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74HCT126DB,112 74HCT126DB,112 NXP USA Inc. 74HC%28T%29126.pdf Description: IC BUFF NON-INVERT 5.5V 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-SSOP
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LPC1114FA44/301,52 LPC1114FA44/301,52 NXP USA Inc. LPC1111-14.pdf Description: IC MCU 32BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 38
DigiKey Programmable: Not Verified
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74HC86N,652 74HC86N,652 NXP USA Inc. 74HC_HCT86.pdf Description: IC GATE XOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 20ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74HC73D,653 74HC73D,653 NXP USA Inc. 74HC73.pdf Description: IC FF JK TYPE DOUBLE 1BIT 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC73D,652 74HC73D,652 NXP USA Inc. 74HC73.pdf Description: IC FF JK TYPE DOUBLE 1BIT 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC73PW,118 74HC73PW,118 NXP USA Inc. 74HC73.pdf Description: IC FF JK TYPE DBL 1-BIT 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC73PW,112 74HC73PW,112 NXP USA Inc. 74HC73.pdf Description: IC FF JK TYPE DBL 1-BIT 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC73DB,118 74HC73DB,118 NXP USA Inc. 74HC73.pdf Description: IC FF JK TYPE DBL 1-BIT 14-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC73DB,112 74HC73DB,112 NXP USA Inc. 74HC73.pdf Description: IC FF JK TYPE DBL 1-BIT 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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BTA225-800B,127 NXP USA Inc. BTA225-800B.pdf Description: TRIAC 800V 25A TO220AB
Packaging: Tube
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BTA225-600B,127 NXP USA Inc. BTA225-600B.pdf Description: TRIAC 600V 25A TO220AB
Packaging: Tube
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BTA225-600BT,127 NXP USA Inc. bta225-600bt.pdf Description: TRIAC 600V 25A TO220AB
Packaging: Tube
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BTA225B-800B,118 NXP USA Inc. bta225-800b_0.pdf Description: TRIAC 800V 25A D2PAK
Packaging: Tape & Reel (TR)
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BTA225B-600B,118 NXP USA Inc. bta225-800b_0.pdf Description: TRIAC 600V 25A D2PAK
Packaging: Tape & Reel (TR)
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PESD15VS2UT,215 PESD15VS2UT,215 NXP USA Inc. PESDXS2UT_SERIES.pdf Description: TVS DIODE 15VWM 40VC SOT23
Packaging: Tape & Reel (TR)
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HEF4013BT,653 HEF4013BT,653 NXP USA Inc. HEF4013B.pdf Description: IC D-TYPE POS TRG DUAL 14SOIC
Packaging: Tape & Reel (TR)
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PBSS5540Z,115 PBSS5540Z,115 NXP USA Inc. PBSS5540Z.pdf Description: TRANS PNP 40V 5A SOT223
Packaging: Tape & Reel (TR)
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PBSS4540Z,115 PBSS4540Z,115 NXP USA Inc. PBSS4540Z.pdf Description: TRANS NPN 40V 5A SOT223
Packaging: Tape & Reel (TR)
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74LVC2952APW,112 74LVC2952APW,112 NXP USA Inc. 74LVC2952A.pdf Description: IC TXRX NON-INVERT 3.6V 24-TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 24-TSSOP
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74HC112N,652 74HC112N,652 NXP USA Inc. 74HC_HCT112_Rev_Oct2000.pdf Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
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BAV20,113 BAV20,113 NXP USA Inc. BAV20.pdf Description: DIODE SWITCHING 150V 0.25A ALF2
Packaging: Tape & Reel (TR)
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MCF52230CAF60 MCF52230CAF60 NXP USA Inc. MCF52235.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 73
DigiKey Programmable: Not Verified
на замовлення 7365 шт:
термін постачання 21-31 дні (днів)
15+1423.11 грн
Мінімальне замовлення: 15
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MCF52256CVN66 MCF52256CVN66 NXP USA Inc. MCF52259.pdf Description: IC MCU 32B 256KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)
1+1607.88 грн
10+1237.66 грн
25+1160.05 грн
100+1008.58 грн
250+970.41 грн
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MCF52213CAE50 MCF52213CAE50 NXP USA Inc. MCF52211.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
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MCXA173VFM NXP USA Inc. MCXAFS.pdf Description: MCXA20-256, 32QFN
Packaging: Tray
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MCXA174VFM NXP USA Inc. MCXAFS.pdf Description: MCXA20-256, 32QFN
Packaging: Tray
