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MFS2633AMDA0AD NXP USA Inc. Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Applications: System Basis Chip
Current - Supply: 29µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1700 шт:
термін постачання 21-31 дні (днів)
1+639.26 грн
10+478.60 грн
25+444.35 грн
100+381.66 грн
250+364.81 грн
500+354.66 грн
1000+340.63 грн
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MF3D2300DA4/00J NXP USA Inc. MF3D_H_X3_SDS.pdf Description: MF3D2300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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MF3D8300DA4/00J NXP USA Inc. Description: MF3D8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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MFRC63103HNY MFRC63103HNY NXP USA Inc. SLRC610.pdf Description: CL READER IC'S
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
For Use With/Related Products: MFRC631
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplied Contents: Board(s)
Supplier Device Package: 32-HVQFN (5x5)
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MFRC63103HNY MFRC63103HNY NXP USA Inc. SLRC610.pdf Description: CL READER IC'S
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
For Use With/Related Products: MFRC631
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplied Contents: Board(s)
Supplier Device Package: 32-HVQFN (5x5)
на замовлення 4305 шт:
термін постачання 21-31 дні (днів)
1+556.98 грн
10+414.22 грн
25+383.73 грн
100+328.71 грн
250+313.73 грн
500+304.71 грн
1000+294.65 грн
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MFS2633AMVA0AD NXP USA Inc. Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
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MF0UL2101DUD,005 NXP USA Inc. MF0ULX1.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
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MF0ICU2001DUD,005 NXP USA Inc. MF0ICU2.pdf Description: MIFARE ULTRALIGHT SGL FCC
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: 25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
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MF0ICU2101DUD,005 NXP USA Inc. MF0ICU2.pdf Description: MIFARE ULTRALIGHT SGL FCC
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
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MF0ICU2001DUF,005 NXP USA Inc. MF0ICU2.pdf Description: MIFARE ULTRALIGHT C - CONTACTLES
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
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MF0AESH2001DUFZ NXP USA Inc. MF0AES(H)20.pdf Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
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MF0AES2001DUFZ NXP USA Inc. MF0AES(H)20.pdf Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
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MF0AESH2001DUDZ NXP USA Inc. MF0AES(H)20.pdf Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
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MF0AES2001DUDZ NXP USA Inc. MF0AES(H)20.pdf Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
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MF0AES2000DA8J MF0AES2000DA8J NXP USA Inc. MF0AES(H)20.pdf Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
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MF0AESH2000DA8J NXP USA Inc. MF0AES(H)20.pdf Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
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RDW8987E-R0 NXP USA Inc. Description: RDW8987E-R0
Packaging: Bulk
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P87C54SBAA512 NXP USA Inc. Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC
Number of I/O: 32
DigiKey Programmable: Not Verified
на замовлення 659 шт:
термін постачання 21-31 дні (днів)
63+635.30 грн
Мінімальне замовлення: 63
В кошику  од. на суму  грн.
S912XES384J3MAA S912XES384J3MAA NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
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MC9S12C96VPBE MC9S12C96VPBE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 96KB FLASH 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 52-TQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
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S912XDG256F1MAAR S912XDG256F1MAAR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MPC8378ECVRALGA MPC8378ECVRALGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
1+8152.93 грн
10+6598.85 грн
В кошику  од. на суму  грн.
MPC8378EVRAJFA NXP USA Inc. FSCLS06715-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCH SOC
Packaging: Bulk
на замовлення 161 шт:
термін постачання 21-31 дні (днів)
4+6349.08 грн
Мінімальне замовлення: 4
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SPC5605BF1VLQ6R SPC5605BF1VLQ6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5605BF1MLQ6 SPC5605BF1MLQ6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5605BF1MLQ6R SPC5605BF1MLQ6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5607BF1VLQ6R SPC5607BF1VLQ6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5607BK0MLQ6 SPC5607BK0MLQ6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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MPC8533VTAQGA557 NXP USA Inc. FSCL-S-A0001172477-1.pdf?t.download=true&u=5oefqw Description: RISC MICROPROCESSOR, CMOS
Packaging: Bulk
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74LVTH125PW,112 74LVTH125PW,112 NXP USA Inc. PHGL-S-A0002129526-1.pdf?t.download=true&u=5oefqw Description: IC BUFF NON-INVERT 3.6V 14TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Supplier Device Package: 14-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 1
Voltage - Supply: 2.7V ~ 3.6V
на замовлення 9588 шт:
термін постачання 21-31 дні (днів)
1850+11.98 грн
Мінімальне замовлення: 1850
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MPC859TZP133A MPC859TZP133A NXP USA Inc. MPC866%2C859_Man.pdf Description: IC MPU MPC8XX 133MHZ 357BGA
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 133MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 44 шт:
термін постачання 21-31 дні (днів)
4+4929.34 грн
Мінімальне замовлення: 4
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MPC866TZP133A MPC866TZP133A NXP USA Inc. MPC866%2C859_Man.pdf Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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LFTAK48GS1A NXP USA Inc. Description: MPC57XX 256 PIN 1.0MM PGA TARGET
