Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35301) > Сторінка 489 з 589
| Фото | Назва | Виробник | Інформація | Доступність | Ціна | ||||||||||||||||||
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|   | BAP64LX,315 | NXP USA Inc. |  Description: RF DIODE PIN 60V 150MW SOD2 Packaging: Cut Tape (CT) Package / Case: SOD-882 Diode Type: PIN - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 60V Supplier Device Package: SOD2 Part Status: Active Current - Max: 100 mA Power Dissipation (Max): 150 mW | на замовлення 28030 шт:термін постачання 21-31 дні (днів) | 
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|   | P89LPC915FDH,129 | NXP USA Inc. |  Description: IC MCU 8BIT 2KB FLASH 14TSSOP Packaging: Tube Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 18MHz Program Memory Size: 2KB (2K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Data Converters: A/D 4x8b; D/A 1x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: 14-TSSOP Part Status: Obsolete Number of I/O: 12 DigiKey Programmable: Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | PCA9505DGGY | NXP USA Inc. |  Description: IC XPNDR 400KHZ I2C 56TSSOP Features: POR Packaging: Cut Tape (CT) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C Number of I/O: 40 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 56-TSSOP Current - Output Source/Sink: 10mA, 15mA Part Status: Active DigiKey Programmable: Not Verified | на замовлення 541 шт:термін постачання 21-31 дні (днів) | 
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|   | LS1023ASN7MQB | NXP USA Inc. |  Description: IC MPU QORIQ 1.2GHZ 621FCPBGA Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (21x21) Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | TEF6638HW/V106557 | NXP USA Inc. |  Description: TEF6638HW - DIGITAL CAR RADIO IC Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
| TEF6638HW/V105518 | NXP USA Inc. |  Description: IC DGTL CHIP AUTO RADIO 100HTQFP Packaging: Bulk Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||||||
|   | TEF6638HW/V105557 | NXP USA Inc. |  Description: IC DGTL CHIP AUTO RADIO 100HTQFP Packaging: Bulk Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
| TEF6638HW/V106Z/SK | NXP USA Inc. | Description: TEF6638HW/V106Z/S30/HTQFP100/STA Packaging: Tray Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||||||
| TEF6638HW/V106/SAK | NXP USA Inc. | Description: TEF6638HW/V106/S31/HTQFP100/TRAY Packaging: Tray Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||||||
| TEF6638HW/V106Z/SY | NXP USA Inc. | Description: TEF6638HW Packaging: Tape & Reel (TR) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||||||
| TEF6638HW/V106/SBK | NXP USA Inc. | Description: TEF6638HW/V106/S32/HTQFP100/TRAY Packaging: Tray Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||||||
|   | S912ZVMC12F2WKHR | NXP USA Inc. |  Description: IC MCU 16BIT 128KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Obsolete Number of I/O: 31 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
| MRF7S21170HSR3 | NXP USA Inc. |  Description: RF MOSFET LDMOS 28V NI880S Packaging: Tape & Reel (TR) Package / Case: NI-880S Mounting Type: Surface Mount Frequency: 2.17GHz Power - Output: 50W Gain: 16dB Technology: LDMOS Supplier Device Package: NI-880S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.4 A | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||||||
|   | MML20242HT1 | NXP USA Inc. |  Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN Packaging: Tape & Reel (TR) Package / Case: 12-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 1.4GHz ~ 2.8GHz RF Type: LTE, TDS-CDMA, W-CDMA Voltage - Supply: 5V Gain: 34dB Current - Supply: 160mA Noise Figure: 0.57dB P1dB: 24dBm Test Frequency: 1.95GHz Supplier Device Package: 12-QFN (3x3) Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | MML20242HT1 | NXP USA Inc. |  Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN Packaging: Cut Tape (CT) Package / Case: 12-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 1.4GHz ~ 2.8GHz RF Type: LTE, TDS-CDMA, W-CDMA Voltage - Supply: 5V Gain: 34dB Current - Supply: 160mA Noise Figure: 0.57dB P1dB: 24dBm Test Frequency: 1.95GHz Supplier Device Package: 12-QFN (3x3) Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | MCHSC705C8ACFBE | NXP USA Inc. |  Description: IC MCU 8BIT 8KB OTP 44QFP Packaging: Tray Package / Case: 44-QFP Mounting Type: Surface Mount Speed: 4MHz Program Memory Size: 8KB (8K x 8) RAM Size: 304 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-QFP (10x10) Part Status: Obsolete Number of I/O: 24 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | PMEG045V150EPD146 | NXP USA Inc. |  Description: RECTIFIER DIODE, SCHOTTKY Packaging: Bulk Part Status: Active | на замовлення 43500 шт:термін постачання 21-31 дні (днів) | 
