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WPR1500-BUCK NXP USA Inc. Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s)
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MCIMX512CJM6C MCIMX512CJM6C NXP USA Inc. IMX51CEC.pdf Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 95°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
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S912ZVML32F3WKHR S912ZVML32F3WKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
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HTMS1001FUG/AM,026 NXP USA Inc. HTMS1x01,%20HTMS8x01_Web.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Bulk
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Part Status: Obsolete
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MKM33Z64CLL5 MKM33Z64CLL5 NXP USA Inc. MKMxxZxxCxx5.pdf Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
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MKM35Z512VLL7R MKM35Z512VLL7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+519.94 грн
Мінімальне замовлення: 1000
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MKM35Z256VLL7R MKM35Z256VLL7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
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SPC5747CK1CMJ2 SPC5747CK1CMJ2 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5747CK1CMJ2R SPC5747CK1CMJ2R NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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MC56F82743VFM MC56F82743VFM NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
на замовлення 2400 шт:
термін постачання 21-31 дні (днів)
1+542.95 грн
10+405.10 грн
25+375.81 грн
100+322.46 грн
490+312.22 грн
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MMA5212AKWR2 NXP USA Inc. MMA52xxAKW.pdf Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4
Part Status: Obsolete
Grade: Automotive
Qualification: AEC-Q100
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MRF6V2010NBR5 MRF6V2010NBR5 NXP USA Inc. MRF6V2010N.pdf Description: FET RF 110V 220MHZ TO-272-2
Packaging: Cut Tape (CT)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
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S32G274ASBK1VUCR S32G274ASBK1VUCR NXP USA Inc. S32G2.pdf Description: S32G274A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Part Status: Active
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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LPC865M201JBD64/0E LPC865M201JBD64/0E NXP USA Inc. LPC86x.pdf Description: IC MCU CORTEX M0+ LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
на замовлення 114 шт:
термін постачання 21-31 дні (днів)
2+182.91 грн
10+111.07 грн
25+105.11 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
PN5120A0HN/C2,551 PN5120A0HN/C2,551 NXP USA Inc. PN512.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
на замовлення 337 шт:
термін постачання 21-31 дні (днів)
1+859.32 грн
10+643.12 грн
25+587.55 грн
80+496.46 грн
230+455.95 грн
В кошику  од. на суму  грн.
S9S08SG4E2CSC S9S08SG4E2CSC NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
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MC34PF1550A6EP MC34PF1550A6EP NXP USA Inc. PF1550DS.pdf Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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LPC1114FHN33/301:5 LPC1114FHN33/301:5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
4000+164.33 грн
Мінімальне замовлення: 4000
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LPC1114FHN33/301:5 LPC1114FHN33/301:5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 5224 шт:
термін постачання 21-31 дні (днів)
2+305.67 грн
10+222.70 грн
25+204.76 грн
100+173.62 грн
250+164.79 грн
500+159.46 грн
1000+152.54 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
74LVCH16541ADGG112 74LVCH16541ADGG112 NXP USA Inc. 74LVCH16541A.pdf Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
на замовлення 312 шт:
термін постачання 21-31 дні (днів)
312+75.80 грн
Мінімальне замовлення: 312
В кошику  од. на суму  грн.
LPC5516JBD100Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
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LPC5516JBD100Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
на замовлення 963 шт:
термін постачання 21-31 дні (днів)
1+465.50 грн
10+408.75 грн
25+400.94 грн
50+373.56 грн
100+335.19 грн
250+333.93 грн
500+307.84 грн
В кошику  од. на суму  грн.
