Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35484) > Сторінка 489 з 592

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TJA1021BT/0Z TJA1021BT/0Z NXP USA Inc. TJA1021.pdf Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
на замовлення 3232 шт:
термін постачання 21-31 дні (днів)
7+51.81 грн
10+34.54 грн
25+32.11 грн
100+26.42 грн
250+24.87 грн
500+24.51 грн
Мінімальне замовлення: 7
В кошику  од. на суму  грн.
TJA1021AT/0Z TJA1021AT/0Z NXP USA Inc. TJA1021.pdf Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+32.51 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
TJA1021AT/0Z TJA1021AT/0Z NXP USA Inc. TJA1021.pdf Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
на замовлення 3803 шт:
термін постачання 21-31 дні (днів)
5+73.79 грн
10+47.09 грн
25+43.03 грн
100+36.55 грн
250+35.07 грн
500+32.97 грн
1000+30.37 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
P4040NSE7MMC P4040NSE7MMC NXP USA Inc. QP4080FS.pdf Description: IC MPU QORIQ P4 1.5GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Part Status: Obsolete
товару немає в наявності
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BFU520X235 BFU520X235 NXP USA Inc. PHGLS29422-1.pdf?t.download=true&u=5oefqw Description: NPN RF TRANSISTOR
Packaging: Bulk
Part Status: Active
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
2323+9.33 грн
Мінімальне замовлення: 2323
В кошику  од. на суму  грн.
BFU520X215 BFU520X215 NXP USA Inc. PHGLS29422-1.pdf?t.download=true&u=5oefqw Description: NPN RF TRANSISTOR
Packaging: Bulk
Part Status: Active
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
2323+9.33 грн
Мінімальне замовлення: 2323
В кошику  од. на суму  грн.
74HCT3G07GD,125 74HCT3G07GD,125 NXP USA Inc. 74HC_HCT3G07.pdf Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
товару немає в наявності
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KTY82/121,235 KTY82/121,235 NXP USA Inc. KTY82_SER.pdf Description: SENSOR PTC 990OHM SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
товару немає в наявності
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KTY82/121,235 KTY82/121,235 NXP USA Inc. KTY82_SER.pdf Description: SENSOR PTC 990OHM SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
товару немає в наявності
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KTY82/110/C1,215 NXP USA Inc. Description: SENSOR PTC 1KOHM SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 1 kOhms
товару немає в наявності
В кошику  од. на суму  грн.
KTY82/110/C1,235 KTY82/110/C1,235 NXP USA Inc. Description: SENSOR PTC 1KOHM SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 1 kOhms
товару немає в наявності
В кошику  од. на суму  грн.
T4161NXN7TTB NXP USA Inc. T4240T4160FS.pdf Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
товару немає в наявності
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TFF1024HN/N1,115 TFF1024HN/N1,115 NXP USA Inc. Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 2.15MHz
Input: Clock, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 2:1
Differential - Input:Output: No/No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
PLL: Yes
Part Status: Last Time Buy
Number of Circuits: 1
DigiKey Programmable: Not Verified
товару немає в наявності
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TFF1024HN/N1,115 TFF1024HN/N1,115 NXP USA Inc. Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 2.15MHz
Input: Clock, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 2:1
Differential - Input:Output: No/No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
PLL: Yes
Part Status: Last Time Buy
Number of Circuits: 1
DigiKey Programmable: Not Verified
на замовлення 3822 шт:
термін постачання 21-31 дні (днів)
1+725.31 грн
10+631.02 грн
25+601.64 грн
100+490.25 грн
250+468.21 грн
500+426.90 грн
1000+365.72 грн
В кошику  од. на суму  грн.
TEA6848HL/V3S518 TEA6848HL/V3S518 NXP USA Inc. PHGLS13713-1.pdf?t.download=true&u=5oefqw Description: IC TUNER CAR RADIO 80LQFP
Packaging: Bulk
Part Status: Active
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Function: Tuner
Frequency: 144kHz ~ 288kHz, 522kHz ~ 1.71MHz, 5.73MHz ~ 9.99MHz, 65MHz ~ 108MHz, 162.4MHz ~ 162.55MHz
RF Type: AM, FM
Secondary Attributes: I2C Interface
Supplier Device Package: 80-LQFP (12x12)
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)
39+563.71 грн
Мінімальне замовлення: 39
В кошику  од. на суму  грн.
TEF6617T/V1518 TEF6617T/V1518 NXP USA Inc. Description: IC CAR RADIO SGL CHIP 32SOIC
Packaging: Bulk
Part Status: Active
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
55+411.74 грн
Мінімальне замовлення: 55
В кошику  од. на суму  грн.