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MCXA173VLF NXP USA Inc. MCXAFS.pdf Description: MCXA20-256, 48LQFP
Packaging: Tray
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MCXA174VLF NXP USA Inc. MCXAFS.pdf Description: MCXA20-256, 48LQFP
Packaging: Tray
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MCXA173VLH NXP USA Inc. MCXAFS.pdf Description: MCXA20-256, 64LQFP
Packaging: Tray
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MCXA174VLH NXP USA Inc. MCXAFS.pdf Description: MCXA20-256, 64LQFP
Packaging: Tray
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MCXA173VLL NXP USA Inc. MCXAFS.pdf Description: MCXA20-256, 100LQFP
Packaging: Tray
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MCXA174VLL NXP USA Inc. MCXAFS.pdf Description: MCXA20-256, 100LQFP
Packaging: Tray
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MCXA175VLH NXP USA Inc. MCXAFS.pdf Description: IC
Packaging: Tray
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MCXA176VLH NXP USA Inc. MCXAFS.pdf Description: IC
Packaging: Tray
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MCXA175VLL NXP USA Inc. MCXAFS.pdf Description: IC
Packaging: Tray
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MCXA175VLQ NXP USA Inc. MCXAFS.pdf Description: IC
Packaging: Tray
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MCXA176VLQ NXP USA Inc. MCXAFS.pdf Description: IC
Packaging: Tray
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MCXA175VPN NXP USA Inc. MCXAFS.pdf Description: MCXA20 169BGA
Packaging: Tray
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MCXA176VPN NXP USA Inc. MCXAFS.pdf Description: MCXA20 169BGA
Packaging: Tray
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74HCT20D,652 74HCT20D,652 NXP USA Inc. NEXP-S-A0002882020-1.pdf?t.download=true&u=5oefqw Description: IC GATE NAND 2CH 4-INP 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 4
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
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74HCT20DB,112 74HCT20DB,112 NXP USA Inc. NXP_Semiconductors-74HCT20DB-datasheet.pdf Description: IC GATE NAND 2CH 4-INP 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 4
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
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74HC20D,652 74HC20D,652 NXP USA Inc. 74HC20.pdf PHGL-S-A0001367380-1.pdf?t.download=true&u=5oefqw Description: IC GATE NAND 2CH 4-INP 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
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74HC20DB,112 74HC20DB,112 NXP USA Inc. Description: IC GATE NAND 2CH 4-INP 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
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MC33288DH MC33288DH NXP USA Inc. Description: IC SSR FLASHER DUAL HSIDE 20HSOP
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Operating Temperature: -40°C ~ 125°C
Output Configuration: High Side
Rds On (Typ): 20mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 35V
Current - Output (Max): 8A
Supplier Device Package: 20-HSOP
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74HCT1G08GV,125 74HCT1G08GV,125 NXP USA Inc. 74HC_HCT1G08.pdf Description: IC GATE AND 1CH 2-INP 5-TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 2mA, 2mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 27ns @ 4.5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 20 µA
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74HCT1G08GW,165 74HCT1G08GW,165 NXP USA Inc. 74HC_HCT1G08.pdf Description: IC GATE AND 1CH 2-INP 5-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 2mA, 2mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 27ns @ 4.5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 20 µA
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BYC15-600,127 NXP USA Inc. byc15-600.pdf Description: DIODE RECT 600V 15A TO-220AC
Packaging: Tube
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BLF177CR,112 NXP USA Inc. BLF177CR%2C112.pdf Description: TRANSISTOR RF DMOS SOT121B
Packaging: Tray
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BLF177,112 NXP USA Inc. BLF177CR%2C112.pdf Description: TRANSISTOR RF DMOS SOT121B
Packaging: Tray
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74HC10N,652 74HC10N,652 NXP USA Inc. 74HC_HCT10_Rev_Oct2000.pdf Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
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74HC541PW,112 74HC541PW,112 NXP USA Inc. 74HC_HCT541.pdf Description: IC BUFFER NON-INVERT 6V 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-TSSOP
