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TEA19381T/1J TEA19381T/1J NXP USA Inc. Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 10-SO
Part Status: Obsolete
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TEA19381T/1J TEA19381T/1J NXP USA Inc. Description: IC OFFLINE SWITCH 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 10-SO
Part Status: Obsolete
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S9S12GN32AMFT S9S12GN32AMFT NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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MC9RS08KA8CWJ MC9RS08KA8CWJ NXP USA Inc. MC9RS08KA8.pdf Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 274 шт:
термін постачання 21-31 дні (днів)
2+194.44 грн
10+139.40 грн
38+122.72 грн
114+106.09 грн
266+100.75 грн
Мінімальне замовлення: 2
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MRF7P20040HSR3 MRF7P20040HSR3 NXP USA Inc. MRF7P20040H(S)R3.pdf Description: FET RF 2CH 65V 2.03GHZ NI780HS-4
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.03GHz
Configuration: Dual
Power - Output: 10W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 150 mA
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MRF6V14300HR5 MRF6V14300HR5 NXP USA Inc. MRF6V14300H.pdf Description: RF MOSFET LDMOS 50V NI780H
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.4GHz
Power - Output: 330W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 150 mA
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PC34901WNEFR2 NXP USA Inc. Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
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MP3V5050VC6U MP3V5050VC6U NXP USA Inc. MP3V5050V.pdf Description: SENSOR 7.25PSI 0.13" 2.82V
Packaging: Tube
Features: Amplified Output, Temperature Compensated
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: -7.25PSI (-50kPa)
Pressure Type: Vacuum
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: -29.01PSI (-200kPa)
Part Status: Active
на замовлення 777 шт:
термін постачання 21-31 дні (днів)
1+1137.80 грн
5+997.44 грн
10+960.79 грн
40+841.41 грн
80+814.95 грн
120+800.50 грн
520+741.56 грн
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SPC5748GK1MMJ6 SPC5748GK1MMJ6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GSK1MKU6 SPC5748GSK1MKU6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5748GSK1MMJ6R NXP USA Inc. Description: NXP 32-BIT MCU, TRIPLE CORE, 6MB
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 246
Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SAI, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, LVD, I2S, POR, WDT
Grade: Automotive
Qualification: AEC-Q100
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SPC5748GTK1MMJ6R SPC5748GTK1MMJ6R NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GGK1MMJ6R SPC5748GGK1MMJ6R NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GBK0AMMN6 NXP USA Inc. Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tray
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Part Status: Active
Number of I/O: 246
DigiKey Programmable: Not Verified
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SPC5748GBK0ACKU6 NXP USA Inc. Description: TRIPLE CORE, 6M FLASH, 768K RAM
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SAI, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, LVD, I2S, POR, WDT
Grade: Automotive
Qualification: AEC-Q100
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BUK9614-55A,118 NXP USA Inc. BUK9614-55A.pdf Description: MOSFET N-CH 55V 73A D2PAK
Packaging: Bulk
Part Status: Active
на замовлення 2273 шт:
термін постачання 21-31 дні (днів)
683+32.56 грн
Мінімальне замовлення: 683
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PCF7953ATTM1AC1500 PCF7953ATTM1AC1500 NXP USA Inc. Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
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PCF7953ATTM1AC1500 PCF7953ATTM1AC1500 NXP USA Inc. Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
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T2081NSN8MQLB NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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T2081NXE8PTB NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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T2081NXN8P1B T2081NXN8P1B NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ T2 1.533GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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T2081NSE8MQLB NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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T2081NSE8T1B NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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T2081NSE8P1B NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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T2081NSE8PTB NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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T2081NSE8MQB NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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NX3L1T3157GMZ NX3L1T3157GMZ NXP USA Inc. NX3L1T3157.pdf Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
на замовлення 15607 шт:
термін постачання 21-31 дні (днів)
14+23.89 грн
21+15.79 грн
25+14.03 грн
100+11.35 грн
250+10.48 грн
500+9.96 грн
1000+9.37 грн
2500+8.93 грн
Мінімальне замовлення: 14
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MRF101AN-88MHZ MRF101AN-88MHZ NXP USA Inc. MRF101AN.pdf Description: MRF101AN REF BRD 108MHZ 115W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 87.5MHz ~ 108MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: MRF101AN
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MCIMX6X4CVM08AC NXP USA Inc. IMX6SXAEC.pdf Description: IC MPU I.MX6SX 800MHZ 529MAPBGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
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BF1201WR,115 BF1201WR,115 NXP USA Inc. BF1201%28R%2CWR%29_Rev_Oct2010.pdf Description: RF MOSFET 5V CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
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BF1201WR,115 BF1201WR,115 NXP USA Inc. BF1201%28R%2CWR%29_Rev_Oct2010.pdf Description: RF MOSFET 5V CMPAK-4
Packaging: Cut Tape (CT)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
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BF1201WR,135 BF1201WR,135 NXP USA Inc. BF1201(R,WR)_Rev_Oct2010.pdf Description: MOSFET 2N-CH 10V 30MA SOT343R
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
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PDTC123TM,315 PDTC123TM,315 NXP USA Inc. PDTC123T_SER.pdf Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Bulk
Part Status: Active
на замовлення 116800 шт:
термін постачання 21-31 дні (днів)
11871+2.36 грн
Мінімальне замовлення: 11871
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SPC5605BK0CLL6 SPC5605BK0CLL6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
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SPC5646CF0MLU1 SPC5646CF0MLU1 NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
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MCIMX6S5EVM10AB MCIMX6S5EVM10AB NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Not For New Designs
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 588 шт:
термін постачання 21-31 дні (днів)
1+3278.29 грн
10+2577.86 грн
25+2433.18 грн
80+2154.54 грн
300+2051.06 грн
В кошику  од. на суму  грн.
