Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (37086) > Сторінка 486 з 619

Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA
Packaging: Tray
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)

Виробник: NXP USA Inc.
Description: IC AMP GENERAL PURPOSE DBS9MPF
Packaging: Tube
Package / Case: 9-SIP Exposed Tab, Formed Leads
Mounting Type: Through Hole
Applications: Standard (General Purpose)
Slew Rate: 3000V/µs
Supplier Device Package: DBS9MPF
Number of Circuits: 1
Current - Supply: 9 mA
Current - Output / Channel: 10 A
-3db Bandwidth: 16 MHz

Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)

Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)

Виробник: NXP USA Inc.
Description: PF8200
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)

Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 65V OM1230-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Voltage - Test: 65 V

Виробник: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Power Dissipation (Max): 164W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 59 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3735 pF @ 12 V

Виробник: NXP USA Inc.
Description: ACCESSORY BOARD:MIPI CAMERA CARD
Packaging: Box
For Use With/Related Products: AP1302, AR0144
Accessory Type: Adapter Board
Utilized IC / Part: AP1302, AR0144

Виробник: NXP USA Inc.
Description: IC AMP W-CDMA 1.8-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 34dB
Current - Supply: 520mA
P1dB: 16.5dBm
Test Frequency: 1.8GHz
Supplier Device Package: TO-270WB-15

Виробник: NXP USA Inc.
Description: IC AMP W-CDMA 1.8-2.2GHZ TO270WB
Packaging: Cut Tape (CT)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 34dB
Current - Supply: 520mA
P1dB: 16.5dBm
Test Frequency: 1.8GHz
Supplier Device Package: TO-270WB-15

Виробник: NXP USA Inc.
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB
Current - Supply: 5mA
Noise Figure: 0.7dB
P1dB: -5dBm
Test Frequency: 1.843GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)

Виробник: NXP USA Inc.
Description: S32K344 PHANTOM, 257MAPBGA, PROD
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: S32K344 PHANTOM, 257MAPBGA, PROD
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: LOCKSTEP CORE M7, 160MHZ, 4M FLA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: S32K3X4EVBQ172NE
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344

Виробник: NXP USA Inc.
Description: S32K3X4EVBQ172ND
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344

Виробник: NXP USA Inc.
Description: S32K3X4EVBQ172NS
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344

Виробник: NXP USA Inc.
Description: S32K3X4EVB-Q257 FULL-FEATURED EV
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344

Виробник: NXP USA Inc.
Description: RD-K344BMU
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: S32K344
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit

Виробник: NXP USA Inc.
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: IC MPU MPC6XX 266MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No

Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AVCH2T45GS - BUS
Packaging: Bulk

Виробник: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHARGE SO10
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Function: Controller
Interface: USB
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 10-SO
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2

Виробник: NXP USA Inc.
Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Supplier Device Package: 512-VFBGA (9.4x9.4)

Виробник: NXP USA Inc.
Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 485-LFBGA (15x15)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M33
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 1000W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA

Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 1000W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA

Виробник: NXP USA Inc.
Description: MRFE6VP5600 REF BOARD - 225
Packaging: Bulk

Виробник: NXP USA Inc.
Description: SENSOR PTC 603OHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 300°C
Supplier Device Package: DO-34
Resistance @ 25°C: 603 Ohms

Виробник: NXP USA Inc.
Description: NJJ29C2A9HN5
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: S12Z CPU, 6128K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34