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| LPC2136FBD64/01151 | NXP USA Inc. |  Description: IC MCU 16/32B 256KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 16x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 47 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||||||
|   | LPC2136FBD64/01,15 | NXP USA Inc. |  Description: IC MCU 16/32B 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 16x10b SAR; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Discontinued at Digi-Key Number of I/O: 47 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | LPC2136FBD64,151 | NXP USA Inc. |  Description: IC MCU 16/32B 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 16x10b SAR; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Obsolete Number of I/O: 47 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | MIMXRT1024DAG5B | NXP USA Inc. |  Description: IC MCU 32BIT 4MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 500MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 19x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 90 | на замовлення 60 шт:термін постачання 21-31 дні (днів) | 
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|   | S912ZVML12F1VKH | NXP USA Inc. |  Description: IC MCU 16BIT 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Obsolete Number of I/O: 31 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | S912ZVML12F1VKHR | NXP USA Inc. |  Description: IC MCU 16BIT 128KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Obsolete Number of I/O: 31 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|  | MC9S12P64CLH | NXP USA Inc. |  Description: IC MCU 16BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 49 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | BGA2712,115 | NXP USA Inc. |  Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP Packaging: Tape & Reel (TR) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 1GHz ~ 3.2GHz RF Type: ISM Voltage - Supply: 5V ~ 6V Gain: 21.3dB Current - Supply: 12.3mA Noise Figure: 3.9dB P1dB: 4.8dBm Test Frequency: 1GHz Supplier Device Package: 6-TSSOP Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | BGA2712,115 | NXP USA Inc. |  Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 1GHz ~ 3.2GHz RF Type: ISM Voltage - Supply: 5V ~ 6V Gain: 21.3dB Current - Supply: 12.3mA Noise Figure: 3.9dB P1dB: 4.8dBm Test Frequency: 1GHz Supplier Device Package: 6-TSSOP Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
| MK51DX256CLK7 | NXP USA Inc. |  Description: IC MCU 32BIT 256KB FLASH 80FQFP Packaging: Bulk Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 30x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified | на замовлення 396 шт:термін постачання 21-31 дні (днів) | 
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|   | PCA9509D,118 | NXP USA Inc. |  Description: IC REDRIVER I2C 2CH 400KHZ 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 5.5V Applications: I2C Current - Supply: 3mA Data Rate (Max): 400kHz Supplier Device Package: 8-SO Part Status: Obsolete Capacitance - Input: 2 pF | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | PCA9509D,118 | NXP USA Inc. |  Description: IC REDRIVER I2C 2CH 400KHZ 8SO Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 5.5V Applications: I2C Current - Supply: 3mA Data Rate (Max): 400kHz Supplier Device Package: 8-SO Part Status: Obsolete Capacitance - Input: 2 pF | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | SPC5607BAVLQ6R | NXP USA Inc. |  Description: IC MCU 32BIT 1.5MB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 121 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | S32G398ASCK1VUCR | NXP USA Inc. |  Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1 Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
| S32G399ASCK1VUCT | NXP USA Inc. |  Description: 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||||||
|   | S32G398ASCK1VUCT | NXP USA Inc. |  Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1 Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | MKL04Z8VLC4R | NXP USA Inc. |  Description: IC MCU 32BIT 8KB FLASH 32LQFP Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 14x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified | на замовлення 10000 шт:термін постачання 21-31 дні (днів) | 
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|   | MC9S08QD2CSC | NXP USA Inc. |  Description: IC MCU 8BIT 2KB FLASH 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 2KB (2K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Part Status: Active Number of I/O: 4 DigiKey Programmable: Not Verified | на замовлення 6849 шт:термін постачання 21-31 дні (днів) | 