LPC2136FBD64/01EL LPC2136FBD64/01EL NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
на замовлення 147 шт:
термін постачання 21-31 дні (днів)
1+1131.93 грн
10+843.51 грн
25+830.97 грн
В кошику  од. на суму  грн.
MRF300ANBN-88MHZ NXP USA Inc. MRF300AN.pdf Description: MRF300ANBN-88MHZ
Packaging: Bulk
Part Status: Active
Supplied Contents: Board(s)
Contents: Board(s)
товару немає в наявності
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MC56F82313VLC MC56F82313VLC NXP USA Inc. MC56F823XX.pdf Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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MC34PF1510A2EP MC34PF1510A2EP NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
товару немає в наявності
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S32G378AACK1VUCT S32G378AACK1VUCT NXP USA Inc. S32G2.pdf Description: IC MPU S32G3 1.3GZ/400MHZ 525BGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
на замовлення 418 шт:
термін постачання 21-31 дні (днів)
1+8541.28 грн
10+6949.05 грн
25+6685.68 грн
В кошику  од. на суму  грн.
S32G378AACK1VUCR S32G378AACK1VUCR NXP USA Inc. S32G2.pdf Description: 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
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S32G378ASCK1VUCT S32G378ASCK1VUCT NXP USA Inc. S32G2.pdf Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
товару немає в наявності
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S32G378ASCK1VUCR S32G378ASCK1VUCR NXP USA Inc. S32G2.pdf Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
товару немає в наявності
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OM14500/TJA1101JP OM14500/TJA1101JP NXP USA Inc. TR1329.pdf Description: EVALUATION BOARD
Packaging: Bulk
Function: Ethernet
Type: Interface
Utilized IC / Part: TJA1101
Supplied Contents: Board(s)
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
1+14216.63 грн
В кошику  од. на суму  грн.
MC68MH360AI33L MC68MH360AI33L NXP USA Inc. MC68MH360UM.pdf Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
5+8896.87 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
BF904,235 BF904,235 NXP USA Inc. BF904(R)_Rev6.pdf Description: RF MOSFET 5V SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 200MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET
Noise Figure: 1dB
Supplier Device Package: SOT-143R
Part Status: Obsolete
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 10 mA
товару немає в наявності
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NVT2002TLH NVT2002TLH NXP USA Inc. NVT2001_NVT2002.pdf Description: IC TRANSLATOR BIDIR HXSON8U
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Data Rate: 33MHz
Supplier Device Package: HXSON8U
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 6206 шт:
термін постачання 21-31 дні (днів)
8+43.96 грн
11+28.88 грн
25+26.85 грн
100+23.25 грн
250+22.80 грн
500+21.25 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
LPC804M101JHI33Y LPC804M101JHI33Y NXP USA Inc. LPC804_DS.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
6000+76.83 грн
Мінімальне замовлення: 6000
В кошику  од. на суму  грн.
LPC804M101JHI33Y LPC804M101JHI33Y NXP USA Inc. LPC804_DS.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
на замовлення 10453 шт:
термін постачання 21-31 дні (днів)
2+174.26 грн
10+131.15 грн
100+105.40 грн
500+93.46 грн
1000+77.44 грн
2500+72.10 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
74HCT4075N,652 74HCT4075N,652 NXP USA Inc. 74HC_HCT4075.pdf Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
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MC13892DJVK MC13892DJVK NXP USA Inc. Description: IC PWR MGMT I.MX35/51 139BGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Part Status: Active
на замовлення 2080 шт:
термін постачання 21-31 дні (днів)
1+745.72 грн
10+561.56 грн
25+522.48 грн
100+450.02 грн
250+430.80 грн
500+419.21 грн
В кошику  од. на суму  грн.
