: USB INTERFACE IC PTN3222EUK
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
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AFT20P140-4WNR3
AFT20P140-4WNR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 1.88GHz ~ 1.91GHz
Configuration: Dual
Power - Output: 24W
Gain: 17.8dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
на замовлення 9810 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+6219.72 грн
Мінімальне замовлення: 4
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AFRX5G372T4 AFRX5G372.pdf
Виробник: NXP USA Inc.
Description: AIRFAST RX MODULE, 3300-5000 MHZ
Packaging: Tape & Reel (TR)
Package / Case: 20-LFLGA Exposed Pad
Frequency: 3.3GHz ~ 5GHz
RF Type: 5G, LTE
Supplier Device Package: 21-HLLGA (6.2x6.2)
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S908QY4AE0CDTE
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, 8MHZ, CM
Packaging: Bulk
DigiKey Programmable: Not Verified
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S908QY4AE0MDTER
S908QY4AE0MDTER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
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WLAN7205CY
Виробник: NXP USA Inc.
Description: WI-FI 6E FRONT-END IC, 5-7 GHZ
Packaging: Tape & Reel (TR)
Features: SPDT
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5.15GHz ~ 7.125GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
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MPC8378EVRANGA MPC837XFFS.pdf
MPC8378EVRANGA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MC9S08MM64CLH
MC9S08MM64CLH
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x16b; D/A 1x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
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MX8-DSI-OLED1A IMX8MDQLQIEC.pdf
MX8-DSI-OLED1A
Виробник: NXP USA Inc.
Description: OLED DISPLAY MIPI-DSI 1080P
Packaging: Box
Function: OLED
Type: Display
Contents: Board(s)
Utilized IC / Part: i.MX 8M Mini
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+43985.12 грн
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BZB784-C10,115 PHGLS17646-1.pdf?t.download=true&u=5oefqw
BZB784-C10,115
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C10 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
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BZB784-C4V3115 BZB784_SERIES.pdf
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C4V3 - ZENER
Packaging: Bulk
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BZB784-C4V3,115 BZB784_SERIES.pdf
Виробник: NXP USA Inc.
Description: DIODE ZENER DUAL 4.3V SOT323
Packaging: Bulk
на замовлення 113500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10452+2.35 грн
Мінімальне замовлення: 10452
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BZB784-C2V4,115 BZB784_SERIES.pdf
Виробник: NXP USA Inc.
Description: DIODE ZENER DUAL 2.4V SOT323
Packaging: Bulk
на замовлення 23500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10452+2.35 грн
Мінімальне замовлення: 10452
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MBC13917EPR2 MBC13917.pdf
MBC13917EPR2
Виробник: NXP USA Inc.
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Tape & Reel (TR)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
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MBC13917EPR2 MBC13917.pdf
MBC13917EPR2
Виробник: NXP USA Inc.
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
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S9S12VR48AACLCR
S9S12VR48AACLCR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
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S9S12VR48AACLC
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
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S9S12VR48AACLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
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S9S12VR48AACLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
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S9S12VR48AAVLCR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
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S9S12VR48AAMLCR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
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S9S12VR48AAMLC
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
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S9S12VR48AAMLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
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S9S12VR48AAVLC
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
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S9S12VR48AAVLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
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S9S12VR48AAMLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
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S9S12VR48AAVLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
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PCA9450B-EVK
Виробник: NXP USA Inc.
Description: PCA9450B-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
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PCA9450C-EVK
Виробник: NXP USA Inc.
Description: PCA9450C-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
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PCA9450AA-EVK getting-started-with-the-pca9450-evaluation-board:GS-PCA9450-EVK
Виробник: NXP USA Inc.
Description: PCA9450AA-EVK
Packaging: Bulk
Contents: Board(s)
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AFLP5G25641T6
Виробник: NXP USA Inc.
Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 32dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 2.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
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A3M40PD012T7
Виробник: NXP USA Inc.
Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 12-WFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: Cellular
Voltage - Supply: 3.3V
Gain: 34dB
Current - Supply: 90mA
P1dB: 25dBm
Test Frequency: 3.5GHz
Supplier Device Package: 12-PLGA (2.2x2.2)
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AFLP5G35645T6
Виробник: NXP USA Inc.
Description: AIRFAST PRE-DRIVER MODULE, 3400-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 31.5dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 3.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
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AFSC5G23E37T2 AFSC5G23E37.pdf
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 35dB
Test Frequency: 2.3GHz, 2.4GHz
Supplier Device Package: 26-HLQFN (10x6)
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AFSC5G26E38T2 AFSC5G26E38.pdf
AFSC5G26E38T2
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 31V
Gain: 32dB
Current - Supply: 48mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
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AFSC5G26F38T2 AFSC5G26F38.pdf
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 36.7dB
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
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AFSC5G35E38T2 AFSC5G35E38.pdf
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 24V ~ 31V
Gain: 30.5dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
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AFSC5G40E38T2
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dB
Test Frequency: 4GHz
Supplier Device Package: 26-HLQFN (10x6)
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AFSC5G23E39T2
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
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AFSC5G26E39T2 AFSC5G26E39.pdf
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28dB
Current - Supply: 65mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
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A3M35TL039T2
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dBm
Test Frequency: 3.4GHz
Supplier Device Package: 26-HLQFN (10x6)
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A3M39TL039T2
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.6dB
Test Frequency: 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
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A3M37TL039T2 A3M37TL039.pdf
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.1dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
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A3M34TL139T2 A3M34TL139.pdf
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.58GHz
RF Type: LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.3GHz
Supplier Device Package: 26-HLQFN (10x6)
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A3M36SL039SAAT2
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: Wireless LAN
Voltage - Supply: 29V
Gain: 29.8dB
Test Frequency: 3.4GHz ~ 3.8GHz
Supplier Device Package: 38-PLGA (10x8)
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A3M36SL039IAAT2
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: LTE
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.2dB
Test Frequency: 3.4GHz
Supplier Device Package: 38-PLGA (10x8)
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A3M34SL039IAAT2 A3M34SL039.pdf
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
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A3M38SL039IAAT2
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
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A3M39SL039IAAT2
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.3dB
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 38-PLGA (10x8)
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A5M39TG140T2
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 32.7dB
Current - Supply: 40mA
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
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A5M36TG140T2
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.8dB
Test Frequency: 3.3GHz ~ 3.8GHz
Supplier Device Package: 26-HLQFN (10x6)
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74AUP1G885GN115 74AUP1G885.pdf
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AUP1G885GN - XOR
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (1.2x1)
Number of Circuits: 1
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PCF85103C-2T/00:11 PCF85103C-2.pdf
PCF85103C-2T/00:11
Виробник: NXP USA Inc.
Description: IC EEPROM 2KBIT I2C 100KHZ 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6.0V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
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MC68030CRC25C MC68030UM.pdf
MC68030CRC25C
Виробник: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MC68030CRC33C MC68030UM.pdf
MC68030CRC33C
Виробник: NXP USA Inc.
Description: IC MPU M680X0 33MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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