Packaging: Bulk
For Use With/Related Products: MPC57xx
Module/Board Type: Socket Module - PGA
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MCIMX6L2DVN10AB MCIMX6L2DVN10AB NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
на замовлення 2984 шт:
термін постачання 21-31 дні (днів)
1+1817.30 грн
10+1408.07 грн
25+1322.65 грн
160+1130.32 грн
320+1101.64 грн
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SAF4000EL/101Z23AY NXP USA Inc. Description: SAF4000EL
Packaging: Tape & Reel (TR)
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SAF4000EL/101Z23AK NXP USA Inc. Description: SAF4000EL
Packaging: Tray
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SL3S1215FUD2/HAPBZ NXP USA Inc. SL3S1205_15.pdf Description: SL3S1215FUD2/HAPBZ
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
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SL3S1215FUD/HAZ NXP USA Inc. Description: IC RFID TRANSP 840-960MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
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MPC885CVR66557 NXP USA Inc. MPC885EC.pdf Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
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MPC855TCVR66D4557 NXP USA Inc. Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
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MPC880CVR66-NXP NXP USA Inc. FSCLS05303-1.pdf?t.download=true&u=5oefqw Description: IC MPU 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
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MPC859DSLVR66A-NXP MPC859DSLVR66A-NXP NXP USA Inc. FSCLS02244-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 44 шт:
термін постачання 21-31 дні (днів)
7+3272.48 грн
Мінімальне замовлення: 7
В кошику  од. на суму  грн.
MPC860PVR66D4-NXP MPC860PVR66D4-NXP NXP USA Inc. FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 2556 шт:
термін постачання 21-31 дні (днів)
2+17099.01 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MPC855TCVR66D4 MPC855TCVR66D4 NXP USA Inc. FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
на замовлення 1748 шт:
термін постачання 21-31 дні (днів)
3+10514.03 грн
Мінімальне замовлення: 3
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MPC853TVR66A MPC853TVR66A NXP USA Inc. MPC853TEC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, TDM, UART
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MPC855TCVR66D4 MPC855TCVR66D4 NXP USA Inc. MPC855TTS.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MPC855TVR66D4 MPC855TVR66D4 NXP USA Inc. MPC855TTS.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MPC857TCVR66B MPC857TCVR66B NXP USA Inc. MPC862EC%2C857%28T%2CDSL%29.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 115°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MC33972APEKR2 NXP USA Inc. MC33972.pdf Description: SWITCH DETECTION INTERFACE, 22-S
Grade: Automotive
Supplier Device Package: 32-SSOP-EP
Applications: Multiple Switch Detection
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
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MC33972APEWR2 NXP USA Inc. MC33972.pdf Description: SWITCH DETECTION INTERFACE, 22-S
Grade: Automotive
Supplier Device Package: 32-SOIC
Applications: Multiple Switch Detection
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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MC33972APEW NXP USA Inc. MC33972.pdf Description: SWITCH DETECTION INTERFACE, 22-S
Grade: Automotive
Supplier Device Package: 32-SOIC
Applications: Multiple Switch Detection
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
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MC33972APEK NXP USA Inc. MC33972.pdf Description: SWITCH DETECTION INTERFACE, 22-S
Grade: Automotive
Supplier Device Package: 32-SSOP-EP
Applications: Multiple Switch Detection
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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MC07XSG517DEKR2 MC07XSG517DEKR2 NXP USA Inc. MC32XSG.pdf Description: HIGH-SIDE SWITCH, 32V, TRIPLE 7M
Voltage - Load: 7V ~ 30V
Input Type: Non-Inverting
Rds On (Typ): 7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 54-HSOP
Ratio - Input:Output: 2:3
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
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MC07XSG517DEK NXP USA Inc. Description: HIGH-SIDE SWITCH, 32V, TRIPLE 7M
Rds On (Typ): 7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Status Flag
Packaging: Tube
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 54-HSOP
Ratio - Input:Output: 2:3
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 30V
Input Type: Non-Inverting
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TJA1057ATK/3/0Z TJA1057ATK/3/0Z NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Duplex: Half
Receiver Hysteresis: 300 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: CANbus
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
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TJA1057ATK/0Z TJA1057ATK/0Z NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Duplex: Half
Receiver Hysteresis: 300 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: CANbus
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
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TJA1057AT/3/0Z TJA1057AT/3/0Z NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1057AT/0Z TJA1057AT/0Z NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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SPC5744PFK1AMMM8 SPC5744PFK1AMMM8 NXP USA Inc. MPC5744P.pdf Description: IC MCU 32B 2.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
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MFS8622BMBA0ESR2 NXP USA Inc. Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
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MFS2633AMDA0AD
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Applications: System Basis Chip
Current - Supply: 29µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1700 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+639.26 грн
10+478.60 грн
25+444.35 грн
100+381.66 грн
250+364.81 грн
500+354.66 грн
1000+340.63 грн
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MF3D2300DA4/00J MF3D_H_X3_SDS.pdf
Виробник: NXP USA Inc.