TDF19972AEL/C1E NXP USA Inc. Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
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TDF19972BEL/C1Y NXP USA Inc. Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
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TDF19972BEL/C1E NXP USA Inc. Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
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MSC8151SAG1000B MSC8151SAG1000B NXP USA Inc. MSC8151.pdf Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Single Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Part Status: Obsolete
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PCA9675PW,118 PCA9675PW,118 NXP USA Inc. PCA9675.pdf Description: IC XPNDR 1MHZ I2C 24TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
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PCA9675PW,118 PCA9675PW,118 NXP USA Inc. PCA9675.pdf Description: IC XPNDR 1MHZ I2C 24TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1671 шт:
термін постачання 21-31 дні (днів)
2+205.97 грн
10+147.89 грн
25+135.26 грн
100+113.91 грн
250+107.69 грн
500+103.95 грн
1000+99.21 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MMRF5018HSR5 MMRF5018HSR5 NXP USA Inc. MMRF5018HS.pdf Description: RF MOSFET GAN NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2SA
Mounting Type: Surface Mount
Frequency: 1MHz ~ 2.7GHz
Power - Output: 125W
Gain: 17.3dB
Technology: GaN
Supplier Device Package: NI-400S-2SA
Part Status: Active
Voltage - Rated: 125 V
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CBTL04GP043EXJ CBTL04GP043EXJ NXP USA Inc. Description: IC SWITCH DPDT X 2 15OHM 28XFBGA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Part Status: Obsolete
Package / Case: 28-XFBGA
Operating Temperature: -20°C ~ 85°C (TA)
Supplier Device Package: 28-XFBGA (2x4)
товару немає в наявності
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MRF1511NT1 MRF1511NT1 NXP USA Inc. MRF1511N.pdf Description: RF MOSFET LDMOS 7.5V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Current Rating (Amps): 4A
Mounting Type: Surface Mount
Frequency: 175MHz
Power - Output: 8W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 40 V
Voltage - Test: 7.5 V
Current - Test: 150 mA
товару немає в наявності
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74AXP1G86GXH NXP USA Inc. 74AXP1G86.pdf Description: IC GATE XOR 1CH 2-INP 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-X2SON (0.80x0.80)
Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
2845+9.06 грн
Мінімальне замовлення: 2845
В кошику  од. на суму  грн.
P87C51X2BBD,157 P87C51X2BBD,157 NXP USA Inc. P80C3XX2_8XC5XX2.pdf Description: IC MCU 8BIT 4KB OTP 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 44-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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CLRC66303EVJ NXP USA Inc. CLRC663.pdf Description: MULTI-PROTOCOL FRONTEND WITH SMA
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 36-VFBGA
Mounting Type: Surface Mount
Supplier Device Package: 36-VFBGA (3.5x3.5)
товару немає в наявності
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HEF4046BT653 NXP USA Inc. HEF4046B.pdf Description: NOW NEXPERIA HEF4046BT - PHASE L
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
LS1048ASE7PTA NXP USA Inc. LS1088A.pdf Description: LS1048 - QORIQ LAYERSCAPE 1088A
Packaging: Bulk
Part Status: Active
на замовлення 97 шт:
термін постачання 21-31 дні (днів)
2+13029.11 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
BZX79-B68,133 NXP USA Inc. PHGLS19463-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 68V 400MW ALF2
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 68 V
Impedance (Max) (Zzt): 240 Ohms
Supplier Device Package: ALF2
Part Status: Active
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 47.6 V
на замовлення 119000 шт:
термін постачання 21-31 дні (днів)
15000+1.65 грн
Мінімальне замовлення: 15000
В кошику  од. на суму  грн.
MKM35Z512VLQ7R MKM35Z512VLQ7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 99
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
500+676.31 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
MKM35Z256VLQ7R MKM35Z256VLQ7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 99
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
500+522.10 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
BUK9515-100A127 BUK9515-100A127 NXP USA Inc. BUK9515-100A.pdf Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 14.4mOhm @ 25A, 10V
Power Dissipation (Max): 230W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 8600 pF @ 25 V
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)
293+80.32 грн
Мінімальне замовлення: 293
В кошику  од. на суму  грн.
TJA1044ATK/3/0Z TJA1044ATK/3/0Z NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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TJA1044AT/0Z TJA1044AT/0Z NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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TJA1044AT/3/0Z TJA1044AT/3/0Z NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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TJA1044ATK/0Z TJA1044ATK/0Z NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
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PMV280ENEA215 NXP USA Inc. PMV280ENEA.pdf Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
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ON5452,518 ON5452,518 NXP USA Inc. i.MX 6 Ultra Light.pdf Description: RF MOSFET
Packaging: Bulk
Part Status: Active
товару немає в наявності
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ON5426/C3,127 NXP USA Inc. Description: ON5426/C3,127
Packaging: Bulk
Supplied Contents: Board(s)
Part Status: Obsolete
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ON5452,518 NXP USA Inc. i.MX 6 Ultra Light.pdf Description: RF MOSFET 20SOIC
Packaging: Tape & Reel (TR)
Part Status: Active
товару немає в наявності
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BC51-10PASX BC51-10PASX NXP USA Inc. NEXP-S-A0002912151-1.pdf?t.download=true&u=5oefqw Description: TRANS PNP 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 145MHz
Supplier Device Package: DFN2020D-3
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
на замовлення 84000 шт:
термін постачання 21-31 дні (днів)
3904+5.80 грн
Мінімальне замовлення: 3904
В кошику  од. на суму  грн.