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|   | S912ZVML64F1WKH557 | NXP USA Inc. |  Description: 16-BIT  FLASH,  CPU12 CPU Packaging: Bulk Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 31 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|  | S9S08LG32J0CLH | NXP USA Inc. |  Description: IC MCU 8BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.9K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 53 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | UBA2024P/N1,112 | NXP USA Inc. |  Description: IC CFL/TL DRIVER 42.68KHZ 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 8-DIP Dimming: No Current - Output Source/Sink: 900mA Part Status: Obsolete Current - Supply: 5 mA | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
| AFT05MP075N-54M | NXP USA Inc. |  Description: RF MOSFET Packaging: Bulk Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||||||
| P1016NSE5DFB | NXP USA Inc. | Description: QORIQ, POWER ARCH 32-BIT SOC, 53 Packaging: Bulk Part Status: Active | на замовлення 2155 шт:термін постачання 21-31 дні (днів) | 
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|   | MC9S08AC96MFUE | NXP USA Inc. |  Description: IC MCU 8BIT 96KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 96KB (96K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | P82B96DPZ | NXP USA Inc. |  Description: IC REDRIVER I2C 2CH 8TSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Delay Time: 270ns Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2V ~ 15V Applications: I2C Current - Supply: 1.1mA Data Rate (Max): 400kHz Supplier Device Package: 8-TSSOP Part Status: Active Capacitance - Input: 7 pF | на замовлення 2257 шт:термін постачання 21-31 дні (днів) | 
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|   | PCA9671PW118 | NXP USA Inc. |  Description: IC I/O EXPANDER I2C 16B 24TSSOP Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | PCA9501D,118 | NXP USA Inc. |  Description: IC XPNDR 400KHZ I2C SMBUS 20SO Features: EEPROM, POR Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I²C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V ~ 3.6V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 20-SO Current - Output Source/Sink: 100µA, 25mA Part Status: Obsolete DigiKey Programmable: Not Verified | на замовлення 20440 шт:термін постачання 21-31 дні (днів) | 
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|   | PCA9509AGM,125 | NXP USA Inc. |  Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN Packaging: Cut Tape (CT) Package / Case: 8-XFQFN Exposed Pad Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Applications: I2C Current - Supply: 5µA Data Rate (Max): 400kHz Supplier Device Package: 8-XQFN (1.6x1.6) Part Status: Obsolete Capacitance - Input: 2 pF | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | PCF85053ATK-ARD | NXP USA Inc. |  Description: PCF85053ATK-ARD Packaging: Bulk Function: Real Time Clock (RTC) Type: Clock Timing Contents: Board(s) Utilized IC / Part: PCF85053A Platform: Arduino Part Status: Active | на замовлення 8 шт:термін постачання 21-31 дні (днів) | 
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|   | 74ABT827D,623 | NXP USA Inc. |  Description: IC BUFFER NON-INVERT 5.5V 24SO Packaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 10 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 24-SO Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | 74ABT827D,623 | NXP USA Inc. |  Description: IC BUFFER NON-INVERT 5.5V 24SO Packaging: Cut Tape (CT) Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 10 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 24-SO Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
| MCIMX258CJM4A557 | NXP USA Inc. |  Description: I.MX25 32-BIT MPU, ARM926EJ-S CO Packaging: Bulk Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||||||
|   | MCIMX258CVM4 | NXP USA Inc. |  Description: IC MPU I.MX25 400MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, Touchscreen Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|  | FS32K118LFT0MLFT | NXP USA Inc. |  Description: IC MCU 32BIT 256KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 43 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | MCIMX6D7CVT08AD | NXP USA Inc. |  Description: IC MPU I.MX6D 800MHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active | на замовлення 579 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||||||||||
| SC550372MFU42R2 | NXP USA Inc. | Description: IC Packaging: Bulk Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||||||
| WPR1500-HV | NXP USA Inc. | Description: EVAL BOARD FOR WPR1516 Packaging: Bulk Function: Receiver Type: Interface Contents: Board(s) Utilized IC / Part: WPR1516 Supplied Contents: Board(s) Embedded: No Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||||||
