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MKE17Z128VLL7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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MKE13Z128VLL7 MKE13Z128VLL7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
1+440.08 грн
10+324.62 грн
25+299.88 грн
80+259.30 грн
230+244.60 грн
450+237.29 грн
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MKE13Z256VLH7 MKE13Z256VLH7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)
1+478.28 грн
10+353.20 грн
25+326.52 грн
80+282.64 грн
230+266.81 грн
800+241.81 грн
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MKE12Z256VLL7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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MKE13Z256VLL7 MKE13Z256VLL7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
1+577.76 грн
10+436.96 грн
80+361.77 грн
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MKW37A512VFT4R MKW37A512VFT4R NXP USA Inc. MKW39A512.pdf Description: IC MCU 32BIT 512KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
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MKW39A512VFT4R NXP USA Inc. Description: 32-BIT BLUETOOTH 5.0 LONG-RANGE
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
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MKW38A512VFT4R MKW38A512VFT4R NXP USA Inc. MKW39A512.pdf Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
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SVF532R2K1CMK4R SVF532R2K1CMK4R NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Cut Tape (CT)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
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PCF8562TT/2,518 PCF8562TT/2,518 NXP USA Inc. PCF8562.pdf Description: UNIVERSAL LCD DRIVER FOR LOW MUL
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 32 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 6 Characters, 8 Characters, 128 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2693 шт:
термін постачання 21-31 дні (днів)
2+178.26 грн
10+127.67 грн
25+116.64 грн
100+98.04 грн
250+92.60 грн
500+89.31 грн
1000+85.20 грн
Мінімальне замовлення: 2
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RDDRONE-IOT NXP USA Inc. hdib Description: RAPID-IOT TO DRONE INTERFACE BOA
Packaging: Bulk
Configuration: Quadcopter Components
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UCANS32K146-01 NXP USA Inc. Description: UCANS32K146 BOARD FOR DRONES, RO
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: S32K146
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RDDRONE-FMUK66L NXP USA Inc. getting-started Description: PX4 ROBOTIC DRONE FMU (RDDRONE-F
Packaging: Bulk
Configuration: Quadcopter Components
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SPC5668GF1AVMG SPC5668GF1AVMG NXP USA Inc. MPC5668x.pdf Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 592K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
DigiKey Programmable: Not Verified
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T1014NXN7MQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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MC9328MX21DVK MC9328MX21DVK NXP USA Inc. MC9328MX21.pdf Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
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ASK-RYLT1043-25K NXP USA Inc. Description: ROYALTY PREPAYMENT 25K UNITS - L
Packaging: Bulk
Type: License
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S32K324EHT1MPBST S32K324EHT1MPBST NXP USA Inc. S32K3xx.pdf Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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PCF85053ATKJ PCF85053ATKJ NXP USA Inc. PCF85053A.pdf Description: IC CPU RTC I2C SOT2413-1
Packaging: Tape & Reel (TR)
Features: Alarm, Daylight Savings, Leap Year, SRAM
Package / Case: 12-VFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128B
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD
Supplier Device Package: 12-HVSON (3x3)
Voltage - Supply, Battery: 1.55V ~ 3.6V
Current - Timekeeping (Max): 1mA @ 3.3V
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PCF85053ATKJ PCF85053ATKJ NXP USA Inc. PCF85053A.pdf Description: IC CPU RTC I2C SOT2413-1
Packaging: Cut Tape (CT)
Features: Alarm, Daylight Savings, Leap Year, SRAM
Package / Case: 12-VFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128B
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD
Supplier Device Package: 12-HVSON (3x3)
Voltage - Supply, Battery: 1.55V ~ 3.6V
Current - Timekeeping (Max): 1mA @ 3.3V
на замовлення 3038 шт:
термін постачання 21-31 дні (днів)
4+104.25 грн
10+73.26 грн
25+66.40 грн
100+55.26 грн
250+51.90 грн
500+49.88 грн
1000+47.42 грн
2500+45.69 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
LPC11E68JBD48K LPC11E68JBD48K NXP USA Inc. LPC11E6X.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 1244 шт:
термін постачання 21-31 дні (днів)
1+491.81 грн
10+364.16 грн
25+336.76 грн
80+291.60 грн
250+274.29 грн
500+266.16 грн
1000+255.22 грн
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NMH1000T1 NXP USA Inc. NMH1000.pdf Description: IC MAG SWITCH SENSOR
Packaging: Tape & Reel (TR)
Features: Sleep Mode
Package / Case: 6-VFDFN
Output Type: I2C
Polarization: North Pole
Mounting Type: Surface Mount
Function: Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Technology: Hall Effect
Current - Supply (Max): 650µA
Supplier Device Package: 6-VSON (1.4x1.4)
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NMH1000T1 NXP USA Inc. NMH1000.pdf Description: IC MAG SWITCH SENSOR
Packaging: Cut Tape (CT)
Features: Sleep Mode
Package / Case: 6-VFDFN
Output Type: I2C
Polarization: North Pole
Mounting Type: Surface Mount
Function: Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Technology: Hall Effect
Current - Supply (Max): 650µA
Supplier Device Package: 6-VSON (1.4x1.4)
на замовлення 1946 шт:
термін постачання 21-31 дні (днів)
3+134.49 грн
10+100.31 грн
25+83.59 грн
50+76.69 грн
100+69.72 грн
500+61.01 грн
1000+53.15 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
MR-CANHUBK344 MR-CANHUBK344 NXP USA Inc. MR-CANHUBK344.pdf Description: EVAL BOARD FOR S32K344
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S32K344
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
Contents: Board(s), Cable(s), Accessories
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+14370.73 грн
В кошику  од. на суму  грн.