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MCZ33793EFR2 MCZ33793EFR2 NXP USA Inc. MC33793.pdf Description: IC DSI SLAVE FOR R-SENSE 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 250 mA
DigiKey Programmable: Not Verified
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MCZ33793EFR2 MCZ33793EFR2 NXP USA Inc. MC33793.pdf Description: IC DSI SLAVE FOR R-SENSE 16-SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 250 mA
DigiKey Programmable: Not Verified
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BZX84-B3V3,215 BZX84-B3V3,215 NXP USA Inc. BZX84_Series.pdf Description: DIODE ZENER 3.3V 250MW TO236AB
Packaging: Tape & Reel (TR)
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RDK01DB1562 NXP USA Inc. TEA2016AAT.pdf Description: EVAL BOARD TEA1995T TEA2016AAT
Packaging: Box
Voltage - Output: 12V
Current - Output: 20A
Contents: Board(s), Cable(s)
Regulator Topology: Flyback
Utilized IC / Part: TEA1995T, TEA2016AAT
Main Purpose: AC/DC, Primary and Secondary Side with PFC
Outputs and Type: 1 Non-Isolated Output
Power - Output: 240W
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MC9S12HZ256CAL MC9S12HZ256CAL NXP USA Inc. MC9S12HZ256V2.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 85
DigiKey Programmable: Not Verified
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BSH205,215 BSH205,215 NXP USA Inc. BSH205.pdf Description: MOSFET P-CH 12V 750MA TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 750mA (Ta)
Rds On (Max) @ Id, Vgs: 400mOhm @ 430mA, 4.5V
Power Dissipation (Max): 417mW (Ta)
Vgs(th) (Max) @ Id: 680mV @ 1mA (Typ)
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 3.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 200 pF @ 9.6 V
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PEMI8QFN/CE,132 PEMI8QFN/CE,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 7dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 8
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74HC107DB,112 74HC107DB,112 NXP USA Inc. 74HC_HCT107.pdf Description: IC FF JK TYPE DBL 1-BIT 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 85 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC107D,652 74HC107D,652 NXP USA Inc. 74HC_HCT107.pdf Description: IC FF JK TYPE DOUBLE 1BIT 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 85 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HCT126DB,112 74HC%28T%29126.pdf
74HCT126DB,112
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-SSOP
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LPC1114FA44/301,52 LPC1111-14.pdf
LPC1114FA44/301,52
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 38
DigiKey Programmable: Not Verified
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74HC86N,652 74HC_HCT86.pdf
74HC86N,652
Виробник: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 20ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74HC73D,653 74HC73.pdf
74HC73D,653
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC73D,652 74HC73.pdf
74HC73D,652
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC73PW,118 74HC73.pdf
74HC73PW,118
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DBL 1-BIT 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC73PW,112 74HC73.pdf
74HC73PW,112
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DBL 1-BIT 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC73DB,118 74HC73.pdf
74HC73DB,118
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DBL 1-BIT 14-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC73DB,112 74HC73.pdf
74HC73DB,112
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DBL 1-BIT 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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BTA225-800B,127 BTA225-800B.pdf
Виробник: NXP USA Inc.
Description: TRIAC 800V 25A TO220AB
Packaging: Tube
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BTA225-600B,127 BTA225-600B.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 25A TO220AB
Packaging: Tube
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BTA225-600BT,127 bta225-600bt.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 25A TO220AB
Packaging: Tube
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BTA225B-800B,118 bta225-800b_0.pdf
Виробник: NXP USA Inc.
Description: TRIAC 800V 25A D2PAK
Packaging: Tape & Reel (TR)
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BTA225B-600B,118 bta225-800b_0.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 25A D2PAK
Packaging: Tape & Reel (TR)
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PESD15VS2UT,215 PESDXS2UT_SERIES.pdf
PESD15VS2UT,215
Виробник: NXP USA Inc.