MC56F8145VFGE MC56F8145VFGE NXP USA Inc. MC56F8345.pdf Description: IC MCU 16BIT 128KB FLASH 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 128-LQFP (14x20)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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MC68SEC000AE20 MC68SEC000AE20 NXP USA Inc. MC68SEC000.pdf Description: IC MPU M680X0 20MHZ 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-LQFP (10x10)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
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MC9S12E32CFUE MC9S12E32CFUE NXP USA Inc. MC9S12E128V1.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
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88W8997PA1-NXWI/AK NXP USA Inc. 88W8997-FACT-SHEET.pdf Description: IC RF TXRX BLE 98HVQFN
Packaging: Tray
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
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88W8997PA1-NXWE/AK NXP USA Inc. 88W8997-FACT-SHEET.pdf Description: IC RF TXRX BLE 98HVQFN
Packaging: Tray
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
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88W8997-A1-NXWE/AK NXP USA Inc. 88W8997-FACT-SHEET.pdf Description: IC RF TXRX BLE 98HVQFN
Packaging: Tray
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
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88W8997-A1-NXWE/AZ NXP USA Inc. 88W8997-FACT-SHEET.pdf Description: IC RF TXRX BLE 98HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
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MSC8101VT1500F MSC8101VT1500F NXP USA Inc. MSC8101.pdf Description: IC DSP 16BIT 250MHZ 332FCBGA
Packaging: Tray
Package / Case: 332-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Communications Processor Module (CPM)
Type: SC140 Core
Operating Temperature: -40°C ~ 75°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 512KB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 300MHz
Supplier Device Package: 332-FCBGA (17x17)
Part Status: Obsolete
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LPC802M001JDH16 NXP USA Inc. Description: IC MCU 32BIT FLASH
Packaging: Tube
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
на замовлення 380 шт:
термін постачання 21-31 дні (днів)
380+103.62 грн
Мінімальне замовлення: 380
В кошику  од. на суму  грн.
LPC860-MAX LPC860-MAX NXP USA Inc. LPCXpresso860-MAXUM.pdf Description: LPCXPRESSO860-MAX EVAL
Packaging: Box
Part Status: Active
на замовлення 29 шт:
термін постачання 21-31 дні (днів)
1+1195.51 грн
В кошику  од. на суму  грн.
LPC802M001JDH20J LPC802M001JDH20J NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
на замовлення 4112 шт:
термін постачання 21-31 дні (днів)
3+109.11 грн
10+61.08 грн
25+59.11 грн
100+53.57 грн
250+53.31 грн
500+53.05 грн
1000+50.46 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
74HC08PW/C4118 74HC08PW/C4118 NXP USA Inc. 74HC_HCT08.pdf Description: IC GATE AND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74HC08PW/S400118 74HC08PW/S400118 NXP USA Inc. 74HC_HCT08.pdf Description: IC GATE AND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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NX3V1T66GM,132 NX3V1T66GM,132 NXP USA Inc. NX3V1T66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
3328+6.74 грн
Мінімальне замовлення: 3328
В кошику  од. на суму  грн.
LD6806CX4/30H,315 LD6806CX4/30H,315 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 3V 200MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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HTSICH5601EW/V7:00 NXP USA Inc. HTSICH56_48_SDS.pdf Description: IC RFID TRANSP 100-150KHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 100kHz ~ 150kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3.5V
Supplier Device Package: Die
Part Status: Active
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74HC08D/C4118 74HC08D/C4118 NXP USA Inc. PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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MC68020EH33E MC68020EH33E NXP USA Inc. MC68020UM.pdf Description: IC MPU M680X0 33MHZ 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 132-PQFP (46x46)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
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74HC08D/S200118 74HC08D/S200118 NXP USA Inc. PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74HC08D/AU118 74HC08D/AU118 NXP USA Inc. PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74HC08D/AUJ 74HC08D/AUJ NXP USA Inc. 74HC_HCT08.pdf Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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ASL1500SHNY ASL1500SHNY NXP USA Inc. ASL1500SHN.pdf Description: IC LED DRIVER CTRLR 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 80V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 120kHz ~ 700kHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C
Applications: Lighting
Topology: Boost
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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ASL1500SHNY ASL1500SHNY NXP USA Inc. ASL1500SHN.pdf Description: IC LED DRIVER CTRLR 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 80V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 120kHz ~ 700kHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C
Applications: Lighting
Topology: Boost
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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MIMXRT685SFFOBR MIMXRT685SFFOBR NXP USA Inc. RT600.pdf Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tape & Reel (TR)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Part Status: Active
Number of I/O: 147
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
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BZA968AVL,115 BZA968AVL,115 NXP USA Inc. BZA900AVL_SERIES.pdf Description: TVS DIODE 6.8VWM SOT665
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-665
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Part Status: Obsolete
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BZA968AVL,115 BZA968AVL,115 NXP USA Inc. BZA900AVL_SERIES.pdf Description: TVS DIODE 6.8VWM SOT665
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-665
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Part Status: Obsolete
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RX1214B300YI112 RX1214B300YI112 NXP USA Inc. Description: RF POWER TRANSISTORS
Packaging: Bulk
Package / Case: SOT-439A
Mounting Type: Chassis Mount
Transistor Type: NPN
Gain: 8dB
Power - Max: 570W
Current - Collector (Ic) (Max): 21A
Voltage - Collector Emitter Breakdown (Max): 60V
Supplier Device Package: CDFM2
Part Status: Active
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MCZ33903CP3EK MCZ33903CP3EK NXP USA Inc. MC33903,4,5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
Part Status: Obsolete
на замовлення 32 шт:
термін постачання 21-31 дні (днів)
1+720.60 грн
10+626.87 грн
25+597.70 грн
В кошику  од. на суму  грн.