PZU4.3BL315 NXP USA Inc. Description: DIODE ZENER SINGLE
Packaging: Bulk
Tolerance: ±5%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
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MC9S12XD64CAA MC9S12XD64CAA NXP USA Inc. MC9S12XDP512RMV2.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC9S12C64MFUE MC9S12C64MFUE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
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MC9S12C64VFUE MC9S12C64VFUE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
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MC9S12C128MPBE MC9S12C128MPBE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 128KB FLASH 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 52-TQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Verified
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P2010NSE2KFC P2010NSE2KFC NXP USA Inc. QP20XXFS.pdf Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
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SPC5746GK1MKU6 SPC5746GK1MKU6 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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BY329X-1500S,127 BY329X-1500S,127 NXP USA Inc. BY329X-1500_1500S.pdf Description: DIODE GEN PURP 1.5KV 6A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 160 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
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BY329-1500S,127 BY329-1500S,127 NXP USA Inc. BY329X-1500_1500S.pdf Description: DIODE GEN PURP 1.5KV 6A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 160 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
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BY329X-1500,127 BY329X-1500,127 NXP USA Inc. BY329X-1500_1500S.pdf Description: DIODE GEN PURP 1.5KV 6A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 230 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.45 V @ 6.5 A
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SPC5746CSK1MMH6R SPC5746CSK1MMH6R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
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MPC885VR80 MPC885VR80 NXP USA Inc. MPC885EC.pdf Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 44 шт:
термін постачання 21-31 дні (днів)
1+5642.05 грн
10+4376.69 грн
44+3980.45 грн
В кошику  од. на суму  грн.
LS1020ASE7KQB LS1020ASE7KQB NXP USA Inc. LS1020ALS1022AFS.pdf Description: IC MPU QORIQ 1.0GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (3)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (1)
Part Status: Active
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74HCT173N,652 74HCT173N,652 NXP USA Inc. 74HC_HCT173.pdf Description: IC FF D-TYPE SNGL 4BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Tri-State, Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 80 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 40ns @ 4.5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 4
на замовлення 6448 шт:
термін постачання 21-31 дні (днів)
620+35.26 грн
Мінімальне замовлення: 620
В кошику  од. на суму  грн.
74AVC32T245EC518 NXP USA Inc. Description: BUS TRANSCEIVER, AVC SERIES
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
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74AVC32T245EC,518 74AVC32T245EC,518 NXP USA Inc. 74AVC32T245.pdf Description: IC TRANSLATOR BIDIR 96LFBGA
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Obsolete
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LFDBGJS50 NXP USA Inc. Description: JTAG TO LAUTERBACH SAMTEC 50 PIN
Packaging: Bulk
Module/Board Type: Adapter Board
Part Status: Active
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MC9S08DZ48AMLF MC9S08DZ48AMLF NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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P60D144PAA/9A2410M NXP USA Inc. Description: IC SMART CARD CTLR INLAY A
Packaging: Bulk
Part Status: Obsolete
DigiKey Programmable: Not Verified
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S9S12G48F1CLC S9S12G48F1CLC NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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XPC8260VVHFBC XPC8260VVHFBC NXP USA Inc. MPC8260EC.pdf Description: IC MPU MPC82XX 166MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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S912XD64F2VAA S912XD64F2VAA NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
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MIMXRT106SDVL6A MIMXRT106SDVL6A NXP USA Inc. Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
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EV-INVERTERHD NXP USA Inc. EVINVERTERHD.pdf Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: FS6500, GD3160, MPC5775E, TJA1051, TJA1100HN
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes, MCU
Part Status: Active
Contents: Board(s)
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TEA19381T/1J
TEA19381T/1J
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 10-SO
Part Status: Obsolete
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TEA19381T/1J
TEA19381T/1J
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 10-SO
Part Status: Obsolete
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S9S12GN32AMFT S12G%20Family%20Fact%20Sheet.pdf
S9S12GN32AMFT
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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MC9RS08KA8CWJ MC9RS08KA8.pdf
MC9RS08KA8CWJ
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 274 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+194.44 грн
10+139.40 грн
38+122.72 грн
114+106.09 грн
266+100.75 грн
Мінімальне замовлення: 2
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MRF7P20040HSR3 MRF7P20040H(S)R3.pdf
MRF7P20040HSR3
Виробник: NXP USA Inc.