Description: TVS DIODE 15VWM 40VC SOT23
Packaging: Tape & Reel (TR)
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HEF4013BT,653 HEF4013B.pdf
HEF4013BT,653
Виробник: NXP USA Inc.
Description: IC D-TYPE POS TRG DUAL 14SOIC
Packaging: Tape & Reel (TR)
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PBSS5540Z,115 PBSS5540Z.pdf
PBSS5540Z,115
Виробник: NXP USA Inc.
Description: TRANS PNP 40V 5A SOT223
Packaging: Tape & Reel (TR)
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PBSS4540Z,115 PBSS4540Z.pdf
PBSS4540Z,115
Виробник: NXP USA Inc.
Description: TRANS NPN 40V 5A SOT223
Packaging: Tape & Reel (TR)
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74LVC2952APW,112 74LVC2952A.pdf
74LVC2952APW,112
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 24-TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 24-TSSOP
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74HC112N,652 74HC_HCT112_Rev_Oct2000.pdf
74HC112N,652
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
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BAV20,113 BAV20.pdf
BAV20,113
Виробник: NXP USA Inc.
Description: DIODE SWITCHING 150V 0.25A ALF2
Packaging: Tape & Reel (TR)
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MCF52230CAF60 MCF52235.pdf
MCF52230CAF60
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 73
DigiKey Programmable: Not Verified
на замовлення 7365 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
15+1423.11 грн
Мінімальне замовлення: 15
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MCF52256CVN66 MCF52259.pdf
MCF52256CVN66
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1607.88 грн
10+1237.66 грн
25+1160.05 грн
100+1008.58 грн
250+970.41 грн
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MCF52213CAE50 MCF52211.pdf
MCF52213CAE50
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
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MCXA173VFM MCXAFS.pdf
Виробник: NXP USA Inc.
Description: MCXA20-256, 32QFN
Packaging: Tray
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MCXA174VFM MCXAFS.pdf
Виробник: NXP USA Inc.
Description: MCXA20-256, 32QFN
Packaging: Tray
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MCXA173VLF MCXAFS.pdf
Виробник: NXP USA Inc.
Description: MCXA20-256, 48LQFP
Packaging: Tray
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MCXA174VLF MCXAFS.pdf
Виробник: NXP USA Inc.
Description: MCXA20-256, 48LQFP
Packaging: Tray
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MCXA173VLH MCXAFS.pdf
Виробник: NXP USA Inc.
Description: MCXA20-256, 64LQFP
Packaging: Tray
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MCXA174VLH MCXAFS.pdf
Виробник: NXP USA Inc.
Description: MCXA20-256, 64LQFP
Packaging: Tray
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MCXA173VLL MCXAFS.pdf
Виробник: NXP USA Inc.
Description: MCXA20-256, 100LQFP
Packaging: Tray
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MCXA174VLL MCXAFS.pdf
Виробник: NXP USA Inc.
Description: MCXA20-256, 100LQFP
Packaging: Tray
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MCXA175VLH MCXAFS.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
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MCXA176VLH MCXAFS.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
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MCXA175VLL MCXAFS.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
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MCXA175VLQ MCXAFS.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
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MCXA176VLQ MCXAFS.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
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MCXA175VPN MCXAFS.pdf
Виробник: NXP USA Inc.
Description: MCXA20 169BGA
Packaging: Tray
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MCXA176VPN MCXAFS.pdf
Виробник: NXP USA Inc.
Description: MCXA20 169BGA
Packaging: Tray
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74HCT20D,652 NEXP-S-A0002882020-1.pdf?t.download=true&u=5oefqw
74HCT20D,652
Виробник: NXP USA Inc.
Description: IC GATE NAND 2CH 4-INP 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 4
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
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74HCT20DB,112 NXP_Semiconductors-74HCT20DB-datasheet.pdf
74HCT20DB,112
Виробник: NXP USA Inc.