Description: MF3D2300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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MF3D8300DA4/00J
Виробник: NXP USA Inc.
Description: MF3D8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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MFRC63103HNY SLRC610.pdf
MFRC63103HNY
Виробник: NXP USA Inc.
Description: CL READER IC'S
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
For Use With/Related Products: MFRC631
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplied Contents: Board(s)
Supplier Device Package: 32-HVQFN (5x5)
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MFRC63103HNY SLRC610.pdf
MFRC63103HNY
Виробник: NXP USA Inc.
Description: CL READER IC'S
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
For Use With/Related Products: MFRC631
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplied Contents: Board(s)
Supplier Device Package: 32-HVQFN (5x5)
на замовлення 4305 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+556.98 грн
10+414.22 грн
25+383.73 грн
100+328.71 грн
250+313.73 грн
500+304.71 грн
1000+294.65 грн
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MFS2633AMVA0AD
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
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MF0UL2101DUD,005 MF0ULX1.pdf
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
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MF0ICU2001DUD,005 MF0ICU2.pdf
Виробник: NXP USA Inc.
Description: MIFARE ULTRALIGHT SGL FCC
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: 25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
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MF0ICU2101DUD,005 MF0ICU2.pdf
Виробник: NXP USA Inc.
Description: MIFARE ULTRALIGHT SGL FCC
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
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MF0ICU2001DUF,005 MF0ICU2.pdf
Виробник: NXP USA Inc.
Description: MIFARE ULTRALIGHT C - CONTACTLES
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
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MF0AESH2001DUFZ MF0AES(H)20.pdf
Виробник: NXP USA Inc.
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
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MF0AES2001DUFZ MF0AES(H)20.pdf
Виробник: NXP USA Inc.
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
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MF0AESH2001DUDZ MF0AES(H)20.pdf
Виробник: NXP USA Inc.
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
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MF0AES2001DUDZ MF0AES(H)20.pdf
Виробник: NXP USA Inc.
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
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MF0AES2000DA8J MF0AES(H)20.pdf
MF0AES2000DA8J
Виробник: NXP USA Inc.
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
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MF0AESH2000DA8J MF0AES(H)20.pdf
Виробник: NXP USA Inc.
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
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RDW8987E-R0
Виробник: NXP USA Inc.
Description: RDW8987E-R0
Packaging: Bulk
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P87C54SBAA512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC
Number of I/O: 32
DigiKey Programmable: Not Verified
на замовлення 659 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
63+635.30 грн
Мінімальне замовлення: 63
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S912XES384J3MAA
S912XES384J3MAA
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
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MC9S12C96VPBE MC9S12C128V1.pdf
MC9S12C96VPBE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 52-TQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
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S912XDG256F1MAAR
S912XDG256F1MAAR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MPC8378ECVRALGA MPC837XFFS.pdf
MPC8378ECVRALGA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+8152.93 грн
10+6598.85 грн
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MPC8378EVRAJFA FSCLS06715-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCH SOC
Packaging: Bulk
на замовлення 161 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+6349.08 грн
Мінімальне замовлення: 4
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SPC5605BF1VLQ6R MPC560XBFAMFS.pdf
SPC5605BF1VLQ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5605BF1MLQ6 MPC560XBFAMFS.pdf
SPC5605BF1MLQ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5605BF1MLQ6R MPC560XBFAMFS.pdf
SPC5605BF1MLQ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5607BF1VLQ6R MPC560XBFAMFS.pdf
SPC5607BF1VLQ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5607BK0MLQ6 MPC560XBFAMFS.pdf
SPC5607BK0MLQ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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MPC8533VTAQGA557 FSCL-S-A0001172477-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: RISC MICROPROCESSOR, CMOS
Packaging: Bulk
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74LVTH125PW,112 PHGL-S-A0002129526-1.pdf?t.download=true&u=5oefqw
74LVTH125PW,112
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 14TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Supplier Device Package: 14-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 1
Voltage - Supply: 2.7V ~ 3.6V
на замовлення 9588 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1850+11.98 грн
Мінімальне замовлення: 1850
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MPC859TZP133A MPC866%2C859_Man.pdf
MPC859TZP133A
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 133MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 44 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+4929.34 грн
Мінімальне замовлення: 4
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MPC866TZP133A MPC866%2C859_Man.pdf
MPC866TZP133A
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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LFTAK48GS1A
Виробник: NXP USA Inc.