BC51-10PAS115 NXP USA Inc. BC53XPAS_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
товару немає в наявності
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MPC555LFCVR40 MPC555LFCVR40 NXP USA Inc. MPC555PB.pdf Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 101
DigiKey Programmable: Not Verified
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FS32K142HRT0VLHT FS32K142HRT0VLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)
1+1391.56 грн
10+1072.34 грн
25+1005.63 грн
80+935.51 грн
В кошику  од. на суму  грн.
MCIMX6U7CVM08AD MCIMX6U7CVM08AD NXP USA Inc. IMX6SDLIEC.pdf Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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LS1048ASN7Q1A LS1048ASN7Q1A NXP USA Inc. LS1088AFS.pdf Description: IC MPU QORIQ 1.6GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
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LS1084AXN7Q1A NXP USA Inc. Description: IC MPU QORLQ LS1 1.6GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
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LS1084ASN7Q1A NXP USA Inc. Description: IC MPU QORLQ LS1 1.6GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
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LS1048AXN7Q1A LS1048AXN7Q1A NXP USA Inc. LS1088AFS.pdf Description: IC MPU QORIQ 1.6GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
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LPC1224FBD48/101,1 LPC1224FBD48/101,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 2014 шт:
термін постачання 21-31 дні (днів)
2+320.50 грн
10+200.01 грн
25+199.96 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
74VHC245PW118 NXP USA Inc. 74VHC_VHCT245.pdf Description: NOW NEXPERIA 74VHC245PW - BUS TR
Packaging: Bulk
Part Status: Active
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MC9S08AC8CFGER MC9S08AC8CFGER NXP USA Inc. MC9S08AC16.pdf Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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WPR1500-BUCK
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s)
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MCIMX512CJM6C IMX51CEC.pdf
MCIMX512CJM6C
Виробник: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 95°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
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S912ZVML32F3WKHR S12ZVMFS.pdf
S912ZVML32F3WKHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
товару немає в наявності
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HTMS1001FUG/AM,026 HTMS1x01,%20HTMS8x01_Web.pdf
Виробник: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Bulk
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Part Status: Obsolete
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MKM33Z64CLL5 MKMxxZxxCxx5.pdf
MKM33Z64CLL5
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
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MKM35Z512VLL7R KM35P144M75SF0.pdf
MKM35Z512VLL7R
Виробник: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+519.94 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
MKM35Z256VLL7R KM35P144M75SF0.pdf
MKM35Z256VLL7R
Виробник: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
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SPC5747CK1CMJ2 MPC5748G.pdf
SPC5747CK1CMJ2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5747CK1CMJ2R MPC5748G.pdf
SPC5747CK1CMJ2R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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MC56F82743VFM MC56F827XXDS.pdf
MC56F82743VFM
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
на замовлення 2400 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+542.95 грн
10+405.10 грн
25+375.81 грн
100+322.46 грн
490+312.22 грн
В кошику  од. на суму  грн.
MMA5212AKWR2 MMA52xxAKW.pdf
Виробник: NXP USA Inc.
Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4
Part Status: Obsolete
Grade: Automotive
Qualification: AEC-Q100
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MRF6V2010NBR5 MRF6V2010N.pdf
MRF6V2010NBR5
Виробник: NXP USA Inc.
Description: FET RF 110V 220MHZ TO-272-2
Packaging: Cut Tape (CT)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
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S32G274ASBK1VUCR S32G2.pdf
S32G274ASBK1VUCR
Виробник: NXP USA Inc.
Description: S32G274A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Part Status: Active
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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LPC865M201JBD64/0E LPC86x.pdf
LPC865M201JBD64/0E
Виробник: NXP USA Inc.