Description: IC GATE NAND 2CH 4-INP 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 4
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
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74HC20D,652 74HC20.pdf PHGL-S-A0001367380-1.pdf?t.download=true&u=5oefqw
74HC20D,652
Виробник: NXP USA Inc.
Description: IC GATE NAND 2CH 4-INP 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
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74HC20DB,112
74HC20DB,112
Виробник: NXP USA Inc.
Description: IC GATE NAND 2CH 4-INP 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
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MC33288DH
MC33288DH
Виробник: NXP USA Inc.
Description: IC SSR FLASHER DUAL HSIDE 20HSOP
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Operating Temperature: -40°C ~ 125°C
Output Configuration: High Side
Rds On (Typ): 20mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 35V
Current - Output (Max): 8A
Supplier Device Package: 20-HSOP
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74HCT1G08GV,125 74HC_HCT1G08.pdf
74HCT1G08GV,125
Виробник: NXP USA Inc.
Description: IC GATE AND 1CH 2-INP 5-TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 2mA, 2mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 27ns @ 4.5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 20 µA
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74HCT1G08GW,165 74HC_HCT1G08.pdf
74HCT1G08GW,165
Виробник: NXP USA Inc.
Description: IC GATE AND 1CH 2-INP 5-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 2mA, 2mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 27ns @ 4.5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 20 µA
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BYC15-600,127 byc15-600.pdf
Виробник: NXP USA Inc.
Description: DIODE RECT 600V 15A TO-220AC
Packaging: Tube
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BLF177CR,112 BLF177CR%2C112.pdf
Виробник: NXP USA Inc.
Description: TRANSISTOR RF DMOS SOT121B
Packaging: Tray
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BLF177,112 BLF177CR%2C112.pdf
Виробник: NXP USA Inc.
Description: TRANSISTOR RF DMOS SOT121B
Packaging: Tray
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74HC10N,652 74HC_HCT10_Rev_Oct2000.pdf
74HC10N,652
Виробник: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
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74HC541PW,112 74HC_HCT541.pdf
74HC541PW,112
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-TSSOP
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MCZ33793EFR2 MC33793.pdf
MCZ33793EFR2
Виробник: NXP USA Inc.
Description: IC DSI SLAVE FOR R-SENSE 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 250 mA
DigiKey Programmable: Not Verified
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MCZ33793EFR2 MC33793.pdf
MCZ33793EFR2
Виробник: NXP USA Inc.
Description: IC DSI SLAVE FOR R-SENSE 16-SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 250 mA
DigiKey Programmable: Not Verified
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BZX84-B3V3,215 BZX84_Series.pdf
BZX84-B3V3,215
Виробник: NXP USA Inc.
Description: DIODE ZENER 3.3V 250MW TO236AB
Packaging: Tape & Reel (TR)
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RDK01DB1562 TEA2016AAT.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD TEA1995T TEA2016AAT
Packaging: Box
Voltage - Output: 12V
Current - Output: 20A
Contents: Board(s), Cable(s)
Regulator Topology: Flyback
Utilized IC / Part: TEA1995T, TEA2016AAT
Main Purpose: AC/DC, Primary and Secondary Side with PFC
Outputs and Type: 1 Non-Isolated Output
Power - Output: 240W
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MC9S12HZ256CAL MC9S12HZ256V2.pdf
MC9S12HZ256CAL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 85
DigiKey Programmable: Not Verified
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BSH205,215 BSH205.pdf
BSH205,215
Виробник: NXP USA Inc.
Description: MOSFET P-CH 12V 750MA TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 750mA (Ta)
Rds On (Max) @ Id, Vgs: 400mOhm @ 430mA, 4.5V
Power Dissipation (Max): 417mW (Ta)
Vgs(th) (Max) @ Id: 680mV @ 1mA (Typ)
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 3.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 200 pF @ 9.6 V
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PEMI8QFN/CE,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/CE,132
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 20 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 7dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 8
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74HC107DB,112 74HC_HCT107.pdf
74HC107DB,112
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DBL 1-BIT 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 85 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC107D,652 74HC_HCT107.pdf
74HC107D,652
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 85 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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