HEF4075BT,653 HEF4075BT,653 NXP USA Inc. HEF4075B.pdf Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 4 µA
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HEF4075BT,652 HEF4075BT,652 NXP USA Inc. HEF4075B.pdf Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 4 µA
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MCF53016CMJ240J MCF53016CMJ240J NXP USA Inc. MCF53010-17.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 869 шт:
термін постачання 21-31 дні (днів)
52+779.89 грн
Мінімальне замовлення: 52
В кошику  од. на суму  грн.
MCF53011CQT240 MCF53011CQT240 NXP USA Inc. MCF53010-17.pdf Description: IC MCU 32BIT ROMLESS 208TQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 61
DigiKey Programmable: Not Verified
на замовлення 2232 шт:
термін постачання 21-31 дні (днів)
43+928.71 грн
Мінімальне замовлення: 43
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KITPF5300SKTEVM NXP USA Inc. KITPF5300SKTEVM-UG.pdf Description: EVAL PF5300
Packaging: Box
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 15A
Contents: Board(s)
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MPF5302AMBA0ES
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
1+14008.64 грн
В кошику  од. на суму  грн.
S9S12XS128J1VAAR S9S12XS128J1VAAR NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MIMX8UD5DVK08SC MIMX8UD5DVK08SC NXP USA Inc. IMX8ULPCEC.pdf Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 512-VFBGA (9.4x9.4)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
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MIMX8UD7DVK08SC MIMX8UD7DVK08SC NXP USA Inc. IMX8ULPCEC.pdf Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 512-VFBGA (9.4x9.4)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
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MIMX8UD5DVP08SC MIMX8UD5DVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 485-LFBGA (15x15)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
на замовлення 620 шт:
термін постачання 21-31 дні (днів)
1+1412.56 грн
10+1084.21 грн
25+1015.24 грн
100+881.65 грн
250+847.76 грн
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MIMX8UX5FVOFZAC MIMX8UX5FVOFZAC NXP USA Inc. Description: I.MX 8DUALX 17X17
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
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MIMX8DX1FVOFZAC MIMX8DX1FVOFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8DUALXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
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MIMX8UX6FVOFZAC MIMX8UX6FVOFZAC NXP USA Inc. Description: I.MX 8DUALX 17X17
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
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MIMX8DX2FVOFZAC MIMX8DX2FVOFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8DUALXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
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MIMX8QX1FVOFZAC MIMX8QX1FVOFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8QUADXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
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MIMX8DX5AVLFZACR MIMX8DX5AVLFZACR NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8DUALXPLUS
Packaging: Tape & Reel (TR)
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8QX2FVOFZAC MIMX8QX2FVOFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8QUADXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
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MIMX8DX1FVLFZAC MIMX8DX1FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8DX5GVLFZAC MIMX8DX5GVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8DX6GVLFZAC MIMX8DX6GVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8DX2FVLFZAC MIMX8DX2FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8QX5GVLFZAC MIMX8QX5GVLFZAC NXP USA Inc. Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8DX5FVLFZAC MIMX8DX5FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8UX5FVLFZAC MIMX8UX5FVLFZAC NXP USA Inc. Description: I.MX8 QXP 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8QX1FVLFZAC MIMX8QX1FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
товару немає в наявності
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MIMX8QX6GVLFZAC NXP USA Inc. Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
товару немає в наявності
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MIMX8DX6FVLFZAC MIMX8DX6FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
товару немає в наявності
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MIMX8UX6FVLFZAC NXP USA Inc. Description: I.MX8 QXP 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
товару немає в наявності
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MIMX8QX2FVLFZAC MIMX8QX2FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
товару немає в наявності
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MIMX8QX5FVLFZAC MIMX8QX5FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8QX6FVLFZAC MIMX8QX6FVLFZAC NXP USA Inc. Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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A7102CGHN1/T0B0AEL A7102CGHN1/T0B0AEL NXP USA Inc. Description: AU10TICS
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
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MC908GR16CFAE MC908GR16CFAE NXP USA Inc. MC68HC908GR16.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
на замовлення 1108 шт:
термін постачання 21-31 дні (днів)
1+1044.10 грн
10+797.45 грн
25+745.55 грн
100+646.20 грн
250+643.63 грн
В кошику  од. на суму  грн.