Description: IC MCU CORTEX M0+ LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
на замовлення 114 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+182.91 грн
10+111.07 грн
25+105.11 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
PN5120A0HN/C2,551 PN512.pdf
PN5120A0HN/C2,551
Виробник: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
на замовлення 337 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+859.32 грн
10+643.12 грн
25+587.55 грн
80+496.46 грн
230+455.95 грн
В кошику  од. на суму  грн.
S9S08SG4E2CSC MC9S08SG8.pdf
S9S08SG4E2CSC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
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MC34PF1550A6EP PF1550DS.pdf
MC34PF1550A6EP
Виробник: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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LPC1114FHN33/301:5 LPC111X.pdf
LPC1114FHN33/301:5
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4000+164.33 грн
Мінімальне замовлення: 4000
В кошику  од. на суму  грн.
LPC1114FHN33/301:5 LPC111X.pdf
LPC1114FHN33/301:5
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 5224 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+305.67 грн
10+222.70 грн
25+204.76 грн
100+173.62 грн
250+164.79 грн
500+159.46 грн
1000+152.54 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
74LVCH16541ADGG112 74LVCH16541A.pdf
74LVCH16541ADGG112
Виробник: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
на замовлення 312 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
312+75.80 грн
Мінімальне замовлення: 312
В кошику  од. на суму  грн.
LPC5516JBD100Y LPC55S1x_LPC551x_DS.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
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LPC5516JBD100Y LPC55S1x_LPC551x_DS.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
на замовлення 963 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+465.50 грн
10+408.75 грн
25+400.94 грн
50+373.56 грн
100+335.19 грн
250+333.93 грн
500+307.84 грн
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TDF19972AEL/C1E
Виробник: NXP USA Inc.
Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
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TDF19972BEL/C1Y
Виробник: NXP USA Inc.
Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
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TDF19972BEL/C1E
Виробник: NXP USA Inc.
Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
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MSC8151SAG1000B MSC8151.pdf
MSC8151SAG1000B
Виробник: NXP USA Inc.
Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Single Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Part Status: Obsolete
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PCA9675PW,118 PCA9675.pdf
PCA9675PW,118
Виробник: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 24TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
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PCA9675PW,118 PCA9675.pdf
PCA9675PW,118
Виробник: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 24TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1671 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+205.97 грн
10+147.89 грн
25+135.26 грн
100+113.91 грн
250+107.69 грн
500+103.95 грн
1000+99.21 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MMRF5018HSR5 MMRF5018HS.pdf
MMRF5018HSR5
Виробник: NXP USA Inc.
Description: RF MOSFET GAN NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2SA
Mounting Type: Surface Mount
Frequency: 1MHz ~ 2.7GHz
Power - Output: 125W
Gain: 17.3dB
Technology: GaN
Supplier Device Package: NI-400S-2SA
Part Status: Active
Voltage - Rated: 125 V
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CBTL04GP043EXJ
CBTL04GP043EXJ
Виробник: NXP USA Inc.
Description: IC SWITCH DPDT X 2 15OHM 28XFBGA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Part Status: Obsolete
Package / Case: 28-XFBGA
Operating Temperature: -20°C ~ 85°C (TA)
Supplier Device Package: 28-XFBGA (2x4)
товару немає в наявності
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MRF1511NT1 MRF1511N.pdf
MRF1511NT1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Current Rating (Amps): 4A
Mounting Type: Surface Mount
Frequency: 175MHz
Power - Output: 8W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 40 V
Voltage - Test: 7.5 V
Current - Test: 150 mA
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74AXP1G86GXH 74AXP1G86.pdf
Виробник: NXP USA Inc.
Description: IC GATE XOR 1CH 2-INP 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-X2SON (0.80x0.80)
Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2845+9.06 грн
Мінімальне замовлення: 2845
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P87C51X2BBD,157 P80C3XX2_8XC5XX2.pdf
P87C51X2BBD,157
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 44-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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CLRC66303EVJ CLRC663.pdf
Виробник: NXP USA Inc.
Description: MULTI-PROTOCOL FRONTEND WITH SMA
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 36-VFBGA
Mounting Type: Surface Mount
Supplier Device Package: 36-VFBGA (3.5x3.5)
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HEF4046BT653 HEF4046B.pdf
Виробник: NXP USA Inc.