|   | WPR1500-LDO | NXP USA Inc. | Description: EVAL BOARD FOR WPR1516 Packaging: Box Function: Wireless Power Supply/Charging Type: Power Management Contents: Board(s) Utilized IC / Part: WPR1516 Supplied Contents: Board(s) Primary Attributes: Receiver Embedded: Yes, MCU, 32-Bit Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
| WPR1500-BUCK | NXP USA Inc. | Description: EVAL BOARD FOR WPR1516 Packaging: Box Function: Wireless Power Supply/Charging Type: Power Management Contents: Board(s) Utilized IC / Part: WPR1516 Supplied Contents: Board(s) Primary Attributes: Receiver Embedded: Yes, MCU, 32-Bit Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||||||
|   | MCIMX512CJM6C | NXP USA Inc. |  Description: IC MPU I.MX51 600MHZ 529BGA Packaging: Tray Package / Case: 529-LFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 95°C (TC) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Supplier Device Package: 529-BGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (3), USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
|   | S912ZVML32F3WKHR | NXP USA Inc. |  Description: IC MCU 16BIT 32KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Active Number of I/O: 31 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
| HTMS1001FUG/AM,026 | NXP USA Inc. |  Description: RFID TAG R/W 100-150KHZ ENCAP Packaging: Bulk Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm) Style: Encapsulated Frequency: 100kHz ~ 150kHz Memory Type: Read/Write Technology: Passive Standards: ISO 11784, ISO 11785 Writable Memory: 1.76kb (User) Part Status: Obsolete | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||||||
|   | MKM33Z64CLL5 | NXP USA Inc. |  Description: IC MCU 32BIT 64KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x16b, 4x24b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LCD, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Not For New Designs Number of I/O: 68 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | 
| BAP64LX,315 |  | 
Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
    Description: RF DIODE PIN 60V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
на замовлення 28030 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 20+ | 16.52 грн | 
| 30+ | 10.82 грн | 
| 34+ | 9.55 грн | 
| 100+ | 7.66 грн | 
| 250+ | 7.04 грн | 
| 500+ | 6.67 грн | 
| 1000+ | 6.26 грн | 
| 2500+ | 5.94 грн | 
| 5000+ | 5.74 грн | 
| P89LPC915FDH,129 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Number of I/O: 12
DigiKey Programmable: Verified
    Description: IC MCU 8BIT 2KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Number of I/O: 12
DigiKey Programmable: Verified
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| PCA9505DGGY |  | 
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 56TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 40
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 56-TSSOP
Current - Output Source/Sink: 10mA, 15mA
Part Status: Active
DigiKey Programmable: Not Verified
    Description: IC XPNDR 400KHZ I2C 56TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 40
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 56-TSSOP
Current - Output Source/Sink: 10mA, 15mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 541 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 336.22 грн | 
| 10+ | 246.05 грн | 
| 25+ | 226.68 грн | 
| 100+ | 192.75 грн | 
| 250+ | 183.23 грн | 
| 500+ | 177.49 грн | 
| LS1023ASN7MQB |  | 
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
    Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
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| TEF6638HW/V106557 |  | 
Виробник: NXP USA Inc.
Description: TEF6638HW - DIGITAL CAR RADIO IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
    Description: TEF6638HW - DIGITAL CAR RADIO IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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| TEF6638HW/V105518 |  | 
Виробник: NXP USA Inc.
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Bulk
Part Status: Active
    Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Bulk
Part Status: Active
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| TEF6638HW/V105557 |  | 
Виробник: NXP USA Inc.
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Bulk
Part Status: Active
    Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Bulk
Part Status: Active
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| TEF6638HW/V106Z/SK | 
Виробник: NXP USA Inc.
Description: TEF6638HW/V106Z/S30/HTQFP100/STA
Packaging: Tray
Part Status: Active
    Description: TEF6638HW/V106Z/S30/HTQFP100/STA
Packaging: Tray
Part Status: Active
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| TEF6638HW/V106/SAK | 
Виробник: NXP USA Inc.