Description: FET RF 2CH 65V 2.03GHZ NI780HS-4
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.03GHz
Configuration: Dual
Power - Output: 10W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 150 mA
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MRF6V14300HR5 MRF6V14300H.pdf
MRF6V14300HR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780H
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.4GHz
Power - Output: 330W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 150 mA
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PC34901WNEFR2
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
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MP3V5050VC6U MP3V5050V.pdf
MP3V5050VC6U
Виробник: NXP USA Inc.
Description: SENSOR 7.25PSI 0.13" 2.82V
Packaging: Tube
Features: Amplified Output, Temperature Compensated
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: -7.25PSI (-50kPa)
Pressure Type: Vacuum
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: -29.01PSI (-200kPa)
Part Status: Active
на замовлення 777 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1137.80 грн
5+997.44 грн
10+960.79 грн
40+841.41 грн
80+814.95 грн
120+800.50 грн
520+741.56 грн
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SPC5748GK1MMJ6 MPC5748G.pdf
SPC5748GK1MMJ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GSK1MKU6 MPC5748G.pdf
SPC5748GSK1MKU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5748GSK1MMJ6R
Виробник: NXP USA Inc.
Description: NXP 32-BIT MCU, TRIPLE CORE, 6MB
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 246
Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SAI, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, LVD, I2S, POR, WDT
Grade: Automotive
Qualification: AEC-Q100
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SPC5748GTK1MMJ6R MPC5748G.pdf
SPC5748GTK1MMJ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GGK1MMJ6R MPC5748G.pdf
SPC5748GGK1MMJ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GBK0AMMN6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tray
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Part Status: Active
Number of I/O: 246
DigiKey Programmable: Not Verified
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SPC5748GBK0ACKU6
Виробник: NXP USA Inc.
Description: TRIPLE CORE, 6M FLASH, 768K RAM
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SAI, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, LVD, I2S, POR, WDT
Grade: Automotive
Qualification: AEC-Q100
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BUK9614-55A,118 BUK9614-55A.pdf
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 73A D2PAK
Packaging: Bulk
Part Status: Active
на замовлення 2273 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
683+32.56 грн
Мінімальне замовлення: 683
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PCF7953ATTM1AC1500
PCF7953ATTM1AC1500
Виробник: NXP USA Inc.
Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
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PCF7953ATTM1AC1500
PCF7953ATTM1AC1500
Виробник: NXP USA Inc.
Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
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T2081NSN8MQLB T2080FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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T2081NXE8PTB T2080FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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T2081NXN8P1B T2080FS.pdf
T2081NXN8P1B
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T2 1.533GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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T2081NSE8MQLB T2080FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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T2081NSE8T1B T2080FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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T2081NSE8P1B T2080FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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T2081NSE8PTB T2080FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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T2081NSE8MQB T2080FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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NX3L1T3157GMZ NX3L1T3157.pdf
NX3L1T3157GMZ
Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
на замовлення 15607 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
14+23.89 грн
21+15.79 грн
25+14.03 грн
100+11.35 грн
250+10.48 грн
500+9.96 грн
1000+9.37 грн
2500+8.93 грн
Мінімальне замовлення: 14
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MRF101AN-88MHZ MRF101AN.pdf
MRF101AN-88MHZ
Виробник: NXP USA Inc.
Description: MRF101AN REF BRD 108MHZ 115W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 87.5MHz ~ 108MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: MRF101AN
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MCIMX6X4CVM08AC IMX6SXAEC.pdf
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 529MAPBGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
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BF1201WR,115 BF1201%28R%2CWR%29_Rev_Oct2010.pdf
BF1201WR,115
Виробник: NXP USA Inc.