PDTC114TMB315 PDTC114TMB315 NXP USA Inc. PDTC114TMB.pdf Description: TRANS PREBIAS
Packaging: Bulk
на замовлення 110000 шт:
термін постачання 21-31 дні (днів)
11225+2.18 грн
Мінімальне замовлення: 11225
В кошику  од. на суму  грн.
MC56F82748VLHR MC56F82748VLHR NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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MC56F82748VLHR MC56F82748VLHR NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 1450 шт:
термін постачання 21-31 дні (днів)
1+693.15 грн
10+519.42 грн
25+482.30 грн
100+414.37 грн
250+396.13 грн
500+385.14 грн
В кошику  од. на суму  грн.
S9S12G48BVLCR S9S12G48BVLCR NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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MKE17Z128VLL7 KE1xZP100M72SF1.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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MKE13Z128VLL7 KE1xZP100M72SF1.pdf
MKE13Z128VLL7
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+440.08 грн
10+324.62 грн
25+299.88 грн
80+259.30 грн
230+244.60 грн
450+237.29 грн
В кошику  од. на суму  грн.
MKE13Z256VLH7 KE1xZP100M72SF1.pdf
MKE13Z256VLH7
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+478.28 грн
10+353.20 грн
25+326.52 грн
80+282.64 грн
230+266.81 грн
800+241.81 грн
В кошику  од. на суму  грн.
MKE12Z256VLL7 KE1xZP100M72SF1.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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MKE13Z256VLL7 KE1xZP100M72SF1.pdf
MKE13Z256VLL7
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+577.76 грн
10+436.96 грн
80+361.77 грн
В кошику  од. на суму  грн.
MKW37A512VFT4R MKW39A512.pdf
MKW37A512VFT4R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
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MKW39A512VFT4R
Виробник: NXP USA Inc.
Description: 32-BIT BLUETOOTH 5.0 LONG-RANGE
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
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MKW38A512VFT4R MKW39A512.pdf
MKW38A512VFT4R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
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SVF532R2K1CMK4R VYBRIDRSERIESEC.pdf
SVF532R2K1CMK4R
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Cut Tape (CT)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
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PCF8562TT/2,518 PCF8562.pdf
PCF8562TT/2,518
Виробник: NXP USA Inc.
Description: UNIVERSAL LCD DRIVER FOR LOW MUL
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 32 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 6 Characters, 8 Characters, 128 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2693 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+178.26 грн
10+127.67 грн
25+116.64 грн
100+98.04 грн
250+92.60 грн
500+89.31 грн
1000+85.20 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
RDDRONE-IOT hdib
Виробник: NXP USA Inc.
Description: RAPID-IOT TO DRONE INTERFACE BOA
Packaging: Bulk
Configuration: Quadcopter Components
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UCANS32K146-01
Виробник: NXP USA Inc.
Description: UCANS32K146 BOARD FOR DRONES, RO
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: S32K146
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RDDRONE-FMUK66L getting-started
Виробник: NXP USA Inc.
Description: PX4 ROBOTIC DRONE FMU (RDDRONE-F
Packaging: Bulk
Configuration: Quadcopter Components
товару немає в наявності
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SPC5668GF1AVMG MPC5668x.pdf
SPC5668GF1AVMG
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 592K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
DigiKey Programmable: Not Verified
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T1014NXN7MQA T1024FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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MC9328MX21DVK MC9328MX21.pdf
MC9328MX21DVK
Виробник: NXP USA Inc.
Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
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ASK-RYLT1043-25K
Виробник: NXP USA Inc.