TJA1021BT/0Z TJA1021.pdf
TJA1021BT/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
на замовлення 3232 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
7+51.81 грн
10+34.54 грн
25+32.11 грн
100+26.42 грн
250+24.87 грн
500+24.51 грн
Мінімальне замовлення: 7
В кошику  од. на суму  грн.
TJA1021AT/0Z TJA1021.pdf
TJA1021AT/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+32.51 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
TJA1021AT/0Z TJA1021.pdf
TJA1021AT/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
на замовлення 3803 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+73.79 грн
10+47.09 грн
25+43.03 грн
100+36.55 грн
250+35.07 грн
500+32.97 грн
1000+30.37 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
P4040NSE7MMC QP4080FS.pdf
P4040NSE7MMC
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Part Status: Obsolete
товару немає в наявності
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BFU520X235 PHGLS29422-1.pdf?t.download=true&u=5oefqw
BFU520X235
Виробник: NXP USA Inc.
Description: NPN RF TRANSISTOR
Packaging: Bulk
Part Status: Active
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2323+9.33 грн
Мінімальне замовлення: 2323
В кошику  од. на суму  грн.
BFU520X215 PHGLS29422-1.pdf?t.download=true&u=5oefqw
BFU520X215
Виробник: NXP USA Inc.
Description: NPN RF TRANSISTOR
Packaging: Bulk
Part Status: Active
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2323+9.33 грн
Мінімальне замовлення: 2323
В кошику  од. на суму  грн.
74HCT3G07GD,125 74HC_HCT3G07.pdf
74HCT3G07GD,125
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
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KTY82/121,235 KTY82_SER.pdf
KTY82/121,235
Виробник: NXP USA Inc.
Description: SENSOR PTC 990OHM SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
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KTY82/121,235 KTY82_SER.pdf
KTY82/121,235
Виробник: NXP USA Inc.
Description: SENSOR PTC 990OHM SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
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KTY82/110/C1,215
Виробник: NXP USA Inc.
Description: SENSOR PTC 1KOHM SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 1 kOhms
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KTY82/110/C1,235
KTY82/110/C1,235
Виробник: NXP USA Inc.
Description: SENSOR PTC 1KOHM SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 1 kOhms
товару немає в наявності
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T4161NXN7TTB T4240T4160FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
товару немає в наявності
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TFF1024HN/N1,115
TFF1024HN/N1,115
Виробник: NXP USA Inc.
Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 2.15MHz
Input: Clock, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 2:1
Differential - Input:Output: No/No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
PLL: Yes
Part Status: Last Time Buy
Number of Circuits: 1
DigiKey Programmable: Not Verified
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TFF1024HN/N1,115
TFF1024HN/N1,115
Виробник: NXP USA Inc.
Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 2.15MHz
Input: Clock, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 2:1
Differential - Input:Output: No/No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
PLL: Yes
Part Status: Last Time Buy
Number of Circuits: 1
DigiKey Programmable: Not Verified
на замовлення 3822 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+725.31 грн
10+631.02 грн
25+601.64 грн
100+490.25 грн
250+468.21 грн
500+426.90 грн
1000+365.72 грн
В кошику  од. на суму  грн.
TEA6848HL/V3S518 PHGLS13713-1.pdf?t.download=true&u=5oefqw
TEA6848HL/V3S518
Виробник: NXP USA Inc.
Description: IC TUNER CAR RADIO 80LQFP
Packaging: Bulk
Part Status: Active
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Function: Tuner
Frequency: 144kHz ~ 288kHz, 522kHz ~ 1.71MHz, 5.73MHz ~ 9.99MHz, 65MHz ~ 108MHz, 162.4MHz ~ 162.55MHz
RF Type: AM, FM
Secondary Attributes: I2C Interface
Supplier Device Package: 80-LQFP (12x12)
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
39+563.71 грн
Мінімальне замовлення: 39
В кошику  од. на суму  грн.