Description: RF MOSFET 5V CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
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BF1201WR,115 BF1201%28R%2CWR%29_Rev_Oct2010.pdf
BF1201WR,115
Виробник: NXP USA Inc.
Description: RF MOSFET 5V CMPAK-4
Packaging: Cut Tape (CT)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
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BF1201WR,135 BF1201(R,WR)_Rev_Oct2010.pdf
BF1201WR,135
Виробник: NXP USA Inc.
Description: MOSFET 2N-CH 10V 30MA SOT343R
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
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PDTC123TM,315 PDTC123T_SER.pdf
PDTC123TM,315
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Bulk
Part Status: Active
на замовлення 116800 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
11871+2.36 грн
Мінімальне замовлення: 11871
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SPC5605BK0CLL6 MPC5606B.pdf
SPC5605BK0CLL6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
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SPC5646CF0MLU1 MPC5646C.pdf
SPC5646CF0MLU1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
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MCIMX6S5EVM10AB IMX6SDLCEC.pdf
MCIMX6S5EVM10AB
Виробник: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Not For New Designs
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 588 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3278.29 грн
10+2577.86 грн
25+2433.18 грн
80+2154.54 грн
300+2051.06 грн
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PZU4.3BL315
Виробник: NXP USA Inc.
Description: DIODE ZENER SINGLE
Packaging: Bulk
Tolerance: ±5%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
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MC9S12XD64CAA MC9S12XDP512RMV2.pdf
MC9S12XD64CAA
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC9S12C64MFUE MC9S12C128V1.pdf
MC9S12C64MFUE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
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MC9S12C64VFUE MC9S12C128V1.pdf
MC9S12C64VFUE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
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MC9S12C128MPBE MC9S12C128V1.pdf
MC9S12C128MPBE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 52-TQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Verified
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P2010NSE2KFC QP20XXFS.pdf
P2010NSE2KFC
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
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SPC5746GK1MKU6
SPC5746GK1MKU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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BY329X-1500S,127 BY329X-1500_1500S.pdf
BY329X-1500S,127
Виробник: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 6A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 160 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
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BY329-1500S,127 BY329X-1500_1500S.pdf
BY329-1500S,127
Виробник: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 6A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 160 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
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BY329X-1500,127 BY329X-1500_1500S.pdf
BY329X-1500,127
Виробник: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 6A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 230 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.45 V @ 6.5 A
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SPC5746CSK1MMH6R MPC5746C.pdf
SPC5746CSK1MMH6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
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MPC885VR80 MPC885EC.pdf
MPC885VR80
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 44 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+5642.05 грн
10+4376.69 грн
44+3980.45 грн
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LS1020ASE7KQB LS1020ALS1022AFS.pdf
LS1020ASE7KQB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.0GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (3)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (1)
Part Status: Active
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74HCT173N,652 74HC_HCT173.pdf
74HCT173N,652
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 4BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Tri-State, Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 80 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 40ns @ 4.5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 4
на замовлення 6448 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
620+35.26 грн
Мінімальне замовлення: 620
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74AVC32T245EC518
Виробник: NXP USA Inc.
Description: BUS TRANSCEIVER, AVC SERIES
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
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74AVC32T245EC,518 74AVC32T245.pdf
74AVC32T245EC,518
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 96LFBGA
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Obsolete
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LFDBGJS50
Виробник: NXP USA Inc.
Description: JTAG TO LAUTERBACH SAMTEC 50 PIN
Packaging: Bulk
Module/Board Type: Adapter Board
Part Status: Active
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MC9S08DZ48AMLF MC9S08DV60.pdf
MC9S08DZ48AMLF
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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P60D144PAA/9A2410M
Виробник: NXP USA Inc.
Description: IC SMART CARD CTLR INLAY A
Packaging: Bulk
Part Status: Obsolete
DigiKey Programmable: Not Verified
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S9S12G48F1CLC MC9S12GRMV1.pdf
S9S12G48F1CLC
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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XPC8260VVHFBC MPC8260EC.pdf
XPC8260VVHFBC
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 166MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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S912XD64F2VAA
S912XD64F2VAA
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
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MIMXRT106SDVL6A
MIMXRT106SDVL6A
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
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EV-INVERTERHD EVINVERTERHD.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: FS6500, GD3160, MPC5775E, TJA1051, TJA1100HN
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes, MCU
Part Status: Active
Contents: Board(s)
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