Description: TEF6638HW/V106/S31/HTQFP100/TRAY
Packaging: Tray
Part Status: Active
    Description: TEF6638HW/V106/S31/HTQFP100/TRAY
Packaging: Tray
Part Status: Active
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| TEF6638HW/V106/SBK | 
Виробник: NXP USA Inc.
Description: TEF6638HW/V106/S32/HTQFP100/TRAY
Packaging: Tray
Part Status: Active
    Description: TEF6638HW/V106/S32/HTQFP100/TRAY
Packaging: Tray
Part Status: Active
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| S912ZVMC12F2WKHR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
    Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
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| MRF7S21170HSR3 |  | 
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 50W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-880S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
    Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 50W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-880S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
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| MML20242HT1 |  | 
Виробник: NXP USA Inc.
Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.8GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 34dB
Current - Supply: 160mA
Noise Figure: 0.57dB
P1dB: 24dBm
Test Frequency: 1.95GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
    Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.8GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 34dB
Current - Supply: 160mA
Noise Figure: 0.57dB
P1dB: 24dBm
Test Frequency: 1.95GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
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| MML20242HT1 |  | 
Виробник: NXP USA Inc.
Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.8GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 34dB
Current - Supply: 160mA
Noise Figure: 0.57dB
P1dB: 24dBm
Test Frequency: 1.95GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
    Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.8GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 34dB
Current - Supply: 160mA
Noise Figure: 0.57dB
P1dB: 24dBm
Test Frequency: 1.95GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
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| MCHSC705C8ACFBE |  | 
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
    Description: IC MCU 8BIT 8KB OTP 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
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| PMEG045V150EPD146 |  | 
на замовлення 43500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 838+ | 29.74 грн | 
| LPC2136FBD64/01151 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
    Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
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| LPC2136FBD64/01,15 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 47
DigiKey Programmable: Not Verified
    Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 47
DigiKey Programmable: Not Verified
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| LPC2136FBD64,151 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 47
DigiKey Programmable: Not Verified
    Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 47
DigiKey Programmable: Not Verified
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| MIMXRT1024DAG5B |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 90
    Description: IC MCU 32BIT 4MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 90
на замовлення 60 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 722.00 грн | 
| 10+ | 645.86 грн | 
| 25+ | 626.02 грн | 
| 60+ | 569.76 грн | 
| S912ZVML12F1VKH |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
    Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
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| S912ZVML12F1VKHR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
    Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
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| MC9S12P64CLH |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
    Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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| BGA2712,115 |  | 
Виробник: NXP USA Inc.
Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 1GHz ~ 3.2GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 21.3dB
Current - Supply: 12.3mA
Noise Figure: 3.9dB
P1dB: 4.8dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
    Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 1GHz ~ 3.2GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 21.3dB
Current - Supply: 12.3mA
Noise Figure: 3.9dB
P1dB: 4.8dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
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| BGA2712,115 |  | 
Виробник: NXP USA Inc.
Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 1GHz ~ 3.2GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 21.3dB
Current - Supply: 12.3mA
Noise Figure: 3.9dB
P1dB: 4.8dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
    Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 1GHz ~ 3.2GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 21.3dB
Current - Supply: 12.3mA
Noise Figure: 3.9dB
P1dB: 4.8dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
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| MK51DX256CLK7 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 30x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 30x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 396 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 28+ | 902.09 грн | 
| PCA9509D,118 |  | 
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
    Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
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| PCA9509D,118 |  | 
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
    Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
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| SPC5607BAVLQ6R |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
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| S32G398ASCK1VUCR |  | 
Виробник: NXP USA Inc.
Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
    Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
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| S32G399ASCK1VUCT |  | 
Виробник: NXP USA Inc.
Description: 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
    Description: 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
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| S32G398ASCK1VUCT |  | 
Виробник: NXP USA Inc.
Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
    Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
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| MKL04Z8VLC4R |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 126+ | 168.65 грн | 
| MC9S08QD2CSC |  | 
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
    Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
на замовлення 6849 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 2+ | 203.22 грн | 
| 10+ | 146.45 грн | 
| 98+ | 120.61 грн | 
| 196+ | 108.40 грн | 
| 294+ | 106.01 грн | 
| 588+ | 102.50 грн | 
| 1078+ | 98.30 грн | 
| 2548+ | 95.39 грн | 
| 5096+ | 93.51 грн | 
| S912ZVML64F1WKH557 |  | 
Виробник: NXP USA Inc.
Description: 16-BIT FLASH, CPU12 CPU
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
    Description: 16-BIT FLASH, CPU12 CPU
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
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| S9S08LG32J0CLH |  | 
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
    Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
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| UBA2024P/N1,112 |  | 
Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
    Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
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| P1016NSE5DFB | 
Виробник: NXP USA Inc.
Description: QORIQ, POWER ARCH 32-BIT SOC, 53
Packaging: Bulk
Part Status: Active
    Description: QORIQ, POWER ARCH 32-BIT SOC, 53
Packaging: Bulk
Part Status: Active
на замовлення 2155 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 5+ | 5970.98 грн | 
| MC9S08AC96MFUE |  | 
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
    Description: IC MCU 8BIT 96KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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| P82B96DPZ |  | 
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 270ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 15V
Applications: I2C
Current - Supply: 1.1mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
    Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 270ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 15V
Applications: I2C
Current - Supply: 1.1mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
на замовлення 2257 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 2+ | 295.74 грн | 
| 10+ | 215.58 грн | 
| 25+ | 198.24 грн | 
| 100+ | 168.13 грн | 
| 250+ | 159.59 грн | 
| 500+ | 154.45 грн | 
| 1000+ | 147.75 грн | 
| PCA9671PW118 |  | 
Виробник: NXP USA Inc.
Description: IC I/O EXPANDER I2C 16B 24TSSOP
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
    Description: IC I/O EXPANDER I2C 16B 24TSSOP
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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| PCA9501D,118 |  | 
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 20SO
Features: EEPROM, POR
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 20-SO
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
    Description: IC XPNDR 400KHZ I2C SMBUS 20SO
Features: EEPROM, POR
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 20-SO
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 20440 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 374+ | 110.70 грн | 
| PCA9509AGM,125 |  | 
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Obsolete
Capacitance - Input: 2 pF
    Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Obsolete
Capacitance - Input: 2 pF
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| PCF85053ATK-ARD |  | 
Виробник: NXP USA Inc.
Description: PCF85053ATK-ARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85053A
Platform: Arduino
Part Status: Active
    Description: PCF85053ATK-ARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85053A
Platform: Arduino
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 4887.15 грн | 
| 74ABT827D,623 |  | 
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
    Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
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| 74ABT827D,623 |  | 
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
    Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
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| MCIMX258CJM4A557 |  | 
Виробник: NXP USA Inc.
Description: I.MX25 32-BIT MPU, ARM926EJ-S CO
Packaging: Bulk
Part Status: Active
    Description: I.MX25 32-BIT MPU, ARM926EJ-S CO
Packaging: Bulk
Part Status: Active
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| MCIMX258CVM4 |  | 
Виробник: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Part Status: Obsolete
    Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Part Status: Obsolete
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| FS32K118LFT0MLFT |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
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| MCIMX6D7CVT08AD |  | 
Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
    Description: IC MPU I.MX6D 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
на замовлення 579 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 5467.89 грн | 
| 10+ | 4377.45 грн | 
| 60+ | 3990.88 грн | 
| 120+ | 3647.17 грн | 
| WPR1500-HV | 
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR WPR1516
Packaging: Bulk
Function: Receiver
Type: Interface
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
    Description: EVAL BOARD FOR WPR1516
Packaging: Bulk
Function: Receiver
Type: Interface
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
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| WPR1500-LDO | 
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
    Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
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| WPR1500-BUCK | 
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
    Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
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| MCIMX512CJM6C |  | 
Виробник: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 95°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Part Status: Active
    Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 95°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Part Status: Active
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| S912ZVML32F3WKHR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
    Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
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| HTMS1001FUG/AM,026 |  | 
Виробник: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Bulk
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Part Status: Obsolete
    Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Bulk
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Part Status: Obsolete
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| MKM33Z64CLL5 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
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