Description: NOW NEXPERIA HEF4046BT - PHASE L
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товару немає в наявності
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LS1048ASE7PTA LS1088A.pdf
Виробник: NXP USA Inc.
Description: LS1048 - QORIQ LAYERSCAPE 1088A
Packaging: Bulk
Part Status: Active
на замовлення 97 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+13029.11 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
BZX79-B68,133 PHGLS19463-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: DIODE ZENER 68V 400MW ALF2
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 68 V
Impedance (Max) (Zzt): 240 Ohms
Supplier Device Package: ALF2
Part Status: Active
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 47.6 V
на замовлення 119000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
15000+1.65 грн
Мінімальне замовлення: 15000
В кошику  од. на суму  грн.
MKM35Z512VLQ7R KM35P144M75SF0.pdf
MKM35Z512VLQ7R
Виробник: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 99
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
500+676.31 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
MKM35Z256VLQ7R KM35P144M75SF0.pdf
MKM35Z256VLQ7R
Виробник: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 99
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
500+522.10 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
BUK9515-100A127 BUK9515-100A.pdf
BUK9515-100A127
Виробник: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 14.4mOhm @ 25A, 10V
Power Dissipation (Max): 230W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 8600 pF @ 25 V
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
293+80.32 грн
Мінімальне замовлення: 293
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TJA1044ATK/3/0Z TJA1044.pdf
TJA1044ATK/3/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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TJA1044AT/0Z TJA1044.pdf
TJA1044AT/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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TJA1044AT/3/0Z TJA1044.pdf
TJA1044AT/3/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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TJA1044ATK/0Z TJA1044.pdf
TJA1044ATK/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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PMV280ENEA215 PMV280ENEA.pdf
Виробник: NXP USA Inc.
Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
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ON5452,518 i.MX 6 Ultra Light.pdf
ON5452,518
Виробник: NXP USA Inc.
Description: RF MOSFET
Packaging: Bulk
Part Status: Active
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ON5426/C3,127
Виробник: NXP USA Inc.
Description: ON5426/C3,127
Packaging: Bulk
Supplied Contents: Board(s)
Part Status: Obsolete
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ON5452,518 i.MX 6 Ultra Light.pdf
Виробник: NXP USA Inc.
Description: RF MOSFET 20SOIC
Packaging: Tape & Reel (TR)
Part Status: Active
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BC51-10PASX NEXP-S-A0002912151-1.pdf?t.download=true&u=5oefqw
BC51-10PASX
Виробник: NXP USA Inc.
Description: TRANS PNP 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 145MHz
Supplier Device Package: DFN2020D-3
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
на замовлення 84000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3904+5.80 грн
Мінімальне замовлення: 3904
В кошику  од. на суму  грн.
BC51-10PAS115 BC53XPAS_SER.pdf
Виробник: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
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MPC555LFCVR40 MPC555PB.pdf
MPC555LFCVR40
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 101
DigiKey Programmable: Not Verified
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FS32K142HRT0VLHT S32K1xx.pdf
FS32K142HRT0VLHT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1391.56 грн
10+1072.34 грн
25+1005.63 грн
80+935.51 грн
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MCIMX6U7CVM08AD IMX6SDLIEC.pdf
MCIMX6U7CVM08AD
Виробник: NXP USA Inc.
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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LS1048ASN7Q1A LS1088AFS.pdf
LS1048ASN7Q1A
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
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LS1084AXN7Q1A
Виробник: NXP USA Inc.
Description: IC MPU QORLQ LS1 1.6GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
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LS1084ASN7Q1A
Виробник: NXP USA Inc.
Description: IC MPU QORLQ LS1 1.6GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
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LS1048AXN7Q1A LS1088AFS.pdf
LS1048AXN7Q1A
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
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LPC1224FBD48/101,1 LPC122X.pdf
LPC1224FBD48/101,1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 2014 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+320.50 грн
10+200.01 грн
25+199.96 грн
Мінімальне замовлення: 2
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74VHC245PW118 74VHC_VHCT245.pdf
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74VHC245PW - BUS TR
Packaging: Bulk
Part Status: Active
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MC9S08AC8CFGER MC9S08AC16.pdf
MC9S08AC8CFGER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
товару немає в наявності
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