Description: MPC57XX 256 PIN 1.0MM PGA TARGET
Packaging: Bulk
For Use With/Related Products: MPC57xx
Module/Board Type: Socket Module - PGA
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MCIMX6L2DVN10AB IMX6SLCEC.pdf
MCIMX6L2DVN10AB
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
на замовлення 2984 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1817.30 грн
10+1408.07 грн
25+1322.65 грн
160+1130.32 грн
320+1101.64 грн
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SAF4000EL/101Z23AY
Виробник: NXP USA Inc.
Description: SAF4000EL
Packaging: Tape & Reel (TR)
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SAF4000EL/101Z23AK
Виробник: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
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SL3S1215FUD2/HAPBZ SL3S1205_15.pdf
Виробник: NXP USA Inc.
Description: SL3S1215FUD2/HAPBZ
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
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SL3S1215FUD/HAZ
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 840-960MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
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MPC885CVR66557 MPC885EC.pdf
Виробник: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
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MPC855TCVR66D4557
Виробник: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
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MPC880CVR66-NXP FSCLS05303-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: IC MPU 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
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MPC859DSLVR66A-NXP FSCLS02244-1.pdf?t.download=true&u=5oefqw
MPC859DSLVR66A-NXP
Виробник: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 44 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
7+3272.48 грн
Мінімальне замовлення: 7
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MPC860PVR66D4-NXP FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
MPC860PVR66D4-NXP
Виробник: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 2556 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+17099.01 грн
Мінімальне замовлення: 2
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MPC855TCVR66D4 FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
MPC855TCVR66D4
Виробник: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
на замовлення 1748 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+10514.03 грн
Мінімальне замовлення: 3
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MPC853TVR66A MPC853TEC.pdf
MPC853TVR66A
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, TDM, UART
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MPC855TCVR66D4 MPC855TTS.pdf
MPC855TCVR66D4
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MPC855TVR66D4 MPC855TTS.pdf
MPC855TVR66D4
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MPC857TCVR66B MPC862EC%2C857%28T%2CDSL%29.pdf
MPC857TCVR66B
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 115°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MC33972APEKR2 MC33972.pdf
Виробник: NXP USA Inc.
Description: SWITCH DETECTION INTERFACE, 22-S
Grade: Automotive
Supplier Device Package: 32-SSOP-EP
Applications: Multiple Switch Detection
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
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MC33972APEWR2 MC33972.pdf
Виробник: NXP USA Inc.
Description: SWITCH DETECTION INTERFACE, 22-S
Grade: Automotive
Supplier Device Package: 32-SOIC
Applications: Multiple Switch Detection
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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MC33972APEW MC33972.pdf
Виробник: NXP USA Inc.
Description: SWITCH DETECTION INTERFACE, 22-S
Grade: Automotive
Supplier Device Package: 32-SOIC
Applications: Multiple Switch Detection
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
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MC33972APEK MC33972.pdf
Виробник: NXP USA Inc.
Description: SWITCH DETECTION INTERFACE, 22-S
Grade: Automotive
Supplier Device Package: 32-SSOP-EP
Applications: Multiple Switch Detection
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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MC07XSG517DEKR2 MC32XSG.pdf
MC07XSG517DEKR2
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 32V, TRIPLE 7M
Voltage - Load: 7V ~ 30V
Input Type: Non-Inverting
Rds On (Typ): 7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 54-HSOP
Ratio - Input:Output: 2:3
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
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MC07XSG517DEK
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 32V, TRIPLE 7M
Rds On (Typ): 7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Status Flag
Packaging: Tube
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 54-HSOP
Ratio - Input:Output: 2:3
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 30V
Input Type: Non-Inverting
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TJA1057ATK/3/0Z TJA1057.pdf
TJA1057ATK/3/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Duplex: Half
Receiver Hysteresis: 300 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: CANbus
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
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TJA1057ATK/0Z TJA1057.pdf
TJA1057ATK/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Duplex: Half
Receiver Hysteresis: 300 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: CANbus
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
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TJA1057AT/3/0Z TJA1057.pdf
TJA1057AT/3/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1057AT/0Z TJA1057.pdf
TJA1057AT/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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SPC5744PFK1AMMM8 MPC5744P.pdf
SPC5744PFK1AMMM8
Виробник: NXP USA Inc.
Description: IC MCU 32B 2.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
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MFS8622BMBA0ESR2
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
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