TEF6617T/V1518
TEF6617T/V1518
Виробник: NXP USA Inc.
Description: IC CAR RADIO SGL CHIP 32SOIC
Packaging: Bulk
Part Status: Active
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
55+411.74 грн
Мінімальне замовлення: 55
В кошику  од. на суму  грн.
LPC2136FBD64/01EL LPC2131_32_34_36_38.pdf
LPC2136FBD64/01EL
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
на замовлення 147 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1131.93 грн
10+843.51 грн
25+830.97 грн
В кошику  од. на суму  грн.
MRF300ANBN-88MHZ MRF300AN.pdf
Виробник: NXP USA Inc.
Description: MRF300ANBN-88MHZ
Packaging: Bulk
Part Status: Active
Supplied Contents: Board(s)
Contents: Board(s)
товару немає в наявності
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MC56F82313VLC MC56F823XX.pdf
MC56F82313VLC
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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MC34PF1510A2EP PF1510.pdf
MC34PF1510A2EP
Виробник: NXP USA Inc.
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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S32G378AACK1VUCT S32G2.pdf
S32G378AACK1VUCT
Виробник: NXP USA Inc.
Description: IC MPU S32G3 1.3GZ/400MHZ 525BGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
на замовлення 418 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+8541.28 грн
10+6949.05 грн
25+6685.68 грн
В кошику  од. на суму  грн.
S32G378AACK1VUCR S32G2.pdf
S32G378AACK1VUCR
Виробник: NXP USA Inc.
Description: 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
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S32G378ASCK1VUCT S32G2.pdf
S32G378ASCK1VUCT
Виробник: NXP USA Inc.
Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
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S32G378ASCK1VUCR S32G2.pdf
S32G378ASCK1VUCR
Виробник: NXP USA Inc.
Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
товару немає в наявності
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OM14500/TJA1101JP TR1329.pdf
OM14500/TJA1101JP
Виробник: NXP USA Inc.
Description: EVALUATION BOARD
Packaging: Bulk
Function: Ethernet
Type: Interface
Utilized IC / Part: TJA1101
Supplied Contents: Board(s)
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+14216.63 грн
В кошику  од. на суму  грн.
MC68MH360AI33L MC68MH360UM.pdf
MC68MH360AI33L
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+8896.87 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
BF904,235 BF904(R)_Rev6.pdf
BF904,235
Виробник: NXP USA Inc.
Description: RF MOSFET 5V SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 200MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET
Noise Figure: 1dB
Supplier Device Package: SOT-143R
Part Status: Obsolete
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 10 mA
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NVT2002TLH NVT2001_NVT2002.pdf
NVT2002TLH
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR HXSON8U
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Data Rate: 33MHz
Supplier Device Package: HXSON8U
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 6206 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+43.96 грн
11+28.88 грн
25+26.85 грн
100+23.25 грн
250+22.80 грн
500+21.25 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
LPC804M101JHI33Y LPC804_DS.pdf
LPC804M101JHI33Y
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6000+76.83 грн
Мінімальне замовлення: 6000
В кошику  од. на суму  грн.
LPC804M101JHI33Y LPC804_DS.pdf
LPC804M101JHI33Y
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
на замовлення 10453 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+174.26 грн
10+131.15 грн
100+105.40 грн
500+93.46 грн
1000+77.44 грн
2500+72.10 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
74HCT4075N,652 74HC_HCT4075.pdf
74HCT4075N,652
Виробник: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
товару немає в наявності
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MC13892DJVK
MC13892DJVK
Виробник: NXP USA Inc.
Description: IC PWR MGMT I.MX35/51 139BGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Part Status: Active
на замовлення 2080 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+745.72 грн
10+561.56 грн
25+522.48 грн
100+450.02 грн
250+430.80 грн
500+419.21 грн
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MC56F8145VFGE MC56F8345.pdf
MC56F8145VFGE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 128-LQFP (14x20)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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MC68SEC000AE20 MC68SEC000.pdf
MC68SEC000AE20
Виробник: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-LQFP (10x10)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
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MC9S12E32CFUE MC9S12E128V1.pdf
MC9S12E32CFUE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
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88W8997PA1-NXWI/AK 88W8997-FACT-SHEET.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Packaging: Tray
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
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88W8997PA1-NXWE/AK 88W8997-FACT-SHEET.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Packaging: Tray
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
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88W8997-A1-NXWE/AK 88W8997-FACT-SHEET.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Packaging: Tray
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
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88W8997-A1-NXWE/AZ 88W8997-FACT-SHEET.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
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MSC8101VT1500F MSC8101.pdf
MSC8101VT1500F
Виробник: NXP USA Inc.