Description: ROYALTY PREPAYMENT 25K UNITS - L
Packaging: Bulk
Type: License
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S32K324EHT1MPBST S32K3xx.pdf
S32K324EHT1MPBST
Виробник: NXP USA Inc.
Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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PCF85053ATKJ PCF85053A.pdf
PCF85053ATKJ
Виробник: NXP USA Inc.
Description: IC CPU RTC I2C SOT2413-1
Packaging: Tape & Reel (TR)
Features: Alarm, Daylight Savings, Leap Year, SRAM
Package / Case: 12-VFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128B
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD
Supplier Device Package: 12-HVSON (3x3)
Voltage - Supply, Battery: 1.55V ~ 3.6V
Current - Timekeeping (Max): 1mA @ 3.3V
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PCF85053ATKJ PCF85053A.pdf
PCF85053ATKJ
Виробник: NXP USA Inc.
Description: IC CPU RTC I2C SOT2413-1
Packaging: Cut Tape (CT)
Features: Alarm, Daylight Savings, Leap Year, SRAM
Package / Case: 12-VFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128B
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD
Supplier Device Package: 12-HVSON (3x3)
Voltage - Supply, Battery: 1.55V ~ 3.6V
Current - Timekeeping (Max): 1mA @ 3.3V
на замовлення 3038 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+104.25 грн
10+73.26 грн
25+66.40 грн
100+55.26 грн
250+51.90 грн
500+49.88 грн
1000+47.42 грн
2500+45.69 грн
Мінімальне замовлення: 4
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LPC11E68JBD48K LPC11E6X.pdf
LPC11E68JBD48K
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 1244 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+491.81 грн
10+364.16 грн
25+336.76 грн
80+291.60 грн
250+274.29 грн
500+266.16 грн
1000+255.22 грн
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NMH1000T1 NMH1000.pdf
Виробник: NXP USA Inc.
Description: IC MAG SWITCH SENSOR
Packaging: Tape & Reel (TR)
Features: Sleep Mode
Package / Case: 6-VFDFN
Output Type: I2C
Polarization: North Pole
Mounting Type: Surface Mount
Function: Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Technology: Hall Effect
Current - Supply (Max): 650µA
Supplier Device Package: 6-VSON (1.4x1.4)
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NMH1000T1 NMH1000.pdf
Виробник: NXP USA Inc.
Description: IC MAG SWITCH SENSOR
Packaging: Cut Tape (CT)
Features: Sleep Mode
Package / Case: 6-VFDFN
Output Type: I2C
Polarization: North Pole
Mounting Type: Surface Mount
Function: Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Technology: Hall Effect
Current - Supply (Max): 650µA
Supplier Device Package: 6-VSON (1.4x1.4)
на замовлення 1946 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+134.49 грн
10+100.31 грн
25+83.59 грн
50+76.69 грн
100+69.72 грн
500+61.01 грн
1000+53.15 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
MR-CANHUBK344 MR-CANHUBK344.pdf
MR-CANHUBK344
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR S32K344
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S32K344
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
Contents: Board(s), Cable(s), Accessories
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+14370.73 грн
В кошику  од. на суму  грн.
HEF4075BT,653 HEF4075B.pdf
HEF4075BT,653
Виробник: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 4 µA
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HEF4075BT,652 HEF4075B.pdf
HEF4075BT,652
Виробник: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 4 µA
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MCF53016CMJ240J MCF53010-17.pdf
MCF53016CMJ240J
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 869 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
52+779.89 грн
Мінімальне замовлення: 52
В кошику  од. на суму  грн.
MCF53011CQT240 MCF53010-17.pdf
MCF53011CQT240
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208TQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 61
DigiKey Programmable: Not Verified
на замовлення 2232 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
43+928.71 грн
Мінімальне замовлення: 43
В кошику  од. на суму  грн.
KITPF5300SKTEVM KITPF5300SKTEVM-UG.pdf
Виробник: NXP USA Inc.
Description: EVAL PF5300
Packaging: Box
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 15A
Contents: Board(s)
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MPF5302AMBA0ES
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+14008.64 грн
В кошику  од. на суму  грн.
S9S12XS128J1VAAR MC9S12XS256RMV1.pdf
S9S12XS128J1VAAR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MIMX8UD5DVK08SC IMX8ULPCEC.pdf
MIMX8UD5DVK08SC
Виробник: NXP USA Inc.
Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 512-VFBGA (9.4x9.4)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
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MIMX8UD7DVK08SC IMX8ULPCEC.pdf
MIMX8UD7DVK08SC
Виробник: NXP USA Inc.
Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 512-VFBGA (9.4x9.4)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
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MIMX8UD5DVP08SC IMX8ULPIEC.pdf
MIMX8UD5DVP08SC
Виробник: NXP USA Inc.
Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 485-LFBGA (15x15)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
на замовлення 620 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1412.56 грн
10+1084.21 грн
25+1015.24 грн
100+881.65 грн
250+847.76 грн
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MIMX8UX5FVOFZAC
MIMX8UX5FVOFZAC
Виробник: NXP USA Inc.
Description: I.MX 8DUALX 17X17
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
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MIMX8DX1FVOFZAC IMX8QXPAEC.pdf
MIMX8DX1FVOFZAC
Виробник: NXP USA Inc.
Description: I.MX 8DUALXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
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MIMX8UX6FVOFZAC
MIMX8UX6FVOFZAC
Виробник: NXP USA Inc.
Description: I.MX 8DUALX 17X17
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
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MIMX8DX2FVOFZAC IMX8QXPAEC.pdf
MIMX8DX2FVOFZAC
Виробник: NXP USA Inc.
Description: I.MX 8DUALXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
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MIMX8QX1FVOFZAC IMX8QXPAEC.pdf
MIMX8QX1FVOFZAC
Виробник: NXP USA Inc.
Description: I.MX 8QUADXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
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MIMX8DX5AVLFZACR IMX8QXPAEC.pdf
MIMX8DX5AVLFZACR
Виробник: NXP USA Inc.
Description: I.MX 8DUALXPLUS
Packaging: Tape & Reel (TR)
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8QX2FVOFZAC IMX8QXPAEC.pdf
MIMX8QX2FVOFZAC
Виробник: NXP USA Inc.
Description: I.MX 8QUADXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
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MIMX8DX1FVLFZAC IMX8QXPAEC.pdf
MIMX8DX1FVLFZAC
Виробник: NXP USA Inc.
Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8DX5GVLFZAC IMX8QXPAEC.pdf
MIMX8DX5GVLFZAC
Виробник: NXP USA Inc.
Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8DX6GVLFZAC IMX8QXPAEC.pdf
MIMX8DX6GVLFZAC
Виробник: NXP USA Inc.
Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8DX2FVLFZAC IMX8QXPAEC.pdf
MIMX8DX2FVLFZAC
Виробник: NXP USA Inc.
Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8QX5GVLFZAC
MIMX8QX5GVLFZAC
Виробник: NXP USA Inc.
Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8DX5FVLFZAC IMX8QXPAEC.pdf
MIMX8DX5FVLFZAC
Виробник: NXP USA Inc.
Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8UX5FVLFZAC
MIMX8UX5FVLFZAC
Виробник: NXP USA Inc.
Description: I.MX8 QXP 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8QX1FVLFZAC IMX8QXPAEC.pdf
MIMX8QX1FVLFZAC
Виробник: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8QX6GVLFZAC
Виробник: NXP USA Inc.
Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
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MIMX8DX6FVLFZAC IMX8QXPAEC.pdf
MIMX8DX6FVLFZAC
Виробник: NXP USA Inc.
Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8UX6FVLFZAC
Виробник: NXP USA Inc.
Description: I.MX8 QXP 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
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MIMX8QX2FVLFZAC IMX8QXPAEC.pdf
MIMX8QX2FVLFZAC
Виробник: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8QX5FVLFZAC IMX8QXPAEC.pdf
MIMX8QX5FVLFZAC
Виробник: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8QX6FVLFZAC
MIMX8QX6FVLFZAC
Виробник: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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A7102CGHN1/T0B0AEL
A7102CGHN1/T0B0AEL
Виробник: NXP USA Inc.
Description: AU10TICS
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
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MC908GR16CFAE MC68HC908GR16.pdf
MC908GR16CFAE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
на замовлення 1108 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1044.10 грн
10+797.45 грн
25+745.55 грн
100+646.20 грн
250+643.63 грн
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PDTC114TMB315 PDTC114TMB.pdf
PDTC114TMB315
Виробник: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
на замовлення 110000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
11225+2.18 грн
Мінімальне замовлення: 11225
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MC56F82748VLHR MC56F827XXDS.pdf
MC56F82748VLHR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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MC56F82748VLHR MC56F827XXDS.pdf
MC56F82748VLHR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 1450 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+693.15 грн
10+519.42 грн
25+482.30 грн
100+414.37 грн
250+396.13 грн
500+385.14 грн
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S9S12G48BVLCR S12G%20Family%20Fact%20Sheet.pdf
S9S12G48BVLCR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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