Description: IC DSP 16BIT 250MHZ 332FCBGA
Packaging: Tray
Package / Case: 332-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Communications Processor Module (CPM)
Type: SC140 Core
Operating Temperature: -40°C ~ 75°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 512KB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 300MHz
Supplier Device Package: 332-FCBGA (17x17)
Part Status: Obsolete
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LPC802M001JDH16
Виробник: NXP USA Inc.
Description: IC MCU 32BIT FLASH
Packaging: Tube
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
на замовлення 380 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
380+103.62 грн
Мінімальне замовлення: 380
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LPC860-MAX LPCXpresso860-MAXUM.pdf
LPC860-MAX
Виробник: NXP USA Inc.
Description: LPCXPRESSO860-MAX EVAL
Packaging: Box
Part Status: Active
на замовлення 29 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1195.51 грн
В кошику  од. на суму  грн.
LPC802M001JDH20J LPC802.pdf
LPC802M001JDH20J
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
на замовлення 4112 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+109.11 грн
10+61.08 грн
25+59.11 грн
100+53.57 грн
250+53.31 грн
500+53.05 грн
1000+50.46 грн
Мінімальне замовлення: 3
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74HC08PW/C4118 74HC_HCT08.pdf
74HC08PW/C4118
Виробник: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74HC08PW/S400118 74HC_HCT08.pdf
74HC08PW/S400118
Виробник: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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NX3V1T66GM,132 NX3V1T66.pdf
NX3V1T66GM,132
Виробник: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3328+6.74 грн
Мінімальне замовлення: 3328
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LD6806CX4/30H,315 LD6806_Series.pdf
LD6806CX4/30H,315
Виробник: NXP USA Inc.
Description: IC REG LINEAR 3V 200MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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HTSICH5601EW/V7:00 HTSICH56_48_SDS.pdf
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 100-150KHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 100kHz ~ 150kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3.5V
Supplier Device Package: Die
Part Status: Active
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74HC08D/C4118 PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw
74HC08D/C4118
Виробник: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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MC68020EH33E MC68020UM.pdf
MC68020EH33E
Виробник: NXP USA Inc.
Description: IC MPU M680X0 33MHZ 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 132-PQFP (46x46)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
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74HC08D/S200118 PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw
74HC08D/S200118
Виробник: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74HC08D/AU118 PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw
74HC08D/AU118
Виробник: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74HC08D/AUJ 74HC_HCT08.pdf
74HC08D/AUJ
Виробник: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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ASL1500SHNY ASL1500SHN.pdf
ASL1500SHNY
Виробник: NXP USA Inc.
Description: IC LED DRIVER CTRLR 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 80V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 120kHz ~ 700kHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C
Applications: Lighting
Topology: Boost
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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ASL1500SHNY ASL1500SHN.pdf
ASL1500SHNY
Виробник: NXP USA Inc.
Description: IC LED DRIVER CTRLR 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 80V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 120kHz ~ 700kHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C
Applications: Lighting
Topology: Boost
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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MIMXRT685SFFOBR RT600.pdf
MIMXRT685SFFOBR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tape & Reel (TR)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Part Status: Active
Number of I/O: 147
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
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BZA968AVL,115 BZA900AVL_SERIES.pdf
BZA968AVL,115
Виробник: NXP USA Inc.
Description: TVS DIODE 6.8VWM SOT665
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-665
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Part Status: Obsolete
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BZA968AVL,115 BZA900AVL_SERIES.pdf
BZA968AVL,115
Виробник: NXP USA Inc.
Description: TVS DIODE 6.8VWM SOT665
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-665
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Part Status: Obsolete
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RX1214B300YI112
RX1214B300YI112
Виробник: NXP USA Inc.
Description: RF POWER TRANSISTORS
Packaging: Bulk
Package / Case: SOT-439A
Mounting Type: Chassis Mount
Transistor Type: NPN
Gain: 8dB
Power - Max: 570W
Current - Collector (Ic) (Max): 21A
Voltage - Collector Emitter Breakdown (Max): 60V
Supplier Device Package: CDFM2
Part Status: Active
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MCZ33903CP3EK MC33903,4,5.pdf
MCZ33903CP3EK
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
Part Status: Obsolete
на замовлення 32 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+720.60 грн
10+626.87 грн
25+597.70 грн
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